A film suction mechanism of a semiconductor package mold

Abstract

This invention relates to a film suction mechanism for a semiconductor packaging mold, comprising a base and a lower pressure plate for supporting the semiconductor packaging mold. A lower mold is mounted on the top of the base, and an upper mold is mounted on the bottom of the lower pressure plate. A film suction workpiece is disposed inside the lower mold, comprising four negative pressure boxes fixedly installed inside the lower mold. A flow collector is disposed on the top of each negative pressure box, and a release film is suctioned onto the top of the flow collector through negative pressure. A trigger, an enhancement component, and an expansion component are sequentially arranged between the flow collector and the negative pressure boxes from top to bottom. The trigger includes a driving block slidably connected inside the flow collector. An outer ring is fixedly connected to the outer side of the driving block, and multiple vent holes are opened on the inner side of the driving block. A pre-tension spring is disposed between the bottom of the outer ring and the internal groove of the flow collector. This invention achieves adaptive adjustment of local suction efficiency, eliminates the risk of residual air and leakage, ensures flat adhesion of the release film, and improves the film suction accuracy and process stability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically to a film suction mechanism for semiconductor packaging molds. Background Technology

[0002] In semiconductor packaging molding processes, release film-assisted molding is a core method to ensure the surface quality of the package and avoid sticking to the mold. The film suction mechanism uses vacuum adsorption to flatten and fix the release film on the surface of the mold cavity. It is widely used in the compression molding and transfer molding processes of chip packaging such as BGA and QFN. Its adsorption stability directly determines the molding accuracy and internal defect rate of the package, and it is a key supporting device for semiconductor packaging production lines.

[0003] The existing semiconductor packaging mold suction mechanism mostly adopts a working method of using a fixed diameter suction hole in conjunction with a vacuum source to continuously pump air, and uses overall negative pressure to adsorb the release film onto the mold surface to achieve film fixation.

[0004] The existing suction hole diameter of this type of mechanism is fixed, which cannot adaptively adjust the local suction efficiency according to the residual air or leakage in the release film adsorption area. This easily leads to insufficient suction when there is residual air or leakage in the local area, resulting in uneven adhesion of the release film and affecting the film adsorption accuracy and process stability. Summary of the Invention

[0005] The purpose of this invention is to provide a film suction mechanism for semiconductor packaging molds, which aims to improve the problem in the prior art that the film suction mechanism is difficult to adaptively adjust the local air extraction efficiency according to the residual air or air leakage in the demolding film adsorption area.

[0006] The objective of this invention is achieved through the following technical solution: a film suction mechanism for a semiconductor packaging mold, comprising a base and a lower pressure plate for supporting the semiconductor packaging mold, wherein a lower mold is installed on the top of the base, an upper mold is installed on the bottom of the lower pressure plate, and a film suction workpiece is installed inside the lower mold. The suction film workpiece includes four negative pressure boxes fixedly installed inside the lower mold. A flow collector is provided on the top of the negative pressure box. The top of the flow collector is adsorbed by negative pressure to form a release film. A trigger, an enhancement, and an expansion are arranged between the flow collector and the negative pressure box from top to bottom. The trigger includes a drive block that is slidably connected inside the collector plate. An outer ring is fixedly connected to the outside of the drive block, and multiple vent holes are opened on the inside of the drive block. A pre-tightening spring is provided between the bottom of the outer ring and the groove inside the collector plate. The enhancement component includes a piston one fixedly connected to the bottom of the drive block, an enhancement cylinder slidably connected to the outside of the piston one, a piston two slidably connected to the bottom of the enhancement cylinder, and a transmission disc fixedly connected to the bottom of the piston two.

