A temperature compensation heat dissipation device for electronic instruments

Abstract

This invention relates to the field of temperature compensation technology and discloses a temperature compensation and heat dissipation device for electronic instruments. The device includes a second fixed plate, a first heat-absorbing plate fixedly connected to one side of the top of the second fixed plate, a second heat-absorbing plate fixedly connected to one side of the first heat-absorbing plate, a fifth fixed block slidably connected to one side of the second heat-absorbing plate, an adjustment mechanism externally provided on the fifth fixed block, a second heat-conducting pipe movably connected to one side of the second heat-absorbing plate, and a fixed connection between the second heat-conducting pipe and the fifth fixed block. The second fixed block is fixedly connected to the top of the second fixed plate, and a cooling mechanism is externally provided on the second fixed block. This technical solution solves the problem in the prior art where electronic instruments easily generate a lot of heat, requiring cooling, but the heat-conducting pipe is generally fixed and difficult to adjust according to the size of different electronic instruments.

Description

Technical Field

[0001] This invention relates to the field of temperature compensation technology, specifically to a temperature compensation and heat dissipation device for electronic instruments and meters. Background Technology

[0002] Electronic instruments and meters refer to instruments and equipment that utilize electronic technology to measure, display, record, and control various physical quantities. They are widely used in various fields such as industrial production, scientific research, healthcare, and environmental monitoring. Electronic instruments and meters typically include various sensors, signal processors, displays, data acquisition units, controllers, and other components, which enable accurate measurement and control of the measured physical quantities. The development of electronic instruments and meters has achieved a transition from analog to digital, and the application of digital technology has greatly improved the accuracy, stability, and reliability of instruments and meters. Modern electronic instruments and meters are characterized by multifunctionality, intelligence, and networking, enabling remote monitoring, data storage, and automatic alarm functions, greatly facilitating user operation and maintenance. Electronic instruments and meters play a crucial role in industrial production; they not only improve production efficiency and reduce costs but also ensure product quality and safety. With the continuous development of technology, the functions and performance of electronic instruments and meters will continue to improve, bringing more convenience and innovation to various industries.

[0003] Currently, in existing technologies, electronic instruments and meters tend to generate a lot of heat when in use, requiring cooling. However, heat pipes are generally fixed and difficult to adjust according to the size of different electronic instruments and meters. Therefore, this invention proposes a temperature compensation and heat dissipation device for electronic instruments and meters. Summary of the Invention

[0004] In view of the shortcomings of existing technologies, when using electronic instruments and meters, electronic instruments and meters tend to generate a lot of heat and require cooling treatment. However, heat pipes are generally fixed and difficult to adjust according to the size of different electronic instruments and meters. This invention provides a temperature compensation and heat dissipation device for electronic instruments and meters, which has the advantage of being able to adjust the heat pipe according to different instruments and meters.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A temperature compensation and heat dissipation device for electronic instruments includes a second fixed plate. A first heat-absorbing plate is fixedly connected to one side of the top of the second fixed plate. A second heat-absorbing plate is fixedly connected to one side of the first heat-absorbing plate. A fifth fixed block is slidably connected to one side of the second heat-absorbing plate. An adjustment mechanism is provided on the outside of the fifth fixed block. The adjustment mechanism includes a groove, a third fixed rod, a fourth fixed rod, a first spring, and a fourth fixed block. A second heat-conducting pipe is movably connected to one side of the second heat-absorbing plate. The second heat-conducting pipe and the fifth fixed block are fixedly connected. A second fixed block is fixedly connected to the top of the second fixed plate. A cooling mechanism is provided on the outside of the second fixed block. The cooling mechanism includes a motor, a turntable, a first fixed rod, a threaded rod, a third fixed block, and a first fixed block.

[0006] Preferably, the adjusting mechanism includes the groove formed on one side of the second heat-absorbing plate, the third fixing rod and the fourth fixing block being fixedly connected, the fourth fixing rod being fixedly connected to one side of the fifth fixing block, the fourth fixing rod and the fourth fixing block being slidably connected, the first spring being sleeved on the outer wall of the fourth fixing rod, and one side of the first spring being fixedly connected to the fourth fixing block.

