A kind of combined mutual inductor precision test calibrating device

Abstract

The application discloses a kind of combined mutual inductor precision test's calibrating device, including test shell, mounting plate and heat dissipation mechanism;Test shell: its bottom wall is fixedly connected with heat conduction plate, and the fin lower end between heat conduction plate is provided with heat dissipation pipeline, and the upper surface of heat conduction plate is fixedly connected with booster;Mounting plate: its fixed connection is in the upper end of mounting bracket of heat conduction plate, and the upper surface of mounting plate is provided with resistance voltage divider and current sensor;Heat dissipation mechanism: it includes shell, heat exchange fin and heat exchange pipeline, the shell is placed in the left side of test shell, and the inside of shell is fixedly connected with heat exchange fin, and the fin between heat exchange fin is fixedly connected with heat exchange pipeline, and the water inlet two of heat exchange pipeline lower end is connected with the water outlet one of heat dissipation pipeline, this combined mutual inductor precision test's calibrating device, by the heat dissipation mode of full-closed type is for the element inside test shell high heat and is dissipated heat, with better electromagnetic shielding effect, more accurate.

Description

Technical Field

[0001] This invention relates to the field of combined current transformer accuracy testing technology, specifically to a verification device for testing the accuracy of combined current transformers. Background Technology

[0002] A combined instrument transformer is a key integrated high-voltage power measurement device that highly integrates the functions of traditional independent current and voltage transformers within a single insulating structure. Its core function is to synchronously and accurately perform two critical tasks: current measurement and voltage measurement. Combined instrument transformers are primarily used in high-voltage and ultra-high-voltage environments, and are particularly suitable for space-constrained locations. They provide an indispensable and highly reliable source of current and voltage information for the safe monitoring, accurate metering, real-time protection, and automatic control of power systems, and are one of the core fundamental components for the efficient and safe operation of modern smart grids.

[0003] Combined current transformers require accuracy testing, which is often performed using a combined current transformer comprehensive tester. The current is boosted and applied to both the combined current transformer and the load. The load's output is connected to the test port of the combined current transformer comprehensive tester for testing. However, the booster inside the combined current transformer comprehensive tester generates significant heat during operation, typically requiring a fan for forced cooling. This is problematic because the sensors used for testing are highly sensitive, and the fan is exposed to external conditions, resulting in poor electromagnetic shielding of the combined current transformer comprehensive tester and significant errors in the test results. Therefore, we propose a calibration device for the accuracy testing of combined current transformers. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the existing defects and provide a calibration device for testing the accuracy of combined current transformers. The device uses a fully enclosed heat dissipation method to dissipate heat from the core heat-generating components inside the test housing, which has a better electromagnetic shielding effect and is more accurate, thus effectively solving the problems in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a calibration device for testing the accuracy of a combined current transformer, comprising a test housing, a mounting plate, and a heat dissipation mechanism;

[0006] Test housing: A heat-conducting plate is fixedly connected to its bottom wall, and heat dissipation pipes are provided between the lower ends of the fins of the heat-conducting plate. A booster is fixedly connected to the upper surface of the heat-conducting plate.

[0007] Mounting plate: It is fixedly connected to the upper end of the mounting bracket of the heat conduction plate. The upper surface of the mounting plate is provided with a resistance voltage divider and a current sensor.

[0008] Heat dissipation mechanism: It includes a shell, heat exchange fins and heat exchange pipes. The shell is placed on the left side of the test shell. Heat exchange fins are fixedly connected inside the shell. Heat exchange pipes are fixedly connected between the fins of the heat exchange fins. The water inlet at the lower end of the heat exchange pipe is connected to the water outlet of the heat dissipation pipe. The high-heat components inside the test shell are cooled by a fully enclosed heat dissipation method, which has better electromagnetic shielding effect and is more accurate.

[0009] Furthermore, it also includes a microcontroller, which is mounted on the upper surface of the mounting plate. The resistor divider and current sensor are both bidirectionally electrically connected to the microcontroller, and the input terminal of the boost converter is electrically connected to the output terminal of the microcontroller to control the electrical components inside the test housing.

[0010] Furthermore, the upper surface of the heat-conducting plate is fixedly connected to a symmetrically distributed fixing frame, and a second fan is fixedly connected inside each fixing frame. The input end of the second fan is electrically connected to the output end of the microcontroller to realize air circulation inside the test shell.

