A semiconductor process apparatus

Abstract

The application discloses a semiconductor process equipment, which comprises a cavity, a cavity cover, a rack assembly, a lifting assembly and a driving assembly. The cavity cover is arranged above the cavity; the rack assembly is arranged above the cavity cover and fixedly connected to the cavity cover at one end; the lifting assembly comprises a first fixed rod and a movable rod, one end of the first fixed rod is fixedly connected to the upper side of the cavity, the other end of the first fixed rod extends upward through the cavity cover, the movable rod is movably connected to the first fixed rod and the top end of the movable rod supports the rack assembly; and the driving assembly drives the movable rod to move relative to the first fixed rod. The semiconductor process equipment of the application drives the cavity cover to move upward by the lifting assembly so as to separate the cavity cover from the cavity, thereby reducing the occupation of the space around the semiconductor process equipment; and the lifting main nut is arranged on the movable rod, when the cavity cover is closed on the cavity, the cavity cover and the cavity are locked by the weight of the cavity cover and other locking structures, thereby avoiding that the lifting assembly exerts excessive load between the cavity cover and the cavity to cause overload failure of the movable rod.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment, and more particularly to a semiconductor process equipment. Background Technology

[0002] Existing semiconductor process equipment typically includes a cavity and a cavity cover, with the wafer undergoing processing within the cavity. A cavity cover is positioned above the cavity, and the cavity cover is detachably connected to the cavity. When maintenance is required inside the cavity, the cavity cover must be lifted upwards or removed to allow for processing within the cavity.

[0003] Because the cavity cover is large and heavy, lifting equipment is needed to assist in lifting it. Currently, the lifting equipment is located around the semiconductor process equipment, occupying the surrounding space. When the semiconductor process equipment is processing wafers, other equipment needs to be placed around it, such as equipment for feeding wafers into or removing them from the cavity. This makes it easy for other equipment around the semiconductor process equipment to interfere with the lifting equipment, requiring adjustments to the relative positions of the lifting equipment and other equipment to ensure each device functions properly. This complicates the operation of the semiconductor process equipment. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor process apparatus that can reduce or even eliminate the space below the cavity occupied by the lifting assembly.

[0005] To achieve the above objectives, the present invention provides a semiconductor process apparatus comprising:

[0006] cavity;

[0007] A cavity cover is disposed above the cavity body;

[0008] A rack assembly is disposed above the cavity cover, and one end of the rack assembly is fixedly connected to the cavity cover;

[0009] The lifting assembly includes a first fixed rod and a movable rod. One end of the first fixed rod is fixedly connected to the upper side of the cavity, and the other end of the first fixed rod extends upward through the cavity cover. One end of the movable rod is movably connected to the first fixed rod and can move vertically relative to the first fixed rod. The top end of the movable rod supports the frame assembly.

[0010] A drive assembly is connected to the movable rod, and the drive assembly drives the movable rod to move vertically relative to the first fixed rod.

[0011] Optionally, the semiconductor process equipment further includes a coupling, the drive assembly includes a motor, the movable rod includes a lead screw, and the output shaft of the motor and the lead screw are connected via the coupling.

[0012] Optionally, the motor is located at the edge of the frame assembly, and the coupling is located along the edge of the frame assembly.

[0013] Optionally, the semiconductor process equipment includes two lifting components, the cavity and the cavity cover have a polygonal horizontal cross-sectional shape, and the two lifting components are arranged diagonally along the cavity cover.

[0014] Optionally, the frame assembly includes multiple first crossbeams and support columns located at the four corners of the cavity cover. The two ends of the first crossbeams are connected to the ends of the support columns away from the cavity cover. A connecting plate is provided at the intersection of two adjacent first crossbeams. The movable rod is arranged parallel to the support column, and the top end of the movable rod is supported on the lower side of the connecting plate.

[0015] Optionally, the semiconductor process equipment further includes a motor mounting plate, the coupling is arranged parallel to the first crossbeam, and the motor is fixedly mounted to the first crossbeam via the motor mounting plate.

[0016] Optionally, the semiconductor process equipment further includes a worm gear assembly, which includes a worm wheel and a worm gear that are meshed together. The worm wheel is fixedly connected to the top of the lead screw, and the worm gear is connected to the output end of the motor through the coupling.

[0017] Optionally, the semiconductor process equipment further includes a guiding assembly, comprising a second fixed rod and a sliding guide rod. One end of the second fixed rod is fixedly connected to the upper side of the cavity, and the other end of the second fixed rod extends upward through the cavity cover. A guide portion is provided on the second fixed rod, and the sliding guide rod is slidably connected to the second fixed rod through the guide portion.

[0018] Optionally, the horizontal cross-sectional shape of the cavity and the cavity cover is quadrilateral, and the guide assembly and the lifting assembly are respectively disposed at different positions at the four corners of the cavity cover.

