High-efficiency energy-saving quantum dot film cutting device

Abstract

This invention discloses a high-efficiency and energy-saving quantum dot film cutting device. The device includes a cutting platform with a robotic arm connected to it via a drive mechanism. A laser emitting unit is mounted on the robotic arm. The device is characterized by a cutting opening within the cutting platform, a diamond micro-blade slidably disposed within the opening, and a handle fastened to the diamond micro-blade. A driven plate is connected to one side of the handle. This invention provides a high-efficiency and energy-saving quantum dot film cutting device that allows direct cutting of the underlying inorganic material via the physical cutting of the diamond micro-blade. The laser only needs to process the upper organic layer, completing the full-layer cutting in a single scan, eliminating the need for multiple repetitive operations.

Description

Technical Field

[0001] This invention belongs to the field of quantum dot film cutting technology, specifically, it relates to a high-efficiency and energy-saving quantum dot film cutting device. Background Technology

[0002] Quantum dot films typically have a composite structure, encompassing components such as a substrate, quantum dot coating, brightness enhancement film, and diffusion layer, arranged vertically. During production, quantum dot films are generally manufactured in large rolls or sheets, while end products such as televisions, mobile phones, tablets, and computer monitors have significantly different screen sizes. The cutting process aims to cut the large-size film material into specifications that perfectly match the screen size of the specific device, thereby ensuring that the film material accurately covers the display area of ​​the backlight panel or LCD panel.

[0003] Because the luminescence efficiency and stability of quantum dots are extremely sensitive to temperature, laser cutting typically relies on thermal effects to achieve material cutting. However, this cutting method can cause lattice distortion, surface ligand detachment, or material decomposition of quantum dots near the cutting edge due to high temperatures, leading to problems such as decreased luminescence efficiency and color distortion.

[0004] Furthermore, to address the aforementioned issues, existing equipment employs short-pulse laser cutting technology. Short-pulse lasers possess high energy density; the rays emitted by the laser emitting unit excite electrons in the material to the conduction band within a femtosecond, forming a free electron gas. Subsequently, the plasma further absorbs the laser energy, generating an outward-expanding shock wave that directly "peels" the material through mechanical force, rather than through heating and melting, thus effectively avoiding lattice distortion caused by high temperatures.

[0005] However, to further reduce the thermal effect, short-pulse ultraviolet lasers, such as those with a wavelength of 355 nm, are often used. However, this type of laser has a shallow penetration depth in quantum dot films, especially for organic substrates. This can lead to incomplete cutting of the underlying materials in multilayer structures, such as the PET substrate beneath the quantum dot layer, requiring multiple scans to complete the cutting, which significantly reduces cutting efficiency. Simultaneously, the quantum dot layer has a strong absorption capacity for ultraviolet light, particularly CdSe-containing semiconductor quantum dots. After absorbing ultraviolet light, photochemical decomposition may occur, ultimately causing a shift in the emission wavelength. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the present invention aims to provide a highly efficient and energy-saving quantum dot film cutting device.

[0007] To achieve the aforementioned objectives, the technical solution adopted by this invention includes: A cutting platform is provided, on which a robotic arm is connected by a transmission. A laser emitting unit is provided on the robotic arm. A cutting opening is provided inside the cutting platform. A diamond micro-blade is slidably arranged inside the cutting opening. A handle is fastened to the diamond micro-blade. A driven plate is connected to one side of the handle. The robotic arm is equipped with an active component, which includes a vertically sliding docking block. A spring is connected to the bottom of the docking block and is connected to the robotic arm. The docking block abuts against the driven plate. When the laser emitting unit moves to cut the quantum dot film, the active component coordinates with the diamond micro-blade to synchronously cut the quantum dot film. In this invention, a robotic arm simultaneously drives the laser emitting unit and the diamond micro-blade to move, thereby improving the synchronization of the laser emitting unit and the diamond micro-blade in cutting the quantum dot film. It also avoids the situation where the laser cuts through part of the layer first, and the material has already undergone thermal deformation when the diamond micro-blade enters the cut later.

