Electronic device

Abstract

The application provides an electronic device, which comprises a screen, a middle frame and a back cover which are sequentially and fixedly arranged in a first direction. A containing space is formed between the screen and the middle frame. A heat source and a heat dissipation structure are arranged in the containing space. The heat dissipation structure comprises a first vapor chamber, a heat conduction sheet and a second vapor chamber which are sequentially arranged in the first direction. The first vapor chamber is thermally coupled with the heat source, the second vapor chamber is thermally coupled with the screen, and the two sides of the heat conduction sheet are thermally coupled with the first vapor chamber and the second vapor chamber respectively. Alternatively, the heat conduction sheet is thermally coupled with the heat source, the second vapor chamber is thermally coupled with the screen, and the two sides of the first vapor chamber are thermally coupled with the heat conduction sheet and the second vapor chamber respectively. The heat dissipation structure is arranged in the three-layer structure, so that the arrangement of the heat dissipation structure is flexible, the internal space of the electronic device is fully utilized, and the heat dissipation capacity is good. Meanwhile, the heat passes through several layers of vapor chambers and is evenly distributed to all parts of the electronic device, so that the heat dissipation capacity is further enhanced.

Description

[0001] This application is a divisional application. The original application has the application number 202411377180.5 and the original application date is September 29, 2024. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic devices, and in particular to an electronic device with a heat dissipation structure. Background Technology

[0003] With the continuous development of electronic devices, people have increasingly higher requirements for thinner, lighter, and safer electronic devices. However, most electronic devices currently on the market use a conventional design. A conventional design refers to an electronic device architecture where the screen and mid-frame are combined first, and then the back cover is installed. This architecture has relatively mature technology, lower cost, and a more refined design, hence its widespread use. However, in a conventional design, the main functional components of the electronic device (such as the motherboard, system-on-a-chip, and imaging system components) need to be placed between the mid-frame and the back cover. The battery and main functional components are only protected by a single layer of the back cover in the thickness direction. When the back cover is impacted, the internal battery or main components are easily damaged, resulting in poor safety performance.

[0004] Therefore, with technological advancements, people have gradually turned their attention to new flip-chip architectures. A flip-chip architecture refers to an electronic device architecture where the back cover and mid-frame are first combined, and then the screen is installed. In this architecture, the battery and main functional components are located on the side of the mid-frame closer to the screen. On one hand, the integration of main functional components is higher, which is beneficial for further thinning and lightening of electronic devices. On the other hand, when the back cover is impacted, the battery and main functional components can be protected by the double layer of the mid-frame and back cover, resulting in better safety performance.

[0005] However, flip-chip electronic devices also present some challenges. One major issue is that, compared to conventional architectures, flip-chip electronic devices have a higher integration density of key functional components, leading to greater heat dissipation pressure. Furthermore, due to their thinner profile and the generally passive cooling methods used, the available space for heat dissipation is smaller, making heat dissipation even more difficult. Currently, there is no optimal heat dissipation solution for flip-chip electronic devices.

[0006] In conclusion, current electronic devices using flip-chip architecture cannot simultaneously achieve a slim and lightweight design and good heat dissipation performance. Summary of the Invention

[0007] This application provides an electronic device that solves the problem that existing electronic devices using flip-chip architecture cannot simultaneously achieve a thin and light design and good heat dissipation performance.

[0008] This application provides an electronic device including a screen, a mid-frame, and a back cover that are sequentially stacked and fixedly connected in a first direction, with the screen and mid-frame surrounding each other to form an accommodating space. The electronic device also includes a heat source and a heat dissipation structure disposed within the accommodating space. The heat dissipation structure includes a first heat spreader, a heat-conducting sheet, and a second heat spreader stacked in the first direction.

[0009] In the first direction, the two sides of the heat-conducting sheet are thermally coupled to the first heat-spreading plate and the second heat-spreading plate, respectively. The first heat-spreading plate is thermally coupled to the heat source, and the second heat-spreading plate is thermally coupled to the screen, so that the heat generated by the heat source can be conducted to the middle frame and the screen through the first heat-spreading plate, the heat-conducting sheet and the second heat-spreading plate.

[0010] Alternatively, in the first direction, the two sides of the first heat spreader are thermally coupled to the heat conduction sheet and the second heat spreader, respectively, and the heat conduction sheet is thermally coupled to the heat source, and the second heat spreader is thermally coupled to the screen, so that the heat generated by the heat source can be conducted to the middle frame and the screen through the heat conduction sheet, the first heat spreader and the second heat spreader.

[0011] In the electronic device of this application, the screen and the mid-frame surround to form an accommodating space, and the heat source is located within this accommodating space. This can be understood as the electronic device employing a flip-chip architecture, enabling a thinner and lighter design. Furthermore, a heat dissipation structure is provided within the accommodating space, comprising a three-layer structure: a first heat spreader, a heat-conducting sheet, and a second heat spreader, stacked on top of each other. Specifically, the heat dissipation structure has two arrangements: The first arrangement involves the first heat spreader, the heat-conducting sheet, and the second heat spreader being stacked sequentially. The first heat spreader is thermally coupled to the heat source, and the second heat spreader is thermally coupled to the screen. The heat transfer path is as follows: first to the first heat spreader, then to the heat-conducting sheet, then to the mid-frame and the second heat spreader, and finally to the screen. The second arrangement involves the heat-conducting sheet, the first heat spreader, and the second heat spreader being stacked sequentially, with the heat-conducting sheet thermally coupled to the heat source and the second heat spreader thermally coupled to the screen. The heat transfer path is as follows: first, it is transferred to the heat-conducting plate, then from the heat-conducting plate to the first heat-spreading plate and the middle frame, then from the first heat-spreading plate to the second heat-spreading plate, and finally from the second heat-spreading plate to the screen.

[0012] By configuring the heat dissipation structure into this three-layer structure, firstly, compared to the thickness of the first and second heat spreaders in the first direction, the thickness of the heat-conducting sheet in the first direction can be made relatively thin. Therefore, the placement of the heat-conducting sheet within the electronic device is more flexible, extending to areas where a heat spreader cannot be placed due to insufficient thickness, dispersing heat over a larger area, thereby achieving large-area passive heat dissipation and improving the heat dissipation capacity of the electronic device. Secondly, the heat generated by the heat source needs to pass through the two layers of the heat dissipation structure—the heat-conducting sheet and the first heat spreader—so that the heat can be transferred relatively evenly to all parts of the electronic device. Thirdly, by setting the second heat spreader to be thermally coupled with the screen, heat can be transferred to the screen for dissipation, enhancing the heat dissipation effect. Furthermore, it also ensures uniform heat distribution at the screen, avoiding hot spots on the screen that could negatively impact the user experience.

[0013] In summary, the electronic device provided in this application not only achieves a thin and light design but also further improves its heat dissipation performance.