[0019] Optionally, the second fixed rod has a guide hole at its center along its axial direction, the sliding guide rod is disposed in the guide hole, the guide hole is provided with a retainer for accommodating the roller body, the retainer is provided with a rolling element, and the second fixed rod and the sliding guide rod are slidably connected through the rolling element.

[0020] Optionally, the semiconductor process equipment further includes a lifting main nut, the movable rod has an external thread on its body, and the lifting main nut and the movable rod are threaded together; the top end of the first fixed rod is provided with a limiting screw, which is movably connected to the lifting main nut, restricting the lifting main nut to move only between the upper limit position and the lower limit position along the axial direction of the first fixed rod.

[0021] Optionally, the lifting main nut includes a nut body and a limiting part. The nut body and the movable rod are threadedly connected. The limiting part surrounds the nut body and has a through hole. The limiting screw passes through the through hole on the limiting part and is threadedly connected to the fixed rod.

[0022] Optionally, the semiconductor process equipment further includes a detection nut, which is threadedly connected to the movable rod, and the detection nut is initially installed at a position higher than the upper limit of the lifting main nut.

[0023] Optionally, the cavity includes at least four reaction chambers, and the lifting assembly is located outside the area enclosed by the four reaction chambers.

[0024] Optionally, the frame assembly further includes a second crossbeam, which is arranged parallel to the first crossbeam and located below the first crossbeam, with both ends of the second crossbeam connected to the support column.

[0025] Optionally, the semiconductor process equipment further includes a lower support frame assembly, which is disposed at the bottom of the cavity and supports the cavity.

[0026] In summary, compared with the prior art, the semiconductor process equipment provided by the present invention has the following advantages:

[0027] Beneficial effects:

[0028] The semiconductor process equipment of the present invention, by setting a lifting assembly and a driving assembly above the cavity, allows the driving assembly to move the cavity cover upward through the lifting assembly, thereby detaching the cavity cover from the cavity. This facilitates maintenance of the cavity interior and saves space around the semiconductor process equipment. Furthermore, a lifting master nut is provided on the movable rod, so that when the cavity cover is closed on the cavity, the lifting assembly does not apply a load between the cavity cover and the cavity. The cavity cover is locked by its own weight and other locking structures, preventing the lifting assembly from applying excessive load between the cavity cover and the cavity, which could cause the movable rod to fail due to overload. In addition, a detection nut is provided to detect the wear of the movable rod, achieving qualitative detection of wear on the movable rod through a simple structure and realizing the detection of the amount of wear on the movable rod at low cost. Attached Figure Description

[0029] Figure 1This is a schematic diagram of the overall structure of the semiconductor process equipment of the present invention.

[0030] Figure 2 This is a schematic diagram of the lifting assembly of the semiconductor process equipment of the present invention.

[0031] Figure 3 This is a schematic diagram of the assembly structure of the lifting main nut and the detection nut of the semiconductor process equipment of the present invention.

[0032] Explanation of reference numerals in the attached figures:

[0033] Semiconductor process equipment 10

[0034] Cavity 110

[0035] Reaction chamber 111

[0036] Cavity cover 120

[0037] Rack assembly 130

[0038] First crossbeam 131

[0039] Support column 132

[0040] Connector plate 133

[0041] Second crossbeam 134

[0042] Lifting component 140

[0043] First fixing rod 141

[0044] Limit screw 1411

[0045] 1412, the base

[0046] 142 movable bar

[0047] Driver component 150

[0048] Coupling 160

[0049] Motor mounting plate 170

[0050] Worm Gear Assembly 180

[0051] Worm Gear 181

[0052] worm gear 182

[0053] Guide component 190

[0054] Lifting main nut 200

[0055] Nut body 201

[0056] Limiting part 202

[0057] Test nut 210

[0058] Lower support frame assembly 220 Detailed Implementation

[0059] The following will be combined with the appendix in the embodiments of the present invention. Figure 1 ~Attached Figure 3 The technical solutions, structural features, objectives and effects achieved in the embodiments of the present invention will be described in detail.

[0060] It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions. They are only used to facilitate and clarify the purpose of illustrating the embodiments of the present invention, and are not intended to limit the implementation conditions of the present invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationship, or adjustments to the size should still fall within the scope of the technical content disclosed in the present invention, provided that they do not affect the effects and objectives that the present invention can produce.

[0061] It should be noted that, in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only the expressly listed elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0062] like Figure 1 As shown, the present invention provides a semiconductor process equipment 10, including a cavity 110, a cavity cover 120, a rack assembly 130, a lifting assembly 140, and a drive assembly 150.

