Micro-vanes, fluidic pump chip and heat dissipation module

Abstract

The application provides a micro blade, a fluid pump chip and a heat dissipation module, wherein the micro blade is used as a functional component of the fluid pump chip and is used for pushing fluid to flow; the micro blade comprises a plurality of layers of deformation piezoelectric film; the direction of the fluid flow is perpendicular to the surface of the micro blade; and the micro blade moves in a plane perpendicular to the direction of the fluid flow. The application can effectively solve the problems of small flow and easy clogging of the existing fluid pump based on the MEMS technology.

Description

Technical Field

[0001] This invention relates to the field of electronic device processing technology, and more specifically, to a micro blade, a fluid pump chip, and a heat dissipation module. Background Technology

[0002] The primary function of a fluid pump is to drive the flow of gas or liquid to achieve energy transfer, such as heat dissipation, and material transport, such as fluid delivery. In many applications, fluid pumps are necessary to convert electrical signals into the power to drive the flow of gas or liquid in space-constrained environments.

[0003] In its broadest sense, Microelectromechanical Systems (MEMS) can be considered as structures that miniaturize and integrate mechanical, electrical, and other possible physical structures using microelectronic fabrication processes, for example, onto one or more interconnected chips. The feature sizes of MEMS devices can range from a few micrometers to a few millimeters. For fluid pumps, MEMS-based fluid pumps are smaller, more compact, more energy efficient, and better suited for space-constrained applications, such as portable and wearable devices, compared to traditional fluid pumps.

[0004] Generally, existing MEMS-based fluid pumps drive fluid in a pulsed flow by vibrating a thin film on a microcavity and controlling the opening and closing of inlet and outlet micro-valves. However, while such solutions can generate relatively large back pressure and flow rate, the flow rate is low; furthermore, the channels for inlet and outlet micro-valves may become blocked; and additionally, contact / friction that may exist inside the fluid pump can also generate additional energy dissipation.

[0005] Therefore, there is an urgent need for a fluid pump structure based on MEMS technology that has a large flow rate, is not prone to clogging, and does not generate significant additional energy consumption. Summary of the Invention

[0006] In view of the above problems, the purpose of this invention is to provide a micro blade, a fluid pump chip, and a heat dissipation module to solve the problems of low flow rate and easy clogging of existing fluid pumps based on MEMS technology.

[0007] The microblade provided by this invention includes a base layer and a multilayer deformation piezoelectric thin film disposed on the base layer; wherein,

[0008] The multilayer deformable piezoelectric thin film includes a piezoelectric material layer, an upper electrode layer, and a lower electrode layer, wherein the upper electrode layer and the lower electrode layer are respectively disposed on both sides of the piezoelectric material layer; and...

[0009] The microblades propel fluid flow based on the piezoelectric effect of the piezoelectric material layer.

[0010] Furthermore, a preferred embodiment is that, during the process of the microblade propelling the fluid flow, the direction of the fluid flow is perpendicular to the surface of the microblade; and the microblade moves in a plane perpendicular to the direction of the fluid flow.

[0011] Furthermore, a preferred embodiment is that during the movement of the microblades, the microblades bend at different positions based on the piezoelectric effect to drive the fluid flow; wherein,

[0012] The microblade bends towards the direction of fluid flow on the side closest to the direction of motion, and bends away from the direction of fluid flow on the side furthest from the direction of motion.

[0013] In addition, the present invention also provides a fluid pump chip, including a blade array and an actuator; wherein the blade array includes the aforementioned micro-blades, and the actuator is used to drive the blade array to move in a plane perpendicular to the direction of fluid flow.

[0014] In addition, the present invention also provides a heat dissipation module, including a heat-generating chip and the aforementioned fluid pump chip; wherein the fluid pump chip is disposed on one side of the heat-generating chip; and the fluid pump chip drives airflow to dissipate heat from the heat-generating chip.

[0015] Furthermore, the present invention also provides another type of microblade, wherein, during the process of the microblade propelling the fluid flow, the direction of the fluid flow is parallel to the surface of the microblade; and,

[0016] The microblades vibrate perpendicularly to their surfaces based on the piezoelectric effect to propel the fluid flow.

[0017] In addition, the present invention provides another fluid pump chip, including a blade array; wherein the blade array includes at least one of the aforementioned second type of microblades.