[0007] Preferably, the cooling mechanism includes a motor fixedly connected to one side of the top of the second fixing plate, a threaded rod installed at the output end of the motor, a rotatable connection between the turntable and the second fixing block, one side of the first fixing rod fixedly connected to the turntable, the side of the first fixing rod away from the turntable fixedly connected to the third fixing block, one side of the threaded rod rotatably connected to the inside of the turntable, the side of the threaded rod away from the turntable rotatably connected to the third fixing block, and a threaded connection between the first fixing block and the threaded rod.

[0008] Preferably, a heat dissipation plate is fixedly connected to one side of the second fixing plate, and a first heat conduction pipe is fixedly connected to one side of the heat dissipation plate. The first heat conduction pipe and the second heat conduction pipe are fixedly connected.

[0009] Preferably, a third fixing plate is fixedly connected to one side of the first heat-absorbing plate, a second fixing rod is rotatably connected to the third fixing plate on the side away from the first heat-absorbing plate, and a first fixing plate is fixedly connected to the side of the first heat-absorbing plate away from the third fixing plate.

[0010] Preferably, a No. 6 fixing block is fixedly connected to one side of the No. 1 fixing plate, a No. 5 fixing rod is slidably connected inside the No. 6 fixing block, a No. 2 handle is fixedly connected to one side of the No. 5 fixing rod, a No. 2 spring is sleeved on the outer wall of the No. 5 fixing rod, one side of the No. 2 spring is fixedly connected to the No. 6 fixing block, and a No. 7 fixing block is fixedly connected to the side of the No. 2 spring away from the No. 6 fixing block. The No. 7 fixing block and the No. 5 fixing rod are fixedly connected.

[0011] Preferably, a fan is rotatably connected to one side of the first fixing block, a handle is fixedly connected to one side of the fourth fixing rod, and the first handle and the side of the first spring away from the fourth fixing block are fixedly connected.

[0012] Preferably, the size of the groove opening is adapted to the size of the third fixing rod, and the number of grooves is multiple and evenly distributed.

[0013] Preferably, a third heat pipe is movably connected to one side of the second heat pipe, and the third heat pipe and the heat sink are fixedly connected.

[0014] Beneficial effects: By using an adjustment mechanism, pulling the third fixing rod can move the fourth fixing block, which in turn moves the fifth fixing block. The movement of the fifth fixing block then adjusts the second heat pipe, allowing the heat pipes to be evenly distributed for better heat dissipation. Attached Figure Description

[0015] Figure 1 This is a first overall schematic diagram of a temperature compensation and heat dissipation device for electronic instruments and meters according to the present invention; Figure 2 This is a schematic diagram of the first part of a temperature compensation and heat dissipation device for electronic instruments and meters according to the present invention. Figure 3 This is a schematic diagram of the second part of a temperature compensation and heat dissipation device for electronic instruments and meters according to the present invention; Figure 4 This is a schematic diagram of the second part of a temperature compensation and heat dissipation device for electronic instruments and meters according to the present invention; Figure 5 for Figure 3 Enlarged diagram of A in the middle; Figure 6 for Figure 4 Enlarged diagram of B in the diagram.

[0016] In the diagram: 1. Heat sink; 2. Fan; 3. Fixing plate 1; 4. Fixing plate 2; 5. Fixing block 1; 6. Fixing rod 1; 7. Turntable; 8. Fixing block 2; 9. Motor; 10. Threaded rod; 11. Fixing block 3; 12. Fixing plate 3; 13. Heat pipe 1; 14. Heat absorber plate 1; 15. Fixing rod 2; 16. Heat pipe 2; 17. Groove; 18. Fixing rod 3; 19. Heat pipe 3; 20. Handle 1; 21. Fixing rod 4; 22. Spring 1; 23. Fixing block 4; 24. Fixing block 5; 25. Handle 2; 26. Fixing rod 5; 27. Fixing block 6; 28. Fixing block 7; 29. ​​Spring 2; 30. Heat absorber plate 2. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Example 1 Please see Figure 1-6 A temperature compensation and heat dissipation device for electronic instruments includes a second fixed plate 4. A first heat-absorbing plate 14 is fixedly connected to one side of the top of the second fixed plate 4. A second heat-absorbing plate 30 is fixedly connected to one side of the first heat-absorbing plate 14. A fifth fixed block 24 is slidably connected to one side of the second heat-absorbing plate 30. An adjustment mechanism is provided on the outside of the fifth fixed block 24. The adjustment mechanism includes a groove 17, a third fixed rod 18, a fourth fixed rod 21, a first spring 22, and a fourth fixed block 23. A second heat-conducting pipe 16 is movably connected to one side of the second heat-absorbing plate 30. The second heat-conducting pipe 16 and the fifth fixed block 24 are fixedly connected. A second fixed block 8 is fixedly connected to the top of the second fixed plate 4. A cooling mechanism is provided on the outside of the second fixed block 8. The cooling mechanism includes a motor 9, a turntable 7, a first fixed rod 6, a threaded rod 10, a third fixed block 11, and a first fixed block 5.

