Gas delivery tube and semiconductor process apparatus

Abstract

This invention provides a gas delivery pipe and semiconductor process equipment, relating to the field of semiconductor equipment. The gas delivery pipe includes an inner pipe and an outer pipe nested together. The inner pipe has multiple inner holes penetrating its sidewalls and spaced apart along its axial direction. The outer pipe has multiple outer holes penetrating its sidewalls and spaced apart along its axial direction. The circumferential relative position of the outer pipe and the inner pipe is adjustable, and the inner holes and outer holes can form vents. When the outer pipe and the inner pipe are in different circumferential relative positions, the venting area of ​​the vents formed at at least one axial position is different. When the outer pipe and the inner pipe are in any circumferential relative position, the venting area of ​​at least two vents is different along the axial direction. This gas delivery pipe is used for gas intake in a process chamber, allowing for different gas intake volumes at different axial positions within the chamber, and providing the required gas intake volume for each axial position, thereby enabling a more uniform axial distribution of gas and its pressure within the chamber.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor equipment, and more specifically, to a gas delivery pipe and semiconductor process equipment. Background Technology

[0002] In semiconductor process equipment such as vertical diffusion furnaces, the uniformity of film layers between wafers and the step coverage are important process indicators that not only directly affect the quality of the finished wafers, but also the production capacity of the equipment.

[0003] The distribution of gas and its pressure within the process chamber is directly related to process parameters such as inter-wafer film uniformity and step coverage. Uneven distribution of gas and its pressure within the process chamber is one of the important reasons for low inter-wafer film uniformity and step coverage.

[0004] However, in related technologies, the process chamber is only equipped with devices such as valves, flow meters, vacuum gauges or differential pressure gauges to regulate or detect the overall pressure inside, which cannot regulate the distribution of gas and its pressure inside the process chamber. Therefore, the finished product quality of the wafer is relatively low and the production capacity of the equipment is also relatively low. Summary of the Invention

[0005] The first objective of this invention is to provide a gas delivery pipe to solve the technical problem in the related art where uneven distribution of gas and its pressure within the process chamber leads to low finished wafer quality.

[0006] The gas delivery pipe provided by the present invention includes an inner pipe and an outer pipe nested together; the inner pipe has an inner hole penetrating its sidewall, and the inner hole has multiple holes spaced apart along the axial direction of the inner pipe; the outer pipe has an outer hole penetrating its sidewall, and the outer hole has multiple holes spaced apart along the axial direction of the outer pipe; the circumferential relative position between the outer pipe and the inner pipe is adjustable, and the inner hole and the outer hole can form a vent hole; when the outer pipe and the inner pipe are in different circumferential relative positions, the venting area of ​​the vent hole formed at at least one axial position is different; when the outer pipe and the inner pipe are in any circumferential relative position, the venting area of ​​at least two vent holes is different along the axial direction of the outer pipe.

[0007] Furthermore, there are multiple outer tubes, which are arranged sequentially along the axial direction of the inner tube.

[0008] Furthermore, multiple positioning structures are provided between the inner tube and the outer tube, and are spaced apart along the circumference of the inner tube. The positioning structures are configured such that the inner tube and the outer tube are relatively fixedly connected when they are in different relative circumferential positions.

[0009] Furthermore, the positioning structure includes: protrusions and grooves; the protrusions are multiple, circumferentially spaced on the inner tube, and protrude from the outer side wall of the inner tube; the grooves are multiple, circumferentially spaced on the outer tube, recessed in the inner side wall of the outer tube, and penetrate through the corresponding ends of the outer tube along the axial direction of the outer tube; when the circumferential relative positions are different, the protrusions are engaged in the corresponding grooves.

[0010] Furthermore, the groove extends radially through the outer wall of the outer tube.

[0011] Furthermore, when there are multiple outer tubes, the multiple positioning structures are arranged in correspondence with the outer tubes along the axial direction of the inner tube.

[0012] Furthermore, the inner holes are arranged in a row, and each inner hole has the same diameter; the outer holes are arranged in multiple rows, and the maximum diameter of the outer holes is not greater than the diameter of the inner holes; when there are multiple outer tubes, the outer holes in the same row have the same diameter, and the outer holes in different rows have different diameters; when there is only one outer tube, the outer holes in the same row have different diameters, and the outer holes in different rows also have different diameters.

[0013] Alternatively, the inner holes may have multiple rows, with different diameters for inner holes in the same row and different diameters for inner holes in different rows; the outer holes may have one row, with all outer holes having the same diameter; the maximum diameter of the inner holes may not be greater than the diameter of the outer holes.

[0014] Furthermore, the free end of the inner tube is sealed.

[0015] Furthermore, one end of the inner tube is connected to an installation tube at an angle to it, and the gas delivery tube is fixedly installed through the installation tube.

[0016] The gas delivery pipe provided by this invention can produce the following beneficial effects:

[0017] The gas delivery pipe provided by the present invention has an inner pipe and an outer pipe that are nested together. The inner hole of the inner pipe and the outer hole of the outer pipe can form a vent hole, so that the gas delivery pipe can be used for gas intake. The gas delivered through the inner cavity of the inner pipe can diffuse to the external environment of the outer pipe through the vent hole. For example, it can be used for gas intake of process chambers to deliver gas from outside the process chamber to inside the process chamber.

[0018] The gas delivery pipe provided by this invention has an adjustable circumferential relative position between the inner and outer pipes. When the outer and inner pipes are in any circumferential relative position, the ventilation area of ​​the vent holes at different positions along the axial direction of the outer pipe can be different, thereby meeting the ventilation volume requirements at different axial positions. Furthermore, when the outer and inner pipes are in different circumferential relative positions, the ventilation area of ​​the vent holes formed at the same axial position can also be different. Thus, by adjusting the circumferential relative position of the outer and inner pipes, the ventilation volume at the same axial position can be adjusted to meet different ventilation volume requirements at the same axial position.

[0019] For example, when a gas delivery pipe is installed along the axial direction of the process chamber for gas intake, the intake volume can vary at different positions along the axial direction within the process chamber. Furthermore, it can provide the required intake volume for each axial position. Therefore, by using this gas delivery pipe, the axial distribution of gas and its pressure within the process chamber can be adjusted, resulting in a more uniform axial distribution. This is beneficial for accurately controlling and improving process parameters such as film uniformity and step coverage between wafers along the axial direction, thereby enhancing the wafer film processing level and improving the finished wafer quality and equipment capacity.

[0020] The second objective of this invention is to provide a semiconductor process apparatus to solve the technical problem in the related art where uneven distribution of gas and pressure within the process chamber leads to low finished wafer quality.

[0021] The semiconductor process equipment provided by this invention includes a process chamber and the aforementioned gas delivery pipe. The process chamber has a chamber inlet and a chamber outlet. The gas delivery pipe is disposed within the process chamber, extending along the height direction of the process chamber, and its inlet end is fixedly inserted into the chamber inlet. Since the process chamber of this semiconductor process equipment is equipped with the aforementioned gas delivery pipe, it possesses all the beneficial effects of the aforementioned gas delivery pipe, which will not be elaborated further here.

[0022] Furthermore, the semiconductor process equipment also includes a heat preservation device, which is disposed in the process chamber, and the body of the heat preservation device is located near the chamber exhaust port.

[0023] Furthermore, the heat preservation device includes a body, the body having a heat preservation cavity and a first air supply channel, the first air supply channel being not connected to the heat preservation cavity, the first air supply channel having multiple air supply ports, all of which are located on the outer wall surface of the body.

[0024] Furthermore, the main body has a barrel-shaped structure, and an insulating cover is fixedly installed at the opening of the main body. The insulating cover and the inner wall of the main body enclose the insulating cavity.

[0025] Furthermore, the insulation cavity is provided with a support column and fins. The support column is fixed to the body, and the fins are multiple and fixed to the support column at intervals along the axial direction of the support column.

[0026] Furthermore, the air inlet includes a first air inlet and a first air outlet, the first air outlet being located on the outer side of the body; and / or, the first air inlet being located on the outer end face of the body.

[0027] Furthermore, the first air outlet has multiple outlets, which are distributed circumferentially and / or axially along the body.

[0028] Furthermore, the first air supply channel is an annular channel surrounding the outside of the insulation cavity.

[0029] Furthermore, the opening is located at the top of the body, and the first air inlet is located at the bottom end face of the body.

