Fluid cartridge with retention member

Abstract

A fluid cartridge includes a fluid ejection device coupled to a cartridge body, a thin interconnect circuit coupled at a first end to the fluid ejection device and at a second end to an outer surface of the cartridge body, and a retention member extending over a portion of the thin interconnect circuit to retain the thin interconnect circuit against the outer surface.

Description

Background Technology

[0001] A fluid die is a structure in which fluid can move through channels in one or more layers or stacks of material. In the context of integrated circuits, a die refers to a block of semiconductor material including circuit components; a fluid die may include fluid components, mechanical components, and / or circuit components. In the context of printing, one type of fluid die includes a fluid jet die. A fluid jet die may include smaller channels that transport fluid (e.g., ink) to a jet chamber, in which the fluid is ejected from the die. The die may be molded into or otherwise coupled to a fluid distribution body that delivers fluid to the die. Other types of fluid dies may exist. For example, but not limited to, in the context of lab-on-a-chip, a fluid die may include circuit elements and / or fluid elements for mixing and separating, fluid logic blocks, measurement devices, etc. The fluid jet die and the fluid distribution body may be coupled to the body of a fluid cartridge. The fluid cartridge may include a fluid reservoir that stores a volume of fluid and delivers the fluid to the fluid distribution body. The cartridge can be installed in the body of a fluid jetting device (such as an inkjet printer) that controls the ejection of fluid from the die. The fluid jetting die may include or be connected to circuitry electrically connected to a corresponding circuitry in the fluid jetting device body to establish communication between the fluid jetting device body and the fluid jetting die. Attached Figure Description

[0002] Figure 1A and Figure 1B This is a cross-sectional side view of an example of a fluid jetting core.

[0003] Figure 2A and Figure 2B This is a cross-sectional side view of an example fluid cell.

[0004] Figure 3 This is a three-dimensional view of an example of a fluidic chamber.

[0005] Figures 4A to 4F An example of a method for assembling a fluid box is illustrated.

[0006] Figure 4G This is a 3D view of a portion of an example of a fluid box.

[0007] Figure 5A This is a perspective view of an example of a fluid box in a forging apparatus.

[0008] Figure 5B yes Figure 5A A cross-sectional side view of the fluid box in the forging device.

[0009] Figure 6AThis is a cross-sectional side view of an example of a fluid box connected to the body of a fluid jetting device.

[0010] Figure 6B yes Figure 6A A cross-sectional side view of the fluid box being removed from the fluid jetting device body.

[0011] Figure 7A This is a cross-sectional side view of an example of a fluid cartridge being removed from the body of a fluid jetting device.

[0012] Figure 7B This is a side view of an example of a fluid box.

[0013] Figure 8 This is a top view of an example of a fluid box.

[0014] Figure 9 This is a top view of an example of a fluid box.

[0015] It will be appreciated that the accompanying drawings are schematic representations for illustrative purposes. The drawings are provided to illustrate one or more embodiments, and it is clearly understood that the drawings are not intended to limit the scope of the claims. Detailed Implementation

[0016] Now for reference Figure 1A and Figure 1B The figures show cross-sectional side and end views of an example fluid flow structure 10 according to some examples. It should be understood that the figures are not drawn to scale and the dimensions of some components are enlarged for clarity. The fluid flow structure 10 may include a fluid core 12. Figure 1A and Figure 1BThe fluid die 12 is shown as a fluid jetting die, such as an ink jetting die for an inkjet printer. However, it should be understood that other types of fluid dies 12 (e.g., lab-on-a-chip or other MEMS devices) can be similarly embedded in the fluid flow structure 10. Other fluids that can be jetted from the fluid die 12 include primers, varnishes, fluxes or refiners for 3D printers, and biomaterials. The fluid die 12 can be an elongated strip with a length greater than three times its width. In some examples, the fluid die 12 may include a substrate 14 and a jetting layer 16, the substrate of which may be made of silicon. As discussed above, the fluid die 12 may be molded into or otherwise coupled to a fluid dispensing body 18. The fluid dispensing body 18 may include a fluid channel 20 (e.g., a slot) fluidly coupled to a fluid feed orifice 22 in the substrate 14. The fluid feed orifice 22 extends through the substrate 14 and is further fluidly coupled to a jetting chamber 24 in the jetting layer 16. Fluid can be supplied to fluid channel 20 and can travel through fluid feed orifice 22 to reach ejection chamber 24. When current is supplied to resistor 27 positioned near the top of ejection chamber 24, the resistor can be rapidly heated, causing fluid to be ejected from nozzle 26, which is fluidly connected to ejection chamber 24. Ejection layer 16 may include bonding pads 28 at each end to form an electrical connection with electrical terminals of a control device (e.g., inkjet printer body) (e.g., via a connection to thin interconnect circuitry 36, as described herein). When fluid die 12 is a fluid ejection die (e.g., an ink ejection die for an inkjet printer), fluid flow structure 10 may be referred to as a fluid ejection device.

