A 3D chip stacking packaging structure based on heterogeneous integration and a preparation method thereof
By introducing protective components and heat dissipation mechanisms into the chip stacked packaging structure, the problems of chip vibration and high temperature are solved, resulting in higher stability and performance, and extending the chip's lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 广东顺为微电子技术有限公司
- Filing Date
- 2026-01-22
- Publication Date
- 2026-05-29
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing chip stacking packaging structures lack good vibration protection, leading to chip shaking and impact force transmission, which affects signal transmission and connection accuracy. Furthermore, the lack of heat dissipation mechanisms causes high temperature accumulation, reducing chip performance and lifespan.
It employs protective components and heat dissipation mechanisms, including shock absorption mechanisms, buffer mechanisms, flexible connection mechanisms, and heat dissipation mechanisms. It reduces the impact of vibration through dampers, springs, and elastic connections, and effectively dissipates heat through heat dissipation pipes and ventilation holes.
It improves the chip's vibration resistance, prevents loosening and positional misalignment, reduces the probability of equipment failure, extends the chip's lifespan, and enhances computing power and data transmission rate.
Smart Images
Figure CN122121667A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip packaging technology, and in particular to a 3D chip stacking packaging structure and fabrication method based on heterogeneous integration. Background Technology
[0002] 3D chip stacking packaging refers to a system-level packaging structure that tightly stacks multiple heterogeneous chips or wafers, such as logic, memory, and photonics chips, in the vertical direction. It achieves high-density electrical interconnection and mechanical fixation between layers through core technologies such as through-silicon vias (TSVs), hybrid bonding, and micro-bumps. Unlike the "side-by-side layout" of traditional 2D planar packaging, its core is to compress the package volume through three-dimensional stacking, shortening the interconnection distance between chips to the micrometer level. This reduces signal latency by more than 30% and power consumption by 20%-35%. With the development of technologies such as AI and 5G, the demand for chip integration density, transmission bandwidth, and power efficiency continues to rise. Traditional 2D packaging, due to its limited interconnection length, cannot meet the high-density integration requirements of heterogeneous chips. Therefore, a 3D chip stacking packaging structure based on heterogeneous integration is urgently needed to meet user needs.
[0003] The existing technology still has the following problems: 1. Existing chip stacking packaging structures do not have good vibration protection. When chips are installed on carriers for use, they inevitably shake. The unbuffered design cannot absorb external impact and vibration energy. The impact force is directly transmitted to the heterogeneous chip body, which may cause loosening, resulting in signal transmission interruption or performance degradation. In addition, the positional displacement caused by shaking will affect the connection accuracy of external interfaces, reduce the compatibility between the package and external circuits, and thus shorten the chip's lifespan.
[0004] 2. Existing chip stacking and packaging structures do not have heat dissipation mechanisms, which means that the heat generated by the chip during operation cannot be dissipated. High temperatures will cause the chip to work slower and increase signal delay, directly reducing the chip's computing power, data transmission rate and other core performance. High temperature environment will accelerate the aging of internal chip materials, significantly reduce chip lifespan and increase the probability of equipment failure. And opening heat dissipation holes can easily cause chip contamination. Summary of the Invention
[0005] To overcome the shortcomings of chip stacking packaging structures, which lack good vibration protection and inevitably cause chip shaking when mounted on a carrier, the lack of buffer design cannot absorb external impact and vibration energy. The impact force is directly transmitted to the heterogeneous chip body, which may cause loosening, resulting in signal transmission interruption or performance degradation. In addition, the positional displacement caused by shaking will affect the connection accuracy of external interfaces, reduce the compatibility between the package and external circuits, and thus shorten the chip's lifespan. Without a heat dissipation mechanism, the heat generated by the chip during operation cannot be dissipated. High temperature will slow down the chip's working speed, increase signal delay, and directly reduce the chip's computing power, data transmission rate and other core performance. The purpose of this invention is to provide a 3D chip stacking packaging structure and preparation method based on heterogeneous integration to solve the above-mentioned deficiencies.
