Irregular decap method for circuit board structures

Abstract

An irregular uncovering method of a circuit board structure includes a surface treatment step, a peelable film setting step, a profile modification step, a pressing step, a blind groove forming step, an uncovering step, and a removing step. The surface treatment step forms a plurality of surface treatment structures on a surface of a first stacked structure. The peelable film setting step sets a plurality of peelable films on the surface treatment structures. The profile modification step modifies a profile of the peelable films. The pressing step presses the first stacked structure and a second stacked structure. The blind groove forming step forms a plurality of blind grooves by blind milling the second stacked structure. The uncovering step removes a part of the second stacked structure to form a plurality of holes. The removing step removes the peelable films to form a circuit board structure. An opening profile of each of the holes corresponds to the profile of one of the peelable films.

Description

Technical Field

[0001] This invention relates to a method for opening a circuit board structure, and more particularly to a method for opening an irregular circuit board structure. Background Technology

[0002] Existing methods for opening circuit board structures have the problem of difficulty in opening irregularly shaped holes. Summary of the Invention

[0003] This invention discloses a method for opening irregularly shaped holes in a circuit board structure, which is mainly used to improve the problem that existing methods for opening circuit board structures have difficulty in opening irregularly shaped holes.

[0004] One embodiment of the present invention discloses an irregular opening method for a circuit board structure, comprising: a pre-processing step of providing a first stacked structure and a second stacked structure; a surface treatment step of surface treating the first stacked structure to form a plurality of surface-treated structures on the surface of the first stacked structure; a peelable film setting step of setting a plurality of peelable films on the plurality of surface-treated structures; a shape modification step of modifying the shape of the peelable films by exposure and development; a lamination step of lamination of the first stacked structure and the second stacked structure; a blind groove forming step of blind milling the surface of the second stacked structure away from the first stacked structure to form a plurality of blind grooves; an opening step of removing portions of the second stacked structure corresponding to the surface-treated structures along the plurality of blind grooves to form a plurality of cavities; wherein the opening shape of each cavity corresponds to the shape of one of the peelable films; and a removal step of removing the peelable films to form a circuit board structure.

[0005] Optionally, after the removal step, each surface-treated structure is exposed from one of the corresponding cavities.

[0006] Optionally, prior to the lamination step, the irregular opening method of the circuit board structure further includes a pre-processing step, in which multiple lines are formed on the surface of the second stacked structure, and multiple pre-cut grooves are formed between the multiple lines.

[0007] Optionally, in the blind slot forming step, the surface of the second stacked structure away from the first stacked structure is blind milled to form a plurality of blind slots connected to a plurality of pre-cut slots.

[0008] Optionally, the depth of each pre-cut groove is between 0.25 and 0.75 times the thickness of the second stacked structure.

[0009] Optionally, in the surface treatment step, a solder resist ink application operation, a blind milling operation, or a gold plating operation are performed on the first stacked structure, and the surface treated structure is a solder resist ink layer, a groove, or a gold-plated surface.

[0010] Optionally, the multiple surface treatment structures include a solder resist ink layer, grooves, and a gold-plated surface.

[0011] Optionally, after the shape finishing step, the shape of the peelable film located in the solder resist ink layer is different from the shape of the peelable film located in the groove or different from the shape of the peelable film located on the gold-plated surface.

[0012] Optionally, the first stacked structure includes multiple copper foil layers stacked on top of each other and multiple insulating layers, the groove being one of the copper foil layers formed on the surface of the first stacked structure, and one of the insulating layers being partially exposed from the groove.

[0013] Optionally, the first stacked structure includes multiple copper foil layers and multiple insulating layers stacked on top of each other; wherein, in the peelable film setting step, a peelable film is further laid on one of the copper foil layers on the surface of the first stacked structure, and in the shape modification step, the shape of the peelable film covering a portion of the copper foil layer is further modified.

[0014] In summary, the irregular opening method for circuit board structures provided by the present invention can effectively improve the problem that existing circuit board structure opening methods have difficulty in opening irregularly shaped holes by means of the technical solutions of "shape modification step, by exposure and development to modify the shape of the peelable film" and "the opening shape of each of the holes corresponds to the shape of one of the peelable films".

[0015] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0016] Figure 1 This is a flowchart of the irregular opening method for the circuit board structure of the present invention.