[0014] In one possible implementation, the accommodating space has a top region, a battery compartment region, and a bottom region arranged sequentially along a second direction. The second direction is perpendicular to the first direction. The heat source and the first heat spreader are both located within the top region, and at least a portion of the heat-conducting sheet and at least a portion of the second heat spreader are also located within the top region.

[0015] By placing the heat source in the top area, overheating can be avoided in parts that users directly contact (such as the screen and the area corresponding to the battery compartment or the bottom area), thus improving the user experience.

[0016] In one possible implementation, the projection of the heat-conducting plate onto the first plane at least partially covers the projection of the first heat-spreading plate onto the first plane, wherein the first plane is perpendicular to the first direction. This ensures a large contact area between the heat-conducting plate and the first heat-spreading plate, which is beneficial for rapid heat transfer.

[0017] In one possible implementation, the heat-conducting plate extends from the top region along a second direction into the battery compartment region or the bottom region. This heat-conducting plate transfers heat to the battery compartment region or the bottom region in the middle of the electronic device, making full use of the space in the battery compartment region or even the bottom region, effectively transferring heat to the entire electronic device, maximizing the heat dissipation area, and improving heat dissipation efficiency.

[0018] In one possible implementation, when the heat-conducting plate extends into the battery compartment area, it extends to the end where the battery compartment area meets the bottom area. This allows for full utilization of the space in the battery compartment area when, in certain situations, a heat-conducting plate cannot be installed in the bottom area.

[0019] In one possible implementation, the heat-conducting plate extends to both sides of the accommodating space in a third-direction direction. This third-direction direction is perpendicular to both the first and second directions. This allows the heat-conducting plate to fully utilize the space in the third-direction direction, increasing the heat dissipation area and improving thermal conductivity.

[0020] In one possible implementation, both the first heat spreader and the second heat spreader include a lower cover plate, a capillary structure and an upper cover plate stacked in a first direction. The lower cover plate and the upper cover plate are sealed together to form a closed cavity. A heat-conducting medium is provided inside the closed cavity, and the capillary structure is disposed inside the closed cavity.

[0021] When the two sides of the heat-conducting sheet are thermally coupled to the first heat-spreading plate and the second heat-spreading plate respectively, the lower cover of the first heat-spreading plate is in contact with the heat source, the upper cover of the first heat-spreading plate is in contact with one side of the heat-conducting sheet, the lower cover of the second heat-spreading plate is in contact with the other side of the heat-conducting sheet, and the upper cover of the second heat-spreading plate is in contact with the screen.

[0022] When the two sides of the first heat spreader are thermally coupled to the heat-conducting sheet and the second heat spreader respectively, one side of the heat-conducting sheet is thermally coupled to the heat source, the lower cover of the first heat spreader is attached to the other side of the heat-conducting sheet, the upper cover of the first heat spreader is attached to the lower cover of the second heat spreader, and the upper cover of the second heat spreader is attached to the screen. The two sides of the lower cover and the upper cover of the first heat spreader that are set opposite to each other constitute the two sides of the first heat spreader.

[0023] This can be understood as follows: the first and second heat spreaders rely on the circulating heat-conducting medium inside for heat equalization. The lower cover plate is in contact with the components that experience higher temperatures, and the heat is transferred to the upper cover plate via the internal heat-conducting medium. The upper cover plate then evenly distributes the heat to the other components it is in contact with. This achieves extremely high thermal conductivity.

[0024] In one possible implementation, the electronic device further includes a first circuit board and a circuit board support disposed within the receiving space. The circuit board support is fixed to the middle plate of the middle frame and extends upwards to both sides of the receiving space. The first circuit board is fixed between the middle plate of the middle frame and the circuit board support. A heat source is mounted on the first circuit board. By adding the circuit board support, additional protection for the heat source can be provided, and the structural strength of the electronic device can be improved, thereby extending the service life of the electronic device.

[0025] In one possible implementation, when the two sides of the heat-conducting sheet are thermally coupled to the first heat-spreading plate and the second heat-spreading plate respectively, the circuit board bracket is provided with a cutout, and the first heat-spreading plate is embedded in the cutout.

[0026] When the two sides of the first heat spreader are thermally coupled to the heat conduction sheet and the second heat spreader respectively, the heat conduction sheet is in contact with the circuit board bracket, and the circuit board bracket is in contact with the heat source, so that the heat conduction sheet is thermally coupled to the heat source through the circuit board bracket.

[0027] This can be understood as follows: the circuit board support is hollowed out, and a first heat spreader is placed inside the hollowed-out area, so that the first heat spreader no longer occupies space in the first direction of the electronic device. This is beneficial for the thinning and miniaturization of electronic devices.

[0028] In one possible implementation, when the two sides of the first heat spreader are thermally coupled to the heat conduction sheet and the second heat spreader respectively, the circuit board support as a whole is configured as follows: the lower cover of the first heat spreader, and the area between the circuit board support and the heat conduction sheet where no other components are provided is provided with the capillary structure of the first heat spreader and / or the upper cover.

[0029] This can also be understood as follows: the lower cover of the first heat spreader is reused as a circuit board support, providing additional support and protection for the first circuit board. Furthermore, the area with sufficient height between the circuit board support and the heat-conducting pad is equipped with the capillary structure of the first heat spreader and / or the upper cover. On the one hand, reusing the lower cover of the first heat spreader as a circuit board support can still provide additional protection for the heat source, improving the structural strength of the electronic device while saving the space occupied by the circuit board support in the first direction. On the other hand, equipping the area with sufficient height between the circuit board support and the heat-conducting pad with the structure of the first heat spreader can maximize the use of this space, increasing the heat dissipation area of ​​the first heat spreader and greatly improving the heat dissipation effect.

[0030] In one possible implementation, the heat source includes at least one of a system-on-a-chip (SoC), a central processing unit (CPU), a charging chip, a general-purpose flash memory chip, or an image processor. The first circuit board is a motherboard, and the circuit board bracket is a motherboard bracket. This provides an efficient and safe heat dissipation solution for the SoC, CPU, charging chip, general-purpose flash memory chip, or image processor.

[0031] In one possible implementation, the second heat spreader extends along a second direction and has a first end and a second end disposed opposite to each other in the second direction. The first end is disposed in the top region, and the second end extends to the end where the battery compartment region meets the bottom region. Alternatively, it extends into the bottom region.

[0032] The second heat spreader extends upwards to both sides of the accommodating space.

[0033] This can be understood as follows: the second heat spreader can also extend into the battery compartment area or even the bottom area in the second direction. Furthermore, in the third direction, the second heat spreader also extends to both sides of the housing space, thus ensuring that the second heat spreader has a large heat dissipation area and better heat dissipation performance.

[0034] In one possible implementation, the heat-conducting sheet is a graphite sheet made of graphite or graphene. Alternatively, it can be a metal sheet made of metallic materials. This allows the heat-conducting sheet to have good thermal conductivity while also being thin, easy to process, and low in cost.