[0007] As a further description of the above technical solution: The expansion member includes a fixed ring fixedly connected to the outside of the enhancement cylinder, a sleeve fixedly connected to the outside of the fixed ring, a connecting shaft slidably connected inside the sleeve, an expansion ring fixedly connected to the other end of the connecting shaft, the outside of the expansion ring abutting against the inner wall of the top through hole of the negative pressure box, a transmission ring fixedly connected to the outside of the connecting shaft, and a hinge plate hinged between the transmission ring and the transmission disc. As a further description of the above technical solution: The radius of the second piston is smaller than that of the first piston, and a partition is provided between the enhancement cylinders, with the radius of the through hole on the partition being slightly smaller than that of the second piston. As a further description of the above technical solution: The top of the negative pressure box is provided with a cylindrical through hole corresponding to the inside of the collector plate. The side wall of the through hole of the negative pressure box is provided with a rubber elastic ring and abuts against the outer side of the expansion ring. As a further description of the above technical solution: A positioning mechanism is provided between the base and the lower pressure plate. The positioning mechanism includes multiple positioning sleeves fixedly connected to the top of the base, multiple positioning shafts fixedly connected to the bottom of the lower pressure plate, and the outer side of the positioning shafts slidably connected to the inside of the positioning sleeves. Anti-misalignment shafts are provided at the top of the base and the bottom of the lower pressure plate, and the lengths of two diagonally arranged anti-misalignment shafts are greater than the length of the other diagonally arranged anti-misalignment shaft. As a further description of the above technical solution: The top of the base is also fixedly connected to multiple buffer blocks, and buffer springs are installed inside the buffer blocks. Multiple buffer posts are installed at the bottom of the pressing block. The outer side of the buffer posts is slidably connected to the inside of the buffer blocks, and the bottom of the buffer posts abuts against the top of the buffer springs. As a further description of the above technical solution: The base is provided with a suction mechanism on the top. The suction mechanism includes a negative pressure machine for providing negative pressure to the suction film workpiece. A power interface is provided on the outside of the negative pressure machine. The top of the output end of the negative pressure machine is provided with a mounting plate that is fixed to the bottom of the four negative pressure boxes. The output end of the negative pressure machine is fixedly connected to four diversion pipes. As a further description of the above technical solution: The lower mold has multiple flow equalization boxes fixedly connected inside, and the other end of the flow divider is fixedly connected inside the flow equalization box. The top of the flow equalization box is connected to the bottom cavity of the negative pressure box.

[0008] Compared with the prior art, the advantages of the present invention are as follows: 1. When there is residual air or leakage in the adsorption area of ​​the release film, the pre-tightening spring drives the drive block to move upward. The force is amplified by the enhancement component, and then the expansion ring is driven to expand outward through the hinge plate and connecting shaft, increasing the radius of the negative pressure box through hole. This quickly removes residual air under the film and suppresses leakage. After the negative pressure reaches the standard, all components automatically reset. This achieves adaptive adjustment of local air extraction efficiency, eliminates the risk of residual air and leakage, ensures flat adhesion of the release film, and improves the film suction accuracy and process stability.

[0009] 2. The positioning sleeve and positioning shaft work together to achieve precise mold closing between the upper and lower molds. The buffer spring and buffer column buffer the impact of mold closing. With the automatic reset structure of each linkage component, the mold closing is free of misalignment, the impact damage to the film suction component is reduced, the film suction mechanism is ensured to operate stably, and the reliability of semiconductor packaging process and product yield are improved. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the main body of an embodiment of a film suction mechanism for a semiconductor packaging mold proposed in this invention; Figure 2 This is a schematic diagram of the upper mold structure of the film suction mechanism of a semiconductor packaging mold proposed in this invention; Figure 3 This is a schematic diagram of the positioning mechanism of the film suction mechanism of a semiconductor packaging mold proposed in this invention; Figure 4 This is a schematic diagram of the suction workpiece of the suction mechanism of a semiconductor packaging mold proposed in this invention; Figure 5 This is a schematic diagram of the suction mechanism of a semiconductor packaging mold according to the present invention. Figure 6 This is a schematic diagram of the flow equalization box of the film suction mechanism of a semiconductor packaging mold proposed in this invention; Figure 7 This is a schematic diagram of the trigger element of the film suction mechanism of a semiconductor packaging mold proposed in this invention; Figure 8 This is a schematic diagram of the expansion component of the film suction mechanism for a semiconductor packaging mold proposed in this invention; Figure 9 for Figure 4 Enlarged view of point A in the middle.