[0017] Figure 2 This is a schematic diagram of the preliminary steps of the irregular opening method for the circuit board structure of the present invention.

[0018] Figure 3 This is a schematic diagram of the surface treatment steps of the irregular opening method for the circuit board structure of the present invention.

[0019] Figure 4 This is a schematic diagram of the peelable film setting steps in the irregular opening method of the circuit board structure of the present invention.

[0020] Figure 5 This is a schematic diagram (a) of the preprocessing steps of the irregular opening method for the circuit board structure of the present invention.

[0021] Figure 6 This is a schematic diagram (II) of the preprocessing steps of the irregular opening method for the circuit board structure of the present invention.

[0022] Figure 7 This is a schematic diagram of the pressing steps in the irregular opening method of the circuit board structure of the present invention.

[0023] Figure 8 This is a schematic diagram of the blind slot formation step in the irregular opening method of the circuit board structure of the present invention.

[0024] Figure 9 This is a schematic diagram of the opening steps of the irregular opening method for the circuit board structure of the present invention.

[0025] Figure 10 This is a schematic diagram of the removal steps in the irregular opening method for the circuit board structure of the present invention.

[0026] Figure 11 This is a schematic diagram of the circuit board structure of the present invention. Detailed Implementation

[0027] The following specific embodiments illustrate the implementation of the "irregular opening method for circuit board structures" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0028] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0029] Please see Figure 1 As shown, Figure 1This is a flowchart of an irregular opening method for a circuit board structure according to the present invention. An embodiment of the present invention provides an irregular opening method for a circuit board structure. The irregular opening method includes a pre-processing step S110, a surface treatment step S120, a peelable film setting step S130, a shape modification step S140, a lamination step S160, a blind slot formation step S170, an opening step S180, and a removal step S190. Of course, the irregular opening method for a circuit board structure may include other steps according to actual needs, and the present invention does not limit this.

[0030] Please see Figure 2 As shown, Figure 2 This is a schematic diagram of the preliminary steps of the irregular opening method for the circuit board structure of the present invention. In the preliminary step S110, a first stacking structure 1 and a second stacking structure 2 are provided. The first stacking structure 1 and the second stacking structure 2 may include multiple copper foil layers 11, 21 and insulating layers 12, 22 stacked on top of each other. The insulating layers 12, 22 may be, for example, paper impregnated with phenolic resin or glass fiber cloth impregnated with epoxy resin, and the number of insulating layers 12, 22 may be one or more, but the present invention is not limited thereto.

[0031] Please see Figure 3 As shown, Figure 3 This is a schematic diagram of the surface treatment steps of the irregular opening method for the circuit board structure of the present invention. In the surface treatment step S120, the first stacked structure 1 is surface treated to form a plurality of surface treatment structures 13 on the surface of the first stacked structure 1. Specifically, in the surface treatment step S120, a solder resist ink application operation, a blind milling operation, or a gold plating operation may be performed on the first stacked structure 1 to form a solder resist ink layer 131, a groove 132, or a gold-plated surface 133 on the first stacked structure 1, and the surface treatment structure 13 is the solder resist ink layer 131, the groove 132, or the gold-plated surface 133.

[0032] In this embodiment, the surface treatment structure includes one solder resist ink layer 131, one groove 132, and one gold-plated surface 133. However, in other embodiments of the present invention not shown, the surface treatment structure 13 may include multiple solder resist ink layers 131, multiple grooves 132, and multiple gold-plated surfaces 133. Furthermore, the groove 132 may be one of the copper foil layers 11 formed on the surface of the first stacked structure 1, and one of the insulating layers 12 is partially exposed from the groove 132.

[0033] Please see Figure 4 As shown, Figure 4This is a schematic diagram illustrating the peelable film setting steps of the irregular opening method for the circuit board structure of the present invention. In the peelable film setting step S130, multiple peelable films 3 are set on multiple surface treatment structures 13. In this embodiment, each of the surface treatment structures 13 is provided with the peelable film 3. Specifically, the peelable film 3 can be set on the solder resist ink layer 131, the groove 132, and the gold-plated surface 133. The peelable film 3 can be, for example, peelable ink, but the present invention does not limit the material of the peelable film.