[0063] The cavity 110 contains a reaction chamber 111, within which wafer processing is performed. This processing is not limited to vapor deposition and etching; examples include plasma-enhanced vapor deposition and plasma-enhanced atomic layer deposition. A cavity cover 120 is positioned above the cavity 110 to close the opening above it. In one embodiment, a sealing assembly can be provided between the cavity cover 120 and the cavity 110. When the cavity cover 120 is closed, the sealing assembly achieves a seal between the cavity cover 120 and the cavity 110, preventing the leakage of reaction gas from the cavity 110 through the cavity cover 110 and the cavity cover 120. In other embodiments, a sealing assembly may not be provided between the cavity cover 120 and the cavity 110; the seal is achieved solely through the contact surfaces between the cavity 110 and the cavity cover 120.

[0064] In the semiconductor process equipment 10 of the present invention, a frame assembly 130 is provided above the cavity cover 120. The frame assembly 130 is used to mount a lifting assembly 140 and a drive assembly 150. The two ends of the lifting assembly 140 are fixedly connected to the cavity 110 and the frame assembly 130, respectively, and the bottom of the frame assembly 130 is fixedly connected to the cavity cover 120. The drive assembly 150 drives the lifting assembly 140 to move the cavity cover 120 toward or away from the cavity 110, thereby achieving the closing or opening of the cavity cover 120 and the cavity 110.

[0065] In this invention, the frame assembly 130, the lifting assembly 140, and the driving assembly 150 for driving the cavity cover 120 and the cavity 110 to close or separate are all located above the cavity 110, and do not occupy the horizontal space around the cavity 110 at the same height as the cavity 110 or the space below the cavity 110, so that other equipment can be installed around the cavity 110, thereby improving the space utilization around the cavity 110.

[0066] like Figure 1 and Figure 2 As shown, the lifting assembly 140 includes a first fixed rod 141 and a movable rod 142. The bottom end of the first fixed rod 141 is fixedly connected to the upper side of the cavity 110. A through hole is provided on the cavity cover 120 for the first fixed rod 141 to pass through. The other end of the first fixed rod 141 extends vertically upward through the through hole on the cavity cover 120. The top end of the movable rod 142 is supported on the frame assembly 130. The other end of the movable rod 142 extends vertically downward and is movably connected to the first fixed rod 141. The movable rod 142 can move vertically relative to the first fixed rod 141 under the drive of the drive assembly 150, thereby lifting the frame assembly 130 upward or lowering the frame assembly 130.

[0067] Specific examples Figure 2 As shown, in this embodiment, the bottom of the first fixing rod 141 is a solid rod segment for connection with the cavity 110. For example, a threaded hole can be opened on the solid rod segment at the bottom of the first fixing rod 141, and a through hole can be opened on the cavity 110. A screw passes through the through hole on the cavity 110 and is threadedly connected to the first fixing rod 141 to connect the cavity 110 and the first fixing rod 141. In other embodiments, the cavity 110 and the first fixing rod 141 can also be connected by other methods such as welding, and the specific connection method is not limited here. Alternatively, the first fixing rod 141 can be a hollow rod body, with a threaded hole opened on the bottom wall of the first fixing rod 141 for connection with the cavity 110. The specific internal structure of the first fixing rod 141 is not limited here, as long as it can achieve a fixed connection with the cavity 110. The upper part of the first fixing rod 141 is hollow for the insertion of the movable rod 142.

[0068] Continue as Figure 1 As shown, in this embodiment, the drive assembly 150 includes a motor. The semiconductor process equipment 10 also includes a coupling 160 and a worm gear assembly 180 (e.g., Figure 2 As shown, the worm gear assembly 180 includes a worm gear 181 and a worm 182 that are meshed together. The movable rod 142 is a lead screw, with the worm gear 181 fixedly connected to the top of the lead screw. The worm 182 is connected to the output shaft of the motor via a coupling 160. The helix angle of the worm 182 is less than the equivalent friction angle. This configuration gives the meshing structure of the worm gear 181 and worm 182 a self-locking property, and the load transfer between the worm gear 181 and worm 182 is unidirectional. That is, only the worm 182 can drive the worm gear 181 to rotate, and conversely, the worm gear 181 cannot drive the worm 182 to rotate.

[0069] The drive assembly 150 is a motor, and the output shaft of the motor is connected to the movable rod 142. The motor drives the movable rod 142 to rotate so as to move relative to the first fixed rod 141. The output characteristics of the motor are stable and easy to adjust, and it can achieve precise movement by driving the movable rod 142 through the motor.

[0070] In a preferred embodiment, the drive assembly 150 is a motor, and a coupling 160 is provided between the motor and the movable rod 142. A worm gear 181 and a worm 182 are also provided between the movable rod 142 and the coupling 160. The output torque of the motor is transmitted to the worm 182 through the horizontally positioned and rotating coupling 160. The worm 182 drives the worm gear 181 to rotate. The worm gear 181 is fixedly connected to the lead screw, causing the vertically positioned movable rod 142 to rotate inside the first fixed rod 141. This ultimately allows the movable rod 142 to move up and down relative to the first fixed rod 141. Since the bottom of the first fixed rod 141 is fixedly connected to the cavity 110, the lead screw, acting as the movable rod 142, moves vertically relative to the first fixed rod 141. The top of the movable rod 142 is supported by the frame assembly 130, and the bottom of the frame assembly 130 is fixedly connected to the cavity cover 120. This allows the motor-driven movable rod 142 to move relative to the first fixed rod 141, causing the frame assembly 130, together with the cavity cover 120, to move upward away from the cavity 110, or causing the frame assembly 130, together with the cavity cover 120, to move downward and close onto the cavity 110.