[0017] Now for reference Figure 2A An example of a fluid cartridge 30 is shown. The fluid cartridge 30 includes a cartridge body 32 and a fluid jetting device 10. The cartridge body includes a reservoir 34 for storing a certain volume of fluid. The fluid jetting device 10 may include or be connected to a thin interconnect circuit 36, which is electrically connected at a first end to a fluid jetting spool 12 and extends from one end of the spool to a second end. The thin interconnect circuit 36 ​​may be electrically connected to the body of the fluid jetting device and receive electrical signals from a controller of the fluid jetting device body, thereby energizing a resistor 27 and discharging fluid from a nozzle 26 at a precise time. Figure 2A As shown, the fluid injection device 10 is connected to the first side 38 of the box body 32. (As indicated...) Figure 2A As shown, a thin interconnect circuit 36 ​​extends from one end of the fluid jetting device 10, bends around the edge 40 of the housing body 32, and connects at its distal end to a second side 42 of the housing body 32 (e.g., the front face of the housing body 32). The second side 42 of the housing body 32 may be orthogonal or substantially orthogonal to the first side 38, such as... Figure 2AAs shown. However, in other examples, the second side 42 may not be orthogonal to the first side 38. The thin interconnect circuit 36 ​​should be "thin" so that it is located in the contact array between the body of the fluid cartridge 30 and the body of the fluid jetting device (e.g., the contact array in the fluid cartridge holder of the fluid jetting device) (e.g., electrical contacts 86, such as...). Figure 6A The function can be achieved through flexible circuitry with contacts and / or thin printed circuit boards (PCBs) with contacts, or, in any case, through suitable flat interconnect circuitry for transmitting signals from the body of the fluid jetting device to the fluid jetting die 12 on a thin plastic or composite single-layer or multi-layer substrate. Flexible circuitry can be less fragile and more flexible than thin PCBs, but PCBs or other substrate types can also work. As used herein, “thin” refers to a relatively small thickness of the circuitry (e.g., substrate layers, cover layers, and interconnect circuitry), or in other words, a flat circuitry. While the specific dimensions of the thickness can vary, maximum thicknesses of 3 mm, 2 mm, or 1 mm can be applied (these values ​​are arbitrary), and maximum thicknesses of 2 mm or 1 mm can also be applied depending on the technology chosen. In some examples, the thickness of the thin interconnect circuitry 36 is much lower than these thicknesses. For example, the thin interconnect circuitry 36 can have a maximum thickness of approximately 110 micrometers or less. As discussed above, the thin interconnect circuitry 36 can be a flexible circuit (e.g., a flex circuit), or at least a portion of the thin interconnect circuitry 36 can be a flexible circuit.

[0018] To assemble the fluid cartridge 30, the fluid jetting device 10 may first be attached to a first side 38 of the cartridge body 32, with the thin interconnect circuit 36 ​​extending beyond the edge 40 of the cartridge body 32. An adhesive material (e.g., pressure-sensitive adhesive) may be applied to the distal end of the thin interconnect circuit 36 ​​and / or the second side 42 of the cartridge body 32. The thin interconnect circuit 36 ​​may then be bent around the edge 40 of the cartridge body 32, and the distal end of the thin interconnect circuit 36 ​​may be pressed against the second side 42 of the cartridge body 32 to adhere the distal end of the thin interconnect circuit 36 ​​to the second side 42 of the cartridge body 32 using the adhesive material.