[0018] Furthermore, in a preferred embodiment, the second fluid pump chip provided by the present invention further includes a mounting bracket, and the blade array is connected to the mounting bracket; and,

[0019] A connecting piece is attached to the end of the micro blade that is away from the fixed support.

[0020] In addition, the present invention also provides another heat dissipation module, including a heat-generating chip and the aforementioned second type of fluid pump chip; wherein,

[0021] The fluid pump chip is disposed on one side of the heating chip; and,

[0022] The fluid pump chip drives airflow to dissipate heat from the heat-generating chip.

[0023] Furthermore, in a preferred embodiment, the fluid pump chip is provided in at least two sets; and,

[0024] The fluid pump chips are connected in series on one side of the heating chip; or, the fluid pump chips are connected in parallel on one side of the heating chip.

[0025] Compared with existing technologies, the above-mentioned micro-blades, fluid pump chips, and heat dissipation modules have the following advantages:

[0026] By fabricating microblades using a self-designed multilayer deformable piezoelectric thin film, a fluid pump chip is created. The deformation vibration of the microblades drives fluid flow, which, compared to existing fluid pumps, can generate a larger flow rate with a smaller pressure difference and is less prone to clogging. Furthermore, by designing a blade array containing multiple microblades, the driving performance of the fluid pump chip can be further improved. In addition, by applying the fluid pump chip provided by this invention to a heat dissipation module, the heat dissipation of the heat-generating chip can be accelerated.

[0027] To achieve the foregoing and related objectives, one or more aspects of the invention include the features which will be described in detail below and specifically pointed out in the claims. The following description and accompanying drawings illustrate certain exemplary aspects of the invention. However, these aspects indicate only a few of the various ways in which the principles of the invention can be used. Furthermore, the invention is intended to include all such aspects and their equivalents. Attached Figure Description

[0028] Other objects and results of the invention will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings and the contents of the claims, and with a more complete understanding of the invention. In the drawings:

[0029] Figure 1 This is a first structural diagram of a multilayer deformable piezoelectric thin film provided according to an embodiment of the present invention;

[0030] Figure 2 This is a second structural diagram of a multilayer deformable piezoelectric thin film provided according to an embodiment of the present invention;

[0031] Figure 3 This is a comparison diagram of a multilayer deformable piezoelectric thin film provided according to an embodiment of the present invention before and after deformation under the drive of voltage V;

[0032] Figure 4 A comparison diagram showing the first type of microblade provided according to an embodiment of the present invention driving fluid flow in different motion directions;

[0033] Figure 5 This is a structural diagram of a first blade array provided according to an embodiment of the present invention;

[0034] Figure 6 This is a structural diagram of a first type of fluid pump chip provided according to an embodiment of the present invention;

[0035] Figure 7 This is a structural diagram of a first heat dissipation module provided according to an embodiment of the present invention;

[0036] Figure 8 This is a structural diagram of a second type of microblade provided according to an embodiment of the present invention;

[0037] Figure 9 This is a vibration effect diagram of a second type of microblade provided according to an embodiment of the present invention;

[0038] Figures 10 to 12 This is a state change diagram of the second type of microblade perturbation fluid motion provided according to an embodiment of the present invention;

[0039] Figure 13 This is a parallel arrangement diagram of a second type of fluid pump chip provided according to an embodiment of the present invention;

[0040] Figure 14 This is a series arrangement diagram of a second type of fluid pump chip provided according to an embodiment of the present invention;

[0041] Figure 15 A first structural diagram of a second type of fluid pump chip configuration connector provided according to an embodiment of the present invention;

[0042] Figure 16 A second structural diagram of a connection piece configured for a second type of fluid pump chip according to an embodiment of the present invention;

[0043] Figure 17 A structural diagram showing the configuration of a second heat dissipation module according to an embodiment of the present invention, in which fluid pump chips are placed in series;

[0044] Figure 18 This is a structural diagram of a second heat dissipation module provided according to an embodiment of the present invention, in which fluid pump chips are placed in parallel.

[0045] Figure 19 A structural diagram showing the configuration of a second heat dissipation module according to an embodiment of the present invention, in which a fluid pump chip is placed.

[0046] Figure 20 This is a structural diagram of a second heat dissipation module according to an embodiment of the present invention, in which fluid pump chips are placed at different positions;

[0047] Figure 21This is a structural diagram showing the use of air inlets at different locations in a second heat dissipation module provided according to an embodiment of the present invention.

