Circuit board structure, manufacturing method, mainboard and electronic device

Abstract

This application discloses a circuit board structure, manufacturing method, motherboard, and electronic device, relating to the field of circuit board technology. The circuit board structure includes a circuit board and a frame board assembly disposed on the circuit board. The circuit board is used to mount electronic components. The frame board assembly is disposed on the circuit board and has notches reserved for the electronic components in a direction parallel to the circuit board. The frame board assembly is used to connect the circuit board to other electronic devices. Based on the solution of this application, the frame board can form a non-closed loop, thereby reducing the area occupied by the frame board and enhancing heat dissipation. Simultaneously, different frame boards can be staggered, effectively improving the space utilization of the circuit board.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, specifically to a circuit board structure, manufacturing method, motherboard, and electronic device. Background Technology

[0002] With the continuous development of society, electronic devices have become an indispensable part of people's daily lives, such as mobile phones, tablets, and computers. Electronic devices generally include a battery, motherboard, screen assembly, and casing. The motherboard comprises multiple circuit boards and numerous electronic components mounted on them. These electronic components are used to perform various functions, such as communication, Bluetooth, and charging.

[0003] Multiple circuit boards are typically stacked using a frame board method to arrange multiple electronic components. Existing frame boards generally use printed circuit boards to form a closed loop, resulting in a large frame board area and poor heat dissipation. At the same time, different frame boards cannot be interleaved, leading to low space utilization.

[0004] Therefore, optimizing the structure of the frame plate has become an urgent problem to be solved. Summary of the Invention

[0005] This application provides a circuit board structure, manufacturing method, motherboard, and electronic device. By reserving notches parallel to the circuit board for electronic components in a frame board assembly, the frame board forms a non-closed loop, reducing its footprint and enhancing heat dissipation. Furthermore, different frame boards can be staggered, effectively improving the space utilization of the circuit board.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] In a first aspect, a circuit board structure is provided, including a circuit board and a frame board assembly disposed on the circuit board. The circuit board is used to mount electronic components. The frame board assembly is disposed on the circuit board and has notches provided for the electronic components in a direction parallel to the circuit board; the frame board assembly is used to connect the circuit board to other electronic devices.

[0008] Alternatively, other electronic devices may be other circuit boards or other electronic components.

[0009] In this embodiment, because the frame board assembly has a notch parallel to the circuit board for the electronic components, it does not completely surround the electronic components, thus providing space for heat dissipation and enhancing the heat dissipation effect. At the same time, the fact that the frame board assembly does not completely surround the electronic components reduces the area occupied by the frame board on the circuit board. Different frame board assemblies can also be staggered, effectively improving the space utilization of the circuit board.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, the circuit board and the frame board assembly are integrally formed.

[0011] In this embodiment, the circuit board and the frame board assembly are integrally formed, which can reduce the unreliability of the connection process between the circuit board and the frame board assembly, such as different solder joint heights, and reduce the number of connection and assembly steps between the circuit board and the frame board assembly, thereby reducing the risk of warping and deformation.

[0012] In conjunction with the first aspect, in some implementations of the first aspect, the circuit board includes a first side and a second side disposed opposite to each other, and the frame board assembly is disposed on the first side or the second side of the circuit board.

[0013] In this embodiment of the application, the frame board assembly can be disposed on the first side or the second side of the circuit board, such as the upper surface or the lower surface of the circuit board, as needed, so that the first side or the second side of the circuit board can be connected to other electronic devices through the frame board assembly.

[0014] In conjunction with the first aspect, in some implementations of the first aspect, the circuit board includes a first side and a second side disposed opposite to each other, and a frame board assembly is disposed on the first side and the second side of the circuit board.

[0015] In this implementation, the frame board assembly can be disposed on the first side and the second side of the circuit board, such as the upper or lower surface of the circuit board, so that the first side and the second side of the circuit board are respectively connected to other electronic devices through the frame board assembly.

[0016] In conjunction with the first aspect, some implementations of the first aspect also include reinforcing components; the reinforcing components are disposed on the circuit board to enhance the support of the frame board assembly.

[0017] In this implementation, reinforcement components are added to enhance the support of the frame board assembly for other electronic components.

[0018] In conjunction with the first aspect, in some implementations of the first aspect, the frame board assembly includes multi-layer frame components that are staggered on the circuit board.

[0019] In this implementation, the space utilization of the circuit board can be improved by interleaving multi-layer frame components.

[0020] In conjunction with the first aspect, in some implementations of the first aspect, the frame plate assembly includes two parallel frame components.

[0021] In this embodiment, the frame board assembly includes two parallel frame components that surround one side of the electronic component, thereby leaving gaps on the other two sides of the electronic component to facilitate heat dissipation. It can also be staggered with other frame board assemblies to effectively improve the space utilization of the circuit board.

[0022] In conjunction with the first aspect, in some implementations of the first aspect, the frame plate assembly includes four parallel frame components.

[0023] It should be understood that the length of each of the four parallel frame components can be less than the length and width of the circuit board.

[0024] In this implementation, the frame board assembly includes four parallel frame components that surround the electronic components. This allows for the reservation of gaps at the unconnected positions of the four parallel frame components, facilitating heat dissipation for the electronic components. Additionally, it can be staggered with other frame board assemblies, effectively improving the space utilization of the circuit board.

[0025] In conjunction with the first aspect, in some implementations of the first aspect, the frame board assembly includes four frame components, which are respectively disposed at the four corners of the circuit board.

[0026] In this implementation, four frame components are respectively set at the four corners of the circuit board, and the electronic components are placed in the middle. This allows for the reservation of space in the areas not set by the four frame components, which facilitates heat dissipation of the electronic components. At the same time, it can also be staggered with other frame board components, which effectively improves the space utilization of the circuit board.

[0027] In conjunction with the first aspect, in some implementations of the first aspect, the frame plate assembly includes one or more of the following: a T-shaped frame component, an X-shaped frame component, an I-shaped frame component, a π-shaped frame component, a U-shaped frame component, a notched asymmetrical frame component, and a notched U-shaped frame component.

[0028] In this implementation, the frame board assembly can be designed in various forms according to actual needs. It only needs to provide a notch parallel to the circuit board for electronic components, which facilitates heat dissipation of electronic components. At the same time, it can be staggered with other frame board assemblies to effectively improve the space utilization of the circuit board.

[0029] In conjunction with the first aspect, in some implementations of the first aspect, the frame board assembly further includes a partial frame component disposed on the circuit board.

[0030] In this implementation, the frame board assembly can also be equipped with local frame components as needed to enhance the connection between the circuit board and other electronic devices.

[0031] Secondly, a method for manufacturing a circuit board structure is provided, comprising: setting a layered dielectric on the surface of the circuit board; setting an adhesive layer on the dielectric; setting a frame board on the adhesive layer, and making holes at predetermined positions on the frame board; the predetermined positions on the frame board are used to reserve notches parallel to the circuit board for electronic components; and cleaning the areas of the frame board without holes.

[0032] In this embodiment, a layered medium is provided on the surface of the circuit board, facilitating the later removal of excess frame boards. An adhesive layer is provided on the layered medium to facilitate the bonding of the frame boards. The frame boards are placed on the adhesive layer, and holes are made in the frame boards at predetermined positions, allowing the frame boards to connect the circuit board to other electronic components at these predetermined positions. Cleaning the unopened areas of the frame boards removes unused frame boards, facilitating heat dissipation for electronic components. Furthermore, staggered designs with other frame board components can effectively improve the space utilization of the circuit board.

[0033] In conjunction with the second aspect, in some implementations of the second aspect, a frame plate is provided in the adhesive layer and holes are opened at preset positions in the frame plate, including: using a high-density interconnection method to provide a multi-layer frame plate in the adhesive layer, and opening multi-layer through holes at preset positions in the multi-layer frame plate and penetrating through the multi-layer through holes.

[0034] In this embodiment, the frame board can be manufactured using a high-density interconnection method, thereby allowing through holes to be opened at preset positions on the multi-layer frame board and passing through multiple through holes, which facilitates the connection of the multi-layer frame board to circuit boards and other electronic devices through the multi-layer through holes.

[0035] In conjunction with the second aspect, in some implementations of the second aspect, opening a hole at a preset position on the frame plate includes: opening a through hole at a preset position on the frame plate.

[0036] In this embodiment, through holes are opened at preset positions on the frame plate, so that the frame plate can be connected to circuit boards and other electronic devices through the through holes.

[0037] In conjunction with the second aspect, in some implementations of the second aspect, a frame plate is provided in the adhesive layer, including: providing multiple frame plates in the adhesive layer, wherein the multiple frame plates are stacked and connected to each other by conductive adhesive.

[0038] In this embodiment of the application, when a multi-layer frame plate is required, the multi-layer frame plate can be bonded with a conductive adhesive to achieve the required frame plate thickness.

[0039] Optionally, the conductive adhesive may include one or more of conductive glue and conductive paste.

[0040] Optionally, the layering medium includes one or more of layering inks and layering resins.

[0041] Optionally, the adhesive layer includes a prepreg.

[0042] In conjunction with the second aspect, some implementations of the second aspect also include: removing residual adhesive from the unperforated areas of the frame plate.

[0043] In this embodiment of the application, removing residual adhesive from the unperforated areas of the frame board can reduce the impact of residual adhesive on the remaining frame board and electronic components.

[0044] Thirdly, a motherboard is provided, including a circuit board structure and electronic components, with the electronic components disposed on the circuit board structure.

[0045] In this embodiment, electronic components are disposed on a circuit board structure, and the circuit board structure has a notch for the electronic components to facilitate heat dissipation.