[0019] Figure 3 The text further details the process. Figure 2AThe thin interconnect circuit 36 ​​includes an interface portion 44 (e.g., a front portion) positioned around the distal end of the flexible circuit 36. This interface portion includes electrical contacts 54 (e.g., contact pillars) for interface connection with corresponding electrical contacts 54 of the body of the fluid jetting device. The portion of the thin interconnect circuit 36 ​​between the interface portion 44 and the fluid jetting device 10 may be referred to as a bend portion 46. The bend portion 46 may include circuitry for electrically connecting the electrical contacts 54 of the interface portion 44 to the fluid jetting die 12 (e.g., connecting a first end of the thin interconnect circuit 36 ​​to a second end). The interface portion 44 may have a length L1. To achieve a reliable electrical connection between the thin interconnect circuit 36 ​​and the fluid jetting device body, the interface portion 44 should be positioned substantially directly against the second side 42 of the housing body 32 along its entire length L1. However, in some examples, the thin interconnect circuit 36 ​​may have a degree of rigidity such that the adhesive force applied by the adhesive material is insufficient to keep the entire length L1 of the interface portion 44 directly against the second side 42 of the housing body 32. Reducing the size of the thin interconnect circuitry 36 might be desirable, which could lower the cost of the fluid cartridge 30. However, reducing the surface area of ​​the interface portion 44 could also reduce the adhesive strength of the adhesive material. Furthermore, during use, the fluid from the reservoir 34 may be aerosolized or vaporized as it is ejected from the fluid jet dies 12 and may come into contact with the adhesive material. Some fluids (e.g., solvent-based inks) may interact with and degrade the adhesive material, further reducing adhesive strength. Figure 2B As shown, this could cause a portion of the interface portion 44 to be pulled away from the second side 42 of the housing body 32, resulting in the length L2 of the interface portion 44 positioned against the second side 42 of the housing body 32 being less than the length L1 of the interface portion 44. This could interfere with the electrical connection between the thin interconnect circuit 36 ​​and the fluid jetting device body. Over time, the interface portion 44 may become completely disconnected from the second side 42 of the housing body 32.

[0020] Now for reference Figure 3 An example of a portion of the fluid cartridge 30 is shown. In addition to what is shown and described herein, Figure 3 The fluid box 30 can be substantially similar to Figure 2A and Figure 2B The fluid cartridge 30 includes a fluid injection device 10 connected to a first side 38 of the cartridge body 32. (Example: ...) Figure 4C As further shown in detail, the thin interconnect circuit 36 ​​extends from the fluid jetting device 10 around the edge 40 of the housing body 32, and the interface portion 44 of the thin interconnect circuit 36 ​​is positioned against the second side 42 of the housing body 32. In addition to the adhesive material that bonds the thin interconnect circuit 36 ​​to the second side 42 of the housing body 32, Figure 3The fluid cartridge 30 also includes a retaining member 50, which is coupled to or integrally formed with the cartridge body 32. In some examples, the fluid cartridge 30 may include a... Figure 3 The diagram shows more or fewer retaining members 50. Each retaining member 50 may extend over an edge 48 of the thin interconnect circuit 36 ​​to retain the thin interconnect circuit 36 ​​(e.g., interface portion 44 of the thin interconnect circuit 36) against a second side 42 of the housing body 32. In some examples, the thin interconnect circuit may include an opening, and the retaining member 50 may extend through the opening and beyond the edge of the opening.

