Heat sink with phase change in combination with liquid cooling

Abstract

The application provides a heat dissipation device combining phase change and liquid cooling, which comprises a phase change conversion plate, a cavity for containing a phase change medium is formed in the phase change conversion plate, and a lower surface of the phase change conversion plate is used for connecting a chip; a liquid cooling plate is connected to an upper surface of the phase change conversion plate, and a groove for containing cooling liquid is formed on a side of the liquid cooling plate facing the phase change conversion plate; and the liquid cooling plate is further provided with an inlet hole and an outlet hole for the cooling liquid to enter and exit. The heat dissipation device combining phase change and liquid cooling can efficiently dissipate heat from a condensing end of phase change heat exchange through liquid cooling, and has high heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to the field of radiators, and in particular to a heat dissipation device that combines phase change with liquid cooling. Background Technology

[0002] To overcome the limitations of traditional heat dissipation methods, phase change heat dissipation technology has received widespread attention in recent years. This technology utilizes the property of phase change media (such as certain fluorinated liquids) to absorb or release a large amount of latent heat during a liquid-to-gas phase change at a specific temperature, achieving efficient heat transfer. A typical vapor chamber is an application of this principle. Phase change heat dissipation has advantages such as near-isothermal heat transfer, rapid thermal response, and excellent temperature uniformity, showing great potential in dealing with localized hotspots and high heat flux densities.

[0003] However, in high-power continuous operation scenarios, the heat dissipation capacity of the condenser end of a purely passive phase change cooling system (relying on natural convection or simple air cooling for condensation) may become a new bottleneck. If the condensation rate cannot keep up with the evaporation rate, it will lead to increased internal pressure, increased thermal resistance, and ultimately a decrease in heat dissipation performance. Summary of the Invention

[0004] To address the aforementioned problems in the prior art, the present invention aims to provide a heat dissipation device combining phase change and liquid cooling, which can efficiently dissipate heat from the condensation end of phase change heat transfer through liquid cooling, resulting in high heat dissipation efficiency.

[0005] To address the above problems, the present invention provides a heat dissipation device combining phase change and liquid cooling, the heat dissipation device comprising:

[0006] A phase change conversion plate, wherein the interior of the phase change conversion plate forms a chamber for accommodating a phase change medium, and the lower surface of the phase change conversion plate is used to connect a chip;

[0007] The liquid cooling plate is connected to the upper surface of the phase change conversion plate, and a groove for containing coolant is formed on the side facing the phase change conversion plate. The liquid cooling plate also has an inlet hole and an outlet hole for coolant to enter and exit.

[0008] Furthermore, the liquid cooling plate has a serpentine flow channel formed at the top of the groove.

[0009] Furthermore, the phase change conversion plate includes:

[0010] A first sealing plate, the lower surface of which is used to connect the chip;

[0011] A phase change plate is connected to the upper surface of the first sealing plate, and a perforation is formed on the phase change plate;

[0012] The second sealing plate is connected to the upper surface of the phase change plate. The first sealing plate and the second sealing plate can close the hollow end, thereby forming the chamber. The phase change conversion plate is connected to the liquid cooling plate through the second sealing plate.

[0013] Furthermore, the second sealing plate has a first needle wing formed on the side near the liquid cooling plate, and the first needle wing extends into the groove of the liquid cooling plate.

[0014] Furthermore, the lower surface of the second sealing plate is formed with a second needle wing that can extend into the hollowed-out area.

[0015] Furthermore, the second needle fin is formed as a column or an inverted cone, the cross-sectional area of ​​which decreases along the direction toward the phase change plate.

[0016] Furthermore, the phase change plate includes:

[0017] Upper plate, wherein a first cutout is formed on the upper plate;

[0018] An intermediate plate is connected to the lower surface of the upper plate; a plurality of spaced-apart second cutouts are formed on the intermediate plate, and the projection of the first cutouts on the intermediate plate covers all the second cutouts.

[0019] The lower plate is connected to the lower surface of the middle plate, and a third cutout is formed on the lower plate. The projection of the third cutout on the middle plate covers the entire second cutout.