[0011] Furthermore, the upper surface of the heat-conducting plate is fixedly connected with uniformly distributed temperature sensors, all of which are bidirectionally electrically connected to the microcontroller to detect the temperature distribution of the heat-conducting plate.

[0012] Furthermore, an LCD screen is provided on the left side of the test panel of the test housing. The input terminal of the LCD screen is electrically connected to the output terminal of the microcontroller, and the test data is displayed graphically.

[0013] Furthermore, it also includes a control switch assembly, which is fixedly connected to the front side of the housing. The input end of the control switch assembly is electrically connected to an external power source to control the electrical appliances inside the housing.

[0014] Furthermore, the heat dissipation mechanism also includes a water tank and a gear pump. The water tank and the gear pump are fixedly connected inside the housing. The water inlet 2 at the upper end of the heat exchange pipe is connected to the water inlet 3 at the upper end of the water tank. The water outlet 3 at the lower end of the water tank is connected to the inlet of the gear pump. The outlet of the gear pump is connected to the water inlet 1 of the heat dissipation pipe. The input end of the gear pump is electrically connected to the output end of the control switch group to realize the circulation of coolant.

[0015] Furthermore, uniformly distributed semiconductor cooling chips are fixedly connected to the rear side of the heat exchange fins. The cooling ends of the semiconductor cooling chips are all in contact with the rear side of the heat exchange fins, and the input ends of the semiconductor cooling chips are all electrically connected to the output end of the control switch group to dissipate heat from the heat exchange fins.

[0016] Furthermore, the heat dissipation mechanism also includes heat dissipation fins and a fan. The heat dissipation fins are fixedly connected to the rear side of the housing, and the heat-generating end of the semiconductor refrigeration chip is attached to the front side of the heat dissipation fins. A fan is fixedly connected to the right side of the housing, and the input end of the fan is electrically connected to the output end of the control switch group to dissipate heat from the semiconductor refrigeration chip.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: This calibration device for testing the accuracy of combined instrument transformers has the following advantages:

[0018] During the accuracy test of the combined transformer, the heat-conducting plate comes into contact with the core heat-generating components such as the booster outside the test housing to achieve efficient heat exchange. The coolant comes into contact with the fins of the heat-conducting plate to cool the heat-conducting plate. Subsequently, the coolant is cooled by the external heat exchange fins, keeping the test housing in a closed state and ensuring that the test housing has a better electromagnetic shielding effect, thereby improving the accuracy of the test. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the present invention;

[0020] Figure 2 This is a schematic cross-sectional view of the test shell structure of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of the heat-conducting plate and mounting plate of the present invention;

[0022] Figure 4 This is a cross-sectional view of the heat dissipation mechanism of the present invention.

[0023] Figure 5 This is a schematic diagram of the positional structure of the semiconductor cooling chip of the present invention.

[0024] In the diagram: 1 Test housing, 2 Heat conduction plate, 3 Mounting plate, 4 Microcontroller, 5 Heat dissipation pipe, 6 Heat dissipation mechanism, 61 Housing, 62 Heat exchange fins, 63 Heat exchange pipe, 64 Water tank, 65 Gear pump, 66 Heat dissipation fins, 67 Fan 1, 7 Control switch group, 8 Resistance voltage divider, 9 Current sensor, 10 Boost converter, 11 Temperature sensor, 12 Mounting bracket, 13 Fan 2, 14 Semiconductor cooling chip, 15 LCD screen. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Please see Figures 1-5 This embodiment provides a technical solution: a calibration device for testing the accuracy of a combined current transformer, including a test housing 1, a mounting plate 3, and a heat dissipation mechanism 6;

[0027] Test housing 1: A heat-conducting plate 2 is fixedly connected to its bottom wall. A heat dissipation pipe 5 is provided between the lower ends of the fins of the heat-conducting plate 2. A booster 10 is fixedly connected to the upper surface of the heat-conducting plate 2. During testing, the booster 10 generates a large amount of heat and exchanges heat with the heat-conducting plate 2. The heat-conducting plate 2 is made of aluminum alloy 6061, which takes into account heat dissipation, lightweight and magnetic field compatibility. The electrical appliances inside the housing 61 are turned on by the control switch group 7 to start the heat dissipation function.