[0021] Now for reference Figures 4A to 4F The assembly is shown. Figure 3 An example of the method for fluid cell 30. For example... Figure 4A As shown, the box body 32 is formed to include a protrusion 52 on its second side 42. The protrusion 52 may be integrally formed with at least a portion of the box body 32. For example, the box body 32 may be formed in a molding process (e.g., injection molding). Material (e.g., plastic, PET, etc.) may be injected into a mold having cavities in the shape of the box body 32 until the material fills the mold, thereby forming the box body 32. The mold may include small cavities or recesses that may be filled with material to form the protrusion 52. The protrusion may be considered as part of the outer surface of the box body 32. Figure 4B As shown, the fluid jetting device 10 is attached to the first side 38 of the cartridge body 32, for example, using a thermosetting adhesive or a pressure-sensitive adhesive. In some cases, the thin interconnect circuit 36 ​​may be attached to the fluid jetting device 10 before it is attached to the cartridge body 32. In some cases, the thin interconnect circuit 36 ​​may be attached to the fluid jetting device 10 after it is attached to the cartridge body 32. Figure 4C As shown, the thin interconnect circuit 36 ​​is bent around the edge 40 of the housing body 32, and the interface portion 44 of the thin interconnect circuit 36 ​​is positioned (e.g., pressed against) against the second side 42 (e.g., the outer surface of the second side 42). Figure 4C As shown, the housing body 32 may include two protrusions 52, and the interface portion 44 of the thin interconnect circuitry 36 may be positioned between the two protrusions 52. The protrusions 52 may be positioned near the proximal end of the interface portion 44 (e.g., the end of the interface portion 44 closest to the edge 40 of the housing body 32), adjacent to the curved portion 46. For example, the distance from the protrusion 52 to the edge 40 of the housing body 32 may be shorter than the distance from each electrical contact 54 to the edge 40 of the housing body 32. For example, as... Figure 4C As shown, the protrusion is positioned at a distance D1 from the edge 40 of the box body 32, and the electrical contact 54 closest to the edge 40 is positioned at a distance D2 from the edge, where distance D2 is greater than distance D1.

[0022] Figure 4D The protrusion 52, the bend 46, and the interface portion 44 of the thin interconnect circuit 36 ​​are shown from the rear, while the rest of the fluid box 30 is hidden. Figure 4D A forging tool 60 (e.g., a forging apparatus) is further shown, comprising a stake shoe portion 61 and a swage shoe portion 59. The swage shoe portion 59 includes a cavity 62 shaped like a retaining member 50. The forging tool 60 presses against a second side 42 of the housing body 32, the cavity 62 being positioned to receive a protrusion 52. The stake shoe portion 61 presses an interface portion 44 of a thin interconnect circuit 36 ​​onto an adhesive 67, which can be bonded to either the interface portion 44 or the second side 42 of the housing body 32, thereby bonding the thin interconnect circuit 36 ​​to the second side 42 of the housing body 32. The swage shoe portion 59 deforms at least a portion of each retaining member 50 and forms material into the retaining member 50. In some examples, the forging tool 60 can be heated to raise the temperature of the protrusion 52 above the glass transition temperature of the material, thereby allowing the material to be deformed more easily. In some examples, pressure can be used to deform the protrusion 52 without heating the material. The forging tool 60 may further include a boss 63 adjacent to each cavity 62 in a direction adjacent to the distal end of the interface portion 44. The boss 63 may block the flow of material from the protrusion 52 across the boss 63 in a distal direction (e.g., in the opposite direction to the fluid jet device 10, downward as shown), forcing more material toward the proximal end of the interface portion 44 (e.g., upward as shown) and across the edge 48 of the thin interconnect circuit 36.

[0023] like Figure 4E As shown, the retaining member 50 is formed by the forging tool 60 to overlap (e.g., extend thereon) the edge 48 of the thin interconnect circuit 36 ​​(e.g., the outer edge of the interface portion 44) to hold the thin interconnect circuit 36 ​​against the second side 42 of the housing body 32. In some examples, additional protrusions 52 may be positioned at different locations around the periphery of the interface portion 44, e.g., adjacent to the distal end of the interface portion 44, and formed as retaining members 50. In some examples, protrusions 52 may be positioned adjacent to the bend 46 (e.g., at one end of the bend 46 adjacent to the interface portion 44). This reduces the force required to pull the interface portion 44 away from the housing body 32, making the adhesive sufficient to attach the interface portion 44 to the housing body 32 without the need for any additional retaining members 50 adjacent to the interface portion. Figure 4FAs shown, in some cases, the protrusion 52 may extend through the opening 64 in the thin interconnect circuit 36, and the forging tool 60 may mold the protrusion 52 to form retaining members that overlap (e.g., extend over) the edges 65 of the opening 64, which can be considered as edges of the thin interconnect circuit 36. In some examples, the shoe portion 61 and the forging shoe portion 59 may be part of a separate tool. For example, the interface portion 44 may be pressed first by a first tool including the shoe portion 61, and the protrusion 52 may be pressed separately by a second tool including the forging shoe portion 59.

