A metal-clad laminate and a circuit board

By optimizing the microstructure of the conductive layer and bonding layer, and controlling the grain size ratio and Ni/Cr ratio, the side etching problem of ultra-thin flexible copper clad laminates during the etching process was solved, improving the bonding strength and etching accuracy of the circuit, and adapting to the fabrication needs of fine circuits on ultra-thin copper foil.

CN122138322APending Publication Date: 2026-06-02GUANGZHOU FANGBANG ELECTRONICS +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGZHOU FANGBANG ELECTRONICS
Filing Date
2026-04-10
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing ultra-thin flexible copper clad laminates suffer from lateral etching during circuit fabrication, resulting in insufficient bonding strength and easy detachment and breakage of the circuits. This affects the edge roughness and line width consistency of the circuits, thus restricting the yield of mass production of fine circuits.

Method used

A stacked structure of conductive layer, bonding layer and substrate layer is adopted. The average grain size ratio of conductive layer to bonding layer is controlled to be ≥5:1, the average grain size of bonding layer is ≥100nm, and the mass ratio of Ni to Cr is adjusted to be ≥1.2:1. The microstructure of bonding layer is optimized to improve interlayer bonding and etching accuracy.

Benefits of technology

It significantly reduces the side etching phenomenon of flexible metal-clad laminates during the etching process, improves the dimensional accuracy of the circuit, impedance control accuracy, high-frequency signal transmission performance, dynamic bending fatigue life and fine circuit process yield, and ensures the bonding strength and etching accuracy of the circuit.

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Abstract

This invention relates to a metal-clad laminate and a circuit board, specifically to the field of electronic materials technology. The metal-clad laminate comprises a conductive layer, a bonding layer, and a substrate layer stacked sequentially. The conductive layer is connected to the substrate layer via the bonding layer. The ratio of the average grain size of the conductive layer to the average grain size of the bonding layer is ≥5:1, the average grain size of the bonding layer is ≥100 nm, and the bonding layer comprises Ni and Cr elements, with a Ni to Cr mass ratio ≥1.2:1. The metal-clad laminate provided by this invention significantly reduces lateral etching during the etching process of flexible metal-clad laminates by optimizing the microstructure of the conductive layer and the bonding layer, and by combining a specific bonding layer, thereby improving the performance of the flexible metal-clad laminate.
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