[0046] Fourthly, an electronic device is provided, including a motherboard, a battery, a screen assembly, and a housing, wherein the motherboard, battery, and screen assembly are all disposed within the housing. Attached Figure Description

[0047] Figure 1 This is a schematic diagram of a scenario for a mobile communication system to which this application embodiment applies;

[0048] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0049] Figure 3 This is a schematic diagram of the structure of a frame plate provided in an embodiment of this application;

[0050] Figure 4 This is a top view schematic diagram of a circuit board structure provided in an embodiment of this application;

[0051] Figure 5 This is a cross-sectional schematic diagram of a circuit board structure provided in an embodiment of this application;

[0052] Figure 6 This is a cross-sectional schematic diagram of another embodiment of the circuit board structure provided in this application;

[0053] Figure 7 This is a cross-sectional schematic diagram of another embodiment of the circuit board structure provided in this application;

[0054] Figure 8 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0055] Figure 9 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0056] Figure 10A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0057] Figure 11 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0058] Figure 12 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0059] Figure 13 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0060] Figure 14 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0061] Figure 15 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0062] Figure 16 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0063] Figure 17 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0064] Figure 18 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0065] Figure 19 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0066] Figure 20 This is a cross-sectional view of a circuit board structure provided in yet another embodiment of this application;

[0067] Figure 21 A top view schematic diagram of another circuit board structure provided in this application embodiment;

[0068] Figure 22 A cross-sectional view of a motherboard provided in an embodiment of this application;

[0069] Figure 23 This is a schematic diagram of the structure of a candybar phone provided in an embodiment of this application;

[0070] Figure 24 This is a schematic diagram of the structure of a double-folding machine provided in an embodiment of this application;

[0071] Figure 25 This is a schematic diagram of the structure of a three-stage stacker provided in an embodiment of this application;

[0072] Figure 26 This is a schematic diagram of the structure of a triplex machine provided in another embodiment of this application;

[0073] Figure 27 This is a schematic diagram of the structure of a four-layer stacker provided in an embodiment of this application;

[0074] Figure 28 A flowchart illustrating a method for manufacturing a circuit board structure according to an embodiment of this application;

[0075] Figure 29 A flowchart illustrating a method for manufacturing a circuit board structure according to another embodiment of this application;

[0076] Figure 30 This is a schematic diagram of a method for manufacturing a circuit board structure according to an embodiment of this application;

[0077] Figure 31 A flowchart illustrating a method for manufacturing a circuit board structure according to another embodiment of this application;

[0078] Figure 32 This is a schematic diagram illustrating a method for manufacturing a circuit board structure according to another embodiment of this application;

[0079] Figure 33 A flowchart illustrating a method for manufacturing a circuit board structure according to another embodiment of this application;

[0080] Figure 34 This is a schematic diagram illustrating a method for manufacturing a circuit board structure according to another embodiment of this application. Detailed Implementation

[0081] The technical solutions in the embodiments of this application will be clearly and thoroughly described below with reference to the accompanying drawings. In the description of the embodiments of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B; the word "and / or" in the text is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.

[0082] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0083] To facilitate understanding of the embodiments of this application, the relevant concepts involved in the embodiments of this application will be briefly explained first.

[0084] 1. Printed circuit board (PCB).

[0085] In the field of circuitry, a printed circuit board (PCB) is a support structure for electronic components. It also serves as the carrier for electrical connections between electronic components. Because PCBs are generally manufactured using electronic printing techniques, they are called printed circuit boards.

[0086] 2. Application processor (AP) board.

[0087] In the field of circuitry, an application processor board (AP) is a type of processor board commonly found in mobile and network communication devices. It is primarily responsible for running the operating system, user interface, and applications. In mobile terminals, the AP board is analogous to the central processing unit (CPU) of a traditional computer, managing all hardware resources and supporting application expansion.

[0088] 3. Radio frequency (RF) board.

[0089] In the field of circuitry, an RF board is a circuit board specifically designed for processing radio frequency (RF) signals. RF boards have wide applications in wireless communication, radar systems, satellite communication, and other fields. The main function of an RF board is to transmit and receive signals; it can convert low-frequency signals into high-frequency RF signals for transmission, and it can also receive external RF signals and convert them back into low-frequency signals for processing.

[0090] 4. Frame board (FB).

[0091] A frame board is a support structure for electronic components or circuit boards, mainly used to provide a carrier or space for electronic components.

[0092] The above is a brief introduction to the terms used in the embodiments of this application, and will not be repeated below.

[0093] Before providing a detailed explanation of the circuit board structure provided in the embodiments of this application, the application scenarios and related technologies of the electronic device will be described first.

[0094] Figure 1 This is a schematic diagram of a scenario for a mobile communication system to which an embodiment of this application applies. For example... Figure 1As shown, users can communicate with base station 20 using electronic device 10. This application does not specifically limit the type of electronic device 10. In some embodiments, electronic device 10 can be a mobile phone, wearable device (e.g., smart bracelet, smartwatch, earphones, etc.), tablet computer, laptop computer, handheld computer, ultra-mobile personal computer (UMPC), cellular phone, personal digital assistant (PDA), augmented reality (AR) / virtual reality (VR) device, or other IoT (Internet of Things) devices. It can also be a television, large screen, printer, projector, etc. For ease of understanding, the following embodiments use a mobile phone as an example for illustrative purposes.

[0095] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 2 As shown in the embodiments of this application, the electronic device 10 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, a first antenna 1, a second antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a headphone jack 170D, a sensor module 180, buttons 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an accelerometer sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0096] It should be noted that, Figure 2 The structure shown does not constitute a specific limitation on the electronic device. In other embodiments of this application, the electronic device may include a... Figure 2 The components shown may include more or fewer components, or the electronic device may include... Figure 2The components shown may be a combination of certain components, or the electronic device may include... Figure 2 Sub-components of some of the components shown. Figure 2 The components shown can be implemented in hardware, software, or a combination of both.

[0097] Processor 110 may include one or more processing units. For example, processor 110 may include at least one of the following processing units: application processor (AP), modem processor, graphics processing unit (GPU), image signal processor (ISP), controller, video codec, digital signal processor (DSP), baseband processor, and neural network processing unit (NPU). These different processing units may be independent devices or integrated devices. The controller can generate operation control signals based on instruction opcodes and timing signals to control instruction fetching and execution.

[0098] The processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can store instructions or data that the processor 110 has just used or that are used repeatedly. If the processor 110 needs to use the instruction or data again, it can retrieve it directly from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0099] In some embodiments, processor 110 may include one or more interfaces. For example, processor 110 may include at least one of the following interfaces: an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a SIM interface, and a USB interface.

[0100] USB interface pin 130 is used to connect with other devices, thereby enabling electronic device 10 to communicate with the outside world or perform charging functions. For example, it supports various charging protocols, On-the-Go (OTG) USB functionality, analog headset functionality, digital headset functionality, and DisplayPort (DP) projection functionality, etc. For instance, USB interface pin 130 can be a Type-C interface.

[0101] Figure 2 The connection relationships between the modules shown are merely illustrative and do not constitute a limitation on the connection relationships between the modules of the electronic device 10. Optionally, the modules of the electronic device 10 may also adopt a combination of various connection methods described in the above embodiments.

[0102] The charging management module 140 receives power from the charger. While charging the battery 142, the charging management module 140 can also power electronic devices via the power management module 141. The power management module 141 connects the battery 142, the charging management module 140, and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, and powers the processor 110, internal memory 121, display screen 194, camera 193, and wireless communication module 160, etc. The power management module 141 can also monitor parameters such as battery capacity, battery cycle count, and battery health status (e.g., leakage current, impedance). Optionally, the power management module 141 can be located within the processor 110, or the power management module 141 and the charging management module 140 can be located in the same device.

[0103] The wireless communication function of electronic device 10 can be implemented through devices such as a first antenna 1, a second antenna 2, a mobile communication module 150, a wireless communication module 160, a modem processor, and a baseband processor. The first antenna 1 and the second antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 10 can be used to cover one or more communication frequency bands. Different antennas can also be reused to improve antenna utilization.

[0104] The mobile communication module 150 can provide a wireless communication solution for use in electronic devices, such as at least one of the following: a second-generation (2G) mobile communication solution, a third-generation (3G) mobile communication solution, a fourth-generation (5G) mobile communication solution, or a fifth-generation (5G) mobile communication solution.

[0105] The modem processor may include a modulator and a demodulator. The modulator modulates a low-frequency baseband signal to be transmitted into a mid-to-high frequency signal. The demodulator demodulates a received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After processing by the baseband processor, the low-frequency baseband signal is transmitted to the application processor. The application processor outputs sound signals through audio devices (e.g., speaker 170A, receiver 170B) or displays images or videos through the display screen 194. In some embodiments, the modem processor may be a separate device. In other embodiments, the modem processor may be independent of the processor 110 and may be housed in the same device as the mobile communication module 150 or other functional modules.

[0106] Similar to the mobile communication module 150, the wireless communication module 160 can also provide wireless communication solutions for use in electronic devices, such as at least one of the following: wireless local area networks (WLAN), Bluetooth (BT), Bluetooth Low Energy (BLE), ultra-wideband (UWB), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technology.

[0107] In some embodiments, the antenna 1 of the electronic device is coupled to the mobile communication module 150, and the antenna 2 of the electronic device is coupled to the wireless communication module 160, enabling the electronic device to communicate with the network and other electronic devices via wireless communication technology.

[0108] Electronic device 10 can implement display functions through a GPU, a display screen 194, and an application processor. The GPU is a microprocessor for image processing, connected to the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations and for graphics rendering. Processor 110 may include one or more GPUs, which execute program instructions to generate or modify display information.

[0109] In some embodiments, the first antenna 1 of the electronic device is coupled to the mobile communication module 150, and the second antenna 2 of the electronic device is coupled to the wireless communication module 160, enabling the electronic device to communicate with the network and other electronic devices via wireless communication technology.

[0110] The external storage interface 120 can be used to connect an external memory card, such as a secure digital (SD) card, to expand the storage capacity of the electronic device. The external memory card communicates with the processor 110 through the external storage interface 120 to perform data storage functions. For example, music, video, and other files can be saved on the external memory card.