[0020] Furthermore, a plurality of second needle wings are formed on the lower surface of the second sealing plate, and the plurality of second needle wings extend into the plurality of second hollows in a corresponding manner.

[0021] Furthermore, the top of the second hollow section has a chamfered edge.

[0022] Furthermore, the second cutout includes at least one set, with each set of the second cutout corresponding to one chip, and the distribution density of each set of the second cutout on the intermediate plate decreases from the projection center of the chip corresponding to that set towards the edge.

[0023] Due to the above technical solution, the present invention has the following beneficial effects:

[0024] The phase change combined with liquid cooling heat dissipation device of the present invention creates an effective path to cope with ultra-high heat flux density by synergistically combining phase change heat transfer and liquid cooling heat dissipation. First, the phase change conversion plate utilizes the extremely high latent heat of phase change to rapidly convert the instantaneous, high-density heat flux of the chip into the latent heat of vaporization of the medium, achieving efficient primary heat transfer. This solves the bottleneck of insufficient heat exchange capacity in traditional heat dissipation methods when heat flux density increases dramatically. Subsequently, the liquid cooling system is responsible for ultimately removing the heat released by the condensation of the phase change medium.

[0025] This division of labor eliminates the need for the liquid cooling system to directly combat the extreme heat load on the chip surface, thereby reducing the stringent requirements for low-temperature cooling and precise control of the coolant and simplifying the overall system design. Ultimately, the device achieves extremely high heat dissipation efficiency and power density within a limited space, making it particularly suitable for high heat flux density scenarios such as GPUs, CPUs, and power chips. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0027] Figure 1 This is a structural diagram of a heat dissipation device and a chip according to an embodiment of the present invention;

[0028] Figure 2 yes Figure 1 Exploded view of the heat dissipation device and chip in the embodiment;

[0029] Figure 3 This is a structural diagram of a phase change plate according to an embodiment of the present invention;

[0030] Figure 4 yes Figure 3 Another structural diagram of the phase change plate in the embodiment.

[0031] Figure label:

[0032] 100, Chip; 200, First sealing plate; 300, Lower plate; 310, Third cutout; 400, Middle plate; 410, Second cutout; 500, Upper plate; 510, First cutout; 600, Second sealing plate; 610, Second needle fin; 700, Liquid cooling plate; 710, Liquid inlet hole; 720, Serpentine flow channel. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0035] The following describes a phase change combined with liquid cooling heat dissipation device according to an embodiment of the present invention.

[0036] like Figures 1 to 4 As shown, the heat dissipation device of this embodiment includes a phase change conversion plate and a liquid cooling plate 700.

[0037] First, let's explain the phase change converter (PCC) board. The PCC board is the primary heat dissipation module that directly manages the heat of chip 100. It has an internal sealed chamber containing a phase change medium (such as a low-boiling-point working medium like a fluorinated liquid). The entire lower surface of the PCC board serves as a mounting surface for a tight connection to chip 100, ensuring efficient heat transfer from chip 100.

[0038] Next, the liquid cooling plate 700 will be described. The liquid cooling plate 700 is fixedly connected above the phase change conversion plate, and a groove is machined on the side facing the phase change conversion plate (i.e., the lower surface). This groove, together with the top surface of the phase change conversion plate, forms the flow space for the coolant. The liquid cooling plate 700 body also has an inlet hole 710 and an outlet hole for connecting to an external cooling circulation system, allowing coolant to continuously flow into and out of the groove.

[0039] The heat dissipation device of this invention combines phase change heat transfer with liquid cooling, creating an effective path to cope with ultra-high heat flux densities. First, the phase change plate utilizes the extremely high latent heat of phase change to rapidly convert the instantaneous, high-density heat flux of the chip 100 into the latent heat of vaporization of the medium, achieving efficient primary heat transfer. This solves the bottleneck of insufficient heat exchange capacity in traditional heat dissipation methods when heat flux density increases dramatically. Subsequently, the liquid cooling system is responsible for ultimately removing the heat released by the condensation of the phase change medium.

