Thermal control method of low-temperature drift module, heat dissipation mechanism and laser

Abstract

The application provides a heat dissipation control method of a low-temperature drift module, a heat dissipation mechanism and a laser, and relates to the technical field of the laser. The method is used for heat dissipation of the low-temperature drift module through the heat dissipation mechanism. The method comprises the following steps: S1, collecting a real-time wavelength λ1 of the low-temperature drift module; S2, obtaining a wavelength drift Δλ through the real-time wavelength λ1 and a preset wavelength λ2; S31, comparing the wavelength drift Δλ with a wavelength extreme value, and when the wavelength drift Δλ is less than or equal to the wavelength extreme value, calculating a wavelength growth rate Z in a first time interval range Δt after the real-time wavelength λ1 is collected; and according to the wavelength growth rate Z, the power of the heat dissipation mechanism is controlled, so that the wavelength drift Δλ tends to 0.

Description

Technical Field

[0001] This invention relates to the field of laser technology, and in particular to a heat dissipation control method, heat dissipation mechanism and laser for a low-temperature drift module. Background Technology

[0002] The wavelength of the laser chip in the pump source of the low-temperature drift module (hereinafter referred to as the low-temperature drift chip) is not sensitive to temperature. Compared with ordinary chips, the wavelength of the low-temperature drift chip is less affected by temperature under the same chip operating temperature.

[0003] In existing technologies, temperature detection is used for ordinary chips. This involves measuring the chip temperature and comparing it to a preset value to adjust the heat dissipation capacity of the cooling fan and control the chip's wavelength. However, for low-temperature drift modules, which have low temperature sensitivity, changes in ambient temperature and the heat generated during chip operation mean that the chip's wavelength changes over time. Furthermore, obtaining the chip temperature (junction temperature) is difficult and cannot be done directly. Existing technologies often calculate the chip temperature by converting the casing temperature. Therefore, the timeliness of obtaining wavelength through temperature-controlled heat dissipation methods is poor, and wavelength control is delayed and inaccurate. This results in poor wavelength stability of the pump source in low-temperature drift modules, affecting the reliability of the module's performance. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation control method, heat dissipation mechanism and laser for a low-temperature drift module, so as to alleviate the technical problems of poor timeliness and lag in existing chip wavelength control.

[0005] In a first aspect, the present invention provides a heat dissipation control method for a low-temperature drift module, which dissipates heat from the low-temperature drift module through a heat dissipation mechanism; Including the following steps: Step S1. Acquire the real-time wavelength λ1 of the low-temperature drift module; Step S2. Obtain the wavelength drift Δλ using the real-time wavelength λ1 and the preset wavelength λ2; Step S31. Relate Δλ to λ 极值 For comparison, when Δλ is less than or equal to λ 极值 At that time, calculate the wavelength growth rate Z within the first time interval range Δt after the real-time wavelength λ1 is acquired; control the power of the heat dissipation mechanism according to the wavelength growth rate Z so that the wavelength drift Δλ tends to 0.

[0006] Furthermore, step S31 specifically includes the following steps: Within the time range of Δt, real-time wavelengths are acquired, and the continuously acquired real-time wavelengths λ1 are successively A1, A2, A3...A nThe time interval between two adjacent wavelength acquisition actions is T. Wavelength growth rate Z = [(A2-A1) / T + (A3-A2) / T + ... + (A...A1) / T] n -A n-1 ) / T]÷(n-1)÷Δt.

[0007] Furthermore, the heat dissipation control method also includes the following steps: Step S32. When Δλ is greater than λ 极值 At that time, the low-temperature drift module did not meet the production requirements.

[0008] Furthermore, the wavelength growth rate Z corresponds to different power settings for the heat dissipation mechanism in different ranges.

[0009] Furthermore, when λ 设定1 <Z<λ 极值 The power of the cooling mechanism is controlled to be a% of its maximum power. When λ 设定2 ≤Z≤λ 设定1 The power of the cooling mechanism is controlled to be b% of its maximum power. When Z < λ 设定2 The power of the cooling mechanism is controlled to be c% of its maximum power. Where, λ 设定1 , λ 设定2 a, b, and c are all set values, and a > b > c.