[0111] Internal memory 121 can be used to store executable program code, including instructions. Internal memory 121 may include a program storage area and a data storage area. Internal memory 121 may be volatile memory or non-volatile memory, or both. Non-volatile memory may be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory may be random access memory (RAM), which serves as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous linked dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM).

[0112] The display screen 194 can be used to display images or videos. Optionally, the display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a mini light-emitting diode (Mini LED), a micro light-emitting diode (Micro LED), a micro OLED, or a quantum dot light-emitting diode (QLED). In some embodiments, the electronic device 10 may include one or N displays 194, where N is a positive integer greater than 1.

[0113] In some embodiments, pressure sensor 180A may be disposed on display screen 194. Pressure sensor 180A can be of many types, such as resistive pressure sensor, inductive pressure sensor, or capacitive pressure sensor. A capacitive pressure sensor may include at least two parallel plates with conductive material. When force is applied to pressure sensor 180A, the capacitance between the electrodes changes, and the electronic device determines the pressure intensity based on the change in capacitance. When a touch operation is applied to display screen 194, the electronic device detects the touch operation based on pressure sensor 180A. The electronic device may also calculate the touch position based on the detection signal from pressure sensor 180A. In some embodiments, touch operations applied to the same touch position but with different touch operation intensities may correspond to different operation commands. For example, when a touch operation with an intensity less than a first pressure threshold is applied to the SMS application icon, a command to view an SMS message is executed; when a touch operation with an intensity greater than or equal to the first pressure threshold is applied to the SMS application icon, a command to create a new SMS message is executed.

[0114] The fingerprint sensor 180H is used to collect fingerprints. Electronic devices can use the collected fingerprint characteristics to unlock devices, access app locks, take photos, and answer calls.

[0115] Touch sensor 180K, also known as a touch device, can be disposed on display screen 194. The touch sensor 180K and display screen 194 together form a touchscreen, also known as a touch screen. Touch sensor 180K is used to detect touch operations applied to or near it. Touch sensor 180K can transmit the detected touch operation to the application processor to determine the type of touch event. Visual output related to the touch operation can be provided through display screen 194. In other embodiments, touch sensor 180K may also be disposed on the surface of the electronic device and in a different location from display screen 194.

[0116] Button 190 includes a power button and volume buttons. Button 190 can be a mechanical button or a touch button. The electronic device can receive button input signals and realize functions related to the button input signals.

[0117] For example, an electronic device typically includes a battery, a motherboard, a screen assembly, and a casing. The motherboard includes multiple circuit boards, a frame board, and multiple electronic components mounted on the circuit boards. The multiple circuit boards are typically arranged with the electronic components stacked using the frame board. Furthermore, the multiple electronic components are used to perform various functions, such as communication, Bluetooth, charging, etc.

[0118] The following section explains the structure of traditional frame panels and the problems associated with using a closed-loop structure in traditional frame panels.

[0119] Figure 3 This is a schematic diagram of the structure of a frame plate provided in an embodiment of this application. Figure 3 As shown in (a) above, exemplarily, the motherboard may include an AP board 30, a frame board 40, and a PMIC 301. Both the frame board 40 and the PMIC 301 are disposed on the AP board 30, and the PMIC 301 can be soldered to the AP board using solder balls. The closed loop board of the frame board 40 has multiple through holes and pads for connecting the AP board 30 to other electronic components or circuit boards. It should be noted that, from a top view, the existing frame board 40 is generally a closed loop board, surrounding the PMIC 301 in the central area, which makes it difficult for the PMIC 301 to dissipate heat outwards, and the frame board 30 cannot be staggered with other frame boards, resulting in low space utilization of the AP board 30.

[0120] like Figure 3As shown in (b), the motherboard may include an AP board 30, a frame board 40, a PMIC 301, and an RF board 50. The frame board 40 is positioned between the AP board 30 and the RF board 50. The frame board 40 has multiple through-holes, through which the AP board 30 and the RF board 50 can be connected via solderable components within the through-holes and solder joints at both ends of the through-holes. However, because the frame board 40 is a closed-loop board, it occupies a large area, has low space utilization, and poor heat dissipation. Furthermore, different frame boards cannot be interleaved in design.

[0121] In view of this, embodiments of this application provide a circuit board structure in which a notch parallel to the circuit board is reserved for electronic components in the frame board assembly, thereby forming a non-closed loop in the frame board, reducing the area occupied by the frame board and enhancing the heat dissipation effect. At the same time, different frame boards can be staggered, effectively improving the space utilization of the circuit board.

[0122] The following is combined Figures 4 to 21 This paper provides a detailed introduction to the solution of reserving a notch in the frame board assembly for electronic components in a direction parallel to the circuit board.

[0123] Figure 4 This is a top view schematic diagram of a circuit board structure provided in an embodiment of this application. Figure 4 As shown, exemplarily, in one embodiment provided in this application, the circuit board structure 60 includes a circuit board 601, a frame board assembly 602 disposed on the circuit board 601, electronic components 603, and other electronic devices 604. The circuit board 601 is used to house the electronic components 603. The frame board assembly 602 is disposed on the circuit board 601 and has a notch reserved for the electronic components 603 in a direction parallel to the circuit board 601. The frame board assembly 602 is used to connect the circuit board 601 with other electronic devices 604.

[0124] In this embodiment, because the frame board assembly 602 has a notch parallel to the circuit board 601 for the electronic component 603, the frame board assembly 602 does not completely surround the electronic component 603, thus reserving heat dissipation space for the electronic component 603 and enhancing the heat dissipation effect. Simultaneously, because the frame board assembly 602 does not completely surround the electronic component 603, the area occupied by the frame board assembly 602 on the circuit board 601 will be reduced. Furthermore, because the frame board assembly 602 has a notch, different frame board assemblies 602 can be staggered, thereby further improving the space utilization rate of the circuit board 601.

[0125] Optionally, other electronic devices 604 can be other circuit boards or other electronic components. That is, one side (e.g., the bottom surface) of the frame board assembly 602 can be disposed on the circuit board 601, and the other side (e.g., the top surface) of the frame board assembly 602 can be connected to other circuit boards or electronic components, thereby allowing the circuit board 601 to be connected to other circuit boards or electronic components through the frame board assembly 602.

[0126] It should be understood that electronic components can be systems on chips (SOC), processors (CPU), radio frequency integrated circuits (RFIC), power management integrated circuits (PMIC), low power integrated modules for advanced devices (LPIMAD), etc.

[0127] It should be noted that, in another embodiment, the circuit board 601 and the frame board assembly 602 are integrally formed, which can effectively reduce the unreliability of the connection process between the circuit board 601 and the frame board assembly 602. For example, if the solder joint heights of the frame board assembly 602 soldered on the circuit board 601 are different, it will affect the levelness of the frame board assembly 602 relative to the circuit board 601, and further affect the connection effect of the electronic components disposed on the circuit board 601 or the frame board assembly 602. At the same time, the integral forming of the circuit board 601 and the frame board assembly 602 can also reduce the number of times the circuit board and the frame board assembly are connected and assembled, and reduce the risk of warping and deformation.

[0128] The following section provides a detailed introduction to several top and bottom structures of circuit boards.

[0129] Figure 5 This is a cross-sectional schematic diagram of a circuit board structure provided in an embodiment of this application. Figure 5 As shown, in one embodiment provided in this application, the circuit board structure 60 includes a circuit board 601, a frame board assembly 602 disposed on the circuit board 601, electronic components 603, and other electronic devices 604. The circuit board 601 is used to house the electronic components 603. The frame board assembly 602 is disposed on the circuit board 601 and has a notch reserved for the electronic components 603 in a direction parallel to the circuit board 601. The frame board assembly 602 is used to connect the circuit board 601 with other electronic devices 604. Optionally, the other electronic devices 604 can be other circuit boards or other electronic components.

[0130] In this embodiment, because the frame board assembly 602 has a notch parallel to the circuit board 601 for the electronic component 603, the frame board assembly 602 does not completely surround the electronic component 603, thus reserving heat dissipation space for the electronic component 603 and enhancing the heat dissipation effect. Simultaneously, because the frame board assembly 602 does not completely surround the electronic component 603, the area occupied by the frame board assembly 602 on the circuit board 601 will be reduced. Furthermore, because the frame board assembly 602 has a notch, different frame board assemblies 602 can be staggered, thereby further improving the space utilization rate of the circuit board 601.

[0131] It should be noted that, in this embodiment, the circuit board 601 includes a first side and a second side disposed opposite to each other. For example, the first side and the second side can be the bottom surface and the top surface when the circuit board 601 is in a horizontally placed state. For example, as shown... Figure 5 As shown in (a), the frame board assembly 602 can be disposed on a first side of the circuit board 601. For example, the frame board assembly 602 can be disposed on the upper surface / top surface of the circuit board 601. It should be understood that in this implementation, the other side of the frame board assembly 602 can also be connected to other electronic devices 604, such as other circuit boards or other electronic components, via solder joints.

[0132] like Figure 5 As shown in (b), the frame board assembly 602 can be disposed on the second side of the circuit board 601. For example, the frame board assembly 602 can be disposed on the lower surface / bottom surface of the circuit board 601. It should be understood that in this implementation, the other side of the frame board assembly 602 can also be connected to other electronic devices 604, such as other circuit boards or other electronic components, via solder joints.

[0133] Figure 6 This is a cross-sectional schematic diagram of another embodiment of the circuit board structure provided in this application. Figure 6 As shown, in one embodiment provided in this application, the circuit board structure 60 includes a circuit board 601, a frame board assembly 602 disposed on the circuit board 601, electronic components 603, and other electronic devices 604. The circuit board 601 is used to house the electronic components 603. The frame board assembly 602 is disposed on the circuit board 601 and has a notch reserved for the electronic components 603 in a direction parallel to the circuit board 601. The frame board assembly 602 is used to connect the circuit board 601 with other electronic devices 604. Optionally, the other electronic devices 604 can be other circuit boards or other electronic components.