[0024] In some examples, different types of retaining members 50 not integrally formed with the box body 32 may be used to secure the interface portion 44 to the box body 32. The retaining member 50 may alternatively be separately attached to the box body. "Separately attached" may mean that the retaining member 50 is welded, press-fitted, or adhered to the box body 32 by adhesive. For example, a retaining member 50 may be adhesively attached to the box body 32 and extend over a portion of the interface portion 44 or a portion of the bend 46. In other examples, the retaining member 50 may be threaded to the box body 32. In other examples, the retaining member 50 (e.g., an insert) may be press-fitted (e.g., press-fitted) into a corresponding hole (e.g., a blind hole) in the box body 32 and extend over a portion of the interface portion 44 or a portion of the bend 46. The blind hole for receiving the insert may be molded (e.g., when the box body 32 is molded) or machined into the box body 32. Alternatively or additionally, adhesive may be used to attach the retaining member 50 to the box body 32. For example, adhesive can be applied to holes in the housing body 32 or directly attached to the (e.g., flush, flat) walls of the housing body 32. Assembly using press-fit retaining members 50 is faster than using adhesive to attach retaining members 50 to the housing body 32 (which may require holding and curing time).

[0025] Now for reference Figure 4GA portion of an example fluid cartridge 30 is shown. The fluid cartridge 30 includes a retaining member 50 extending across a thin interconnect circuit 36. The retaining member 50 includes two end portions 110 and a bridging portion 112. These two end portions can be coupled to the outer surface of the cartridge body 32 on either side of the interface portion 44 of the thin interconnect circuit 36 ​​(e.g., to a second side 42 of the cartridge body 32). For example, the end portions 110 can be coupled to the cartridge body using an adhesive (such as a pressure-sensitive adhesive or a thermosetting adhesive). The bridging portion 112 extends across the interface portion 44 between the end portions 110. Therefore, the bridging portion 112 secures a portion of the interface portion 44 against the outer surface of the cartridge body 32. The retaining member 50 can effectively increase the surface area of ​​the adhesive that couples the interface portion 44 to the cartridge body 32, exceeding the surface area of ​​the interface portion 44 itself. Figure 4G The additional retaining member 50 shown can be used in other locations to secure the interface portion 44, provided that the bridging portion 112 does not interfere with the contact between the electrical contact 54 and the corresponding contact of the fluid jetting device body. In some examples, the width of the bridging portion 112 can be smaller than the width of the end portion 11, allowing for an increase in the surface area of ​​the end portion 110 without increasing the size of the bridging portion 112 extending across the thin interconnect circuit 36, and thus increasing the adhesive force provided by the end portion. In some examples, Figure 4G The retaining member 50 shown can span the curved portion 46 of the thin interconnect circuit 36.

[0026] Figure 5A and Figure 5B Further details are shown Figure 4D The hot-melting process. The forging tool 60 can be coupled to a press 66, which may include a heating element (e.g., a resistance heating element) to heat the forging tool 60. Figure 4D In the example shown, the forging tool 60 includes a forging shoe portion 59 with a cavity 62 for molding the protrusion 52 into a retaining member 50, as discussed above. The stud shoe portion 61 of the forging tool 60 presses the remainder of the interface portion 44 of the thin interconnect circuit 36 ​​against a second side 42 of the housing body 32. As discussed above, pressure-sensitive adhesive can be applied to the interface portion 44 or to a portion of the second side 42 of the housing body 32. The stud shoe portion 61 of the forging tool 60 can press the interface portion 44 such that the adhesive bonds the interface portion 44 to the second side 42 of the housing body 32. Furthermore, by pressing the interface portion 44 against the second side 42 of the housing body 32, the stud shoe portion 61 ensures that the interface portion 44 remains in the correct position while the forging shoe portion 59 molds the protrusion 52 into the retaining member 50. Figure 5BThe cross-section of the forged shoe portion 59, in which the protrusion 52 is molded into the retaining member 50, is shown, illustrating both the protrusion 52 before molding and the retaining member 50 after molding. Figure 5B As shown, the protrusion 52 has a height H1 and a width W1. A forging shoe portion 59 shapes the protrusion 52 into retaining members 50, these retaining members having a width W2 greater than the width W1 of the protrusion 52 and a height H2 smaller than the height H1 of the protrusion. The forging shoe portion 59 may include a single cavity 62 to receive two protrusions 52, thereby allowing material to flow freely toward the center of the thin interconnect circuit 36. The forging shoe portion 59 pushes the material of the protrusion 52 across the edge 48 of the thin interconnect circuit 36 ​​to form retaining members 50, which have overlapping portions 72 extending across the edge 48 of the thin interconnect circuit 36.

