Substrate separation apparatus and substrate set transport method

By designing the support and containment components of the substrate separation device, efficient separation and containment of the substrate and the annular bracket are achieved, solving the problem of long separation-transfer time and improving separation efficiency.

CN122121603APending Publication Date: 2026-05-29WUXI LEADPRO TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WUXI LEADPRO TECH CO LTD
Filing Date
2024-11-28
Publication Date
2026-05-29

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Abstract

The application discloses a substrate separating device and a substrate combination transportation method, and belongs to the technical field of semiconductor processing equipment. The substrate separating device is used for separating and combining a substrate and a ring-shaped carrier. The substrate separating device comprises a plate body, a supporting assembly and a containing assembly. The supporting assembly is arranged on the plate body and has a supporting surface for supporting the substrate. The containing assembly is arranged on the plate body and surrounds the supporting assembly. The containing assembly has containing main bodies for supporting the ring-shaped carrier. The containing main bodies are at least two and are arranged in a vertical direction in a spaced and stacked manner. In the vertical direction, the supporting center of the supporting assembly is offset from the containing center of the containing main bodies. The substrate is supported by the supporting assembly, and the multiple containing main bodies arranged at the offset supporting position can realize the containing of the multiple ring-shaped carriers, so that the ring-shaped carrier does not need to be transferred when the substrate is separated from the ring-shaped carrier, the transportation time is reduced, and the separation efficiency is improved.
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Description

Technical Field

[0001] This application belongs to the field of semiconductor processing equipment technology, specifically relating to a substrate separation device and a substrate assembly and transportation method. Background Technology

[0002] When separating the substrate from the annular bracket, supports of different heights are needed to support the substrate and the annular bracket respectively. Then, a robotic arm is used to move the substrate and the annular bracket away from the supports one by one to facilitate the subsequent separation of the substrate and the annular bracket.

[0003] However, the above separation-transfer process takes a long time, which affects the separation efficiency of the substrate and the annular bracket. Summary of the Invention

[0004] Objective of the Invention: This application provides a substrate separation device to overcome the current technical problems of long separation and handling time and low efficiency of substrates from annular supports. This application also provides a substrate assembly and transportation method.

[0005] Technical solution: This application discloses a substrate separation device for separating and assembling a substrate and an annular bracket, comprising:

[0006] plate body,

[0007] A support assembly is disposed on the plate body, the support assembly having a support surface for supporting the substrate;

[0008] A receiving assembly is disposed on the plate and surrounds the support assembly. The receiving assembly has a receiving body for supporting the annular bracket. At least two receiving bodies are provided and are stacked at intervals in the vertical direction.

[0009] In the vertical direction, the support center of the support component is offset from the containment center of the containment body.

[0010] In some embodiments, the receiving body has a receiving space, the receiving body includes a first support portion and a second support portion, adjacent receiving bodies are connected through the first support portion, the first support portion surrounds to form the receiving space, the second support portion is connected to the side of the first support portion facing the receiving space and is arranged in a stepped structure with the first support portion, and the annular bracket is at least partially placed on the second support portion.

[0011] In some embodiments, the first support portion has a first surface facing the receiving space, and the second support portion has a second surface facing the receiving space and connected to the first surface, wherein a clearance groove is provided on the second surface.

[0012] In some embodiments, the support component includes a support body for supporting the substrate;

[0013] The substrate separation device includes at least one separation buffer state. In the separation buffer state, the substrate is placed on the support surface, the annular bracket is separated from the substrate, and two or more of the annular brackets are sleeved on the support body and placed inside the receiving body.

[0014] In some embodiments, the support body includes a plurality of support columns, which are arranged at equal intervals around the support center. The support surface is located at the end of the support column away from the plate, and the support column directly supports the substrate.

[0015] In some embodiments, the receiving body has a receiving plane, in which the distance from the receiving center to the support center is a, the maximum distance from the support body to the support center is b, and the inner radius of the annular bracket is r, satisfying rb≥a.

[0016] In some embodiments, the support body is further provided with a support arm at one end away from the plate. The support arm is connected to the support body and extends in a direction away from the receiving assembly. The support surface is disposed on the side of the support arm away from the plate. The support body indirectly supports the substrate through the support arm.

[0017] In some embodiments, the support arm has a support center, the receiving body has a receiving plane, the maximum distance from the support center to the support body within the receiving plane is c, and the inner radius of the annular bracket is r, satisfying r≥c;

[0018] The distance from the support center to the containment center is a, and the shortest distance from the support center to the support body is e, satisfying r+e≥a.