[0048] Reference numerals: 1. Multilayer deformable piezoelectric film; 11. Substrate layer; 12. Lower electrode layer; 13. Upper electrode layer; 14. Piezoelectric material layer; 2. Microblade; 3. Blade array; 31. Movable support; 32. Reinforcing rib; 4. Fluid pump chip; 41. Frame; 42. Actuator; 43. Fixing bracket; 44. Connecting piece; 5. Heat dissipation module; 51. Protective shell; 52. Airflow channel; 53. Thermal adhesive; 54. Heat-conducting plate; 55. Heating chip. Detailed Implementation

[0049] In the following description, numerous specific details are set forth for illustrative purposes and to provide a thorough understanding of one or more embodiments. However, it will be apparent that these embodiments may also be implemented without these specific details. In other instances, well-known structures and devices are shown in block diagram form for ease of description of one or more embodiments.

[0050] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0051] Before detailing the specific structure of the fluid pump provided by this invention, it should be noted that, in order to solve the problems of low flow rate and easy clogging of existing fluid pumps based on MEMS technology, the fluid pump provided by this invention adopts a new method of driving fluid. Specifically, the fluid pump provided by this invention uses microblades made of multilayer deformable piezoelectric thin films formed by MEMS processing technology. The fluid flow is driven by the vibration (or bending deformation) of the microblades made of multilayer deformable piezoelectric thin films. For the microblades, the multilayer deformable piezoelectric thin film serves as its basic power unit. The multilayer deformable piezoelectric thin film vibrates (or bends) under the action of piezoelectric effect to drive the fluid flow.

[0052] The principle of the multilayer deformation piezoelectric thin film provided by the present invention will be described in detail below with reference to the accompanying drawings. Among them, Figure 1 This illustrates a first structure of a multilayer deformable piezoelectric thin film according to an embodiment of the present invention. Figure 2 A second structure of a multilayer deformable piezoelectric thin film according to an embodiment of the present invention is shown. Figure 3 This is a comparison diagram of a multilayer deformable piezoelectric thin film provided according to an embodiment of the present invention before and after deformation under the drive of voltage V.

[0053] Combination Figures 1 to 3 As can be seen, in order to realize the fabrication of micro blades, the present invention provides a multilayer deformation piezoelectric thin film 1, including a base layer 11 and a piezoelectric stack disposed on at least one side of the base layer 11, wherein the piezoelectric stack includes a piezoelectric material layer 14, an upper electrode layer 13 and a lower electrode layer 12, the upper electrode layer 13 and the lower electrode layer 12 are respectively disposed on both sides of the piezoelectric material layer 14; and the multilayer deformation piezoelectric thin film 1 is formed by MEMS processing technology.

[0054] It should be noted that the multilayer deformable piezoelectric thin film 1 provided by the present invention refers to a stacked thin film structure formed by depositing multiple layers of different materials, which generally includes a base layer 11. The constituent material of the base layer 11 can be (but is not limited to): metal, single crystal or polycrystalline silicon, oxide, ceramic, etc. Furthermore, in the piezoelectric stack, piezoelectric materials, such as the piezoelectric ceramic material lead zirconate titanate (PZT) and the piezoelectric semiconductor material aluminum nitride, can be used to fabricate the piezoelectric material layer 14, and an upper electrode layer 13 and a lower electrode layer 12 are fabricated on both sides of the piezoelectric material layer 14.

[0055] It should be further noted that the above description of the multilayer deformable piezoelectric thin film 1 only summarizes its main functional structure. In specific engineering practices, other auxiliary layers may be added to improve performance. For example, to enhance the piezoelectric properties of the piezoelectric material layer 14, layers of materials such as zirconium oxide and strontium oxide may be added. Furthermore, the structure of the aforementioned multilayer deformable piezoelectric thin film 1 is not as described above. Figure 1 The only possible structure shown is as follows: Figure 2 As shown, a piezoelectric stack can also be provided on the upper and lower sides of the substrate 11 to improve the piezoelectric performance of the entire multilayer deformable piezoelectric film 1; of course, the structure with more layers can also be set according to the requirements, and the structure to be used in specific applications should be determined according to the specific situation.

[0056] Regarding the multilayer deformable piezoelectric thin film 1 provided by the present invention, as follows: Figure 3As shown, when an electric field (generated by voltage V) is applied to the piezoelectric material layer 14, internal stress is generated in the piezoelectric material layer 14, causing the entire multilayer deformable piezoelectric film 1 to deform. The internal stress generated in the piezoelectric material layer 14 is determined by the electric field strength, therefore the magnitude of the deformation of the multilayer deformable piezoelectric film 1 can be controlled by the voltage V provided by the external circuit.

