Method for manufacturing a circuit board assembly and circuit board assembly

Abstract

A method for manufacturing a circuit board assembly includes: providing a chip structure, including a chip assembly and a heat dissipation assembly, wherein the heat dissipation assembly and the chip assembly are connected; the chip assembly includes a chip body, a gate, a source, a drain, a first electrode, a second electrode, and a third electrode; providing a first circuit substrate, including a first bonding pad, a second bonding pad, and a third bonding pad; forming a second circuit substrate and a third circuit substrate on opposite surfaces of the first circuit substrate; forming a first groove on the second circuit substrate and placing a heat spreader in the first groove; forming a second groove on the third circuit substrate and placing the chip structure in the second groove; electrically connecting the first bonding pad and the first electrode, electrically connecting the second bonding pad and the second electrode, and electrically connecting the third bonding pad and the third electrode; and forming a conductive layer penetrating the third circuit substrate, the first circuit substrate, and the second circuit substrate, the conductive layer further covering the heat spreader and the chip structure. This application also provides a circuit board assembly.

Description

Technical Field

[0001] This application relates to the field of chip assembly technology, and in particular to a method for manufacturing a circuit board assembly and the circuit board assembly itself. Background Technology

[0002] Embedding chips into circuit boards can increase the assembly density of the circuit board. However, embedding chips into the circuit board usually involves using microvias to connect the chip and the circuit board, which requires expensive materials such as silver sintering and additional equipment, such as chip handling equipment and chip-to-circuit board alignment equipment, resulting in high manufacturing costs. The thickness and type of the chip must meet the requirements of subsequent drilling and electroplating processes. The quality of the chip needs to be tested before it is fed into the circuit board. To avoid the circuit board warping or even chip breakage due to the difference in thermal expansion coefficients between the chip and the circuit board, more expensive low thermal expansion coefficient substrates are required. Summary of the Invention

[0003] In view of this, it is necessary to provide a method for manufacturing circuit board assemblies that is simple in process and low in cost, and to provide circuit board assemblies that solve the above problems.

[0004] A method for manufacturing a circuit board assembly includes: providing a chip assembly, including a chip assembly and a heat dissipation assembly, the heat dissipation assembly and the chip assembly being connected; the chip assembly including a chip body, a gate, a source, a drain, a first electrode, a second electrode, and a third electrode, the gate, the source, and the drain being located on the surface of the chip body; the first electrode being connected to the gate, the second electrode being connected to the source, and the third electrode being connected to the drain; providing a first circuit substrate, including a first bonding pad, a second bonding pad, and a third bonding pad; forming a peelable layer on the first circuit substrate, the peelable layer covering the first bonding pad, the second bonding pad, and the third bonding pad; and forming a second circuit substrate on two opposite surfaces of the first circuit substrate. The system comprises a third circuit substrate, which covers a first bonding pad, a second bonding pad, and a third bonding pad; a first groove is formed on the second circuit substrate, and a heat spreader is placed in the first groove; a second groove is formed on the third circuit substrate, exposing a peelable layer, and the peelable layer is removed; a chip assembly is placed in the second groove; the first bonding pad and the first electrode are electrically connected; the second bonding pad and the second electrode are electrically connected; and the third bonding pad and the third electrode are electrically connected; a through-hole is formed through the third circuit substrate, the first circuit substrate, and the second circuit substrate; and a conductive layer is formed connecting the second circuit substrate and the third circuit substrate, which covers the heat spreader and the chip assembly and passes through the through-hole.

[0005] In one possible embodiment of this application, at least a portion of the surfaces of the first electrode, the second electrode, and the third electrode are on the same surface.

[0006] In one possible embodiment of this application, after the step of placing the heat spreader in the first groove, the manufacturing method further includes: filling the first groove with a first thermally conductive resin, the first thermally conductive resin connecting the second circuit substrate and the heat spreader; and / or after the step of placing the chip assembly in the second groove, the manufacturing method further includes: filling the second groove with a second thermally conductive resin, the second thermally conductive resin connecting the third circuit substrate and the chip assembly.