[0010] Furthermore, the heat dissipation mechanism includes a heat-conducting component, and a low-temperature drift module is disposed on the heat-conducting component; when the range of wavelength growth rate Z remains unchanged, the heat dissipation control method further includes the following steps: Step S4. Based on the wavelength shift Δλ, compare it with λ... 低 and λ 高 The magnitude of the λ value determines the power of the heat dissipation mechanism, where λ is the value of the heat dissipation mechanism. 低 λ is positively correlated with the thermal conductivity of the thermally conductive component. 高 It is negatively correlated with the thermal conductivity of the thermally conductive component.

[0011] Furthermore, step S4 specifically includes the following steps: If λ 低 ≤Δλ≤λ 高 The power of the heat dissipation mechanism remains unchanged; If Δλ < λ 低 The power of the heat dissipation mechanism is reduced; If Δλ>λ 高 The power of the heat dissipation mechanism is increased.

[0012] Furthermore, for Δλ<λ 低 Or, Δλ>λ高 The situation; The distribution interval of Δλ is preset, and at certain intervals in the distribution of Δλ, the corresponding interval is matched with the corresponding power.

[0013] Furthermore, in step S1, the wavelength is monitored using a laser wavelength meter; And / or, the heat dissipation mechanism includes a fan, and the power of the heat dissipation mechanism is changed by changing the speed of the fan; And / or, when the low-temperature drift module starts working, the heat dissipation mechanism operates at 50% of its maximum power. And / or, provide a beam splitter and a wavelength acquisition module. The beam splitter is connected to the low-temperature drift module. The beam splitter outputs 1%-2% of the light from the low-temperature drift module to the wavelength acquisition module. The wavelength acquisition module acquires the real-time wavelength λ1 of the low-temperature drift module.

[0014] Secondly, the present invention provides a heat dissipation mechanism for performing the above-described heat dissipation control method.

[0015] Furthermore, the heat dissipation mechanism includes a heat-conducting component and a fan, and the power of the heat dissipation mechanism is changed by adjusting the fan speed; the heat-conducting component includes a heat-conducting base and fins; The top surface of the heat-conducting base is used to fix the low-temperature drift module; the bottom surface of the heat-conducting base is provided with multiple fins spaced apart, and the air outlet of the fan faces the gap formed between the fins; the spacing between two adjacent fins ranges from 1mm to 2mm; the height of the fins ranges from 38mm to 42mm; and the thickness of the fins ranges from 0.8mm to 2.5mm. And / or, the heat-conducting component includes heat pipes, and multiple heat pipes are also provided on the top surface of the heat-conducting base. The heat dissipation of the heat pipes ranges from 55 W to 65 W, and the spacing between the heat pipes is 12 mm to 15 mm. And / or, multiple fins facing the fan opening form a flared shape.

[0016] Thirdly, the present invention provides a laser, including a low-temperature drift module and the aforementioned heat dissipation mechanism.

[0017] This invention has at least the following advantages or beneficial effects: The heat dissipation control method for a low-temperature drift module provided by the present invention dissipates heat from the low-temperature drift module through a heat dissipation mechanism; including the following steps: Step S1. Acquire the real-time wavelength λ1 of the low-temperature drift module; Step S2. Obtain the wavelength drift amount Δλ using the real-time wavelength λ1 and the preset wavelength λ2; Step S31. Compare Δλ with λ1... 极值 For comparison, when Δλ is less than or equal to λ 极值At that time, calculate the wavelength growth rate Z within the first time interval range Δt after the real-time wavelength λ1 is acquired; control the power of the heat dissipation mechanism according to the wavelength growth rate Z so that the wavelength drift Δλ tends to 0.