[0030] Furthermore, the heat preservation device also includes a rotating shaft fixed to the bottom end face of the main body, the rotating shaft being coaxial with the main body; the rotating shaft has a second air supply channel, the second air supply channel having a second air inlet and a second air outlet, the second air outlet being located on the top end face of the rotating shaft and connected to the first air inlet.

[0031] Furthermore, the second air inlet is located on the bottom end face of the rotating shaft.

[0032] Furthermore, the longitudinal section of the rotating shaft is T-shaped, with its larger end located at the top of the rotating shaft, and the longitudinal section is a plane passing through the axis of the rotating shaft.

[0033] Furthermore, the second air delivery channel is an annular channel and is coaxial with the rotating shaft.

[0034] Furthermore, the first air inlet is an arc-shaped structure, having multiple inlets, which are circumferentially spaced along the bottom end face of the body, and / or radially spaced along the bottom end face of the body.

[0035] The second air outlet has an arc-shaped structure and has multiple outlets, which are circumferentially spaced along the top surface of the rotating shaft and / or radially spaced along the top surface of the rotating shaft, and correspond to the position of the first air inlet.

[0036] Furthermore, one of the top surface of the rotating shaft and the bottom surface of the body is provided with a limiting protrusion, and the other is provided with a limiting groove, wherein the limiting protrusion and the limiting groove cooperate.

[0037] Furthermore, the semiconductor process equipment also includes a pressure detection component configured to detect gas pressure at different height positions within the process chamber.

[0038] Furthermore, the process chamber is provided with a pressure measuring hole; the pressure detection component includes a pressure measuring tube and a pressure measuring vacuum gauge, one end of the pressure measuring tube is connected to the pressure measuring vacuum gauge, and the other end can extend from the pressure measuring hole to the target height position inside the process chamber.

[0039] Furthermore, the pressure measuring tube and the pressure measuring vacuum gauge are sealed together by a first vacuum conversion connector, and / or the pressure measuring hole and the pressure measuring tube are sealed together by a second vacuum conversion connector.

[0040] Furthermore, the first vacuum conversion connector includes:

[0041] The first body has a first through hole, a first end of the first through hole extends radially inward to form a first limiting end face, and a second end extends radially outward to form a second limiting end face; the first through hole is sleeved on the outer wall of the pressure measuring tube, and one end of the pressure measuring tube abuts against the first limiting end face;

[0042] A first locking member has a first through hole and a first locking hole that are connected to each other. The first through hole is fitted onto the outer wall of the pressure measuring tube. The first locking hole extends radially outward from the inner wall surface of one end of the first through hole and extends axially away from the first through hole, penetrating the corresponding end face of the first locking member. The first locking hole is fitted onto the outer wall of the first body.

[0043] The first clamping sleeve is fitted onto the outer wall of the pressure measuring tube and located inside the first locking hole. One end abuts against the bottom end face of the first locking hole, and the other end face is tightly pressed with the second limiting end face by a first sealing ring. The first sealing ring is tightly fitted onto the outer wall of the pressure measuring tube.

[0044] Furthermore, the second vacuum conversion connector includes:

[0045] The second body has a second through hole, one end of which extends radially outward to form a third limiting end face; the second through hole is sleeved on the outer wall of the pressure measuring tube;

[0046] The second locking member has a second through hole and a second locking hole that are connected to each other. The second through hole is sleeved on the outer wall of the pressure measuring tube. The second locking hole extends radially outward from the inner wall surface of one end of the second through hole and extends axially away from the second through hole, penetrating the corresponding end face of the second locking member. The second locking hole is sleeved on the outer wall of the second body.

[0047] The second clamping sleeve is fitted onto the outer wall of the pressure measuring tube and located inside the second locking hole. One end abuts against the bottom end face of the second locking hole, and the other end face is tightly pressed against the third limiting end face with a second sealing ring. The second sealing ring is tightly fitted onto the outer wall of the pressure measuring tube.

[0048] Furthermore, the pressure detection assembly also includes a first metal connector, a first air valve, and a second metal connector connected in sequence. The end of the first metal connector away from the first air valve is fixed to the first vacuum conversion connector, and the end of the second metal connector away from the first air valve is fixed to the pressure measuring vacuum gauge.

[0049] Furthermore, the pressure detection assembly also includes a support arm with a through hole. After the pressure detection assembly is installed in place, the first metal connector passes through the through hole, and the first vacuum conversion connector overlaps the support arm. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0051] Figure 1 This is one of the partial front cross-sectional views of a semiconductor process apparatus provided in an embodiment of the present invention;

[0052] Figure 2 This is a schematic diagram of the structure of a gas delivery pipe provided in an embodiment of the present invention;

[0053] Figure 3 A three-dimensional structural schematic diagram of the outer tube of the gas delivery pipe provided in an embodiment of the present invention;

[0054] Figure 4 A cross-sectional view of the outer tube of the gas delivery pipe provided in an embodiment of the present invention;

[0055] Figure 5 A partial structural diagram of the inner tube of the gas delivery pipe provided in an embodiment of the present invention;

[0056] Figure 6 A partial structural schematic diagram of the gas delivery pipe provided in an embodiment of the present invention;

[0057] Figure 7 This is a second partial front cross-sectional view of a semiconductor process equipment provided in an embodiment of the present invention;

[0058] Figure 8 A three-dimensional cross-sectional schematic diagram of the heat preservation device and chamber door in the semiconductor process equipment provided in the embodiment of the present invention;

[0059] Figure 9 A three-dimensional structural diagram of the heat preservation device and chamber door in a semiconductor process equipment provided in an embodiment of the present invention;

[0060] Figure 10 A bottom view of the body of the heat preservation device in the semiconductor process equipment provided in an embodiment of the present invention;

[0061] Figure 11 A top view of the rotating shaft of the heat preservation device in the semiconductor process equipment provided in an embodiment of the present invention;

[0062] Figure 12 This is a simplified structural diagram of a semiconductor process equipment provided in an embodiment of the present invention;

[0063] Figure 13 This is one of the partial structural schematic diagrams of a pressure detection component in a semiconductor process equipment provided in an embodiment of the present invention;

[0064] Figure 14 This is a schematic diagram of the structure of the first vacuum conversion connector of the pressure detection component in the semiconductor process equipment provided in an embodiment of the present invention;

[0065] Figure 15 This is a schematic diagram of the structure of the second vacuum conversion connector of the pressure detection component in the semiconductor process equipment provided in an embodiment of the present invention;

[0066] Figure 16 This is a second partial structural schematic diagram of a pressure detection component in a semiconductor process equipment provided in an embodiment of the present invention.

[0067] Explanation of reference numerals in the attached figures:

[0068] 100 - Chamber assembly; 110 - Process chamber; 111 - Chamber air inlet; 112 - Chamber exhaust outlet; 113 - Process door; 120 - Crystal boat;

[0069] 200-Insulation device; 210-Main body; 211-Insulation cavity; 212-First air supply channel; 213-First air inlet; 214-First air outlet; 215-Outer wall surface; 216-Outer side surface; 217-Bottom end surface; 218-Limiting groove; 219-Inner wall surface; 220-Insulation cover; 231-Support column; 232-Fin; 240-Rotating shaft; 241-Second air supply channel; 242-Second air inlet; 243-Second air outlet; 244-Receiving groove; 245-Limiting ring;

[0070] 310 - Gas delivery pipe; 311 - Inner pipe; 312 - Inner hole; 313 - Protrusion; 314 - Installation pipe; 316 - Outer pipe; 317 - Outer hole; 318 - Groove;

[0071] 400-Pressure detection assembly; 410-Pressure measuring tube; 420-First vacuum conversion connector; 421-First body; 422-First through hole; 423-First limiting end face; 424-Second limiting end face; 425-First locking element; 426-First through hole; 427-First locking hole; 428-First clamping sleeve; 429-First sealing ring; 430-First metal connecting pipe; 440-First air valve; 450-Second metal connecting pipe; 460-Pressure measuring vacuum gauge; 470-Second vacuum conversion connector; 471-Second body; 472-Second through hole; 473-Third limiting end face; 474-Second locking element; 475-Second through hole; 476-Second locking hole; 477-Second clamping sleeve; 478-Second sealing ring; 480-Support arm; 481-Fixing block; 482-Fixing plate;

[0072] 500 - Exhaust assembly; 510 - Exhaust pipe; 520 - Vacuum pump; 530 - Exhaust vacuum gauge; 540 - Second air valve. Detailed Implementation

[0073] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0074] In semiconductor process equipment such as vertical diffusion furnaces, the uneven distribution of gas and pressure within the process chamber 110 leads to low uniformity of film layers and step coverage between wafers, which not only directly affects the finished product quality of the wafers but also the production capacity of the equipment.