[0007] In one possible embodiment of this application, the heat dissipation component includes a first heat dissipation pin, the heat spreader includes a second heat dissipation pin, and the first circuit board further includes a power layer; after the step of forming a via, the first heat dissipation pin, the second heat dissipation pin, and the power layer are exposed to the via; and after the step of forming a conductive layer, the conductive layer connects the first heat dissipation pin, the second heat dissipation pin, and the power layer exposed to the via.

[0008] In one possible embodiment of this application, before the step of forming a peelable layer on the first circuit substrate, the manufacturing method further includes: forming a solder resist layer on the first circuit substrate, the solder resist layer filling the gap between the first solder pad, the second solder pad and the third solder pad; and after the step of forming a peelable layer on the first circuit substrate, the peelable layer further covers the solder resist layer.

[0009] A circuit board assembly includes a first circuit board, a second circuit board, a third circuit board, a heat spreader, a chip mechanism, and a conductive layer.

[0010] The first circuit board includes a first solder pad, a second solder pad, and a third solder pad; the second circuit board is located on the surface of the first circuit board opposite to the first solder pad, the second solder pad, and the third solder pad, and the second circuit board has a first groove; the third circuit board is located on the surface of the first circuit board on which the first solder pad, the second solder pad, and the third solder pad are provided, and the third circuit board has a second groove, the first solder pad, the second solder pad, and the third solder pad being exposed in the second groove; a heat sink is located in the first groove; a chip assembly is located in the second groove, the chip assembly includes a chip component and a heat dissipation component, the heat dissipation component and the chip component are connected, the chip component includes a chip body, a gate, a source, a drain, a first electrode, a second electrode, and a third electrode, the gate, the source, and the drain are located on the surface of the chip body, the first electrode and the gate are connected, the second electrode and the source are connected, the third electrode and the drain are connected, the first solder pad and the first electrode are electrically connected, the second solder pad and the second electrode are electrically connected, and the third solder pad and the third electrode are electrically connected; the circuit board assembly also includes a through hole, the through hole penetrating the third circuit board, the first circuit board, and the second circuit board; a conductive layer is located in the through hole and covers the heat sink and the chip assembly.

[0011] In one possible embodiment of this application, at least a portion of the surfaces of the first electrode, the second electrode, and the third electrode are on the same surface.

[0012] In one possible embodiment of this application, the circuit board assembly further includes a first thermally conductive resin located in a first groove, the first thermally conductive resin connecting a second circuit substrate and a heat spreader; and / or the circuit board assembly further includes a second thermally conductive resin located in a second groove, the second thermally conductive resin connecting a third circuit substrate and a chip assembly.

[0013] In one possible embodiment of this application, the heat dissipation component includes a first heat dissipation pin, the heat spreader includes a second heat dissipation pin, and the first circuit board further includes a power layer; the first heat dissipation pin, the second heat dissipation pin, and the power layer are all exposed through vias, and a conductive layer connects the first heat dissipation pin, the second heat dissipation pin, and the power layer.

[0014] In one possible embodiment of this application, the circuit board assembly further includes a solder resist layer that fills the gap between the first solder pad, the second solder pad, and the third solder pad.

[0015] The circuit board assembly manufacturing method provided in this application embodiment electrically connects the chip mechanism and the first circuit board by welding, eliminating the need for drilling and additional equipment, thus reducing manufacturing costs. The chip mechanism includes a heat dissipation component, which can quickly dissipate the heat generated by the chip mechanism. In addition, the heat can also be quickly dissipated through a heat spreader, resulting in good heat dissipation performance of the circuit board assembly and reducing the risk caused by the difference in thermal expansion coefficients between the chip mechanism and the circuit board. The chip mechanism is first placed in the second groove of the third circuit board, which reduces the thickness requirements of the chip mechanism and makes it easy to replace if there are quality problems with the chip mechanism. Attached Figure Description

[0016] Figure 1 This is a cross-sectional schematic diagram of the chip structure provided in an embodiment of this application.

[0017] Figure 2 This is a cross-sectional schematic diagram of the first circuit board provided in an embodiment of this application.

[0018] Figure 3 In order to be in Figure 2 The diagram shows a cross-sectional view of the first circuit board on which a solder resist layer and a peelable layer are formed.

[0019] Figure 4 In order to be in Figure 3 The diagram shows a cross-sectional view of the first circuit board, on which the second and third circuit boards are formed on opposite surfaces.