[0006] This application provides a 3D chip stacking packaging structure based on heterogeneous integration, including a shell, a top cover, a substrate, and a chip block. The outer surface of the top cover has a reserved hole. The outer surface of the shell is snapped onto the top cover. A shield is fixedly installed on the outer surface of the top cover. A protective component is provided on the inner wall of the bottom end of the shell. The outer surface of the protective component is provided with the substrate. The chip block is fixedly welded to the upper surface of the substrate. A heat dissipation mechanism is provided on the outer surface of the substrate. The protective component includes a support plate. A shock-absorbing mechanism is provided at the four corners of the lower surface of the support plate. A buffer mechanism is provided at both ends of the support plate. A flexible connection mechanism is provided in the middle part of the upper surface of the support plate.
[0007] Furthermore, the shock absorption mechanism includes a base, a buffer seat is slidably connected to the inner cavity of the base, a damper is provided between the buffer seat and the base, a first spring is sleeved on the outer surface of the damper, the lower surface of the base is fixedly connected to the bottom wall of the outer shell, and the upper surface of the buffer seat is fixedly connected to the lower surface of the support plate.
[0008] Furthermore, the buffer mechanism includes a buffer frame, a buffer block slidably connected to the outer surface of the buffer frame, a slot formed on the outer surface of the buffer block, a connecting rod fixedly installed on the inner wall of the buffer frame, a second spring sleeved on the outer surface of the connecting rod, positioning blocks fixedly installed at both ends of the support plate, a locking rod slidably connected to the inner cavity of the positioning block, a locking ball movably connected to one end of the locking rod, a slider fixedly installed at the end of the locking rod away from the locking ball, an alarm fixedly installed on the outer surface of the positioning block, a button provided on the outer surface of the positioning block, and a third spring provided in the inner cavity of the positioning block.
[0009] Furthermore, the bottom end of the buffer frame is fixedly connected to the bottom wall of the outer casing, and the buffer block and the connecting rod are slidably connected. There are two symmetrically distributed buffer blocks on one buffer frame, the second spring is located between the inner wall of the buffer frame and the buffer block, the locking ball is located in the middle of the two buffer blocks, and the locking ball and the buffer block are tightly fitted. The alarm and the button are electrically connected, and the pressing of the button controls the alarm to sound an alarm. The slider and the positioning block are slidably connected, and there is a gap between the slider and the button. The third spring is located between the slider and the support plate.
[0010] Furthermore, the flexible connection mechanism includes a limiting ring, a groove on the outer surface of the limiting ring, a floating block in the middle of the limiting ring, a slide rod fixedly mounted on the outer surface of the floating block, a fourth spring sleeved on the outer surface of the slide rod, a washer slidably connected to the outer surface of the slide rod, the limiting ring and the upper surface of the support plate being fixedly connected, the slide rod and the groove being slidably connected, the floating block and the support plate having a gap, the fourth spring being located between the floating block and the washer, the washer being slidably connected to the inner wall of the limiting ring, the top of the floating block and the lower surface of the substrate being fixedly connected, and the top of the limiting ring and the lower surface of the substrate having a gap.
[0011] Furthermore, the heat dissipation mechanism includes a connecting bar, a limiting rod is slidably connected to the inner cavity of the connecting bar, a limiting plate is fixedly installed at the bottom end of the limiting rod, a fifth spring is sleeved on the outer surface of the limiting rod, a heat dissipation plate is fixedly installed at the top end of the limiting rod, a heat dissipation pipe is fixedly installed on the outer surface of the heat dissipation plate, heat dissipation holes are opened on the outer surface of the heat dissipation pipe, a protective cover is fixedly installed in the inner cavity of the top cover, and the heat dissipation plate and the protective cover are slidably connected.