[0075] To address the aforementioned technical problems, this embodiment provides a gas delivery pipe 310 and semiconductor process equipment, wherein the gas delivery pipe 310 is capable of adjusting the gas flow rate at different positions along its axial direction; and the semiconductor process equipment, such as... Figure 1As shown, the system includes the aforementioned gas delivery pipe 310 and a chamber assembly 100. The chamber assembly 100 includes a process chamber 110, which has a chamber inlet 111 and a chamber outlet 112. The gas delivery pipe 310 is disposed within the process chamber 110, extending along the height direction of the process chamber 110, with one end fixedly inserted into the chamber inlet 111. This configuration allows the gas delivery pipe 310 to provide different intake volumes at different axial positions within the process chamber 110, and to supply the required intake volume for each axial position. This allows for adjustment of the axial distribution of gas and pressure within the process chamber 110, resulting in a more uniform axial distribution. This facilitates accurate control and improvement of process parameters such as film uniformity and step coverage between wafers along the axial direction, thereby enhancing the wafer film processing level and improving both the finished wafer quality and equipment capacity.

[0076] Among them, the gas delivery pipe can be an air inlet pipe.

[0077] The gas delivery pipe 310 provided in this embodiment will be described in detail below:

[0078] Combination Figures 2 to 6 As shown, the gas delivery pipe 310 provided in this embodiment includes an inner pipe 311 and an outer pipe 316 nested together. The inner pipe 311 has an inner hole 312 penetrating its sidewall, and there are multiple inner holes 312, which are spaced apart along the axial direction of the inner pipe 311. The outer pipe 316 has an outer hole 317 penetrating its sidewall, and there are multiple outer holes 317, which are spaced apart along the axial direction of the outer pipe 316. The circumferential relative position between the outer pipe 316 and the inner pipe 311 is adjustable, and the inner holes 312 and the outer holes 317 can form vent holes. When the outer pipe 316 and the inner pipe 311 are in different circumferential relative positions, the ventilation area of ​​the vent hole formed at at least one axial position is different. When the outer pipe 316 and the inner pipe 311 are in any circumferential relative position, the ventilation area of ​​at least two vent holes is different along the axial direction of the outer pipe 316.

[0079] The gas delivery pipe 310 provided in this embodiment has an inner hole 312 in the inner tube 311 and an outer hole 317 in the outer tube 316 forming a vent. Therefore, the gas delivery pipe 310 can be used for air intake. Gas delivered through the inner cavity of the inner tube 311 can diffuse through the vent to the external environment of the outer tube 316. For example, it can be used for air intake in the process chamber 110, delivering gas from outside the process chamber 110 to inside. Of course, the gas delivery pipe 310 is not limited to use as an intake pipe; when applied to other equipment, it can also be used as an exhaust pipe.

[0080] The gas delivery pipe 310 provided in this embodiment has an adjustable circumferential relative position between the inner pipe 311 and the outer pipe 316. When the outer pipe 316 and the inner pipe 311 are in any circumferential relative position, the ventilation area of ​​the vent at different positions along the axial direction of the outer pipe 316 can be different, thereby meeting the ventilation volume requirements at different axial positions. Furthermore, when the outer pipe 316 and the inner pipe 311 are in different circumferential relative positions, the ventilation area of ​​the vent at the same axial position can also be different. Therefore, by adjusting the circumferential relative position of the outer pipe 316 and the inner pipe 311, the ventilation volume at the same axial position can be adjusted to meet the different ventilation volume requirements at the same axial position.

[0081] In this embodiment, there may be multiple outer tubes 316, which are arranged sequentially along the axial direction of the inner tube 311. This arrangement allows multiple outer tubes 316 to divide the venting portion of the gas delivery pipe 310 into multiple segments along the axial direction. Therefore, for each segment's corresponding height range, the circumferential relative position of each outer tube 316 and inner tube 311 can be adjusted to obtain more combinations of vent holes, meeting the different ventilation requirements for different height ranges. This makes the adjustment of the ventilation volume along the axial direction of the gas delivery pipe 310 more precise, for example, making the adjustment of the air intake volume along the axial direction of the process chamber 110 more precise, thereby improving the uniformity of the gas and its pressure within the process chamber 110 along the axial direction.

[0082] Specifically, such as Figure 2 As shown, taking the setting of four outer tubes 316 as an example, the four outer tubes 316 are arranged sequentially along the axial direction of the inner tube 311, correspondingly dividing the ventilation part of the gas delivery pipe 310 into four segments framed by the dashed lines. Of course, in other embodiments of this application, the outer tubes 316 are not limited to four; for example, there can be two, three, or five, which can be set according to the specific distribution of gas and its pressure in the process chamber 110.

[0083] It should be noted that the lengths of the multiple outer tubes 316 can be different. The specific length can be determined according to the specific axial distribution of the gas and its pressure in the process chamber 110. For example, the gas and its pressure distribution can be divided into the same height range if they are relatively close, and the length of the corresponding outer tube 316 can be determined according to the length of each height range.

[0084] In this embodiment, multiple positioning structures are provided between the inner tube 311 and the outer tube 316, and are spaced apart along the circumference of the inner tube 311. The positioning structures are configured such that the inner tube 311 and the outer tube 316 are relatively fixedly connected when their relative circumferential positions are different. By setting the positioning structures, after adjusting the relative circumferential positions of the outer tube 316 and the inner tube 311, the outer tube 316 and the inner tube 311 can be relatively fixed, thereby ensuring that the ventilation area of ​​each vent remains unchanged, and thus ensuring accurate ventilation through the vents.

[0085] Specifically, in combination Figures 3 to 6 As shown, in this embodiment, the positioning structure includes: protrusions 313 and grooves 318; there are multiple protrusions 313, circumferentially spaced on the inner tube 311, and protruding from the outer wall of the inner tube 311; there are multiple grooves 318, circumferentially spaced on the outer tube 316, recessed in the inner wall of the outer tube 316, and penetrating the corresponding ends of the outer tube 316 along the axial direction; when in different circumferential relative positions, the protrusions 313 are engaged in the corresponding grooves 318. In this embodiment, the outer tube 316 can be tightly fitted onto the outer wall of the inner tube 311, and the tightness does not hinder the coaxial relative rotation and axial relative movement of the outer tube 316 and the inner tube 311. Of course, the length of the outer tube 316 is less than the distance between the protrusions 313 at both ends, so that the outer tube 316 and the inner tube 311 can be smoothly adjusted from one circumferential relative position to another circumferential relative position. Specifically, when adjusting the circumferential relative position of the outer tube 316 and the inner tube 311, first move the outer tube 316 a certain distance relative to the inner tube 311 along the axial direction so that the groove 318 disengages from the corresponding protrusion 313. Then rotate the outer tube 316 to the target position. Finally, move the outer tube 316 along the axial direction so that the groove 318 engages with the corresponding protrusion 313 in the new position.

[0086] In addition, the groove 318 extends through the corresponding end of the outer tube 316 along the axial direction, allowing the operator to visually see from the corresponding end of the outer tube 316 whether the protrusion 313 and the groove 318 have been engaged. The positioning structure also plays a certain role in axial positioning and limiting of the outer tube 316, which helps to ensure the accurate axial relative position of the outer tube 316 and the inner tube 311.

[0087] More specifically, such as Figure 3 and Figure 4 As shown, and in combination Figure 6 As shown, in this embodiment, the groove 318 penetrates the outer wall of the outer tube 316 radially. Because when the outer tube 316 and the inner tube 311 are in any circumferential relative position, each protrusion 313 should be engaged in the corresponding groove 318. Therefore, by setting the groove 318 to penetrate the outer wall of the outer tube 316, the operator can clearly see from the side whether the protrusion 313 and the groove 318 have been engaged, thus enabling a very intuitive determination of whether the circumferential relative position of the outer tube 316 and the inner tube 311 has been adjusted to the correct position.

[0088] Of course, in other embodiments of this application, the groove 318 may not penetrate the outer wall of the outer tube 316, but only penetrate the end of the outer tube 316. In that case, the operator can judge whether the adjustment is in place from the end of the outer tube 316.

[0089] In this embodiment, the outer tube 316 and the inner tube 311 can be made of materials such as quartz.

[0090] In this embodiment, multiple positioning structures are arranged in correspondence with the outer tube 316 along the axial direction of the inner tube 311.