[0057] Specifically, such as Figure 3 As shown in the figure, the previous diagram illustrates the situation without applied voltage. When the piezoelectric material layer 14 is not deformed, the multilayer deformable piezoelectric film 1 is flat. In this case, if the left end of the multilayer deformable piezoelectric film 1 is fixed, its right end can move freely. When a certain voltage is applied to the upper and lower electrode layers 12, the electric field they create causes strain in the piezoelectric material layer 14. When this strain is contraction, the multilayer deformable piezoelectric film 1 will bend upwards (e.g., ...). Figure 3 (As shown in the later figure); Conversely, when the strain is expansion, the multilayer deformable piezoelectric film 1 bends downwards. It should be noted that in practical engineering, generally speaking, after the MEMS fabrication process is completed, different residual stresses will exist in each layer of the multilayer deformable piezoelectric film 1. These residual stresses will cause the multilayer film to have an initial bend rather than a completely straight shape. However, this does not affect the deformation direction of the multilayer deformable piezoelectric film 1 described later. Moreover, in engineering practice, residual stresses can be reduced or overcome by adjusting processing parameters or adding stress compensation layers.

[0058] The multilayer deformable piezoelectric film 1 described above can be used as (or used to fabricate) the micro blades 2 that drive fluid flow in the fluid pump provided by the present invention. In the actual design process, the movement of the micro blades 2 drives fluid flow in two ways: 1. The direction of fluid flow is basically perpendicular to the blade surface; 2. The direction of fluid flow is basically parallel to the blade surface. The following describes these two methods respectively.

[0059] On one hand, the present invention provides a microblade 2 for driving fluid flow; the microblade 2 includes the aforementioned multilayer deformable piezoelectric film 1; wherein the direction of fluid flow is perpendicular to the surface of the microblade 2; and the microblade 2 moves in a plane perpendicular to the direction of fluid flow.

[0060] Specifically, during the movement of the microblade 2, the microblade 2 bends at different positions based on the piezoelectric effect to drive fluid flow; wherein, the side of the microblade 2 closer to the direction of movement bends in the direction of fluid flow, and the side of the microblade 2 away from the direction of movement bends away from the direction of fluid flow.

[0061] It should be noted that this design is similar to a ship or airplane propeller. The direction of motion of the microblade 2 is roughly parallel to its surface, while the direction of fluid flow is roughly perpendicular to its surface. However, unlike the continuous rotation of a propeller, the microblade 2 in this design uses a contactless, frictionless vibration mode (reciprocating along a plane parallel to its surface). Furthermore, since the shape of the microblade 2 can be adjusted by applying an electric field, its shape can be continuously changed (achieving bending at different positions based on the piezoelectric effect), causing its bending direction to continuously reverse during the reciprocating motion, thereby generating continuous and unidirectional fluid flow thrust.

[0062] Figure 4 The diagram shows a comparison of the fluid flow driven by the first type of microblade 2 according to an embodiment of the present invention under different motion directions, such as... Figure 4 As shown, the microblade 2, composed of a multilayer deformable piezoelectric film 1, can be fixed on the movable support 31 and reciprocate with the movable support 31 in a plane parallel to the surface of the microblade 2. When the microblade 2 moves to the left (direction comparison) Figure 4 (The same below) During movement, the electric fields applied to the left and right sides of the micro blade 2 can be adjusted respectively, so that the left side of the micro blade 2 bends downward and the right side bends upward, similar to the principle of a propeller. At this time, the micro blade 2 can push the fluid to flow upward.

[0063] Of course, the shape of the multilayer deformable piezoelectric film 1 is not the only option. In engineering practice, the multilayer deformable piezoelectric film 1 can also achieve similar results by using different deformations. For example, when the piezoelectric material layer 14 has the characteristic that it can only contract regardless of the polarity of the electric field, zero voltage can be applied to the left piezoelectric material layer 14 to make it approximately parallel, while a certain voltage can be applied to the right piezoelectric material layer 14 to make it bend upward. At this time, the fluid can still be pushed upward. In addition, when the microblade 2 moves to the left to its limit position and then moves back to the right, the electric fields applied to the left and right sides of the microblade 2 can be adjusted respectively, so that the left side of the microblade 2 bends upward and the right side bends downward. At this time, the microblade 2 can still push the fluid upward. In this way, when the microblade 2 reciprocates, the shape of the left and right sides of the microblade 2 can be continuously adjusted to make it continuously push the fluid upward.