[0071] In other embodiments, the specific structure of the drive assembly 150 may not be limited to a motor. Correspondingly, the load transmission structure between the drive assembly 150 and the movable rod 142 is also adjusted according to the specific selection of the drive assembly 150. In other embodiments, a hydraulic cylinder or a pneumatic cylinder may also be used as the drive assembly 150. By connecting the output end of the hydraulic cylinder or pneumatic cylinder to the movable rod 142, the movable rod 142 is driven to move relative to the first fixed rod 141, thereby causing the cavity cover 120 and the cavity 110 to separate or close through the frame assembly 130.

[0072] In this embodiment, as Figure 3 As shown, the relative movement between the movable rod 142 and the first fixed rod 141 is achieved by a lifting main nut 200 movably mounted on the movable rod 142. Specifically, the vertical movement of the movable rod 142 relative to the first fixed rod 141 is achieved through the relative movement of the three components: the movable rod 142, the lifting main nut 200, and the first fixed rod 141.

[0073] The movable rod 142 has an external thread on its body, and the lifting main nut 200 with an internal thread is connected to the movable rod 142 by the thread. The lifting main nut 200 can move up and down relative to the movable rod 142 along its axis by rotating relative to the movable rod 142.

[0074] The top end of the first fixing rod 141 is provided with a stop portion 1412 perpendicular to its axis. The stop portion 1412 has a thickness in the vertical direction and has a threaded hole thereon. The top end of the first fixing rod 141 is provided with a limiting screw 1411. The limiting screw 1411 is a semi-threaded screw. The part of the bottom of the limiting screw 1411 with threads is the first rod body, and the part of the upper part of the rod body without threads is the second rod body. The diameter of the second rod body is larger than the outer diameter of the first rod body. When the limiting screw 1411 is tightened into the threaded hole on the abutment part 1412, the first threaded rod is fully screwed into the threaded hole on the abutment part 1412, and the bottom of the second rod abuts against the abutment part 1412 to achieve the threaded connection between the limiting screw 1411 and the abutment part 1412. The relative position between the limiting screw 1411 and the abutment part 1412 is fixed, and the limiting screw 1411 cannot continue to be screwed into the threaded hole on the abutment part 1412, thus avoiding unnecessary relative movement between the limiting screw 1411 and the abutment part 1412.

[0075] When the limit screw 1411 is tightened into the threaded hole on the abutment part 1412, the head of the limit screw 1411 and the abutment part 1412 work together to limit the lifting main nut 200. Specifically, the head of the limit screw 1411 limits the lifting main nut 200 to its upper limit position, i.e., the upper limit position; the abutment part 1412 limits the lifting main nut 200 to its lower limit position, i.e., the lower limit position. This limits the vertical movement range of the lifting main nut 200 when the movable rod 142 and the lifting main nut 200 rotate relative to each other.

[0076] In this embodiment, a lifting main nut 200 is provided between the movable rod 142 and the first fixed rod 141. The movable rod 142 and the first fixed rod 141 move relative to each other via the lifting main nut 200. After the lifting main nut 200, the first fixed rod 141, and the movable rod 142 are installed, the initial position of the lifting main nut 200 is between the upper limit position and the lower limit position, at which point the cavity cover 120 is closed above the cavity 110. To move the cavity cover 120 upwards away from the cavity 110, the drive assembly 150 drives the movable rod 142 to rotate relative to the first fixed rod 141. During the rotation of the movable rod 142, the lifting main nut 200, due to the limiting effect of the limiting screw 1411, can only move linearly along the axis of the movable rod 142 and will not rotate around the movable rod 142. The lifting main nut 200 moves downward until the bottom end of its limiting part 202 abuts against the first fixed rod 141. At this time, the movable rod 142 continues to rotate, and the lifting main nut 200 has a tendency to move downward relative to the movable rod 142. However, due to the limiting effect of the first fixed rod 141 on the lifting main nut 200, the lifting main nut 200 cannot continue to move downward. At this time, the movable rod 142 can only move upward, and the top end of the movable rod 142 is supported by the frame assembly 130. The frame assembly 130 is fixedly connected to the cavity cover 120. The upward movement of the movable rod 142 causes the cavity cover 120 to move upward and separate from the cavity 110.