[0012] Furthermore, the shield is located directly above the protective cover, the limiting plate and the outer surface of the chip block are in close contact, the fifth spring is located between the limiting plate and the inner wall of the connecting strip, the heat dissipation pipe and the protective cover are slidably connected, the heat dissipation hole is housed in the inner cavity of the protective cover, the heat dissipation plate connects the two sides of the heat dissipation plate through the heat dissipation hole, and the connecting strip and the outer surface of the substrate are fixedly connected.
[0013] A method for fabricating a D-chip stacked package based on heterogeneous integration, comprising the following steps: S1. Stack heterogeneous chip modules such as logic and memory to form a chip block, and fix the chip block to the outer surface of the substrate. S2. The substrate is limited by the protective components to reduce the impact on the substrate when the shell shakes, and improve the stability of the chip block on the substrate. S3. The heat dissipation mechanism is used to limit the chip block. At the same time, when the chip block expands due to heat during operation, it drives the heat dissipation mechanism to ventilate and dissipate heat. Meanwhile, the shield is used to shield the heat dissipation mechanism to prevent dust from entering the inner cavity of the outer casing. S4. Wiring is done on the reserved holes on the top cover to make electrical connections between the cables and the chip blocks for easy use later.
[0014] The technical solution provided in this application has at least the following technical effects or advantages: 1. By employing protective components, this invention effectively addresses the shortcomings of existing chip stacking packaging structures in terms of vibration protection. When chips are mounted on a carrier, they inevitably experience shaking. Without buffering, the unabsorbing design cannot absorb external impacts and vibrations, and the impact force is directly transmitted to the heterogeneous chip body, potentially causing loosening, signal transmission interruption, or a sudden performance drop. Furthermore, the positional shift caused by shaking affects the connection accuracy of external interfaces, reduces the compatibility between the package and external circuits, and thus shortens the chip's lifespan. This invention, through its protective components, mitigates mechanical impacts and vibrations during chip stacking packaging, preventing chip damage from rigid collisions. It reduces vibration and shaking caused by collisions and provides timely alarms when the chip experiences significant shaking, facilitating user maintenance. It also reduces chip positional shifts that affect the connection accuracy of external interfaces, thereby improving the compatibility between the package and external circuits and extending the chip's lifespan.
[0015] 2. By employing a heat dissipation mechanism, this invention effectively solves the problem of existing chip stacking and packaging structures lacking a heat dissipation mechanism. This results in the chip's expansion heat during operation being unable to dissipate, leading to slower chip operation, increased signal latency, and directly reduced core performance characteristics such as computing power and data transmission rate. High temperatures also accelerate the aging of internal chip materials, significantly reducing chip lifespan and increasing the probability of device failure. While traditional heat dissipation holes can easily contaminate the chip, this invention utilizes a heat dissipation mechanism to provide ventilation and heat dissipation when the chip expands due to heat, rapidly reducing chip instability. Furthermore, the heat dissipation holes have a dustproof effect, reducing external environmental contamination of the chip. This, in turn, improves core performance characteristics such as computing power and data transmission rate, slows down the aging of internal chip materials, significantly extends chip lifespan, and reduces the probability of device failure. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure in Embodiment 1 of this application; Figure 2 This is a schematic diagram of the cross-sectional structure of the top cover in Embodiment 1 of this application; Figure 3 This is a schematic diagram of the substrate structure in Embodiment 1 of this application; Figure 4 This is a schematic diagram of the protective component structure in Embodiment 1 of this application; Figure 5 This is a schematic diagram of the shock absorption mechanism structure in Embodiment 1 of this application; Figure 6 This is a schematic diagram of the buffer mechanism structure in Embodiment 1 of this application; Figure 7 This is a schematic diagram of the positioning block structure in Embodiment 1 of this application; Figure 8 This is a schematic diagram of the flexible connection mechanism structure in Embodiment 1 of this application; Figure 9 This is a schematic diagram of the heat dissipation mechanism in Embodiment 2 of this application.