[0091] In this embodiment, combined with Figures 3 to 5 As shown, the inner holes 312 are arranged in a single row, and all inner holes 312 have the same diameter; the outer holes 317 are arranged in multiple rows, with the same diameter for outer holes 317 in the same row and different diameters for outer holes 317 in different rows; the maximum diameter of the outer hole 317 is not greater than the diameter of the inner hole 312. With this arrangement, when the outer tube 316 and the inner tube 311 are in different circumferential relative positions, the outer tube 316 either partially blocks the inner hole 312 or is directly opposite and equal in size to the inner hole 312. Furthermore, when the outer tube 316 partially blocks the inner hole 312, the area of ​​obstruction by the outer tube 316 varies depending on the circumferential relative position. In this configuration, when the outer tube 316 is adjusted so that the outer holes 317 in different rows are opposite the inner holes 312, a row of vent holes with the same diameter as the outer holes 317 will be formed. Of course, in other embodiments of this application, the outer tube 316 may be a single tube, in which case the diameters of the outer holes 317 in the same row are different, and the diameters of the outer holes 317 in different rows are also different.

[0092] It should be noted that in other embodiments of this application, the inner hole 312 and outer hole 317 can also be configured as follows: the inner hole 312 has multiple rows, the inner holes 312 in the same row have different diameters, and the inner holes 312 in different rows also have different diameters; the outer hole 317 has one row, and the diameters of each outer hole 317 are the same; the maximum diameter of the inner hole 312 is not greater than the diameter of the outer hole 317. In this case, when the outer tube 316 is adjusted so that the outer hole 317 is opposite to the inner holes 312 in different rows, a row of vent holes with the same diameter as the inner holes 312 will be formed.

[0093] In this embodiment, as Figure 2 As shown, the free end of the inner tube 311 is sealed. This design ensures that all gas inside the inner tube 311 diffuses out through the vents. Of course, if the free end of the inner tube 311 requires ventilation, it can also be provided with corresponding vents.

[0094] In this embodiment, as Figure 2 As shown, and in combination Figure 1 As shown, one end of the inner tube 311 is connected to an installation tube 314 at an angle to it, and the gas delivery tube 310 is fixedly installed through the installation tube 314. Figure 1In this process chamber 110, the air inlet 111 is located on the side wall of the process chamber 110. Therefore, the installation pipe 314 is provided to facilitate the fixed installation of the gas delivery pipe 310. Of course, if the air inlet 111 is located on the top or bottom wall of the process chamber 110, the gas delivery pipe 310 may not need to be provided with the installation pipe 314, but can be directly fixed to the chamber exhaust port 112.

[0095] In order to compensate for the intake air in the area near the exhaust port 112 of the process chamber 110, the semiconductor process equipment provided in this embodiment also includes a heat preservation device 200 with dual functions of heat preservation and air supply. The heat preservation device 200 is disposed in the process chamber 110, and its body 210 is disposed near the chamber exhaust port 112.

[0096] The following is a detailed introduction to the heat preservation device 200:

[0097] like Figure 7 and Figure 8 As shown, the heat preservation device 200 provided in this embodiment includes a body 210, which has a heat preservation cavity 211 and a first air supply channel 212. The first air supply channel 212 is not connected to the heat preservation cavity 211, and the first air supply channel 212 is provided with multiple air supply ports, all of which are located on the outer wall surface 215 of the body 210. The heat preservation cavity 211 has a heat preservation function; for example, if... Figure 1 In this embodiment, the heat insulation device 200 is positioned below the crystal boat 120 within the process chamber 110, thereby blocking or at least significantly reducing heat transfer between the area where the crystal boat 120 is located and the external environment below the process chamber 110. In other embodiments of this application, the heat insulation device 200 can also be positioned above or to the side of the crystal boat 120 within the process chamber 110, in which case it can block or reduce heat transfer between the area where the crystal boat 120 is located and the external environment above or to the side of the process chamber 110.

[0098] The first air supply channel 212 of the insulation device 200 has an air supply function, that is, it can transport gas from one space to another, for example, Figure 1 In this process chamber 110, gas can be transported from outside the chamber to inside, so it can be used for the intake or supplementary intake of the process chamber 110. Figure 1 The first air supply channel 212 is used for compensating air intake in the process chamber 110. It increases the air intake in the area where the air outlet is located and its vicinity, thereby helping to regulate the distribution of gas and pressure within the process chamber 110. This results in a more uniform distribution of gas and pressure within the process chamber 110, which in turn facilitates accurate control and improvement of process parameters such as wafer uniformity and step coverage. In other words, the air supply function of this insulation device 200 can improve the wafer film layer process level, thereby contributing to improved wafer quality and equipment capacity.

[0099] Continue as Figure 7 and Figure 8 As shown, in this embodiment, the main body 210 has a barrel-shaped structure, and an insulating cover 220 is fixedly installed at the open end of the main body 210. The insulating cover 220 and the inner wall surface 219 of the main body 210 enclose an insulating cavity 211. With this configuration, the shape of the insulating device 200 is well matched with that of the process chamber 110 and the crystal boat 120 inside it. When it is placed in the process chamber 110, the insulating device 200 can better perform its functions of heat preservation and gas supply to ensure uniform gas and pressure distribution within the process chamber 110. However, it should be noted that in other embodiments of this application, the shape of the main body 210 of the insulating device 200 is not limited to a barrel shape, but can be any other shape, as long as it can perform the required heat preservation and gas supply functions.

[0100] In this embodiment, the insulation cavity 211 is provided with a support column 231 and fins 232. The support column 231 is fixed to the body 210, and multiple fins 232 are fixed to the support column 231 at intervals along the axial direction of the support column 231. The fins 232 are used to improve the insulation performance of the insulation device 200, while the support column 231 is used to support the fins 232. It should be noted that the form of the fins 232 and the support column 231 is not limited to the structure shown in the schematic diagram, but different forms of fins and support columns can be selected according to different process requirements.

[0101] In this embodiment, as Figure 7 and Figure 8 As shown, and in combination Figure 9 and Figure 10 As shown, the air supply port includes a first air inlet 213 and a first air outlet 214. The first air outlet 214 is located on the outer side 216 of the main body 210; the first air inlet 213 is located on the outer end face of the main body 210. More specifically, in this embodiment, the opening of the main body 210 is located at its top, and the first air inlet 213 is located on the bottom end face 217 of the main body 210. However, in other embodiments of this application, if the heat preservation device 200 is located above the crystal boat 120, that is, below the heat preservation device 200, then the first air inlet 213 can be located on the top surface of the main body 210, and the opening of the main body 210 can be located at its bottom. Of course, in other embodiments of this application, the positions of the first air inlet 213 and the first air outlet 214 are not limited to the above positions, but only need to be able to transport the required gas from one space to another space that needs the gas through the first air supply channel 212.

[0102] Specifically, such as Figure 9As shown, in this embodiment, there are multiple first air outlets 214, which are distributed at intervals along the circumference of the body 210 and also at intervals along the axial direction of the body 210. This arrangement is beneficial for both uniform air discharge from the body 210 along the circumference and uniform air discharge along the axial direction. If the distribution of gas and its pressure around the heat preservation device 200 is uniform, then when it is placed below the crystal boat 120 in the process chamber 110, it can uniformly compensate for air intake. However, it should be noted that as long as it can perform the function of compensating for air intake, this application does not limit the specific arrangement, shape, and size of the first air outlets 214.

[0103] In this embodiment, as Figure 7 and Figure 8 As shown, the first air supply channel 212 is an annular channel surrounding the outside of the insulation cavity 211. More specifically, the cavity wall of the insulation cavity 211 is hollow. The first air supply channel 212 is formed by the inner wall surface 219 and the outer wall surface 215 of the body 210. Along its circumference, its radial cross-section is L-shaped, where the radial cross-section refers to the cross-section passing through the central axis of the body 210. With this configuration, the gas entering the first air supply channel 212 from the first air inlet 213 can first flow uniformly in the horizontal direction to the surrounding area, and then flow uniformly upward in the vertical direction, i.e., axially, and diffuse uniformly into the process chamber 110 from the first air outlet 214 uniformly arranged on the outer side 216. Of course, in other embodiments of this application, the arrangement of the first air supply channel 212 is not limited to this, as long as it can supply air. For example, the first air supply channel 212 may also include a plurality of branch channels evenly arranged in the circumferential direction, with the air inlet end of each branch channel corresponding to a first air inlet 213 and the air outlet end corresponding to a row of first air outlets 214.