[0035] In one possible implementation, the thickness of the first heat spreader is 0.1mm-1mm, the thickness of the second heat spreader is 0.1mm-1mm, and the thickness of the heat-conducting sheet is 0.03mm-0.5mm. This allows the heat-conducting sheet to be arranged more flexibly within the electronic device while ensuring excellent heat dissipation performance of both the first and second heat spreaders. Attached Figure Description

[0036] Figure 1 This is a three-dimensional structural diagram of the electronic device according to an embodiment of this application; Figure 2a This is an exploded structural diagram of the first embodiment of the electronic device described in this application; Figure 2b This is an exploded structural diagram from another perspective of the first embodiment of the electronic device of this application. Figure 3 This is a side view of the electronic device according to a first embodiment of the present application, excluding the frame. Figure 4 This is a front view of the electronic device according to a first embodiment of the present application, excluding the border. Figure 5 This is a schematic diagram of the cooperative structure of the heat dissipation structure, circuit board and heat source in the first embodiment of the electronic device of this application; Figure 6 for Figure 5 A magnified view of a portion of region A in the middle; Figure 7 for Figure 6 A schematic diagram of the decomposed structure; Figure 8 This is a schematic diagram of the cooperative structure of the heat dissipation structure, screen, mid-frame and battery in the first embodiment of the electronic device of this application; Figure 9 This is a schematic diagram of the cooperation structure between the first heat spreader and the heat source in the first embodiment of the electronic device of this application. Figure 10 This is a schematic diagram of the cooperative structure between the first heat spreader and the circuit board bracket in the first embodiment of the electronic device of this application. Figure 11a This is an exploded structural diagram of the second embodiment of the electronic device described in this application; Figure 11b This is an exploded structural diagram from another perspective of the second embodiment of the electronic device of this application. Figure 12 This is a schematic diagram of the cooperative structure of the heat dissipation structure, circuit board, circuit board bracket and heat source in the second embodiment of the electronic device of this application; Figure 13 for Figure 12 A magnified view of a portion of region B in the middle; Figure 14 for Figure 13 A schematic diagram of the decomposed structure; Figure 15 This is a schematic diagram of the heat dissipation structure, screen, and mid-frame cooperation structure in a second embodiment of the electronic device of this application. Figure 16 This is a schematic diagram of the circuit board support structure in the second embodiment of the electronic device of this application; Figure 17 This is a schematic diagram of the first heat spreader structure in the second embodiment of the electronic device of this application; Figure 18 This is a schematic diagram of the cooperative structure of the first heat spreader and the circuit board bracket in the third embodiment of the electronic device of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 100. Electronic devices;

[0039] 10. Storage space; 101. Top area; 102. Battery compartment area; 103. Bottom area;

[0040] 1. Mid-frame; 11. Base plate; 111. First surface; 112. Second surface; 12. Frame; 13. Battery compartment sidewall;

[0041] 2. Heat dissipation structure; 21. First heat spreader; 211. Upper cover plate; 212. Capillary structure; 213. Lower cover plate; 22. Second heat spreader; 23. Heat-conducting sheet;

[0042] 3. First circuit board; 31. Heat source; 32. Circuit board support; 321. Cutout section; 33. Thermal interface material;

[0043] 4. Screen;

[0044] 5. Back cover;

[0045] z, first direction; y, second direction; x, third direction. Detailed Implementation

[0046] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0047] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0048] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "top," and "bottom," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0050] In the description of this application, it should be noted that the mutual perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing and assembly errors (e.g., the included angle between two structural features is 89.9°) is also within the scope of mutual perpendicularity in this application. Similarly, the mutual parallelism in this application is not absolute parallelism. Approximate parallelism due to processing and assembly errors (e.g., the included angle between two structural features is 0.1°) is also within the scope of mutual parallelism in this application. The axisymmetry in this application is not absolute axisymmetry. Approximate axisymmetry due to processing and assembly errors (e.g., a portion of the structure is offset by a certain distance or angle relative to the axis of symmetry) is also within the scope of axisymmetry in this application. This application does not impose specific limitations in these respects.

[0051] Current flip-chip electronic devices have higher integration of key functional components, resulting in greater heat dissipation pressure. Furthermore, due to their thinner profile and the fact that they typically employ passive cooling methods, the available space for heat dissipation is even smaller, making heat dissipation more challenging. Currently, there is no optimal heat dissipation solution for flip-chip electronic devices.

[0052] Based on this, the present application provides an electronic device that solves the problem that electronic devices using flip-chip architecture in the prior art cannot simultaneously achieve a thin and light design and heat dissipation performance.

[0053] It should be noted that the electronic device in this application embodiment is an electronic device with certain heat dissipation requirements, including but not limited to handheld devices, in-vehicle devices, wearable devices, computing devices, or other processing devices connected to a wireless modem. For example, it may include cellular phones, smartphones, personal digital assistant (PDA) computers, tablet computers, laptop computers, smartwatches, smart wristbands, in-vehicle computers, and other electronic devices with mobile or wireless communication functions. This application embodiment does not impose special limitations on the specific form of the electronic device 100. For ease of explanation, the following will use a mobile phone as an example, illustrated with accompanying drawings.

[0054] Please see Figures 1-3 , Figure 1 This is a three-dimensional structural diagram of the electronic device according to an embodiment of this application; Figure 2a This is an exploded structural diagram of the first embodiment of the electronic device described in this application; Figure 2b This is an exploded structural diagram from another perspective of the first embodiment of the electronic device of this application. Figure 3This is a side view of the electronic device according to the first embodiment of this application, excluding the border.

[0055] like Figures 1-2b As shown, this application provides an electronic device 100, including a screen 4, a middle frame 1, and a back cover 5 that are sequentially stacked and fixedly connected in a first direction z, with the screen 4 and the middle frame 1 surrounding to form a receiving space 10. The electronic device 100 also includes components disposed in the receiving space 10 (see [link to relevant documentation]). Figure 3 The heat source 31 and heat dissipation structure 2 are located within the heat source 31. The heat dissipation structure 2 includes a first heat dissipation plate 21, a heat-conducting plate 23, and a second heat dissipation plate 22 stacked in the first direction z. The specific structure of the heat dissipation structure 2 will be described in detail later.

[0056] Those skilled in the art will understand that the type of screen 4 is also not limited.

[0057] In one possible implementation, screen 4 can be a liquid crystal display (LCD) screen, an organic light emitting diode (OLED) display screen, etc., where the OLED display screen can be a flexible display screen or a rigid display screen. Screen 4 can be a regular screen, or an irregularly shaped screen, a foldable screen, etc. For example, screen 4 can rotate or fold relatively freely to form an arc, a polygonal prism, etc. Screen 4 can be located on the front and / or back of electronic device 100. The front of electronic device can be understood as the side facing the user when using electronic device 100, and the back of electronic device can be understood as the side facing away from the user when using electronic device 100. Furthermore, when screen 4 is upright and facing the user, the corresponding position of the top of screen 4 is the top area of ​​electronic device 100, and the corresponding position of the bottom part of screen 4 is the bottom area of ​​electronic device 100. The corresponding positions of the two sides of screen 4 are the two sides of electronic device 100. Furthermore, the top area of ​​the receiving space mentioned below is located in the top area of ​​electronic device 100, the bottom area of ​​the receiving space is located in the bottom area of ​​electronic device 100, and the two sides of the receiving space are located in the two sides of electronic device 100. These locations will not be described separately in the following text.