[0064] It should be noted that the above describes the operation of a single microblade 2. In actual use, multiple microblades 2 can also be combined into a blade array 3. Specifically, Figure 5 The structure of a first blade array 3 according to an embodiment of the present invention is shown, such as Figure 5As shown, multiple micro blades 2 are connected to the same movable support 31, and the multiple micro blades 2 are interconnected and fixed by the reinforcing ribs 32 on both sides. At this time, a blade array 3 can be assembled. Subsequently, one or more blade arrays 3 can be integrated on a chip to realize the function of a fluid pump.

[0065] Furthermore, the present invention provides a fluid pump chip 4, including a blade array 3 and an actuator 42; wherein the blade array 3 includes the aforementioned micro blades 2, and the actuator 42 is used to drive the blade array 3 to reciprocate in a plane perpendicular to the direction of fluid flow.

[0066] Specifically, Figure 6 The structure of a first fluid pump chip 4 provided according to an embodiment of the present invention is shown, as follows: Figure 6 As shown, one or more blade arrays 3 can be integrated onto a MEMS chip to form a fluid pump chip 4. The micro-blades 2 in the blade array 3 can be connected to a frame 41 via a movable bracket 31 and an actuator 42. The micro-blades 2 in the blade array 3 can reciprocate in a plane under the drive of the actuator 42. The frame 41 can be used to fix the various components (including the blade array 3 and the actuator 42) in the fluid pump chip 4. It should be noted that the actuator 42 can be fabricated using various options such as a voice coil motor, an electrostatic motor, or a piezoelectric motor. In engineering practice, an appropriate actuator 42 can be selected according to the processing technology and performance requirements to drive the blade array 3 to vibrate in a plane (i.e., reciprocate), while periodically adjusting the shape of the micro-blades 2 to achieve the purpose of promoting fluid flow.

[0067] In engineering practice, the first fluid pump chip 4 provided by this invention requires other components to form a complete module to achieve certain functions. The following is an example of a module that can be used in a specific application. For instance, to prevent the heat-generating chip 55 from overheating and affecting the chip itself, the fluid pump chip 4 provided by this invention can be used to drive airflow to remove heat, thereby effectively dissipating heat from the heat-generating chip 55.

[0068] Specifically, the present invention provides a heat dissipation module 5, including a heat-generating chip 55 and the aforementioned fluid pump chip 4; wherein the fluid pump chip 4 is disposed on one side of the heat-generating chip 55; and the fluid pump chip 4 drives airflow to dissipate heat from the heat-generating chip 55.

[0069] Furthermore, Figure 7 The specific structure of the first heat dissipation module 5 provided according to an embodiment of the present invention is shown, such as... Figure 7As shown, the heat dissipation module 5 includes a protective shell 51. The fluid pump chip 4 is placed inside the protective shell 51 and above the heat-generating chip 55. A heat-conducting plate 54 (such as a metal plate or a thermally conductive ceramic plate) is then fixed to the side of the heat-generating chip 55 near the fluid pump chip 4 using thermally conductive adhesive 53. Finally, the heat-conducting plate 54 is connected to the protective shell 51. An airflow channel 52 is provided on the protective shell 51, thus forming a complete heat dissipation module 5. In actual use, the fluid pump chip 4 accelerates the airflow inside the protective shell 51, thereby carrying away the heat transferred from the heat-generating chip 55 to the heat-conducting plate 54, thus achieving effective heat dissipation for the heat-generating chip 55.

[0070] On the other hand, the present invention also provides another microblade 2 for driving fluid flow; including the aforementioned multilayer deformable piezoelectric film 1; wherein the direction of fluid flow is parallel to the surface of the microblade 2; and the microblade 2 vibrates perpendicular to the surface of the microblade 2 based on the piezoelectric effect to drive fluid flow.

[0071] This design is similar to a fan. The movement of the microblade 2 is a vibration that is roughly perpendicular to the blade surface, while the direction of fluid flow is roughly parallel to the blade surface. The solution described in this invention is still a non-contact, frictionless vibration mode, and continuous and unidirectional fluid flow can be generated by the vibration of the microblade 2.

