A heat source testing device for a uniform temperature plate

Abstract

The application relates to the field of testing equipment, in particular to a heat source testing device for a vapor chamber, which comprises a rack, a lifting platform, an insulating plate, a lifting testing mechanism and a self-adaptive leveling mechanism. The lifting platform comprises a jig and a heat transfer piece, the jig is used for placing a plurality of heat transfer pieces, the insulating plate is used for placing a to-be-tested vapor chamber, the lifting testing mechanism comprises a testing hot plate, the testing hot plate is moved downwards to be closely attached to the top of the to-be-tested vapor chamber, the jig drives the heat transfer pieces to move upwards until the heat transfer pieces are closely attached to the to-be-tested vapor chamber, the heat transfer pieces are used for monitoring temperature data and feeding back an external power supply monitoring device, and the self-adaptive leveling mechanism comprises a plurality of first leveling structures which are correspondingly arranged at the bottoms of the heat transfer pieces and are used for automatically adjusting the flatness of the attachment of the heat transfer pieces to the uniform temperature area of the to-be-tested vapor chamber. The device realizes the automatic leveling function in the vapor chamber testing process, improves the accuracy and testing efficiency of the testing, and effectively avoids the problem of uneven heat transfer in the testing process.

Description

Technical Field

[0001] This application relates to the field of testing equipment, and in particular to a heat source testing device for a heat exchange plate. Background Technology

[0002] In the field of electronic equipment, with the continuous improvement of chip performance, the amount of heat generated has increased dramatically. As a key thermal management component, a vapor chamber can efficiently and evenly distribute heat, ensuring the stable operation of electronic equipment, extending its service life, and preventing performance degradation or even failure due to overheating. Especially in the aerospace and new energy vehicle industries, where extremely high demands are placed on equipment thermal management, vapor chambers, with their excellent thermal conductivity and temperature uniformity, provide reliable protection for the normal operation of aerospace equipment and new energy vehicles. Depending on the requirements, vapor chambers can be divided into box-type vapor chambers and thin-film vapor chambers. Box-type vapor chambers can be installed side-by-side in large equipment, while thin-film vapor chambers can form multiple temperature uniformity zones during the manufacturing process, requiring only one thin-film vapor chamber to function in small equipment. As the performance requirements for vapor chambers in various fields become increasingly stringent, accurate and efficient testing of vapor chamber performance has become a key factor driving the development of related technologies.

[0003] The industry standard for testing the temperature uniformity of heat exchangers involves using a heat exchanger testing device. Existing testing devices include a placement platform, a testing mechanism positioned above the platform, and a power control mechanism. Specifically, the placement platform has a dedicated slot for the heat exchanger, and the testing mechanism has a test aluminum plate electrically connected to the power control mechanism. During the heating test, the test aluminum plate is driven downwards until its bottom is firmly pressed against the surface of the heat exchanger in the slot. The test aluminum plate simulates the actual heating of an electronic heating element during operation. The heating power of the test plate is controlled by precisely adjusting the DC power supply voltage. When the heating power remains constant, the heat transfer of the heat exchanger is measured through multiple temperature detection points on the test plate and heat sink within the slot. After system data processing, the temperature difference can be calculated, thus enabling the testing of the heat exchanger's thermal response time and temperature uniformity.

[0004] However, existing vapor chamber testing devices have significant drawbacks in practical use. These drawbacks primarily manifest in the fact that operators must level the vapor chamber before testing, but it is difficult for operators to determine whether the vapor chamber is level. When the test plate is pressed down, some areas of the vapor chamber may not adhere tightly to the test plate, leading to uneven heat transfer and inaccurate temperature measurements. This, in turn, affects the evaluation of the vapor chamber's thermal response and temperature uniformity, reducing test accuracy. This is especially problematic when testing thin, uneven vapor chambers, where one-step leveling is impossible. This necessitates testing each temperature uniformity area individually to assess the overall performance of the vapor chamber, increasing testing time and cost, reducing efficiency, and failing to meet the increasingly diverse testing needs of vapor chambers. Summary of the Invention

[0005] In order to achieve automatic leveling during the testing process of a heat exchanger, improve the accuracy and efficiency of the test, and effectively avoid the problem of uneven heat transfer affecting the test results due to gaps between the heat exchanger and the test components on the upper and lower surfaces during the test, this application provides a heat exchanger heat source testing device.