[0058] Understandably, the specific structure of the middle frame 1 is also not limited.

[0059] like Figure 1 and Figure 2a As shown, in one possible implementation, the middle frame 1 is a support frame located inside the electronic device 100, which may specifically include a base plate 11 and a frame 12.

[0060] like Figure 2b and Figure 3As shown, the base plate 11 includes a first surface 111 and a second surface 112 disposed opposite to each other. The first surface 111 faces the rear cover 5, and the second surface 112 faces the back of the screen 4. A receiving space 10 can be formed between the screen 4 and the second surface 112 of the base plate 11. The receiving space 10 can be used to install internal components such as batteries, cameras, and antennas.

[0061] The frame 12 is a structure that surrounds the outer periphery of the electronic device 100. For example... Figure 1 As shown, and in combination Figure 2a It is understood that the bezel 12 may extend around the periphery of the electronic device 100 and the screen 4, specifically surrounding the four sides of the screen 4 to help secure the screen 4. In some embodiments, the bezel 12 may be a metal bezel made of a metal material such as copper, magnesium alloy, or stainless steel. In other embodiments, the bezel 12 may also be a non-metallic bezel (i.e., an insulating bezel), including plastic bezels, glass bezels, ceramic bezels, etc.

[0062] The base plate 11 and the frame 12 can be either separate or integrated; this embodiment does not limit the specific components. When the base plate 11 and frame 12 are separate, they are two independent components of the middle frame 1, assembled together by snap-fit ​​or fastening, and can be separated when disassembly is required. When the base plate 11 and frame 12 are integrated, the connection between them cannot be separated. For example, the base plate 11 and frame 12 can be manufactured using a single molding process or assembled using a permanent connection method such as welding. In the integrated base plate 11 and frame 12, the outer periphery of the middle frame 1 can be considered as the frame 12 of the electronic device 100.

[0063] Those skilled in the art will understand that the specific structure and type of the back cover 5 are not limited.

[0064] In one possible implementation, the back cover 5 is a structure on the electronic device 100 that is positioned opposite the screen 4 and connected to the frame 12. It serves to enclose the components of the electronic device 100 within the device, while also providing protection against dust, impacts, and scratches. The back cover 5 can be made of metal (i.e., a metal back cover) or non-conductive materials (i.e., a non-metal back cover), such as a glass back cover or a plastic back cover.

[0065] It should be noted that the above is merely an exemplary structure of the electronic device 100. The electronic device 100 may contain more or fewer functional modules to achieve the corresponding functions. For example, it may include a charging management module for receiving charging input from a charger, a power management module for supplying power to the display screen, a wireless communication module and a mobile communication module for implementing the communication function of the electronic device, and an audio module for implementing audio functions, etc. This application does not constitute a limitation.

[0066] It should be noted that the heat source 31 includes one or more electronic components. These components can be arranged independently or integrated together; this application does not impose any limitations on this. Furthermore, the type of electronic component is not limited. In one possible implementation, the heat source 31 includes a chip, which may include any one or more of a system-on-a-chip (SoC), a central processing unit (CPU), a graphics processing unit (GPU), a charging chip, and a general-purpose flash memory chip. Among these, the SoC, CPU, GPU, charging chip, and general-purpose flash memory chip are all high-power chips that dissipate a significant amount of heat during operation. Alternatively, it can be understood that the electronic components included in the heat source 31 are high-power, heat-generating components. Concentrating these components in one area to form a module (i.e., the heat source 31) allows for centralized heat dissipation of the heat-generating components, improving heat dissipation efficiency. By correspondingly placing the heat dissipation structure mentioned later in the location of the heat source 31, heat dissipation of the electronic components in the heat source 31 can be centralized. For ease of explanation, the following description uses the example of the heat source 31 including a system-on-a-chip, illustrated with accompanying drawings.

[0067] It will be understood by those skilled in the art that the specific configuration of the heat source 31 is not limited. For example... Figure 2a As shown, in one possible implementation, the electronic device 100 further includes a first circuit board 3 and a circuit board support 32 disposed within the receiving space 10. The circuit board support 32 is fixed to the middle plate of the middle frame 1 and extends in a third direction (x) to both sides of the receiving space 10. The first circuit board 3 is fixed between the middle plate of the middle frame 1 and the circuit board support 32. A heat source 31 is mounted on the first circuit board 3. By adding the circuit board support 32, additional protection can be provided for the heat source 31, and the structural strength of the electronic device 100 can be improved, thereby extending the service life of the electronic device 100.

[0068] Furthermore, in one possible implementation, the first circuit board 3 can be a motherboard, and the circuit board support 32 can be a motherboard support. In another possible implementation, the first circuit board 3 can also be a sub-board, and the circuit board support 32 can be a sub-board support; this application does not impose any limitations on this.

[0069] The above is a brief description of the scenario of the electronic device 100 proposed in the embodiments of this application. The following will describe other components and their cooperation relationships with reference to the accompanying drawings. First, the heat dissipation structure 2 will be described. It should be noted that the specific composition and arrangement of the heat dissipation structure 2 are not limited.

[0070] Please see Figures 4-8 , Figure 4 This is a front view of the electronic device according to a first embodiment of the present application, excluding the border. Figure 5 This is a schematic diagram of the cooperative structure of the heat dissipation structure, circuit board and heat source in the first embodiment of the electronic device of this application; Figure 6 for Figure 5 A magnified view of a portion of region A in the middle; Figure 7 for Figure 6 A schematic diagram of the decomposed structure; Figure 8 This is a schematic diagram of the cooperative structure of the heat dissipation structure, screen, mid-frame and battery in the first embodiment of the electronic device of this application.

[0071] like Figures 2a-3 As shown, in one possible implementation, the heat dissipation structure 2 includes a first heat spreader 21, a heat-conducting sheet 23, and a second heat spreader 22 stacked in the first direction z. In the first direction z, the two sides of the heat-conducting sheet 23 are thermally coupled to the first heat spreader 21 and the second heat spreader 22, respectively. Furthermore, the first heat spreader 21 is thermally coupled to the heat source 31, and the second heat spreader 22 is thermally coupled to the screen 4, allowing the heat generated by the heat source 31 to be conducted to the middle frame 1 and the screen 4 through the first heat spreader 21, the heat-conducting sheet 23, and the second heat spreader 22.

[0072] It should be noted that thermal coupling refers to the ability to transfer heat between two components, and the specific method of heat transfer is not limited. In one possible implementation, thermal coupling can involve the surfaces of the two components being bonded together, with heat transferred through the bonding area. In another possible implementation, a thermal interface material can be provided between the two components, and heat can be transferred through the thermal interface material; this application does not impose any limitations on this.