[0104] Continue as Figure 7 and Figure 8 As shown, in this embodiment, the heat preservation device 200 also includes a rotating shaft 240 fixed to the bottom end face 217 of the body 210. The rotating shaft 240 is coaxial with the body 210. The rotating shaft 240 is used to support the body 210 of the heat preservation device 200 and the crystal boat 120 above the heat preservation device 200, and to realize the rotation of the body 210 and the crystal boat 120. The connection between the body 210 and the rotating shaft 240 includes, but is not limited to, using bolts, buckles, pins and other structures made of the same material as the body 210.

[0105] More specifically, in this embodiment, the rotating shaft 240 has a second air supply channel 241, which has a second air inlet 242 and a second air outlet 243. The second air outlet 243 is located on the top surface of the rotating shaft 240 and communicates with the first air inlet 213. In this configuration, gas can sequentially enter the process chamber 110 through the second air supply channel 241 and the first air supply channel 212, thereby providing compensating air supply to the process chamber 110.

[0106] The second air inlet 242 is located on the bottom end face of the rotating shaft 240 and can be connected to an external air source. Of course, in other embodiments of this application, if the bottom end of the rotating shaft 240 extends outside the process chamber 110, the second air inlet 242 can also be located on the side wall of the rotating shaft 240.

[0107] Continue as Figure 7 and Figure 8 As shown, in this embodiment, the longitudinal section of the rotating shaft 240 is T-shaped, with its larger end located at the top of the rotating shaft 240. The longitudinal section is a plane passing through the axis of the rotating shaft 240. With this configuration, the body 210 is positioned on the larger end of the rotating shaft 240, resulting in a relatively large bearing area for the body 210 and the crystal boat 120 above it, thus providing better bearing stability for the body 210 and the crystal boat 120.

[0108] In this embodiment, the second air delivery channel 241 is an annular channel and is coaxial with the rotating shaft 240. More specifically, the rotating shaft 240 is a hollow structure, and its radial cross-section along the circumference of the second air delivery channel 241 is approximately "7" shaped, where the radial cross-section refers to the cross-section through the axis of the rotating shaft 240. With this configuration, the gas entering the second air delivery channel 241 from the second air inlet 242 first flows upward axially, then diffuses horizontally in all directions, and then enters the first air delivery channel 212 after passing upward through the second air outlet 243 and the first air inlet 213. Of course, in other embodiments of this application, the second air delivery channel 241 is not limited to the above form, as long as it can deliver gas. For example, the second air delivery channel 241 can also be a cylindrical channel and coaxial with the rotating shaft 240.

[0109] like Figure 10 As shown, in this embodiment, the first air inlet 213 has an arc-shaped structure and multiple inlets, which are spaced apart both circumferentially and radially along the bottom end face 217 of the body 210. More specifically, with the axis of the body 210 as the center, the first air inlet 213 has multiple rings, and the multiple rings of the first air inlet 213 are evenly arranged radially, while the multiple first air inlets 213 in each ring are evenly arranged circumferentially. In this way, the arrangement of the first air inlets 213 is relatively uniform, thereby improving the uniformity of air intake.

[0110] like Figure 11As shown, the second air outlet 243 is also an arc-shaped structure with multiple outlets. They are evenly spaced both circumferentially and radially along the top surface of the rotating shaft 240. This ensures that the outlets are evenly spaced, thus guaranteeing uniformity of air output. Furthermore, the outlets 243 correspond to the positions of the first inlet 213, allowing the gas flowing out from the outlets 243 to directly enter the first inlet 213. This results in low gas resistance and high gas delivery efficiency.

[0111] In this embodiment, one of the top surface of the rotating shaft 240 and the bottom surface 217 of the body 210 can be provided with a limiting protrusion, and the other can be provided with a limiting groove 218. The limiting protrusion and the limiting groove 218 cooperate to position and limit the position between the rotating shaft 240 and the body 210, which helps to ensure the coaxiality of the two.

[0112] Specifically, in this embodiment, combined with Figure 7 and Figure 8 As shown, the bottom end face 217 of the main body 210 is provided with a limiting groove 218, and the top end face of the rotating shaft 240 is provided with a receiving groove 243. A limiting ring 244 is installed in the receiving groove 243, and the limiting ring 244 forms a limiting protrusion. Of course, in other embodiments of this application, the top end face of the rotating shaft 240 can also be directly provided with a limiting protrusion. Moreover, although the limiting groove 218, the receiving groove 244, and the limiting ring 245 are all annular in this embodiment, in other embodiments of this application, the limiting groove 218 and the limiting protrusion are not limited to being annular, but only need to be able to provide the above-mentioned positioning and limiting functions for the rotating shaft 240 and the main body 210.

[0113] like Figure 1 and Figure 12 As shown, the semiconductor process equipment provided in this embodiment also includes a pressure detection component 400, which is configured to detect the gas pressure at different height positions within the process chamber 110. By detecting the gas pressure at different height positions within the process chamber 110, the specific value and distribution of the axial pressure within the process chamber 110 can be accurately determined. This facilitates targeted adjustment of the axial pressure within the process chamber 110 using gas delivery pipes 310 and insulation devices 200, based on differences in the axial pressure distribution, to improve the uniformity of the axial pressure within the process chamber 110, thereby improving the uniformity of the film layer and step coverage between wafers at different height positions.

[0114] The pressure detection component 400 is described in detail below:

[0115] like Figure 1 , Figure 12 as well as Figure 13As shown, in this embodiment, the pressure detection assembly 400 includes a pressure measuring tube 410 and a pressure measuring vacuum gauge 460. One end of the pressure measuring tube 410 is connected to the pressure measuring vacuum gauge 460, and the other end can extend from the pressure measuring hole provided in the process chamber 110 to the target height position inside the process chamber 110. The free end of the pressure measuring tube 410 is not closed. When detecting the gas pressure at a certain height position inside the process chamber 110, the free end is extended to the target height position inside the process chamber 110, and then the pressure measuring vacuum gauge 460 is used for detection. The type and model of the pressure measuring vacuum gauge 460 can be selected according to the requirements.

[0116] The pressure measuring tube 410 is made of high-temperature resistant materials such as quartz or silicon carbide, preferably the same material as the process chamber 110.

[0117] Considering that the pressure measuring tube 410 is relatively fragile, in this embodiment, the connection between the pressure measuring tube 410 and other devices is through a vacuum conversion connector. Specifically, a first vacuum conversion connector 420 is provided between the pressure measuring tube 410 and the pressure measuring vacuum gauge 460, and the pressure measuring tube 410 is sealed to the first vacuum conversion connector 420; the pressure measuring hole is sealed to the pressure measuring tube 410 through a second vacuum conversion connector 470.

[0118] Specifically, such as Figure 14 As shown, the first vacuum conversion connector 420 includes a first body 421, a first locking member 425, and a first clamping sleeve 428. The first body 421 has a first through hole 422. The first end of the first through hole 422 extends radially inward to form a first limiting end face 423, and the second end extends radially outward to form a second limiting end face 424. The first through hole 422 is sleeved on the outer side wall of the pressure measuring tube 410, and one end of the pressure measuring tube 410 abuts against the first limiting end face 423. The first locking member 425 has a first through hole 426 and a first locking hole 427 that are connected. The first through hole 426 is sleeved on the outer side wall of the pressure measuring tube 410. The outer wall of the first body 421 has a first locking hole 427 extending radially outward from the inner wall surface of one end of the first through hole 426 and extending axially away from the first through hole 426, penetrating the corresponding end face of the first locking member 425. The first locking hole 427 is fitted onto the outer wall of the first body 421. The first pressing sleeve 428 is fitted onto the outer wall of the pressure measuring tube 410 and located inside the first locking hole 427. One end of the sleeve abuts against the bottom end face of the first locking hole 427, and the other end face is tightly pressed against the second limiting end face 424 with a first sealing ring 429. The first sealing ring 429 is tightly fitted onto the outer wall of the pressure measuring tube 410. The tightness referred to by "tightly pressing" and "tightly fitted" is such that the first sealing ring 429 can fix the pressure measuring tube 410 to the first vacuum conversion connector 420 without damaging the pressure measuring tube 410.