[0072] Specifically, for this type of design, Figure 8 The structure of a second type of microblade 2 provided according to an embodiment of the present invention is shown, as follows: Figure 8 As shown, the microblade 2 still uses the aforementioned multilayer deformable piezoelectric film 1 as a basic driving unit. One end of it can be connected to the fixed bracket 43, while the other end remains free to move. In actual use, as before, the voltage on both sides of the piezoelectric material layer 14 will provide a driving force to cause the multilayer deformable piezoelectric film 1 to deform. When this driving voltage is a periodic signal (including both positive and negative signals), the multilayer deformable piezoelectric film 1 will vibrate (e.g., Figure 9 As shown, the vibrating multilayer deformable piezoelectric film 1 will drive the fluid flow, eventually generating a net lateral flow.

[0073] Figures 10 to 12 This diagram illustrates the state change of the disturbed fluid motion (fluid velocity field diagram generated by simulation) of the second type of microblade 2 provided according to an embodiment of the present invention, displayed on simulation software. Figures 10 to 12 It can be seen that the fluid flows in a consistent general direction at a certain distance from the microblade 2, which further proves that the vibration of the second type of microblade 2 provided in this embodiment can drive the fluid flow.

[0074] In addition, multiple of the above-mentioned second type of micro-blades 2 can be combined into an array to improve the performance of the fluid pump. The combination method can be divided into parallel connection and series connection. Figure 13 This diagram shows a parallel arrangement of a second type of fluid pump chip 4 according to an embodiment of the present invention, consisting of... Figure 13 As shown, the second type of microblade 2 can move along... Figure 13 The blades are arranged in the direction indicated by the middle arrow to form a blade array 3, and the parallel arrangement can increase the total fluid flow rate of the fluid pump by approximately the proportion of the number of micro blades 2. Figure 14 This diagram shows a series arrangement of a second type of fluid pump chip 4 according to an embodiment of the present invention. Figure 14 As shown, the second type of microblade 2 can also be along Figure 14 The blades are arranged in the direction indicated by the middle arrow to form a blade array 3. Furthermore, the series connection can better overcome the resistance of fluid flow and help to increase the flow rate.

[0075] Specifically, the present invention provides another fluid pump chip 4, including a blade array 3; wherein the blade array 3 includes a plurality of (at least one) of the aforementioned second type of microblades 2. It should be noted that the second type of fluid pump chip 4 provided by the present invention may further include a fixing bracket 43, on which the blade array 3 is connected.

[0076] It should be noted that in the second type of fluid pump chip 4 described above, the multilayer deformable piezoelectric film 1 provides the power source for the fluid pump chip 4 and also serves as the blade that drives the fluid flow. In engineering practice, the function of the blade can also be separated from the multilayer deformable piezoelectric film 1, for example, Figure 15 This illustrates a first structure of a second fluid pump chip 4 configuration connector 44 provided according to an embodiment of the present invention, such as... Figure 15 It can be seen that a connecting piece 44 can be connected to the end of the micro blade 2 away from the fixed support 43, and the connecting piece 44 can be used as a blade to drive the fluid flow.

[0077] It needs to be further explained that, in Figure 15 In the middle, the area corresponding to the connecting piece 44 usually does not contain a power source, that is, it does not contain the piezoelectric material layer 14 (or it contains the piezoelectric material layer 14, but the piezoelectric material layer 14 is not applied with an electric field and does not serve as a power source).

[0078] also, Figure 16 This illustrates a second structure of a second fluid pump chip 4 configuration connector 44 provided according to an embodiment of the present invention, such as... Figure 16 As shown, in order to save space or increase blade density, the connecting piece 44 can also be folded, so that the fluid pump chip 4 with the folded structure occupies less space.

[0079] In engineering practice, the second type of fluid pump chip 4 provided by this invention requires other components to form a complete module to achieve certain functions. The following is an example of a module that can be used in a specific application. For instance, to prevent the heat-generating chip 55 from overheating and affecting the chip itself, the fluid pump chip 4 provided by this invention can be used to drive airflow to remove heat, thereby effectively dissipating heat from the heat-generating chip 55.

[0080] This invention provides another heat dissipation module 5, including a heat-generating chip 55 and the aforementioned second type of fluid pump chip 4; wherein, the fluid pump chip 4 is disposed on one side of the heat-generating chip 55; and, the fluid pump chip 4 drives airflow to dissipate heat from the heat-generating chip 55. Furthermore, to improve the heat dissipation effect, multiple fluid pump chips 4 (at least two groups) can be provided; and, the fluid pump chips 4 are distributed in series on one side of the heat-generating chip 55; or, the fluid pump chips 4 are distributed in parallel on one side of the heat-generating chip 55.