[0073] For example, in this application, a thermal interface material 33 is provided between the opposing planes of any two components that require heat conduction, thereby further accelerating the heat exchange efficiency between the two components. Please refer to the following for details. Figure 9 The following text will use the first heat spreader 21 and the heat source 31 as an example to illustrate the relevant content.

[0074] Those skilled in the art will understand that the specific type of thermal interface material 33 is not limited. In one possible implementation, the thermal interface material 33 can be thermally conductive silicone grease or liquid metal, etc. In another possible implementation, the thermal interface material 33 can also be a non-interface material such as graphite / graphene thermal pads. This application does not impose any restrictions here.

[0075] like Figures 3-7 As shown, in the electronic device 100 of this application, the screen 4 and the mid-frame 1 surround to form a receiving space 10, and the heat source 31 is disposed within the receiving space 10. This can be understood as the electronic device 100 employing a flip-chip architecture, which enables a thinner and lighter design. Furthermore, a heat dissipation structure 2 is provided within the receiving space 10. The heat dissipation structure 2 includes a three-layer structure: a first heat spreader 21, a heat-conducting sheet 23, and a second heat spreader 22, which are stacked together. At this time, the first heat spreader 21 is thermally coupled to the heat source 31, and the second heat spreader 22 is thermally coupled to the screen 4. The heat transfer path is as follows: first, the heat is transferred to the first heat spreader 21; then, from the first heat spreader 21, it is transferred to the heat-conducting sheet 23; then, from the heat-conducting sheet 23, it is transferred to the mid-frame 1 and the second heat spreader 22 of the electronic device 100; finally, from the second heat spreader 22, it is transferred to the screen 4.

[0076] In another possible implementation, along the first direction z, the first heat spreader 21 is thermally coupled to the heat-conducting plate 23 and the second heat spreader 22 on both sides, respectively. The heat-conducting plate 23 is thermally coupled to the heat source 31, and the second heat spreader 22 is thermally coupled to the screen 4. This allows the heat generated by the heat source 31 to be conducted to the middle frame 1 and the screen 4 through the heat-conducting plate 23, the first heat spreader 21, and the second heat spreader 22. This structure will be described in detail later with reference to the accompanying drawings.

[0077] It should be noted that the first direction z mentioned above and the second direction y and third direction x mentioned below are mutually perpendicular, and their correspondence with the directions of the electronic device is not limited. In one possible implementation, the first direction z is the thickness direction of the electronic device 100, the second direction y is the length direction of the electronic device 100, and the third direction x is the width direction of the electronic device 100. This application does not impose any limitations here.

[0078] Secondly, the heat dissipation method of electronic device 100 needs to be explained: Heat dissipation methods for electronic devices are generally divided into two main categories: active heat dissipation and passive heat dissipation. Active heat dissipation refers to using externally powered cooling devices, such as fans or water pumps, to increase heat removal efficiency. The electronic device 100 addressed in this application mainly does not have actively powered cooling components. This type of electronic device 100 requires passive heat dissipation. Passive heat dissipation refers to a method that does not rely on an external power source for heat dissipation, but rather increases heat transfer efficiency through the design of a heat dissipation structure 2. Specifically, the heat dissipation path involves transferring the heat generated by the heat source 31 to the heat-dissipating structure through metal or other highly thermally conductive materials, and then dissipating heat through the heat radiation (radiating heat into the surrounding environment) and convection (using the natural convection of air or other fluids to carry away heat).

[0079] Those skilled in the art will understand that the larger the surface area used for heat dissipation, the stronger the heat dissipation capacity of the electronic device 100. Furthermore, the stronger the thermal conductivity of the heat dissipation structure 2, the higher the efficiency of transferring heat to the heat-dissipating structure, and thus the stronger the heat dissipation capacity. Therefore, this application mainly enhances the heat dissipation capacity by increasing the surface area used for heat dissipation of the electronic device 100 and by improving the thermal conductivity of the heat dissipation structure 2.

[0080] Therefore, by setting the heat dissipation structure 2 to this three-layer structure, firstly, compared to the thickness of the first heat dissipation plate 21 and the second heat dissipation plate 22 in the first direction z, the thickness of the heat-conducting sheet 23 in the first direction z can be made relatively thin. Thus, the placement of the heat-conducting sheet 23 within the electronic device 100 is more flexible, extending to areas where a heat dissipation plate cannot be placed due to insufficient thickness, dispersing heat over a larger area, thereby achieving large-area passive heat dissipation and improving the heat dissipation capacity of the electronic device 100. Secondly, the heat generated by the heat source 31 needs to pass through the two-layer heat dissipation structure of the heat-conducting sheet 23 and the first heat dissipation plate 21, which can transfer the heat to all parts of the electronic device 100 relatively evenly. Thirdly, by setting the second heat dissipation plate 22 to be thermally coupled to the screen 4, heat can be transferred to the screen 4 for heat dissipation, enhancing the heat dissipation effect. Furthermore, it can also ensure uniform heat distribution at the screen 4, avoiding hot spots on the screen 4 and thus affecting the user experience.

[0081] Finally, it should be noted that the method by which the heat-conducting plate 23 transfers heat to the middle frame 1 is also not limited. In one possible implementation, such as... Figure 8 As shown, the heat-conducting sheet 23 is attached to the battery compartment sidewall 13 connected to the middle frame 1, thereby transferring heat. In another possible implementation, the heat-conducting sheet 23 can also transfer heat by being connected to the edge 12 of the middle frame 1, which is not limited in this application.

[0082] In summary, the electronic device 100 provided in this application not only achieves a thin and light design but also further improves its heat dissipation performance.

[0083] The above is a description of the basic concept of this application. The following, in conjunction with the accompanying drawings, will first describe other components that may be involved in the first embodiment and their mating relationships.

[0084] First, those skilled in the art will understand that the specific structure and extension direction of the heat-conducting sheet 23 are not limited.

[0085] like Figure 8 As shown, in one possible implementation, the accommodating space 10 has a top region 101, a battery compartment region 102, and a bottom region 103 arranged sequentially along the second direction y. The top region 101 corresponds to the top region of the electronic device 100, and the bottom region 103 corresponds to the bottom region of the electronic device 100. The battery compartment region 102 is located between the top region 101 and the bottom region 103. The battery compartment region is defined as the region in the accommodating space 10 corresponding to the battery compartment of the electronic device, and the battery compartment is enclosed by a battery compartment sidewall 13 for housing a battery (not shown in the figure). The heat source 31 and the first heat spreader 21 are both located within the top region 101, and at least a portion of the heat-conducting sheet 23 is located within the top region 101.

[0086] By placing the heat source 31 in the top area 101, overheating can be avoided in the parts that the user directly contacts (such as the parts of the screen 4 and the middle frame 1 corresponding to the battery compartment area 102 or the bottom area 103), thus improving the user experience.