[0119] When assembling the pressure measuring tube 410 and the first vacuum conversion connector 420, the first locking member 425, the first clamping sleeve 428, and the first sealing ring 429 can be sequentially fitted from the end of the pressure measuring tube 410 used to connect with the first vacuum conversion connector 420 to the outside of the pressure measuring tube 410; then the end of the pressure measuring tube 410 is inserted into the first through hole 422 and abuts against the first limiting end face 423. During this process, if the initial position of the first sealing ring 429 is too close to the end of the pressure measuring tube 410, the first sealing ring 429 will contact the second limiting end face 424 before the pressure measuring tube 410 is inserted into the position, and the second limiting end face 424 will push it backward to the target position. Finally, the first locking member 425 is fixedly connected to the first body 421. During this process, the first locking member 425 will push the first pressing sleeve 428 toward the first sealing ring 429 and squeeze the first sealing ring 429 so that the first sealing ring 429 is tightly fitted outside the pressure measuring tube 410, thereby fixing the pressure measuring tube 410. If the initial position of the first sealing ring 429 is too far from the end of the pressure measuring tube 410, during the process of the first locking member 425 being fixedly connected to the first body 421, the first locking member 425 will first push the first sealing ring 429 to the target position through the first pressing sleeve 428, and then squeeze it to be tightly fitted outside the pressure measuring tube 410.

[0120] like Figure 15 As shown, the second vacuum converter 470 includes a second body 471, a second locking member 474, and a second clamping sleeve 477. The second body 471 has a second through hole 472, one end of which extends radially outward to form a third limiting end face 473. The second through hole 472 is fitted onto the outer wall of the pressure measuring tube 410. The second locking member 474 has a second through hole 475 and a second locking hole 476 that are connected. The second through hole 475 is fitted onto the outer wall of the pressure measuring tube 410. The second locking hole 476 extends from the second through hole 475. One end of the inner wall extends radially outward and axially away from the second through hole 475, penetrating the corresponding end face of the second locking member 474. The second locking hole 476 is fitted onto the outer wall of the second body 471. The second pressing sleeve 477 is fitted onto the outer wall of the pressure measuring tube 410 and located inside the second locking hole 476. One end abuts against the bottom end face of the second locking hole 476, and the other end face is tightly pressed against the third limiting end face 473 with a second sealing ring 478. The second sealing ring 478 is tightly fitted onto the outer wall of the pressure measuring tube 410. The tightness referred to by "tightly pressing" and "tightly fitted" is such that the second sealing ring 478 can fix the pressure measuring tube 410 to the second vacuum conversion connector 470 without damaging the pressure measuring tube 410.

[0121] The bottom wall of the process chamber 110 is its process door 113, and the pressure measuring hole is located in the process door 113; the second body 471 is fixed to the process door 113 and is arranged coaxially with the pressure measuring hole.

[0122] When assembling the pressure testing tube 410 and the second vacuum conversion connector 470, the second sealing ring 478, the second clamping sleeve 477, and the second locking member 474 can be sequentially fitted onto the outside of the pressure testing tube 410 from the end of the pressure testing tube 410 used to connect with the second vacuum conversion connector 470. The second sealing ring 478 is then moved to the target position, that is, the position where the second sealing ring 478 should be when the free end of the pressure testing tube 410 is inserted through the second through hole 472 into the target height position within the process chamber 110. The target height position can be determined in advance through simple calculation and measurement. After the free end of the pressure measuring tube 410 is inserted into the process chamber 110 through the second through hole 472, the second locking member 474 is fixedly connected to the second body 471. During this process, the second locking member 474 will push the second pressing sleeve 477 toward the second sealing ring 478 and squeeze the second sealing ring 478 so that the second sealing ring 478 is tightly fitted on the outside of the pressure measuring tube 410, thereby fixing the pressure measuring tube 410.

[0123] More specifically, such as Figure 1 and Figure 13 As shown, in this embodiment, the pressure detection assembly 400 further includes a first metal connector 430, a first air valve 440, and a second metal connector 450 connected in sequence. The end of the first metal connector 430 away from the first air valve 440 is fixed to the first vacuum conversion connector 420, and the end of the second metal connector 450 away from the first air valve 440 is fixed to the pressure measuring vacuum gauge 460. The first air valve 440 can be a ball valve, and the first metal connector 430 and the second metal connector 450 are connected to the ball valve via a compression fitting on the ball valve. When assembling the pressure detection component 400, the first metal connector 430, the first air valve 440, and the second metal connector 450 can be assembled first. The connection between the first metal connector 430 and the first body 421 of the first vacuum conversion connector 420 can be achieved by first inserting the first metal connector 430 into the through hole of the first body 421 and then welding it. The second metal connector 450 and the pressure gauge 460 can be connected through an adapter that is compatible with the pressure gauge 460, including but not limited to VCR connectors, flange connectors, etc. After assembling the above-mentioned unbreakable components, the pressure measuring tube 410 can be installed.

[0124] Considering the weight of the pressure detection component 400, and that the second sealing ring 478 is used to fix the pressure detection component 400 to the process chamber 110, the positional stability of the pressure measuring tube 410 is limited. Therefore, in this embodiment, as... Figure 12As shown, the pressure detection assembly 400 also includes a support arm 480 with a through hole. After the pressure detection assembly 400 is installed in place, the first metal connector 430 passes through the through hole, and the first vacuum conversion connector 420 overlaps the support arm 480. This arrangement relies primarily on the support arm 480 to support the weight of the pressure detection assembly 400 and other components, greatly improving the positional stability of the pressure detection assembly 400 and facilitating smooth detection and accurate results.

[0125] More specifically, such as Figure 16 As shown, the support arm 480 can be provided with a fixing block 481 and a fixing plate 482. The fixing block 481 is fixedly connected to the main body of the support arm 480. Each side of the fixing block 481 and the fixing plate 482 has a partial through hole. After the fixing plate 482 is fixed to the fixing block 481, the two partial through holes form the aforementioned perforation. With this configuration, when assembling for testing, the fixing block 481 can be moved to one side of the first metal connector 430 first, and then the fixing plate 482 can be merged into the fixing block 481 without having to insert the pipe into the perforation axially, which is very convenient. Furthermore, at least one of the two partial through holes can be smaller than half a hole. In this way, the size of the perforation and the clamping degree of the first metal connector 430 can be adjusted by adjusting the screws connecting the two.

[0126] In summary, when detecting gas pressure at different heights within the process chamber 110, the pressure detection assembly 400 can be installed and removed following these steps:

[0127] S102, Remove the sealing plug on the second vacuum conversion connector 470 at the pressure measuring hole of the process door 113 of the process chamber 110, and place it properly.

[0128] S104, connect and assemble the first vacuum conversion connector 420, the first metal connector 430, the first air valve 440, and the second metal connector 450. Connect the pressure measuring vacuum gauge 460 to the second metal connector 450 through the adapter. Assemble the step formed between the lower end of the first vacuum conversion connector 420 and the first metal connector 430 with the support arm 480. The tightness of the screws that fix the fixing plate 482 to the fixing block 481 is such that the first metal connector 430 can move up and down in the through hole of the support arm 480 without being restricted, and can be slightly wobbled, so as to prevent the pressure measuring tube 410 from being subjected to abnormal force when connecting the pressure measuring tube 410.

[0129] S106. Connect the data cable of the pressure gauge 460 to the computer to confirm that the data can be stored and read.

[0130] S108, remove the second locking part 474, the second clamping sleeve 477 and the second sealing ring 478 from the pressure testing hole of the second vacuum conversion connector 470 at the process door 113, and wipe the second sealing ring 478 with pure water to make the surface of the second sealing ring 478 clean and free of foreign matter.

[0131] S110: Based on the target detection height, determine the distance from the bottom surface of the pressure testing tube 410 to the bottom surface of the second vacuum conversion connector 470. Fit the second sealing ring 478 to its target position, then install the pressure testing tube 410. Specifically, insert the pressure testing tube 410 into the pressure testing hole and slowly move it upwards to prevent collisions until the second sealing ring 478 abuts against the third limiting end face 473. Securely connect the second locking member 474 to the second body 471. If the second locking member 474 is overtightened, do not reverse it, as this can easily lead to seal failure. Completely unscrew the second locking member 474 from the second body 471 and then retighten it. Axial installation errors only need to be controlled within the allowable range, such as within 5mm.

[0132] S112, remove the first locking part 425, the first pressing sleeve 428, and the first sealing ring 429 from the first vacuum conversion connector 420, wipe the first sealing ring 429 with pure water to keep the surface of the first sealing ring 429 clean and free of foreign matter; and then put the first locking part 425, the first pressing sleeve 428, and the first sealing ring 429 onto the outside of the pressure measuring tube 410 in sequence.

[0133] S114, move the support arm 480 so that the first vacuum conversion connector 420 is concentric with the pressure measuring tube 410 that has been installed on the process gate 113, and the upper surface of the first vacuum conversion connector 420 is 8-10mm away from the bottom surface of the pressure measuring tube 410.