[0028] A fixed bracket 12 is fixedly connected to the front side of the upper surface of the heat conduction plate 2, which is symmetrically distributed on the left and right. A fan 13 is fixedly connected inside the fixed bracket 12. The input end of the fan 13 is electrically connected to the output end of the microcontroller 4. The fan 13 drives the air circulation inside the test shell 1, so that the air between the fins of the heat conduction plate 2, the air between the heat conduction plate 2 and the mounting plate 3, and the air at the top of the mounting plate 3 are mixed, and the temperature distribution inside the test shell 1 is more uniform. The fan 13 is a silent fan and has little impact on the inside of the test shell 1.

[0029] Temperature sensors 11 are uniformly distributed and fixedly connected to the upper surface of the heat-conducting plate 2. The temperature sensors 11 are all bidirectionally electrically connected to the microcontroller 4. The temperature sensors 11 detect the temperature at each point of the heat-conducting plate 2 and feed it back to the microcontroller 4. The microcontroller 4 displays the temperature at each point through the LCD screen 15, which makes it easy to monitor the temperature change of the heat-conducting plate 2.

[0030] Mounting plate 3: It is fixedly connected to the upper end of the mounting bracket of the heat conduction plate 2. The upper surface of the mounting plate 3 is provided with a resistance voltage divider 8 and a current sensor 9.

[0031] An LCD screen 15 is provided on the left side of the test panel of the test housing 1. The input terminal of the LCD screen 15 is electrically connected to the output terminal of the microcontroller 4.

[0032] Heat dissipation mechanism 6 includes a housing 61, heat exchange fins 62, and heat exchange pipes 63. The housing 61 is placed on the left side of the test housing 1. The heat exchange fins 62 are fixedly connected inside the housing 61, and heat exchange pipes 63 are fixedly connected between the fins of the heat exchange fins 62. The water inlet 2 at the lower end of the heat exchange pipe 63 is connected to the water outlet 1 of the heat dissipation pipe 5. The heat dissipation mechanism 6 also includes a water tank 64 and a gear pump 65. The water tank 64 and the gear pump 65 are fixedly connected inside the housing 61. The water inlet 2 at the upper end of the heat exchange pipe 63 is connected to the water inlet 3 at the upper end of the water tank 64, and the water outlet 3 at the lower end of the water tank 64 is connected to the inlet of the gear pump 65. The outlet of the gear pump 65 is connected to... The inlet of the heat dissipation pipe 5 is connected to the output of the control switch group 7. The input end of the gear pump 65 is electrically connected to the output end of the control switch group 7. The gear pump 65 sends the 50% ethylene glycol water coolant inside the water tank 64 into the heat dissipation pipe 5. The heat dissipation pipe 5 exchanges heat with the fins of the heat conduction plate 2, which drives the heat of the heat conduction plate 2. The number of fins of the heat conduction plate 2 in the figure is only for illustration. The actual number of fins of the heat conduction plate 2 in actual use shall prevail. The coolant with heat is transported to the heat exchange pipe 63. The cooling end of the semiconductor refrigeration chip 14 cools the heat exchange fins 62, thereby cooling the coolant inside the heat exchange pipe 63. The cooled coolant returns to the water tank 64 to realize the refrigeration cycle.

[0033] The rear side of the heat exchange fins 62 is fixedly connected with uniformly distributed semiconductor cooling chips 14. The cooling ends of the semiconductor cooling chips 14 are all in contact with the rear side of the heat exchange fins 62. The input ends of the semiconductor cooling chips 14 are all electrically connected to the output ends of the control switch group 7. The heat dissipation mechanism 6 also includes heat dissipation fins 66 and a fan 67. The heat dissipation fins 66 are fixedly connected to the rear side of the housing 61. The heat generating ends of the semiconductor cooling chips 14 are in contact with the front side of the heat dissipation fins 66. The right side of the housing 61 is fixedly connected with a fan 67 that is symmetrically distributed vertically. The input ends of the fan 67 are all electrically connected to the output ends of the control switch group 7. The heat dissipation fins 66 are in contact with the heat generating ends of the semiconductor cooling chips 14. The heat generating ends and cooling ends of the semiconductor cooling chips 14 are isolated by a partition that fixes the heat exchange fins 62. The fan 67 brings in external cold air to dissipate heat from the heat dissipation fins 66. The fins of the heat dissipation fins 66 are arranged horizontally to facilitate contact between the cold air and the fins of the heat dissipation fins 66, thereby improving the heat exchange effect.