[0018] The wavelength is continuously monitored over a period of time to obtain the wavelength growth rate Z, thereby understanding the wavelength growth trend. The power of the heat dissipation mechanism is then controlled based on the wavelength growth rate Z to make the wavelength drift Δλ approach zero. In other words, a large wavelength growth rate Z indicates that the wavelength will grow significantly after Δt time, requiring greater heat dissipation power to bring Δλ to zero; in this case, a larger heat dissipation mechanism power is matched. Conversely, a small Z indicates that the wavelength will grow at a smaller rate after Δt time, requiring only less heat dissipation power to bring Δλ to zero; in this case, a correspondingly smaller heat dissipation mechanism power is matched. By predicting the subsequent wavelength growth trend, cooling measures can be taken in advance to avoid a large increase in wavelength and maintain the wavelength stably within a certain range. Therefore, this method has the advantages of timely wavelength detection of the pump source of the low-temperature drift module, thus achieving precise wavelength control. The pump source of the low-temperature drift module has the advantages of strong wavelength stability and high reliability. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 A flowchart illustrating the heat dissipation control method for a low-temperature drift module provided in an embodiment of the present invention; Figure 2 A schematic diagram of a laser provided for an embodiment of the present invention (with part of the laser housing removed).

[0021] Icons: 1-Fan; 2-Heat-conducting base; 3-Fins; 4-Heat pipe; 5-Low temperature drift module. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but can be slightly tilted.

[0027] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] like Figure 1 and Figure 2 As shown, in the heat dissipation control method for the low-temperature drift module provided by the present invention, the low-temperature drift module 5 is cooled by a heat dissipation mechanism. This heat dissipation mechanism can be either air-cooled or water-cooled. In this embodiment, the heat dissipation mechanism uses a fan 1 for air cooling, and the power of the heat dissipation mechanism is changed by adjusting the speed of the fan 1. In other feasible solutions, circulating coolant can also be used for cooling, in which case the power of the heat dissipation mechanism is changed by adjusting the flow rate of the coolant.

[0029] The heat dissipation mechanism includes a heat-conducting component and a fan 1. A low-temperature drift module 5 is mounted on the heat-conducting component, and the heat generated by the low-temperature drift module 5 is transferred to the heat-conducting component. The heat-conducting component includes a heat-conducting base 2 and fins 3. The top surface of the heat-conducting base 2 is used to fix the low-temperature drift module 5. It is recommended that the chips in the low-temperature drift module 5 be spaced 8-12mm apart in the X-axis (length direction of the heat-conducting base 2) and 12-15mm apart in the Y-axis (width direction of the heat-conducting base 2).

[0030] Specifically, the bottom surface of the heat-conducting base 2 is provided with multiple fins 3 spaced apart. The fan 1 is connected to the housing of the laser, and the air outlet of the fan 1 faces the gap formed between the fins 3. The fins 3 are used to increase the heat dissipation area, the low-temperature drift module 5 transfers heat to the fins 3, and the fan 1 then reduces the temperature of the fins 3.

[0031] Under the same conditions, the spacing between two adjacent fins 3 affects the wavelength drift of the cryogenic drift module 5 (defined as the real-time wavelength λ1 for monitoring and reading, the preset wavelength λ2, and the wavelength drift Δλ = λ2 - λ1). The simulation results are shown in Table 1. Table 1

[0032] It can be observed that the denser the spacing of fins 3, the smaller the wavelength shift. However, considering the cost and processing difficulty, the spacing between two adjacent fins 3 is designed to be in the range of 1mm-2mm.

[0033] Similarly, the height of fin 3 also affects heat dissipation, and the simulation results are shown in Table 2: Table 2

[0034] It can be observed that as the height of fin 3 increases, the wavelength shift becomes smaller and smaller. After exceeding 40mm, the influence on the wavelength shift becomes smaller and smaller. Considering the cost and processing difficulty, the height of fin 3 is in the range of 38mm-42mm, preferably 40mm.