[0027] Now for reference Figure 6A and Figure 6B Example fluid cartridge 30 is shown both installed in the body 82 of the fluid jetting device 80 and removed from the body 82 of the fluid jetting device 80. Figure 6A As shown, the body 82 of the fluid jetting device 80 includes a terminal 84 with electrical contacts 86. When the fluid cartridge 30 is installed in the body 82 of the fluid jetting device 80, the electrical contacts 86 of the terminal 84 contact the electrical contacts 54 of the thin interconnect circuit 36, thereby forming an electrical connection between the body 82 and the fluid jetting device 10. A retaining member 50 is positioned outside the end 88 of the terminal 84 (e.g., below as shown) so that the retaining member 50 does not interfere with the connection between the electrical contacts 54, 86. However, as Figure 6B As shown, the fluid cartridge 30 can be removed from the body 82 of the fluid jetting device 80 by swinging or rotating the fluid cartridge 30 (for example, counterclockwise as shown).

[0028] Now for reference Figure 7A and Figure 7B An example fluid cartridge 30 is shown, wherein each retaining member 50 includes a chamfer or ramp 51 on an end of the retaining member 50. The ramp 51 is shown positioned on the end 53 of the retaining member 50 closest to the distal end of the thin interconnect circuit 36, and away from the fluid jetting device 10 (e.g., opposite). Figure 7A As shown, when the fluid cartridge 30 is swung or rotated (e.g., counterclockwise as shown) to remove the fluid cartridge 30 from the body 82 of the fluid jetting device 80, the ramp 51 allows the retaining member 50 to pass through the end 88 of the terminal 84 without contacting the end 88. The end 53 of the retaining member 50 has a height H3 ( Figure 7B As shown in the figure, this height is less than the height H2 of the retaining member 50. Figure 7B A fluid cartridge 30 is shown, which includes a retaining member 50 having a ramp 51. Figure 7BAlso shown is a restricted area 90, into which the retaining member 50 should not extend to avoid interfering with the terminal 84. The design of the ramp 51 allows the length L2 of the overlapping portion 72 of the retaining member 50 to be longer than the length L3 of the portion of the retaining member 50 having a height H2. This maximizes the structural integrity of the retaining member and helps ensure that the interface portion of the thin interconnect circuit 36 ​​remains positioned against the second side 42 of the housing body 32.

[0029] Now for reference Figure 8 This shows a portion of the assembled example fluid cartridge 30. (See above reference.) Figure 4D The forging tool 60 discussed may include a boss 63 to block material flow from the protrusion 52. The boss 63 may heat-deform a portion of the second side 42 of the housing body 32 to form a notch 92. (As discussed in...) Figure 8 As can be seen, the material of the retaining member 50 does not extend beyond the notch 92 because the boss 63 blocks the flow of material in the distal direction (e.g., downward as shown) of the interface portion 44 of the thin interconnect circuit 36.

