Electronic device

Abstract

This application provides an electronic device, including a circuit board assembly, a heating element, and a semiconductor cooling device. The semiconductor cooling device includes a cooling side and a heat dissipation side, and is electrically connected to the circuit board assembly. The circuit board assembly includes a first circuit board, a second circuit board, and a frame plate. The first circuit board includes an outer surface and an inner surface opposite to the outer surface. The second circuit board includes a first surface and a second surface opposite to the first surface. The first and second circuit boards are stacked. The frame plate is connected to the first surface and the inner surface and is electrically connected to the first and second circuit boards. The first circuit board also includes a notch penetrating the outer and inner surfaces. The frame plate surrounds the periphery of the notch and forms a receiving groove with a portion of the first surface. The heating element is housed in the receiving groove and fixed to the first surface. The cooling side of the semiconductor cooling device is connected to the surface of the heating element opposite to the first surface, and the semiconductor cooling device is at least partially located in the receiving groove.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication equipment, and in particular to an electronic device. BACKGROUND

[0002] With the high-performance development of electronic devices such as mobile phones and tablet computers, the power density of heat generating devices such as chips is also gradually increasing, and therefore the heat dissipation demand of electronic devices is also increasing. The current common heat dissipation technology of electronic devices mainly adopts a passive heat dissipation mode, and heat conduction and heat dissipation are performed on the heat emitted by the chip through heat conduction glue, a heat dissipation plate and other heat conduction components. However, the heat dissipation performance of this heat dissipation mode is difficult to improve, and it is unable to meet the heat dissipation demand of existing electronic devices. SUMMARY

[0003] The present application provides an electronic device, which can meet the thinness of the electronic device and effectively dissipate heat from a heat generating element.

[0004] The present application provides an electronic device, which includes a circuit board assembly, a heat generating element and a semiconductor refrigeration component. The semiconductor refrigeration component includes a refrigeration side and a heat dissipation side, and the refrigeration side and the heat dissipation side are arranged in opposite directions along the thickness direction of a frame plate. The semiconductor refrigeration component is electrically connected to the circuit board assembly.

[0005] The circuit board assembly includes a first circuit board, a second circuit board and a frame plate. The first circuit board includes an outer surface and an inner surface arranged in an opposite direction to the outer surface. The second circuit board includes a first surface and a second surface arranged in an opposite direction to the first surface. In the thickness direction of the frame plate, the first circuit board and the second circuit board are stacked, and the frame plate is connected to the first surface and the inner surface. The frame plate is electrically connected to the first circuit board and the second circuit board.

[0006] The first circuit board further includes a notch penetrating through the outer surface and the inner surface. The frame plate surrounds the periphery of the notch and forms a receiving groove with part of the first surface. The heat generating element is received in the receiving groove, and the heat generating element is fixed to the first surface and electrically connected to the first circuit board. The refrigeration side of the semiconductor refrigeration component is connected to the surface of the heat generating element opposite to the first surface, and the semiconductor refrigeration component is at least partially located in the receiving groove.

[0007] In this embodiment, the heat generating element is a chip of an electronic device, the chip generates a large amount of heat when working, the cooling side of the semiconductor refrigeration device is connected with the chip, and the chip can be cooled in time to absorb the heat of the chip, so that effective heat dissipation is achieved; the heat of the semiconductor refrigeration device is conducted away through the heat dissipation side, and the heat dissipation member mainly utilizes the Peltier effect of the semiconductor material. When an electric current passes through a loop composed of different conductors, in addition to irreversible Joule heat, heat absorption and heat release phenomena will occur at the junctions of different conductors with different current directions. It can be understood that when direct current passes through an electric couple composed of two different semiconductor materials connected in series, heat can be absorbed and released at the two ends of the electric couple, respectively, so that the purpose of refrigeration can be achieved. The heat dissipation member absorbs the heat of the chip, and the heat is transferred, shielded and dissipated by the heat dissipation side and the heat spreading plate. In this embodiment, the heat dissipation member can dynamically control the cooling according to the heat generation degree of the chip, so as to reduce the junction temperature of the chip and effectively reduce the temperature of the chip, thereby ensuring that the heat generating chip works at a safe temperature. Compared with the air cooling or liquid cooling cooling effect of the prior art, the cooling effect is limited; in this embodiment, the structure and assembly of the heat dissipation member are relatively simple, and the heat dissipation path of the chip only needs to pass through the shielding member and the heat spreading plate, without the need to reserve air duct and fan space, which can reduce the occupied area of the internal space of the electronic device; and in this embodiment, the chip and at least part of the semiconductor refrigeration device are accommodated in the accommodation groove of the circuit board assembly, so that the space occupied by the semiconductor refrigeration device, the chip and the circuit board assembly in the thickness direction is reduced, thereby saving the internal space of the electronic device; and the demand for thin design of the electronic device and the demand for high-power heat dissipation are met.

[0008] In one embodiment, the thickness of the heat generating element is less than the sum of the thicknesses of the frame plate and the first circuit board in the thickness direction of the frame plate, and the height of the semiconductor refrigeration device protruding from the first surface is less than or equal to 0.2 mm. In this embodiment, the thickness of the heat generating element is less than the depth of the accommodation groove, so that the circuit board assembly has a certain space in the thickness direction to accommodate the semiconductor refrigeration device, thereby reducing the space occupied by the semiconductor refrigeration device in the thickness direction and avoiding increasing or further reducing the thickness space of the electronic device.

[0009] In one embodiment, the heat dissipation side of the semiconductor refrigeration device is flush with the outer surface, or lower than the outer surface in the direction of the first circuit board. In this embodiment, the height of the shielding member connected with the heat dissipation side of the semiconductor refrigeration device protruding from the outer surface of the circuit board is reduced, thereby reducing the thickness space of the electronic device.

[0010] In one embodiment, the electronic device further comprises a shielding member, the shielding member comprises a cover plate and a side plate, the side plate is connected to the circumferential side of the surface of the cover plate and surrounds the cover plate, the shielding member covers the gap, the side plate is fixedly connected to the outer surface, and the heat dissipation side of the semiconductor refrigeration device is connected to the surface of the cover plate facing the accommodation groove.

[0011] The electronic device further includes a mid-frame, a shield, and a heat spreader. The mid-frame has a front side, a back side opposite to the front side, and a clearance slot penetrating the front side and the back side. The heat spreader is stacked on the front side and covers the clearance slot. Along the thickness direction of the electronic device, the shield is partially located within the clearance slot. The cover plate is connected to the heat spreader and the heat dissipation side of the semiconductor cooling device through a thermally conductive layer.

[0012] In this embodiment, the shielding component can prevent the heat-generating device and the semiconductor cooling component from being interfered with by external signals. The semiconductor cooling component dissipates heat through the shielding component. Part of the shielding component extends into the clearance groove of the middle frame, which can further save space in the electronic device.

[0013] In one embodiment, the electronic device further includes a shielding component, which includes a cover plate and a side plate. The side plate is connected to the peripheral surface of the cover plate and surrounds the cover plate. The shielding component covers the heating element and the semiconductor cooling element. The shielding component is located in the receiving groove and spaced apart from the frame plate. The heat dissipation side of the semiconductor cooling element is connected to the cover plate.

[0014] The frame plate has a connecting surface that exposes the notch, and the side plate extends into the receiving groove and is fixed and electrically connected to the connecting surface of the frame plate; or, the side plate extends into the receiving groove and is fixed and electrically connected to the first surface of the second circuit board; or, the first surface in the receiving groove is connected to an electrical connecting plate surrounding the heating element, and the side plate extends into the receiving groove and is fixed and electrically connected to the electrical connecting plate.

[0015] In this embodiment, the shielding component is located within the receiving groove, which can save the thickness space occupied by the shielding component in the circuit board assembly, further saving the thickness space of the electronic device and facilitating the thin design of the electronic device.

[0016] In one embodiment, a first shielding cover and a second shielding cover are provided on the outer surface of the first circuit board. The electronic device further includes a middle frame, a shielding component and a heat dissipation plate. The middle frame has a front side and a back side that are opposite to the front side, as well as a clearance groove that passes through the front side and the back side.

[0017] Along the thickness direction of the electronic device, the heat spreader is stacked on the front side, the circuit board assembly is located on the back side, the shielding member is opposite to the clearance slot, and the shielding member is connected to the heat spreader through a thermally conductive layer;

[0018] The first shield and the second shield are connected to the back surface. Along the thickness direction of the electronic device, the height of the shield protruding from the outer surface is less than or equal to the height of the first shield and the second shield protruding from the outer surface.

[0019] In this embodiment, the first shielding cover and the second shielding cover are connected to the middle frame. The shielding components do not increase the distance between the first shielding cover and the second shielding cover and the middle frame. The installation can be achieved by the first shielding cover and the second shielding cover protruding from the circuit board, thus avoiding increasing the thickness of the circuit board assembly and saving the thickness space of the electronic device.

[0020] In one embodiment, the electronic device further includes a shielding member, which is a metal plate covering the notch. The shielding member is fixedly connected to the outer surface at its peripheral edge facing the receiving groove. The heat dissipation side of the semiconductor cooling device is connected to the surface of the shielding member facing the receiving groove. In this embodiment, the semiconductor cooling device is completely located within the degreasing knife, and the shielding clip can adopt a plate-like structure, greatly reducing the space occupied by the circuit board assembly thickness and saving overall thickness space of the electronic device.

[0021] In one embodiment, the electronic device further includes a mid-frame, a shield, and a heat spreader. The mid-frame has a front side, a back side opposite to the front side, and a clearance groove penetrating the front side and the back side. The surface of the heat spreader has protrusions. Along the thickness direction of the electronic device, the heat spreader is stacked on the front side, the circuit board assembly is located on the back side, the protrusions pass through the clearance groove, and the shield is connected to the protrusions of the heat spreader.