[0134] In this embodiment, because the frame board assembly 602 has a notch parallel to the circuit board 601 for the electronic component 603, the frame board assembly 602 does not completely surround the electronic component 603, thus reserving heat dissipation space for the electronic component 603 and enhancing the heat dissipation effect. Simultaneously, because the frame board assembly 602 does not completely surround the electronic component 603, the area occupied by the frame board assembly 602 on the circuit board 601 will be reduced. Furthermore, because the frame board assembly 602 has a notch, different frame board assemblies 602 can be staggered, thereby further improving the space utilization rate of the circuit board 601.

[0135] It should be noted that, in this embodiment, the circuit board 601 includes a first side and a second side disposed opposite to each other. For example, the first side and the second side can be the bottom surface (i.e., the lower surface) and the top surface (i.e., the upper surface) of the circuit board 601 when it is in a horizontal position. The frame board assembly 602 is disposed on the first side and the second side of the circuit board 601. It should be understood that, in this implementation, both the first side and the second side of the circuit board 601 are connected to other electronic devices 604 through the frame board assembly 602.

[0136] Figure 7 This is a cross-sectional schematic diagram of another embodiment of the circuit board structure provided in this application. Figure 7 As shown, in one implementation of this application embodiment, the circuit board structure 60 includes a circuit board 601, a frame board assembly 602 disposed on the circuit board 601, electronic components 603, other electronic devices 604, and a reinforcing assembly 605. The circuit board 601 is used to house the electronic components 603. The frame board assembly 602 is disposed on the circuit board 601 and has a notch reserved for the electronic components 603 in a direction parallel to the circuit board 601. The frame board assembly 602 is used to connect the circuit board 601 with other electronic devices 604. Optionally, the other electronic devices 604 can be other circuit boards or other electronic components. The reinforcing assembly 605 is disposed on the circuit board 601 and is used to strengthen the supporting force of the frame board assembly 602.

[0137] In this embodiment, because the frame board assembly 602 has a notch parallel to the circuit board 601 for the electronic component 603, the frame board assembly 602 does not completely surround the electronic component 603, thus reserving heat dissipation space for the electronic component 603 and enhancing the heat dissipation effect. Simultaneously, because the frame board assembly 602 does not completely surround the electronic component 603, the area occupied by the frame board assembly 602 on the circuit board 601 will be reduced. Furthermore, because the frame board assembly 602 has a notch, different frame board assemblies 602 can be staggered, thereby further improving the space utilization rate of the circuit board 601.

[0138] It should be noted that, in this embodiment, when the frame plate assembly 602 is high in height or long in length, because the frame plate assembly 602 has a pre-reserved notch and is not a closed structure, the supporting force and tension of the frame plate assembly 602 will be reduced. Therefore, a reinforcing assembly 605 is needed to strengthen the lateral supporting force and longitudinal tension of the frame plate assembly.

[0139] Exemplarily, in one embodiment of this application, the frame plate assembly 602 consists of two parallel frame components. For example... Figure 7 As shown in (a), the reinforcing component 605 is disposed between the two frame members and in contact with them, thereby increasing the support force on the sides of the two frame members. Figure 7 As shown in (b), the reinforcing assembly 605 includes a first reinforcing unit 6051 and a second reinforcing unit 6052. The first reinforcing unit 6051 is disposed between and in contact with the two frame members, thereby increasing the support force on the sides of the two frame members. The second reinforcing unit 6052 is disposed between the first reinforcing unit 6051 and in contact with one of the frame members, thereby further increasing the support force on the side of that frame member. Figure 7 As shown in (c), the reinforcing assembly 605 includes a third reinforcing unit 6053 and a fourth reinforcing unit 6054. The third reinforcing unit 6053 is disposed between and in contact with the two frame components, thereby increasing the support force on the sides of the two frame components. One side of the fourth reinforcing unit 6054 is disposed on the third reinforcing unit 6053. The other side of the fourth reinforcing unit 6054 can be connected to other electronic devices 604, thereby providing support for other electronic devices 604 through the height of the third and fourth reinforcing units 6053 and 6054. It should be understood that, depending on actual needs, multiple reinforcing units can be provided along the direction supporting other electronic devices 604. Figure 7 As shown in (d), the reinforcing component 605 can be disposed between the two frame components and has the same height as the two frame components. One side of the reinforcing component 605 is disposed on the circuit board 601, and the other side is connected to other electronic devices 604, thereby increasing the support force on the other electronic devices 604 through the reinforcing component 605.

[0140] It should be understood that in this embodiment, the reinforcing component 605 can be a non-through-frame plate assembly 602. That is, the reinforcing component 605 can be provided in a portion of the notch area of ​​the frame plate assembly 602 as needed. Alternatively, through holes can also be provided in the reinforcing component 605 to connect the circuit board 601 and other electronic devices 604. Exemplarily, the reinforcing component 605 can be a reinforcing rib.

[0141] Figure 8 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 8 As shown, in one embodiment provided in this application, the circuit board structure 60 includes a circuit board 601, a frame board assembly 602 disposed on the circuit board 601, electronic components 603, and other electronic devices 604. The circuit board 601 is used to house the electronic components 603. The frame board assembly 602 is disposed on the circuit board 601 and has a notch reserved for the electronic components 603 in a direction parallel to the circuit board 601. The frame board assembly 602 is used to connect the circuit board 601 with other electronic devices 604. Optionally, the other electronic devices 604 can be other circuit boards or other electronic components.

[0142] In this embodiment, because the frame board assembly 602 has a notch parallel to the circuit board 601 for the electronic component 603, the frame board assembly 602 does not completely surround the electronic component 603, thus reserving heat dissipation space for the electronic component 603 and enhancing the heat dissipation effect. Simultaneously, because the frame board assembly 602 does not completely surround the electronic component 603, the area occupied by the frame board assembly 602 on the circuit board 601 will be reduced. Furthermore, because the frame board assembly 602 has a notch, different frame board assemblies 602 can be staggered, thereby further improving the space utilization rate of the circuit board 601.

[0143] It should be noted that, in the embodiments of this application, as Figure 8As shown in (a), the frame board assembly 602 includes multi-layer frame components. Other electronic devices include a first electronic device 6041 and a second electronic device 6042. For example, the first electronic device 6041 can be a first circuit board, and the second electronic device 6042 can be a second circuit board. Exemplarily, the frame board assembly 602 may include a first frame component 6021 and a second frame component 6022. One side of the first frame component 6021 is disposed on the circuit board 601, and the other side of the first frame component 6021 is connected to the first electronic device 6041. One side of the second frame component 6022 is disposed on the circuit board 601, and the other side of the second frame component 6022 is connected to the second electronic device 6042. The second frame component 6022 is disposed in the notch area of ​​the first frame component 6021. That is, the first frame component 6021 and the second frame component 6022 are staggered on the circuit board 601, thereby effectively improving the space utilization of the first circuit board 601.

[0144] like Figure 8 As shown in (b), the second frame component 6022 can be disposed in the notch area of ​​the first frame component 6021, so as not to affect the normal function of the first frame component 6021, and to effectively utilize the empty area of ​​the first frame component 6021, thereby improving the space utilization of the first circuit board 601.

[0145] The following section provides a detailed introduction to several top-view structures of circuit boards. First, we will discuss the circuit board structure where the frame board assembly and the circuit board are integrally formed.

[0146] Figure 9 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 9As shown, in one embodiment provided in this application, the circuit board structure 60 includes a circuit board 601, a frame board assembly 602 disposed on the circuit board 601, electronic components 603, and other electronic devices 604. The circuit board 601 is used to house the electronic components 603. The frame board assembly 602 is disposed on the circuit board 601 and has a notch parallel to the circuit board 601 reserved for the electronic components 603. The frame board assembly 602 is used to connect the circuit board 601 with other electronic devices 604. Optionally, the other electronic devices 604 can be other circuit boards or other electronic components. In this embodiment, because the frame board assembly 602 has a notch parallel to the circuit board 601 reserved for the electronic components 603, the frame board assembly 602 does not completely surround the electronic components 603, thus reserving heat dissipation space for the electronic components 603 and enhancing the heat dissipation effect. Simultaneously, because the frame board assembly 602 does not completely surround the electronic components 603, the area occupied by the frame board assembly 602 on the circuit board 601 will be reduced. In addition, because the frame board assembly 602 has a notch, different frame board assemblies 602 can be staggered, thereby further improving the space utilization of the circuit board 601.

[0147] It should be noted that, in this embodiment, the frame board assembly 602 may include two parallel frame components, thereby providing gaps for electronic components 603 disposed within the two parallel frame components to facilitate heat dissipation of the electronic components 603. Simultaneously, the gaps provided by the two parallel frame components, compared to a fully enclosed frame board structure, can reduce the area occupied by the frame board assembly 602 on the circuit board 601. Furthermore, the gaps provided by the two parallel frame components can be staggered with other frame board assemblies 602, thereby further improving the space utilization of the circuit board 601.

[0148] Figure 10 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 10As shown, in one embodiment provided in this application, the circuit board structure 60 includes a circuit board 601, a frame board assembly 602 disposed on the circuit board 601, electronic components 603, and other electronic devices 604. The circuit board 601 is used to house the electronic components 603. The frame board assembly 602 is disposed on the circuit board 601 and has a notch parallel to the circuit board 601 reserved for the electronic components 603. The frame board assembly 602 is used to connect the circuit board 601 with other electronic devices 604. Optionally, the other electronic devices 604 can be other circuit boards or other electronic components. In this embodiment, because the frame board assembly 602 has a notch parallel to the circuit board 601 reserved for the electronic components 603, the frame board assembly 602 does not completely surround the electronic components 603, thus reserving heat dissipation space for the electronic components 603 and enhancing the heat dissipation effect. Simultaneously, because the frame board assembly 602 does not completely surround the electronic components 603, the area occupied by the frame board assembly 602 on the circuit board 601 will be reduced. In addition, because the frame board assembly 602 has a notch, different frame board assemblies 602 can be staggered, thereby further improving the space utilization of the circuit board 601.