[0008] The cutting platform is equipped with a reset component, which is connected to the blade handle. After the laser emitting unit works with the diamond micro-blade to cut the quantum dot film, the diamond micro-blade is moved and reset by the reset component. In this invention, after the quantum dot film is cut, the continued movement of the diamond micro-blade will trigger the reset component, causing the connection between the active component and the driven plate to be disconnected, thereby causing the diamond micro-blade to be pulled and moved by the reset component.

[0009] The handle is provided with an encapsulation component, which includes a glue dispensing box that is vertically slidably disposed on the handle, and a glue dispensing roller for applying glue to the cut section of the quantum dot film is rotatably connected inside the glue dispensing box.

[0010] In this invention, during the process of cutting the quantum dot film with a diamond microblade, the traction of the diamond microblade enables the encapsulation component to apply adhesive to the cut section of the quantum dot film in a timely manner.

[0011] Preferably, the cutting platform is connected to a blade rail frame, and the blade handle is rotatably provided with multiple casters along the circumferential direction, with each caster slidably connected to the blade rail frame.

[0012] In this invention, the sliding of the caster on the tool rail reduces the sliding friction between the diamond micro-instrument and the tool rail, which facilitates the movement of the diamond micro-instrument.

[0013] Preferably, the docking block is provided with an elastic element, and the elastic element has a chamfer. When the laser emitting unit moves and resets, the chamfer of the elastic element presses against the driven plate, so that the active element reconnects with the driven plate.

[0014] It should be noted that when the robotic arm moves and resets, the elastic element can be pressed against the driven plate by the chamfer, so that the robotic arm can move to the state before cutting and automatically reset the quantum dot film cutting device to the pre-cutting preparation state, which is convenient for cutting the quantum dot film again.

[0015] Preferably, the elastic element includes a locking block, the chamfer is formed on the side opposite to the contact surface of the locking block and the driven plate, the mating block has a connecting port for the locking block to retract, and a second spring is fixedly connected in the connecting port, the second spring being connected to the locking block.

[0016] Preferably, the reset assembly includes a reset groove formed in the cutting platform, a reset roller rotatably connected in the reset groove, torsion springs connected to both sides of the reset roller, the torsion springs connected to the reset groove, and a traction rope wound around the reset roller, the traction rope being connected to the knife handle. The reset assembly also includes a ramp plate connected to the cutting platform. The ramp plate has an inclined surface. When the mating block moves to the inclined surface, the mating block will be pressed against the inclined surface and move vertically downward until the mating block is disconnected from the driven plate.

[0017] In this invention, the connection between the active component and the driven plate is automatically disconnected after the mating block is pressed against the inclined surface, so that the diamond micro-blade can be reset by the reset component itself, without the need for an additional driving source, thus reducing the cost of using the device.

[0018] Preferably, the packaging assembly further includes a connecting sleeve fixedly connected to the bottom of the dispensing box, and an insert plate is inserted into the connecting sleeve, the insert plate being fixedly connected to the knife handle; A guide rod is fixedly connected inside the cutting platform, and a traveling column is fixedly connected to one side of the connecting sleeve. The traveling column is slidably connected to the guide rod. When the diamond micro-blade moves, the movement of the traveling column on the guide rod causes the coating roller to gradually move up to the height of contact with the cutting section of the quantum dot film.

[0019] During the cutting process, the encapsulation component can move with the diamond micro-blade, enabling the quantum dot film to be encapsulated in a timely manner upon completion of the cutting process, thus preventing water and oxygen erosion.

[0020] Preferably, the guide rod includes a concealed box section and an adhesive coating section, the concealed box section and the adhesive coating section are connected, and the concealed box section is located below the adhesive coating section.

[0021] In this invention, when the laser emitting unit and the diamond micro-blade just begin to move and cut the quantum dot film, the traveling column moves from the box section to the coating section, so that the height of the coating roller gradually increases until the coating roller can contact the cut section of the quantum dot film.

[0022] Preferably, the glue dispensing box has a glue storage tank, the top of the glue storage tank has a glue replenishment port, the glue dispensing box has a glue dispensing port, and the glue dispensing box delivers encapsulating glue to the glue coating roller through the glue dispensing port.

