Substrate transport method, device, apparatus, storage medium, and product

Abstract

This application discloses a substrate transportation method, apparatus, device, storage medium, and product, relating to the field of circuit board technology. The substrate transportation method includes: when a substrate to be produced is transported to a preset placement area, controlling a first support structure of the preset placement area to descend, so that the substrate to be produced is placed in a TRAY tray below the substrate to be produced, obtaining a target TRAY tray containing the substrate to be produced; clamping the target TRAY tray to a preset separation area using a clamping device; separating the substrate to be produced from the target TRAY tray in the preset separation area; and transporting the separated substrate to be produced to a production line. This application does not require suction cups for picking up the substrate, and the TRAY tray can avoid the risk of the substrate falling.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to a method, apparatus, device, storage medium and product for transporting a substrate. Background Technology

[0002] In related technologies, high-density interconnect circuit boards (HDI) have gradually adopted production processes of level 6 or higher, with the number of layers even reaching more than 70. The transportation of the above-mentioned circuit board substrates is often carried out by suction cups. As the number of layers increases, the board thickness increases, the weight increases, and the probability of the substrate falling off increases. Summary of the Invention

[0003] The main objective of this application is to provide a substrate transportation method, apparatus, device, storage medium, and product, which aims to solve the technical problem that increasing the number of layers, board thickness, and weight will increase the probability of the substrate falling off.

[0004] To achieve the above objectives, this application proposes a substrate transportation method, the substrate transportation method comprising: When the substrate to be produced is transported to the preset placement area, the first support structure of the preset placement area is controlled to descend so that the substrate to be produced is placed in the TRAY tray below the substrate to be produced, and a target TRAY tray containing the substrate to be produced is obtained. The target TRAY disk is clamped by a clamping device to a preset separation area. In the preset separation area, the substrate to be produced in the target TRAY disk is separated, and the separated substrate to be produced is transported to the production line.

[0005] In one embodiment, the first support structure includes a predetermined first number of retractable first support columns, which are used to support the substrate to be produced and keep the substrate to be produced horizontal during descent.

[0006] In one embodiment, the support column is rotatable and is used to rotate the substrate to be produced until it is parallel to the TRAY disk.

[0007] In one embodiment, the step of clamping the target TRAY disc to a preset separation area using a clamping device includes: A target clamping force is applied to a preset position of the target TRAY disk by a clamping device, and the target TRAY disk is clamped to a preset separation area based on the target clamping force, wherein the target clamping force is positively correlated with the thickness of the substrate to be produced.

[0008] In one embodiment, the step of separating the substrate to be manufactured in the target TRAY disk in the preset separation area includes: The second support structure in the preset separation area rises until the substrate to be produced in the target TRAY disk separates from the target TRAY disk.

[0009] In one embodiment, the second support structure includes a preset second number of retractable second support columns, the second support columns including a third support column and a fourth support column, the fourth support column rising after the third support column rises to a preset distance.

[0010] Furthermore, to achieve the above objectives, this application also proposes a substrate transport device, the substrate transport device comprising: The placement module is used to control the first support structure of the preset placement area to descend when the substrate to be produced is transported to the preset placement area, so that the substrate to be produced is placed in the TRAY tray below the substrate to be produced, thereby obtaining a target TRAY tray containing the substrate to be produced. The separation module is used to clamp the target TRAY disk to a preset separation area using a clamping device, separate the substrate to be produced in the target TRAY disk in the preset separation area, and transport the separated substrate to be produced to the production line.

[0011] In addition, to achieve the above objectives, this application also proposes a substrate transport device, the device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the substrate transport method as described above.

[0012] In addition, to achieve the above objectives, this application also proposes a storage medium, which is a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the steps of the substrate transport method described above.

[0013] In addition, to achieve the above objectives, this application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the steps of the substrate transport method described above.

[0014] One or more technical solutions proposed in this application have at least the following technical effects: In related technologies, high-density interconnect (HDI) circuit boards have gradually adopted manufacturing processes of level 6 or higher, with the number of layers reaching or even exceeding 70 layers. The transport of these circuit board substrates often employs suction cups. However, due to the increased number of layers, the board thickness and weight increase, raising the probability of the substrate falling off. In contrast, this application, when the substrate to be produced is transported to a preset placement area, controls the first support structure of the preset placement area to descend, so that the substrate to be produced is placed in a TRAY tray below it, resulting in a target TRAY tray containing the substrate to be produced. A clamping device then clamps the target TRAY tray to a preset separation area, where the substrate to be produced is separated from the target TRAY tray, and the separated substrate is then transported to the production line. This application lowers the substrate to be produced, which is transferred to a preset placement area, into a TRAY tray below the substrate through a first support structure. The target TRAY tray containing the substrate is clamped by a clamping device and moved to a preset separation area. The separated substrate is then transferred to the production line. No suction cup is needed to pick it up, and the risk of the substrate falling can be avoided by using the TRAY tray. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic flowchart of an embodiment of the substrate transportation method of this application; Figure 2 This is a schematic diagram of the module structure of the substrate transport device according to an embodiment of this application; Figure 3 This is a schematic diagram of the equipment structure of the hardware operating environment involved in the substrate transportation method in the embodiments of this application.