[0077] When the cavity cover 120 needs to move downwards to close onto the cavity 110, the drive assembly 150 drives the movable rod 142 to rotate in the opposite direction relative to the first fixed rod 141. When the movable rod 142 rotates in the opposite direction, the lifting main nut 200 tends to move upwards along the axis of the movable rod 142. In the initial state, there is a vertical distance between the cavity cover 120 and the cavity 110. The bottom end of the lifting main nut 200 is pressed against the first fixed rod 141, and the frame assembly 130 connected to the cavity cover 120 is pressed against the top of the movable rod 142. The motor drives the movable rod 142 to rotate. At this time, the lifting main nut 200 and the first fixed rod 141 remain relatively stationary. The movable rod 142 moves downwards in the vertical direction, and the cavity cover 120 also moves downwards until it closes onto the upper part of the cavity 110.

[0078] When the cavity cover 120 is closed on the upper part of the cavity 110, the drive assembly 150 continues to drive the movable rod 142 to rotate. The frame assembly 130 connected to the cavity cover 120 and the movable rod 142 can no longer move downwards. At this time, the relative movement between the movable rod 142 and the lifting main nut 200 causes the lifting main nut 200 to move upwards along the axis of the movable rod 142 and disengage from the first fixed rod 141. After disengagement, the drive assembly 150 stops driving the movable rod 142 to rotate. In this state, the cavity cover 120 closes to the cavity 110 by its own weight, and a reliable sealed connection is maintained between the cavity cover 120 and the cavity 110 through the sealing assembly and other locking devices. The lifting assembly 140 and drive assembly 150 do not apply a load between the cavity 110 and the cavity cover 120.

[0079] By setting a lifting master nut 200 on the movable rod 142, it is avoided that when the cavity cover 120 is already closed on the cavity 110, the lifting assembly 140 and the drive assembly 150 continuously apply load between the cavity 110 and the cavity cover 120, resulting in excessive load between the cavity 110 and the cavity cover 120, which could cause the sealing assembly to fail or the transmission structure in the lifting assembly 140 to fail due to excessive load.

[0080] In this embodiment, the lifting main nut 200 includes a nut body 201 and a limiting part 202. The nut body 201 and the movable rod 142 are threadedly connected. The limiting part 202 surrounds the nut body 201 and has a through hole. A limiting screw 1411 passes through the through hole in the limiting part 202 and is threadedly connected to the abutment part 1412. The limiting screw 1411 is fixedly disposed relative to the first fixed rod 141. The limiting screw 1411 engages with the through hole in the lifting main nut 200, so that the lifting main nut 200 can only move up and down along the axial direction of the limiting screw 1411. Since the axial direction of the limiting screw 1411 is the same as the axial direction of the first fixed rod 141 and the movable rod 142, the lifting main nut 200 can only move up and down along the axial direction of the movable rod 142 under the limiting action of the limiting screw 1411. The limiting screw 1411 serves to restrict the rotation of the lifting main nut 200 around the axis of the movable rod 142.

[0081] In this embodiment, four threaded holes are evenly distributed circumferentially on the abutment portion 1412 of the first fixing rod 141, and four limiting screws 1411 are provided opposite to each other. When the limiting screws 1411 limit the lifting main nut 200, it is necessary to restrict the rotation of the lifting main nut 200 around the movable rod 142. During this process, the lifting main nut 200 has a reaction force on the limiting screws 1411. By providing four limiting screws 1411 circumferentially along the abutment portion 1412, the reaction force of the lifting main nut 200 can be borne by the four limiting screws 1411 respectively, reducing the reaction force borne by a single limiting screw 1411, thus ensuring the limiting effect on the lifting main nut 200 and preventing the lifting main nut 200 from rotating around the movable rod 142.

[0082] In addition to restricting the degree of freedom of rotation of the lifting main nut 200 around the movable rod 142, the limiting screw 1411, because its head diameter is larger than the through hole diameter of the lifting main nut 200, also restricts the lifting main nut 200 to the highest position of upward movement along the axis of the movable rod 142. Due to the combined restraining effect of the limiting screw 1411 and the abutment portion 1412 of the first fixed rod 141 on the limiting portion 202 of the lifting main nut 200, the lifting main nut 200 can only move between the upper limit position and the lower limit position along the axial direction of the first fixed rod 141.

[0083] The upper limit position of the lifting main nut 200 is when the lifting main nut 200 moves upward along the axis of the movable rod 142 until the top of the limiting part 202 abuts against the screw head of the limiting screw 1411. The lower limit position is when the lifting main nut 200 moves downward until the bottom of the limiting part 202 abuts against the abutting part 1412 of the fixed part.

[0084] In a preferred embodiment, the drive assembly 150 is a motor, and a coupling 160, a worm gear 181, and a worm 182 are provided between the motor and the movable rod 142. In this embodiment, the motor drives the movable rod 142 to rotate through the worm gear 181 and the worm 182. A lifting column nut 200 is provided between the movable rod 142 and the first fixed rod 141. The process by which the movable rod 142 drives the cavity cover 120 to disengage from the cavity 110 or the cavity cover 120 to close onto the cavity 110 is similar to the aforementioned process and will not be described again here.