[0022] In this embodiment, the shielding cover is a flat plate, and the thickness space of the middle frame is used to accommodate the protrusion. This not only does not increase the thickness of the electronic device, but the protrusion can also increase the volume of the heat dissipation plate, thereby improving the heat dissipation efficiency.

[0023] In one embodiment, the semiconductor cooling device is located in the heat concentration area of ​​the heat-generating element, the peripheral side and the heat dissipation side of the semiconductor cooling device are covered with a second thermally conductive layer, the surface of the chip is covered with a first thermally conductive layer, the cooling side of the semiconductor cooling device and the second thermally conductive layer are connected to the first thermally conductive layer, and the side of the second thermally conductive layer facing away from the chip is connected to the shielding device.

[0024] In this embodiment, the area of ​​the semiconductor cooling device is smaller than the area of ​​the heat-generating element, and it concentrates heat dissipation in the concentrated heat-generating area. The second thermally conductive layer covers the outer peripheral surface of the semiconductor cooling device and the surface facing away from the chip. This can be understood as the second thermally conductive layer wrapping around the outer surface of the semiconductor cooling device. The second thermally conductive layer can absorb heat from the first thermally conductive layer and the semiconductor cooling device, and transfer the heat to the shielding component; the second thermally conductive layer improves the heat dissipation effect of the chip and the semiconductor cooling device. In this embodiment, the second thermally conductive layer can be made of thermally conductive gel.

[0025] In one embodiment, the thermoelectric cooler is located in the heat concentration area of ​​the heat-generating element. An auxiliary heat-conducting component is provided around the peripheral side of the thermoelectric cooler. The auxiliary heat-conducting component is connected to the peripheral side of the thermoelectric cooler through a heat insulation layer. The auxiliary heat-conducting component is spaced apart from the first circuit board. The two sides of the auxiliary heat-conducting component in the thickness direction are flush with the cooling side and the heat dissipation side of the thermoelectric cooler, respectively. The surface of the chip is covered with a first heat-conducting layer. The auxiliary heat-conducting component, the heat insulation layer, and the thermoelectric cooler are connected to the first heat-conducting layer. A second heat-conducting layer is connected between the auxiliary heat-conducting component, the heat insulation layer, the thermoelectric cooler, and the shielding component.

[0026] In this embodiment, to achieve the desired cooling effect of the semiconductor cooler, i.e., to maintain a large temperature difference between the cooling and heat dissipation sides of the semiconductor cooler, the thermal conductivity of the insulation layer is less than or equal to 1 W / m·K. The auxiliary heat conductor is made of copper and can dissipate and conduct heat from the first heat conductor layer. Because the insulation layer has low thermal conductivity, it will not transfer heat to the semiconductor cooler. Compared to the semiconductor cooler, where heat conduction is along the thickness and circumferential directions, the copper auxiliary heat conductor further enhances the passive heat dissipation effect along the thickness (Z-axis) compared to thermally conductive gel. Even when the semiconductor cooler is not operating, heat from the chip can still be transferred through the first heat conductor layer and the auxiliary heat conductor, thus saving energy. The insulation layer is a non-thermally conductive colloid.

[0027] In one embodiment, the first thermally conductive layer surrounds the peripheral side of the heating element and covers the surface of the heating element facing the semiconductor cooling device. A metal thermally conductive layer is connected between the heating element and the surface of the frame plate facing the chip, and the metal thermally conductive layer surrounds the peripheral side of the heating element. The first thermally conductive layer is formed using thermally conductive adhesive. When the heat generated by the chip is low, the semiconductor cooling device can remain inactive, reducing the power consumption of the electronic device. When the chip's heat is low, the heat is absorbed by the first thermally conductive layer and transferred through the second thermally conductive layer and the shielding device, achieving heat dissipation during the transfer process. Moreover, the metal thermally conductive layer connects the first thermally conductive layer and the frame plate. The heat absorbed by the chip by the first thermally conductive layer can be transferred to the frame plate for heat dissipation through the metal thermally conductive layer. The chip has multiple heat dissipation paths, and the first thermally conductive layer has a large volume, thus effectively dissipating heat from the chip and reducing power consumption.

[0028] In one embodiment, the electronic device further includes a heat spreader, a first thermally conductive layer connecting the cooling side of the semiconductor cooling device to the chip, a second thermally conductive layer connecting the heat dissipation side of the semiconductor cooling device to the shielding device, and a third thermally conductive layer connecting the shielding device to the heat spreader. The first, second, and third thermally conductive layers can be thermally conductive gels to increase the heat transfer rate. They can also be liquid metal, solder, Ag glue, etc.

[0029] In one embodiment, the semiconductor cooling device includes a conductive portion fixed and electrically connected to the outer surface of the first circuit board; or, the frame plate has a connecting surface exposing the notch, and the conductive portion is fixed and electrically connected to the connecting surface of the frame plate; or, the conductive portion is electrically connected to a first surface of the second circuit board. The conductive portion in the semiconductor cooling device sets the connection position according to the location of the semiconductor cooling device, shortening the connection path and reducing space usage.

[0030] This application provides an electronic device, which includes a circuit board, a heating element, a thermoelectric cooler, an auxiliary heat-conducting component, and a shielding component; the circuit board includes an outer surface and an inner surface disposed opposite to the outer surface, the auxiliary heat-conducting component includes a baffle; the thermoelectric cooler includes a cooling side and a heat-dissipating side, the cooling side and the heat-dissipating side are disposed opposite to each other along the thickness direction of the frame plate, and the thermoelectric cooler is electrically connected to the circuit board.

[0031] The heating element is connected to the outer surface, the shielding member covers the heating element, the semiconductor cooling member surrounds the block, and the block is connected to the shielding member; the auxiliary heat-conducting member is connected to the surface of the heating element facing away from the outer surface, and the cooling side and the heat dissipation side are respectively connected to the auxiliary heat-conducting member and the shielding member; or, the shielding member is connected to the surface of the heating element facing away from the outer surface, and the cooling side and the heat dissipation side are respectively connected to the shielding member and the auxiliary heat-conducting member.

[0032] In this embodiment, the circuit board is a single-layer circuit board. When the height of the heat-generating chip is relatively limited, the semiconductor cooling device can be combined with the auxiliary heat-conducting device and placed above the chip for heat dissipation. The semiconductor cooling device and the baffle of the auxiliary heat-conducting device can form a U-shaped structure. The auxiliary heat-conducting device enhances the passive heat dissipation effect and does not absorb the heat from the heat dissipation side of the semiconductor cooling device. The semiconductor cooling device can cool the auxiliary heat-conducting device below and quickly transfer the heat from the heat dissipation side to the heat dissipation plate above for heat dissipation; thus improving heat dissipation efficiency.

[0033] The shielding component connects to the surface of the heating element facing away from the outer surface, assisting the heat-conducting component in enhancing passive heat dissipation. It does not absorb heat from the heat dissipation side of the semiconductor cooling component. The semiconductor cooling component can cool the shielding component below and quickly transfer the heat from the heat dissipation side to the heat dissipation plate above for heat dissipation. Moreover, the semiconductor cooling component is located outside the shielding component, which can improve the heat dissipation efficiency of the heat dissipation side.

[0034] In one embodiment, the shielding member is connected to the surface of the heating element facing away from the outer surface, and a bracket is connected between the shielding member and the outer surface, the bracket surrounding the heating element.

[0035] In one embodiment, the heating element is externally wrapped with a thermally conductive colloid, which connects the shield, the outer surface, and the bracket.

[0036] This application provides an electronic device, which includes a mid-frame, a circuit board, a heating element, a semiconductor cooling element, a heat spreader, and a shielding element; the circuit board includes an outer surface and an inner surface disposed opposite to the outer surface.

[0037] The heating element is connected to the outer surface, and the shielding member is covered on the heating element and fixedly connected to the outer surface. In the thickness direction of the electronic device, the heat dissipation side of the semiconductor cooling element is connected to the surface of the cover plate facing the receiving groove.

[0038] The thermoelectric cooler includes a cooling side and a heat dissipation side, which are arranged opposite to each other along the thickness direction of the frame plate. The thermoelectric cooler is electrically connected to the circuit board. The cooling side is connected to the back side via a thermally conductive layer. A heat spreader is placed over the thermoelectric cooler and connected to the back side. The heat dissipation side of the thermoelectric cooler is connected to the heat spreader. In this embodiment, the thermoelectric cooler can dissipate heat from the circuit board. The heat from the thermoelectric cooler is transferred to the motherboard bracket through the heat spreader, and then dissipated from the motherboard bracket to the rear cover of the electronic device. The heat spreader improves the heat dissipation rate of the thermoelectric cooler and prevents heat concentration on the rear cover.

[0039] In one embodiment, the middle frame is provided with a clearance groove, the circuit board is connected to one side of the middle frame, the shielding component is partially located in the clearance groove, and a heat dissipation plate is provided on the side of the middle frame facing away from the circuit board. The heat dissipation plate and the shielding component are connected through a thermally conductive layer. Attached Figure Description

[0040] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0042] Figure 2 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of one embodiment of the electronic device shown;

[0043] Figure 3 yes Figure 1 A schematic plan view of the structure of a portion of the electronic device shown;

[0044] Figure 4 yes Figure 2 The diagram shows a partial cross-sectional view of the electronic device, illustrating a first embodiment of the circuit board assembly.