[0017] In the diagram: 1. Outer shell; 2. Top cover; 3. Shield; 4. Protective components; 41. Support plate; 42. Shock absorption mechanism; 421. Base; 422. Buffer seat; 423. Damper; 424. First spring; 43. Buffer mechanism; 431. Buffer frame; 432. Buffer block; 433. Slot; 434. Connecting rod; 435. Second spring; 436. Positioning block; 437. Locking rod; 438. Locking ball; 439. Slider; 4310 4311. Alarm; 4312. Button; 4313. Third spring; 44. Flexible connection mechanism; 441. Limiting ring; 442. Slide groove; 443. Floating block; 444. Slide rod; 445. Fourth spring; 446. Washer ring; 5. Substrate; 6. Chip block; 7. Heat dissipation mechanism; 71. Connecting bar; 72. Limiting rod; 73. Limiting plate; 74. Fifth spring; 75. Heat dissipation plate; 76. Heat dissipation pipe; 77. Heat dissipation hole; 78. Protective cover. Detailed Implementation
[0018] For chips that lack good vibration protection, this invention can mitigate mechanical shock and vibration during operation through protective components, preventing chip damage from rigid collisions and reducing vibration and shaking during collisions. For chips that lack a heat dissipation mechanism, this invention can provide ventilation and heat dissipation when the chip expands due to heat, rapidly reducing chip instability. The heat dissipation holes also have a dustproof effect, reducing environmental contamination of the chip.
[0019] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods. Example
[0020] Please see Figure 1 , Figure 2 and Figure 3As shown, a 3D chip stacking packaging structure based on heterogeneous integration includes a shell 1, a top cover 2, a substrate 5, and a chip block 6. The outer surface of the top cover 2 has pre-drilled holes. The top cover 2 is snapped onto the outer surface of the shell 1. A shield 3 is fixedly mounted on the outer surface of the top cover 2. A protective component 4 is provided on the inner wall of the bottom end of the shell 1. The substrate 5 is provided on the outer surface of the protective component 4. The chip block 6 is fixedly soldered to the upper surface of the substrate 5. A heat dissipation mechanism 7 is provided on the outer surface of the substrate 5. The chip block 6 is formed by stacking heterogeneous chip modules such as logic and memory chips. Chip block 6 is fixedly welded to the outer surface of substrate 5. Protective component 4 is used to limit substrate 5, reduce the impact on substrate 5 when the outer shell 1 shakes, and improve the stability of chip block 6 on substrate 5. Heat dissipation mechanism 7 is used to limit chip block 6. At the same time, when chip block 6 expands due to heat during operation, it drives heat dissipation mechanism 7 to ventilate and dissipate heat. Meanwhile, shield 3 is used to shield heat dissipation mechanism 7 to prevent dust from entering the inner cavity of outer shell 1. Wiring is done on the reserved hole of top cover 2 to make the cable and chip block 6 electrically connected for subsequent use.
[0021] Please see Figure 3 and Figure 4 As shown, the protective component 4 includes a support plate 41. Shock-absorbing mechanisms 42 are provided at the four corners of the lower surface of the support plate 41, buffer mechanisms 43 are provided at both ends of the support plate 41, and a flexible connection mechanism 44 is provided in the middle of the upper surface of the support plate 41. The substrate 5 is flexibly connected to the support plate 41 through the flexible connection mechanism 44, thereby reducing the damage to the chip block 6 caused by the shaking and vibration of the outer shell 1. The shock-absorbing mechanism 42 is used to dampen the support plate 41, and the buffer mechanism 43 is used to issue an alarm when the support plate 41 shakes significantly, so that the user can take measures.