[0011] Label Explanation: 1. Base; 2. Lower Pressure Plate; 3. Lower Mold; 4. Upper Mold; 5. Positioning Mechanism; 501. Positioning Sleeve; 502. Positioning Shaft; 503. Anti-Misalignment Shaft; 504. Buffer Block; 505. Buffer Spring; 6. Suction Mechanism; 601. Negative Pressure Machine; 602. Power Interface; 603. Mounting Plate; 604. Diverter Pipe; 7. Suction Film Workpiece; 71. Negative Pressure Box; 72. Collector Plate; 73. Detachment... 74. Mold; 741. Trigger; 742. Drive block; 743. Vent hole; 744. Outer ring; 745. Preload spring; 76. Enhancer; 751. Piston 1; 752. Enhancer cylinder; 753. Piston 2; 754. Transmission disc; 76. Expansion member; 761. Fixing ring; 762. Sleeve; 763. Connecting shaft; 764. Expansion ring; 765. Transmission ring; 766. Hinge plate; 77. Flow equalization box. Detailed Implementation

[0012] The present invention will now be described in detail with reference to the accompanying drawings and embodiments: like Figures 1 to 9 The diagram shows an embodiment of a film suction mechanism for a semiconductor packaging mold provided by the present invention. This embodiment provides a film suction mechanism for a semiconductor packaging mold, including a base 1 and a lower pressure plate 2 for supporting the semiconductor packaging mold. The base 1 is used to stably support the semiconductor packaging mold and the lower mold 3, ensuring the overall installation foundation of the mold is stable. The lower pressure plate 2 is used to support and drive the upper mold 4 to complete the mold closing and opening actions. The lower mold 3 is installed on the top of the base 1. The lower mold 3 is used to install and fix the film suction workpiece 7, providing a basic carrier for the adsorption of the release film 73. The upper mold 4 is provided at the bottom of the lower pressure plate 2. The upper mold 4 is used to cooperate with the lower mold 3 to complete the molding process of semiconductor packaging. The film suction workpiece 7 is provided inside the lower mold 3. The film suction workpiece 7 is used to perform negative pressure adsorption and adaptive adjustment on the release film 73, ensuring that the release film 73 is flat and attached.

[0013] A positioning mechanism 5 is provided between the base 1 and the lower pressure plate 2. The positioning mechanism 5 is used to achieve accurate positioning when the upper and lower molds 3 are closed, and to avoid misalignment during mold closing. The positioning mechanism 5 includes multiple positioning sleeves 501 fixedly connected to the top of the base 1. The positioning sleeves 501 are used to slide and guide the positioning shafts 502 to ensure accurate positioning path during mold closing. Multiple positioning shafts 502 are fixedly connected to the bottom of the lower pressure plate 2. The positioning shafts 502 are used to cooperate with the positioning sleeves 501 to improve the mold closing accuracy of the upper and lower molds 3. The outer side of the positioning shafts 502 is slidably connected to the inside of the positioning sleeves 501. Anti-misalignment shafts 503 are provided at the top of the base 1 and the bottom of the lower pressure plate 2. The anti-misalignment shafts 503 are used to further constrain mold closing misalignment. The uniqueness of positioning is strengthened by the difference in diagonal lengths. The lengths of the two diagonally arranged anti-misalignment shafts 503 are greater than the length of the other diagonally arranged anti-misalignment shaft 503. Multiple buffer blocks 504 are fixedly connected to the top of the base 1. The buffer blocks 504 are used to install and accommodate the buffer springs 505 and the buffer pillars to form a mold closing buffer base. The buffer springs 505 are installed inside the buffer blocks 504. The buffer springs 505 are used to buffer the impact force of mold closing and reduce impact damage to the parts. Multiple buffer pillars are installed at the bottom of the lower pressure block. The buffer pillars are used to slide with the buffer blocks 504 to transmit and buffer the impact force of mold closing. The outer side of the buffer pillars is slidably connected to the inside of the buffer blocks 504 and the bottom of the buffer pillars abuts against the top of the buffer springs 505.