[0045] Figure 5 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of a second embodiment of the electronic device shown;

[0046] Figure 6 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of a third embodiment of the electronic device shown;

[0047] Figure 7 forFigure 1 A cross-sectional schematic diagram of a portion of the structure of the fourth embodiment of the electronic device shown;

[0048] Figure 8a for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the fifth embodiment of the electronic device shown;

[0049] Figure 8b for Figure 8a A top plan view of a portion of the structure of the fifth embodiment of the electronic device shown;

[0050] Figure 9a for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the sixth embodiment of the electronic device shown;

[0051] Figure 9b for Figure 9a A top plan view of a portion of the structure of the sixth embodiment of the electronic device shown;

[0052] Figure 10 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the seventh embodiment of the electronic device shown;

[0053] Figure 11 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the eighth embodiment of the electronic device shown;

[0054] Figure 12 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the ninth embodiment of the electronic device shown;

[0055] Figure 13 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the tenth embodiment of the electronic device shown;

[0056] Figure 14 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the eleventh embodiment of the electronic device shown;

[0057] Figure 15 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the twelfth embodiment of the electronic device shown. Detailed Implementation

[0058] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0059] In the description of this application, it should be noted that the terms "center," "upper," "lower," "top," "bottom," "left," "right," "vertical," "horizontal," "inner," "outer," "top," "bottom," "front," and "rear," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0060] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0061] In the description of this application, it should be understood that "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in a circuit structure are connected through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB).

[0062] In the description of this application, it should be noted that the mutual perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing and assembly errors (e.g., the included angle between two structural features is 89.9°) is also within the scope of mutual perpendicularity in this application. Similarly, the mutual parallelism in this application is not absolute parallelism. Approximate parallelism due to processing and assembly errors (e.g., the included angle between two structural features is 0.1°) is also within the scope of mutual parallelism in this application. The axial symmetry in this application is not absolute axial symmetry. Approximate axial symmetry due to processing and assembly errors (e.g., a partial structure offset by a certain distance or angle relative to the axis of symmetry) is also within the scope of axial symmetry in this application. The central symmetry in this application is not absolute central symmetry. Approximate central symmetry due to processing and assembly errors (e.g., a partial structure offset by a certain distance or angle relative to the axis of symmetry) is also within the scope of central symmetry in this application. This application does not impose specific limitations in these respects.

[0063] Please see Figure 1 , Figure 1This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. This embodiment uses a tablet computer as an example for illustration. For ease of description, the width direction of the electronic device is defined as the X-axis direction, the length direction as the Y-axis direction, and the thickness direction as the Z-axis direction. The X-axis, Y-axis, and Z-axis directions are mutually perpendicular.

[0064] The electronic device 1000 includes, but is not limited to, the cellphone, tablet computer, personal digital assistant, or mobile device.

[0065] Electronic device 1000 includes a display screen 200, a mid-frame 300, a circuit board assembly, and a rear housing 400. The display screen 200 is mounted on one side of the mid-frame 300 along its thickness direction, and the rear housing 400 is mounted on the other side of the mid-frame 300 along its thickness direction. The circuit board assembly is connected to the side of the mid-frame 300 facing the rear housing 400 and is located between the mid-frame 300 and the rear housing 400. The display screen 200 has a display area capable of displaying image information. When powered on, the display screen 200 can display corresponding image information.

[0066] The electronic device 1000 also includes a battery (not shown), a chip (not shown), and functional components that implement various functions of the electronic device (camera, speaker module). The circuit board assembly, battery (not shown), and functional components that implement various functions of the electronic device (camera, speaker module) are all mounted on the mid-frame 300 and covered by the rear cover 400 and the display screen 200. The chip can serve as the CPU (central processing unit) of the electronic device 1000. The battery provides power to the screen, circuit board, processor, and other electronic components.

[0067] The circuit board assembly provided in this application includes multiple circuit boards, which can be printed circuit boards (PCBs), rigid-flex circuit boards, or integrated circuits (or chips). The circuit board in this embodiment is a double-sided board, meaning that electronic devices can be placed on both sides of the circuit board. The circuit board can be a radio frequency (RF) board or an application processor (AP) board. The RF board can be used, but is not limited to, to carry radio frequency integrated circuits (RFICs), radio frequency power amplifiers (RFPAs), and wireless fidelity (WIFI) chips. For example, the multiple circuit boards may include an application processor board, which can be used, but is not limited to, to carry a CPU, double data rate (DDR) memory, a main power management unit (PMU), and an auxiliary power management chip. The application processor board can be understood as the main circuit board. The multiple circuit boards also include radio frequency (RF) boards and small boards for connecting speakers or antennas.

[0068] The circuit board is connected to multiple electronic devices. In this embodiment, the electronic devices can be capacitors, resistors, and inductors; they can also be connectors, electronic transformers, relays, laser devices, packaged devices, biometric identification modules, memory (such as double data rate memory), power modules, main power management chips, radio frequency chips, radio frequency power amplifiers, wireless fidelity chips, or auxiliary power management chips, etc. Besides being single electronic components, the electronic devices can also be multiple electronic components stacked together.

[0069] In existing technologies, mobile phones and other electronic devices dissipate heat from chips and other components using air cooling or liquid cooling methods. However, as mobile phones continue to evolve towards higher performance, the power density of chips is also gradually increasing, leading to ever-increasing demands for heat dissipation. Existing air cooling and liquid cooling technologies are no longer sufficient to meet the heat dissipation requirements of current thinner devices with high-power chips. Insufficient heat dissipation can affect the reliability of related components. The electronic device provided in this application uses electrothermal cooling technology for heat dissipation, ensuring heat dissipation performance without increasing the thickness of the electronic device. This facilitates the thinning of mobile phones and other electronic devices with high-power chips while achieving good heat dissipation, ensuring the efficiency and stability of related components. See the following figures and embodiments for details.

[0070] Please refer to the following: Figure 2 andFigure 3 , Figure 2 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of one embodiment of the electronic device shown. Figure 3 yes Figure 1 The diagram shows a plan view of the structure of a portion of the electronic device. Figure 2 It's just a schematic diagram, and it only shows part of the internal structure of the electronic device. The dimensions of the middle frame and back cover are not limited to the structure. Figure 3 The dashed lines represent the outline of the underlying covered structure, with the frame board only showing the outline of the part not covered by the circuit board outline.

[0071] In this embodiment, the middle frame 300 includes a middle plate 301, which includes a front side 301a and a back side 301b. The front side 301a and the back side 301b are arranged facing away from each other along the thickness direction of the middle plate 301. A frame (not shown in the figure) is connected to the periphery of the middle plate 301. The frame and the middle plate form an accommodating space for accommodating the functional components of the electronic device, which will not be described again. The middle plate 301 also includes a clearance slot 303, which penetrates the front side 301a and the back side 301b.

[0072] The circuit board assembly 10 of this embodiment includes multiple circuit boards and multiple frame boards. The electronic devices include multiple first electronic devices and multiple second electronic devices. Along the thickness direction (Z-axis direction) of the circuit board assembly, the multiple circuit boards are stacked and spaced apart along the Z-axis direction, and the frame board assembly is connected between adjacent circuit boards. The multiple first electronic devices and multiple second electronic devices can be disposed on both surfaces of the circuit boards, which is beneficial for fully utilizing the space along the Z-axis direction of the electronic device 1000. An example of two circuit boards and two frame boards will be used for explanation. It can be understood that the circuit board assembly of this embodiment is a circuit board with a double-layer stacked structure.

[0073] Specifically, the two circuit boards are a second circuit board 11 and a first circuit board 12. They are stacked along the thickness direction of the electronic device 1000, with the first circuit board 12 and the second circuit board 11 stacked and spaced apart. The frame board includes a second frame board 14 and a first frame board 13, which are connected between the first circuit board 12 and the second circuit board 11. The second frame board 14 is located around the first frame board 13 and spaced apart from it. Multiple first electronic devices 15 are distributed on both surfaces of the second circuit board 11. Multiple second electronic devices 16 are distributed on both surfaces of the first circuit board 12. In this embodiment, the second frame board 14 and the first frame board 13 are spaced apart. In other embodiments, the second frame board 14 and the first frame board 13 are connected by a crossbeam. This ensures the flatness of the connection position during soldering with the first and second circuit boards, preventing unevenness in the height of the second frame board 14 and the first frame board 13.

[0074] The second circuit board 11 includes a first surface 111 and a second surface 112, which are disposed opposite to each other along the thickness direction (Z-axis direction) of the second circuit board 11. The first circuit board 12 includes an inner surface 121 and an outer surface 122, which are disposed opposite to each other along the thickness direction (Z-axis direction) of the first circuit board 12. The second circuit board 11 and the first circuit board 12 are stacked along the thickness direction (Z-axis direction) of the circuit board assembly 10, with the second surface 112 of the second circuit board 11 facing the inner surface 121 of the first circuit board 12.

[0075] The second frame plate 14 and the first frame plate 13 are connected between the first surface 111 of the second circuit board 11 and the inner surface 121 of the first circuit board 12, and support the second circuit board 11 and the first circuit board 12. A gap exists between the second circuit board 11 and the first circuit board 12, and multiple first electronic devices 15 are disposed on the first surface 111 and the second surface 112 of the second circuit board 11. Multiple second electronic devices 16 are disposed on the inner surface 121 and the outer surface 122 of the first circuit board 12. That is, some of the first electronic devices 15 and the second electronic devices 16 are located within the gap between the second circuit board 11 and the first circuit board 12. Electronic devices can be disposed on both the first surface 111 of the second circuit board 11 and the inner surface 121 of the first circuit board 12, improving the utilization rate of the circuit board assembly. The frame plate electrically connects the second circuit board 11 and the first circuit board 12, enabling the two circuit boards to transmit data information to each other. The distribution of the first electronic devices 15 and the second electronic devices 16 is matched according to the main performance characteristics of the second circuit board 11 and the first circuit board 12. In this embodiment, the second circuit board 11 is the main circuit board (PCB) of the electronic device, and the first circuit board 12 is an radio frequency (RF) circuit board.