[0019] In some embodiments, the substrate separation device further includes a lifting assembly, and the receiving assembly is connected to the plate body through the lifting assembly for adjusting the height of the receiving body.

[0020] This application also discloses a substrate assembly transportation method, based on the substrate separation device described in the above embodiments, wherein the substrate assembly includes a substrate and an annular bracket supporting the substrate, and the method includes:

[0021] The conveying mechanism conveys the substrate assembly to a first position, which is located directly above the support surface of the substrate separation device;

[0022] The substrate assembly is separated, the separation operation including: the conveying mechanism and / or the substrate separation device are raised and lowered, so that the conveying mechanism moves closer to the substrate separation device in the vertical direction and reaches a second position, the second position being below the support surface of the substrate separation device and above the target receiving body, wherein the substrate is left on the support surface, and the annular bracket follows the conveying mechanism to the second position;

[0023] The bracket is buffered, and the buffering operation includes: the conveying mechanism and / or the substrate separation device performing a lifting movement, the conveying mechanism reaching a third position, the third position corresponding to the position of the receiving space of the target receiving body; the conveying mechanism performing at least one translational movement in the plane where the third position is located to transport the annular bracket into the target receiving body, and cooperating with the relative lifting movement between the conveying components to complete the receiving of the annular bracket.

[0024] In some embodiments, the transport method includes removing the substrate from the support surface by a conveying mechanism before transporting the next substrate assembly; repeating the transport operation of the current substrate assembly to transport the next substrate assembly, wherein, during the buffer operation of the bracket, the receiving body above the target receiving body of the current substrate assembly is configured as the target receiving body of the next substrate assembly.

[0025] Beneficial Effects: The substrate separation device of this application embodiment is used for separating and assembling a substrate and an annular bracket. The substrate separation device includes a plate, a support assembly, and a receiving assembly. The support assembly is disposed on the plate and has a support surface for supporting the substrate. The receiving assembly is disposed on the plate and surrounds the support assembly. The receiving assembly has a receiving body for supporting the annular bracket. At least two receiving bodies are provided and stacked at intervals along the vertical direction. In the vertical direction, the support center of the support assembly is offset from the receiving center of the receiving body. By supporting the substrate with the support assembly and using multiple receiving bodies disposed at offset positions, multiple annular brackets can be received, so that when the substrate is subsequently separated from the annular bracket, it is not necessary to transfer the annular bracket, reducing transportation time and improving separation efficiency.

[0026] The substrate assembly and transportation method of this application embodiment is based on the substrate separation device described in the above embodiments. Therefore, it can have all the technical features and effects of the above substrate separation device, which will not be repeated here. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the separate structure of the substrate and the annular bracket in a substrate separation device according to an embodiment of this application;

[0029] Figure 2 This is a three-dimensional structural schematic diagram of a substrate separation device according to an embodiment of the present application. The figure shows the substrate supported on the support surface and the annular bracket housed in the housing body.

[0030] Figure 3 This is a front view schematic diagram of a substrate separation device according to an embodiment of this application;

[0031] Figure 4 This is a half-sectional view of a substrate separation device according to an embodiment of this application in the front view direction;

[0032] Figure 5 for Figure 4 Enlarged view of a portion of point A in the middle;

[0033] Figure 6 for Figure 4 A magnified view of a portion of point A in the diagram, showing the clearance groove;

[0034] Figure 7 This is a top view of a substrate separation device according to an embodiment of this application;

[0035] Figure 8 This is a three-dimensional structural schematic diagram of a substrate separation device according to another embodiment of this application. The figure shows a substrate supported on a support surface and an annular bracket housed in a housing body.

[0036] Figure 9 This is a top view of a substrate separation device according to another embodiment of this application, showing the support arm.

[0037] Figure 10 This is a half-sectional schematic diagram of a substrate separation device according to another embodiment of this application;

[0038] Reference numerals: 1. Plate; 2. Support assembly; 20. Support surface; 3. Receiving assembly; 31. Receiving main body; X. Vertical direction; 310. Receiving space; 311. First support part; 312. Second support part; 3111. First surface; 3121. Second surface; 3120. Clearance groove; 21. Support main body; 211. Support column; T. Support center; O. Receiving center; 22. Support arm; 4. Substrate assembly; 41. Substrate; 42. Annular bracket; Y. Translation direction. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0040] In the description of this application, it should be understood that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, "multiple" means two or more, and "at least one" can refer to one, two, or more, unless otherwise explicitly specified. The terms "first," "second," and "third," etc., are only for the convenience of description and are used to name parts or embodiments by number, and do not imply any order of importance between the parts or embodiments.