[0040] This division of labor eliminates the need for the liquid cooling system to directly combat the extreme heat load on the surface of the chip 100, thereby reducing the stringent requirements for low-temperature cooling and precise control of the coolant and simplifying the overall system design. Ultimately, the device achieves extremely high heat dissipation efficiency and power density within a limited space, making it particularly suitable for high heat flux density scenarios such as GPUs, CPUs, and power chips 100.

[0041] In some embodiments of the present invention, a serpentine flow channel 720 is formed at the top of the groove of the liquid cooling plate 700.

[0042] like Figure 2 As shown, meandering grooves are machined on the inner top wall of the groove in the liquid cooling plate 700, forming a serpentine flow channel 720. After the coolant flows in from the inlet hole 710, it is constrained to flow within this flow channel and finally flows out from the outlet hole.

[0043] The serpentine flow channel 720 design greatly extends the flow path of the coolant within a limited plate area. This increases the effective heat exchange time and contact area between the coolant and the liquid cooling plate 700 (and consequently the phase change plate), thereby significantly improving the heat exchange efficiency of a single liquid cooling plate 700, resulting in a stronger overall heat dissipation capacity and a more compact structure for the heat dissipation device.

[0044] In some embodiments of the present invention, such as Figure 2 , Figure 3 and Figure 4 As shown, the lower surface of the first sealing plate 200 is used to connect the chip 100. A phase change plate is connected to the upper surface of the first sealing plate 200, and a perforation is formed on the phase change plate. A second sealing plate 600 is connected to the upper surface of the phase change plate. The first sealing plate 200 and the second sealing plate 600 can close the ends of the perforations, thereby forming a cavity. The phase change conversion plate is connected to the liquid cooling plate 700 through the second sealing plate 600.

[0045] In other words, the phase change conversion plate includes a first sealing plate 200, a phase change plate, and a second sealing plate 600 stacked together. The first sealing plate 200 is located at the bottom layer, and its lower surface is used to connect the chip 100. The phase change plate is located in the middle, and it has a specific hollow structure processed on it. The second sealing plate 600 is located at the top layer, and its lower surface is combined with the phase change plate. The first sealing plate 200 and the second sealing plate 600 respectively seal the hollow area on the phase change plate from below and above, and the three together enclose the aforementioned sealed chamber. Finally, the phase change conversion plate is thermally connected to the lower surface of the liquid cooling plate 700 through the second sealing plate 600 at its top.

[0046] This modular, plate-layer structure design breaks down the complex phase-change chamber into multiple independently processable and assembleable flat plate components, greatly reducing the difficulty of manufacturing processes. At the same time, it provides a foundational platform for the refined design of the internal structure (such as subsequent perforation distribution and pin fin arrangement), enhancing design flexibility and customizability.

[0047] Furthermore, the second sealing plate 600 has a first needle fin formed on the side near the liquid cooling plate 700, and the first needle fin extends into the groove of the liquid cooling plate 700.

[0048] On the upper surface of the second sealing plate 600, there are upward-protruding needle-like or plate-like heat dissipation structures, namely the first needle fins. When the liquid cooling plate 700 is assembled in place, these first needle fins extend precisely into the groove space of the liquid cooling plate 700.

[0049] The design of the first needle fin enables "direct contact" heat exchange between the second sealing plate 600 and the coolant. The needle fin structure significantly increases the heat transfer surface area between the second sealing plate 600 and the coolant, allowing the heat released from the condensation of the phase change medium to be transferred to the flowing coolant more quickly and fully, significantly reducing the thermal resistance of this key interface and improving the heat dissipation efficiency of the liquid cooling side.

[0050] In some embodiments of the present invention, such as Figure 2 As shown, the lower surface of the second sealing plate 600 has a second needle wing 610 that can extend into the perforated phase change plate.

[0051] On the lower surface of the second sealing plate 600, there are downwardly protruding second needle wings 610. After assembly, these second needle wings 610 are inserted downward into the cutouts in the phase change plate.