[0076] In this embodiment, the first frame plate 13 and the second frame plate 14 are welded to the first surface 111 of the second circuit board 11 and the inner surface 121 of the first circuit board 12. The second frame plate 14 is located at the edge of the first surface 111 of the second circuit board 11 and the edge of the inner surface 121 of the first circuit board 12. The second frame plate 14 and the first frame plate 13 are spaced apart. The frame plate can be a common frame plate with electrical connection function and sufficient support performance. It can be understood that the two frame plates form a U-shape, which can support the two circuit boards and has a certain shielding effect. It will not be elaborated here. For ease of description, the first circuit board 12 can be called a circuit board, the first frame plate can be called a frame plate, and the first thermal conductive layer, the second thermal conductive layer and the third thermal conductive layer mentioned below can all be called thermal conductive layers.

[0077] A shielding cover is also provided on the second surface 112 of the second circuit board 11. The shielding cover covers some electronic components to achieve a shielding function. A first shielding cover 123 and a second shielding cover 124 are provided on the outer surface 122 of the first circuit board 12. The first shielding cover 123 and the second shielding cover 124 are connected to the outer surface. The first shielding cover 123 and the second shielding cover 124 cover the second electronic component 16 on the outer surface 122, isolating the mutual interference between signals inside and outside the shielding cover.

[0078] Please refer to the following: Figure 4 , Figure 4 yes Figure 2 The diagram shows a cross-sectional view of a portion of the structure of the electronic device, illustrating a first embodiment of the circuit board assembly.

[0079] In this embodiment, the first circuit board 12 further includes a notch 17, which penetrates the inner surface 121 and the outer surface 122, and is opposite to the first surface 111 of the second circuit board 11, meaning that part of the first surface 111 is visible through the notch 17. A first shielding cover 123 and a second shielding cover 124 are located on opposite sides or around the notch 17. A first frame plate 13 is connected to the inner surface 121 and extends along the periphery of the notch 17. Both the first surface 111 and the inner surface 121 are provided with pads for connection to the frame plate, which are then fixed and electrically connected to the second frame plate 14 and the first frame plate 13. In this embodiment, the first frame plate 13 is flush with or nearly flush with the wall surface inside the notch 17, and the inner wall of the notch 17, the second frame plate 14, and part of the second circuit board 11 constitute a receiving groove A.

[0080] The electronic device 1000 also includes a shielding component 18, a chip 20, a thermoelectric cooler 30, and a heat spreader 40. The chip 20 can be referred to as a heat-generating element. The chip 20 can be a CPU, PMU, etc. The shielding component 18 is used to shield and protect the chip 20, preventing external devices from affecting its performance and also preventing physical damage. The thermoelectric cooler 30 and the heat spreader 40 dissipate heat from the chip 20. The thermoelectric cooler 30 is a thermoelectric cooler. A thermoelectric cooler (TEC) is a device that uses the thermoelectric effect of semiconductors to generate cooling; it is also called a thermoelectric cooler. When two different metals are connected by a thermoelectric cooler and a direct current is applied, the temperature at one junction decreases, and the temperature at the other junction increases. In this embodiment, the thermoelectric cooler 30 is schematically a sheet-like structure. The heat spreader 40 is connected to the middle plate 301 of the middle frame 300 and is used for heat conduction and dissipation.

[0081] In this embodiment, both chip 20 and semiconductor cooling component 30 are located within the receiving groove A. Chip 20 is connected to the first surface 111 of the second circuit board 11. It can be fixed and electrically connected to the second circuit board 11 by soldering. The notch 17 is opposite to chip 20 in the thickness direction of the circuit board assembly. The orthographic projection of chip 20 onto the second circuit board 11 is completely located within the orthographic projection of notch 17 onto the second circuit board 11, and the outer periphery of chip 20 is spaced apart from the outer periphery of notch 17. The first frame plate 13 and the wall surface inside notch 17 are the sidewalls of receiving groove A; the first frame plate 13 surrounds chip 20, which can shield chip 20 and ensure the stability of its function.

[0082] The semiconductor cooler 30 is a thermoelectric cooler with a cooling side 31 and a heat dissipation side 32, which are arranged opposite to each other along the thickness direction (Z-axis direction) of the semiconductor cooler 30. The semiconductor cooler 30 is stacked and connected to the surface of the chip 20. The cooling side 31 of the semiconductor cooler 30 is connected to the surface of the chip 20 through a first thermally conductive layer 191. The material of the first thermally conductive layer 191 can be a thermal interface material, such as thermally conductive gel, liquid metal, solder, Ag glue, etc. The first thermally conductive layer 191 can absorb the heat of the chip 20, assisting the semiconductor cooler 30 in heat dissipation and improving heat dissipation efficiency. In one embodiment, the area of ​​the orthographic projection of the semiconductor cooler 30 in the Z-axis direction is equal to or less than the area of ​​the orthographic projection of the chip 20 in the Z-axis direction.

[0083] The semiconductor cooling element 30 is electrically connected to the first circuit board 12 via a conductive part 34. The conductive part 34 can be a conductive spring, a conductive wire, or a connector, etc. The conductive part 34 extends beyond the side of the semiconductor cooling element 30 and extends to the outer surface of the first circuit board 12, and is connected by soldering or plugging. The side of the semiconductor cooling element 30 is close to the first circuit board 12, which facilitates the connection between the semiconductor cooling element 30 and the first circuit board 12 and does not occupy additional space.

[0084] The shielding component 18 in this embodiment has a cover-like structure, which can be understood as a shielding cover, including a cover plate 181 and a side plate 182. The side plate 182 is connected to the peripheral surface of the cover plate 181. The shielding component 18 is placed over the notch 17, and the side plate 182 is fixedly connected to the outer surface 122 of the first circuit board 12 by welding. The cover plate 181 is opposite to the notch 17. The shielding component 18 can shield the chip 20 and the thermoelectric cooler 30 in the receiving groove A. The surface of the cover plate 181 of the shielding component 18 facing the receiving groove A is connected and fixed to the heat dissipation side 32 of the thermoelectric cooler 30 through the second thermally conductive layer 192. The shielding component 18 can protect the chip 20 and the thermoelectric cooler 30, thereby strengthening them. At the same time, the shielding component 18 absorbs the heat transferred from the thermoelectric cooler 30, thereby achieving the purpose of heat conduction.

[0085] After the circuit board assembly is mounted on the middle frame 300, the shielding member 18, the first shielding cover 123, and the second shielding cover 124 all face the middle plate 301. The first shielding cover 123 and the second shielding cover 124 are opposite to the back surface 301b, and can be connected or have gaps. Part of the shielding member 18 is located in the clearance slot 303, which can reduce the size of the shielding member 18 in the thickness direction and save space in the thickness of the electronic device.

[0086] In this embodiment, the heat spreader 40 is stacked on the front side 301a of the middle plate and covers the clearance slot 303. The heat spreader 40 and the surface of the shield 18 facing away from the chip 20 are connected by a third thermally conductive layer 193. The shield 18 absorbs the heat from the semiconductor cooling component 30 and conducts the heat to the heat spreader 40 for heat dissipation.

[0087] The chip 20 generates a significant amount of heat during operation. The cooling side 31 of the semiconductor cooler 30 is connected to the chip 20, actively absorbing the heat generated during chip 20's operation and effectively cooling the chip 20. This constitutes active heat dissipation for the chip 20. The heat from the semiconductor cooler 30 is conducted away through the heat dissipation side 32. The semiconductor cooler 30 primarily utilizes the Peltier effect of semiconductor materials. When current flows through a circuit composed of different conductors, in addition to generating irreversible Joule heating, heat absorption and release phenomena occur at the junctions of different conductors depending on the direction of the current. This can be understood as the absorption and release of heat at the two ends of a thermocouple formed by two different semiconductor materials connected in series when direct current passes through them, achieving the purpose of cooling. The heat absorbed by the semiconductor cooler 30 from the chip 20 is transferred through the heat dissipation side 32, and then dissipated and cooled through the second thermally conductive layer 192, the shielding component 18, the third thermally conductive layer 193, and the heat spreader 40.

[0088] Compared to the passive heat dissipation of existing technologies through conductors such as heat sinks, the semiconductor cooling device 30 in this embodiment can dynamically adjust the cooling according to the heat generation of the chip 20, thereby actively reducing the chip junction temperature and effectively lowering the temperature of the chip 20. This ensures that the heat-generating chip 20 operates at a safe temperature and can meet the effective heat dissipation requirements of high-power-density chips. Moreover, compared to the air-cooling or liquid-cooling methods of existing technologies, the structure and assembly of the semiconductor cooling device 30 in this embodiment are relatively simple. The heat dissipation path to the chip 20 only needs to be transferred through the heat dissipation side of the semiconductor cooling device 30, such as the shielding component 18 and the heat spreader 40. There is no need to reserve space for air ducts and fans, which may reduce the area occupied by the internal space of the electronic device, save internal space, and facilitate the thinner design of the electronic device. The materials of the first thermally conductive layer 191, the second thermally conductive layer 192, and the third thermally conductive layer 193 can be thermal interface materials, such as thermally conductive gel, liquid metal, solder, Ag glue, etc.; the first thermally conductive layer 191, the second thermally conductive layer 192, and the third thermally conductive layer 193 can increase the heat transfer rate of the chip.