[0006] This application provides a heat source testing device for a heat exchange plate, including a lifting platform mounted on the frame, an insulating plate, a lifting testing mechanism, and an adaptive leveling mechanism. The lifting platform includes a liftable fixture and heat transfer components. The top of the fixture has several placement slots for placing the heat transfer components one by one. The insulating plate has positioning slots for placing the heat exchange plate to be tested. The lifting testing mechanism includes a test hot plate for connecting to an external power monitoring device. When the test hot plate moves downwards to the top of the heat exchange plate to be tested, which is in close contact with the positioning slot, the fixture drives the heat transfer components upwards until each heat transfer component is in close contact with the heat exchange area of ​​the heat exchange plate to be tested. The heat transfer components are used to monitor temperature data and provide feedback to the external power monitoring device. The adaptive leveling mechanism includes several primary leveling structures, each of which is correspondingly located at the bottom of each heat transfer component. These structures are used to automatically adjust the flatness of the contact between the heat transfer component and the heat exchange area of ​​the heat exchange plate to be tested and to buffer the slight vibration of the heat transfer component during the testing process. By adopting the above technical solution, a liftable fixture and heat transfer components are set in the heat source testing device for the heat spreader plate. Placement slots are arranged on the top of the fixture to hold the heat transfer components. When the test hot plate moves downwards to press against the top of the heat spreader plate under test, the fixture drives the heat transfer components upwards to press against the uniform temperature areas of the heat spreader plate. This allows the heat transfer components to accurately monitor temperature data and feed it back to the external power monitoring device, achieving effective testing of the heat spreader plate's thermal performance. Simultaneously, the first-stage leveling structure of the adaptive leveling mechanism is located at the bottom of the heat transfer components. During the contact process between the heat transfer components and the heat spreader plate, the first-stage leveling structure automatically adjusts according to the actual surface conditions of the heat spreader plate, ensuring a smoother contact between the heat transfer components and the uniform temperature areas. This avoids uneven heat transfer caused by loose contact, thereby improving the accuracy of temperature data measurement and ensuring the reliability of the evaluation of the heat spreader plate's thermal response and uniform temperature effect. Furthermore, the primary leveling structure can buffer minor vibrations of the heat transfer component during testing, reducing interference with temperature measurements and further improving testing accuracy and stability. In this way, for different types, especially thin and light-weight heat spreaders with uneven surfaces, it is unnecessary to test each heat spreader area separately; the entire heat spreader can be tested in one go, significantly shortening testing time, reducing testing costs, and improving testing efficiency. Preferably, the primary leveling structure includes four primary springs, which are rectangularly arranged between the placement slot and the heat transfer component. By adopting the above technical solution, in the heat spreader heat source testing device, because the primary leveling structure uses four rectangular primary springs arranged between the placement slot and the heat transfer component, when the heat transfer component contacts the heat spreader area to be tested, even if the surface of the heat spreader is uneven, the primary springs in each direction will undergo varying degrees of expansion and contraction deformation according to the force applied.This expansion and contraction allows the heat transfer component to adaptively adjust its position and angle, ensuring close contact with the temperature equalization area of ​​the heat exchange plate under test, thus improving the flatness of the contact between the heat transfer component and the temperature equalization area of ​​the heat exchange plate under test. Simultaneously, when slight vibrations occur in the heat transfer component due to the downward pressure of the test hot plate during the test, the primary spring can use its elasticity to buffer and absorb the energy of the vibration, thereby cushioning the slight vibrations of the heat transfer component during the test. Preferably, the lifting platform further includes a fixture drive component for driving the fixture to rise and fall, and the adaptive leveling mechanism further includes a secondary leveling structure, which is disposed between the fixture and the output end of the fixture drive component to buffer the slight vibrations of the fixture during the test. By adopting the above technical solution, a two-stage leveling structure is set between the fixture and the output end of the fixture drive component in the heat source testing device for a heat spreader plate. This effectively buffers the slight vibrations generated by the pressing action of the test hot plate during the testing process, preventing the vibration from affecting the adhesion between the heat transfer component and the temperature uniformity area of ​​the heat spreader plate under test. This ensures the accuracy of temperature data monitoring and improves the reliability of the testing device in evaluating the thermal response and temperature uniformity effect of the heat spreader plate. Preferably, the two-stage leveling structure includes two secondary springs, which are symmetrically arranged at the bottom of the fixture. By adopting the above technical solution, since the two secondary springs are symmetrically arranged at the bottom of the fixture, when the test hot plate is pressed down and the fixture is subjected to external force and generates slight vibrations, the symmetrically arranged secondary springs can be subjected to force simultaneously and evenly. Because springs have elastic deformation capabilities, this elasticity can absorb and disperse the energy generated by the vibration of the fixture, thus effectively buffering the slight vibrations of the fixture during the testing process, ensuring the stability of the testing environment, and thus improving the accuracy of the test data. Preferably, the lifting platform, insulating plate, lifting testing mechanism, and adaptive leveling mechanism are all mounted on a U-shaped plate, and the U-shaped plate is rotatably connected to the frame via an angle adjustment structure. By adopting the above technical solution, the lifting platform, insulating plate, lifting testing mechanism, and adaptive leveling mechanism are all mounted on a U-shaped plate, and the U-shaped plate is rotatably connected to the frame via an angle adjustment structure. This structural design allows the U-shaped plate to rotate relative to the frame, facilitating the adjustment of the test hot plate to a horizontal state during testing. Furthermore, in actual testing, the testing conditions of the heat spreader may vary, and different testing scenarios may require different testing angles. Because the U-shaped plate is rotatable, the testing angle can be flexibly adjusted according to actual testing needs. This better simulates the actual usage conditions of the heat spreader under different environments, thereby more accurately testing the heat spreader and making the test results more consistent with actual application conditions. Preferably, the angle adjustment structure includes a damping rotation shaft and a tie rod. The U-shaped plate and the frame are coaxially rotatably connected via the damping rotation shaft. The tie rod is perpendicularly connected to the U-shaped plate. The frame is provided with an arc-shaped groove that allows the tie rod to rotate around the damping rotation shaft.By adopting the above technical solution, this angle adjustment structure uses a damped rotating shaft to achieve coaxial rotational connection between the U-shaped plate and the frame. The damping characteristic ensures that the U-shaped plate remains stable during rotation and will not sway due to slight external disturbances, thus ensuring the accuracy of angle adjustment. Simultaneously, the tie rod, in conjunction with the arc-shaped groove on the frame, further restricts the movement trajectory during adjustment, making angle adjustment more precise and controllable. This achieves flexible adjustment of the overall angle of the heat exchanger heat source testing device to adapt to different testing scenarios and needs. Preferably, the lifting testing mechanism also includes a heat plate drive component for driving the lifting and lowering of the test heat plate. The frame is horizontally equipped with at least four level sensors, arranged in pairs on opposite sides of the test heat plate. Each of the four level sensors emits rays to the lower surface of the test heat plate to detect whether the lower surface of the test heat plate is level. An alarm is triggered when the detection results of the four level sensors are inconsistent. By adopting the above technical solution, in the heat exchanger heat source testing device, the heat plate drive component can drive the lifting and lowering of the test heat plate, and the levelness of the test heat plate is crucial to the performance of the heat exchanger. If the lower surface of the test hot plate is not level, it will not adhere tightly to the heat exchanger under test, resulting in uneven heat transfer and inaccurate temperature measurements, affecting the evaluation of the heat exchanger's thermal response and temperature uniformity. At least four level sensors are horizontally arranged on the frame, in pairs on opposite sides of the test hot plate. These sensors emit rays to the lower surface of the test hot plate, enabling real-time detection of its levelness. When the four level sensors show inconsistent results, it indicates that the lower surface of the test hot plate is not level, triggering an alarm to promptly remind the operator to adjust the level of the test hot plate, ensuring a tight fit between the test hot plate and the heat exchanger, resulting in uniform heat transfer, accurate temperature measurements, and improved accuracy in evaluating the heat exchanger's thermal response and temperature uniformity. Preferably, two mechanical sensors are horizontally arranged at the bottom of the placement slot. During testing, these two mechanical sensors contact the heat transfer element, and an alarm is triggered when the results from the two mechanical sensors in one placement slot are inconsistent. By adopting the above technical solution, during testing, two mechanical sensors horizontally positioned at the bottom of the placement tank contact the heat transfer component. If the heat transfer component adheres well to the temperature distribution plate under test and is subjected to uniform force, the detection results of the two mechanical sensors should be consistent. When the detection results of the two mechanical sensors in one placement tank are inconsistent, it indicates that the heat transfer component is not tightly adhered to the temperature distribution plate under test or that the force is uneven. An alarm is then triggered, allowing for timely detection of problems in the adhesion between the heat transfer component and the temperature distribution plate under test, preventing uneven heat transfer due to adhesion issues, and thus improving the accuracy of the test. Preferably, the test hot plate is connected to the U-shaped plate via four guide posts. By adopting the above technical solution, the four guide posts connect the test hot plate to the U-shaped plate, providing a clear guiding path for the movement of the test hot plate.When the test hot plate moves up and down, the guide column restricts its direction of movement, allowing it to move only in a straight line along the guide column, thus preventing deviation or wobbling during movement. This ensures that the test hot plate accurately contacts the top of the heat exchanger plate when it moves downwards, improving the stability of heat transfer and the accuracy of the test. Preferably, there are four placement slots and four heat transfer components. By adopting the above technical solution, considering that common heat exchangers, especially thin heat exchangers, form multiple heat exchange zones during the manufacturing process, four placement slots and four heat transfer components are set to comprehensively and reasonably test the performance of each heat exchange zone. This allows each heat transfer component to correspond well with the heat exchange zone of the heat exchanger plate, thereby more effectively monitoring the temperature data of each heat exchange zone and feeding it back to the external power monitoring device, providing strong data support for accurately evaluating the thermal response and heat exchange effect of the heat exchanger plate.