[0023] Preferably, a positioning frame is provided above the cutting opening, and multiple cylinders are connected above the positioning frame, with the cylinders fixedly connected to the cutting platform.

[0024] Compared with the prior art, the advantages of the present invention include: (1) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device, which cuts the inorganic hard layer of the quantum dot film by synchronous and coordinated cutting of the laser emitting unit and the diamond micro blade. The diamond micro blade first physically cuts the inorganic hard layer of the quantum dot film, and the laser only needs to process the organic layer, such as the quantum dot coating, which greatly reduces the laser action time and heat accumulation. (2) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device, which uses a short pulse laser combined with a diamond micro-blade for "mechanical peeling + laser ablation" composite cutting method to avoid high temperature damage caused by single laser thermal effect, protect the stability of quantum dot structure, and maintain luminous efficiency and color accuracy. (3) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device. The physical cutting of diamond micro-blade can directly cut the bottom inorganic material, and the laser only needs to process the upper organic layer. A single scan can complete the full-layer cutting without repeated operations. (4) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device in which the robotic arm drives the laser and the cutter to move synchronously, ensuring that the cutting path is consistent, avoiding material displacement errors caused by multiple scans, and further improving cutting accuracy and efficiency. (5) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device, in which the diamond micro-blade undertakes most of the inorganic layer cutting work, and the laser only needs to use a lower energy to process the organic layer, shortening the interaction time between ultraviolet light and quantum dot layer and reducing the risk of photochemical decomposition; (6) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device, in which the encapsulation component simultaneously coats the cross section with UV-curable optical adhesive during the cutting process to form a physical barrier, isolate the subsequent irradiation of the quantum dot layer by ultraviolet light, and further protect the performance of the quantum dot; (7) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device, which adopts an integrated design of "single robotic arm driving laser and cutting tool", reducing the number of driving components, such as eliminating the need for a motor to independently drive the cutting tool, thereby reducing equipment energy consumption and manufacturing costs; (8) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device. The reset component uses the mechanical structure of torsion spring and ramp plate to realize automatic reset of the cutter, without the need for an additional power source, further saving energy; the sliding design of casters and cutter rail reduces friction and reduces drive energy consumption. (9) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device in which the laser is used only for ablation of the organic layer, and the diamond micro-blade is responsible for the physical cutting of the inorganic layer. The clear division of labor reduces energy waste. Compared with traditional all-laser cutting, synchronous cutting avoids multiple scans, shortens equipment running time, and reduces standby power consumption. (10) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device. The reset component realizes the tool reset through the elastic potential energy of the torsion spring, replacing the electric reset mechanism and saving power consumption. The guide rod of the encapsulation component cooperates with the walking column, and uses the moving potential energy of the robotic arm to drive the coating roller to rise and fall, without the need for an additional power source, further reducing energy consumption; (11) The present invention provides a high-efficiency and energy-saving quantum dot film cutting device. The present invention solves the technical problems of heat damage, insufficient penetration and light decomposition of traditional laser cutting by using the composite cutting technology of "laser + diamond micro blade" and integrated mechanical design. At the same time, it achieves high efficiency and energy saving through energy division, passive mechanism and material optimization. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is an overall schematic diagram of a high-efficiency and energy-saving quantum dot film cutting device according to the present invention; Figure 2 This is a schematic diagram of the exploded structure of the robotic arm in this invention; Figure 3 This is a schematic diagram of the inclined plate in this invention; Figure 4 This is a schematic diagram of the reset roller in this invention; Figure 5 This is a schematic diagram of the guide rod structure in this invention; Figure 6 This is a schematic diagram of the active component in this invention; Figure 7 This is a cross-sectional view of the structure in this invention; Figure 8 This is a schematic diagram of the diamond micro-blade structure in this invention; Figure 9 This is a schematic diagram of the encapsulation component in this invention.