[0089] In one embodiment, along the thickness direction (Z-axis direction) of the electronic device, the thickness H1 of the chip 20 is less than the sum of the thickness H2 of the first frame plate 13 and the thickness H3 of the first circuit board 12. This can be understood as the thickness H1 of the chip 20 being less than the depth of the receiving groove A; thus, the circuit board assembly has sufficient space in the thickness direction (Z-axis direction) to accommodate the semiconductor cooling element 30, reducing the space occupied by the semiconductor cooling element 30 in the thickness direction and avoiding or reducing the thickness space of the electronic device. In one embodiment, the heat dissipation side 32 of the semiconductor cooling element 30 can be flush with the outer surface 122, reducing the height of the shielding element 18 protruding from the outer surface, thereby reducing the thickness space of the electronic device. In one embodiment, the semiconductor cooling element 30 protrudes from the outer surface 122 of the first circuit board 12, and the protrusion height is less than the protrusion height of the first shielding cover and the second shielding cover from the outer surface 122. The protrusion height of the semiconductor cooling element 30 is transferred to the shielding element 18, and the shielding element 18 extends into the clearance groove 303 of the middle frame, so the semiconductor cooling element 30 does not increase the overall thickness of the electronic device. In the example, the thickness of chip 20 is approximately 1.24 mm, the thickness of semiconductor cooling device 30 is 1.1 mm, the height of frame plate is 1.5 mm, the thickness of first circuit board 12 is 0.5 mm, the height of first shielding cover is 1.1 mm, and the final height of semiconductor cooling device 30 protruding from the outer surface 122 of first circuit board 12 is less than or equal to 0.2 mm.

[0090] Please see Figure 5 , Figure 5 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the second embodiment of the electronic device shown.

[0091] In this embodiment, unlike the embodiments described above, firstly, the thickness of the semiconductor cooling element 30, the thickness of the first thermally conductive layer 191, and the thickness of the chip 20 are different. The semiconductor cooling element 30 is electrically connected to the second frame plate. Secondly, the structure of the shielding element is different. Structures identical to those in the embodiments described above will not be elaborated upon further; please refer to the following description for details.

[0092] In this embodiment, the sum of the thickness of the semiconductor cooler 30, the thickness of the first thermally conductive layer 191, and the thickness of the chip 20 is less than the sum of the thickness H2 of the first frame plate 13 and the thickness H3 of the first circuit board 12, which is less than the depth of the receiving groove A. The chip 20 and the semiconductor cooler 30 are shielded by the first frame plate 13. The heat dissipation side 32 of the semiconductor cooler 30 is lower than the outer surface 122. The side of the semiconductor cooler 30 is close to the surface of the first frame plate 13.

[0093] In this embodiment, the first frame plate 13 includes a connecting surface 130, with a notch 17 exposed in part of the connecting surface 130. The conductive portion 34 of the semiconductor cooling element 30 is soldered to the connecting surface 130 of the first frame plate 13 and electrically connected to the first circuit board or the first circuit board 12 through the first frame plate 13. Since the semiconductor cooling element 30 is closer to the connecting surface 130 of the first frame plate 13 than the surface of the first circuit board 12, soldering the conductive portion 34 to the connecting surface 130 of the first frame plate 13 can shorten the connection path, facilitate processing, and save space.

[0094] In this embodiment, the shielding element 18 is a plate, which can be a copper foil or a metal sheet. The shielding element 18 is connected to the semiconductor cooling element 30 through the second thermally conductive layer 192 and covers the notch 17. The periphery of the shielding element 18 is connected to the outer surface 122 of the first circuit board 12. When the shielding element 18 can be a copper foil, the outer surface 122 of the first circuit board 12 is treated with copper leakage to bond and electrically conduct with the shielding element 18, thereby improving the shielding effect of the shielding element 18 on the chip 20 and the semiconductor cooling element 30.

[0095] The shielding component 18 is connected to the heat spreader 40 on the side facing away from the chip 20. The heat spreader 40 has a protrusion 41 in the area of ​​the clearance groove 303 facing the middle frame. The protrusion 41 extends into the clearance groove 303 and connects to the shielding component 18, which can be connected via a third thermally conductive layer. The heat dissipation path of the chip in this embodiment is the same as in the previous embodiment, and will not be described again here. In this embodiment, the chip can be shielded by the second frame plate, and combined with the shielding component, the shielding effect is improved. Moreover, the shielding cover directly uses the copper foil or metal plate of the board, eliminating the need for additional welding processes for the shielding cover, thus simplifying the manufacturing process.

[0096] Please see Figure 6 , Figure 6 forFigure 1 The diagram shows a partial cross-sectional view of the structure of a third embodiment of the electronic device. In this embodiment, unlike the second embodiment described above, the size of the thermoelectric cooler 30 is smaller than the size of the chip 20, as detailed below. The thermoelectric cooler 30 is connected to the surface of the chip 20 facing away from the second circuit board 11, and there is a distance between the periphery of the thermoelectric cooler 30 and the periphery of the chip 20. In the thickness direction of the electronic device, the orthographic projection of the thermoelectric cooler 30 is completely within the chip 20; that is, the area of ​​the thermoelectric cooler 30 is smaller than the area of ​​the chip 20. In this embodiment, the thermoelectric cooler 30 is connected to the heat-concentrating area of ​​the chip 20 through a first thermally conductive layer 191. When the chip 20 is operating at high frequencies, the heat in the heat-concentrating area of ​​the chip 20 will be relatively large. The thermoelectric cooler 30 can cool and dissipate heat in the heat-concentrating area, achieving a rapid cooling effect. Moreover, the second thermally conductive layer 192 can actively absorb the heat from the thermoelectric cooler 30 and other areas of the chip, which is beneficial for heat dissipation. Reducing the size of the thermoelectric cooler 30 can reduce the power consumption of the thermoelectric cooler without affecting the heat dissipation of the chip.

[0097] In this embodiment, the semiconductor cooler 30 and the shield 18 are connected by a second thermally conductive layer 192. In this embodiment, the second thermally conductive layer includes a groove 1921 recessed into the surface of the second thermally conductive layer 192 facing the chip 20. The side of the second thermally conductive layer 192 facing away from the shield 18 is connected to a first thermally conductive layer 191. The semiconductor cooler 30 is located within the groove 1921. The first thermally conductive layer 191 closes the opening of the groove 1921. The second thermally conductive layer 192 covers the outer peripheral surface of the semiconductor cooler 30 and the surface facing away from the chip 20. It can be understood that the second thermally conductive layer wraps around the outer surface of the semiconductor cooler 30. The second thermally conductive layer 192 can absorb heat from the first thermally conductive layer 191 and the semiconductor cooler 30, and transfer the heat to the shield 18; the second thermally conductive layer improves the heat dissipation effect of the chip 20 and the semiconductor cooler 30. The second thermally conductive layer 192 in this embodiment can be made of thermally conductive gel. Other structures in this embodiment are the same as in the second embodiment and will not be described in detail.

[0098] Please see Figure 7 , Figure 7 for Figure 1 This is a cross-sectional schematic diagram of a partial structure of a fourth embodiment of the electronic device shown. In this embodiment, [the structure is similar to...] Figure 6 The third embodiment differs in that thermally conductive adhesive is provided on the periphery of the chip 20, and a thermally conductive layer is provided between the chip 20 and the second frame plate. Details are as follows.

[0099] In this embodiment, the chip 20 is embedded within the first thermally conductive layer 191, which encloses the chip 20, except for the portion where the chip 20 connects to the second circuit board 11. Specifically, the first thermally conductive layer 191 surrounds the peripheral side of the chip 20 and covers the surface of the chip 20 facing the semiconductor cooling device 30, as well as a portion of the surface facing the second circuit board 11. The thickness of the first thermally conductive layer 191 in this embodiment is greater than that in the third embodiment.

[0100] The first thermally conductive layer 191 includes a peripheral side surface 1910, which connects to two surfaces along the thickness direction of the first thermally conductive layer 191. These two surfaces are respectively connected to the second circuit board 11, the second thermally conductive layer 192, and the semiconductor cooling device 30 embedded in the second thermally conductive layer 192. The area of ​​the second thermally conductive layer 192 is smaller than the area of ​​the first thermally conductive layer 191. The first thermally conductive layer 191 is connected to the second circuit board 11, and the peripheral side surface 1910 is spaced apart from the surface of the first frame plate 13 facing the chip 20. A metal thermally conductive layer 195 is connected between the peripheral side surface 1910 and the surface of the first frame plate 13 facing the chip 20; the metal thermally conductive layer 195 surrounds the peripheral side surface 1910. In this embodiment, the metal thermally conductive layer 195 is made of copper foil.

[0101] In this embodiment, the first thermally conductive layer 191 is formed using thermally conductive adhesive. When the heat generated by the chip 20 is low, the semiconductor cooling device 30 can remain inactive, reducing the power consumption of the electronic device. When the heat generated by the chip 20 is low, the heat is absorbed by the first thermally conductive layer 191 and transferred to the heat spreader 40 via the second thermally conductive layer 192 and the shielding member 18, achieving heat dissipation during the transfer process. Furthermore, the metal thermally conductive layer 195 connects the first thermally conductive layer 191 and the first frame plate 13. The heat absorbed by the first thermally conductive layer 191 from the chip 20 can be transferred to the first frame plate 13 for heat dissipation through the metal thermally conductive layer 195. The chip has multiple heat dissipation paths, and the first thermally conductive layer has a relatively large volume, thus effectively dissipating heat from the chip and reducing power consumption. Other structures and effects in this embodiment are the same as in the third embodiment and will not be described in detail.

[0102] Please see Figure 8a and Figure 8b , Figure 8a for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the fifth embodiment of the electronic device shown. Figure 8b for Figure 8a This is a top plan view of a partial structure of the fifth embodiment of the electronic device shown. In this embodiment, with... Figure 7 The fourth embodiment differs in that the semiconductor cooling element 30 is directly connected to the shielding element 18, and an auxiliary heat-conducting element 35 is provided around the semiconductor cooling element 30. Specific implementation details are as follows.