[0035] With the same blank length, if the thickness of fin 3 is increased without changing the tooth spacing of fin 3, then the limited length will lead to a reduction in the number of fins 3, which will reduce the heat exchange area and gradually worsen the heat dissipation performance. Therefore, it is usually advisable to design a thinner fin thickness without affecting the structural strength in order to increase the heat exchange area. The range of fin thickness is 0.8 mm - 2.5 mm.

[0036] The heat-conducting component also includes heat pipes 4. Multiple heat pipes 4 are also provided on the top surface of the heat-conducting base 2. The low-temperature drift module 5 covers part of the heat pipes 4. The heat generated by the low-temperature drift module 5 is transferred downward to the heat-conducting base 2 through the heat pipes 4, and then transferred downward to the fins 3. The diameter of the heat pipes 4 is 12mm, but a denser arrangement of 10mm can also be used. In this embodiment, an intermittent arrangement is adopted. The heat dissipation of the heat pipes 4 ranges from 55W to 65W, and the arrangement interval between the heat pipes 4 is 12mm-15mm.

[0037] The method includes the following steps: Step S1. Acquire the real-time wavelength λ1 of the low-temperature drift module 5.

[0038] In this embodiment, a laser wavelength meter is used to monitor the real-time wavelength λ1 of the low-temperature drift module 5, and to accurately capture the wavelength (LC chip) in the working state.

[0039] Step S2. Obtain the wavelength drift Δλ using the real-time wavelength λ1 and the preset wavelength λ2. The wavelength drift is Δλ = λ2 - λ1.

[0040] Step S31. Relate Δλ to λ 极值 For comparison, when Δλ is less than or equal to λ 极值 At that time, calculate the wavelength growth rate Z within the first time interval range Δt after the real-time wavelength λ1 is acquired; control the power of the heat dissipation mechanism according to the wavelength growth rate Z so that the wavelength drift Δλ tends to 0.

[0041] When Δλ is greater than λ 极值 If the drift is too large, the low-temperature drift module 5 will not meet production requirements and needs to be replaced or repaired. In this embodiment, λ is set as follows: 极值 =8nm.

[0042] When Δλ is less than or equal to λ 极值 When the wavelength is continuously monitored over a period of time, the wavelength growth rate Z is obtained, thus revealing the wavelength growth trend. The power of the heat dissipation mechanism is then controlled based on the wavelength growth rate Z to minimize the wavelength drift Δλ. In other words, a larger wavelength growth rate Z indicates a significant increase in wavelength after time Δt, requiring greater heat dissipation power to bring Δλ to zero; conversely, a smaller Z indicates a smaller increase in wavelength after time Δt, requiring less heat dissipation power to bring Δλ to zero. By predicting subsequent wavelength growth trends, cooling measures can be implemented in advance to prevent significant wavelength increases.

[0043] Specifically, step S31 includes the following steps: Within the time range of Δt, real-time wavelengths are acquired, and the continuously acquired real-time wavelengths λ1 are successively A1, A2, A3...A n The time interval between two adjacent wavelength acquisition actions is T. Wavelength growth rate Z = [(A2-A1) / T + (A3-A2) / T + ... + (A...A1) / T] n -A n-1 ) / T]÷(n-1)÷Δt.

[0044] The average wavelength growth rate over time Δt can be calculated using the above formula, and this value is set as the wavelength growth rate Z. The time interval T can be 0.1s. In this embodiment, n equals 10, so Δt = 1s, i.e., Z = [(A2-A1) / 0.1 + (A3-A2) / 0.1 + ... + (A...A1) / 0.1] / 0.1. 10 -A9) / 0.1]÷9÷1.

[0045] The wavelength growth rate Z corresponds to different power settings for the heat dissipation mechanism in different ranges.

[0046] The wavelength growth rate Z can be set to a range of three, and the corresponding heat dissipation mechanism can be divided into three levels, that is, when λ 设定1 <Z<λ 极值 The power of the heat dissipation mechanism is controlled to be a% of its maximum power; when λ 设定2 ≤Z≤λ 设定1 The power of the heat dissipation mechanism is controlled to be b% of its maximum power; when Z < λ 设定2 The power of the cooling mechanism is controlled to be c% of its maximum power; where λ 设定1 , λ 设定2 a, b, and c are all set values, with a > b > c. Of course, in other feasible solutions, the cooling mechanism can be divided into four, five, or other levels. The larger the Z-value, the greater the power of the cooling mechanism and the shorter the wavelength change time, thus enabling timely adjustment.