[0020] Figure 5 In order to be in Figure 4 The diagram shows a cross-sectional view of a first groove formed on a second circuit board, and a heat spreader placed in the first groove.

[0021] Figure 6 In order to be in Figure 5 The diagram shows a cross-sectional view of the second groove formed on the third circuit board.

[0022] Figure 7 In order to be in Figure 6 Placed in the second groove shown Figure 1 The diagram shows a cross-sectional view of the chip structure.

[0023] Figure 8 To form a through Figure 7 A cross-sectional schematic diagram of the through holes of the third circuit board, the first circuit board, and the second circuit board shown.

[0024] Figure 9 In order to be in Figure 8 A cross-sectional schematic diagram showing the conductive layer forming the connection between the second and third circuit boards.

[0025] Figure 10 To Figure 9 The diagram shows a cross-sectional view of the conductive layer used for circuit fabrication.

[0026] Explanation of main component symbols

[0027]

[0028] Detailed Implementation

[0029] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0031] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0032] Please see Figures 1 to 10 This application provides a method for manufacturing a circuit board assembly 100, which may include the following steps:

[0033] Step S1: Please refer to Figure 1 Provide chip structure 10.

[0034] The chip assembly 10 includes a chip component 11, a heat dissipation component 13, and a connection layer 15. The heat dissipation component 13 is connected to the chip component 11 and is used to quickly dissipate the heat generated by the chip component 11 during operation. The connection layer 15 connects the chip component 11 and the heat dissipation component 13 and is used to connect the chip component 11 and the heat dissipation component 13 into a whole.

[0035] The chip assembly 11 may include a chip body 111, a gate 112, a source 113, a drain 114, a first electrode 115, a second electrode 116, and a third electrode 117. The gate 112, source 113, and drain 114 are located on the surface of the chip body 111, wherein the gate 112 and source 113 are located on the same surface of the chip body 111, and the drain 114 is located on the surface of the chip body 111 opposite to the gate 112 and source 113. The first electrode 115 is connected to the gate 112, the second electrode 116 is connected to the source 113, and the third electrode 117 is connected to the drain 114.

[0036] At least a portion of the surfaces of the first electrode 115, the second electrode 116, and the third electrode 117 are on the same surface, facilitating subsequent soldering. In this embodiment, the first electrode 115 and the second electrode 116 are located on the same side of the chip body 111, and the third electrode 117 is generally Z-shaped. One end of the third electrode 117 is on the same surface as the first electrode 115 and the second electrode 116. The irregularly shaped third electrode 117 is embedded in the interconnect layer 15, improving the connection reliability of the third electrode 117.

[0037] The chip assembly 11 may further include multiple bonding layers 118 for correspondingly connecting the gate 112 and the first electrode 115, the source 113 and the second electrode 116, the drain 114 and the third electrode 117. The heat dissipation assembly 13 may include a heat sink 131, a heat pipe 132, and an encapsulation layer 133. The heat sink 131 and the drain 114 are located on the same surface of the chip body 111, and the heat sink 131 connects the chip body 111 and the encapsulation layer 133. The heat pipe 132 is generally flat and is embedded in the encapsulation layer 133. The heat sink 131 can quickly conduct the heat generated by the chip during operation to the heat pipe 132, and then quickly dissipate the heat through the heat pipe 132.

[0038] The encapsulation layer 133 includes a first heat dissipation pin 1331, which is located on the side of the encapsulation layer 133 away from the chip assembly 11 and protrudes relative to the connection layer 15.

[0039] Step S2: Please refer to Figure 2 A first circuit board 20 is provided, which includes a first solder pad 221, a second solder pad 222 and a third solder pad 223.

[0040] The first circuit board 20 includes a first dielectric layer 21 and a first circuit layer 22 stacked together. The first dielectric layer 21 and the first circuit layer 22 can be multiple layers. The first circuit layer 22 includes a first solder pad 221, a second solder pad 222 and a third solder pad 223, which are located on the outer surface of the first circuit board 20.

[0041] The first circuit board 20 may further include a power layer 26, which is embedded in the first dielectric layer 21. In this embodiment, the first circuit board 20 includes two power layers 26.