[0041] It should also be noted that in the accompanying drawings of this application, the arrow marked X indicates the vertical direction, and the arrow marked Y indicates the translational direction of the annular bracket. In the description of this application, the vertical direction and translational direction are introduced to more clearly define the structure and relative positional relationship of each component in the substrate separation device.

[0042] As a preliminary part of the embodiments of this application, when separating the substrate and the annular bracket, supports of different heights are required to support the substrate and the annular bracket respectively. Then, a robot is used to move the substrate and the annular bracket away from the supports to facilitate the subsequent separation of the substrate and the annular bracket.

[0043] However, the above separation-transfer process takes a long time, which affects the separation efficiency of the substrate and the annular bracket.

[0044] In view of this, embodiments of this application provide a substrate separation device, which aims to solve at least one of the above-mentioned technical problems.

[0045] Please see Figures 1 to 10 As shown, the substrate 41 separation device in this embodiment is used for separating and assembling the substrate 41 and the annular bracket 42 (e.g., Figure 1 As shown, the substrate 41 separation device includes a plate 1, a support assembly 2, and a receiving assembly 3. The support assembly 2 is disposed on the plate 1 and has a support surface 20 for supporting the substrate 41. The receiving assembly 3 is disposed on the plate 1 and surrounds the support assembly 2. The receiving assembly 3 has a receiving body 31 for supporting the annular bracket 42. At least two receiving bodies 31 are provided and stacked at intervals along the vertical direction X. In the vertical direction X, the support center T of the support assembly 2 is offset from the receiving center O of the receiving body 31. It should be understood that the robotic arm transports the substrate 41 and the annular bracket 42 in their combined state above the support surface 20. During the descent of the robotic arm, the substrate 41 is supported on the support surface 20 and separated from the annular bracket 42. The robotic arm continues to lower the annular bracket 42 to a certain height and then translates it, thus realizing the annular bracket 42 being received within the receiving body 31, completing one separation and buffering operation. The substrate 41 separation device disclosed in this application can separate the substrate 41 from the annular bracket 42 and enable the annular bracket 42 to be stored quickly without the need to transfer the annular bracket 42, thus saving the time of moving the annular bracket 42 away and improving the separation efficiency of the substrate 41 from the annular bracket 42. At the same time, it can make the next combination of the substrate 41 and the annular bracket 42 more convenient and faster.

[0046] Please see Figures 2 to 5 As shown, in some embodiments, the receiving body 31 has a receiving space 310. The receiving body 31 includes a first support portion 311 and a second support portion 312. Adjacent receiving bodies 31 are connected by the first support portion 311, which surrounds to form the receiving space 310. The second support portion 312 is connected to the side of the first support portion 311 facing the receiving space 310 and is arranged in a stepped structure with the first support portion 311. The annular bracket 42 is at least partially placed on the second support portion 312. It should be understood that the robot transfers the annular bracket 42 into the receiving space 310 and supports it on the second support portion 312. The first support portion 311 can guide the annular bracket 42 to the receiving position. On the one hand, it restricts the horizontal (translational) displacement of the annular bracket 42. On the other hand, it prevents the annular bracket 42 from being unstable and leaving the receiving space 310 or even falling after the robot detaches.

[0047] Please see Figure 4 and Figure 6As shown, in some embodiments, the first support portion 311 has a first surface 3111 facing the receiving space 310, and the second support portion 312 has a second surface 3121 facing the receiving space 310 and connected to the first surface 3111. A clearance groove 3120 is provided on the second surface 3121. It should be understood that by providing the clearance groove 3120 on the second surface 3121, the manipulator can operate within a certain space to move the annular bracket 42. On the one hand, this ensures that the annular bracket 42 will not shake after the manipulator withdraws from the receiving position. On the other hand, after the manipulator enters the receiving position, the clearance groove 3120 provides the manipulator with an operable space to support the annular bracket 42 from the bottom.