[0047] In this embodiment, the wavelength growth rate Z is set to a range of four, corresponding to four speed settings for the heat dissipation mechanism. For example, when Z > 0.7, the fan 1 is controlled to operate at 100% full speed, at which point the heat dissipation mechanism has the highest power. If 0.7 ≥ Z ≥ 0.5, the fan 1 is controlled to operate at 70% speed. If 0.5 ≥ Z ≥ 0.3, the fan 1 is controlled to operate at 50% speed. If Z < 0.3, the fan 1 is controlled to operate at 20% speed. Specifically, Z is calculated by the software program and fed back to the main control board, which then converts it into the duty cycle parameter of the PWM signal (the higher the duty cycle, the faster the fan 1 speed and the higher the power of the heat dissipation mechanism). Then, a command is sent to the fan 1 to adjust its speed.

[0048] The above method achieves coarse adjustment of the power of the heat dissipation mechanism. When the range of wavelength growth rate Z remains unchanged, i.e., the change in the value of Z does not exceed its range, the heat dissipation control method also includes the following steps: Step S4. Based on the wavelength shift Δλ, compare it with λ... 低 and λ 高 The magnitude of the λ value determines the power of the heat dissipation mechanism, where λ is the value of the heat dissipation mechanism. 低 λ is positively correlated with the thermal conductivity of the thermally conductive component. 高 It is negatively correlated with the thermal conductivity of the thermally conductive component.

[0049] λ 低 and λ 高 All of these factors are related to the thermal conductivity of the heat-conducting component and can be calculated experimentally. Factors affecting the thermal conductivity of the heat-conducting component include its material, fin spacing, fin height, fin thickness, and heat pipe arrangement. In this embodiment, other factors are not considered; only the fin spacing, fin height, and fin thickness are analyzed. Different fin spacing, fin height, and fin thickness result in different heat dissipation effects. As the temperature rises, the wavelength shift gradually increases, λ... 低 With λ 高 The values ​​of λ are set near the maximum and minimum values ​​when the fin spacing, fin height, and fin thickness are optimal, respectively. This means that as the heat dissipation performance improves, λ... 低 It will gradually increase, λ 高 It will gradually decrease.

[0050] λ 低 With λ 高 The specific calculation process is as follows: By using the fin spacing, fin height, and fin thickness as variables, the combination that maximizes the thermal conductivity of the heat-conducting component is obtained through fitting. Then, based on the thermally conductive component formed by this combination and combined with a low-temperature drift module, a curve of wavelength drift change over a period of time was obtained. The minimum and maximum values ​​in the curve were selected as λ. 低 With λ 高 .

[0051] Among other feasible solutions, heat pipe 4 also affects the overall thermal conductivity. The higher the thermal conductivity of heat pipe 4, the better the heat dissipation performance and the smaller the change in wavelength drift, λ. 低 It will increase relatively, λ 高 The value will be relatively reduced. Alternatively, heat pipe 4 can be introduced as a variable into the simulation process to obtain λ. 低 and λ 高 .

[0052] Step S4 specifically includes the following steps: If λ 低 ≤Δλ≤λ 高 The power of the cooling system remains constant, and the speed of fan 1 remains constant, maintaining the current cooling state. If Δλ < λ 低 The power consumption of the heat dissipation mechanism is reduced, saving energy. If Δλ>λ 高 The increased power of the heat dissipation mechanism improves heat dissipation efficiency, thereby enabling fine-tuning of the power of the heat dissipation mechanism and achieving precise adjustment.

[0053] Furthermore, for Δλ<λ 低 Or, Δλ>λ 高 The situation is as follows: a preset distribution of Δλ is defined, and at certain intervals in the distribution of Δλ, the corresponding interval is matched with the corresponding power.