[0134] S116, hold the assembled component and slowly move it upwards until the first sealing ring 429 on the outer sleeve of the pressure measuring tube 410 abuts against the second limiting end face 424. Then tighten the first locking member 425 of the first vacuum conversion connector 420 to the first body 421. Similarly, if the first locking member 425 is over-tightened, do not untighten it. Instead, completely unscrew the first locking member 425 from the first body 421 and then tighten it back on.

[0135] Hold the assembled components and adjust the height of the support arm 480 so that the support arm 480 can just provide support through the first vacuum conversion joint 420.

[0136] S118, adjust the process state in the process chamber 110, heat up to the test temperature, and test the leakage rate after assembly. If the leakage rate Spec≤4mTorr / min, the leak test is passed and pressure test can be performed. If the leak test fails, the condition of the sealing rings of the first vacuum conversion connector 420 and the second vacuum conversion connector 470 needs to be checked, reinstalled and tested for leaks until the leak test is passed.

[0137] S120, after the test is completed, the process chamber 110 is cooled down. Wearing high-temperature gloves, loosen the second locking part 474 of the second vacuum conversion connector 470 at the process door 113, remove the first locking part 425 of the first vacuum conversion connector 420, move the support arm 480, unscrew the second locking part 474 of the second vacuum conversion connector 470 at the process door 113, take out the pressure measuring tube 410, and the test is completed.

[0138] In this embodiment, as Figure 12 As shown, the semiconductor process equipment also includes an exhaust assembly 500, which includes an exhaust pipe 510 and a vacuum pump 520. The exhaust pipe 510 connects the process chamber 110 and the vacuum pump 520, and the exhaust pipe 510 is equipped with an exhaust vacuum gauge 530 and a second gas valve 540, which can be a butterfly valve. The vacuum pump 520 can evacuate the process chamber 110, allowing gas to exit the process chamber 110 through the exhaust pipe 510; the exhaust vacuum gauge 530 can monitor and measure the exhaust pressure; and the second gas valve 540 can control the magnitude of the exhaust pressure.

[0139] When using the aforementioned pressure detection component 400 to detect the gas pressure at different heights within a process chamber 110 under certain process conditions, after assembling and installing the pressure detection component 400, process gas is introduced into the process chamber 110. A vacuum pump 520 evacuates the process chamber 110, and the process gas is discharged from the process chamber 110 through the exhaust pipe 510. A certain pressure distribution is achieved within the process chamber 110. At this point, the pressure value measured by the pressure gauge 460 connected to the pressure measuring tube 410 is the pressure value at the location of the top opening of the pressure measuring tube 410. The pressure value measured by the pressure gauge 460 can be read by a connected computer. The computer records the pressure value at that height within the process chamber 110 at certain time intervals and can plot this series of pressure values ​​as a pressure-time curve on the computer. After the gas pressure at one target height has been measured, the length of the pressure measuring tube 410 extending into the process chamber 110 can be adjusted to measure the gas pressure at another target height, until the gas pressure at all target heights has been measured. By comparing the measured pressure value at each height with the target pressure value, the pressure difference value can be obtained. Based on the pressure difference value corresponding to each height position, targeted pressure adjustments can be made.

[0140] According to the measured data, along the axial direction of the process chamber 110, the gas pressure at the top and middle of the wafer area is basically the same, both greater than the pressure at the bottom. The bottom is the part near the insulation area where the insulation device 200 is located. The reason is that the bottom of the wafer area is closer to the chamber exhaust port 112, so the pressure change at this part is more obvious and the pressure is lower than that at the top and middle.

[0141] Based on the above experimental results, the heat preservation device 200 can be used alone to compensate for the air intake in the vicinity of the chamber exhaust port 112, thereby increasing the gas at the bottom of the wafer location area, increasing the gas pressure in that area, and thus improving the uniformity of the gas and pressure distribution along the axial direction in the wafer location area; the gas delivery pipe 310 can also be used alone to locally or globally adjust the air intake at different height positions in the process chamber 110, making the axial pressure in the process chamber 110 more uniform; the gas delivery pipe 310 and the heat preservation device 200 can also be used in combination to achieve the purpose of making the axial pressure in the process chamber 110 uniform.

[0142] In summary, the semiconductor process equipment provided in this embodiment can achieve transparency of the axial pressure distribution within the process chamber 110 through the pressure detection component 400. Given that the axial pressure distribution and specific pressure values ​​within the process chamber 110 are known, the axial gas pressure within the process chamber 110 can be specifically adjusted for differences in the axial pressure distribution through the compensation air intake function of the gas delivery pipe 310 and the insulation device 200. This improves the uniformity of the axial pressure distribution within the process chamber 110, thereby optimizing the uniformity of the inter-wafer process film layers and improving step coverage, ultimately enhancing the process level and wafer product quality.

[0143] Furthermore, by using the gas delivery pipe 310, the air intake at different height positions within the process chamber 110 can be adjusted to bring the gas pressure at each height position close to the target pressure. Alternatively, the air intake within a certain height range can be adjusted to bring the gas pressure within that range close to the gas pressure in other height ranges, thereby achieving axial uniformity of the gas and its pressure within the process chamber 110. Specifically, if the gas pressure in a certain height range is lower than the gas pressure in other height ranges, the gas delivery pipe 310 and the outer pipe 316 corresponding to that height range can be rotated to make the vent area of ​​its vent larger than that of other height ranges, thereby increasing the air intake within that height range and raising the gas pressure within that height range. Conversely, if the gas pressure in a certain height range is higher than that of other height ranges, the gas delivery pipe 310 and the outer pipe 316 corresponding to that height range can be rotated to make the vent area of ​​its vent smaller than that of other height ranges, thereby reducing the air intake within that height range and lowering the pressure value within that height range.

[0144] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0145] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to the embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A gas delivery pipe, characterized in that, It includes an inner tube (311) and an outer tube (316) that are fitted together; The inner tube (311) has an inner hole (312) penetrating its sidewall, and there are multiple inner holes (312) that are spaced apart along the axial direction of the inner tube (311). The outer tube (316) has an outer hole (317) penetrating its sidewall, and there are multiple outer holes (317) that are spaced apart along the axial direction of the outer tube (316). The circumferential relative position between the outer tube (316) and the inner tube (311) is adjustable, and the inner hole (312) and the outer hole (317) can form a vent hole; When the outer tube (316) and the inner tube (311) are in different circumferential relative positions, the ventilation area of ​​the vent formed at at least one axial position is different; When the outer tube (316) and the inner tube (311) are in any of the circumferential relative positions, the ventilation areas of at least two of the vent holes are different along the axial direction of the outer tube (316).

2. The gas delivery pipe according to claim 1, characterized in that, The outer tube (316) has multiple components and is arranged sequentially along the axial direction of the inner tube (311).

3. The gas delivery pipe according to claim 1, characterized in that, Multiple positioning structures are provided between the inner tube (311) and the outer tube (316), and are spaced apart along the circumference of the inner tube (311). The positioning structures are configured such that the inner tube (311) and the outer tube (316) are relatively fixedly connected when they are in different relative circumferential positions.

4. The gas delivery pipe according to claim 3, characterized in that, The positioning structure includes: protrusions (313) and grooves (318); the protrusions (313) are multiple, circumferentially spaced on the inner tube (311), and protrude from the outer sidewall of the inner tube (311); the grooves (318) are multiple, circumferentially spaced on the outer tube (316), recessed in the inner sidewall of the outer tube (316), and extending through the corresponding ends of the outer tube (316) along the axial direction of the outer tube (316); When the relative positions of the protrusions (313) are different, the protrusions (313) are engaged in the corresponding grooves (318).

5. The gas delivery pipe according to claim 4, characterized in that, The groove (318) penetrates the outer wall of the outer tube (316) radially.

6. The gas delivery pipe according to claim 4, characterized in that, When there are multiple outer tubes (316), the multiple positioning structures are arranged in correspondence with the outer tubes (316) along the axial direction of the inner tube (311).

7. The gas delivery pipe according to any one of claims 1-6, characterized in that, The inner holes (312) are arranged in a row, and the diameter of each inner hole (312) is the same; the outer holes (317) are arranged in multiple rows, and the maximum diameter of each outer hole (317) is not greater than the diameter of the inner hole (312); when there are multiple outer tubes (316), the diameter of the outer holes (317) in the same row is the same, and the diameter of the outer holes (317) in different rows is different; when there is only one outer tube (316), the diameter of the outer holes (317) in the same row is different, and the diameter of the outer holes (317) in different rows is also different. Alternatively, the inner hole (312) has multiple rows, the inner holes (312) in the same row have different diameters, and the inner holes (312) in different rows also have different diameters; the outer hole (317) has one row, and the diameters of each outer hole (317) are the same; the maximum diameter of the inner hole (312) is not greater than the diameter of the outer hole (317).