[0034] It also includes a microcontroller 4, which is mounted on the upper surface of the mounting plate 3. The resistor divider 8 and the current sensor 9 are both bidirectionally electrically connected to the microcontroller 4, and the input terminal of the boost converter 10 is electrically connected to the output terminal of the microcontroller 4.

[0035] It also includes a control switch group 7, which is fixedly connected to the front side of the housing 61, and the input end of the control switch group 7 is electrically connected to an external power source.

[0036] The working principle of the calibration device for testing the accuracy of a combined current transformer provided by this invention is as follows: When using this calibration device, prepare a combined current transformer to be tested and a matching current booster. The output terminal of the three-phase standard power supply is connected to the input terminal of the microcontroller 4. The input terminal of the current booster is connected to the output terminal of the microcontroller 4 through the current boosting control output port of the test housing 1. The current enters the booster 10 through the microcontroller 4. The boosted current enters the current booster for current boosting. The external current booster can also be replaced with a small current booster and installed on the upper surface of the heat-conducting plate 2. The current then enters the combined current transformer to be tested. The output terminal of the combined current transformer is electrically connected to the input terminal of the programmable load box. The programmable load box is used to simulate the actual secondary working conditions. The output terminal of the programmable load box is electrically connected to the detection port on the upper surface of the test housing 1. The resistive voltage divider 8 detects and measures the output voltage of the current transformer. The current sensor 9 detects and measures the input and output current to realize the accuracy test of the combined current transformer. The test housing 1 is a composite electromagnetic shielding housing. The outer layer is a lightweight aluminum alloy, and the inner layer is permalloy + copper-plated film to ensure the accuracy of the test.

[0037] During testing, the booster 10 generates a large amount of heat. The booster 10 exchanges heat with the heat-conducting plate 2. The heat-conducting plate 2 is made of aluminum alloy 6061, which takes into account heat dissipation, lightweight and magnetic field compatibility. The electrical appliances inside the housing 61 are turned on by the control switch group 7 to start the heat dissipation function.

[0038] Fan 2 13 drives the air circulation inside the test housing 1, which mixes the air between the fins of the heat conduction plate 2, the air between the heat conduction plate 2 and the mounting plate 3, and the air at the top of the mounting plate 3, making the temperature distribution inside the test housing 1 more uniform. Fan 2 13 is a silent fan and has little impact on the inside of the test housing 1.

[0039] Temperature sensor 11 detects the temperature at various points on heat conduction plate 2 and feeds it back to microcontroller 4. Microcontroller 4 displays the temperature at each point on LCD screen 15, making it easy to monitor the temperature changes of heat conduction plate 2.

[0040] Gear pump 65 delivers 50% ethylene glycol water coolant from water tank 64 into heat dissipation pipe 5. Heat dissipation pipe 5 exchanges heat with the fins of heat conduction plate 2, driving the heat of heat conduction plate 2. The number of fins of heat conduction plate 2 in the figure is only for illustration and the actual number of fins of heat conduction plate 2 in actual use shall prevail.

[0041] The coolant carrying heat is transported to the heat exchange pipe 63. The cooling end of the semiconductor refrigeration chip 14 cools the heat exchange fins 62, thereby cooling the coolant inside the heat exchange pipe 63. The cooled coolant then returns to the water tank 64, thus achieving a refrigeration cycle.

[0042] The heat dissipation fins 66 are in contact with the heat-generating end of the thermoelectric cooler 14. The heat-generating end and the cooling end of the thermoelectric cooler 14 are isolated by a partition that fixes the heat exchange fins 62. The fan 67 brings in external cold air to dissipate heat from the heat dissipation fins 66. The fins of the heat dissipation fins 66 are arranged horizontally to facilitate contact between the cold air and the fins of the heat dissipation fins 66, thereby improving the heat exchange effect.

[0043] It is worth noting that, in the above embodiments, the microcontroller 4 can be an STM32F103C6, the resistor divider 8 can be a RIG8B resistor divider, the current sensor 9 can be a ZH-HCS-100C closed-loop Hall current sensor, the boost converter 10 can be an MCHGD boost module, the second fan 13 can be an AXIAL miniature silent fan, the temperature sensor 11 can be a T06 series surface mount temperature sensor, and the first fan 67, the thermoelectric cooler 14, and the gear pump 65 can be freely configured according to the actual application scenario. The microcontroller 4 controls the operation of the resistor divider 8, the current sensor 9, the boost converter 10, the temperature sensor 11, and the second fan 13 using methods commonly used in the prior art. The control switch group 7 is equipped with switch buttons corresponding to the first fan 67, the thermoelectric cooler 14, and the gear pump 65 for controlling their switching operation.

