A multi-sensor-based composite intervention guide wire performance detection system and method

By using a multi-sensor detection system to monitor the bonding state between the inner and outer layers of the interventional guidewire in real time, the problem of the inability to quantify and evaluate this process in existing technologies has been solved. This enables efficient and accurate detection of interlayer bonding strength during the guidewire production process, ensuring product quality and surgical safety.

CN122108933APending Publication Date: 2026-05-29DONGGUAN DUS CHENGFA PRECISION SPRING CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DONGGUAN DUS CHENGFA PRECISION SPRING CO LTD
Filing Date
2026-04-23
Publication Date
2026-05-29

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Abstract

The application relates to the field of performance detection, and discloses a composite intervention guide wire performance detection system and method based on multiple sensors. The method comprises the following steps: performing an axial force test on a first sample to obtain an interlayer axial maximum static friction force; performing a rotary torque test on a second sample to obtain an interlayer torsional static friction force; respectively calculating a first interlayer bonding strength coefficient and a first torsional interlayer bonding strength coefficient, and comparing the two coefficients with preset standard values; if both the coefficients are qualified, outputting a comprehensive value; if any one is unqualified, performing a cyclic fatigue test on a third sample to calculate a second interlayer bonding strength coefficient; if the second interlayer bonding strength coefficient is still unqualified, performing a composite load test on a fourth sample and a fifth sample to respectively obtain calibration interlayer bonding strength coefficients in two sequences, and taking the average value of the two coefficients as a final result. Through a multi-stage evaluation strategy, the application realizes accurate detection of the bonding state of the inner and outer layers of a double-layer guide wire.
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