[0019] Working principle: When a temperature compensation and heat dissipation device for electronic instruments is needed, pull handle 25 (number two) to move fixing rod 26 (number five) until it is completely removed from fixing rod 15 (number two). Stop pulling handle 25, allowing fixing rod 15 to rotate. Place the electronic instrument into heat absorption plate 14 (number one) and secure it with fixing rod 15. Slowly release handle 25, allowing it to move fixing rod 26, which then secures fixing rod 15. Pull fixing rod 18 (number three) until fixing rod 18 is fully extended. The fixed rod 18 is completely removed from the groove 17, allowing the third fixed rod 18 to move the fourth fixed block 23, which in turn allows the fifth fixed block 24 to move the second heat pipe 16, adjusting it to a suitable position. The third fixed rod 18 is then slowly released, allowing it to be inserted into the corresponding groove 17, enabling better heat dissipation for the electronic instruments. The motor 9 is then started, causing the threaded rod 10 to rotate, which in turn causes the first fixed block 5 to rotate up and down, thereby enabling the fan 2 to rotate up and down for better overall heat dissipation.

[0020] Example 2 Please see Figure 1-6Further, based on Embodiment 1, the adjustment mechanism includes a groove 17 formed on one side of the second heat-absorbing plate 30, a fixed connection between the third fixing rod 18 and the fourth fixing block 23, a fixed connection between the fourth fixing rod 21 and one side of the fifth fixing block 24, a sliding connection between the fourth fixing rod 21 and the fourth fixing block 23, a first spring 22 sleeved on the outer wall of the fourth fixing rod 21, and a fixed connection between one side of the first spring 22 and the fourth fixing block 23; the cooling mechanism includes a motor 9 fixedly connected to one side of the top of the second fixing plate 4, and a threaded rod 10 installed at the output end of the motor 9. Turntable 7 and No. 2 fixing block 8 are rotatably connected. One side of No. 1 fixing rod 6 is fixedly connected to turntable 7. The side of No. 1 fixing rod 6 away from turntable 7 is fixedly connected to No. 3 fixing block 11. One side of threaded rod 10 is rotatably connected to the inside of turntable 7. The side of threaded rod 10 away from turntable 7 is rotatably connected to No. 3 fixing block 11. No. 1 fixing block 5 and threaded rod 10 are threadedly connected. A heat dissipation plate 1 is fixedly connected to one side of No. 2 fixing plate 4. A heat conduction pipe 13 is fixedly connected to one side of heat dissipation plate 1. The heat conduction pipe 13 and the heat conduction pipe 16 are fixedly connected. No. 1 heat absorption plate 14 One side of the first heat absorber plate 14 is fixedly connected to a No. 3 fixing plate 12. A No. 2 fixing rod 15 is rotatably connected to the side of the No. 3 fixing plate 12 away from the No. 1 heat absorber plate 14. A No. 1 fixing plate 3 is fixedly connected to the side of the No. 1 fixing plate 14 away from the No. 3 fixing plate 12. A No. 6 fixing block 27 is fixedly connected to one side of the No. 1 fixing plate 3. A No. 5 fixing rod 26 is slidably connected inside the No. 6 fixing block 27. A No. 2 handle 25 is fixedly connected to one side of the No. 5 fixing rod 26. A No. 2 spring 29 is sleeved on the outer wall of the No. 5 fixing rod 26. One side of the No. 2 spring 29 is fixedly connected to the No. 6 fixing block 27. The No. 2 spring 29 is located away from the No. 6 fixing plate 14. Fixed block 27 is fixedly connected to fixed block 28 on one side, and fixed block 28 is fixedly connected to fixed rod 26 on the other side; fan 2 is rotatably connected to fixed block 5 on one side, and handle 20 is fixedly connected to fixed rod 21 on one side, and handle 20 is fixedly connected to spring 22 on the side away from fixed block 23 on the other side; the size of the opening of groove 17 is compatible with the size of fixed rod 18 on the third side, and there are multiple sets of grooves 17 that are evenly distributed; heat pipe 19 is movably connected to heat pipe 16 on one side, and heat pipe 19 is fixedly connected to heat sink 1.