[0081] Specifically, Figure 17 This illustration shows the structure of a second heat dissipation module 5 provided according to an embodiment of the present invention, in which the fluid pump chip 4 is placed in series. Figure 18 This illustration shows a configuration of a second heat dissipation module 5 provided according to an embodiment of the present invention, in which the fluid pump chip 4 is placed in parallel. Figure 19 The diagram illustrates a configuration of a second heat dissipation module 5 according to an embodiment of the present invention, in which the fluid pump chip 4 is placed in a hybrid arrangement. Diagram 20 shows a configuration of the second heat dissipation module 5 according to an embodiment of the present invention, in which the fluid pump chip 4 is placed at different locations. Specifically, in engineering practice, in certain applications where ventilation is required, the module can only be positioned on the side. Figure 21 The following diagram illustrates a heat dissipation module designed to meet these requirements, such as... Figure 21 As shown, the structure uses a side air inlet and a side air outlet, and the internal blade array is set as a unidirectional array, with all the micro blades pushing the airflow in the same direction, thereby achieving heat dissipation for the heat-generating chip.

[0082] Furthermore, by Figure 17 As shown, the heat dissipation module 5 includes a protective shell 51. Multiple fluid pump chips 4 arranged in series can be placed inside the protective shell 51 and positioned above the heat-generating chip 55. A heat-conducting plate 54 (such as a metal plate or a thermally conductive ceramic plate) is then fixed to the side of the heat-generating chip 55 near the fluid pump chips 4 using thermally conductive adhesive 53. Finally, the heat-conducting plate 54 is connected to the protective shell 51. An airflow channel 52 is provided on the protective shell 51, thus forming a complete heat dissipation module 5. In actual use, the fluid pump chips 4 accelerate the airflow within the protective shell 51, thereby carrying away the heat transferred from the heat-generating chip 55 to the heat-conducting plate 54, thus achieving effective heat dissipation for the heat-generating chip 55.

[0083] Depend on Figure 18As shown, the heat dissipation module 5 includes a protective shell 51. Multiple parallel-placed fluid pump chips 4 are placed inside the protective shell 51 and positioned above the heat-generating chip 55. A heat-conducting plate 54 (such as a metal plate or a thermally conductive ceramic plate) is then fixed to the side of the heat-generating chip 55 near the fluid pump chips 4 using thermally conductive adhesive 53. Finally, the heat-conducting plate 54 is connected to the protective shell 51. An airflow channel 52 is provided on the protective shell 51, thus forming a complete heat dissipation module 5. In actual use, the fluid pump chips 4 accelerate the airflow within the protective shell 51, thereby carrying away the heat transferred from the heat-generating chip 55 to the heat-conducting plate 54, thus achieving effective heat dissipation for the heat-generating chip 55.

[0084] Depend on Figure 19 As shown, the heat dissipation module 5 includes a protective shell 51. Multiple fluid pump chips 4, arranged in a mixed configuration (including series and parallel placement), are placed inside the protective shell 51 and positioned above the heat-generating chip 55. A heat-conducting plate 54 (such as a metal plate or a thermally conductive ceramic plate) is then fixed to the side of the heat-generating chip 55 near the fluid pump chip 4 using thermally conductive adhesive 53. Finally, the heat-conducting plate 54 is connected to the protective shell 51. An airflow channel 52 is provided on the protective shell 51, thus forming a complete heat dissipation module 5. In actual use, the fluid pump chip 4 accelerates the airflow within the protective shell 51, thereby carrying away the heat transferred from the heat-generating chip 55 to the heat-conducting plate 54, thus achieving effective heat dissipation for the heat-generating chip 55.

[0085] Depend on Figure 20 As shown, the heat dissipation module 5 includes a protective shell 51, which can hold multiple different fluid pump chips 4 within the protective shell 51 near different airflow channels 52 (e.g., ...). Figure 20 The upper airflow channel and side airflow channel shown in the diagram are positioned above the heating chip 55. A heat-conducting plate 54 (such as a metal plate or a thermally conductive ceramic plate) is then fixed to the side of the heating chip 55 near the fluid pump chip 4 using thermally conductive adhesive 53. Finally, the heat-conducting plate 54 is connected to the protective shell 51, which has airflow channels 52, thus forming a complete heat dissipation module 5. In actual use, the fluid pump chip 4 accelerates the airflow within the protective shell 51, thereby carrying away the heat transferred from the heating chip 55 to the heat-conducting plate 54, thus achieving effective heat dissipation for the heating chip 55.