[0007] In summary, this application includes at least one of the following beneficial technical effects: 1. The adaptive leveling mechanism comprises several primary leveling structures, each correspondingly positioned at the bottom of each heat transfer component. During testing, the primary leveling structures automatically adjust the flatness of the contact between the heat transfer component and the temperature uniformity area of ​​the temperature uniformity plate, based on the actual conditions of the area under test. This solves the problem of insufficient contact between parts of the temperature uniformity plate and the test component in existing technologies, thereby making the measured temperature data more accurate and ultimately improving the accuracy of the evaluation of the temperature uniformity plate's thermal response and temperature uniformity effect. 2. The primary and secondary leveling structures of the adaptive leveling mechanism can absorb and disperse the slight vibrations generated by the heat transfer components during the test, thereby buffering the slight vibrations of the heat transfer components during the test and ensuring the stability of the test process. 3. The lifting platform of this device includes a liftable fixture and heat transfer components. The top of the fixture has several placement slots for individually placing the heat transfer components. When the test hot plate moves downwards to be flush with the top of the heat spreader under test, the fixture moves the heat transfer components upwards, achieving good contact between the heat transfer components and the heat spreader's temperature uniformity area. Unlike existing technologies, this eliminates the need to test each temperature uniformity area separately, reducing testing steps, thus reducing testing time and cost, improving testing efficiency, and meeting the increasingly diverse testing needs of heat spreaders. Attached Figure Description