[0021] The heat dissipation equipment of this device was tested as follows: 1. Test object: Analog electronic instrument (adjustable heating module, maximum heating power 100W); Heat dissipation device: 2. Adjustment mechanism: The spacing between the heat pipes is adjustable from 5-20mm (achieved through groove 17 and fixing rod 18). 3. Cooling mechanism: Fan speed has three settings (low 1000rpm, medium 2000rpm, high 3000rpm).

[0022] 4. The temperature data of the instrument surface (No. 1 heat absorption plate 14), No. 2 heat conduction pipe 16, and heat sink 1 are collected by an infrared temperature sensor (accuracy ±0.5℃), with a sampling frequency of 1 time / second.

[0023] A total of 5 experimental groups were designed, as shown in Table 1 below: Table 1 Follow these steps to conduct the experiment: 1. Fix the heating module to the first heat absorption plate 14 and connect the heat pipes (second heat pipe 16 and third heat pipe 19).

[0024] 2. Adjust the spacing of the heat pipes according to the working conditions (select the position of groove 17 by pulling the third fixing rod 18), start the fan and set the speed.

[0025] 3. Turn on the heating module and record the temperature changes of the instrument surface, heat pipe, and heat sink over time until the temperature stabilizes (fluctuation ≤ 0.5℃).

[0026] 4. Each experiment was repeated 3 times, and the average value was taken to reduce error.

[0027] The basic heat dissipation performance test data based on Group 1 are shown in the table below: Table 2 Based on Table 2, it can be concluded that under an environment of 25℃ and a load of 50W, the device reaches thermal equilibrium within 30 minutes, and the stable surface temperature of the instrument is 48.7℃. The heat dissipation efficiency is better than that of the traditional fixed heat pipe device (the stable temperature of the traditional solution is about 55℃).

[0028] The test data for the adjustment mechanism effect based on Group 2 are shown in the table below: Table 3 Based on Table 3, it can be concluded that the smaller the spacing between heat pipes, the higher the heat dissipation efficiency (the temperature decreases by 3.6℃ and the time is shortened by 6 minutes when the heat pipes are densely distributed). This verifies that the adjustment mechanism can improve the heat dissipation effect by optimizing the heat pipe layout.

[0029] The high-load and high-temperature environment test data based on groups 3 and 4 are shown in the table below: Table 4 Based on Table 4, it can be concluded that the device can still control the temperature within a safe range under extreme operating conditions (electronic components typically withstand temperatures ≤70℃), indicating its strong environmental adaptability.

[0030] The test data on the impact of fan speed on group 5 are shown in the table below: Table 5 Based on Table 5, we can conclude that fan speed is positively correlated with heat dissipation efficiency, and the temperature drop rate increases by 100% at high speeds, indicating that the cooling mechanism plays an important role in rapid cooling.

[0031] In summary, by adjusting the spacing of the heat pipes, the heat dissipation layout can be optimized for instruments of different sizes. When densely distributed, the heat dissipation efficiency is improved by about 7.4%. The fan speed directly affects the heat dissipation rate. At high speeds, the thermal equilibrium time can be significantly shortened and the stable temperature can be reduced. The device can still effectively dissipate heat in high temperature (45℃) and high load (100W) scenarios, meeting the needs of industrial applications.