[0034] In the shape modification step S140, the shape of the peelable film 3 is modified by exposure and development. It is worth noting that after the shape modification step S140, the shape of the peelable film 3 located on the solder resist ink layer 131 can be different from the shape of the peelable film 3 located on the groove 132 or different from the shape of the peelable film 3 located on the gold-plated surface 133. Alternatively, in the shape modification step S140, the shapes of the peelable films 3 can be modified to be the same as or different from each other as needed. Furthermore, after the shape modification step S140, the first stacked structure 1 on which the surface treatment structure 13 is formed can be baked at a temperature between 120°C and 180°C for 20 to 40 minutes, but the present invention is not limited thereto.

[0035] In one embodiment, in the peelable film setting step S130, the peelable film 3 may be further laid on one of the copper foil layers 11 on the surface of the first stacked structure 1, and in the shape modification step S140, the shape of the peelable film 3 covering a portion of the copper foil layer 11 may be further modified.

[0036] Please see Figure 7 As shown, Figure 7 This is a schematic diagram of the pressing steps in the irregular opening method for the circuit board structure of the present invention. In the pressing step S160, the first stacked structure 1 and the second stacked structure 2 are pressed together. In the pressing step S160, an insulating layer (not shown) may be pressed between the first stacked structure 1 and the second stacked structure 2, and the insulating layer may be, for example, glass fiber impregnated with epoxy resin, but the present invention is not limited thereto. In addition, two insulating layers (not shown) and two copper foil layers (not shown) may be pressed together on both sides of the first stacked structure 1 and the second stacked structure 2.

[0037] Please see Figure 8 As shown, Figure 8This is a schematic diagram of the blind trench forming step in the irregular opening method for the circuit board structure of the present invention. In the blind trench forming step S170, the surface of the second stacked structure 2 away from the first stacked structure 1 is blindly milled to form a plurality of blind trenches 4. It is worth mentioning that the shape surrounded by each of the blind trenches 4 may correspond to the shape of one of the peelable films 3.

[0038] Please see Figure 5 and Figure 6 As shown, Figure 5 This is a schematic diagram (I) of the preprocessing steps of the irregular opening method for the circuit board structure of the present invention, and Figure 6 This is a schematic diagram (II) of the preprocessing steps of the irregular opening method for the circuit board structure of the present invention. Furthermore, before the lamination step S160, the irregular opening method for the circuit board structure may further include a preprocessing step S150, in which multiple lines 23 are formed on the surface of the second stacked structure 2, and multiple pre-cut grooves 24 are formed between the multiple lines 23. Specifically, the lines 23 may be formed on the second stacked structure 2 by exposure, development, and etching, and the multiple pre-cut grooves 24 may be formed by laser cutting. In other words, each pre-cut groove 24 may be a laser pre-cut groove, and the depth D of each pre-cut groove 24 may be between 0.25 and 0.75 times the thickness of the second stacked structure.

[0039] Furthermore, in the blind groove forming step S170, blind milling can be performed on the surface of the second stacked structure 2 away from the first stacked structure 1 to form a plurality of blind grooves 4 communicating with the plurality of pre-cut grooves 24. By forming the pre-cut grooves 24 before the blind groove forming step S170, the blind milling accuracy in the blind groove forming step S170 can be improved. That is, the depth D of the blind groove 4 will not be too deep or too shallow, which would be detrimental to the subsequent opening step S180.

[0040] Please see Figure 9 As shown, Figure 9 This is a schematic diagram of the opening steps of the irregular opening method for the circuit board structure of the present invention. In the opening step S180, the second stacked structure 2 corresponding to the portion of the surface treatment structure 13 at the location of the plurality of blind grooves 4 is removed to form a plurality of cavities 5. The opening shape 51 of each cavity 5 corresponds to the shape of one of the peelable films 3. By pre-modifying the shape of the peelable film 3 in the shape modification step S140, it is possible to more easily make the opening shape 51 of each cavity 5 correspond to the shape of one of the peelable films 3 in the opening step S180.

[0041] Please see Figure 10 and Figure 11 As shown, Figure 10 This is a schematic diagram of the removal step in the irregular opening method for the circuit board structure of the present invention, and Figure 11 This is a schematic diagram of the circuit board structure of the present invention. Figure 10 This can be viewed as a cross-sectional view of the imaginary line L along path 11. In the removal step S190, the peelable film 3 is removed to form a circuit board structure 100. It is worth mentioning that after the removal step S190, the surface treatment structure 13 is exposed from the cavity 5. In other words, in this embodiment, the solder resist layer 131, the groove 132, and the gold-plated surface 133 may be exposed from one of the corresponding cavities 5.