[0008] Figure 1 This is a structural diagram of a heat source testing device for a heat exchanger plate according to Embodiment 1; Figure 2 This is a product image of the heat exchanger plate under test in Example 1, which is a heat source testing device for a heat exchanger plate. Figure 3This is an internal structural diagram of a heat source testing device for a heat exchanger plate according to Embodiment 1; Figure 4 This is an exploded view of the internal structure of a heat source testing device for a heat exchanger plate according to Embodiment 1; Figure 5 This is a structural diagram of the fixture and heat transfer components of a heat source testing device for a heat exchange plate, as shown in Example 1. Figure 6 This is a structural diagram of the insulating plate of a heat source testing device for a heat exchange plate, as shown in Example 2. Figure 7 This is a schematic diagram of the horizontal sensor installation of a heat source testing device for a heat exchange plate according to Embodiment 3; Figure 8 This is a schematic diagram of the mechanical sensor installation of a heat source testing device for a heat exchange plate, as shown in Example 4.

[0009] Explanation of reference numerals in the attached drawings: 1. Frame; 2. Lifting platform; 3. Insulating plate; 4. Lifting test mechanism; 5. Adaptive leveling mechanism; 6. Temperature distribution plate to be tested; 7. Horizontal sensor; 8. Mechanical sensor; 11. Frame body; 12. U-shaped plate; 13. Angle adjustment structure; 111. Arc groove; 131. Damping rotation shaft; 132. Tie rod; 21. Fixture; 22. Heat transfer component; 23. Fixture drive component; 24. Fixture plate; 25. Connecting plate; 26. Connector 27. Column; 211. Support plate; 221. Placement slot; 222. Wire; 222. Heat dissipation hole; 31. Positioning slot; 32. Slide plate; 33. Sliding structure; 34. Mounting plate; 321. Clearing hole; 41. Test hot plate; 42. Hot plate drive component; 43. Heat insulation plate; 44. Guide column; 51. First-level leveling structure; 52. Second-level leveling structure; 61. First temperature uniformity zone; 62. Second temperature uniformity zone; 63. Third temperature uniformity zone; 64. Fourth temperature uniformity zone. Detailed Implementation

[0010] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0011] Example 1 This application provides an embodiment of a heat source testing device for a heat exchange plate, referring to... Figure 1 and Figure 2The system includes a frame 1, a lifting platform 2 mounted on the frame 1, an insulating plate 3, a lifting test mechanism 4, and an adaptive leveling mechanism 5. The lifting platform 2, insulating plate 3, and lifting test mechanism 4 are arranged sequentially from bottom to top. The adaptive leveling mechanism 5 is installed in the lifting platform 2 and works in conjunction with it. The insulating plate 3 is used to place the heat dissipation plate 6 to be tested. The lifting platform 2 can move closer to the upper insulating plate 3 to place the heat dissipation structure for testing. At the same time, the lifting test mechanism 4 can move closer to the lower insulating plate 3 to perform testing. The lifting test mechanism 4 is used to simulate the heating of electronic components. The adaptive leveling mechanism 5 ensures the flatness of the heat dissipation structure and the heat dissipation plate 6 under test. The heat dissipation structure of the lifting platform 2 and the lifting test mechanism 4 are both connected to an external power monitoring device to monitor the test parameters, thereby improving the accuracy and efficiency of the heat dissipation plate test.