[0149] It should be noted that, in this embodiment, the frame board assembly 602 may include four parallel frame members. This provides notches for the electronic components 603 disposed within the four parallel frame members, facilitating heat dissipation. Simultaneously, the notches provided by the four parallel frame members, compared to a fully enclosed frame board structure, can reduce the area occupied by the frame board assembly 602 on the circuit board 601. Furthermore, the notches provided by the four parallel frame members can be staggered with other frame board assemblies 602, thereby further improving the space utilization of the circuit board 601.

[0150] Figure 11 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 11As shown, in one embodiment provided in this application, the circuit board structure 60 includes a circuit board 601, a frame board assembly 602 disposed on the circuit board 601, electronic components 603, and other electronic devices 604. The circuit board 601 is used to house the electronic components 603. The frame board assembly 602 is disposed on the circuit board 601 and has a notch parallel to the circuit board 601 reserved for the electronic components 603. The frame board assembly 602 is used to connect the circuit board 601 with other electronic devices 604. Optionally, the other electronic devices 604 can be other circuit boards or other electronic components. In this embodiment, because the frame board assembly 602 has a notch parallel to the circuit board 601 reserved for the electronic components 603, the frame board assembly 602 does not completely surround the electronic components 603, thus reserving heat dissipation space for the electronic components 603 and enhancing the heat dissipation effect. Simultaneously, because the frame board assembly 602 does not completely surround the electronic components 603, the area occupied by the frame board assembly 602 on the circuit board 601 will be reduced. In addition, because the frame board assembly 602 has a notch, different frame board assemblies 602 can be staggered, thereby further improving the space utilization of the circuit board 601.

[0151] It should be noted that, in this embodiment, the frame board assembly 602 may include four frame components, which are respectively disposed at the four corners of the circuit board 601. This provides notches for the electronic components 603 disposed in the four corner frame components, facilitating heat dissipation. Simultaneously, the notches provided by the four corner frame components, compared to a fully enclosed frame board structure, can reduce the area occupied by the frame board assembly 602 on the circuit board 601. Furthermore, the notches provided by the four corner frame components can be staggered with those of other frame board assemblies 602, thereby further improving the space utilization of the circuit board 601.

[0152] Figure 12 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 12 As shown, in one embodiment provided in this application, the frame board assembly 602 may include a T-shaped frame component to provide a notch for the electronic component 603 disposed within the T-shaped frame component, thereby facilitating heat dissipation of the electronic component 603. Simultaneously, the notch provided by the T-shaped frame component, compared to a fully enclosed frame board structure, can reduce the area occupied by the frame board assembly 602 on the circuit board 601. Furthermore, the notch provided by the T-shaped frame component can be staggered with other frame board assemblies 602, thereby further improving the space utilization of the circuit board 601.

[0153] Figure 13 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 13As shown, in one embodiment provided in this application, the frame board assembly 602 may include an X-shaped frame component to provide a notch for the electronic component 603 disposed within the X-shaped frame component, thereby facilitating heat dissipation of the electronic component 603. Simultaneously, the notch provided by the X-shaped frame component, compared to a fully enclosed frame board structure, can reduce the area occupied by the frame board assembly 602 on the circuit board 601. Furthermore, the notch provided by the X-shaped frame component can be staggered with other frame board assemblies 602, thereby further improving the space utilization of the circuit board 601.

[0154] Figure 14 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 14 As shown in (a) of this application, in one embodiment, the frame board assembly 602 may include an I-shaped frame component to provide a notch for the electronic component 603 disposed within the I-shaped frame component, thereby facilitating heat dissipation of the electronic component 603. Simultaneously, the notch provided by the I-shaped frame component, compared to a fully enclosed frame board structure, can reduce the area occupied by the frame board assembly 602 on the circuit board 601. Furthermore, the notch provided by the I-shaped frame component can be staggered with other frame board assemblies 602, thereby further improving the space utilization of the circuit board 601.

[0155] It should be understood that two parallel frame components in an I-beam frame are not required to be symmetrical. That is to say, as... Figure 14 As shown in (b), depending on the actual needs, the two parallel frame components in the I-shaped frame component can be extended arbitrarily to both ends.

[0156] Figure 15 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 15 As shown, in one embodiment provided in this application, the frame board assembly 602 may include a π-shaped frame component to provide a notch for the electronic component 603 disposed within the π-shaped frame component, thereby facilitating heat dissipation of the electronic component 603. Simultaneously, the notch provided by the π-shaped frame component, compared to a fully enclosed frame board structure, can reduce the area occupied by the frame board assembly 602 on the circuit board 601. Furthermore, the notch provided by the π-shaped frame component can be staggered with other frame board assemblies 602, thereby further improving the space utilization of the circuit board 601.

[0157] Figure 16 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 16As shown, in one embodiment provided in this application, the frame board assembly 602 may include a U-shaped frame component to provide a notch for the electronic component 603 disposed in the U-shaped frame component, thereby facilitating heat dissipation of the electronic component 603. Simultaneously, the notch provided by the U-shaped frame component, compared to a fully enclosed frame board structure, can reduce the area occupied by the frame board assembly 602 on the circuit board 601. Furthermore, the notch provided by the U-shaped frame component can be staggered with other frame board assemblies 602, thereby further improving the space utilization of the circuit board 601.

[0158] Figure 17 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 17 As shown, in one embodiment provided in this application, the frame board assembly 602 may include a notched asymmetrical frame component to provide a notch for the electronic component 603 disposed within the notched asymmetrical frame component, thereby facilitating heat dissipation of the electronic component 603. Simultaneously, the notch provided by the notched asymmetrical frame component, compared to a fully enclosed frame board structure, can reduce the area occupied by the frame board assembly 602 on the circuit board 601. Furthermore, the notch provided by the notched asymmetrical frame component can be staggered with other frame board assemblies 602, thereby further improving the space utilization of the circuit board 601.

[0159] It should be understood that the asymmetrical frame component with a notch can include either a through or non-through notch set at any position in a traditional U-shaped frame component, or a through or non-through notch set at any position in a frame plate assembly 602 of any of the above structural forms.

[0160] Figure 18 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 18 As shown, in one embodiment provided in this application, the frame board assembly 602 may include a notched U-shaped frame component to provide a notch for the electronic component 603 disposed in the notched U-shaped frame component, thereby facilitating heat dissipation of the electronic component 603. Simultaneously, the notch provided by the notched U-shaped frame component, compared to a fully enclosed frame board structure, can reduce the area occupied by the frame board assembly 602 on the circuit board 601. Furthermore, the notch provided by the notched U-shaped frame component can be staggered with other frame board assemblies 602, thereby further improving the space utilization of the circuit board 601.

[0161] It should be understood that the notched U-shaped frame component may include through or non-through notches at any location on the U-shaped frame component.

[0162] Figure 19 This is a top view schematic diagram of another circuit board structure provided in this application embodiment. (See attached diagram.) Figure 19 As shown, in one embodiment provided in this application, the frame board assembly 602 further includes partial frame components disposed on the circuit board 601 to provide a more precise and complete connection effect and support for the circuit board 601. For example, the layout frame components can be used to provide support for some large-sized ball grid array (BGA) chips or stress-sensitive devices. That is to say, all the frame components in the frame board assembly 602 are not necessarily symmetrical or interconnected, and can also be designed in blocks according to actual needs. Exemplarily, the frame board assembly 602 may include T-shaped frame components and partial frame components, both of which are disposed on the circuit board 601.

[0163] The following section provides a detailed introduction to the circuit board structure where the frame board assembly and the circuit board are not integrally formed.

[0164] Figure 20 This is a cross-sectional view of another circuit board structure provided in this application embodiment. For example... Figure 20 As shown, in one implementation of this application embodiment, the circuit board structure 60 includes a circuit board 601, a frame board assembly 602 disposed on the circuit board 601, electronic components 603, and other electronic devices 604. The circuit board 601 is used to house the electronic components 603. The frame board assembly 602 is disposed on the circuit board 601 and has a notch in a direction parallel to the circuit board 601 reserved for the electronic components 603. The frame board assembly 602 is used to connect the circuit board 601 with other electronic devices 604. Optionally, the other electronic devices 604 can be other circuit boards or other electronic components. In this application embodiment, because the frame board assembly 602 has a notch in a direction parallel to the circuit board 601 reserved for the electronic components 603, the frame board assembly 602 does not completely surround the electronic components 603, thus reserving heat dissipation space for the electronic components 603 and enhancing the heat dissipation effect. Simultaneously, because the frame board assembly 602 does not completely surround the electronic components 603, the area occupied by the frame board assembly 602 on the circuit board 601 will be reduced. In addition, because the frame board assembly 602 has a notch, different frame board assemblies 602 can be staggered, thereby further improving the space utilization of the circuit board 601.

[0165] It should be noted that, in this embodiment, the frame board assembly 602 is mounted on the circuit board 601 via solder joints. That is, multiple frame components in the frame board assembly 602 are mounted on the circuit board 601 by soldering. It should be understood that, in order to ensure that the circuit board 601 and other electronic devices 604 connected to the multiple frame components can maintain a parallel relationship, the heights of the multiple frame components must be equal, and the heights of the solder joints on the multiple frame components must also be equal. For example, the frame board assembly 602 includes frame component A, frame component B, and frame component C. The height difference between frame component A, frame component B, and frame component C is: H1 = max(Ha,Hb,Hc) - min(Ha,Hb,Hc) = 0. Where Ha is the height of frame component A, Hb is the height of frame component B, and Hc is the height of frame component C. The height difference between the solder pads of frame component A, frame component B, and frame component C is: H2 = max(Ja,Jb,Jc) - min(Ja,Jb,Jc) = 0. Where Ja is the pad height of frame A, Jb is the pad height of frame B, and Jc is the pad height of frame C.