[0087] Furthermore, such as Figures 6-8 As shown, in one possible implementation, the projection of the heat-conducting plate 23 onto the first plane at least partially (which can be understood as partially or completely) covers the projection of the first heat-spreading plate 21 onto the first plane, wherein the first plane is perpendicular to the first direction z. This ensures a large contact area between the heat-conducting plate 23 and the first heat-spreading plate 21, which is beneficial for rapid heat transfer.

[0088] The above describes the arrangement relationship between the heat-conducting plate 23 and the first heat-spreading plate 21. The following will describe the specific structure of the heat-conducting plate 23 in the second direction y with reference to the accompanying drawings.

[0089] like Figures 5-8 As shown, in one possible implementation, the heat-conducting plate 23 extends from the top region 101 along the second direction y into the battery compartment region 102. This allows heat to be transferred to the battery compartment region 102 in the middle of the electronic device via the heat-conducting plate 23, fully utilizing the battery compartment region 102 and effectively transferring heat to a larger area within the electronic device 100, thereby significantly increasing the heat dissipation area and improving heat dissipation efficiency.

[0090] like Figure 8 As shown, further, in one possible implementation, when the heat-conducting sheet 23 extends into the battery compartment region 102, the heat-conducting sheet 23 may specifically extend to the end where the battery compartment region 102 meets the bottom region 103. This allows for full utilization of the space in the battery compartment region 102 when, in certain specific situations, the heat-conducting sheet 23 cannot be placed in the bottom region 103 (for example, when a second circuit board is provided in the bottom region 103 of the electronic device for integrating the bottom power management module and charging module, etc., which may be included in the electronic device 100).

[0091] Furthermore, the heat-conducting plate 23 can also extend further in the second direction y.

[0092] like Figure 2b and Figure 5 As shown, in one possible implementation, the heat-conducting sheet 23 extends from the top region 101 along the second direction y to the bottom region 103. This fully utilizes the space of the electronic device 100 in the second direction y, effectively transferring heat to all parts of the electronic device 100, maximizing the heat dissipation area, and improving heat dissipation efficiency.

[0093] The above describes the possible structures of the heat-conducting plate 23 in the second direction y. The possible structures of the heat-conducting plate 23 in the third direction x will be described below.

[0094] like Figure 4 and Figure 8 As shown, in one possible implementation, the heat-conducting plate 23 extends in the third direction x to either side or near the sides of the receiving space 10. This allows the heat-conducting plate 23 to fully utilize the space within the electronic device 100 in the third direction x, increasing the heat dissipation area and improving heat conduction efficiency.

[0095] In another possible implementation, the heat-conducting plate 23 may not extend to either side of the receiving space 10 in the third direction x, in order to avoid certain critical components or to accommodate certain special design needs. This application does not impose any limitations.

[0096] The above describes the specific shape and arrangement of the heat-conducting plate 23. The following will explain the specific material and thickness range of the heat-conducting plate 23.

[0097] It should be noted that the specific material of the heat-conducting sheet 23 is also not limited.

[0098] In one possible implementation, the heat-conducting sheet 23 is a graphite sheet made of graphite or graphene. This allows the heat-conducting sheet 23 to have good thermal conductivity while also being thin, easy to process, and low in cost. In another possible implementation, the heat-conducting sheet 23 can also be made of other materials that combine thermal conductivity and ductility, such as a metal sheet made of metallic materials. This application does not impose any limitations on these aspects.

[0099] Those skilled in the art will understand that the specific thickness of the heat-conducting sheet 23 is also not limited.

[0100] In one possible implementation, the thickness of the heat-conducting sheet 23 is 0.03mm-0.5mm, such as 0.03mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm and 0.5mm.

[0101] Furthermore, the thickness of the heat-conducting sheet 23 can be 0.03mm-0.3mm, such as 0.03mm, 0.09mm, 0.15mm, 0.21mm, 0.27mm and 0.3mm, so that the heat-conducting sheet 23 can be arranged more flexibly in the electronic device 100 and has good heat conduction capability.

[0102] Furthermore, the thickness of the heat-conducting sheet 23 can be set to 0.03mm-0.15mm, such as 0.03mm, 0.05mm, 0.07mm, 0.09mm, 0.11mm, 0.13mm and 0.15mm, so that the heat-conducting sheet 23 can achieve the optimal combination of space occupied and heat conduction capacity in the first direction z.

[0103] It should be noted that, in another possible implementation, the heat-conducting sheet 23 may also be set to a thickness greater than 0.5 mm or less than 0.03 mm to adapt to certain special designs or meet certain special requirements, and this application does not impose any restrictions here.

[0104] The above is a detailed description of the possible specific structure and materials of the heat-conducting plate 23. The following section, in conjunction with the accompanying drawings, will explain the possible structures of the first heat-spreading plate 21 and the second heat-spreading plate 22, as well as their compatibility with related components.

[0105] It should be noted that the specific structure of the first heat spreader 21 and the second heat spreader 22 is also not limited.

[0106] Please see Figure 9 , Figure 9 This is a schematic diagram of the cooperation structure between the first heat spreader and the heat source in the first embodiment of the electronic device of this application.

[0107] like Figure 9As shown, the first heat spreader 21 is used as an example for specific explanation. In one possible implementation, each heat spreader 21 and the second heat spreader 22 includes a lower cover plate 213, a capillary structure 212 and an upper cover plate 211 stacked in the first direction z. The lower cover plate 213 and the upper cover plate 211 are sealed together to form a closed cavity. The closed cavity is provided with a heat-conducting medium, and the capillary structure 212 is disposed in the closed cavity.

[0108] Continue to refer to Figure 9 The main working principle of the first heat spreader 21 is as follows: First, when the lower cover plate 213 comes into contact with the heat source 31, the heat-conducting medium inside the lower cover plate 213 near the heat source 31 rapidly absorbs heat and evaporates into a gaseous state, absorbing a large amount of heat energy in this process. Second, the gaseous heat-conducting medium flows in a plane perpendicular to the first direction, causing the heat to be evenly distributed in the plane perpendicular to the first direction; at the same time, the gaseous heat-conducting medium also flows towards the lower-temperature upper cover plate 211 (or can be understood as the first direction z) due to the pressure difference. Third, the gaseous heat-conducting medium comes into contact with the upper cover plate 211 and condenses and releases heat in the upper cover plate 211, causing the heat to be released to the upper cover plate. Finally, the liquid heat-conducting medium is affected by the capillary force of the capillary structure 212 and returns to the lower cover plate 213 to complete a heat release cycle.

[0109] Those skilled in the art will understand that the specific structure of the capillary structure 212 is not limited. In one possible implementation, the capillary structure 212 may include one or more copper powder sintered layers, one or more copper mesh layers, and liquid wicking structures, and this application does not impose any limitations on these aspects.

[0110] It should be noted that the first heat spreader 21 and the second heat spreader 22 may also include more or fewer structures, such as internal or external support structures. This application does not impose any limitations on these aspects. Furthermore, the specific material of the heat-conducting medium is not limited. In one possible implementation, the heat-conducting medium can be pure water, methanol, or acetone, etc. This application also does not impose any limitations on these aspects.