[0014] A suction mechanism 6 is provided on the top of the base 1. The suction mechanism 6 is used to provide a stable negative pressure for the suction film workpiece 7, ensuring the adsorption power of the demolding film 73. The suction mechanism 6 includes a negative pressure machine 601 for providing negative pressure for the suction film workpiece 7. The negative pressure machine 601 is used to generate and output negative pressure, providing the core power for suction adsorption. A power interface 602 is provided on the outside of the negative pressure machine 601, which is used to connect the negative pressure machine 601 to electricity to ensure the continuous operation of the negative pressure machine 601. The top of the output end of the negative pressure machine 601 is provided with a mounting plate 603 that is fixed to the bottom of the four negative pressure boxes 71. The mounting plate 603 is used to fix the negative pressure machine 601 and the negative pressure box 71 to ensure the sealing and stability of the negative pressure transmission path. The output end of the negative pressure machine 601 is fixedly connected to four diversion pipes 604. The diversion pipes 604 are used to divert and transport negative pressure, and distribute the negative pressure evenly to each flow equalization box 77. Multiple flow equalization boxes 77 are fixedly connected inside the lower mold 3. The flow equalization boxes 77 are used to evenly distribute and buffer negative pressure to ensure that the negative pressure supply to each negative pressure box 71 is uniform and stable. The other end of the diversion pipe 604 is fixedly connected to the inside of the flow equalization box 77. The top of the flow equalization box 77 is connected to the bottom cavity of the negative pressure box 71.

[0015] The suction film workpiece 7 includes four negative pressure boxes 71 fixedly installed inside the lower mold 3. The negative pressure boxes 71 are used to contain and transmit negative pressure, providing a negative pressure space for the adsorption of the release film 73. A flow collector plate 72 is provided on the top of the negative pressure box 71. The flow collector plate 72 is used to support the release film 73 and provide a flat adsorption support surface. The release film 73 is adsorbed on the top of the flow collector plate 72 through negative pressure. The release film 73 is used to isolate the molding compound from the mold and ensure the surface quality of the package. From top to bottom, a trigger element 74, an enhancement element 75, and an expansion element 76 are arranged between the flow collector plate 72 and the negative pressure box 71. The trigger element 74 is used to detect residual air and leakage under the film and trigger the adaptive adjustment process. The enhancement element 75 is used to amplify the triggering force and improve the adjustment drive efficiency. The expansion element 76 is used to adjust the size of the through hole of the negative pressure box 71 and improve the local suction negative pressure efficiency.

[0016] The trigger 74 includes a drive block 741 slidably connected inside the collector plate 72. The drive block 741 is used to sense changes in negative pressure under the membrane and execute triggering actions. An outer ring 743 is fixedly connected to the outside of the drive block 741. The outer ring 743 is used to slide and cooperate with the groove of the collector plate 72 to ensure the stability of the movement path of the drive block 741. Multiple vent holes 742 are opened on the inner side of the drive block 741. The vent holes 742 are used to allow air to circulate under the membrane to ensure negative pressure transmission and air extraction. A pre-tension spring 744 is provided between the bottom of the outer ring 743 and the groove inside the collector plate 72. The pre-tension spring 744 is used to provide elastic reset and triggering driving force for the drive block 741 to ensure sensitive triggering action.

[0017] The enhancing component 75 includes a piston 751 fixedly connected to the bottom of the drive block 741. The piston 751 moves synchronously with the drive block 741 and transmits the triggering force. An enhancing cylinder 752 is slidably connected to the outer side of the piston 751. The enhancing cylinder 752 is used to guide the piston 751 and the piston 753 to form an enhancing space. A piston 753 is slidably connected to the bottom of the enhancing cylinder 752. The piston 753 is used to receive the amplified force and drive the transmission disk 754 to move. The transmission disk 754 is fixedly connected to the bottom of the piston 753. The transmission disk 754 is used to transmit the amplified force to the expansion component 76 to drive the adjustment action. The radius of the piston 753 is smaller than the radius of the piston 751. A partition is provided between the enhancing cylinders 752. The partition is used to separate each enhancing cylinder 752 to ensure independent and stable enhancing action. The radius of the through hole on the partition is slightly smaller than the radius of the piston 753.