[0012] In this embodiment, the temperature distribution plate 6 to be tested is a thin sheet-like temperature distribution plate. The side of the temperature distribution plate that contacts the lifting test mechanism 4 is a flat plane. The side of the temperature distribution plate that contacts the lifting platform 2 is arranged sequentially as a first temperature distribution area 61, a second temperature distribution area 62, a third temperature distribution area 63, and a fourth temperature distribution area 64. The thickness of the second temperature distribution area 62 and the third temperature distribution area 63 is greater than the thickness of the first temperature distribution area 61 and the fourth temperature distribution area 64. That is to say, the side of the temperature distribution plate that contacts the lifting platform 2 is a non-flat surface.

[0013] Reference Figure 3 Specifically, the frame 1 in this embodiment includes a frame body 11 and a U-shaped plate 12. The frame body 11 is a U-shaped structure with its opening facing upwards, and the U-shaped plate 12 is a U-shaped structure with its opening facing downwards. The two are rotatably connected by an angle adjustment structure 13. The lifting platform 2, the insulating plate 3, the lifting test mechanism 4, and the adaptive leveling mechanism 5 are all disposed on the U-shaped plate 12 and rotate synchronously with the U-shaped plate 12 around a horizontal axis. Specifically, each angle adjustment structure 13 consists of a damping rotation shaft 131 and a pull rod 132. The U-shaped plate 12 and the frame body 11 are coaxially rotatably connected by the horizontal damping rotation shaft 131. The pull rod 132 is vertically fixedly connected to the U-shaped plate 12. Arc-shaped grooves 111 are provided on both sides of the frame body 11, allowing the pull rod 132 to rotate around the damping rotation shaft 131. By pulling the lever 132, the U-shaped plate 12 is driven to rotate around the damping rotation axis 131, thereby causing the U-shaped plate 12 to drive the lifting platform 2, the insulating plate 3, the lifting test mechanism 4, and the adaptive leveling mechanism 5 to rotate at a certain angle relative to the frame body 11. This facilitates the debugging and maintenance of the testing device. The damping characteristics of the damping rotation axis 131 enable the U-shaped plate 12 to remain stably at any rotation angle during rotation, and it can remain stable throughout the rotation process without swaying due to slight external disturbances, thus ensuring the accuracy of angle adjustment.

[0014] Reference Figure 3 and Figure 4 Specifically, in this embodiment, the lifting platform 2 includes a liftable fixture 21, a heat transfer component 22, and a fixture drive component 23 for driving the fixture 21 to rise and fall. The fixture drive component 23 is horizontally installed at the opening of the U-shaped plate 12 via a fixing plate 24, connecting columns 26, and a support plate 27. Specifically, the fixing plate 24 is fixedly connected to both sides of the U-shaped plate 12, and the support plate 27 is set below the fixing plate 24 via four vertical connecting columns 26, and the support plate 27 is parallel to the fixing plate 24. In this embodiment, the fixture drive component 23 is a cylinder, and there are two cylinders. The bottom of the two cylinders is set on the support plate 27, and the piston rod end of the top of the two cylinders is provided with a horizontal plate. A connecting plate 25 is set on the top of the two horizontal plates and connected to the bottom of the fixture 21. The piston rod drives the fixture 21 to rise or fall.

[0015] Reference Figure 4 and Figure 5 The fixture 21 has four placement slots 211 arranged on its top for placing heat transfer components 22 one by one. There are four placement slots 211 and four heat transfer components 22, and each slot corresponds to one heat transfer component 22. Ideally, the four heat transfer components 22 can be tightly attached to the first temperature uniformity area 61, the second temperature uniformity area 62, the third temperature uniformity area 63, and the fourth temperature uniformity area 64 of the temperature uniformity plate 6 under test, allowing simultaneous testing of these four areas and improving testing efficiency. Of course, depending on different testing requirements, the fixture 21 in this embodiment can be disassembled and installed using bolts to adjust the number of placement slots 211 and heat transfer components 22, adapting to testing temperature uniformity plates of different specifications. The fixture 21 is made of insulating material and is a square flat plate to facilitate the placement of the heat transfer components 22.