[0042] The first circuit board 20 may further include a via 27 and a first filler 271. The via 27 penetrates the first circuit board 20 and can be used to connect first circuit layers 22 located in different layers. The first filler 271 fills the via 27. In other embodiments, when the first circuit layers 22 located in different layers are electrically connected in other ways, the via 27 may be omitted, and the first filler 271 in the via 27 may also be omitted accordingly.

[0043] Step S3: Please refer to Figure 3 A solder resist layer 24 and a peelable layer 23 are formed on the first circuit board 20.

[0044] The solder resist layer 24 fills the gap between the first solder pad 221, the second solder pad 222, and the third solder pad 223. The peelable layer 23 covers the first solder pad 221, the second solder pad 222, and the third solder pad 223, and also covers the solder resist layer 24.

[0045] Step S4: Please refer to Figure 4 A second circuit substrate 30 and a third circuit substrate 40 are formed on opposite surfaces of the first circuit substrate 20.

[0046] The second circuit board 30 covers one of the surfaces of the first circuit board 20, the third circuit board 40 covers the surface of the first circuit board 20 opposite to the second circuit board 30, and the third circuit board 40 is also covered with a peelable layer 23.

[0047] The second circuit board 30 may include a second dielectric layer 31 and a second circuit layer 32 stacked together. The number of layers of the second dielectric layer 31 and the second circuit layer 32 may be one or more. The second dielectric layer 31 is connected to the first circuit board 20.

[0048] The third circuit board 40 may include a third dielectric layer 41 and a third circuit layer 42 stacked together. The number of layers of the third dielectric layer 41 and the third circuit layer 42 may be one or more. The third dielectric layer 41 is connected to the first circuit board 20.

[0049] Step S5: Please refer to Figure 5 A first groove 33 is formed on the second circuit substrate 30, and the heat spreader 50 is placed in the first groove 33.

[0050] A first groove 33 is formed on the surface of the second circuit board 30 facing away from the first circuit board 20. In this embodiment, the first groove 33 is stepped, and includes a first receiving portion 331 and a second receiving portion 332. The first receiving portion 331 is the side of the first groove 33 facing away from the first circuit board 20, and the second receiving portion 332 is the side of the first groove 33 close to the first circuit board 20. The width of the first receiving portion 331 is greater than the width of the second receiving portion 332. The heat sink 50 includes a second heat dissipation pin 51, which is located in the first receiving portion 331.

[0051] After placing the heat spreader 50 in the first groove 33, the manufacturing method further includes filling the first groove 33 with a first thermally conductive resin 34, which connects the second circuit board 30 and the heat spreader 50. The first thermally conductive resin 34 fills the gap between the heat spreader 50 and the second circuit board 30, and can play a role in rapid heat conduction.

[0052] Step S6: Please refer to Figure 6A second groove 43 is formed on the third circuit board 40 to expose the peelable layer 23, and the peelable layer 23 is removed.

[0053] A second groove 43 is formed in the area corresponding to the peelable layer 23. The second groove 43 penetrates the third circuit board 40, thereby exposing the peelable layer 23. After the peelable layer 23 is exposed, the peelable layer 23 is removed, and the first solder pad 221, the second solder pad 222, and the third solder pad 223 are exposed in the second groove 43.

[0054] The second groove 43 is stepped and includes a third receiving portion 431 and a fourth receiving portion 432. The third receiving portion 431 is the side of the second groove 43 away from the first circuit board 20, and the fourth receiving portion 432 is the side of the second groove 43 close to the first circuit board 20. The width of the third receiving portion 431 is greater than the width of the fourth receiving portion 432.

[0055] Step S7: Please refer to Figure 7 and combined Figure 1 The chip assembly 10 is placed in the second groove 43, the first pad 221 and the first electrode 115 are electrically connected, the second pad 222 and the second electrode 116 are electrically connected, and the third pad 223 and the third electrode 117 are electrically connected.