[0048] Please see Figure 5 As shown, in some embodiments, the first surface 3111 extends along the vertical direction X, and the first surface 3111 and the second surface 3121 are arranged at an angle of less than or equal to 90°. The second surface 3121 is arranged at an angle, so that the annular bracket 42 can slide under gravity to contact the first surface 3111, achieving precise positioning and storage, improving storage stability and separation efficiency. It should be understood that the specific shape of the first support portion 311 is not limited. The first support portion 311 can be a semi-enclosed structure, such as an arc or other polygonal structure; the first support portion 311 can also be a fully enclosed annular structure, and the inner radius of the first support portion 311 is larger than the diameter of the annular bracket 42. It should be understood that the first support portion 311 of both the semi-enclosed structure and the fully enclosed annular structure can surround the annular bracket 42, so that the annular bracket 42 can be translated within the space surrounded by the first support portion 311, so that the annular bracket 42 is supported on the second support portion 312. The range and position of the annular bracket 42 placed on the first support portion 311 are not limited here. The first support portion 311 of the semi-enclosed structure has an opening, which facilitates the robotic arm to grasp the annular bracket 42 and transfer the annular bracket 42 to place it on the second support portion 312. The first support portion 311 of the fully enclosed annular structure provides the robotic arm with operable space to grasp the annular bracket 42 around the formed receiving space 310.

[0049] Please refer to the following: Figures 2 to 4 As shown, in some embodiments, the support component 2 includes a support body 21 for supporting the substrate 41; the substrate 41 separation device includes at least one separation buffer state, in which the substrate 41 is placed on the support surface 20, the annular bracket 42 is separated from the substrate 41, and two or more annular brackets 42 are sleeved on the support body 21 and placed inside the receiving body 31. It should be understood that when the annular bracket 42 is placed inside the receiving body 31, the annular bracket 42 is sleeved outside the support body 21 so that the buffering of the annular bracket 42 is completed simultaneously in the separation step.

[0050] In some embodiments, the support body 21 includes a plurality of support columns 211, which are arranged at equal intervals around the support center T. The support surface 20 is located at the end of the support column 211 away from the plate 1, and the support column 211 directly supports the substrate 41. By setting multiple support columns 211 to jointly support the substrate 41, multi-point support is achieved, thereby improving the stability of the support.

[0051] Please see Figure 7 As shown, in some embodiments, the receiving body 31 has a receiving plane. Within the receiving plane, the distance from the receiving center O to the support center T is a, the maximum distance from the support body 21 to the support center T is b, and the inner radius of the annular bracket 42 is r, satisfying rb≥a. It should be understood that the receiving center O refers to the center position of the annular bracket 42 when it is in the receiving position, and the support center T refers to the center position of the annular bracket 42 when it is detached from the substrate 41. At this time, the center position of the annular bracket 42 and the center position of the substrate 41 are located in the same vertical direction X. Therefore, the distance a from the receiving center O to the support center T refers to the straight-line distance between the receiving center O and the support center T along the translation direction of the annular bracket 42. Considering that the specific shape of the support body 21 is not limited, the maximum distance b from the support body 21 to the support center T refers to the dimension from the side of the support body 21 away from the support center T along the translation direction of the annular bracket 42. The translational space of the annular bracket 42 is defined by a and b in the above formula. By satisfying the above conditions, sufficient translational space is ensured for the annular bracket 42, allowing it to be stably stored within the receiving body 31. This ensures that the support body 21 will not obstruct or interfere with the annular bracket 42 during translation. Therefore, in the process of supporting the substrate 41 and transporting the annular bracket 42 to the receiving space 310, only one lifting action and one translational action are required, simplifying the transportation steps and improving transportation efficiency.

[0052] Please see Figure 8 and Figure 9 As shown, in some embodiments, the support body 21 is further provided with a support arm 22 at the end away from the plate 1. The support arm 22 is connected to the support body 21 and extends in a direction away from the receiving assembly 3. A support surface 20 is provided on the side of the support arm 22 away from the plate 1. The support body 21 indirectly supports the substrate 41 through the support arm 22. By setting the support arm 22, the stability of the substrate 41 is improved. On the other hand, by separating the support position of the substrate 41 from the receiving position of the annular bracket 42, the distance between the support center T and the receiving center O is increased. This reduces the interference caused to the annular bracket 42 stored in the receiving body 31 by the robot during the removal of the substrate 41. At the same time, it reduces the interference caused to the substrate 41 by the robot during the storage or retrieval of the annular bracket 42, thereby improving the stability of the substrate 41 and the annular bracket 42, as well as the working efficiency of the robot.