[0016] The heat transfer element 22 is made of a material with high thermal conductivity; in this embodiment, it is made of copper. It is block-shaped and effectively transfers heat. It is connected to an external power monitoring device via wire 221 for temperature monitoring. The copper block is equipped with heat dissipation holes 222 for better heat dissipation. The combination logic of the fixture 21 and the heat transfer element 22 is as follows: the fixture 21 provides support and positioning for the heat transfer element 22 through a placement slot 211; the fixture drive 23 moves the fixture 21 and the heat transfer element 22 up and down together, so that the heat transfer element 22 can fit tightly against the temperature distribution plate 6 under test, achieving temperature monitoring. This combination allows the heat transfer element 22 to accurately reach the test position and remain stable during the test.

[0017] Specifically, the adaptive leveling mechanism 5 in this embodiment includes a primary leveling structure 51 and a secondary leveling structure 52. There are four primary leveling structures 51 and two secondary leveling structures 52. Each primary leveling structure 51 corresponds to a heat transfer element 22, and each heat transfer element 22 has a primary leveling structure 51 at its bottom. These structures automatically adjust the flatness of the contact between the heat transfer element 22 and the temperature distribution area of ​​the temperature distribution plate 6 under test, and buffer minor vibrations of the heat transfer element 22 during testing. Specifically, each primary leveling structure 51 includes four identical primary springs. These four primary springs are arranged horizontally in a rectangle between the placement groove 211 and the heat transfer element 22. The bottom of the primary spring is fixedly connected to the bottom of the placement groove 211, and the top of the spring is in contact with the bottom of the heat transfer element 22. The primary springs are made of a metal material with good elasticity, such as stainless steel, and their elastic coefficient is selected according to the weight of the heat transfer element 22 and the testing requirements. The function of the primary spring is to automatically adjust the posture of the heat transfer element 22 according to the unevenness of the surface of the heat exchange plate 6 when the heat transfer element 22 comes into contact with the heat exchange plate 6, so that the heat transfer element 22 and the heat exchange plate are fully in contact, and at the same time buffer the vibration during the test to reduce the impact on the test results.

[0018] Two secondary leveling structures 52 are symmetrically arranged between the fixture 21 and the connecting plate 25 at the output end of the fixture drive component 23 to buffer minor vibrations of the fixture 21 during testing. Each secondary leveling structure 52 includes four secondary springs, each sleeved on the outer wall of the connecting cylinder between the horizontal plate and the connecting plate 25. The secondary springs are also made of a metal material with good elasticity, and their elastic coefficient is determined according to the weight of the fixture 21 and the testing requirements. The diameter of the secondary springs is much larger than that of the primary springs. The function of the secondary springs is to further buffer the vibration of the fixture 21 during lifting and lowering, ensuring the stability of the fixture 21 and the heat transfer component 22, thereby improving the accuracy of the test.

[0019] Reference Figure 3Specifically, in this embodiment, the insulating plate 3 has a positioning groove 31 in the middle for placing the temperature-equalizing plate 6 to be tested. The insulating plate 3 is made of a material with good insulation properties, such as plastic or ceramic, and its function is to prevent heat leakage to the surrounding environment and to provide a fixed placement position for the temperature-equalizing plate 6 to be tested. The insulating plate 3 is usually square flat, and the positioning groove 31 is designed according to the shape and size of the temperature-equalizing plate 6 to be tested to ensure that the temperature-equalizing plate can be accurately placed in it. In this embodiment, the bottom of the insulating plate 3 is provided with a sliding plate 32. The sliding plate 32 slides and engages with the fixed plate 24 below through a sliding structure 33, so that the sliding plate 32 and the insulating plate 3 can slide horizontally. The sliding structure 33 is a combination of a sliding groove and a sliding rail. The sliding rail is set on the top of the fixed plate 24, and the bottom of the sliding plate 32 is provided with a sliding groove. The sliding plate 32 is provided with a clearance hole 321 to facilitate the lifting and lowering of the fixture 21, so that the fixture 21 drives the heat transfer element 22 through the clearance hole 321 of the sliding plate 32 until it contacts the temperature-equalizing plate 6 to be tested on the insulating plate 3.