[0056] Before placing the chip assembly 10 in the second recess 43, conductive paste 25 can be applied to the surfaces of the first pad 221, the second pad 222, and the third pad 223. After placing the chip assembly 10 in the second recess 43, the conductive paste 25 connects the corresponding first pad 221 and the first electrode 115, the second pad 222 and the second electrode 116, and the third pad 223 and the third electrode 117. Reflow soldering can be used to electrically connect the chip assembly 10 and the first circuit board 20. The first electrode 115, the second electrode 116, and the third electrode 117 of the chip assembly 11 can be electrically connected to the corresponding first pad 221, the second pad 222, and the third pad 223 by soldering. This can reduce the problem of increased parasitic inductance caused by wire bonding, reduce power loss, increase power density, improve switching frequency, and also play a role in heat dissipation.

[0057] After placing the chip assembly 10 in the second recess 43, the first heat dissipation pin 1331 is located in the third receiving portion 431. The manufacturing method may further include filling the second recess 43 with a second thermally conductive resin 44, the second thermally conductive resin 44 connecting the third circuit board 40 and the chip assembly 10, and the second thermally conductive resin 44 also covering a solder resist layer 24. The second thermally conductive resin 44 fills the gap between the chip assembly 10 and the third circuit board 40, and the second thermally conductive resin 44 can provide rapid heat conduction.

[0058] Step S8: Please refer to Figure 8 A through hole 45 is formed that penetrates the third circuit substrate 40, the first circuit substrate 20 and the second circuit substrate 30.

[0059] After the via 45 is formed, the first heat dissipation pin 1331 and the second heat dissipation pin 51 are exposed to the via 45. In the step of forming the via 45, a portion of the first heat dissipation pin 1331 and a portion of the second heat dissipation pin 51 may be removed to ensure that the first heat dissipation pin 1331 and the second heat dissipation pin 51 are exposed to the via 45.

[0060] Step S9: Please refer to Figure 9 A conductive layer 46 is formed to connect the second circuit substrate 30 and the third circuit substrate 40. The conductive layer 46 covers the heat sink 50 and the chip mechanism 10 and passes through the through hole 45.

[0061] After the conductive layer 46 is formed, it can be connected to the first circuit layer 22, the second circuit layer 32, and / or the third circuit layer 42 to provide connectivity between the first circuit substrate 20, the second circuit substrate 30, and the third circuit substrate 40. The conductive layer 46 connects the first heat dissipation pin 1331 and the second heat dissipation pin 51 exposed in the via 45. The conductive layer 46 also provides heat conduction, improving the heat dissipation performance of the circuit board assembly 100.

[0062] The via 45 can also penetrate the power layer 26. The power layer 26 is exposed through the via 45. After forming the conductive layer 46, the power layer 26 and the conductive layer 46 are connected. The conductive layer 46 can also quickly transfer the heat of the power layer 26 away, improving the heat dissipation performance of the circuit board assembly 100.

[0063] After the step of forming the conductive layer 46, the manufacturing method may further include: forming a second filler 461 in the through hole 45, wherein the conductive layer 46 located in the through hole 45 surrounds the second filler 461.

[0064] Step S10: Please refer to Figure 10 The conductive layer 46 located on the surface of the second circuit substrate 30 and the third circuit substrate 40 is fabricated to form the outer circuit layer 60.

[0065] The method for manufacturing the circuit board assembly 100 provided in this application embodiment involves electrically connecting the chip mechanism 10 and the first circuit board 20 by soldering, eliminating the need for drilling and additional equipment, thus reducing manufacturing costs. The chip mechanism 10 includes a heat dissipation component 13, which can quickly dissipate the heat generated by the chip assembly 11. Additionally, the heat can be quickly dissipated through the heat dissipation plate 50. The circuit board assembly 100 has good heat dissipation performance, reducing the risk caused by the difference in thermal expansion coefficients between the chip assembly 11 and the circuit board (including the first circuit board 20, the second circuit board 30, and the third circuit board 40). The chip mechanism 10 is first placed in the second groove 43 of the third circuit board 40, which reduces the thickness requirement for the chip mechanism 10 and makes it easy to replace if there are quality problems.

[0066] Please refer to it again. Figure 10 This application also provides a circuit board assembly 100, which may include a first circuit board 20, a second circuit board 30, a third circuit board 40, a heat spreader 50, a chip assembly 10, and a conductive layer 46. The second circuit board 30 and the third circuit board 40 are located on opposite surfaces of the first circuit board 20. The heat spreader 50 is located in the second circuit board 30, the chip assembly 10 is located in the third circuit board 40, and the conductive layer 46 penetrates the third circuit board 40, the first circuit board 20, and the second circuit board 30, and connects the heat spreader 50 and the chip assembly 10.