[0086] Depend on Figure 21 As shown, the heat dissipation module 5 includes a protective shell 51, within which multiple different fluid pump chips can be arranged in an array. It is important to note that in this configuration, the blade array should be unidirectional, with all blades arranged in the same direction to push airflow in the same direction, thus forming a complete heat dissipation module 5. Airflow enters the airflow channel through a side opening and exits through another side opening, carrying away heat and effectively dissipating heat from the heat-generating chip 55.

[0087] It should be noted that in the second heat dissipation module 5 provided by the present invention, the fluid pump chip 4 can be placed in various ways as described above. In actual use, the appropriate method can be selected according to the specific situation.

[0088] As can be seen from the above specific embodiments, the multilayer deformable piezoelectric film 1, microblade 2, fluid pump chip 4, and heat dissipation module 5 provided by the present invention, based on the piezoelectric effect and Bernoulli's principle, can achieve a larger flow rate with lower back pressure compared to existing fluid pumps based on MEMS technology. Furthermore, through a simpler and more open structure, a frictionless and contactless high-efficiency solution can be achieved. In addition, the multilayer deformable piezoelectric film 1 used in the present invention can eliminate mechanical fatigue and, when used as an air pump, is dustproof and waterproof, improving reliability and durability.

[0089] As referred above Figures 1 to 21 The microblade, fluid pump chip, and heat dissipation module according to the present invention are described by way of example. However, those skilled in the art will understand that various modifications can be made to the microblade, fluid pump chip, and heat dissipation module proposed in the present invention without departing from the scope of the invention. Therefore, the scope of protection of the present invention should be determined by the contents of the appended claims.

Claims

1. A miniature blade, characterized in that, It includes a substrate layer and a multilayer deformable piezoelectric thin film disposed on the substrate layer; wherein, The multilayer deformable piezoelectric thin film includes a piezoelectric material layer, an upper electrode layer, and a lower electrode layer, wherein the upper electrode layer and the lower electrode layer are respectively disposed on both sides of the piezoelectric material layer; and... The microblades propel fluid flow based on the piezoelectric effect of the piezoelectric material layer.

2. The microblade as described in claim 1, characterized in that, During the process of the microblade propelling the fluid flow, the direction of the fluid flow is perpendicular to the surface of the microblade; and the microblade moves in a plane perpendicular to the direction of the fluid flow.

3. The microblade as described in claim 2, characterized in that, During the movement of the microblades, the microblades bend at different positions based on the piezoelectric effect to drive the fluid flow; wherein, The microblade bends towards the direction of fluid flow on the side closest to the direction of motion, and bends away from the direction of fluid flow on the side furthest from the direction of motion.

4. A fluid pump chip, characterized in that, Includes blade arrays and actuators; among which, The blade array includes at least one microblade as described in claim 2 or 3, and the actuator is used to drive the blade array to move in a plane perpendicular to the direction of fluid flow.

5. A heat dissipation module, characterized in that, Includes a heating chip and a fluid pump chip as described in claim 4; wherein, The fluid pump chip is disposed on one side of the heating chip; and, The fluid pump chip drives airflow to dissipate heat from the heat-generating chip.

6. The microblade as described in claim 1, characterized in that, During the process of the fluid flow being propelled by the microblades, the direction of the fluid flow is parallel to the surface of the microblades; and... The microblades vibrate perpendicularly to their surfaces based on the piezoelectric effect to propel the fluid flow.

7. A fluid pump chip, characterized in that, Includes blade arrays; among which, The blade array includes at least one microblade as described in claim 6.

8. The fluid pump chip as described in claim 7, characterized in that, It also includes a fixed support, on which the blade array is connected; and, A connecting piece is attached to the end of the micro blade that is away from the fixed support.

9. A heat dissipation module, characterized in that, Includes a heating chip and a fluid pump chip as described in claim 7 or 8; wherein, The fluid pump chip is disposed on one side of the heating chip; and, The fluid pump chip drives airflow to dissipate heat from the heat-generating chip.

10. The heat dissipation module as described in claim 9, characterized in that, The fluid pump chip is provided in at least two sets; and... The fluid pump chips are connected in series on one side of the heating chip; or, the fluid pump chips are connected in parallel on one side of the heating chip.

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