[0020] Specifically, in this embodiment, the lifting test mechanism 4 includes a test hot plate 41 for connecting to an external power monitoring device and a hot plate drive component 42 for driving the test hot plate 41 to rise or fall. A heat insulation plate 43 is provided on the top of the test hot plate 41 to prevent heat leakage to the surrounding environment. The test hot plate 41 is made of a material with good electrical and thermal conductivity, such as aluminum alloy, and its surface is flat, simulating the heating conditions of an electronic heating element in actual operation. After the test hot plate 41 is connected to the external power monitoring device, the heating power is controlled by precisely adjusting the voltage of the power supply. In other embodiments, the test hot plate 41 can be replaced with a plate of other materials but with similar electrical and thermal conductivity. The hot plate drive component 42 is also a cylinder, which is located on the U-shaped plate 12. Its piston rod passes through the U-shaped plate 12 and connects to the test hot plate 41 to drive the test hot plate 41 to rise or fall. The combination logic of the test hot plate 41 and the hot plate drive component 42 is as follows: the hot plate drive component 42 drives the test hot plate 41 to rise and fall, so that the test hot plate 41 can be in close contact with the top of the temperature distribution plate 6 under test, providing heat to the temperature distribution plate. This combination ensures that the test hot plate 41 can accurately reach the test position and make full contact with the temperature distribution plate, achieving effective heat transfer.

[0021] Specifically, the test hot plate 41 is connected to the U-shaped plate 12 via four guide posts 44. The guide posts 44 are made of metal with a smooth surface, and their function is to ensure that the test hot plate 41 remains vertical and stable during the lifting and lowering process.

[0022] The implementation principle of this embodiment is as follows: This heat exchanger testing device achieves efficient and accurate testing of the heat exchanger through the coordinated operation of its components. The primary leveling structure 51 and secondary leveling structure 52 of the adaptive leveling mechanism 5 can automatically adjust the posture of the heat transfer element 22 and the fixture 21, ensuring that the heat transfer element 22 is fully in contact with the heat exchanger 6 under test, reducing uneven heat transfer caused by poor contact and improving test accuracy. The angle adjustment structure 13 facilitates the debugging and maintenance of the device. The horizontal sensor 7 and the mechanical sensor 8 can monitor the status of the test hot plate 41 and the heat transfer element 22 in real time, providing timely alarms when abnormalities occur, ensuring the reliability of the test. Simultaneously, the setting for simultaneous testing of multiple heat transfer elements 22 improves testing efficiency, meeting the increasingly diverse testing needs of heat exchangers, and significantly improving the accuracy and efficiency of heat exchanger testing compared to existing technologies.

[0023] Example 2 The difference between this embodiment and Embodiment 1 above is that: (Refer to...) Figure 6 In this embodiment, the insulating plate 3 has a detachable mounting plate 34 in the middle. The mounting plate 34 has positioning grooves 31 for placing the temperature equalization plate 6 to be tested. That is, this embodiment can be replaced with mounting plates 34 with positioning grooves 31 of different specifications and shapes. For example, the mounting plate 34 in this embodiment has four positioning grooves 31. Correspondingly, the fixture 21 is replaced with four corresponding placement grooves 211 at corresponding intervals. In this way, four temperature equalization plates can be tested simultaneously. This embodiment is applicable to various temperature equalization plates and test scenarios where multiple temperature equalization plates are tested simultaneously, meeting the increasingly diverse testing needs of temperature equalization plates. Everything else is the same as in Embodiment 1.

[0024] Example 3 The difference between this embodiment and Embodiment 1 above is that: (Refer to...) Figure 7This embodiment is suitable for testing processes where the test hot plate 41 needs to be leveled before testing. Four level sensors 7 are horizontally arranged on both sides of the frame body 11. The four level sensors 7 are arranged in pairs on opposite sides of the test hot plate 41. Each of the four level sensors 7 emits rays to the lower surface of the test hot plate 41 to detect whether the lower surface of the test hot plate 41 is level. An alarm is triggered when the detection results of the four level sensors 7 are inconsistent. The level sensor 7 can be a laser level sensor, which works by emitting a laser beam to the lower surface of the test hot plate 41 and determining the levelness of the test hot plate 41 by receiving the time difference of the reflected light, i.e., the distance between different positions on the end face of the test hot plate 41. In other embodiments, the level sensor 7 can also be an infrared level sensor. This embodiment uses the level sensor 7 to better indicate the levelness of the test hot plate 41 to the operator during device debugging. If the test hot plate 41 is not level, an alarm will be triggered to instruct the operator to adjust it, thereby further improving the accuracy of the test. Everything else is the same as in Embodiment 1.

[0025] Example 4 The difference between this embodiment and embodiment 3 above is that: (Refer to...) Figure 8 This embodiment is suitable for testing processes where the test hot plate 41 needs to be leveled before testing. In this embodiment, two mechanical sensors 8 are horizontally arranged at the bottom of each placement slot 211. During testing, the two mechanical sensors 8 contact the bottom of the heat transfer element 22. An alarm is triggered when the detection results of the two mechanical sensors 8 in one placement slot 211 are inconsistent. The mechanical sensor 8 is a pressure sensor used to detect the pressure distribution between the heat transfer element 22 and the placement slot 211. In other embodiments, the mechanical sensor 8 can also be a strain gauge sensor. This embodiment uses the mechanical sensors 8 to more accurately determine whether the pressure applied by the heat transfer element 22 to the two mechanical sensors 8 is consistent during testing. This allows for the determination of whether the heat transfer element 22 receives uniform pressure from the heat exchange plate 6 under test, and whether the heat transfer element 22 and the heat exchange plate 6 are in close contact. If there is any partial non-contact, it will cause inconsistencies in the detection results of the two mechanical sensors 8, triggering an alarm to instruct the operator to make adjustments. Other aspects are the same as in Embodiment 3.