[0032] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A temperature compensation and heat dissipation device for electronic instruments, comprising a second fixing plate (4), characterized in that: A first heat-absorbing plate (14) is fixedly connected to one side of the top of the second fixed plate (4). A second heat-absorbing plate (30) is fixedly connected to one side of the first heat-absorbing plate (14). A fifth fixed block (24) is slidably connected to one side of the second heat-absorbing plate (30). An adjustment mechanism is provided on the outside of the fifth fixed block (24). The adjustment mechanism includes a groove (17), a third fixed rod (18), a fourth fixed rod (21), a first spring (22), and a fourth fixed block (23). A second heat-conducting pipe (16) is movably connected to one side of the second heat-absorbing plate (30). The second heat-conducting pipe (16) and the fifth fixing block (24) are fixedly connected. A second fixing block (8) is fixedly connected to the top of the second fixing plate (4). A cooling mechanism is provided on the outside of the second fixing block (8). The cooling mechanism includes the motor (9), turntable (7), first fixing rod (6), threaded rod (10), third fixing block (11) and first fixing block (5).

2. The temperature compensation and heat dissipation device for electronic instruments and meters according to claim 1, characterized in that: The adjustment mechanism includes the groove (17) formed on one side of the second heat absorption plate (30), the third fixing rod (18) and the fourth fixing block (23) fixedly connected, the fourth fixing rod (21) fixedly connected on one side of the fifth fixing block (24), the fourth fixing rod (21) and the fourth fixing block (23) slidably connected, the first spring (22) sleeved on the outer wall of the fourth fixing rod (21), and one side of the first spring (22) fixedly connected to the fourth fixing block (23).

3. A temperature compensation and heat dissipation device for electronic instruments and meters according to claim 2, characterized in that: The cooling mechanism includes a motor (9) fixedly connected to one side of the top of the second fixing plate (4), a threaded rod (10) installed at the end of the output end of the motor (9), a turntable (7) and the second fixing block (8) rotatably connected, one side of the first fixing rod (6) fixedly connected to the turntable (7), the side of the first fixing rod (6) away from the turntable (7) and the third fixing block (11) fixedly connected, one side of the threaded rod (10) rotatably connected to the inside of the turntable (7), the side of the threaded rod (10) away from the turntable (7) and the third fixing block (11) rotatably connected, and the first fixing block (5) and the threaded rod (10) threadedly connected.

4. A temperature compensation and heat dissipation device for electronic instruments and meters according to claim 3, characterized in that: A heat sink (1) is fixedly connected to one side of the second fixing plate (4), and a first heat pipe (13) is fixedly connected to one side of the heat sink (1). The first heat pipe (13) and the second heat pipe (16) are fixedly connected.

5. A temperature compensation and heat dissipation device for electronic instruments and meters according to claim 4, characterized in that: A third fixing plate (12) is fixedly connected to one side of the first heat-absorbing plate (14). A second fixing rod (15) is rotatably connected to the side of the third fixing plate (12) away from the first heat-absorbing plate (14). A first fixing plate (3) is fixedly connected to the side of the first heat-absorbing plate (14) away from the third fixing plate (12).

6. A temperature compensation and heat dissipation device for electronic instruments and meters according to claim 5, characterized in that: A No. 6 fixing block (27) is fixedly connected to one side of the No. 1 fixing plate (3). A No. 5 fixing rod (26) is slidably connected inside the No. 6 fixing block (27). A No. 2 handle (25) is fixedly connected to one side of the No. 5 fixing rod (26). A No. 2 spring (29) is sleeved on the outer wall of the No. 5 fixing rod (26). One side of the No. 2 spring (29) is fixedly connected to the No. 6 fixing block (27). A No. 7 fixing block (28) is fixedly connected to the side of the No. 2 spring (29) away from the No. 6 fixing block (27). The No. 7 fixing block (28) and the No. 5 fixing rod (26) are fixedly connected.

7. A temperature compensation and heat dissipation device for electronic instruments and meters according to claim 6, characterized in that: A fan (2) is rotatably connected to one side of the first fixing block (5), and a handle (20) is fixedly connected to one side of the fourth fixing rod (21). The handle (20) and the spring (22) are fixedly connected to each other on the side away from the fourth fixing block (23).

8. A temperature compensation and heat dissipation device for electronic instruments and meters according to claim 7, characterized in that: The size of the opening of the groove (17) is adapted to the size of the third fixing rod (18), and the number of the grooves (17) is multiple and evenly distributed.

9. A temperature compensation and heat dissipation device for electronic instruments and meters according to claim 8, characterized in that: A third heat pipe (19) is movably connected to one side of the second heat pipe (16), and the third heat pipe (19) and the heat sink (1) are fixedly connected.

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