[0022] Please see Figure 5 , Figure 6 and Figure 7As shown, the shock absorption mechanism 42 includes a base 421, a buffer seat 422 slidably connected to the inner cavity of the base 421, a damper 423 disposed between the buffer seat 422 and the base 421, a first spring 424 sleeved on the outer surface of the damper 423, the lower surface of the base 421 fixedly connected to the bottom wall of the outer shell 1, and the upper surface of the buffer seat 422 fixedly connected to the lower surface of the support plate 41. The buffer mechanism 43 includes a buffer frame 431, a buffer block 432 slidably connected to the outer surface of the buffer frame 431, a slot 433 formed on the outer surface of the buffer block 432, a connecting rod 434 fixedly installed on the inner wall of the buffer frame 431, a second spring 435 sleeved on the outer surface of the connecting rod 434, and positioning blocks 436 fixedly installed at both ends of the support plate 41. A locking rod 437 is slidably connected to the inner cavity of the positioning block 436. A locking ball 438 is movably connected to one end of the locking rod 437. A slider 439 is fixedly installed at the end of the locking rod 437 away from the locking ball 438. An alarm 4310 is fixedly installed on the outer surface of the positioning block 436. A button 4311 is provided on the outer surface of the positioning block 436. A third spring 4312 is provided in the inner cavity of the positioning block 436. The bottom end of the buffer frame 431 is fixedly connected to the bottom wall of the outer shell 1. The buffer block 432 and the connecting rod 434 are slidably connected. There are two symmetrically distributed buffer blocks 432 on one buffer frame 431. The second spring 435 is located between the inner wall of the buffer frame 431 and the buffer block 432. The locking ball 438 is located in the middle of the two buffer blocks 432. 8 and buffer block 432 are tightly fitted together. Alarm 4310 and button 4311 are electrically connected, and pressing button 4311 controls alarm 4310 to sound an alarm. Slider 439 and positioning block 436 are slidably connected. There is a gap between slider 439 and button 4311. Third spring 4312 is located between slider 439 and support plate 41. When the overall structure shakes, shock absorption mechanism 42 is used to dampen support plate 41. At this time, the vibration of outer shell 1 drives shock absorption mechanism 42 to vibrate, thereby driving buffer seat 422 to slide in the inner cavity of base 421. At this time, damper 423 extends and retracts in conjunction with the elastic force of first spring 424 to reduce the vibration amplitude of support plate 41, thereby damping chip block 6. At the same time, support plate 41 When significant vibration or shaking occurs, the support plate 41 moves the positioning block 436, which in turn moves the locking rod 437. At this time, the locking ball 438 slides on the buffer block 432. When the locking ball 438 engages with the locking groove 433, the elastic force of the third spring 4312 compresses the slider 439, causing it to press the button 4311. This triggers the alarm 4310 to alert the user for maintenance. Simultaneously, the shaking of the support plate 41 causes the locking rod 437 to continue moving. Since the locking ball 438 is engaged with the locking groove 433, the buffer block 432 slides on the connecting rod 434 and compresses the second spring 435. The elastic force of the second spring 435 then provides a secondary buffering effect.This means that it can provide secondary buffering when chip block 6 experiences significant floating or shaking, improving the protection of chip block 6 and preventing its positional shift from affecting the connection accuracy of external interfaces. This, in turn, improves the compatibility of the package with external circuits, thereby extending the chip's lifespan.