[0103] In this embodiment, an auxiliary heat-conducting element 35 is provided around the peripheral side 33 of the semiconductor cooler 30. The auxiliary heat-conducting element 35 is connected to the peripheral side 33 of the semiconductor cooler 30 through a heat insulation layer 353. The auxiliary heat-conducting element 35 is located within the notch 17 and spaced apart from the first circuit board 12. This heat insulation layer 353 typically does not have thermal conductivity. The two sides of the auxiliary heat-conducting element 35 in the thickness direction are flush with the cooling side 31 and the heat dissipation side 32 of the semiconductor cooler 30, respectively. It can be understood that the auxiliary heat-conducting element 35 and the semiconductor cooler 30 are a composite structure, with the semiconductor cooler 30 embedded inside the auxiliary heat-conducting element 35. After the auxiliary heat-conducting element 35 is connected to the semiconductor cooler 30, it is installed between the first heat-conducting layer 191 and the shielding element 18.

[0104] The surface of the auxiliary heat-conducting component 35 surrounding the heat dissipation side 32 is connected to the shielding component 18 via a second connecting layer (not shown). The connection can be made by thermally conductive adhesive, welding, or direct contact.

[0105] To achieve the desired cooling effect of the thermoelectric cooler 30, specifically a significant temperature difference between the cooling side 31 and the heat dissipation side 32, the thermal conductivity of the insulation layer 353 is less than or equal to 1 W / m·K. The auxiliary heat conductor 35 is made of copper and can dissipate and conduct heat from the first heat conductor layer 191. Because the insulation layer 353 has low thermal conductivity, it will not transfer heat to the thermoelectric cooler 30. Compared to the thermoelectric cooler 30, whose heat conduction direction is the thickness direction and circumferential direction, the copper auxiliary heat conductor 35 can further enhance the passive heat dissipation effect along the thickness (Z-axis) compared to thermally conductive gel. Even when the thermoelectric cooler 30 is not operating, the chip's heat can still be transferred through the first heat conductor layer 191 and the auxiliary heat conductor 35, achieving heat dissipation. Other structures and effects in this embodiment are the same as in the fourth embodiment and will not be repeated.

[0106] Please see Figure 9a and Figure 9b , Figure 9a for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the sixth embodiment of the electronic device shown. Figure 9b for Figure 9a This is a top plan view of a partial structure of the sixth embodiment of the electronic device shown. In this embodiment, it is related to... Figure 3 The difference in the first embodiment is the connection position between the shielding member 18 and the circuit board assembly. The specific implementation is as follows.

[0107] The first frame plate 13 forms an opening 131, and the first frame plate 13 includes a connecting surface 130 surrounding the opening 131. The width and length dimensions of the notch 17 of the first circuit board 12 are both greater than the length and width dimensions of the opening 131 formed by the first frame plate 13. The connecting surface 130 connects to the first circuit board 12, the opening 131 communicates with the notch 17, and a portion of the connecting surface 130 is exposed above the notch 17. It can be understood that the receiving groove A in this embodiment is a T-shaped groove.

[0108] The side plate 182 of the shielding component 18 is located within the receiving groove A, and the side plate 182 is fixedly connected to the connecting surface 130 of the first frame plate 13 by welding. The conductive part 34 of the semiconductor cooling component 30 is welded to the connecting surface 130 of the first frame plate 13, reducing the connection path. In this embodiment, the shielding component 18 is connected to the first frame plate 13, utilizing the thickness of the first circuit board 12, reducing the height of the shielding component 18 protruding from the first circuit board 12, and saving space in the thickness of the electronic device. The third thermal conductive layer 193 is located within the clearance groove 303 of the middle frame 300, thus saving overall space in the thickness of the electronic device.

[0109] In addition, in this embodiment, the first circuit board 12 has a U-shaped structure, such as... Figure 9b The notch on the first circuit board 12 is U-shaped, not a closed opening. The first frame board 13, however, is a closed opening, providing shielding for the chip 20.

[0110] Please see Figure 10 , Figure 10 for Figure 1 A cross-sectional schematic diagram of a partial structure of the seventh embodiment of the electronic device shown. In this embodiment, with... Figure 9a The sixth embodiment differs in that the shielding member 18 is directly connected to the second circuit board 11. Specific implementation details are as follows.

[0111] The shielding component 18 has a cover-like structure, which can be understood as a shielding cover, and includes a cover plate 181 and a side plate 182. The side plate 182 is connected to the peripheral surface of the cover plate 181. The side plate 182 of the shielding component 18 is located in the receiving groove A and is spaced apart from the first frame plate 13. The side plate 182 is fixedly connected to the first surface 111 of the second circuit board 11 by welding. The surface of the cover plate 181 facing away from the first circuit board 12 is flush with the surface of the first shielding cover 123 facing away from the first circuit board 12. The surface of the cover plate 181 of the shielding component 18 facing into the receiving groove A is connected and fixed to the heat dissipation side 32 of the thermoelectric cooler 30 through a second thermally conductive layer (not shown). The conductive part 34 of the thermoelectric cooler 30 is welded to the cover plate 181 and extends to the second circuit board 11 to achieve electrical connection. Alternatively, the conductive part 34 of the thermoelectric cooler 30 is connected to the first circuit board 12 through a conductive sheet or connector. The shielding component 18 can shield the chip 20 and the thermoelectric cooler 30 in the receiving groove A. The third thermal conductive layer 193 is located within the clearance slot 303 of the middle frame 300, and the shielding member 18 is located within the receiving slot A. The saved space can be used to increase the thickness of the third thermal conductive layer 193 to improve the heat dissipation speed of the heat dissipation side 32 of the semiconductor cooling device 30. It can also be used to reduce the overall thickness of the circuit board assembly 10 with the shielding member 18.

[0112] The shielding component 18 can protect the chip 20 and the thermoelectric cooler 30, thus providing a strengthening effect. Simultaneously, the shielding component 18 absorbs the heat transferred from the thermoelectric cooler 30, achieving both heat conduction and dissipation. Furthermore, since the shielding component 18 is installed within the receiving slot A, the overall thickness of the circuit board assembly is reduced, thereby minimizing the space occupied by the electronic device. Other structures and effects in this embodiment are the same as in the first embodiment and will not be described in detail.

[0113] Please see Figure 11 , Figure 11 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the eighth embodiment of the electronic device shown.

[0114] In this embodiment, with Figure 10 The seventh embodiment differs in that the shielding member 18 is connected to the second circuit board 11 via an electrical connection plate 196. Specifically, the circuit board assembly also includes the electrical connection plate 196, which is a U-shaped frame fixed to the first surface 111 of the second circuit board 11 and located within the receiving groove A. The electrical connection plate 196 is also a PCB circuit board with circuitry, enabling electrical communication with the second circuit board 11. The side plate 182 of the shielding member 18 is soldered to the end face of the electrical connection plate 196 facing away from the second circuit board 11, allowing the shielding member 18 and the electrical connection plate 196 to conduct electricity and achieve shielding. In this embodiment, the shielding cover is raised relative to the second circuit board 11 by the electrical connection plate 196, improving the connection stability of the shielding member 18.

[0115] The conductive part 34 of the semiconductor cooling component 30 is welded to the electrical connection plate 196. By adhering to the principle of proximity, the electrical connection path is reduced, thus saving space. Figure 10 and Figure 11 Both the first frame plate 13 and the first circuit board 12 can be U-shaped plates. Other structures and effects in this embodiment are the same as in the seventh embodiment, and will not be described again.

[0116] It should be noted that in the sixth, seventh, and eighth embodiments described above, the shielding member 18 extends into the circuit board assembly 10, saving space in the thickness direction and reducing the thickness of the electronic device. Alternatively, the space saved by the shielding member 18 can be used to increase the thickness of the third thermally conductive layer 193, with the third thermally conductive layer 193 extending into the clearance slot 303 of the middle frame; this can improve the thermal conductivity of the third thermally conductive layer 193 and accelerate the heat transfer rate between the shielding member 18 and the heat spreader 40.

[0117] exist Figure 6 , Figure 7 and Figure 8a The embodiment shown, in which auxiliary structures are added around the chip 20 or the semiconductor cooling device 30, can also be applied. Figure 4 , Figure 5 , Figure 9a , Figure 10 and Figure 11 In the embodiments described herein, no further explanation will be given. While the second and third thermally conductive layers are not fully shown in the accompanying drawings of some embodiments, connection and heat dissipation can actually be achieved through the second and third thermally conductive layers.

[0118] Please see Figure 12 , Figure 12 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the ninth embodiment of the electronic device shown.

[0119] The difference between this embodiment and the previous embodiment lies in the circuit board assembly structure and the heat dissipation method of the semiconductor cooling component 30 and the chip 20, as detailed in the following description. Components identical to those described above will not be repeated in this embodiment, such as the chip 20 and semiconductor cooling component 30, the circuit board type, and the middle frame 300 and heat spreader 40. Any differences are in the quantities. It should be noted that the heat spreader 40 described in this embodiment can be referred to as an auxiliary heat dissipation component, and the protrusion 41 can be referred to as a baffle.

[0120] In this embodiment, the circuit board assembly 10 includes a first circuit board 12 and a second circuit board (not shown). The second circuit board is an auxiliary circuit board for the electronic device, which can be understood as a sub-board, used to assist the camera, speaker, etc., in electrical connection with the second circuit board 11. That is, the second circuit board 11 and the second circuit board are two independent boards with only an electrical connection. The first circuit board 12 in this embodiment can also be called a circuit board, which includes an inner surface 121 and an outer surface 122. Multiple electronic devices are disposed on the outer surface 122. The chip 20 of the electronic device 1000 is connected to the outer surface 122.