[0166] Figure 21 This is a cross-sectional view of another circuit board structure provided in this application embodiment. For example... Figure 21 As shown, in one implementation of this application embodiment, the frame board assembly 602 may include multiple frame components arranged sequentially on the circuit board 601, thereby accommodating more solder pads and providing more connection paths for the circuit board 601 and other electronic devices 604. For example, the number of frame components may be greater than or equal to five. It should be noted that the maximum number of solder pads can be accommodated when the sequentially arranged frame components completely occupy the circuit board 601.

[0167] The following section provides a detailed introduction to solutions for applying frame board structures to motherboards and electronic devices.

[0168] In one embodiment of this application, a motherboard 70 is provided, including a circuit board structure 60 and electronic components 603, with the electronic components 603 disposed on the circuit board structure 60. This allows the circuit board structure 60 to reserve a notch parallel to the circuit board 601 for the electronic components 603, thus forming a non-closed loop in the frame board, reducing the area occupied by the frame board and enhancing heat dissipation. Simultaneously, different frame boards can be staggered, effectively improving the space utilization of the circuit board. It should be understood that, depending on actual needs, the motherboard 70 can be configured with multiple layers of circuit board structure 60 and electronic components 603, thereby forming a three-layer structure (i.e., a sandwich structure), a four-layer structure (i.e., a quad sandwich structure), a five-layer structure (i.e., a quintet sandwich structure), etc.

[0169] Figure 22This is a cross-sectional view of a motherboard provided in yet another embodiment of this application. For example... Figure 22 As shown, exemplarily, in another embodiment, the motherboard 70 may include a vapor chamber (VC) 701, a mid-frame 702, a copper foil 703, a gel 704, a camera component 705, a decorative housing (DECO) 706, an AP board, RF1, RF2, a board-to-board (BTB) connector, a frame board assembly 602 (e.g., FB1, FB2, FB3), and electronic components 603. The vapor chamber 701 is used to transfer heat generated during the operation of the electronic components 603. The mid-frame 702 is disposed on the vapor chamber 701 and is used to support various internal components. The AP board is disposed on the mid-frame 702. A SOC and a first chip IC1 are sequentially disposed on the lower surface of the AP board. A copper foil 703 is also disposed on the lower surface of the AP board for heat conduction. A gel 704 may also be disposed on the copper foil 703 near the SOC and the first chip IC1 for insulating protection of the SOC and the first chip IC1. The camera component 705 is disposed on the mid-frame 702. The decorative housing 706 is located at the very top, covering all electronic components.

[0170] It should be noted that FB1, FB2, and PMIC can be disposed on the upper surface of the AP board. RF1 is disposed on FB1, RF2 is disposed on FB2, FB3 is disposed on RF1, and RF3 is disposed on FB3. BTB, LPIMAD, RFIC, and the second chip IC2 are all disposed on RF3 and connected to the decorative housing 706. It should be understood that LPIMAD, RFIC, and the second chip IC2 are also provided with shielding covers. BTB is also disposed on RF2. In this embodiment, it is equivalent to adopting a structure of multi-layer frame board assembly and multi-layer electronic components. Among them, the frame board assembly 602 (e.g., FB1, FB2, FB3) has notches reserved for electronic components 603 in a direction parallel to the AP board, RF1, RF2, and RF3, so that the frame board forms a non-closed loop, reducing the occupied area of ​​the frame board and enhancing the heat dissipation effect. At the same time, different frame boards can be staggered, effectively improving the space utilization of the circuit board.

[0171] Exemplary embodiments of this application also provide an electronic device 10, including a motherboard 70, a battery, a screen assembly, and a housing, wherein the motherboard 70, battery, and screen assembly are all disposed within the housing. The battery provides power to the motherboard 70 and the screen assembly. The screen assembly serves as a display carrier for the motherboard. Exemplarily, the motherboard may be a control chip comprising a SoC chip, a frame board assembly, and multiple electronic components. The software components of the motherboard 70 may be built into the chip's hardware components before the chip leaves the factory, or may be imported into the chip's hardware components from other non-volatile memory after the chip leaves the factory, or may be downloaded and updated online via a network. The battery may include multiple power sources, which may be the same or different. The battery may also power various subsystems, which may use the same power source or different power sources.

[0172] In addition, the electronic device 10 may also include an application subsystem, which can serve as the main control system or main computing system of the electronic device 10. This application subsystem runs the main operating system and applications, manages the hardware and software resources of the entire electronic device 10, and provides a user interface. The application subsystem may include one or more processing cores. Furthermore, the application subsystem may also include driver software related to other subsystems.

[0173] For example, when the electronic device 10 is a smartphone, the electronic device 10 can be a candybar phone, a double-folding phone, a triple-folding phone, or a quadruple-folding phone, etc. It should be understood that the circuit board structure 60 and the motherboard 70 can be applied to the above-mentioned different types of smartphones.

[0174] Figure 23 This is a schematic diagram of the structure of a candybar phone according to an embodiment of this application. Figure 23 As shown, in one implementation of this application embodiment, the electronic device 10 can be a candybar phone 101. The candybar phone 101 may include a first housing 1010, a first motherboard 1011, a first battery 1012, and a first sub-board 1013. The first motherboard 1011, the first battery 1012, and the first sub-board 1013 are disposed on the first housing 1010. The first battery 1012 is connected to the first motherboard 1011 and the first sub-board 1013 via a flexible printed circuit board (FPC). The first battery 1012 is also connected to the first motherboard 1011 via a battery FPC. The first motherboard 1011 houses a first camera (CAM) CAM1, a System-on-a-C (SoC), and universal flash storage (UFS). The first sub-board 1013 houses a SIM card and a Type-C interface. It should be noted that both the flexible FPC and the battery FPC are connected to other circuit boards via BTB connectors.

[0175] It should be understood that the aforementioned circuit board structure 60 and motherboard 70 can be applied to the first motherboard 1011.

[0176] Figure 24 This is a schematic diagram of the structure of a double-folding machine provided in an embodiment of this application. Figure 24 As shown, in one implementation of this application embodiment, the electronic device 10 can be a dual-folding device 102. The dual-folding device 102 may include a first housing 1010, a second housing 1020, a first motherboard 1011, a first battery 1012, a first sub-board 1013, a first hinge 1021, a second battery 1022, and a first sub-motherboard 1023. The first motherboard 1011, the first battery 1012, and the first sub-board 1013 are disposed on the first housing 1010. The first battery 1012 is connected to the first motherboard 1011 and the first sub-board 1013 via a charging FPC. The first battery 1012 is also connected to the first motherboard 1011 via a battery FPC. The first motherboard 1011 houses a first camera CAM1, a SOC, and a UFS. The first sub-board 1013 houses a SIM card and a Type-C interface.

[0177] The first housing 1010 is connected to the second housing 1020 via a first pivot 1021. The second battery 1022 and the first sub-main board 1023 are disposed in the second housing 1020. The first main board 1011 is connected to the second battery 1022 and the first sub-main board 1023 via a through-axis FPC. The second battery 1022 is connected to the first sub-main board 1023 via a battery FPC. The first sub-main board 1023 is connected to the second camera CAM2 via an FPC. It should be noted that the charging FPC, battery FPC, and through-axis FPC are all connected to other circuit boards via BTB connectors.

[0178] It should be understood that the aforementioned circuit board structure 60 and motherboard 70 can be applied to the first motherboard 1011 and the first sub-motherboard 1023.

[0179] Figure 25 This is a schematic diagram of the structure of a three-stage laminar flow machine provided in an embodiment of this application. Figure 25As shown, in one implementation of this application embodiment, the electronic device 10 can be a triple-mounted unit 103. The triple-mounted unit 103 may include a first housing 1010, a second housing 1020, a third housing 1030, a first motherboard 1011, a first battery 1012, a first sub-board 1013, a first hinge 1021, a second battery 1022, a first sub-motherboard 1023, a second hinge 1031, a third battery 1032, and a second sub-motherboard 1033. The first motherboard 1011, the first battery 1012, and the first sub-board 1013 are disposed in the first housing 1010. The first battery 1012 is connected to the first motherboard 1011 and the first sub-board 1013 via a charging printed circuit board (FPC). The first battery 1012 is also connected to the first motherboard 1011 via a battery FPC. The first motherboard 1011 houses a first camera (CAM1), a system-on-a-chip (SOC), and a universal flash memory (UFS).

[0180] The first sub-board 1013 is equipped with a SIM card and a Type-C interface.

[0181] The first housing 1010 is connected to the second housing 1020 via a first pivot 1021. A second battery 1022 and a first sub-main board 1023 are disposed in the second housing 1020. The first main board 1011 is connected to the second battery 1022 and the first sub-main board 1023 via a through-axis FPC. The second battery 1022 is connected to the first sub-main board 1023 via a battery FPC. The second housing 1020 is connected to the third housing 1030 via a second pivot 1031. A third battery 1032 and a second sub-main board 1033 are disposed in the third housing 1030. The first main board 1011 is also connected to the third battery 1032 and the second sub-main board 1033 via a through-axis FPC. The third battery 1032 is connected to the second sub-main board 1033 via a battery FPC. The second sub-main board 1033 is connected to the second camera CAM2 via an FPC. It should be noted that the charging FPC, battery FPC, and through-axis FPC are all connected to other circuit boards via BTB connectors or zero insertion force (ZIF) connectors.

[0182] It should be understood that the aforementioned circuit board structure 60 and motherboard 70 can be applied to the first motherboard 1011, the first sub-motherboard 1023, and the second sub-motherboard 1033.