[0054] In the distribution of Δλ, as the preset Δλ value increases, the difference between two adjacent powers can remain unchanged; or it can gradually increase. That is, when Δλ is larger, a higher power needs to be matched to accelerate the wavelength change.

[0055] In this embodiment, the parameter spacing is set according to the distribution of Δλ. At certain intervals of difference, different fan speeds are set to match different speeds. When Δλ is large (Δλ>λ), 最高 Fan 1 operates at full speed when Δλ is extremely small (Δλ < λ). 最低 When fan 1 operates in low-power, low-speed mode, it is in standby mode when Δλ equals 0. 最高 For greater than λ 高 The set value, λ 最低 For less than λ 低 The set value is determined by the software program. Specifically, Δλ is calculated and fed back to the main control board, which then converts it into the duty cycle parameter of the PWM signal (the higher the duty cycle, the faster the fan 1 speed). A command is then sent to fan 1 to adjust its speed. See Table 3 for details. Table 3

[0056] Where, λ 最低 , λ 低 , λ 高 , λ 最高 The values ​​range for these values ​​are 2nm - 2.4nm, 4.4nm - 4.8nm, 6.8nm - 7.2nm, and 9.2-9.4nm, respectively. In the initial state, the heat dissipation mechanism operates at 50% of its maximum power (the fan speed can be controlled by setting the duty cycle). The low-temperature drift module 5 operates, and over time, heat gradually accumulates, causing the module temperature to rise and the wavelength drift to increase.

[0057] The λ value needs to be guaranteed during the software programming of the main controller. 低 and λ 高 The setting covers the entire range of wavelength readings for the entire module.

[0058] The heat dissipation mechanism also includes a temperature sensor to detect the temperature of the module, and the temperature monitored by the temperature sensor serves as a power-off protection mechanism.

[0059] The heat dissipation mechanism includes a beam splitter and a wavelength acquisition module. The beam splitter is connected to the output optical fiber of the low temperature drift module 5. The beam splitter may include an amplifier and a lens. The beam splitter outputs 5%-2% of the light from the low temperature drift module to the wavelength acquisition module. The wavelength acquisition module acquires the real-time wavelength λ1 of the low temperature drift module 5 and monitors the wavelength of the output light without affecting the output power.

[0060] The laser provided by the present invention includes a low-temperature drift module 5 and the heat dissipation mechanism described above.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation control method for a low-temperature drift module, characterized in that, The low-temperature drift module (5) is cooled by a heat dissipation mechanism; include step: Step S1. Acquire the real-time wavelength λ1 of the low-temperature drift module (5); Step S2. Obtain the wavelength drift Δλ using the real-time wavelength λ1 and the preset wavelength λ2; Step S31. Relate Δλ to λ 极值 For comparison, when Δλ is less than or equal to λ 极值 At that time, calculate the wavelength growth rate Z within the first time interval range Δt after the real-time wavelength λ1 is acquired; control the power of the heat dissipation mechanism according to the wavelength growth rate Z so that the wavelength drift Δλ tends to 0.

2. The heat dissipation control method for the low-temperature drift module according to claim 1, characterized in that, Step S31 specifically includes the following steps: Within the time range of Δt, real-time wavelengths are acquired, and the continuously acquired real-time wavelengths λ1 are successively A1, A2, A3...A n The time interval between two adjacent wavelength acquisition actions is T. Wavelength growth rate Z = [(A2-A1) / T + (A3-A2) / T + ... + (A...A1) / T] n -A n-1 ) / T]÷(n-1)÷Δt.

3. The heat dissipation control method for the low-temperature drift module according to claim 1, characterized in that, The heat dissipation control method further includes the following steps: Step S32. When Δλ is greater than λ 极值 At that time, the low temperature drift module (5) did not meet the production requirements.

4. The heat dissipation control method for the low-temperature drift module according to claim 3, characterized in that, The value of the wavelength growth rate Z corresponds to different power settings for the heat dissipation mechanism in different ranges.