[0121] The shielding component 18 has a dome-shaped structure, including a cover plate 181 and a side plate 182. The side plate 182 is connected to the peripheral surface of the cover plate 181. The cover plate 181 has a roughly "U"-shaped cross-section, including a first sub-cover plate 1811 and a second sub-cover plate 1812. The first sub-cover plate 1811 has an n-shaped cross-section and a clearance groove 1814. The second sub-cover plate 1812 is a rectangular closed annular sheet. The second sub-cover plate 1812 is connected to the outer periphery of the first sub-cover plate 1811 and surrounds the periphery of the opening of the clearance groove 1814. The side plate 182 is connected to the periphery of the second sub-cover plate 1812 away from the first sub-cover plate 1811. The shielding component 18 covers the chip 20 and some electronic components around the chip. The side plate 182 is fixedly connected to the outer surface 122 of the first circuit board 12 by welding, and the opening of the clearance groove 1814 faces the chip 20. It can be understood that the shielding member 18 in this embodiment has a larger width and length, which can shield electronic components around the chip that have little impact on the signal of the chip 20, such as resistors and capacitors, as can be seen from the previous embodiments. In other embodiments, the shielding member 18 may only shield the chip 20.

[0122] In this embodiment, the electronic device 1000 includes an auxiliary heat-conducting component 35 and a semiconductor cooling component 30. The semiconductor cooling component 30 in this embodiment has a ring-shaped structure. The auxiliary heat-conducting component 35 includes a body 351 and a stop 352. The body 351 includes a surface 3510, and the stop 352 protrudes from the center of the surface 3510. Specifically, the auxiliary heat-conducting component 35 is made of copper, and the body 351 is plate-shaped, with an area larger than that of the chip 20. The stop 352 is located between opposite sides of the body 351. The cooling side 31 of the semiconductor cooling component 30 is connected to the surface 3510 and fitted around the periphery of the stop 352. In one embodiment, the surface of the stop 352 facing away from the surface 3510 is flush with the heat dissipation side 32. In another embodiment, the surface of the stop 352 facing away from the surface 3510 and the heat dissipation side 32 may not be flush.

[0123] The auxiliary heat-conducting component 35 and the semiconductor cooling component 30 are mounted on the surface of the chip 20 facing away from the first circuit board. The surface of the body 351 facing away from the surface 3510 is connected to the chip 20 through the first heat-conducting layer 191. The block 352 is opposite to the chip 20, and in the thickness direction, the orthogonal projection of the chip 20 is completely located within the clearance groove 1814. The block 352 of the auxiliary heat-conducting component 35 and the semiconductor cooling component 30 are located within the clearance groove 1814 of the first sub-cover plate 1811. The body 351 is located at the opening of the clearance groove 1814. The surface of the block 352 facing away from the surface 3510 and the heat dissipation side 32 are connected to the surface of the first sub-cover plate 1811 facing away from the chip 20 through the second heat-conducting layer 192. The first sub-cover plate 1811 of the shielding component 18 extends partially or completely into the clearance groove 303 of the middle frame 300, and the outer surface of the first sub-cover plate 1811 is connected to the heat dissipation plate 40. In this embodiment, the heat spreader 40 is provided with a protrusion 41, and the first sub-cover plate 1811 is connected to the protrusion 41. The electrical connection of the semiconductor cooling component 30 can be made through the shield 18 or directly connected to the first circuit board, which will not be described in detail here.

[0124] Both the first thermally conductive layer 191 and the second thermally conductive layer 192 are thin plates, and their materials can be thermal interface materials, thermally conductive gels, liquid metals, solder, Ag glue, etc. The first thermally conductive layer 191 and the second thermally conductive layer 192 have thermal conductivity. The shielding component 18 can shield the chip 20 and the semiconductor cooling component 30 within the accommodating groove A. The shielding component 18 can protect the chip 20 and the semiconductor cooling component 30, providing a strengthening effect. Simultaneously, the shielding component 18 absorbs the heat transferred from the semiconductor cooling component 30, achieving the purpose of heat conduction.

[0125] In this embodiment, the first circuit board 12 is a single-layer circuit board. When the height of the heat-generating chip 20 is relatively limited, the semiconductor cooling component 30 can be placed above the chip 20 in conjunction with the auxiliary heat-conducting component 35 for heat dissipation. The semiconductor cooling component 30 and the baffle of the auxiliary heat-conducting component 35 can form a U-shaped structure. The auxiliary heat-conducting component 35 enhances the passive heat dissipation effect and does not absorb the heat from the heat dissipation side of the semiconductor cooling component 30. The semiconductor cooling component 30 can cool the body 351 below and quickly transfer the heat from the heat dissipation side 32 to the heat dissipation plate above for heat dissipation; thus improving heat dissipation efficiency.

[0126] In other embodiments, the two semiconductor cooling elements 30 may be two and located on both sides of the block, with the cooling side 31 connected to the surface 3510, and the two semiconductor cooling elements 30 located on opposite sides of the block 352.

[0127] In one embodiment, a bracket 125 is provided between the body 351 of the auxiliary heat-conducting component 35 and the first circuit board 12. The bracket 125 is connected to the body 351 to support the auxiliary heat-conducting component 35. This reduces the pressure on the chip 20 caused by the auxiliary heat-conducting component 35, the semiconductor cooling component, and the heat spreader. It also prevents external forces on the electronic device from being transferred to the chip 20 through the heat spreader, thus protecting the chip 20. Of course, if the size of the auxiliary heat-conducting component 35 is similar to the size of the chip, the bracket may not be necessary.

[0128] Please see Figure 13 , Figure 13 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the tenth embodiment of the electronic device shown.

[0129] This embodiment and Figure 12 The ninth embodiment differs from the first embodiment in that the structure of the shielding member 18 is different, and the auxiliary heat-conducting member 35 is omitted. The structure of the shielding member 18 is the same as that of the shielding member in the first embodiment, except that its volume is larger. Specifically, the shielding member 18 is a cover-shaped structure, which includes a cover plate 181 and a side plate 182. The side plate 182 is connected to the peripheral surface of the cover plate 181. Both the side plate 182 and the cover plate 181 are flat structures. The shielding member 18 covers the chip 20, and the side plate 182 is fixedly connected to the outer surface 122 of the first circuit board 12 by welding. In one embodiment, a bracket 125 is provided between the cover plate 181 and the first circuit board 12. The bracket 125 has an effect on the cover plate 181, which can avoid the pressure of the cover plate 181 on the chip 20, thereby achieving the purpose of protecting the chip.

[0130] The surface of the cover plate 181 facing away from the outer surface 122 is connected to the chip 20 through the first thermally conductive layer 191, and the semiconductor cooling component 30 is connected to the outer surface 122 of the cover plate 181 through the second thermally conductive layer 192. The semiconductor cooling component 30 has a ring structure. After the middle frame 300 and the heat sink 40 are assembled with the circuit board assembly, the semiconductor cooling component 30 surrounds the protrusion 41 of the heat sink 40 and is connected to the heat sink 40 through the third thermally conductive layer 193. The protrusion 41 enhances the passive heat dissipation effect and does not absorb heat from the heat dissipation side of the semiconductor cooling component 30. The semiconductor cooling component 30 can cool the cover plate 181 below and quickly transfer the heat from the heat dissipation side 32 to the heat sink 40 above for heat dissipation. Moreover, in this embodiment, the semiconductor cooling component 30 is located outside the shielding component 18, which can improve the heat dissipation efficiency of the heat dissipation side.

[0131] Please see Figure 14 , Figure 14 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the eleventh embodiment of the electronic device shown.

[0132] This embodiment and Figure 13Unlike the tenth embodiment, the chip 20 is externally wrapped with a thermally conductive colloid 197. The thermally conductive colloid 197 connects the cover plate 181, the outer surface 122 of the first circuit board 12, and the peripheral side surface of the support 125. The thermally conductive colloid 197 improves the heat dissipation rate of the chip 20 and accelerates the rate at which the semiconductor cooling device 30 transfers heat.

[0133] Please see Figure 15 , Figure 15 for Figure 1 A cross-sectional schematic diagram of a portion of the structure of the twelfth embodiment of the electronic device shown.

[0134] In this embodiment, the structure of the shielding member 18 is the same as that of the shielding member in the ninth embodiment. The shielding member 18 covers the chip 20 and some electronic components around the chip. The side plate 182 is fixedly connected to the outer surface 122 of the first circuit board 12 by welding. The slot of the clearance groove 1814 faces the chip 20. The first sub-cover plate 1811 is directly connected to the chip 20 through the first thermal conductive layer 191. The outer surface of the first sub-cover plate 1811 is connected to the heat spreader 40 through the third thermal conductive layer 193.

[0135] This embodiment also includes a motherboard bracket 305 and a heat spreader 306. Both the motherboard bracket 305 and the heat spreader 306 are cover-shaped structures. The heat spreader 306 covers the inner surface 121 of the first circuit board 12, and the heat spreader 306 and the side plate 182 are arranged opposite to each other on two sides of the first circuit board 12. The inner surface of the heat spreader 306 is connected to the semiconductor cooling element 30, which is spaced apart from the inner surface 121 of the first circuit board 12, with the cooling side of the semiconductor cooling element 30 facing the first circuit board 12. The semiconductor cooling element 30 completely covers the chip 20 in its orthogonal projection onto the first circuit board 12. A first thermally conductive layer 191 connects the semiconductor cooling element 30 and the inner surface 121 of the first circuit board 12. The heat from the chip can be dissipated through the shield 18, or it can be transferred through the first circuit board 12 and the first thermally conductive layer 191 to the cooling side of the semiconductor cooling element 30 for heat dissipation.

[0136] The motherboard bracket 305 is mounted on the outside of the heat spreader 306, and the motherboard bracket 305 and the heat spreader 306 are connected in the thickness direction. Heat from the thermoelectric cooler 30 is transferred to the motherboard bracket 305 through the heat spreader 306, and then dissipated from the motherboard bracket to the rear cover of the electronic device. The heat spreader 306 improves the heat dissipation rate of the thermoelectric cooler 30 and prevents heat concentration on the rear cover.

