A capacitor

Abstract

This invention relates to metallized film capacitors and discloses a capacitor comprising: a casing containing a core fixed by a potting compound; the core having leads extending out of the potting compound and communicating with an external circuit; leads with a flat structure; positioning holes formed along the thickness direction of the leads; an insulating element disposed on the outer surface of the leads; a positioning post inserted into the positioning hole on the inner surface of the insulating element; and latches on both sides of the insulating element, the latches bypassing the sides of the leads and abutting against the inner surface of the leads to restrict the movement of the insulating element relative to the thickness direction of the leads. This invention facilitates the assembly of the insulating element to the leads, and the insulating element significantly increases the insulation level between the leads and surrounding devices while maintaining the same spacing between the leads and the external circuit.

Description

Technical Field

[0001] This invention relates to metallized film capacitors, and more particularly to a capacitor. Background Technology

[0002] With the rapid development of power electronics technology, metallized film capacitors have been widely used in the field of new energy vehicles. However, as the automotive industry continues to demand miniaturization and lightweighting, the space left for film capacitors is getting smaller and smaller. The gap between the external interface of the capacitor and other internal parts of the electronic control system, such as the housing and heat sink, is very close. If the gap is less than the safe electrical or creepage distance, insulation measures need to be added.

[0003] Existing film capacitors consist of a capacitor core, lead electrodes, a casing, and resin filling. For capacitors with potential insulation risks, an insulating paper (such as PET film) is typically attached to the terminals for insulation. However, this method of using cold-applied insulating paper for electrode insulation has several drawbacks: 1. During the high-temperature process in capacitor manufacturing, the adhesive on the insulating paper softens and loses its stickiness, causing the insulating paper to detach and resulting in poor capacitor appearance. 2. After the insulating paper is removed, it needs to be reapplied in the subsequent process, which increases rework time and affects efficiency; 3. Manual cold-applying of insulating paper can lead to significant dimensional deviations in the insulating paper, which may not meet customer requirements. Summary of the Invention

[0004] The present invention aims to at least partially solve one of the technical problems in the aforementioned art. Therefore, the object of the present invention is to provide a capacitor in which the terminal portion is enclosed within an insulating structure.

[0005] To achieve the above objectives, embodiments of the present invention provide a capacitor comprising: The outer shell contains a core, which is fixed in place by potting compound. The core has pins that extend out of the potting compound and connect to external circuitry; The pin has a flat structure; a positioning hole is formed along the thickness direction of the pin; an insulating element is provided on the outer side of the pin; the inner side of the insulating element has a positioning post that can be inserted into the positioning hole; the two sides of the insulating element are provided with buckles that bypass the two sides of the pin and abut against the inner side of the pin, so as to restrict the movement of the insulating element relative to the thickness direction of the pin.

[0006] According to an embodiment of the present invention, the insulating element has a positioning post that restricts two spatial degrees of freedom of the insulating element relative to the pin, while the snap-fit ​​restricts another spatial degree of freedom, thereby fixing the insulating element relative to the pin and facilitating the assembly of the insulating element to the pin. The insulating element significantly increases the insulation level between the pin and surrounding devices while keeping the distance between the pin and the external circuit unchanged.

[0007] In addition, a capacitor according to the above embodiments of the present invention may also have the following additional technical features: Optionally, the insulating element protrudes along the thickness direction of the pin to form a flange around the pin, the flange height being not less than the pin thickness.

[0008] Furthermore, the cross-sectional shape of the flange is elliptical or rectangular.

[0009] Optionally, one end of the insulating element extending into the potting compound, facing the core, protrudes to form a separating element that abuts against the core.

[0010] Optionally, the insulating element is made of materials such as PC, PPS, or PA6T. Attached Figure Description

[0011] Figure 1 This is a perspective view of the overall structure according to an embodiment of the present invention; Figure 2 This is a partial structural view according to an embodiment of the present invention; Figure 3 This is a perspective view of the insulating element structure according to the present invention.

[0012] Label Explanation: Outer shell 1 Core 2 Pin 3, Positioning Hole 31 Insulating element 4, positioning post 41, buckle 42, flange 43, separating element 44. Detailed Implementation

[0013] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0014] The present invention fixes the insulating element relative to the pin by means of a positioning post that restricts two spatial degrees of freedom of the insulating element relative to the pin, and a snap-fit ​​that restricts the other spatial degree of freedom. This makes it easy to assemble the insulating element onto the pin. The insulating element significantly increases the insulation level between the pin and surrounding devices while keeping the distance between the pin and the external circuit unchanged.