[0027] Figure label: 1. Cutting platform; 11. Cutting opening; 12. Transmission gear; 13. Transmission rack; 14. Drive motor; 15. Moving rail; 16. Positioning frame; 17. Cylinder; 2. Robotic arm; 21. Laser emitting unit; 22. Diamond micro-blade; 23. Knife handle; 24. Driven plate; 25. Knife rail frame; 26. Casters; 27. Reset roller; 28. Traction rope; 29. ​​Torsion spring; 210. Inclined plate; 3. Driving component; 31. Fixing rod; 32. Connecting block; 33. Locking block; 34. Spring 1; 35. Guide column; 36. Spring 2; 4. Encapsulation assembly; 41. Glue roller; 42. Glue dispensing box; 43. Connecting sleeve; 44. Insert plate; 45. Guide rod; 451. Box concealment section; 452. Glue dispensing section; 46. Traveling column; 47. Glue filling port. Detailed Implementation

[0028] In view of the shortcomings of the prior art, the inventors of this invention, through long-term research and extensive practice, have proposed the technical solution of this invention. The technical solution, its implementation process, and principles will be further explained below with reference to the accompanying drawings and specific implementation examples in the embodiments of this application.

[0029] It should be noted that the embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. The described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, the present invention covers any substitutions, modifications, equivalent methods and solutions made on the spirit, principles and scope of the present invention as defined by the claims. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] In the description of this application, the terms "first," "second," "third," and similar words do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "a" or "one," and similar words, do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including," and similar words, mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including," and their equivalents, but do not exclude other elements or objects. The terms "connected" or "linked," and similar words, are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0031] In the description of this application, the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this application and for simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, when using positional terms such as "both sides," "outer side," and "upper and lower," it should be understood that they are used only for ease of understanding and description, taking into account that the structure may be oriented to other positions.

[0032] In the description of this application, unless otherwise expressly specified and limited, the technical or scientific terms used shall have the ordinary meaning understood by a person with ordinary skills in the art to which this application pertains. Terms such as “installation,” “connection,” and “joining” shall be interpreted broadly, for example, as fixed connection, detachable connection, mating connection, or integral connection. For a person skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0033] The present invention aims to introduce and explain the structural composition of a high-efficiency and energy-saving quantum dot film cutting device and the cooperation relationship between the various components. Unless otherwise specified, the dimensions, materials and manufacturing processes of the various components in the high-efficiency and energy-saving quantum dot film cutting device in the present invention can be selected according to specific circumstances, and no special limitations or explanations are made here.

[0034] Furthermore, to provide the public with a better understanding of the present invention, certain specific details are described in detail in the following description of the invention. However, those skilled in the art will fully understand the invention even without these detailed descriptions.

[0035] Example 1 Please see Figure 1 , Figure 2 and Figure 3 This embodiment discloses a high-efficiency and energy-saving quantum dot film cutting device, including a cutting platform 1.

[0036] The cutting platform 1 has a cutting opening 11 and a moving groove at the bottom. Two moving rails 15 are fixedly connected in the moving groove. A robotic arm 2 is slidably mounted on the two moving rails 15 and a laser emitting unit 21 is fixedly mounted on the robotic arm 2.

[0037] Furthermore, a transmission rack 13 is fixedly connected to the robotic arm 2, and a transmission gear 12 is meshed on the transmission rack 13. A drive motor 14 is fixedly connected inside the cutting platform 1, and the drive end of the drive motor 14 is fixedly connected to the transmission gear 12.

[0038] Furthermore, a positioning frame 16 is provided above the cutting opening 11, and four cylinders 17 are fixedly connected inside the cutting platform 1. The telescopic end of each cylinder 17 is fixedly connected to the positioning frame 16. When it is necessary to position the quantum dot film, the extension of the telescopic end of the cylinder 17 can drive the positioning frame 16 to press down on the quantum dot film to fix its position.

[0039] It should be noted that the specific structure of the laser emitting unit 21 is the same as that of commercially available short-pulse laser cutting mechanisms. Both use solid-state lasers such as titanium-doped sapphire, Nd:YAG, or fiber lasers, and generate picosecond or femtosecond pulses through mode-locking technology, such as active mode-locking or passive mode-locking, to cut quantum dot films.