[0053] Please see Figure 10 As shown, in some embodiments, the support arm 22 has a support center T, and the receiving body 31 has a receiving plane. Within the receiving plane, the maximum distance from the support center T to the support body 21 is c, and the inner radius of the annular bracket 42 is r, satisfying r ≥ c; the distance from the support center T to the receiving center O is a, and the shortest distance from the support center T to the support body 21 is e, satisfying r + e ≥ a. It should be understood that when the annular bracket 42 drives the substrate 41 and causes the substrate 41 to form a support on the support arm 22, the projection of the support center T and the center of the annular bracket 42 in the vertical direction X overlaps. The maximum distance c from the support center T to the support body 21 refers to the dimension of the support center T away from the support body 21 along the translation direction of the annular bracket 42. By limiting r to be greater than or equal to c, it is ensured that when the robot arm drives the annular bracket 42 to rise and fall in the vertical direction X, the support arm 22 and the support body 21 will not interfere with the displacement of the annular bracket 42.

[0054] It is important to understand that the distance 'a' from the receiving center O to the support center T refers to the straight-line distance between the receiving center O and the support center T along the translational direction of the annular bracket 42. The shortest distance 'e' from the support center T to the support body 21 refers to the distance from the support center T to the side of the support body 21 closest to the support center T along the translational direction of the annular bracket 42. By ensuring that 'r' plus 'e' is greater than or equal to 'a', it is ensured that the annular bracket 42, after translation and reaching the receiving center O, can be stably supported within the receiving body 31. This guarantees that the annular bracket 42 has sufficient translational space to be stably stored within the receiving body 31, ensuring that the support body 21 will not obstruct or interfere with the annular bracket 42 during translation. Therefore, in the process of supporting the substrate 41 and transporting the annular bracket 42 to the receiving space 310, only one lifting action and one translational action are required, simplifying the transportation steps and improving transportation efficiency.

[0055] In some embodiments, the substrate 41 separation device further includes a lifting assembly, and the receiving assembly 3 is connected to the plate body 1 via the lifting assembly for adjusting the height of the receiving body 31. It should be understood that during the process of the robotic arm storing the annular bracket 42, the lifting assembly can control the lifting and lowering of the receiving assembly 3 to adjust the receiving height and further improve storage efficiency.

[0056] This application also discloses a method for transporting a substrate assembly 4, based on the substrate 41 separation device of the above embodiment. The substrate assembly 4 includes a substrate 41 and an annular bracket 42 supporting the substrate 41. The method includes: a conveying mechanism conveying the substrate assembly 4 to a first position, the first position being directly above the support surface 20 of the substrate 41 separation device; and performing a separation operation on the substrate assembly 4, the separation operation including: performing a lifting and lowering movement on the conveying mechanism and / or the substrate 41 separation device, so that the conveying mechanism approaches the substrate 41 separation device in the vertical direction X and reaches a second position, the second position being below the support surface 20 of the substrate 41 separation device. The container is positioned above the target receiving body 31, with the substrate 41 placed on the support surface 20 and the annular bracket 42 following the conveying mechanism to the second position. A buffering operation is performed on the bracket, which includes: the conveying mechanism and / or the substrate 41 separation device performing a lifting movement, the conveying mechanism reaching a third position, the third position corresponding to the position of the receiving space 310 of the target receiving body 31; the conveying mechanism performing at least one translational movement in the plane where the third position is located to transport the annular bracket 42 into the target receiving body 31, and cooperating with the relative lifting movement between the container and the receiving assembly 3 to complete the receiving of the annular bracket 42.

[0057] In some embodiments, the transport method includes removing substrate 41 from support surface 20 by means of a conveying mechanism before transporting the next substrate assembly 4; repeating the transport operation of the current substrate assembly 4 to transport the next substrate assembly 4, wherein, during the buffer operation of the tray, the receiving body 31 above the target receiving body 31 of the current substrate assembly 4 is configured as the target receiving body 31 of the next substrate assembly 4.

[0058] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0059] The substrate separation device and substrate assembly and transportation method provided in the embodiments of this application have been described in detail above, and specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A substrate separation device for separating and assembling a substrate (41) and an annular bracket (42), characterized in that, include: Plate(1), A support component (2) is disposed on the plate (1), and the support component (2) has a support surface (20) for supporting the substrate (41); A receiving assembly (3) is disposed on the plate (1) and surrounds the support assembly (2). The receiving assembly (3) has a receiving body (31) for supporting the annular bracket (42). At least two receiving bodies (31) are provided and are stacked at intervals along the vertical direction (X). In the vertical direction (X), the support center (T) of the support component (2) is offset from the containment center (O) of the containment body (31).