[0023] Please see Figure 7 and Figure 8 As shown, the flexible connection mechanism 44 includes a limiting ring 441. A groove 442 is formed on the outer surface of the limiting ring 441. A floating block 443 is provided in the middle of the limiting ring 441. A sliding rod 444 is fixedly installed on the outer surface of the floating block 443. A fourth spring 445 is sleeved on the outer surface of the sliding rod 444. A washer 446 is slidably connected to the outer surface of the sliding rod 444. The limiting ring 441 is fixedly connected to the upper surface of the support plate 41. The sliding rod 444 and the groove 442 are slidably connected. There is a gap between the floating block 443 and the support plate 41. The fourth spring 445 is located between the floating block 443 and the washer 446. The washer 446 is used for... To prevent the fourth spring 445 and the inner wall of the limiting ring 441 from rubbing against each other, the pad ring 446 and the inner wall of the limiting ring 441 are slidably connected. The top of the floating block 443 is fixedly connected to the lower surface of the substrate 5. There is a gap between the top of the limiting ring 441 and the lower surface of the substrate 5. When the structure shakes, it causes the floating block 443 to shake in the inner cavity of the limiting ring 441. At this time, the slide rod 444 slides in the inner cavity of the slide groove 442 and squeezes the fourth spring 445, so that the floating block 443 can reduce the shaking amplitude, thereby reducing the shaking amplitude of the chip block 6, so that the chip block 6 can be stably installed on the outer surface of the substrate 5 for easy use. Example
[0024] Please see Figure 9As shown, the heat dissipation mechanism 7 includes a connecting bar 71, a limiting rod 72 slidably connected to the inner cavity of the connecting bar 71, a limiting plate 73 fixedly installed at the bottom end of the limiting rod 72, a fifth spring 74 sleeved on the outer surface of the limiting rod 72, a heat dissipation plate 75 fixedly installed at the top end of the limiting rod 72, a heat dissipation pipe 76 fixedly installed on the outer surface of the heat dissipation plate 75, heat dissipation holes 77 opened on the outer surface of the heat dissipation pipe 76, a protective cover 78 fixedly installed in the inner cavity of the top cover 2, the heat dissipation plate 75 and the protective cover 78 slidably connected, a shielding cover 3 located directly above the protective cover 78, used to prevent dust when the heat dissipation holes 77 are exposed, reducing the probability of dust entering the interior of the outer casing 1, the limiting plate 73 is in close contact with the outer surface of the chip block 6, which can be used to limit the chip block 6, improving the stability of the connection between the pins of the chip block 6 and the substrate 5, the fifth spring 74 is located between the limiting plate 73 and the inner wall of the connecting bar 71, and the heat dissipation pipe 76 and the protective cover 78 are slidably connected. The heat dissipation holes 77 are housed within the inner cavity of the protective cover 78. The heat dissipation plate 75 is connected to both sides through the heat dissipation holes 77. The connecting strip 71 is fixedly connected to the outer surface of the substrate 5. When the chip block 6 expands due to heat, it exerts a squeezing effect on the limiting plate 73. At this time, the limiting plate 73 drives the limiting rod 72 to slide within the inner cavity of the connecting strip 71 and squeezes the fifth spring 74. The movement of the limiting rod 72 causes the heat dissipation plate 75 to slide within the inner cavity of the protective cover 78. The movement of the heat dissipation plate 75 causes the heat dissipation pipe 76 to slide within the inner cavity of the protective cover 78. At this time, the heat dissipation holes 77 are exposed on the outer surface of the top cover 2 for ventilation and heat dissipation, which rapidly reduces the temperature of the chip block 6. The heat dissipation pipe 76 returns to its original position under the elastic force of the fifth spring 74 to prevent dust from entering, thereby improving the core performance of the chip block 6, such as computing power and data transmission rate, reducing the aging rate of internal materials, significantly improving the chip's lifespan, and reducing the probability of equipment failure.