[0085] like Figure 3As shown, in this embodiment, a detection nut 210 is also provided above the lifting main nut 200. The detection nut 210 is threadedly connected to the movable rod 142, and the detection nut 210 is initially installed at a position higher than the upper limit of the lifting main nut 200. The detection nut 210 is installed on the movable rod 142, and there is no load between the detection nut 210 and the movable rod 142. Therefore, when the movable rod 142 rotates, the detection nut 210 will rotate with the movable rod 142. In a preferred embodiment, a set screw can be provided between the detection nut 210 and the movable rod 142 to position the detection nut 210 and the movable rod 142, preventing accidental rotation between the detection nut 210 and the movable rod 142.

[0086] In a preferred embodiment, both the detection nut 210 and the lifting main nut 200 are made of brass, while the movable rod 142 is made of alloy steel or stainless steel. Since the load of the lifting assembly 140 when it drives the cavity cover 120 away from the cavity 110 is ultimately transmitted between the movable rod 142 and the lifting main nut 200, a significant load exists between them. Because alloy steel or stainless steel has lower strength than brass, wear on the movable rod 142, made of alloy steel or stainless steel, primarily occurs during load transmission. This wear leads to an increase in the actual pitch of the movable rod 142; that is, as the wear process progresses, the distance between corresponding points of adjacent threads in the threaded portion where the movable rod 142 meshes with the lifting main nut 200 gradually increases. The pitch of the worn section is greater than the pitch of the unworn section of the movable rod 142. After completing multiple cycles of separation and engagement between the cavity cover 120 and the cavity 110, the pitch of the movable rod 142 increases due to thread wear. Since there is no load between the detection nut 210 and the movable rod 142, the meshing threads between the detection nut 210 and the movable rod 142 do not wear, and the relative position between the detection nut 210 and the movable rod 142 does not change.

[0087] Due to thread wear, even though the lifting main nut 200 moves to the upper limit position, the actual vertical height of the lifting main nut 200 is lower than the initial vertical height. At this time, the distance d between the lifting main nut 200 and the detection nut 210 increases. By monitoring the distance d between the lifting main nut 200 and the detection nut 210, the wear of the movable rod 142 and whether it needs to be replaced can be determined.

[0088] By monitoring the distance d between the lifting main nut 200 and the detection nut 210, the thread wear of the movable rod 142 can be detected without removing the movable rod 142. The detection method using the detection nut 210 has the advantages of being simple and efficient.

[0089] In other embodiments, the lifting main nut 200 may not be provided. Instead, matching threads may be provided on the movable rod 142 and the first fixed rod 141. By driving the movable rod 142 to rotate relative to the first fixed rod 141, the movable rod 142 may move relative to the first fixed rod 141 along its axial direction. This will cause the cavity cover 120 and the cavity 110 to separate or close through the frame assembly 130.

[0090] Continue as Figure 1 As shown, the frame assembly 130 includes multiple first crossbeams 131 and support columns 132 located at the four corners of the cavity cover 120. Four support columns 132 are respectively provided at the four corners of the cavity cover 120. The bottom of each support column 132 is fixedly connected to the upper surface of the cavity cover 120, and the support column 132 extends vertically upwards. Adjacent support columns 132 are connected in pairs by the first crossbeams 131, and both ends of the first crossbeams 131 are connected to the ends of the support columns 132 away from the cavity cover 120. The frame structure formed by the first crossbeams 131 and the support columns 132 enhances the stability of the connection structure between the frame assembly 130 and the cavity cover 120.

[0091] In this embodiment, a connecting plate 133 is provided at the intersection of two adjacent first crossbeams 131. The connecting plate 133 is triangular and has a certain thickness. The two adjacent sides of the triangular connecting plate 133 are respectively connected to the two first crossbeams 131. Triangles have stability, and by connecting adjacent first crossbeams 131 through the triangular connecting plate 133, the stability of the frame assembly 130 is further improved.

[0092] In a more preferred embodiment, the rack assembly 130 further includes a second crossbeam 134. The second crossbeam 134 is the same number as the first crossbeam 131, is arranged parallel to it, and is located below the first crossbeam 131. Both ends of the second crossbeam 134 are connected to support columns 132. By providing the second crossbeam 134, the connection strength between the support columns 132 is further enhanced, improving the overall connection strength and structural reliability of the rack assembly 130.

[0093] Furthermore, in this embodiment, the movable rod 142 is arranged parallel to the support column 132, the top end of the movable rod 142 is supported on the lower side of the connecting plate 133, and the movable rod 142 is connected to the frame assembly 130 through the connecting plate 133 to transmit load.