[0018] The expansion member 76 includes a fixing ring 761 fixedly connected to the outside of the enhancement cylinder 752. The fixing ring 761 is used to fix the sleeve 762, ensuring the stability of the installation foundation of the expansion member 76. The sleeve 762 is fixedly connected to the outside of the fixing ring 761. The sleeve 762 is used to slide and guide the connecting shaft 763, ensuring the accurate movement path of the expansion ring 764. The connecting shaft 763 is slidably connected inside the sleeve 762. The connecting shaft 763 is used to transmit the force of the transmission ring 765 and drive the expansion ring 764 to move. The other end of the connecting shaft 763 is fixedly connected to... An expansion ring 764 is used to expand the through hole of the negative pressure box 71, increasing the air flow rate to improve the negative pressure efficiency. The outer side of the expansion ring 764 abuts against the inner side wall of the top through hole of the negative pressure box 71. A transmission ring 765 is fixedly connected to the outside of the connecting shaft 763. The transmission ring 765 is used to receive the force of the hinge plate 766 and drive the connecting shaft 763 to move. A hinge plate 766 is hinged between the transmission ring 765 and the transmission disk 754. The hinge plate 766 is used to transmit the force between the transmission disk 754 and the transmission ring 765 to ensure smooth linkage of the adjustment action. A cylindrical through hole is provided at the top of the negative pressure box 71 and at the corresponding position inside the manifold 72. The cylindrical through hole is used to allow air to circulate and provide a channel for air extraction and adsorption. A rubber elastic ring is provided on the side wall of the through hole of the negative pressure box 71 and abuts against the outer side of the expansion ring 764. The rubber elastic ring is used to elastically abut against the expansion ring 764, providing a deformation basis for the diameter of the through hole of the negative pressure box 71 while ensuring the sealing effect after the through hole is adjusted.

[0019] Working principle: The suction mechanism of the semiconductor packaging mold enters the working preparation stage. The base 1 carries the lower mold 3, the lower pressure plate 2 drives the upper mold 4 to the initial position, the demolding film 73 is placed on the top of the manifold 72, the negative pressure machine 601 of the suction mechanism 6 is in the ready-to-start state, the pre-tightening spring 744 is in the initial pre-tightening state, the drive block 741 and the outer ring 743 are in the initial position of the groove inside the manifold 72, the piston 1 751, the enhancement cylinder 752, and the piston 2 753 are in the initial engagement position, the connecting shaft 763 and the expansion ring 764 are in the initial contraction position, and the through hole at the top of the negative pressure box 71 is in the initial radius state.

[0020] When the suction mechanism 6 is activated, the negative pressure machine 601 is connected to the power supply through the power interface 602. The output end of the shunt pipe 604 transmits the negative pressure to the flow equalization box 77. The flow equalization box 77 is connected to the bottom cavity of the negative pressure box 71. A negative pressure environment begins to form inside the negative pressure box 71. The air between the flow collector plate 72 and the demolding film 73 is drawn to the negative pressure machine 601 through the vent hole 742 on the drive block 741, the internal channel of the flow collector plate 72, the negative pressure box 71, the flow equalization box 77, and the shunt pipe 604. The demolding film 73 begins to be adsorbed on the top of the flow collector plate 72.

[0021] When there is residual air or air leakage between the manifold 72 and the release film 73, the negative pressure value in this area is lower than the preset threshold. The external atmospheric pressure is connected to the drive block 741, and the downward suction force on the drive block 741 is less than the pre-tightening force of the pre-tightening spring 744. Under the action of the elastic force of the pre-tightening spring 744, the drive block 741 and the outer ring 743 slide upward along the internal groove of the manifold 72.