[0025] In summary, heterogeneous chip modules such as logic and storage are stacked to form chip block 6, which is then fixedly soldered to the outer surface of substrate 5. Protective component 4 is used to limit the substrate 5, reducing the impact of shaking of the outer casing 1 and improving the stability of chip block 6 on substrate 5. Heat dissipation mechanism 7 is used to limit the chip block 6 and, when chip block 6 expands due to heat during operation, drives heat dissipation mechanism 7 for ventilation. Simultaneously, shielding cover 3 is used to shield heat dissipation mechanism 7 to prevent dust from entering the inner cavity of outer casing 1. Wiring is performed through pre-drilled holes in top cover 2 to electrically connect cables to chip block 6 for easy subsequent use. Flexible connection mechanism 44 flexibly connects substrate 5 to support plate 41, thereby reducing damage to chip block 6 caused by shaking and vibration of outer casing 1. Vibration damping mechanism 42 is used to dampen vibrations in support plate 41. The buffer mechanism 43 is used to issue an alarm when the support plate 41 shakes significantly, so that the user can take measures. When the chip block 6 expands due to heat, it will squeeze the limiting plate 73. At this time, the limiting plate 73 drives the limiting rod 72 to slide in the inner cavity of the connecting bar 71 and squeeze the fifth spring 74. The movement of the limiting rod 72 drives the heat sink 75 to slide in the inner cavity of the protective cover 78. The movement of the heat sink 75 drives the heat sink 76 to slide in the inner cavity of the protective cover 78. At this time, the heat dissipation hole 77 is exposed on the outer surface of the top cover 2 for ventilation and heat dissipation, so that the temperature of the chip block 6 drops rapidly. The heat sink 76 returns to its original position under the elastic force of the fifth spring 74 to prevent dust from entering, thereby improving the core performance of the chip block 6 such as computing power and data transmission rate, reducing the aging rate of the internal materials, significantly improving the chip life and reducing the probability of equipment failure.
[0026] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.
[0027] The above description is merely a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present application, based on the technical solution and concept of the present application, should be covered within the scope of protection of the present application.
Claims
1. A 3D chip stacking packaging structure based on heterogeneous integration, comprising a shell (1), a top cover (2), a substrate (5), and a chip block (6), wherein the outer surface of the top cover (2) is provided with a pre-drilled hole, characterized in that, The outer surface of the outer shell (1) is fitted with a top cover (2), and a shield (3) is fixedly installed on the outer surface of the top cover (2). A protective component (4) is provided on the inner wall of the bottom end of the outer shell (1). A substrate (5) is provided on the outer surface of the protective component (4). A chip block (6) is fixedly welded on the upper surface of the substrate (5). A heat dissipation mechanism (7) is provided on the outer surface of the substrate (5). The protective component (4) includes a support plate (41), a shock-absorbing mechanism (42) is provided at the four corners of the lower surface of the support plate (41), a buffer mechanism (43) is provided at both ends of the support plate (41), and a flexible connection mechanism (44) is provided in the middle part of the upper surface of the support plate (41).
2. The 3D chip stacking packaging structure based on heterogeneous integration as described in claim 1, characterized in that, The shock absorption mechanism (42) includes a base (421), a buffer seat (422) is slidably connected to the inner cavity of the base (421), a damper (423) is provided between the buffer seat (422) and the base (421), a first spring (424) is sleeved on the outer surface of the damper (423), the lower surface of the base (421) is fixedly connected to the bottom wall of the outer shell (1), and the upper surface of the buffer seat (422) is fixedly connected to the lower surface of the support plate (41).
3. The 3D chip stacking packaging structure based on heterogeneous integration as described in claim 1, characterized in that, The buffer mechanism (43) includes a buffer frame (431), a buffer block (432) is slidably connected to the outer surface of the buffer frame (431), a slot (433) is provided on the outer surface of the buffer block (432), a connecting rod (434) is fixedly installed on the inner wall of the buffer frame (431), a second spring (435) is sleeved on the outer surface of the connecting rod (434), positioning blocks (436) are fixedly installed at both ends of the support plate (41), a locking rod (437) is slidably connected to the inner cavity of the positioning block (436), a locking ball (438) is movably connected to one end of the locking rod (437), a slider (439) is fixedly installed at the end of the locking rod (437) away from the locking ball (438), an alarm (4310) is fixedly installed on the outer surface of the positioning block (436), a button (4311) is provided on the outer surface of the positioning block (436), and a third spring (4312) is provided in the inner cavity of the positioning block (436).