8. The gas delivery pipe according to claim 7, characterized in that, The free end of the inner tube (311) is sealed.

9. The gas delivery pipe according to claim 1, characterized in that, One end of the inner tube (311) is connected to an installation tube (314) at an angle to it, and the gas delivery tube (310) is fixedly installed through the installation tube (314).

10. A semiconductor process apparatus, characterized in that, The device includes a process chamber (110) and a gas delivery pipe (310) as described in any one of claims 1-9. The process chamber (110) has a chamber inlet (111) and a chamber outlet (112). The gas delivery pipe (310) is disposed in the process chamber (110), extends along the height direction of the process chamber (110), and its inlet end is fixedly inserted into the chamber inlet (111).

11. The semiconductor process equipment according to claim 10, characterized in that, The semiconductor process equipment also includes a heat preservation device (200), which is located in the process chamber (110), and the body (210) of the heat preservation device (200) is located near the chamber exhaust port (112).

12. The semiconductor process equipment according to claim 11, characterized in that, The heat preservation device (200) includes a body (210), which has a heat preservation cavity (211) and a first air supply channel (212). The first air supply channel (212) is not connected to the heat preservation cavity (211). The first air supply channel (212) is provided with multiple air supply ports, all of which are located on the outer wall surface (215) of the body (210).

13. The semiconductor process equipment according to claim 12, characterized in that, The main body (210) has a barrel-shaped structure. The opening of the main body (210) is sealed with a heat-insulating cover (220). The heat-insulating cover (220) and the inner wall surface (219) of the main body (210) enclose the heat-insulating cavity (211).

14. The semiconductor process equipment according to claim 13, characterized in that, The heat insulation cavity (211) is provided with a support column (231) and fins (232). The support column (231) is fixed to the body (210), and the fins (232) are multiple and fixed to the support column (231) at intervals along the axial direction of the support column (231).

15. The semiconductor process equipment according to claim 13, characterized in that, The air inlet includes a first air inlet (213) and a first air outlet (214), with the first air outlet (214) located on the outer side (216) of the body (210); And / or, the first air inlet (213) is located on the outer end face of the body (210).

16. The semiconductor process equipment according to claim 15, characterized in that, The first air outlet (214) has multiple outlets, which are distributed circumferentially along the body (210) and / or distributed axially along the body (210).

17. The semiconductor process equipment according to claim 15, characterized in that, The first air supply channel (212) is an annular channel surrounding the outside of the heat preservation cavity (211).

18. The semiconductor process apparatus according to any one of claims 15-17, characterized in that, The opening is located at the top of the body (210), and the first air inlet (213) is located at the bottom end face (217) of the body (210).

19. The semiconductor process equipment according to claim 18, characterized in that, The heat preservation device (200) also includes a rotating shaft (240) fixed to the bottom end face (217) of the body (210), and the rotating shaft (240) is coaxial with the body (210); The rotating shaft (240) has a second air supply channel (241), the second air supply channel (241) has a second air inlet (242) and a second air outlet (243), the second air outlet (243) is located on the top surface of the rotating shaft (240) and is connected to the first air inlet (213).

20. The semiconductor process equipment according to claim 19, characterized in that, The second air inlet (242) is located on the bottom end face of the rotating shaft (240).

21. The semiconductor process equipment according to claim 19, characterized in that, The longitudinal section of the shaft (240) is "T" shaped, with its large end located at the top of the shaft (240). The longitudinal section is a plane passing through the axis of the shaft (240).

22. The semiconductor process equipment according to claim 19, characterized in that, The second air delivery channel (241) is an annular channel and is coaxial with the rotating shaft (240).

23. The semiconductor process equipment according to claim 19, characterized in that, The first air inlet (213) is an arc-shaped structure and has multiple inlets, which are arranged circumferentially along the bottom end face (217) of the body (210) and / or radially along the bottom end face (217) of the body (210). The second air outlet (243) is an arc-shaped structure with multiple outlets, which are circumferentially spaced along the top surface of the rotating shaft (240) and / or radially spaced along the top surface of the rotating shaft (240), and correspond to the position of the first air inlet (213).

24. The semiconductor process equipment according to claim 19, characterized in that, One of the top surface of the rotating shaft (240) and the bottom surface (217) of the body (210) is provided with a limiting protrusion, and the other is provided with a limiting groove (218), wherein the limiting protrusion and the limiting groove (218) cooperate.

25. The semiconductor process equipment according to any one of claims 10-17, characterized in that, The semiconductor process equipment also includes a pressure detection component (400), which is configured to detect the gas pressure at different height positions within the process chamber (110).

26. The semiconductor process equipment according to claim 25, characterized in that, The process chamber (110) is provided with a pressure measuring hole; The pressure detection assembly (400) includes a pressure measuring tube (410) and a pressure measuring vacuum gauge (460). One end of the pressure measuring tube (410) is connected to the pressure measuring vacuum gauge (460), and the other end can extend from the pressure measuring hole to the target height position inside the process chamber (110).

27. The semiconductor process equipment according to claim 26, characterized in that, The pressure measuring tube (410) and the pressure measuring vacuum gauge (460) are sealed together by a first vacuum conversion connector (420), and / or the pressure measuring hole and the pressure measuring tube (410) are sealed together by a second vacuum conversion connector (470).

28. The semiconductor process equipment according to claim 27, characterized in that, The first vacuum adapter (420) includes: The first body (421) has a first through hole (422), the first end of the first through hole (422) extends radially inward to form a first limiting end face (423), and the second end extends radially outward to form a second limiting end face (424); the first through hole (422) is sleeved on the outer wall of the pressure measuring tube (410), and one end of the pressure measuring tube (410) abuts against the first limiting end face (423); A first locking member (425) has a first through hole (426) and a first locking hole (427) that are connected to each other. The first through hole (426) is fitted onto the outer wall of the pressure measuring tube (410). The first locking hole (427) extends radially outward from the inner wall surface of one end of the first through hole (426) and extends axially away from the first through hole (426) and through the corresponding end face of the first locking member (425). The first locking hole (427) is fitted onto the outer wall of the first body (421). The first clamping sleeve (428) is fitted onto the outer wall of the pressure measuring tube (410) and located inside the first locking hole (427). One end abuts against the bottom end face of the first locking hole (427), and the other end face is tightly pressed against the second limiting end face (424) with a first sealing ring (429). The first sealing ring (429) is tightly fitted onto the outer wall of the pressure measuring tube (410).

29. The semiconductor process equipment according to claim 27, characterized in that, The second vacuum adapter (470) includes: The second body (471) has a second through hole (472), one end of which extends radially outward to form a third limiting end face (473); the second through hole (472) is sleeved on the outer wall of the pressure measuring tube (410); The second locking member (474) has a second through hole (475) and a second locking hole (476) that are connected. The second through hole (475) is fitted onto the outer wall of the pressure measuring tube (410). The second locking hole (476) extends radially outward from the inner wall surface of one end of the second through hole (475) and extends axially away from the second through hole (475) and through the corresponding end face of the second locking member (474). The second locking hole (476) is fitted onto the outer wall of the second body (471). The second clamping sleeve (477) is fitted onto the outer wall of the pressure measuring tube (410) and located inside the second locking hole (476). One end abuts against the bottom end face of the second locking hole (476), and the other end face is tightly pressed against the third limiting end face (473) with a second sealing ring (478). The second sealing ring (478) is tightly fitted onto the outer wall of the pressure measuring tube (410).

30. The semiconductor process equipment according to claim 27, characterized in that, The pressure detection assembly (400) further includes a first metal connector (430), a first air valve (440), and a second metal connector (450) connected in sequence. The end of the first metal connector (430) away from the first air valve (440) is fixed to the first vacuum conversion connector (420), and the end of the second metal connector (450) away from the first air valve (440) is fixed to the pressure measuring vacuum gauge (460).

31. The semiconductor process equipment according to claim 30, characterized in that, The pressure detection assembly (400) also includes a support arm (480) with a through hole. After the pressure detection assembly (400) is installed in place, the first metal connector (430) passes through the through hole and the first vacuum conversion connector (420) overlaps the support arm (480).

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