[0042] In other words, the circuit board structure 100 includes a first stacked structure 1 and a second stacked structure 2 located on the first stacked structure 1. The second stacked structure 2 has a plurality of holes 5, and the opening shape 51 of any one of the holes 5 may be different from the opening shape 51 of any other hole 5. Each of the surface treatment structures 13 of the first stacked structure 1 is exposed from one of the corresponding holes 5.

[0043] [Beneficial Effects of the Embodiments of the Invention]

[0044] One of the beneficial effects of the present invention is that the irregular opening method of the circuit board structure provided by the present invention can effectively improve the problem that the existing circuit board structure opening method has difficulty in opening irregularly shaped holes by means of the technical solutions of "shape modification step, by exposure and development to modify the shape of the peelable film" and "the opening shape of each of the holes corresponds to the shape of one of the peelable films".

[0045] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the description and drawings of the present invention are included within the protection scope of the present invention.

Claims

1. A method for opening an irregularly shaped circuit board structure, characterized in that, The irregular opening method of the circuit board structure includes: A preliminary step includes providing a first stacking structure and a second stacking structure; A surface treatment step is performed on the first stacked structure to form a plurality of surface-treated structures on the surface of the first stacked structure; A peelable film setting step involves setting multiple peelable films on multiple surface treatment structures; A shape modification step involves modifying the shape of the peelable film through exposure and development. A pressing step is performed to press the first stacked structure and the second stacked structure together; A blind groove forming step involves blind milling the surface of the second stacked structure away from the first stacked structure to form multiple blind grooves; In the first opening step, the second stacked structure corresponding to the portion of the surface-treated structure at the location of the plurality of blind grooves is removed to form a plurality of cavities; wherein, the opening shape of each cavity corresponds to the shape of the peelable film; as well as A removal step removes the peelable film to form a circuit board structure.

2. The irregular opening method for a circuit board structure according to claim 1, characterized in that, After the removal step, each of the surface-treated structures is exposed from the corresponding cavity.

3. The irregular opening method for a circuit board structure according to claim 1, characterized in that, Prior to the lamination step, the irregular opening method of the circuit board structure further includes a preprocessing step, in which multiple lines are formed on the surface of the second stacked structure, and multiple pre-cut grooves are formed between the multiple lines.

4. The irregular opening method for the circuit board structure according to claim 3, characterized in that, In the blind slot forming step, the surface of the second stacked structure away from the first stacked structure is blind milled to form a plurality of blind slots communicating with the plurality of pre-cut slots.

5. The irregular opening method for a circuit board structure according to claim 3, characterized in that, The depth of each of the pre-cut slots is between 0.25 and 0.75 times the thickness of the second stacked structure.

6. The irregular opening method for a circuit board structure according to claim 1, characterized in that, In the surface treatment step, a solder resist ink application operation, a blind milling operation, or a gold plating operation is performed on the first stacked structure, and the surface treatment structure is a solder resist ink layer, a groove, or a gold-plated surface.

7. The irregular opening method for a circuit board structure according to claim 6, characterized in that, The plurality of surface treatment structures include the solder resist ink layer, the groove, and the gold-plated surface.

8. The irregular opening method for a circuit board structure according to claim 6, characterized in that, After the shape modification step, the shape of the peelable film located on the solder resist ink layer is different from the shape of the peelable film located in the groove or different from the shape of the peelable film located on the gold-plated surface.

9. The irregular opening method for a circuit board structure according to claim 6, characterized in that, The first stacked structure includes multiple copper foil layers stacked on top of each other and multiple insulating layers, the groove being the copper foil layer formed on the surface of the first stacked structure, and the insulating layer being partially exposed from the groove.

10. The irregular opening method for a circuit board structure according to claim 1, characterized in that, The first stacked structure includes multiple copper foil layers and multiple insulating layers stacked on top of each other; wherein, in the peelable film setting step, the peelable film is further laid on the copper foil layers on the surface of the first stacked structure, and in the shape modification step, the shape of the peelable film covering a portion of the copper foil layers is further modified.

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