[0111] like Figures 6-7 As shown, when the two sides of the heat-conducting plate 23 are thermally coupled to the first heat-dissipating plate 21 and the second heat-dissipating plate 22 respectively, the lower cover plate 213 of the first heat-dissipating plate 21 is attached to the heat source 31, the upper cover plate 211 of the first heat-dissipating plate 21 is attached to one side of the heat-conducting plate 23, the lower cover plate 213 of the second heat-dissipating plate 22 is attached to the other side of the heat-conducting plate 23, and the upper cover plate 211 of the second heat-dissipating plate 22 is attached to the screen 4.

[0112] This can be understood as follows: the first heat spreader 21 and the second heat spreader 22 rely on the circulating heat-conducting medium inside for heat equalization. The lower cover 213 is in contact with the components with higher temperatures and transfers heat to the upper cover 211 through the internal heat-conducting medium. The upper cover 211 then evenly transfers the heat to the other components it is in contact with. This achieves extremely high thermal conductivity.

[0113] In one possible implementation, the thickness of the first heat spreader 21 and the second heat spreader 22 is 0.1mm-1mm, such as 0.1mm, 0.3mm, 0.5mm, 0.7mm, 0.9mm and 1mm, so as to ensure that the first heat spreader 21 and the second heat spreader 22 have good heat dissipation performance without occupying too much space in the first z direction.

[0114] Furthermore, the thickness of the first heat dissipation plate 21 and the second heat dissipation plate 22 is 0.3mm-0.4mm, such as 0.3mm, 0.32mm, 0.34mm, 0.36mm, 0.38mm and 0.4mm, thereby achieving the best overall combination of thinness and heat dissipation capability for the electronic device 100.

[0115] It should be noted that, in another possible implementation, the thickness of the first heat spreader 21 and the second heat spreader 22 can also be set to a thickness greater than 1 mm or less than 0.1 mm to adapt to certain special designs or meet certain special requirements. This application does not impose any restrictions on this.

[0116] The above describes the specific structure of the first heat spreader 21 and the second heat spreader 22. The following will describe the relationship between the first heat spreader 21 and the second heat spreader 22 and other structures in conjunction with the accompanying drawings.

[0117] It should be noted that the fit between the first heat spreader 21 and the second heat spreader 22 and other structures is not limited.

[0118] Please see Figure 10 , Figure 10 This is a schematic diagram of the cooperative structure of the first heat spreader and the circuit board bracket in the first embodiment of the electronic device of this application.

[0119] like Figure 10 As shown, and in combination Figures 6-7 Understandably, in one possible implementation, the circuit board support 32 is configured as: the lower cover plate 213 of the first heat spreader 21, and the area between the circuit board support 32 and the heat conduction plate 23 where no other components are provided is provided with: the capillary structure 212 of the first heat spreader 21 and / or the upper cover plate 211.

[0120] This can also be understood as follows: the lower cover plate 213 of the first heat spreader 21 is reused as a circuit board support 32, providing additional support and protection for the first circuit board 3. Furthermore, at this time, the area with sufficient height between the circuit board support 32 and the heat-conducting plate 23 is provided with the capillary structure 212 and / or the upper cover plate 211 of the first heat spreader 21. On the one hand, reusing the lower cover plate 213 of the first heat spreader 21 as a circuit board support 32 can still provide additional protection for the heat source 31, improving the structural strength of the electronic device 100, while saving the first z-space occupied by the circuit board support 32. On the other hand, providing the structure of the first heat spreader 21 in the area with sufficient height between the circuit board support 32 and the heat-conducting plate 23 can maximize the utilization of this area's space, maximizing the heat dissipation area of ​​the first heat spreader 21 and greatly improving the heat dissipation effect.

[0121] In another possible implementation, the first heat spreader 21 can also be set up relatively independently or completely independently from the circuit board support 32. These implementations will be described in detail later, and will not be repeated here.

[0122] The above is one way of setting the first heat spreader 21. The following will describe the way of setting the second heat spreader 22 with reference to the attached drawings.

[0123] like Figure 5 and Figure 8 As shown, and in combination Figures 6-7 It is understood that, in one possible implementation, the second heat spreader 22 extends along the second direction y and has a first end and a second end disposed opposite to each other in the second direction y, the first end being disposed within the top region 101 and the second end extending to the end where the battery compartment region 102 meets the bottom region 103.

[0124] Furthermore, in one possible implementation, the second heat spreader 22 may also extend into the bottom region 103 to maximize the use of the space of the electronic device 100 in the second direction y. The second heat spreader 22 extends to both sides of the accommodating space 10 in the third direction x.

[0125] This can be understood as follows: the second heat spreader 22 can also extend into the battery compartment area 102 or even the bottom area 103 in the second direction y. Furthermore, in the third direction x, the second heat spreader 22 also extends to both sides of the accommodating space 10, thereby ensuring that the second heat spreader 22 can also have a large heat dissipation area and better heat dissipation performance.

[0126] The above is a detailed description of a complete embodiment of this application. Another possible implementation described above will be described below with reference to the accompanying drawings.

[0127] Please see Figures 11a-15 , Figure 11a This is an exploded structural diagram of the second embodiment of the electronic device described in this application; Figure 11b This is an exploded structural diagram from another perspective of the second embodiment of the electronic device of this application. Figure 12 This is a schematic diagram of the cooperative structure of the heat dissipation structure, circuit board, circuit board bracket and heat source in the second embodiment of the electronic device of this application; Figure 13 for Figure 12 A magnified view of a portion of region B in the middle; Figure 14 for Figure 13 A schematic diagram of the decomposed structure; Figure 15 This is a schematic diagram of the heat dissipation structure, screen, and mid-frame in the second embodiment of the electronic device of this application.

[0128] like Figures 11a-15 As shown above, in another possible implementation, in the first direction z, the two sides of the first heat spreader 21 are thermally coupled to the heat-conducting sheet 23 and the second heat spreader 22, respectively. The heat-conducting sheet 23 is thermally coupled to the heat source 31, and the second heat spreader 22 is thermally coupled to the screen 4. This allows the heat generated by the heat source 31 to be conducted to the middle frame 1 and the screen 4 through the heat-conducting sheet 23, the first heat spreader 21, and the second heat spreader 22. In this case, the heat-conducting sheet 23 is thermally coupled to the heat source 31, and the second heat spreader 22 is thermally coupled to the screen 4. The heat transfer path is as follows: first, it is transferred to the heat-conducting sheet 23; then, it is transferred from the heat-conducting sheet 23 to the first heat spreader 21 and the middle frame 1; then, it is transferred from the first heat spreader 21 to the second heat spreader 22; and finally, it is transferred from the second heat spreader 22 to the screen 4.

[0129] Those skilled in the art will understand that the heat-conducting sheet 23 and the second heat-spreading plate 22 in the second embodiment can adopt the aforementioned heat-conducting sheet structure and second heat-spreading plate structure, which will not be repeated here. This section focuses on describing the specific structure and cooperation method of the first heat-spreading plate 21 and the circuit board support 32, which differ from those in the first embodiment.