[0022] When the drive block 741 moves upward, it drives the bottom piston 751 to move upward synchronously. The piston 751 slides upward inside the enhancement cylinder 752, and the medium inside the enhancement cylinder 752 is compressed. Since the radius of the second piston 753 is smaller than the radius of the first piston 751, the upward force on the second piston 753 is amplified. The second piston 753 moves upward along the bottom of the enhancement cylinder 752, driving the bottom transmission disc 754 to move upward synchronously.

[0023] When the transmission disc 754 moves upward, it drives the transmission ring 765 to move outward through the hinge plate 766. The transmission ring 765 drives the connecting shaft 763 to slide outward along the sleeve 762. The connecting shaft 763 drives the expansion ring 764 to expand outward. The expansion ring 764 abuts against the rubber elastic ring of the top through hole of the negative pressure box 71, making the radius of the top through hole of the negative pressure box 71 larger.

[0024] After the radius of the top through hole of the negative pressure box 71 increases, the air flow rate in this area increases, the negative pressure efficiency of air extraction is improved, the residual air between the manifold 72 and the demolding film 73 is quickly extracted, the air replenishment speed at the leakage point is suppressed, and the negative pressure value in this area gradually recovers to the preset threshold. At the same time, due to the increased suction force on the drive block 741, the elastic force of the pre-tightening spring 744 pushes the drive block 741 and the outer ring 743 to move downward. The piston 1 751, piston 2 753, and transmission disc 754 move downward synchronously, and the hinge plate 766, transmission ring 765, connecting shaft 763, and expansion ring 764 reset synchronously, and the radius of the top through hole of the negative pressure box 71 returns to the initial state.

[0025] When the air between the manifold 72 and the release film 73 is completely extracted, and the release film 73 is flatly adsorbed on the top of the manifold 72 without any residual air or leakage, the pressure on the top of the drive block 741 is balanced with the preload force of the preload spring 744. The drive block 741, piston 1 751, piston 2 753, transmission disc 754, hinge plate 766, transmission ring 765, connecting shaft 763, and expansion ring 764 are all in a stable state. The through hole at the top of the negative pressure box 71 maintains its initial radius, and the suction mechanism 6 continuously provides a stable negative pressure to maintain the adsorption state of the release film 73.

[0026] After the semiconductor packaging mold completes the molding process, the suction mechanism 6 stops working, the negative pressure at the output end of the negative pressure machine 601 disappears, and the negative pressure inside the flow equalization box 77, the negative pressure box 71, and the current collector 72 gradually returns to normal pressure. The adsorption force between the release film 73 and the current collector 72 disappears, the lower pressure plate 2 drives the upper mold 4 to move upward, the release film 73 separates from the mold surface and adheres tightly to the package body, the film suction mechanism completes one working cycle, and enters the next working preparation stage.

[0027] Throughout the entire operation, the positioning sleeve 501 of the positioning mechanism 5 cooperates with the positioning shaft 502 to ensure the mold closing accuracy of the lower mold 3 and the upper mold 4. The anti-misalignment shaft 503 further prevents mold misalignment. The buffer spring 505 inside the buffer block 504 cooperates with the buffer column to buffer the impact force during the mold closing process, protect the precision components of the film suction mechanism, and ensure the stability and reliability of the film suction process.