[0067] The first circuit board 20 may include a first dielectric layer 21 and a first circuit layer 22 stacked together. The first circuit layer 22 may include a first solder pad 221, a second solder pad 222, and a third solder pad 223. The second circuit board 30 may include a second dielectric layer 31 and a second circuit layer 32 stacked together. The third circuit board 40 may include a second dielectric layer 31 and a second circuit layer 32 stacked together. The second circuit board 30 is located on the surface of the first circuit board 20 that is opposite to the first solder pad 221, the second solder pad 222, and the third solder pad 223; the third circuit board 40 is located on the surface of the first circuit board 20 on which the first solder pad 221, the second solder pad 222, and the third solder pad 223 are disposed.

[0068] The circuit board assembly 100 also includes a solder resist layer 24, which fills the gap between the first solder pad 221, the second solder pad 222 and the third solder pad 223.

[0069] The second circuit board 30 has a first groove 33, and the heat dissipation plate 50 is located in the first groove 33. The third circuit board 40 has a second groove 43, and the first solder pad 221, the second solder pad 222 and the third solder pad 223 are exposed in the second groove 43.

[0070] Please see Figure 10and combined Figure 1 The chip assembly 10 includes a chip component 11 and a heat dissipation component 13, which are connected to the chip component 11. The chip component 11 includes a chip body 111, a gate 112, a source 113, a drain 114, a first electrode 115, a second electrode 116, and a third electrode 117. The gate 112, the source 113, and the drain 114 are located on the surface of the chip body 111. The first electrode 115 is connected to the gate 112, the second electrode 116 is connected to the source 113, and the third electrode 117 is connected to the drain 114. The first pad 221 is electrically connected to the first electrode 115, the second pad 222 is electrically connected to the second electrode 116, and the third pad 223 is electrically connected to the third electrode 117.

[0071] The circuit board assembly 100 has a through hole 45 that penetrates the third circuit board 40, the first circuit board 20, and the second circuit board 30. A conductive layer 46 is located in the through hole 45 and covers the heat sink 50 and the chip assembly 10.

[0072] The heat dissipation assembly 13 may include a heat sink 131, a heat pipe 132, and an encapsulation layer 133. The heat sink 131 and the drain 114 are located on the same surface of the chip body 111, and the heat sink 131 connects the chip body 111 and the encapsulation layer 133. The heat pipe 132 is embedded in the encapsulation layer 133. The encapsulation layer 133 may include a first heat dissipation pin 1331, which is located on the side of the encapsulation layer 133 facing away from the chip assembly 11, and protrudes relative to the connection layer 15. The first heat dissipation pin 1331 is exposed through a via 45, and the conductive layer 46 may also connect to the first heat dissipation pin 1331.

[0073] The heat spreader 50 may include a second heat dissipation pin 51, which is exposed in the through hole 45, and the conductive layer 46 may also be connected to the second heat dissipation pin 51.

[0074] The first circuit board 20 may also include a power layer 26, which is embedded in the first dielectric layer 21 and exposed through a via 45. The conductive layer 46 may also be connected to the power layer 26.

[0075] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that, include: A chip assembly is provided, including a chip component and a heat dissipation component, wherein the heat dissipation component is connected to the chip component, and the chip component includes a chip body, a gate, a source, a drain, a first electrode, a second electrode, and a third electrode. The gate, the source, and the drain are located on the surface of the chip body, the first electrode and the gate are connected, the second electrode and the source are connected, and the third electrode and the drain are connected. A first circuit board is provided, including a first solder pad, a second solder pad, and a third solder pad; A peelable layer is formed on the first circuit board, the peelable layer covering the first solder pad, the second solder pad and the third solder pad; A second circuit board and a third circuit board are formed on opposite surfaces of the first circuit board, wherein the third circuit board covers the first solder pad, the second solder pad and the third solder pad; A first groove is formed on the second circuit substrate, and a heat spreader is placed in the first groove; A second groove is formed on the third circuit board to expose the peelable layer, and the peelable layer is then removed. The chip assembly is placed in the second groove, the first pad and the first electrode are electrically connected, the second pad and the second electrode are electrically connected, and the third pad and the third electrode are electrically connected. A through-hole is formed through the third circuit substrate, the first circuit substrate, and the second circuit substrate; as well as A conductive layer is formed to connect the second circuit substrate and the third circuit substrate. The conductive layer covers the heat sink and the chip assembly and passes through the via.