[0015] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the invention to those skilled in the art.

[0016] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0017] Figures 1 to 3 A capacitor according to an embodiment of the present invention includes: The outer shell 1 has a core 2 inside, which is fixed by potting compound; Core 2 has pins 3 that extend out of the potting compound and are connected to an external circuit; Pin 3 has a flat structure; a positioning hole 31 is formed along the thickness direction of pin 3; an insulating element 4 is provided on the outer side of pin 3; the inner side of the insulating element 4 has a positioning post 41 that can be inserted into the positioning hole 31; and buckles 42 are provided on both sides of the insulating element 4. The buckles 42 pass around the two sides of pin 3 and abut against the inner side of pin 3 so that the movement of the insulating element 4 relative to the thickness direction of pin 3 is restricted.

[0018] The purpose of insulating element 4 is to replace the existing insulating paper and separate the outside of pin 3 from the surrounding conductors. The existing insulating paper is bonded to pin 3 by adhesive, which is unstable and will fall off. In addition, the insulating paper is easy to lift up, causing some pin 3 to be exposed, which reduces the insulation effect.

[0019] Therefore, the insulating element 4 in this solution can stably and effectively cover part of the pin 3 to improve the insulation of the pin 3, and the insulating element 4 can be quickly, conveniently and stably fixed without reducing assembly efficiency.

[0020] During assembly, the positioning post 41 of the insulating element 4 is aligned with the positioning hole 31, and pressure is applied from the outer side of the pin 3. The positioning post 41 is inserted into the positioning hole 31, and the buckle 42 is elastically deformed during the process to lock the pin 3, thereby fixing the relative position of the insulating element 4 and the pin 3. The insulating element 4 will not fall off during subsequent assembly and use. The thickness of the insulating element 4 can be adjusted according to design requirements to achieve the most suitable capacitor in terms of cost, ease of assembly, and volume.

[0021] Specifically, in some embodiments, the insulating element 4 protrudes along the thickness direction of the pin 3 to form a flange 43 around the pin 3. The height of the flange 43 is not less than the thickness of the pin 3. In this way, the pin 3 is isolated from other external areas to increase the creepage distance. The flange 43 can more stably control the relative position of the insulating element 4 and the pin 3 and maintain its stability in use.

[0022] By making the cross-sectional shape of the flange 43 elliptical or rectangular, it is easy to manufacture and effectively increases the creepage distance, thereby improving the insulation of pin 3 relative to the external conductor.

[0023] In some embodiments, one end of the insulating element 4 extends into the potting compound and faces the core 2, forming a partition element 44 that abuts against the core 2. The partition element 44 can ensure that the insulating element 4 does not get too close to the core 2 during potting compound filling, causing a local area of ​​the core 2 to be without potting compound flow, thus avoiding a reduction in yield.

[0024] Optionally, the insulating element 4 is made of materials such as PC, PPS or PA6T, which facilitates molding and cost control while ensuring electrical performance.

[0025] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0026] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0027] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0028] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A capacitor, characterized in that, include: The outer shell contains a core, which is fixed in place by potting compound. The core has pins that extend out of the potting compound and connect to external circuitry; The pin has a flat structure; a positioning hole is formed along the thickness direction of the pin; an insulating element is provided on the outer side of the pin; the inner side of the insulating element has a positioning post that can be inserted into the positioning hole; the two sides of the insulating element are provided with buckles that bypass the two sides of the pin and abut against the inner side of the pin, so as to restrict the movement of the insulating element relative to the thickness direction of the pin.

2. A capacitor as described in claim 1, characterized in that: The insulating element protrudes along the thickness direction of the pin, forming a flange around the pin, and the flange height is not less than the pin thickness.

3. A capacitor as described in claim 2, characterized in that: The cross-sectional shape of the flange is elliptical or rectangular.

4. A capacitor as described in claim 1, characterized in that: One end of the insulating element extends into the potting compound, facing the core, and protrudes to form a separating element that abuts against the core.

5. A capacitor as described in claim 1, characterized in that: The insulating element is made of materials such as PC, PPS or PA6T.

Images