[0040] Please see Figure 4 , Figure 5 and Figure 8 This embodiment discloses a high-efficiency and energy-saving quantum dot film cutting device, including a diamond microblade 22.

[0041] In this embodiment, the diamond micro-blade 22 uses an ultra-thin diamond cutting disc, such as 0.43mm thick, which can be precisely controlled by lateral precise movement with an accuracy of 0.01mm.

[0042] Specifically, the bottom of the diamond micro-blade 22 is provided with a handle 23, and a through slot is provided in the handle 23 for the diamond micro-blade 22 to be inserted. The cross-sectional thickness of the through slot gradually decreases from the opening to the inside. By tightly inserting the diamond micro-blade 22 into the through slot until the through slot deforms, the diamond micro-blade 22 can be firmly fixed in the handle 23. A driven plate 24 is connected to one side of the handle 23.

[0043] Furthermore, a blade rail frame 25 is fixedly connected inside the cutting platform 1, and casters 26 are rotatably provided on all four sides of the blade handle 23. When the blade handle 23 is pulled out toward the blade rail frame 25, the casters 26 located on both sides of the blade rail of the blade rail frame 25 will be blocked by the side wall of the blade rail frame 25, so that the blade handle 23 cannot be pulled out. Each caster 26 is slidably connected to the blade rail frame 25.

[0044] Furthermore, the cutting platform 1 is equipped with a reset component, which is connected to the handle 23. After the laser emitting unit 21 and the diamond micro-blade 22 cut the quantum dot film, the diamond micro-blade 22 is moved and reset by the reset component.

[0045] Specifically, the reset assembly includes a reset groove formed in the cutting platform 1, a reset roller 27 rotatably connected in the reset groove, torsion springs 29 connected on both sides of the reset roller 27, the torsion springs 29 connected to the reset groove, a traction rope 28 wound in the reset roller 27, and the traction rope 28 connected to the knife handle 23; the reset assembly also includes a ramp plate 210 connected to the cutting platform 1, the ramp plate 210 having an inclined surface.

[0046] Please see Figure 6 , Figure 7 and Figure 9 This embodiment discloses a high-efficiency and energy-saving quantum dot film cutting device, wherein the robotic arm 2 is equipped with an active component 3.

[0047] The active component 3 includes a fixed rod 31 fixedly connected to the robotic arm 2. An adjustment port is provided within the fixed rod 31, and a vertically slidable docking block 32 is provided within the adjustment port. A guide hole is provided through the docking block 32, and a guide post 35 is inserted into the guide hole. The guide post 35 is fixedly connected to the adjustment port. A spring 34 is connected to the bottom of the docking block 32 and is fixedly connected to the fixed rod 31. The docking block 32 abuts against the driven plate 24. When the laser emitting unit 21 moves to cut the quantum dot film, the active component 3, in coordination with the diamond micro-blade 22, synchronously cuts the quantum dot film. An elastic element is provided within the docking block 32, and a chamfer is provided on the elastic element. When the laser emitting unit 21 moves to its reset position, the chamfer of the elastic element presses against the driven plate 24, causing the active component 3 to reconnect with the driven plate 24. The elastic element includes a locking block 33, with a chamfer on the side opposite to the contact surface between the locking block 33 and the driven plate 24. A connecting port for the locking block 33 to retract is provided in the mating block 32, and a second spring 36 is fixedly connected in the connecting port and connected to the locking block 33.

[0048] Please see Figure 8 and Figure 9 This embodiment discloses a high-efficiency and energy-saving quantum dot film cutting device, including an encapsulation component 4.

[0049] The encapsulation assembly 4 includes a dispensing box 42 vertically slidably mounted on the handle 23. A coating roller 41 for applying adhesive to the cut section of the quantum dot film is rotatably connected inside the dispensing box 42. The dispensing box 42 has a glue storage tank, a refill port 47 at the top, and a dispensing port. The dispensing box 42 delivers encapsulation adhesive to the coating roller 41 through the dispensing port.