5. The heat dissipation control method for the low-temperature drift module according to claim 4, characterized in that, When λ 设定1 <Z<λ 极值 The power of the heat dissipation mechanism is controlled to be a% of its maximum power. When λ 设定2 ≤Z≤λ 设定1 The power of the heat dissipation mechanism is controlled to be b% of its maximum power. When Z < λ 设定2 The power of the heat dissipation mechanism is controlled to be c% of its maximum power. Where, λ 设定1 , λ 设定2 a, b, and c are all set values, and a > b > c.

6. The heat dissipation control method for the low-temperature drift module according to claim 4, characterized in that, The heat dissipation mechanism includes a heat-conducting component, and the low-temperature drift module (5) is disposed on the heat-conducting component; when the range of wavelength growth rate Z does not change, the heat dissipation control method further includes the following steps: Step S4. Based on the wavelength shift Δλ, compare it with λ... 低 and λ 高 The magnitude of the λ value determines the power of the heat dissipation mechanism, where λ is the value of the heat dissipation mechanism. 低 The λ is positively correlated with the thermal conductivity of the thermally conductive component. 高 It is negatively correlated with the thermal conductivity of the thermally conductive component.

7. The heat dissipation control method for the low-temperature drift module according to claim 6, characterized in that, Step S4 specifically includes the following steps: If λ 低 ≤Δλ≤λ 高 The power of the heat dissipation mechanism remains unchanged; If Δλ < λ 低 The power of the heat dissipation mechanism is reduced; If Δλ>λ 高 The power of the heat dissipation mechanism is increased.

8. The heat dissipation control method for the low-temperature drift module according to claim 7, characterized in that, For Δλ<λ 低 Or, Δλ>λ 高 The situation; The distribution interval of Δλ is preset, and at certain intervals in the distribution of Δλ, the corresponding interval is matched with the corresponding power.

9. The heat dissipation control method for the low-temperature drift module according to claim 1, characterized in that, In step S1, the wavelength is monitored using a laser wavelength meter; And / or, the heat dissipation mechanism includes a fan (1), and the power of the heat dissipation mechanism is changed by changing the speed of the fan (1); And / or, when the low temperature drift module (5) starts working, the heat dissipation mechanism operates at 50% of its maximum power; And / or, a beam splitter and a wavelength acquisition module are provided, wherein the beam splitter is connected to the low temperature drift module (5), and the beam splitter outputs 1%-2% of the light from the low temperature drift module (5) to the wavelength acquisition module, wherein the wavelength acquisition module acquires the real-time wavelength λ1 of the low temperature drift module (5).

10. A heat dissipation mechanism, characterized in that, The heat dissipation mechanism is used to perform the heat dissipation control method according to any one of claims 1-9.

11. The heat dissipation mechanism according to claim 10, characterized in that, The heat dissipation mechanism includes a heat-conducting component and a fan (1). The power of the heat dissipation mechanism can be changed by adjusting the speed of the fan (1). The heat-conducting component includes a heat-conducting base (2) and fins (3). The top surface of the heat-conducting base (2) is used to fix the low-temperature drift module (5); the bottom surface of the heat-conducting base (2) is provided with a plurality of fins (3) spaced apart, and the air outlet of the fan (1) faces the gap formed between each fin (3); the distance between two adjacent fins (3) is in the range of 1mm-2mm; the height of the fins (3) is in the range of 38mm-42mm; the thickness of the fins (3) is in the range of 0.8mm-2.5mm. And / or, the heat-conducting component includes heat pipes (4), and multiple heat pipes (4) are also provided on the top surface of the heat-conducting base (2). The heat dissipation of the heat pipes (4) ranges from 55 W to 65 W, and the spacing between the heat pipes (4) is 12 mm to 15 mm. And / or, the openings of the plurality of said fins (3) toward the fan (1) are flared.

12. A laser, characterized in that, It includes a low-temperature drift module (5) and a heat dissipation mechanism as described in claim 10 or 11.

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