[0094] In this embodiment, the semiconductor process equipment 10 also includes a motor mounting plate 170, which is fixedly mounted to the rack assembly 130. The motor is mounted on the edge of the rack assembly 130 via the motor mounting plate 170. This configuration allows for the connection between the motor and the rack assembly 130 solely through the motor mounting plate 170, simplifying the connection structure. In other embodiments, the motor can also be placed in other positions, such as the middle, to accommodate the placement of various structures within the rack assembly 130.

[0095] The coupling 160 is disposed along the edge of the frame assembly 130. Specifically, the coupling 160 is disposed parallel to the first crossbeam 131, and the motor is fixedly mounted to the first crossbeam 131 via a motor mounting plate 170. Both the motor and the coupling 160 are disposed at the edge of the first crossbeam 131 and are located inside the frame structure formed by multiple first crossbeams 131, which simplifies the structure of the drive assembly 150 and the frame assembly 130 and improves the overall reliability of the device.

[0096] Because the cavity cover 120 has a large overall mass, and the lifting assembly 140 needs to drive additional structures such as the frame assembly 130 and drive assembly 150 during lifting, the load on the movable rod 142 and the lifting main nut 200 in a single lifting assembly 140 is excessive. Excessive load leads to increased wear at the connection between the movable rod 142 and the lifting main nut 200, accelerating the wear and failure process of the lifting assembly 140. In a preferred embodiment, the semiconductor process equipment 10 includes two lifting assemblies 140. The horizontal cross-sectional shape of the cavity 110 and the cavity cover 120 is polygonal, such as rectangular, and the two lifting assemblies 140 are arranged diagonally along the cavity cover 120. The two lifting assemblies 140 have identical structures, and the load on the cavity cover 120 during movement relative to the cavity 110 is evenly distributed between the two lifting assemblies 140, reducing the load on each lifting assembly 140 and extending its service life.

[0097] Two sets of lifting components 140 are arranged diagonally opposite each other along the cavity cover 120, which can improve the stress condition of the frame assembly 130 connected to the cavity cover 120, avoid the frame assembly 130 being stressed on one side, make the frame assembly 130 more evenly stressed, and improve the reliability of the lifting components 140 and the frame assembly 130.

[0098] In a preferred embodiment, the semiconductor process equipment 10 further includes a guide assembly 190. When the lifting assembly 140 and the rack assembly 130 move the cavity cover 120 toward or away from the cavity 110 in a vertical direction, the guide assembly 190 guides the cavity cover 120, preventing the cavity cover 120 from deviating from the preset vertical movement direction of the lifting assembly 140 and reducing the bending load on the lifting assembly 140.

[0099] Specifically, the guide assembly 190 includes a second fixed rod and a sliding guide rod. One end of the second fixed rod is fixedly connected to the upper side of the cavity 110, and the other end extends upward through a through hole in the cavity cover 120. A guide portion is provided on the second fixed rod, and the sliding guide rod is slidably connected to the second fixed rod through the guide portion.

[0100] In this embodiment, the guide portion is a guide hole formed at the center of the second fixed rod, and the guide hole is arranged along the axial direction of the second fixed rod. A sliding guide rod is disposed within the guide hole. More preferably, a retainer for accommodating the roller body is provided within the guide hole, and a rolling element is disposed within the retainer. The second fixed rod and the sliding guide rod are slidably connected through the rolling element. The rolling element disposed between the second fixed rod and the sliding guide rod can convert the sliding friction between them into rolling friction, reducing the frictional resistance during their relative movement.

[0101] In other embodiments, the guide part may also be a guide groove formed on the second fixed rod, and the guide groove is arranged along the axial direction of the second fixed rod. The sliding guide rod is provided with a guide rail that matches the guide groove. The sliding guide rod is engaged in the guide groove and slides along the axial direction of the second fixed rod to achieve the guiding effect.

[0102] The horizontal cross-sectional shape of the cavity 110 and the cavity cover 120 is quadrilateral. In order to distribute the load as evenly as possible, the guide assembly 190 and the lifting assembly 140 are respectively located at different positions at the four corners of the cavity cover 120. The two sets of lifting assemblies 140 are arranged diagonally, and the motor is located on the side closer to one set of lifting assemblies 140. The other set of lifting assemblies 140 is connected through a transmission rod perpendicular to the coupling 160. When it is necessary to repair or replace the guide assembly 190 or the lifting assembly 140, the guide assembly 190 and the lifting assembly 140 located at different positions can avoid interference.

[0103] In this embodiment, the cavity 110 includes at least four reaction chambers 111, which are arranged in a matrix. The center line connecting the four reaction chambers 111 forms an enclosed area. The lifting assembly 140 and the guide assembly 190 are both located outside the enclosed area of ​​the four reaction chambers 111 to avoid interference between the arrangement of the lifting assembly 140 or the guide assembly 190 and the reaction chambers 111.

[0104] The semiconductor process equipment 10 also includes a lower support frame assembly 220, which is disposed at the bottom of the cavity 110 and supports the cavity 110. The lower support frame assembly 220 supports the cavity 110 vertically, leaving space below the cavity 110 for the installation of other equipment, thereby improving the utilization rate of the space below the cavity 110.