[0050] Furthermore, the encapsulation component 4 also includes a connecting sleeve 43 fixedly connected to the bottom of the dispensing box 42, and an insert plate 44 is inserted into the connecting sleeve 43, and the insert plate 44 is fixedly connected to the knife handle 23. A guide rod 45 is fixedly connected inside the cutting platform 1, and a traveling column 46 is fixedly connected to one side of the connecting sleeve 43. The traveling column 46 is slidably connected to the guide rod 45. When the diamond micro-blade 22 moves, the movement of the traveling column 46 on the guide rod 45 causes the coating roller 41 to gradually move upward to the height of contact with the cutting section of the quantum dot film. The guide rod 45 includes a box section 451 and a coating section 452, which are connected. The box section 451 is located below the coating section 452.

[0051] It should be noted that the adhesive stored in the adhesive storage tank is a UV-curable optical adhesive.

[0052] In this embodiment, the specific implementation steps for cutting the quantum dot film are as follows: S1. In the initial state, the locking block 33 of the active component 3 contacts the driven plate 24. Before cutting, the part to be cut is aligned with the edge of the cutting opening 11. When it is necessary to position the quantum dot film, the extension of the telescopic end of the cylinder 17 drives the positioning frame 16 to press down the quantum dot film to fix its position. S2. Start the drive motor 14 to drive the transmission gear 12 to rotate. The transmission gear 12 and the transmission rack 13 cause the robotic arm 2 to move. The movement of the robotic arm 2 causes the sequentially connected card block 33 and driven plate 24 to push the diamond micro-blade 22 to move. During the movement of the diamond micro-blade 22, the traction rope 28 is pulled out by the force. The torsion spring 29 is deformed by the rotation of the reset roller 27. The diamond micro-blade 22 first cuts the part of the harder inorganic layer of the quantum dot film. At the same time, the laser emission unit 21 is started. When the diamond micro-blade 22 starts to cut, the laser emission unit 21 emits short pulse laser to cut the organic layer of the quantum dot film. The robotic arm 2 can cut and separate the part of the quantum dot film to be removed in one go with a single movement. S3. In step S2, the movement of the diamond micro-blade 22 will cause the traveling column 46 and the guide rod 45 to press against each other, so that when the traveling column 46 moves from the box section 451 to the glue coating section 452, it can raise the position height of the glue box 42 so that it can touch the part of the quantum dot film that has been cut. And the glue coating roller 41 can apply glue to the cut section of the quantum dot film in time as the diamond micro-blade 22 moves. S4. After the cutting is completed, the continued movement of the robotic arm 2 will cause the docking block 32 to move to the inclined surface. As the robotic arm 2 continues to move, the docking block 32 will be pressed against the inclined surface and move vertically downward until the docking block 32 is disconnected from the driven plate 24. The spring force of the torsion spring 29 will drive the reset roller 27 to rotate and return to its original position, so that the reset roller 27 will rewind the traction rope 28, and the traction rope 28 will pull the diamond micro-blade 22 to move and reset. S5. After the diamond micro-blade 22 is reset, the robotic arm 2 will move and reset. During this process, the chamfer of the locking block 33 will press against the driven plate 24, causing the locking block 33 to move into the docking block 32. The second spring 36 will deform under force. After the locking block 33 passes the driven plate 24, the second spring 36 will drive the locking block 33 to move and reset, so that the locking block 33 will once again abut against the driven plate 24 and reset, and can then enter the state of cutting the quantum dot film again.