[0052] The second fin 610 primarily functions within the phase change chamber. It significantly expands the condensation surface area of ​​the second sealing plate 600 within the chamber. When the gaseous phase change medium rises within the chamber, it comes into large-area contact with the cooler second fin 610, rapidly condensing into a liquid and releasing heat. This greatly enhances the condensation process in the phase change cycle, which is crucial for maintaining efficient phase change heat dissipation.

[0053] Furthermore, the second needle fin 610 is formed as a column or an inverted cone, with the cross-sectional area of ​​the inverted cone decreasing along the direction toward the phase change plate.

[0054] The second needle fin 610 can be a cylinder or square prism with a constant cross-section. A preferred option is to use an inverted cone design, such as a cone or square cone, characterized by the cross-sectional area of ​​the needle fin gradually decreasing from top to bottom.

[0055] The cylindrical structure provides a stable expanded surface area. The inverted conical structure offers even greater advantages: its sloping sidewalls provide a smooth return path for the condensed droplets, allowing them to slide more easily down the slope to the bottom of the chamber under gravity, thus preventing the liquid from accumulating on the condensing surface and forming an excessively thick liquid film. The liquid film is a major source of condensation thermal resistance; reducing its thickness effectively improves the condensation heat transfer coefficient and accelerates the phase change cycle.

[0056] Furthermore, such as Figure 3 and Figure 4 As shown, the phase change plate includes an upper plate 500, a middle plate 400, and a lower plate 300.

[0057] The upper plate 500 has a first cutout 510. The middle plate 400, located below the upper plate 500, has multiple spaced-apart second cutouts 410 machined onto it. The projection of the first cutout 510 onto the middle plate 400 completely covers the second cutouts 410. The lower plate 300, located below the middle plate 400, has a third cutout 310. The projection of the third cutout 310 onto the middle plate 400 also completely covers the second cutouts 410.

[0058] This three-layer plate structure is an ingenious design for achieving complex chamber shapes. The second perforation 410 of the middle plate 400 forms the main body of the chamber, and its size and distribution can be flexibly designed to match the heat source. The perforations (first perforation 510 and third perforation 310) of the upper plate 500 and lower plate 300 mainly serve a connecting and supporting function, ensuring that all second perforations 410 are connected vertically to form a whole chamber, while guaranteeing the overall strength and sealing reliability of the structure, and allowing each second perforation 410 to be interconnected. This design facilitates the customization of chambers by stacking plates with different patterns, and has good manufacturability.

[0059] Furthermore, such as Figure 2 As shown, the multiple second pin fins 610 on the lower surface of the second sealing plate 600 extend into the multiple second hollows 410 of the intermediate plate 400 in a corresponding manner.

[0060] The number, position, and spacing of the second pins 610 on the lower surface of the second sealing plate 600 perfectly match the number, position, and spacing of the second cutouts 410 on the intermediate plate 400. Each second pin 610 is precisely inserted into a corresponding second cutout 410.

[0061] This "one needle, one hole" correspondence allows the condensation efficiency of the second needle fin 610 to be precisely applied to each individual chamber sub-region. It ensures the maximization and uniformity of the condensation surface area distribution within the chamber, avoids heat dissipation blind spots, and enables the efficient condensation of vapor generated by the phase change medium at any location within the chamber, thereby improving the uniformity and reliability of the overall heat dissipation performance.

[0062] Furthermore, the top of the second cutout 410 has a chamfered edge.

[0063] Specific implementation: On the upper edge of each second cutout 410 of the middle plate 400 (i.e. the side near the second cover plate 600), bevel or round the edge to form a smooth transition bevel edge.

[0064] The chamfered edge offers two benefits. First, it provides a smooth path for rising steam, reducing local resistance to steam flow and facilitating rapid steam diffusion. Second, it improves condensate reflux, allowing droplets to slide off more easily from the chamfered edge and preventing accumulation at the corners of the cutouts. This maintains smooth two-phase flow within the chamber, ensuring efficient and stable operation of the phase change cycle.