[0105] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A semiconductor process apparatus, characterized in that, include: cavity; A cavity cover is disposed above the cavity body; A rack assembly is disposed above the cavity cover, and one end of the rack assembly is fixedly connected to the cavity cover; The lifting assembly includes a first fixed rod and a movable rod. One end of the first fixed rod is fixedly connected to the upper side of the cavity, and the other end of the first fixed rod extends upward through the cavity cover. One end of the movable rod is movably connected to the first fixed rod and can move vertically relative to the first fixed rod. The top end of the movable rod supports the frame assembly. A drive assembly is connected to the movable rod, and the drive assembly drives the movable rod to move vertically relative to the first fixed rod.

2. The semiconductor process equipment as described in claim 1, characterized in that, The semiconductor process equipment also includes a coupling, the drive assembly includes a motor, the movable rod includes a lead screw, and the output shaft of the motor and the lead screw are connected by the coupling.

3. The semiconductor process equipment as described in claim 2, characterized in that, The motor is located at the edge of the frame assembly, and the coupling is located along the edge of the frame assembly.

4. The semiconductor process equipment as described in claim 2, characterized in that, The semiconductor process equipment includes two lifting components. The horizontal cross-sectional shape of the cavity and the cavity cover is polygonal, and the two lifting components are arranged diagonally along the cavity cover.

5. The semiconductor process equipment as described in claim 4, characterized in that, The frame assembly includes multiple first crossbeams and support columns located at the four corners of the cavity cover. The two ends of the first crossbeams are connected to the ends of the support columns away from the cavity cover. A connecting plate is provided at the intersection of two adjacent first crossbeams. The movable rod is arranged parallel to the support column, and the top end of the movable rod is supported on the lower side of the connecting plate.

6. The semiconductor process equipment as described in claim 4, characterized in that, The semiconductor process equipment also includes a motor mounting plate, the coupling is arranged parallel to the first crossbeam, and the motor is fixedly mounted to the first crossbeam via the motor mounting plate.

7. The semiconductor process equipment as described in claim 2, characterized in that, The semiconductor process equipment also includes a worm gear assembly, which includes a worm wheel and a worm that are meshed together. The worm wheel is fixedly connected to the top of the lead screw, and the worm is connected to the output end of the motor through the coupling.

8. The semiconductor process equipment as described in claim 1, characterized in that, The semiconductor process equipment also includes a guiding assembly, comprising a second fixed rod and a sliding guide rod. One end of the second fixed rod is fixedly connected to the upper side of the cavity, and the other end of the second fixed rod extends upward through the cavity cover. A guide portion is provided on the second fixed rod, and the sliding guide rod is slidably connected to the second fixed rod through the guide portion.

9. The semiconductor process equipment as described in claim 8, characterized in that, The cavity and the cavity cover have a quadrilateral cross-sectional shape in the horizontal direction, and the guide assembly and the lifting assembly are respectively located at different positions at the four corners of the cavity cover.

10. The semiconductor process equipment as described in claim 8, characterized in that, The second fixed rod has a guide hole at its center along its axial direction, the sliding guide rod is disposed in the guide hole, the guide hole is provided with a retainer for accommodating the roller body, the retainer is provided with a rolling element, and the second fixed rod and the sliding guide rod are slidably connected through the rolling element.

11. The semiconductor process equipment as claimed in claim 1, characterized in that, The semiconductor process equipment also includes a lifting main nut, the movable rod has an external thread on its body, and the lifting main nut and the movable rod are threaded together; the top end of the first fixed rod is provided with a limiting screw, which is movably connected to the lifting main nut, restricting the lifting main nut to move only between the upper limit position and the lower limit position along the axial direction of the first fixed rod.

12. The semiconductor process equipment as described in claim 11, characterized in that, The lifting main nut includes a nut body and a limiting part. The nut body and the movable rod are threadedly connected. The limiting part surrounds the nut body and has a through hole. The limiting screw passes through the through hole on the limiting part and is threadedly connected to the fixed rod.

13. The semiconductor process equipment as described in claim 11 or 12, characterized in that, The semiconductor process equipment also includes a detection nut, which is threadedly connected to the movable rod, and the detection nut is initially installed at a position higher than the upper limit of the lifting main nut.

14. The semiconductor process equipment as claimed in claim 1, characterized in that, The cavity includes at least four reaction chambers, and the lifting assembly is located outside the area enclosed by the four reaction chambers.

15. The semiconductor process equipment as described in claim 5, characterized in that, The frame assembly also includes a second crossbeam, which is arranged parallel to the first crossbeam and located below the first crossbeam, with both ends of the second crossbeam connected to the support column.

16. The semiconductor process equipment as claimed in claim 1, characterized in that, The semiconductor process equipment also includes a lower support frame assembly, which is disposed at the bottom of the cavity and supports the cavity.

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