2. The method for manufacturing a circuit board assembly according to claim 1, characterized in that, At least a portion of the surfaces of the first electrode, the second electrode, and the third electrode are on the same surface.

3. The method for manufacturing a circuit board assembly according to claim 1, characterized in that, After placing the heat spreader in the first groove, the manufacturing method further includes: filling the first groove with a first thermally conductive resin, wherein the first thermally conductive resin connects the second circuit board and the heat spreader; and / or After placing the chip assembly in the second groove, the manufacturing method further includes filling the second groove with a second thermally conductive resin, wherein the second thermally conductive resin connects the third circuit board and the chip assembly.

4. The method for manufacturing a circuit board assembly according to any one of claims 1-3, characterized in that, The heat dissipation component includes a first heat dissipation pin, the heat spreader includes a second heat dissipation pin, and the first circuit board also includes a power layer. After the via is formed, the first heat dissipation pin, the second heat dissipation pin, and the power layer are exposed to the via; and After the step of forming the conductive layer, the conductive layer connects the first heat dissipation pin, the second heat dissipation pin, and the power layer exposed in the via.

5. A method for manufacturing a circuit board assembly according to any one of claims 1-3, characterized in that, Prior to the step of forming the peelable layer on the first circuit board, the fabrication method further includes: A solder resist layer is formed on the first circuit board, the solder resist layer filling the gap between the first solder pad, the second solder pad, and the third solder pad; and After the step of forming the peelable layer on the first circuit board, the peelable layer also covers the solder resist layer.

6. A circuit board assembly, characterized in that, include: The first circuit board includes a first solder pad, a second solder pad, and a third solder pad; The second circuit board is located on the surface of the first circuit board that is away from the first solder pad, the second solder pad and the third solder pad, and the second circuit board has a first groove. A third circuit board is located on the surface of the first circuit board on which the first solder pad, the second solder pad, and the third solder pad are disposed. The third circuit board has a second groove, and the first solder pad, the second solder pad, and the third solder pad are exposed in the second groove. A heat spreader is located in the first groove; A chip assembly, located in the second recess, includes a chip component and a heat dissipation component connected to the chip component. The chip component includes a chip body, a gate, a source, a drain, a first electrode, a second electrode, and a third electrode. The gate, source, and drain are located on the surface of the chip body. The first electrode is connected to the gate, the second electrode is connected to the source, and the third electrode is connected to the drain. The first pad is electrically connected to the first electrode, the second pad is electrically connected to the second electrode, and the third pad is electrically connected to the third electrode. Conductive layer; The circuit board assembly further includes through holes that penetrate the third circuit board, the first circuit board, and the second circuit board; the conductive layer is located in the through holes and covers the heat spreader and the chip assembly.

7. The circuit board assembly according to claim 6, characterized in that, At least a portion of the surfaces of the first electrode, the second electrode, and the third electrode are on the same surface.

8. The circuit board assembly according to claim 6, characterized in that, The circuit board assembly further includes a first thermally conductive resin located in the first groove, the first thermally conductive resin connecting the second circuit substrate and the heat spreader; and / or the circuit board assembly further includes a second thermally conductive resin located in the second groove, the second thermally conductive resin connecting the third circuit substrate and the chip assembly.

9. The circuit board assembly according to any one of claims 6-8, characterized in that, The heat dissipation component includes a first heat dissipation pin, the heat spreader includes a second heat dissipation pin, and the first circuit board further includes a power layer; the first heat dissipation pin, the second heat dissipation pin, and the power layer are all exposed through the via, and the conductive layer connects the first heat dissipation pin, the second heat dissipation pin, and the power layer.

10. The circuit board assembly according to any one of claims 6-8, characterized in that, The circuit board assembly further includes a solder resist layer that fills the gap between the first solder pad, the second solder pad, and the third solder pad.

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