4. The 3D chip stacking packaging structure based on heterogeneous integration as described in claim 3, characterized in that, The bottom end of the buffer frame (431) is fixedly connected to the bottom wall of the outer shell (1). The buffer block (432) and the connecting rod (434) are slidably connected. There are two symmetrically distributed buffer blocks (432) on one buffer frame (431). The second spring (435) is located between the inner wall of the buffer frame (431) and the buffer block (432). The locking ball (438) is located in the middle of the two buffer blocks (432), and the locking ball (438) and the buffer block (432) are tightly fitted. The alarm (4310) and the button (4311) are electrically connected. Pressing the button (4311) controls the alarm (4310) to sound an alarm. The slider (439) and the positioning block (436) are slidably connected. There is a gap between the slider (439) and the button (4311). The third spring (4312) is located between the slider (439) and the support plate (41).
5. A 3D chip stacking packaging structure based on heterogeneous integration as described in claim 1, characterized in that, The flexible connection mechanism (44) includes a limiting ring (441), the outer surface of which is provided with a sliding groove (442), a floating block (443) is provided in the middle part of the limiting ring (441), a sliding rod (444) is fixedly installed on the outer surface of the floating block (443), a fourth spring (445) is sleeved on the outer surface of the sliding rod (444), and a washer (446) is slidably connected to the outer surface of the sliding rod (444). The limiting ring (441) and the support plate The upper surface of (41) is fixedly connected, the slide rod (444) and the slide groove (442) are slidably connected, the floating block (443) and the support plate (41) have a gap, the fourth spring (445) is located between the floating block (443) and the washer (446), the washer (446) and the inner wall of the limiting ring (441) are slidably connected, the top end of the floating block (443) and the lower surface of the base plate (5) are fixedly connected, and the top end of the limiting ring (441) and the lower surface of the base plate (5) have a gap.
6. The 3D chip stacking packaging structure based on heterogeneous integration as described in claim 1, characterized in that, The heat dissipation mechanism (7) includes a connecting bar (71), a limiting rod (72) is slidably connected to the inner cavity of the connecting bar (71), a limiting plate (73) is fixedly installed at the bottom end of the limiting rod (72), a fifth spring (74) is sleeved on the outer surface of the limiting rod (72), a heat dissipation plate (75) is fixedly installed at the top end of the limiting rod (72), a heat dissipation pipe (76) is fixedly installed on the outer surface of the heat dissipation plate (75), a heat dissipation hole (77) is opened on the outer surface of the heat dissipation pipe (76), a protective cover (78) is fixedly installed in the inner cavity of the top cover (2), and the heat dissipation plate (75) and the protective cover (78) are slidably connected.
7. A 3D chip stacking packaging structure based on heterogeneous integration as described in claim 6, characterized in that, The shield (3) is located directly above the protective cover (78). The limiting plate (73) and the outer surface of the chip block (6) are in close contact. The fifth spring (74) is located between the limiting plate (73) and the inner wall of the connecting strip (71). The heat dissipation pipe (76) and the protective cover (78) are slidably connected. The heat dissipation hole (77) is housed in the inner cavity of the protective cover (78). The heat dissipation plate (75) is connected to both sides of the heat dissipation plate (75) through the heat dissipation hole (77). The connecting strip (71) and the outer surface of the substrate (5) are fixedly connected.
8. A method for fabricating 3D chip stacking packaging based on heterogeneous integration, comprising fabricating a 3D chip stacking packaging structure based on heterogeneous integration as described in any one of claims 1-7, characterized in that, Includes the following steps: S1. Stack heterogeneous chip modules such as logic and storage to form a chip block (6), and fix the chip block (6) on the outer surface of the substrate (5); S2. The substrate (5) is limited by the protective component (4) to reduce the impact on the substrate (5) when the outer shell (1) shakes, and to improve the stability of the chip block (6) on the substrate (5). S3. The heat dissipation mechanism (7) is used to limit the chip block (6). At the same time, when the chip block (6) expands due to heat during operation, it drives the heat dissipation mechanism (7) to ventilate and dissipate heat. Meanwhile, the shield (3) is used to shield the heat dissipation mechanism (7) to prevent dust from entering the inner cavity of the outer shell (1). S4. Wiring is done on the reserved hole of the top cover (2) so that the cable and the chip block (6) are electrically connected for easy use later.