[0030] Now for reference Figure 9 This shows a portion of an assembled example fluid cartridge 30. Due to manufacturing and assembly tolerances, the precise positions of the protrusion 52 and the formed retaining member 50 can vary within acceptable limits. Figure 9 Two possible positions 94 and 96 of the retaining member 50 on the second side 42 of the housing body 32 are shown. The first position 94 is the maximum distance from the centerline of the interface portion 44 of the thin interconnect circuit 36. The second position 96 is the minimum distance from the centerline of the interface portion 44 of the thin interconnect circuit 36. It may be desirable to maintain a gap between the retaining member 50 and the wire 98 extending along the thin interconnect circuit 36 ​​to connect the electrical contact 54 to the fluid jet device 10. Figure 9 As shown, the thin interconnect circuit 36 ​​includes a reinforcement 56 that extends outward from the main surface 58 of the thin interconnect circuit 36 ​​(e.g., a portion extending therefrom the retaining member 50 of the thin interconnect circuit) (e.g., extending out of the page as shown). For example, the main surface 58 of the thin interconnect circuit 36 ​​may extend a first distance away from the second side 42 of the housing body 32, and the reinforcement 56 may extend a second distance away from the second side 42 of the housing body 32, the second distance being greater than the first distance. In addition to increasing the strength of the thin interconnect circuit 36, the reinforcement 56 may also prevent material flow from the protrusion 52 beyond the outer edge 55 of the reinforcement 56, so that material cannot reach the wire 98.

[0031] While this specification contains details of specific implementations, these should not be construed as limiting the scope of any possible claims, but rather as descriptions of features specific to particular implementations. Certain features described in the context of individual implementations may also be implemented in combination in a single implementation. Conversely, different features described in the context of a single implementation may also be implemented individually or in any suitable sub-combination in multiple implementations. Furthermore, although features may be described as functioning in certain combinations and even initially claimed in this way, in some cases features of the claimed combination may be removed from the combination, and the claimed combination may involve sub-combinations or variations thereof.

[0032] As used herein with respect to structural features (e.g., to describe shape, size, orientation, direction, relative position, etc.), the terms “approximately,” “about,” “substantially,” and similar terms are intended to cover minor variations in the structure that may result from, for example, manufacturing or assembly processes, and are intended to have a broad meaning consistent with common and accepted usage by one of ordinary skill in the art to which the subject matter of this disclosure pertains. Accordingly, these terms should be understood to indicate that non-substantial or insignificant modifications or alterations to the described and claimed subject matter are considered to fall within the scope of this disclosure as set forth in the appended claims.

[0033] As used herein, the term "connection" and its variations mean that two components are joined together directly or indirectly. Such a connection can be static (e.g., permanent or fixed) or movable (e.g., removable or releasable). Such a connection can be achieved by: the two components being directly connected to each other; the two components being connected to each other using a single intermediate component and any additional intermediate component; or the two components being connected to each other using an intermediate component that is integral with one of the two components to form a single whole. If "connection" or its variations are modified by an additional term (e.g., direct connection), the general definition of "connection" provided above is modified by the simple linguistic meaning of the additional term (e.g., "direct connection" means that the connection of two components does not involve any single intermediate component), resulting in a narrower definition than the general definition of "connection" provided above. Such a connection can be mechanical, electrical, or fluid.

[0034] The locations of elements referred to herein (e.g., "top," "bottom," "above," "below") are used only to describe the orientation of the individual elements in the figures. It should be noted that the orientation of the individual elements may vary according to other examples, and such variations are intended to be included in this disclosure.

[0035] Regarding the use of virtually any plural and / or singular terms in this document, those skilled in the art can appropriately convert from plural to singular and / or from singular to plural depending on the context and / or application. For clarity, various singular / plural permutations may be explicitly described herein.

[0036] For purposes of illustration and description, the foregoing description of illustrative examples has been presented. It is not intended to be exhaustive or to limit one to the precise form of the disclosed examples, and modifications and variations may be made in light of the foregoing teachings, or may be derived from the practice of the disclosed examples. The scope of the claimed subject matter is intended to be defined by the appended claims and their equivalents.

Claims

1. A fluid cartridge, comprising: A fluid jetting device, which is connected to the box body; A thin interconnect circuit, which is connected to the fluid jetting device at a first end and to the outer surface of the box body at a second end; as well as A retaining member extends over a portion of the thin interconnect circuit to retain the thin interconnect circuit against the outer surface.

2. The fluid cartridge as claimed in claim 1, wherein, At least a portion of the thin interconnect circuit is a flexible circuit.

3. The fluid cartridge as claimed in any one of claims 1 or 2, wherein, The retaining member is integrally formed with the outer surface of the box body.