[0130] Please see Figures 16-17 , Figure 16 This is a schematic diagram of the circuit board support structure in the second embodiment of the electronic device of this application; Figure 17 This is a schematic diagram of the first heat spreader structure in the second embodiment of the electronic device of this application.

[0131] like Figures 16-17 As shown, and in combination Figures 11a-12 It is understood that, in another possible implementation, the first heat spreader 21 can be configured as a separate structure completely independent of the circuit board support 32. This avoids the structural strength problem caused by the circuit board support 32 being completely set as the lower cover 213 of the first heat spreader 21, thereby extending the service life of the electronic device 100.

[0132] In another possible implementation, the first heat spreader 21 can also be configured as a structure that is relatively independent of the circuit board support 32.

[0133] Please see Figure 18 , Figure 18 This is a schematic diagram of the cooperative structure of the first heat spreader and the circuit board bracket in the third embodiment of the electronic device of this application.

[0134] like Figure 18 As shown, and in combination Figures 5-7 It is understood that, in one possible implementation, when the two sides of the heat-conducting sheet 23 are thermally coupled to the first heat-spreading plate 21 and the second heat-spreading plate 22 respectively, the circuit board support 32 is provided with a hollow part 321, and the first heat-spreading plate 21 is embedded in the hollow part 321.

[0135] When the two sides of the first heat spreader 21 are thermally coupled to the heat-conducting sheet 23 and the second heat spreader 22 respectively, the heat-conducting sheet 23 is attached to the circuit board support 32, and the circuit board support 32 is attached to the heat source 31, so that the heat-conducting sheet 23 is thermally coupled to the heat source 31 through the circuit board support 32.

[0136] This can be understood as follows: the circuit board support 32 is partially hollowed out, and a first heat dissipation plate 21 is set inside the hollowed-out portion 321, so that the first heat dissipation plate 21 no longer occupies space of the electronic device 100 in the first direction z. This is beneficial for the thinning and miniaturization of the electronic device 100. It achieves a comprehensive advantage in heat dissipation performance and structural strength.

[0137] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An electronic device, characterized in that, include: A screen and a mid-frame are stacked in the thickness direction of the electronic device. The mid-frame includes a base plate, which includes a first surface and a second surface disposed opposite to each other. The second surface faces the screen, and a receiving space is formed between the screen and the second surface. Both the heat source and the heat dissipation structure are disposed within the accommodating space; the heat dissipation structure includes a first heat dissipation plate; as well as The first circuit board and the circuit board support are both disposed within the accommodating space; the first circuit board is fixed between the base plate and the circuit board support, the circuit board support is provided with a hollow portion, the first heat spreader is embedded in the hollow portion, the heat source is installed on the first circuit board, and the first heat spreader is thermally coupled to the heat source.

2. The electronic device as claimed in claim 1, characterized in that, The heat dissipation structure includes a heat-conducting sheet, which is stacked with the first heat dissipation plate in the thickness direction of the electronic device.

3. The electronic device as described in claim 2, characterized in that, The heat-conducting sheet is thermally coupled to the first heat spreader.

4. The electronic device as described in claim 2 or 3, characterized in that, The heat-conducting sheet is disposed between the screen and the first heat-spreading plate.

5. The electronic device as described in any one of claims 2-4, characterized in that, The projection of the heat-conducting sheet on the first plane at least partially covers the projection of the first heat spreader on the first plane, wherein the first plane is perpendicular to the thickness direction of the electronic device.

6. The electronic device according to any one of claims 2-5, characterized in that, The heat-conducting sheet extends to both sides of the receiving space in the width direction of the electronic device.

7. The electronic device as claimed in any one of claims 2-6, characterized in that, The material of the heat-conducting sheet includes graphite or graphene; or, the heat-conducting sheet is a metal sheet made of a metallic material.

8. The electronic device according to any one of claims 2-7, characterized in that, The accommodating space has a top region, a battery compartment region, and a bottom region arranged sequentially along the length of the electronic device; The heat source is located in the top region, and at least a portion of the heat-conducting sheet is located in the top region.

9. The electronic device as claimed in claim 8, characterized in that, The heat-conducting sheet extends from the top region along the length of the electronic device into the battery compartment region.

10. The electronic device as claimed in claim 8, characterized in that, The heat-conducting sheet extends to the end where the battery compartment area meets the bottom area.

11. The electronic device according to any one of claims 8-10, characterized in that, A second circuit board is provided in the bottom area.

12. The electronic device according to any one of claims 1-11, characterized in that, The first heat spreader includes a lower cover plate, a capillary structure, and an upper cover plate stacked in the thickness direction of the electronic device. The lower cover plate and the upper cover plate are sealed together to form a closed cavity. A cooling medium is provided inside the closed cavity, and the capillary structure is disposed inside the closed cavity.

13. The electronic device as claimed in claim 12, characterized in that, The lower cover of the first heat spreader is in contact with the heat source, and the upper cover of the first heat spreader is in contact with one side of the heat-conducting sheet of the heat dissipation structure.

14. The electronic device according to any one of claims 1-13, characterized in that, The circuit board bracket is fixed to the base plate of the middle frame.

15. The electronic device according to any one of claims 1-14, characterized in that, The circuit board support extends to both sides of the receiving space in the width direction of the electronic device.

16. The electronic device according to any one of claims 1-15, characterized in that, A thermal interface material is provided between the first heat spreader and the heat source.

17. The electronic device as claimed in claim 16, characterized in that, The thermal interface material includes graphite or graphene thermally conductive pads.

18. The electronic device according to any one of claims 1-17, characterized in that, The heat source includes at least one of a system-on-a-chip, a central processing unit, a charging chip, a general-purpose flash memory chip, or an image processor.

19. The electronic device according to any one of claims 1-18, characterized in that, The first circuit board is a motherboard, and the circuit board bracket is a motherboard bracket.

20. The electronic device according to any one of claims 1-19, characterized in that, The mid-frame also includes a frame that surrounds the outer perimeter of the electronic device, and the base plate and the frame are an integral structure.

21. The electronic device as claimed in claim 20, characterized in that, The frame is a metal frame.

22. The electronic device according to any one of claims 1-21, characterized in that, It also includes a back cover, which is disposed opposite to the screen, with the first surface facing the back cover.

23. The electronic device as claimed in claim 22, characterized in that, The back cover is a glass back cover.

24. The electronic device according to any one of claims 1-23, characterized in that, The first heat spreader is set up completely independently from the circuit board bracket.

25. The electronic device according to any one of claims 1-24, characterized in that, The screen and the mid-frame are fixedly connected.

26. The electronic device according to any one of claims 22-25, characterized in that, The back cover of the electronic device is attached to the base plate.

27. The electronic device according to any one of claims 22-26, characterized in that, A receiving space is formed between the screen and the second surface, and the receiving space is used to install the battery.

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