[0044] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A calibration device for testing the accuracy of a combined current transformer, characterized in that: It includes a test housing (1), a mounting plate (3), and a heat dissipation mechanism (6); Test housing (1): A heat-conducting plate (2) is fixedly connected to its bottom wall. A heat dissipation pipe (5) is provided between the lower ends of the fins of the heat-conducting plate (2). A booster (10) is fixedly connected to the upper surface of the heat-conducting plate (2). Mounting plate (3): It is fixedly connected to the upper end of the mounting bracket of the heat-conducting plate (2). The upper surface of the mounting plate (3) is provided with a resistance voltage divider (8) and a current sensor (9). Heat dissipation mechanism (6): It includes a shell (61), heat exchange fins (62) and heat exchange pipes (63). The shell (61) is placed on the left side of the test shell (1). The heat exchange fins (62) are fixedly connected inside the shell (61). The heat exchange pipes (63) are fixedly connected between the fins of the heat exchange fins (62). The water inlet at the lower end of the heat exchange pipe (63) is connected to the water outlet of the heat dissipation pipe (5).

2. The calibration device for testing the accuracy of a combined current transformer according to claim 1, characterized in that: It also includes a microcontroller (4), which is disposed on the upper surface of the mounting plate (3). The resistor divider (8) and the current sensor (9) are both bidirectionally electrically connected to the microcontroller (4), and the input end of the boost converter (10) is electrically connected to the output end of the microcontroller (4).

3. The calibration device for testing the accuracy of a combined current transformer according to claim 2, characterized in that: The upper surface of the heat-conducting plate (2) is fixedly connected to a fixed frame (12) that is symmetrically distributed on the left and right. The inside of the fixed frame (12) is fixedly connected to a second fan (13). The input end of the second fan (13) is electrically connected to the output end of the microcontroller (4).

4. The calibration device for testing the accuracy of a combined current transformer according to claim 2, characterized in that: The upper surface of the heat-conducting plate (2) is fixedly connected with uniformly distributed temperature sensors (11), and the temperature sensors (11) are all bidirectionally electrically connected to the microcontroller (4).

5. The calibration device for testing the accuracy of a combined current transformer according to claim 2, characterized in that: The test panel of the test housing (1) is provided with an LCD screen (15) on the left side, and the input terminal of the LCD screen (15) is electrically connected to the output terminal of the microcontroller (4).

6. The calibration device for testing the accuracy of a combined current transformer according to claim 1, characterized in that: It also includes a control switch group (7), which is fixedly connected to the front side of the housing (61), and the input end of the control switch group (7) is electrically connected to an external power source.

7. The calibration device for testing the accuracy of a combined current transformer according to claim 6, characterized in that: The heat dissipation mechanism (6) also includes a water tank (64) and a gear pump (65). The water tank (64) and the gear pump (65) are fixedly connected inside the housing (61). The water inlet 2 at the upper end of the heat exchange pipe (63) is connected to the water inlet 3 at the upper end of the water tank (64). The water outlet 3 at the lower end of the water tank (64) is connected to the inlet of the gear pump (65). The outlet of the gear pump (65) is connected to the water inlet 1 of the heat dissipation pipe (5). The input end of the gear pump (65) is electrically connected to the output end of the control switch group (7).

8. The calibration device for testing the accuracy of a combined current transformer according to claim 6, characterized in that: The rear side of the heat exchange fins (62) is fixedly connected with uniformly distributed semiconductor cooling chips (14). The cooling ends of the semiconductor cooling chips (14) are all in contact with the rear side of the heat exchange fins (62), and the input ends of the semiconductor cooling chips (14) are all electrically connected to the output ends of the control switch group (7).

9. A calibration device for testing the accuracy of a combined current transformer according to claim 8, characterized in that: The heat dissipation mechanism (6) also includes heat dissipation fins (66) and a fan (67). The heat dissipation fins (66) are fixedly connected to the rear side of the housing (61). The heat-generating end of the semiconductor cooling chip (14) is attached to the front side of the heat dissipation fins (66). The right side of the housing (61) is fixedly connected to a fan (67) that is symmetrically distributed vertically. The input end of the fan (67) is electrically connected to the output end of the control switch group (7).

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