[0065] In some embodiments of the present invention, such as Figure 3 As shown, the second cutout 410 is divided into at least one group, with each group corresponding to one chip 100. Within each group, the distribution density of the second cutout 410 decreases from the center of the projection area of ​​the chip 100 towards the edge.

[0066] Based on the heat dissipation characteristics of chip 100 (usually the central area has the highest heat flux density), a cutout design is made on the intermediate board 400 corresponding to the area projected by chip 100. At the location corresponding to the central hot spot of chip 100, the arrangement of the second cutout 410 is very dense; as the position moves towards the edge of chip 100, the distribution of the second cutout 410 gradually becomes sparse.

[0067] This design embodies the concept of precise heat dissipation through "on-demand allocation." In the core region of chip 100, where heat generation is most intense, maximum capacity for the phase change medium and space for vapor generation / condensation (i.e., higher heat dissipation capacity) are provided; while in the edge regions where heat generation is lower, resource allocation is appropriately reduced. This ensures effective overall heat dissipation for chip 100 while achieving a more uniform temperature distribution on its surface, preventing localized overheating, and optimizing material usage and space utilization efficiency.

[0068] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heat dissipation device combining phase change and liquid cooling, characterized in that, The heat dissipation device includes: A phase change conversion plate, wherein the interior of the phase change conversion plate forms a chamber for accommodating a phase change medium, and the lower surface of the phase change conversion plate is used to connect a chip; The liquid cooling plate is connected to the upper surface of the phase change conversion plate, and a groove for containing coolant is formed on the side facing the phase change conversion plate. The liquid cooling plate also has an inlet hole and an outlet hole for coolant to enter and exit.

2. The heat dissipation device combining phase change and liquid cooling according to claim 1, characterized in that, The liquid cooling plate has a serpentine flow channel formed at the top of the groove.

3. The heat dissipation device combining phase change and liquid cooling according to claim 1, characterized in that, The phase transition plate includes: A first sealing plate, the lower surface of which is used to connect the chip; A phase change plate is connected to the upper surface of the first sealing plate, and a perforation is formed on the phase change plate; The second sealing plate is connected to the upper surface of the phase change plate. The first sealing plate and the second sealing plate can close the hollow end, thereby forming the chamber. The phase change conversion plate is connected to the liquid cooling plate through the second sealing plate.

4. The phase change combined with liquid cooling heat dissipation device according to claim 3, characterized in that, The second sealing plate has a first needle fin formed on the side near the liquid cooling plate, and the first needle fin extends into the groove of the liquid cooling plate.

5. The heat dissipation device combining phase change and liquid cooling according to claim 3, characterized in that, The lower surface of the second sealing plate is formed with a second needle wing that can extend into the hollow.

6. The heat dissipation device combining phase change and liquid cooling according to claim 5, characterized in that, The second needle fin is formed as a column or an inverted cone, the cross-sectional area of ​​which decreases along the direction toward the phase change plate.

7. The phase change combined with liquid cooling heat dissipation device according to claim 6, characterized in that, The phase change plate includes: Upper plate, wherein a first cutout is formed on the upper plate; An intermediate plate is connected to the lower surface of the upper plate; a plurality of spaced-apart second cutouts are formed on the intermediate plate, and the projection of the first cutouts on the intermediate plate covers all the second cutouts. The lower plate is connected to the lower surface of the middle plate, and a third cutout is formed on the lower plate. The projection of the third cutout on the middle plate covers the entire second cutout.

8. The heat dissipation device combining phase change and liquid cooling according to claim 7, characterized in that, The lower surface of the second sealing plate forms a plurality of second needle wings, which extend into a plurality of second cutouts in a corresponding manner.

9. The heat dissipation device combining phase change and liquid cooling according to claim 8, characterized in that, The top of the second hollow section has a chamfered edge.

10. The heat dissipation device combining phase change and liquid cooling according to claim 9, characterized in that, The second cutout includes at least one set, with each set of the second cutout corresponding to one chip. The distribution density of each set of the second cutout on the intermediate plate decreases from the projection center of the chip corresponding to that set towards the edge.

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