[0183] Figure 26 This is a schematic diagram of the structure of another embodiment of the triplex machine provided in this application. Figure 26As shown, in one implementation of this application embodiment, the electronic device 10 can be a triple-mounted unit 103. The triple-mounted unit 103 may include a first housing 1010, a second housing 1020, a third housing 1030, a first mainboard 1011, a first battery 1012, a first sub-board 1013, a first hinge 1021, a second battery 1022, a first sub-mainboard 1023, a second hinge 1031, a third battery 1032, and a second sub-mainboard 1033. The first mainboard 1011 and the first battery 1012 are disposed in the first housing 1010. The first battery 1012 is connected to the first mainboard 1011 via a flexible printed circuit (FPC). The first battery 1012 is also connected to the first mainboard 1011 via a battery FPC. The first mainboard 1011 houses the System-on-Chips (SOC) and the UFS (Unified Storage System).

[0184] The first housing 1010 is connected to the second housing 1020 via a first pivot 1021. A second battery 1022, a first sub-main board 1023, and a first sub-board 1013 are disposed in the second housing 1020. The first main board 1011 is connected to the second battery 1022 and the first sub-main board 1023 via a through-shaft FPC. The second battery 1022 is connected to the first sub-main board 1023 via a battery FPC. The first main board 1011 houses a first camera CAM1. The first sub-board 1013 houses a SIM card and a Type-C interface.

[0185] The first housing 1010 is connected to the third housing 1030 via the second pivot 1031. The third battery 1032 and the second sub-main board 1033 are disposed within the third housing 1030. The first main board 1011 is also connected to the third battery 1032 and the second sub-main board 1033 via a through-axis FPC. The third battery 1032 is connected to the second sub-main board 1033 via a battery FPC. The second sub-main board 1033 is connected to the second camera CAM2 via an FPC. It should be noted that the charging FPC, battery FPC, and through-axis FPC are all connected to other circuit boards via BTB connectors or zero-insertion-force (ZIF) connectors.

[0186] It should be understood that the aforementioned circuit board structure 60 and motherboard 70 can be applied to the first motherboard 1011, the first sub-motherboard 1023, and the second sub-motherboard 1033.

[0187] Figure 27 This is a schematic diagram of the structure of a four-layer stacking machine provided in an embodiment of this application. Figure 27As shown, in one implementation of this application embodiment, the electronic device 10 can be a quadruple stacker 104. The quadruple stacker 104 may include a first housing 1010, a second housing 1020, a third housing 1030, a fourth housing 1040, a first mainboard 1011, a first battery 1012, a first sub-board 1013, a first hinge 1021, a second battery 1022, a first sub-mainboard 1023, a second hinge 1031, a third battery 1032, a second sub-mainboard 1033, a third hinge 1041, a fourth battery 1042, and a third sub-mainboard 1043. The first mainboard 1011, the first battery 1012, and the first sub-board 1013 are disposed in the first housing 1010. The first battery 1012 is connected to the first mainboard 1011 and the first sub-board 1013 via a charging printed circuit board (FPC). The first battery 1012 is also connected to the first mainboard 1011 via a battery FPC. The first motherboard 1011 houses the first camera CAM1, SOC, and general-purpose flash memory UFS. The first sub-board 1013 houses the SIM card and Type-C interface.

[0188] The first housing 1010 is connected to the second housing 1020 via a first pivot 1021. A second battery 1022 and a first sub-main board 1023 are disposed in the second housing 1020. The first main board 1011 is connected to the second battery 1022 and the first sub-main board 1023 via a through-shaft FPC. The second battery 1022 is connected to the first sub-main board 1023 via a battery FPC. The second housing 1020 is connected to the third housing 1030 via a second pivot 1031. A third battery 1032 and a second sub-main board 1033 are disposed in the third housing 1030. The first main board 1011 is also connected to the third battery 1032 and the second sub-main board 1033 via a through-shaft FPC. The third battery 1032 is connected to the second sub-main board 1033 via a battery FPC.

[0189] The third housing 1030 is connected to the fourth housing 1040 via the third pivot 1041. The second sub-main board 1033 is connected to the fourth battery 1042 and the third sub-main board 1043 via a through-axis FPC. The third main board 1043 is connected to the second camera CAM2 via an FPC. It should be noted that the charging FPC, battery FPC, and through-axis FPC are all connected to other circuit boards via BTB connectors or zero-insertion-force (ZIF) connectors.

[0190] It should be understood that the circuit board structure 60 and the motherboard 70 described above can be applied to the first motherboard 1011, the first sub-motherboard 1023, the second sub-motherboard 1033, and the third sub-motherboard 1043.

[0191] It should be understood that the above is only an example of the structure of electronic device 10. Electronic device 10 may also include other subsystems or devices, which can be set and modified as needed. This application embodiment does not impose any restrictions on this.

[0192] The beneficial effects that the electronic device provided in the above-described embodiments of this application can achieve can be referred to the beneficial effects corresponding to the modules provided above, and will not be repeated here.

[0193] The following section provides a detailed introduction to the fabrication methods for circuit board structures.

[0194] Figure 28 This is a flowchart illustrating a method for manufacturing a circuit board structure according to an embodiment of this application. Figure 28 As shown, in one embodiment provided in this application, a method 80 for manufacturing a circuit board structure is provided based on the circuit board structure 60, specifically including the following steps:

[0195] S801, Set a layered dielectric on the surface of the circuit board.

[0196] For example, to facilitate the later cleaning of excess frame board components and prevent excess frame boards from sticking to the circuit board and being difficult to remove, a layer of layered medium can be first applied to the surface of the circuit board. For example, layerable ink or resin can be printed on the surface of the circuit board.

[0197] S802. An adhesive layer is provided in the layered medium.

[0198] For example, the adhesive layer is provided on the layered medium for bonding the frame panel assembly to the layered medium. Optionally, the adhesive layer may be a prepreg (PP sheet).

[0199] S803. A frame plate is installed in the adhesive layer, and holes are made in the frame plate at preset positions. The preset positions of the frame plate are used to reserve notches parallel to the circuit board for electronic components.

[0200] For example, the frame board is bonded to the surface of the circuit board using an adhesive layer. Holes are then drilled at predetermined locations on the frame board, allowing the circuit board to be connected to other electronic components via the holes and solder joints. It should be understood that the predetermined locations on the frame board represent the effective working area reserved for the frame board.

[0201] S804. Clean the un-drilled areas of the frame plate.

[0202] For example, the unperforated areas are redundant areas, and their removal will not affect the function of the frame panel. Therefore, the unperforated areas of the frame panel can be cleaned to obtain a frame panel that meets the requirements. The frame panel that meets the requirements can be one of the above-mentioned two parallel frame components, four parallel frame components, four corner frame panel components, T-shaped frame components, X-shaped frame components, I-shaped frame components, π-shaped frame components, U-shaped frame components, notched asymmetrical frame components, notched U-shaped frame components, etc.

[0203] Figure 29 This is a flowchart illustrating a method for manufacturing a circuit board structure according to another embodiment of this application. Figure 30 This is a schematic diagram illustrating a method for manufacturing a circuit board structure according to an embodiment of this application. Figure 29 and Figure 30 As shown, in one embodiment provided in this application, a method 80 for manufacturing a circuit board structure is provided based on the circuit board structure 60, specifically including the following steps:

[0204] S801, Set a layered dielectric on the surface of the circuit board.

[0205] For example, such as Figure 30 As shown in (a), to facilitate the later cleaning of excess frame board components and prevent excess frame boards from sticking to the circuit board and being difficult to remove, a layer of layered medium 8011 can be first applied to the surface of the circuit board 601. For example, layerable ink or resin can be printed on the surface of the circuit board.

[0206] S802. An adhesive layer is provided in the layered medium.

[0207] For example, such as Figure 30 As shown in (b), an adhesive layer 8012 is provided on the layered medium 8011 for bonding the frame plate to the layered medium. Optionally, the adhesive layer may be a prepreg (PP sheet).

[0208] S8031: A multi-layer frame board is set in the adhesive layer using a high-density interconnection method, and multi-layer through-holes are opened at preset positions on the multi-layer frame board. The preset positions on the frame board are used to reserve notches parallel to the circuit board for electronic components.

[0209] For example, such as Figure 30As shown in (c), the frame board can be fabricated using a high-density interconnect (HDI) method. The multilayer frame board 8013 is bonded to the circuit board surface using an adhesive layer. Through-holes are then created at predetermined locations on the multilayer frame board 8013, extending through the board to facilitate connections between the multilayer frame board and other electronic components via these through-holes (which can contain solder paste) and solder joints. It should be understood that the predetermined locations on the frame board represent the effective working area reserved for the frame board.

[0210] S804. Clean the un-drilled areas of the frame plate.

[0211] For example, such as Figure 30 As shown in (d), the unperforated area is the redundant area. Removing it will not affect the function of the frame panel. Therefore, the unperforated area of ​​the frame panel can be cleaned to obtain a frame panel that meets the requirements. A frame panel that meets the requirements can be one of the following: two parallel frame components, four parallel frame components, four-corner frame panel components, T-shaped frame components, X-shaped frame components, I-shaped frame components, π-shaped frame components, U-shaped frame components, asymmetrical frame components with notches, U-shaped frame components with notches, etc.

[0212] Figure 31 This is a flowchart illustrating a method for manufacturing a circuit board structure according to another embodiment of this application. Figure 32 This is a schematic diagram illustrating a method for manufacturing a circuit board structure according to another embodiment of this application. Figure 31 and Figure 32 As shown, in one embodiment provided in this application, a method 80 for manufacturing a circuit board structure is provided based on the circuit board structure 60, specifically including the following steps:

[0213] S801, Set a layered dielectric on the surface of the circuit board.