Claims

1. A film suction mechanism for a semiconductor packaging mold, comprising a base (1) for supporting the semiconductor packaging mold and a lower pressure plate (2), characterized in that: The base (1) is provided with a lower mold (3) installed on the top, and the lower pressure plate (2) is provided with an upper mold (4) at the bottom. The lower mold (3) is provided with a suction film workpiece (7). The suction film workpiece (7) includes four negative pressure boxes (71) fixedly installed inside the lower mold (3). A flow collector (72) is provided on the top of the negative pressure box (71). The top of the flow collector (72) is adsorbed by negative pressure to form a release film (73). A trigger (74), an enhancement component (75), and an expansion component (76) are arranged between the flow collector (72) and the negative pressure box (71) from top to bottom. The trigger (74) includes a drive block (741) slidably connected inside the collector plate (72), an outer ring (743) is fixedly connected to the outside of the drive block (741), and multiple vent holes (742) are opened on the inner side of the drive block (741). A pre-tightening spring (744) is provided between the bottom of the outer ring (743) and the groove inside the collector plate (72). The enhancement component (75) includes a piston one (751) fixedly connected to the bottom of the drive block (741), an enhancement cylinder (752) slidably connected to the outside of the piston one (751), a piston two (753) slidably connected to the bottom of the enhancement cylinder (752), and a transmission disc (754) fixedly connected to the bottom of the piston two (753).

2. The film suction mechanism of a semiconductor packaging mold according to claim 1, characterized in that: The expansion member (76) includes a fixing ring (761) fixedly connected to the outside of the enhancement cylinder (752), a sleeve (762) fixedly connected to the outside of the fixing ring (761), a connecting shaft (763) slidably connected inside the sleeve (762), an expansion ring (764) fixedly connected to the other end of the connecting shaft (763), the outside of the expansion ring (764) abutting against the inner sidewall of the top through hole of the negative pressure box (71), a transmission ring (765) fixedly connected to the outside of the connecting shaft (763), and a hinge plate (766) hinged between the transmission ring (765) and the transmission disc (754).

3. The film suction mechanism of a semiconductor packaging mold according to claim 1, characterized in that: The radius of the second piston (753) is smaller than that of the first piston (751), and a partition is provided between the enhancement cylinders (752), with the radius of the through hole on the partition being slightly smaller than that of the second piston (753).

4. The film suction mechanism of a semiconductor packaging mold according to claim 2, characterized in that: The top of the negative pressure box (71) and the corresponding position inside the collector plate (72) are provided with cylindrical through holes. The side wall of the through hole of the negative pressure box (71) is provided with a rubber elastic ring and abuts against the outer side of the expansion ring (764).

5. The film suction mechanism of a semiconductor packaging mold according to claim 1, characterized in that: A positioning mechanism (5) is provided between the base (1) and the lower pressure plate (2). The positioning mechanism (5) includes multiple positioning sleeves (501) fixedly connected to the top of the base (1). Multiple positioning shafts (502) are fixedly connected to the bottom of the lower pressure plate (2). The outer side of the positioning shafts (502) is slidably connected to the inside of the positioning sleeves (501). Anti-misalignment shafts (503) are provided at the top of the base (1) and the bottom of the lower pressure plate (2). The length of two anti-misalignment shafts (503) arranged diagonally is greater than the length of the other anti-misalignment shaft (503) arranged diagonally.

6. The film suction mechanism of a semiconductor packaging mold according to claim 1, characterized in that: The base (1) is also fixedly connected to a number of buffer blocks (504). A buffer spring (505) is provided inside the buffer block (504). A number of buffer pillars are provided at the bottom of the pressing block. The outer side of the buffer pillar is slidably connected to the inside of the buffer block (504) and the bottom of the buffer pillar abuts against the top of the buffer spring (505).

7. The film suction mechanism of a semiconductor packaging mold according to claim 1, characterized in that: The base (1) is provided with a suction mechanism (6) at the top. The suction mechanism (6) includes a negative pressure machine (601) for providing negative pressure to the suction film workpiece (7). A power interface (602) is provided on the outside of the negative pressure machine (601). The top of the output end of the negative pressure machine (601) is provided with an installation plate (603) that is fixed to the bottom of the four negative pressure boxes (71). The output end of the negative pressure machine (601) is fixedly connected to four diversion pipes (604).

8. The film suction mechanism of a semiconductor packaging mold according to claim 7, characterized in that: The lower mold (3) has multiple flow equalization boxes (77) fixedly connected inside, and the other end of the flow divider (604) is fixedly connected inside the flow equalization box (77). The top of the flow equalization box (77) is connected to the bottom cavity of the negative pressure box (71).

Images