4. The fluid cartridge as claimed in any one of claims 1 to 2, wherein, The retaining member extends on the outer edge of the thin interconnect circuit.

5. The fluid cartridge as claimed in claim 4, wherein, The thin interconnect circuit includes a reinforcement, wherein a portion of the thin interconnect circuit extends away from the outer surface of the housing body by a first distance, and the reinforcement extends away from the outer surface of the housing body by a second distance, the second distance being greater than the first distance, wherein the retaining member does not extend beyond the outer edge of the reinforcement.

6. The fluid cartridge as claimed in any one of claims 1 to 5, wherein, The retaining member includes a chamfer, which is located on the edge of the retaining member and away from the fluid injection device.

7. The fluid cartridge as claimed in any one of claims 1 to 3, wherein, The retaining member extends through the opening in the thin interconnect circuit and extends beyond the edge of the opening.

8. The fluid cartridge as claimed in any one of claims 1 to 7, wherein, The fluid jetting device is connected to a first side of the housing body, and the second end of the thin interconnect circuit is connected to a second side of the housing body orthogonal to the first side. The thin interconnect circuit further includes a curved portion that extends around the edge of the housing body and connects the first end of the thin interconnect circuit to the second end.

9. The fluid cartridge of claim 1, wherein: The front portion of the thin interconnect circuit is attached to the front surface of the housing body. The front portion includes contact pillars to contact corresponding fluid injection device contacts. The contact pillars extend from a second end of the thin interconnect circuit to a curved portion of the thin interconnect circuit, wherein the thin interconnect circuit is curved toward the fluid injection device. The retaining member extends adjacent to the bent portion.

10. The fluid cartridge of claim 9, further comprising two opposing retaining members at opposite ends of the front portion.

11. The fluid cartridge as claimed in any one of claims 1, 2, 9 or 10, wherein, The retaining member extends across the thin interconnect circuit.

12. The fluid cartridge as claimed in any one of claims 1, 2, or 9 to 11, wherein, The retaining member is attached to the box body by an adhesive.

13. A method of manufacturing a fluid cartridge, the method comprising: A fluid jetting device is connected to the housing body, the fluid jetting device having thin interconnect circuitry extending from the fluid jetting device; The interface portion of the thin interconnect circuit is pressed against the outer surface of the housing body; as well as A portion of the outer surface of the housing body is pressed to form a retaining member that extends over a section of the interface portion, thereby retaining the thin interconnect circuit against the outer surface of the housing body.

14. The method of claim 13, wherein, The fluid jetting device is connected to a first side of the housing body, and a portion of the thin interconnect circuit is fixed against a second side of the housing body orthogonal to the first side. Pressing the interface portion of the thin interconnect circuit against the outer surface of the housing body includes bending the thin interconnect circuit around the edge of the housing body.

15. The method of any one of claims 13 or 14, wherein, The portion of the outer surface of the box body that is pressed includes the retention member formed on the section of the interface portion closest to the edge end of the box body.

16. The method according to any one of claims 13 to 15, wherein, The portion of the outer surface of the box body is pressed with a forging tool to heat the portion of the outer surface.

17. The method of claim 16, wherein, The portion of the outer surface of the box body that is pressed includes using the boss of the forging tool to block the material of the portion of the outer surface from flowing in the opposite direction to the fluid jetting device.

18. The method of any one of claims 16 and 17, wherein, The pressing of the portion of the outer surface of the housing body and the pressing of the interface portion of the thin interconnect circuit are performed simultaneously using the forging tool.

19. A method of manufacturing a fluid cartridge, the method comprising: A fluid jetting device is attached to a first side of a housing body, the housing body having a protrusion extending from a second side of the housing body orthogonal to the first side, and the fluid jetting device having thin interconnect circuitry extending from the fluid jetting device. The thin interconnect circuit is bent around the edge of the housing body, and the interface portion of the thin interconnect circuit is pressed against the second side of the housing body. as well as The protrusion is heat-fused to form a retaining member extending over a portion of the thin interconnect circuit.

20. The method of claim 19, further comprising forming the box body in a mold such that the protrusion is integrally formed with a second side of the box body.

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