2. The substrate separation device according to claim 1, characterized in that, The receiving body (31) has a receiving space (310). The receiving body (31) includes a first support (311) and a second support (312). Adjacent receiving bodies (31) are connected through the first support (311). The first support (311) surrounds to form the receiving space (310). The second support (312) is connected to the side of the first support (311) facing the receiving space (310) and is arranged in a stepped structure with the first support (311). The annular bracket (42) is at least partially placed on the second support (312).

3. The substrate separation device according to claim 2, characterized in that, The first support portion (311) has a first surface (3111) facing the receiving space (310), and the second support portion (312) has a second surface (3121) facing the receiving space (310) and connected to the first surface (3111). A clearance groove (3120) is provided on the second surface (3121).

4. The substrate separation device according to claim 1, characterized in that, The support component (2) includes a support body (21) for supporting the substrate (41); The substrate separation device includes at least one separation buffer state, in which the substrate (41) is placed on the support surface (20), the annular bracket (42) is separated from the substrate (41), and two or more of the annular brackets (42) are sleeved on the support body (21) and placed in the receiving body (31).

5. The substrate separation apparatus according to claim 4, characterized in that, The support body (21) includes a plurality of support columns (211), which are arranged at equal intervals around the support center (T). The support surface (20) is located at the end of the support column (211) away from the plate (1), and the support column (211) directly supports the substrate (41).

6. The substrate separation apparatus according to claim 5, characterized in that, The receiving body (31) has a receiving plane. Within the receiving plane, the distance from the receiving center (O) to the support center (T) is a, the maximum distance from the support body (21) to the support center (T) is b, and the inner radius of the annular bracket (42) is r, satisfying rb≥a.

7. The substrate separation apparatus according to claim 4, characterized in that, The support body (21) is provided with a support arm (22) at one end away from the plate (1). The support arm (22) is connected to the support body (21) and extends in a direction away from the receiving assembly (3). The support surface (20) is arranged on the side of the support arm (22) away from the plate (1). The support body (21) indirectly supports the substrate (41) through the support arm (22).

8. The substrate separation apparatus according to claim 7, characterized in that, The support arm (22) has a support center (T), the receiving body (31) has a receiving plane, and the maximum distance from the support center (T) to the support body (21) within the receiving plane is c, and the inner radius of the annular bracket (42) is r, satisfying r≥c; The distance from the support center (T) to the containment center (O) is a, and the shortest distance from the support center (T) to the support body (21) is e, satisfying r+e≥a.

9. The substrate separation apparatus according to claim 1, characterized in that, The substrate separation device further includes a lifting assembly, and the receiving assembly (3) is connected to the plate (1) through the lifting assembly to adjust the height of the receiving body (31).

10. A method for transporting a substrate assembly, based on the substrate separation device according to any one of claims 1 to 9, wherein the substrate assembly (4) comprises a substrate (41) and an annular bracket (42) supporting the substrate (41), characterized in that, The method includes: The conveying mechanism conveys the substrate assembly (4) to a first position, which is located directly above the support surface (20) of the substrate separation device; The substrate assembly (4) is separated. The separation operation includes: lifting the conveying mechanism and / or the substrate separation device, so that the conveying mechanism approaches the substrate separation device in the vertical direction (X) and reaches a second position, which is located below the support surface (20) of the substrate separation device and above the target receiving body (31), wherein the substrate (41) remains on the support surface (20), and the annular bracket (42) follows the conveying mechanism to the second position; The bracket is buffered, the buffering operation includes: the conveying mechanism and / or the substrate separation device move up and down, the conveying mechanism reaches a third position, the third position corresponds to the position of the receiving space (310) of the target receiving body (31); the conveying mechanism performs at least one translational movement in the plane where the third position is located, so as to transport the ring bracket (42) into the target receiving body (31), and complete the receiving of the ring bracket (42) in coordination with the relative lifting movement between the ring bracket and the receiving assembly (3).

11. A substrate assembly and transportation method according to claim 10, characterized in that, The transportation method includes removing the substrate (41) on the support surface (20) by means of a conveying mechanism before transporting the next substrate assembly (4); repeating the transportation operation of the current substrate assembly (4) to transport the next substrate assembly (4), wherein, when performing a buffering operation on the bracket, the receiving body (31) above the target receiving body (31) of the current substrate assembly (4) is configured as the target receiving body (31) of the next substrate assembly (4).