[0026] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heat source testing device for a heat exchanger plate, characterized in that, The system includes a frame (1), a lifting platform (2) mounted on the frame (1), an insulating plate (3), a lifting test mechanism (4), and an adaptive leveling mechanism (5). The lifting platform (2) includes a liftable fixture (21) and a heat transfer element (22). The top of the fixture (21) is provided with several placement slots (211) for placing the heat transfer element (22) one by one. The insulating plate (3) is provided with a positioning slot (31) for placing the temperature distribution plate (6) to be tested. The lifting test mechanism (4) includes a test hot plate (41) for connecting an external power monitoring device. When the test hot plate (41) moves downward until it is in close contact with the positioning slot... The fixture (21) moves the heat transfer element (22) upwards from the top of the temperature plate (6) to be tested in (31) until each heat transfer element (22) is in close contact with the temperature uniform area of ​​the temperature plate (6) to be tested. The heat transfer element (22) is used to monitor temperature data and feed it back to the external power monitoring device. The adaptive leveling mechanism (5) includes several first-level leveling structures (51). Each first-level leveling structure (51) is correspondingly set at the bottom of each heat transfer element (22) to automatically adjust the flatness of the contact between the heat transfer element (22) and the temperature uniform area of ​​the temperature plate (6) to be tested and to buffer the slight vibration of the heat transfer element (22) during the test.

2. The heat source testing device for a heat exchange plate according to claim 1, characterized in that, The primary leveling structure (51) includes four primary springs, which are arranged in a rectangular shape between the placement groove (211) and the heat transfer element (22).

3. The heat source testing device for a heat exchange plate according to claim 2, characterized in that, The lifting platform (2) also includes a fixture drive (23) for driving the fixture (21) to rise and fall. The adaptive leveling mechanism (5) also includes a secondary leveling structure (52). The secondary leveling structure (52) is disposed between the fixture (21) and the output end of the fixture drive (23) for buffering the slight vibration of the fixture (21) during the test.

4. The heat source testing device for a heat exchange plate according to claim 3, characterized in that, The secondary leveling structure (52) includes two secondary springs, which are symmetrically arranged at the bottom of the fixture (21).

5. The heat source testing device for a heat exchange plate according to claim 1, characterized in that, The lifting platform (2), the insulating plate (3), the lifting test mechanism (4) and the adaptive leveling mechanism (5) are all set on the U-shaped plate (12). The U-shaped plate (12) and the frame (1) are rotatably connected through the angle adjustment structure (13).

6. The heat source testing device for a heat exchange plate according to claim 5, characterized in that, The angle adjustment structure (13) includes a damping rotation shaft (131) and a pull rod (132). The U-shaped plate (12) and the frame (1) are coaxially rotatably connected through the damping rotation shaft (131). The pull rod (132) is perpendicularly connected to the U-shaped plate (12). The frame (1) is provided with an arc-shaped groove (111) that allows the pull rod (132) to rotate around the damping rotation shaft (131).

7. The heat source testing device for a heat exchange plate according to claim 5, characterized in that, The lifting test mechanism (4) also includes a hot plate drive component (42) for driving the test hot plate (41) to lift. The frame (1) is horizontally provided with at least four level sensors (7). The four level sensors (7) are located in pairs on opposite sides of the test hot plate (41). The four level sensors (7) emit rays to the lower surface of the test hot plate (41) to detect whether the lower surface of the test hot plate (41) is horizontal. An alarm is triggered when the detection results of the four level sensors (7) are inconsistent.

8. The heat source testing device for a heat exchange plate according to claim 1, characterized in that, Two mechanical sensors (8) are horizontally arranged at the bottom of the placement slot (211). During testing, the two mechanical sensors (8) are in contact with the heat transfer element (22). An alarm is triggered when the detection results of the two mechanical sensors (8) in one placement slot (211) are inconsistent.

9. The heat source testing device for a heat exchange plate according to claim 5, characterized in that, The test hot plate (41) is connected to the U-shaped plate (12) via four guide pillars (44).

10. The heat source testing device for a heat exchange plate according to claim 1, characterized in that, The number of placement slots (211) and heat transfer elements (22) are both four.

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