[0137] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An electronic device, characterized in that, Includes circuit board assemblies, heating elements, and semiconductor cooling components; The semiconductor cooling device includes a cooling side and a heat dissipation side, which are arranged opposite to each other along the thickness direction of the frame plate. The semiconductor cooling device is electrically connected to the circuit board assembly. The circuit board assembly includes a first circuit board, a second circuit board, and a frame board. The first circuit board includes an outer surface and an inner surface disposed opposite to the outer surface. The second circuit board includes a first surface and a second surface disposed opposite to the first surface. In the thickness direction of the frame board, the first circuit board and the second circuit board are stacked. The frame board is connected to the first surface and the inner surface. The frame board is electrically connected to the first circuit board and the second circuit board. The first circuit board also includes a notch penetrating the outer surface and the inner surface, the frame plate surrounding the periphery of the notch and forming a receiving groove with a portion of the first surface; The heating element is housed in the receiving groove, the heating element is fixed to the first surface and electrically connected to the first circuit board, the cooling side of the semiconductor cooling device is connected to the surface of the heating element facing away from the first surface, and the semiconductor cooling device is at least partially located in the receiving groove.

2. The electronic device according to claim 1, characterized in that, Along the thickness direction of the frame plate, the thickness of the heating element is less than the sum of the thicknesses of the frame plate and the first circuit board, and the height of the semiconductor cooling element protruding from the first surface is less than or equal to 0.2 mm.

3. The electronic device according to claim 1, characterized in that, The heat dissipation side of the semiconductor cooling device is flush with the outer surface, or, towards the first circuit board, the heat dissipation side is lower than the outer surface.

4. The electronic device according to claim 2 or 3, characterized in that, The electronic device further includes a shielding component, which includes a cover plate and a side plate. The side plate is connected to the peripheral surface of the cover plate and surrounds the cover plate. The shielding component covers the notch. The side plate is fixedly connected to the outer surface. The heat dissipation side of the semiconductor cooling device is connected to the surface of the cover plate facing the receiving groove. The electronic device further includes a mid-frame, a shield, and a heat spreader. The mid-frame has a front side, a back side opposite to the front side, and a clearance slot penetrating the front side and the back side. The heat spreader is stacked on the front side and covers the clearance slot. Along the thickness direction of the electronic device, the shield is partially located within the clearance slot. The cover plate is connected to the heat spreader and the heat dissipation side of the semiconductor cooling device through a thermally conductive layer.

5. The electronic device according to claim 3, characterized in that, The electronic device further includes a shielding component, which includes a cover plate and a side plate. The side plate is connected to the peripheral surface of the cover plate and surrounds the cover plate. The shielding component covers the heating element and the semiconductor cooling element. The shielding component is located in the receiving groove and is spaced apart from the frame plate. The heat dissipation side of the semiconductor cooling element is connected to the cover plate. The frame plate has a connecting surface that exposes the notch, and the side plate extends into the receiving groove and is fixed and electrically connected to the connecting surface of the frame plate; or, the side plate extends into the receiving groove and is fixed and electrically connected to the first surface of the second circuit board; or, the first surface in the receiving groove is connected to an electrical connecting plate surrounding the heating element, and the side plate extends into the receiving groove and is fixed and electrically connected to the electrical connecting plate.

6. The electronic device according to claim 5, characterized in that, The outer surface of the first circuit board is provided with a first shielding cover and a second shielding cover. The electronic device also includes a middle frame, a shielding component and a heat dissipation plate. The middle frame is provided with a front side and a back side that are opposite to the front side, as well as a clearance groove that passes through the front side and the back side. Along the thickness direction of the electronic device, the heat spreader is stacked on the front side, the circuit board assembly is located on the back side, the shielding member is opposite to the clearance slot, and the shielding member is connected to the heat spreader through a thermally conductive layer; The first shield and the second shield are connected to the back surface. Along the thickness direction of the electronic device, the height of the shield protruding from the outer surface is less than or equal to the height of the first shield and the second shield protruding from the outer surface.

7. The electronic device according to claim 2 or 3, characterized in that, The electronic device further includes a shielding component, which is a metal plate and covers the notch. The shielding component is fixedly connected to the outer surface at the periphery of the surface facing the receiving groove. The heat dissipation side of the semiconductor cooling component is connected to the surface of the shielding component facing the receiving groove.

8. The electronic device according to claim 5 or 7, characterized in that, The electronic device further includes a mid-frame, a shield, and a heat spreader. The mid-frame has a front side, a back side opposite to the front side, and a clearance groove passing through the front side and the back side. The surface of the heat spreader has protrusions. Along the thickness direction of the electronic device, the heat spreader is stacked on the front side, the circuit board assembly is located on the back side, the protrusions pass through the clearance groove, and the shield is connected to the protrusions of the heat spreader.

9. The electronic device according to claim 7, characterized in that, The semiconductor cooling device is located in the heat concentration area of ​​the heating element. The peripheral side and the heat dissipation side of the semiconductor cooling device are covered with a second thermally conductive layer. The surface of the heating element is covered with a first thermally conductive layer. The cooling side of the semiconductor cooling device and the second thermally conductive layer are connected to the first thermally conductive layer. The side of the second thermally conductive layer facing away from the heating element is connected to the shielding device.

10. The electronic device according to claim 7, characterized in that, The semiconductor cooling device is located in the heat concentration area of ​​the heating element. An auxiliary heat-conducting device is provided around the peripheral side of the semiconductor cooling device. The auxiliary heat-conducting device is connected to the peripheral side of the semiconductor cooling device through a heat insulation layer. The auxiliary heat-conducting device is spaced apart from the first circuit board. The two sides of the auxiliary heat-conducting device in the thickness direction are flush with the cooling side and the heat dissipation side of the semiconductor cooling device, respectively. The surface of the heating element is covered with a first heat-conducting layer. The auxiliary heat-conducting device, the heat insulation layer, and the semiconductor cooling device are connected to the first heat-conducting layer. A second heat-conducting layer is connected between the auxiliary heat-conducting device, the heat insulation layer, the semiconductor cooling device, and the shielding device.

11. The electronic device according to claim 9 or 10, characterized in that, The first thermally conductive layer surrounds the peripheral side of the heating element and covers the surface of the heating element facing the semiconductor cooling device. A metal thermally conductive layer is connected between the heating element and the surface of the frame plate facing the heating element, and the metal thermally conductive layer surrounds the peripheral side of the heating element.

12. The electronic device according to claim 7, characterized in that, The electronic device further includes a heat spreader, the cooling side of the semiconductor cooling element is connected to the heating element by a first thermally conductive layer, the heat dissipation side of the semiconductor cooling element is connected to the shielding element by a second thermally conductive layer, and the shielding element is connected to the heat spreader by a third thermally conductive layer.

13. The electronic device according to claim 2 or 3, characterized in that, The semiconductor cooling device includes a conductive portion, which is fixed and electrically connected to the outer surface of the first circuit board; or, the frame plate has a connecting surface exposing the notch, and the conductive portion is fixed and electrically connected to the connecting surface of the frame plate; or, the conductive portion is electrically connected to the first surface of the second circuit board.

14. An electronic device, characterized in that, It includes a circuit board, a heating element, a semiconductor cooling component, an auxiliary heat-conducting component, and a shielding component; the circuit board includes an outer surface and an inner surface facing away from the outer surface; the auxiliary heat-conducting component includes a baffle. The semiconductor cooling device includes a cooling side and a heat dissipation side, which are arranged opposite to each other along the thickness direction of the frame plate. The semiconductor cooling device is electrically connected to the circuit board. The heating element is connected to the outer surface, the shielding member covers the heating element, the semiconductor cooling element surrounds the block, and the block is connected to the shielding member; The auxiliary heat-conducting component is connected to the surface of the heating element facing away from the outer surface, and the cooling side and the heat dissipation side are respectively connected to the auxiliary heat-conducting component and the shielding component; Alternatively, the shielding component is connected to the surface of the heating element facing away from the outer surface, and the cooling side and the heat dissipation side are respectively connected to the shielding component and the auxiliary heat-conducting component.

15. The electronic device according to claim 14, characterized in that, The shielding component is connected to the surface of the heating element that faces away from the outer surface, and a bracket is connected between the shielding component and the outer surface, the bracket surrounding the heating element.

16. The electronic device according to claim 15, characterized in that, The heating element is wrapped with a thermally conductive colloid, which connects the shield, the outer surface, and the bracket.

17. An electronic device, characterized in that, It includes a mid-frame, circuit board, heating element, semiconductor cooling component, heat spreader, and shielding component; the circuit board includes an outer surface and an inner surface facing away from the outer surface. The heating element is connected to the outer surface, and the shielding member is covered on the heating element and fixedly connected to the outer surface. In the thickness direction of the electronic device, the heat dissipation side of the semiconductor cooling element is connected to the surface of the cover plate facing the receiving groove. The semiconductor cooling device includes a cooling side and a heat dissipation side, which are arranged opposite to each other along the thickness direction of the frame plate. The semiconductor cooling device is electrically connected to the circuit board. The cooling side is connected to the back side through a thermally conductive layer. A heat spreader is placed over the semiconductor cooling device and connected to the back side. The heat dissipation side of the semiconductor cooling device is connected to the heat spreader.

18. The electronic device according to claim 17, characterized in that, The middle frame is provided with a clearance slot, the circuit board is connected to one side of the middle frame, the shielding part is located in the clearance slot, and a heat dissipation plate is provided on the side of the middle frame facing away from the circuit board. The heat dissipation plate and the shielding part are connected through a heat-conducting layer.

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