[0214] For example, such as Figure 32 As shown in (a), to facilitate the later cleaning of excess frame board components and prevent excess frame boards from sticking to the circuit board and being difficult to remove, a layer of layered medium 8011 can be first applied to the surface of the circuit board 601. For example, layerable ink or resin can be printed on the surface of the circuit board.

[0215] S802. An adhesive layer is provided in the layered medium.

[0216] For example, such as Figure 32 As shown in (b), an adhesive layer 8012 is provided on the layered medium 8011 for bonding the frame panel assembly on the layered medium. Optionally, the adhesive layer may be a prepreg (PP sheet).

[0217] S8032. A frame plate is installed in the adhesive layer, and through holes are opened at preset positions on the frame plate. The preset positions on the frame plate are used to reserve notches parallel to the circuit board for electronic components.

[0218] For example, such as Figure 32 As shown in (c), the frame board 8013 is bonded to the circuit board surface via the adhesive layer 8012. Then, through-holes are made at predetermined locations on the frame board 8013, allowing the frame board to connect the circuit board to other electronic components through the through-holes (where solder paste can be placed) and solder joints. It should be understood that the predetermined locations on the frame board are the effective working areas reserved for the frame board.

[0219] S804. Clean the un-drilled areas of the frame plate.

[0220] For example, such as Figure 32 As shown in (d), the unperforated area is the redundant area. Removing it will not affect the function of the frame panel. Therefore, the unperforated area of ​​the frame panel can be cleaned to obtain a frame panel that meets the requirements. A frame panel that meets the requirements can be one of the following: two parallel frame components, four parallel frame components, four-corner frame panel components, T-shaped frame components, X-shaped frame components, I-shaped frame components, π-shaped frame components, U-shaped frame components, asymmetrical frame components with notches, U-shaped frame components with notches, etc.

[0221] Figure 33 This is a flowchart illustrating a method for manufacturing a circuit board structure according to another embodiment of this application. Figure 34 This is a schematic diagram illustrating a method for manufacturing a circuit board structure according to another embodiment of this application. Figure 33 and Figure 34 As shown, in one embodiment provided in this application, a method 80 for manufacturing a circuit board structure is provided based on the circuit board structure 60, specifically including the following steps:

[0222] S801, Set a layered dielectric on the surface of the circuit board.

[0223] For example, such as Figure 34 As shown in (a), to facilitate the later cleaning of excess frame board components and prevent excess frame boards from sticking to the circuit board and being difficult to remove, a layer of layered medium 8011 can be first applied to the surface of the circuit board 601. For example, layerable ink or resin can be printed on the surface of the circuit board.

[0224] S802. An adhesive layer is provided in the layered medium.

[0225] For example, such as Figure 34As shown in (b), an adhesive layer 8012 is provided on the layered medium 8011 for bonding the frame panel assembly on the layered medium. Optionally, the adhesive layer may be a prepreg (PP sheet).

[0226] S8033. A multi-layer frame board is provided in the adhesive layer. The multi-layer frame boards are stacked and connected by conductive adhesive, and through holes are opened at preset positions on the frame boards. The preset positions on the frame boards are used to reserve notches in the direction parallel to the circuit board for electronic components.

[0227] For example, such as Figure 34 As shown in (c), a multilayer frame board 8013 is stacked and bonded to the circuit board surface via conductive adhesive 8014 on the adhesive layer 8012. Holes are then made at predetermined locations on the frame board, allowing the frame board to connect the circuit board to other electronic components through the holes and solder joints. It should be understood that the predetermined locations on the frame board are the effective working areas reserved for the frame board.

[0228] Optionally, the conductive adhesive can be a conductive glue or conductive paste. Conductive glue or conductive paste can be used to bond multilayer frame panels by heating to 130–260°C.

[0229] S804. Clean the un-drilled areas of the frame plate.

[0230] For example, such as Figure 34 As shown in (d), the unperforated area is the redundant area. Removing it will not affect the function of the frame panel. Therefore, the unperforated area of ​​the frame panel can be cleaned to obtain a frame panel that meets the requirements. A frame panel that meets the requirements can be one of the following: two parallel frame components, four parallel frame components, four-corner frame panel components, T-shaped frame components, X-shaped frame components, I-shaped frame components, π-shaped frame components, U-shaped frame components, asymmetrical frame components with notches, U-shaped frame components with notches, etc.

[0231] It should be noted that, in the several embodiments of the circuit board structure manufacturing method of this application described above, the following steps may also be included:

[0232] S805. Remove residual adhesive from the unperforated areas of the frame panel.

[0233] For example, such as Figure 34 As shown in (e), in order to reduce the impact of residual adhesive on the remaining frame board and electronic components, the residual adhesive in the unopened areas of the frame board can be removed.

[0234] It should be understood that the above description is merely to help those skilled in the art better understand the embodiments of this application, and is not intended to limit the scope of the embodiments of this application. Based on the examples given above, those skilled in the art can obviously make various equivalent modifications or changes. For example, some steps in the various embodiments of the above detection method may be unnecessary, or new steps may be added. Alternatively, any combination of two or more of the above embodiments may be used. Such modifications, changes, or combinations also fall within the scope of the embodiments of this application. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0235] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0236] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0237] It should also be understood that the above description of the embodiments of this application focuses on highlighting the differences between the various embodiments. Any similarities or differences not mentioned can be referred to each other. For the sake of brevity, they will not be repeated here.

[0238] It should also be understood that, in the various embodiments of this application, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0239] It should also be understood that in the embodiments of this application, "pre-setting" or "pre-defining" can be achieved by pre-saving the corresponding code, table or other means that can be used to indicate relevant information in the device (e.g., including electronic devices), and this application does not limit the specific implementation method.

[0240] It should also be understood that the methods, situations, categories, and classifications of embodiments in this application are for the convenience of description only and should not constitute a special limitation. Various methods, categories, situations, and features in embodiments can be combined without contradiction.

[0241] It should also be understood that, in the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced by each other, and the technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0242] Finally, it should be noted that the above descriptions are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. In conclusion, the above descriptions are merely preferred embodiments of the technical solutions of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A circuit board structure, characterized in that, Includes a circuit board and a frame board assembly disposed on the circuit board; the circuit board is used to house electronic components; The frame plate assembly is disposed on the circuit board and has a notch provided for the electronic components in a direction parallel to the circuit board; the frame plate assembly is used to connect the circuit board to other electronic devices.

2. The circuit board structure as described in claim 1, characterized in that, The circuit board and the frame board assembly are integrally formed.

3. The circuit board structure as described in claim 1 or 2, characterized in that, The circuit board includes a first side and a second side disposed opposite to each other, and the frame board assembly is disposed on the first side or the second side of the circuit board.

4. The circuit board structure as described in claim 1 or 2, characterized in that, The circuit board includes a first side and a second side disposed opposite to each other, and the frame board assembly is disposed on the first side and the second side of the circuit board.

5. The circuit board structure as described in any one of claims 1-4, characterized in that, It also includes a reinforcing component; the reinforcing component is disposed on the circuit board to enhance the support of the frame plate assembly.

6. The circuit board structure as described in any one of claims 1-5, characterized in that, The frame board assembly includes multiple layers of frame components, which are staggered on the circuit board.

7. The circuit board structure as described in any one of claims 1-6, characterized in that, The frame plate assembly includes two parallel frame components.

8. The circuit board structure as described in any one of claims 1-6, characterized in that, The frame plate assembly includes four parallel frame components.

9. The circuit board structure as described in any one of claims 1-6, characterized in that, The frame board assembly includes four frame components, which are respectively disposed at the four corners of the circuit board.

10. The circuit board structure according to any one of claims 1-6, characterized in that, The frame plate assembly includes one or more of the following: T-shaped frame component, X-shaped frame component, I-shaped frame component, π-shaped frame component, U-shaped frame component, notched asymmetrical frame component, and notched U-shaped frame component.

11. The circuit board structure as described in any one of claims 7-10, characterized in that, The frame board assembly also includes a partial frame component disposed on the circuit board.

12. A method for manufacturing a circuit board structure, based on the circuit board structure according to any one of claims 1-11, characterized in that, include: Layered dielectric is applied to the surface of the circuit board. An adhesive layer is provided in the layered medium; A frame plate is provided in the adhesive layer, and holes are made in the frame plate at preset positions; The frame plate is positioned at a pre-defined location to provide a notch for electronic components that is parallel to the circuit board. Clean the un-drilled areas of the frame plate.

13. The manufacturing method as described in claim 12, characterized in that, The step of setting the frame plate on the adhesive layer and making holes at predetermined positions on the frame plate includes: A high-density interconnection method is used to set multiple layers of the frame plate in the adhesive layer, and multiple through holes are opened at preset positions in the multiple layers of the frame plate and penetrate through the multiple through holes.

14. The manufacturing method as described in claim 12, characterized in that, The method of opening a hole at a predetermined position on the frame plate includes: Through holes are made at predetermined positions on the frame plate.

15. The manufacturing method as described in claim 12, characterized in that, The step of setting the frame plate in the adhesive layer includes: Multiple frames are disposed in the adhesive layer, and the multiple frames are stacked and connected by conductive adhesive.

16. The manufacturing method as described in claim 15, characterized in that, The conductive adhesive includes one or more of conductive glue and conductive paste.

17. The manufacturing method according to any one of claims 12-16, characterized in that, The layered medium includes one or more of layered inks and layered resins.

18. The manufacturing method according to any one of claims 12-17, characterized in that, The adhesive layer includes a prepreg.

19. The manufacturing method according to any one of claims 12-18, characterized in that, Also includes: Remove residual adhesive from the unperforated areas of the frame plate.

20. A motherboard, characterized in that, It includes the circuit board structure and electronic components as described in any one of claims 1 to 11, wherein the electronic components are disposed on the circuit board structure.

21. An electronic device, characterized in that, The device includes the motherboard as described in claim 20, a battery, a screen assembly, and a housing, wherein the motherboard, the battery, and the screen assembly are all disposed within the housing.

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