[0053] It should be understood that the above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. It should not be considered that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A high-efficiency and energy-saving quantum dot film cutting device, comprising a cutting platform (1), wherein a robotic arm (2) is drivenly connected to the cutting platform (1), and a laser emitting unit (21) is provided on the robotic arm (2), characterized in that, The cutting platform (1) is provided with a cutting opening (11), a diamond micro-blade (22) is slidably provided in the cutting opening (11), a handle (23) is fastened on the diamond micro-blade (22), and a driven plate (24) is connected to one side of the handle (23). The robotic arm (2) is provided with an active component (3), which includes a vertically sliding docking block (32). A spring (34) is connected to the bottom of the docking block (32). The spring (34) is connected to the robotic arm (2). The docking block (32) abuts against the driven plate (24). When the laser emitting unit (21) moves to cut the quantum dot film, the active component (3) coordinates with the diamond micro-blade (22) to cut the quantum dot film synchronously. The cutting platform (1) is equipped with a reset component, which is connected to the handle (23). After the laser emitting unit (21) and the diamond micro-blade (22) cut the quantum dot film, the diamond micro-blade (22) is moved and reset by the reset component. The handle (23) is provided with an encapsulation component (4), which includes a glue dispensing box (42) that is vertically slidably disposed on the handle (23), and a glue dispensing roller (41) for applying glue to the cut section of the quantum dot film is rotatably connected inside the glue dispensing box (42).

2. The high-efficiency and energy-saving quantum dot film cutting device according to claim 1, characterized in that: The cutting platform (1) is connected to a blade rail frame (25), and the blade handle (23) is provided with multiple casters (26) that rotate along the circumferential direction. All of the multiple casters (26) are slidably connected to the blade rail frame (25).

3. The high-efficiency and energy-saving quantum dot film cutting device according to claim 1, characterized in that: The docking block (32) is provided with an elastic element, and the elastic element has a chamfer. When the laser emitting unit (21) moves and resets, it is pressed against the driven plate (24) by the chamfer of the elastic element so that the active element (3) is connected to the driven plate (24) again.

4. The high-efficiency and energy-saving quantum dot film cutting device according to claim 3, characterized in that: The elastic element includes a locking block (33), the chamfer is formed on the side opposite to the contact surface of the locking block (33) and the driven plate (24), the connecting block (32) has a connection port for the locking block (33) to retract, and a second spring (36) is fixedly connected in the connection port, the second spring (36) is connected to the locking block (33).

5. The high-efficiency and energy-saving quantum dot film cutting device according to claim 1, characterized in that: The reset assembly includes a reset groove opened in the cutting platform (1), a reset roller (27) is rotatably connected in the reset groove, a torsion spring (29) is connected to both sides of the reset roller, the torsion spring (29) is connected to the reset groove, a traction rope (28) is wound and connected in the reset roller (27), and the traction rope (28) is connected to the handle (23). The reset assembly also includes a ramp plate (210) connected to the cutting platform (1), the ramp plate (210) having an inclined surface, when the docking block (32) moves to the inclined surface, the docking block (32) will press against the inclined surface and move vertically downward until the docking block (32) is disconnected from the driven plate (24).

6. The high-efficiency and energy-saving quantum dot film cutting device according to claim 1, characterized in that: The encapsulation component (4) further includes a connecting sleeve (43) fixedly connected to the bottom of the dispensing box (42), and an insert plate (44) is inserted into the connecting sleeve (43), and the insert plate (44) is fixedly connected to the knife handle (23); The cutting platform (1) is fixedly connected to a guide rod (45), and a walking column (46) is fixedly connected to one side of the connecting sleeve (43). The walking column (46) is slidably connected to the guide rod (45). When the diamond micro-blade (22) moves, the movement of the walking column (46) on the guide rod (45) causes the coating roller (41) to gradually move up to the height that contacts the cutting section of the quantum dot film.

7. The high-efficiency and energy-saving quantum dot film cutting device according to claim 6, characterized in that: The guide rod (45) includes a box section (451) and an adhesive section (452), which are connected, with the box section (451) located below the adhesive section (452).

8. The high-efficiency and energy-saving quantum dot film cutting device according to claim 1, characterized in that: The glue dispensing box (42) has a glue storage tank inside, and a glue replenishment port (47) is opened at the top of the glue storage tank. The glue dispensing box (42) has a glue dispensing port inside, and the glue dispensing box (42) delivers encapsulating glue to the glue coating roller (41) through the glue dispensing port.

9. The high-efficiency and energy-saving quantum dot film cutting device according to claim 1, characterized in that: A positioning frame (16) is provided above the cutting opening (11), and multiple cylinders (17) are connected above the positioning frame (16). The cylinders (17) are fixedly connected to the cutting platform (1).

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