[0018] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0020] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0021] The main solution of this application embodiment is as follows: when the substrate to be produced is transferred to a preset placement area, the first support structure of the preset placement area is controlled to descend so that the substrate to be produced is placed in a TRAY tray below the substrate to be produced, thereby obtaining a target TRAY tray containing the substrate to be produced; the target TRAY tray is clamped to a preset separation area by a clamping device, and the substrate to be produced in the target TRAY tray is separated in the preset separation area, and the separated substrate to be produced is transferred to the production line.

[0022] In related technologies, high-density interconnect circuit boards (HDI) have gradually adopted production processes of level 6 or higher, with the number of layers reaching more than 70. The transportation of the above-mentioned circuit board substrates is often carried out by suction cups. As the number of layers increases, the board thickness increases, the weight increases, and the probability of the substrate falling off increases.

[0023] This application lowers the substrate to be produced, which is transferred to a preset placement area, into a TRAY tray below the substrate through a first support structure. The target TRAY tray containing the substrate is clamped by a clamping device and moved to a preset separation area. The separated substrate is then transferred to the production line. No suction cup is needed to pick it up, and the risk of the substrate falling can be avoided by using the TRAY tray.

[0024] It should be noted that the executing entity in this embodiment can be a computing service device with data processing, network communication, and program execution functions, such as a tablet computer, personal computer, or mobile phone, or an electronic device or substrate transport device capable of performing the above functions. The following description uses a substrate transport device as an example to illustrate this embodiment and the subsequent embodiments.

[0025] Based on this, embodiments of this application provide a substrate transportation method, referring to... Figure 1 , Figure 1 This is a schematic flowchart of the first embodiment of the substrate transportation method of this application.

[0026] In this embodiment, the substrate transportation method includes steps S10 to S20: Step S10: When the substrate to be produced is transported to the preset placement area, the first support structure of the preset placement area is controlled to descend so that the substrate to be produced is placed in the TRAY tray below the substrate to be produced, and a target TRAY tray containing the substrate to be produced is obtained. It should be noted that the execution entity in this embodiment is a substrate transport device. This substrate transport device is connected to a conveyor belt. The substrate to be produced refers to a PCB (printed circuit board) or other sheet material that needs to enter the production line for processing, and has different thickness specifications (e.g., 0.035mm to 10mm or more). The preset placement area refers to a pre-defined operating position for placing the substrate to be produced into a TRAY tray. This area is equipped with corresponding mechanical structures (such as a first support structure) to ensure accurate placement of the substrate. The TRAY tray is a tray used to carry the substrate to be produced. The substrate is placed in the TRAY tray so that it can be transported subsequently by clamping the TRAY tray, avoiding direct contact with the substrate surface. The target TRAY tray refers to the TRAY tray carrying the substrate to be produced.

[0027] Understandably, since the substrate transport device is connected to the conveyor belt, the substrate slides to the preset placement area by inertia when it leaves the conveyor belt. When the substrate to be produced is transported to the preset placement area, the substrate transport device controls the first support structure of that area to descend, so that the substrate to be produced is placed smoothly in the TRAY tray below it under the action of gravity, thus obtaining the target TRAY tray containing the substrate to be produced. Since the substrate to be produced falls naturally into the TRAY tray by descending the first support structure, instead of being picked up by a suction cup or placed manually, this non-contact placement method avoids direct contact between the suction cup and the substrate surface, thereby eliminating the possibility of suction nozzle marks and suction cup dust and debris, and reducing the risk of damage to the substrate during placement.

[0028] Step S20: The target TRAY disk is clamped to a preset separation area by a clamping device. In the preset separation area, the substrate to be produced in the target TRAY disk is separated and the separated substrate to be produced is transported to the production line.

[0029] It should be noted that the clamping device refers to the mechanical component used to pick up and place the target TRAY tray. The preset separation area refers to the pre-set operating position for separating the substrate to be produced from the TRAY tray. The substrate transport device clamps the target TRAY tray carrying the substrate to be produced using the clamping device and smoothly transports it to the preset separation area. Within the preset separation area, the TRAY tray separation mechanism is activated to separate the substrate to be produced from the target TRAY tray, causing the substrate to detach from the TRAY tray. The separated substrate is then transported to the production line as a single piece for subsequent processing. This achieves contactless transfer of the substrate from the TRAY tray to the production line, avoiding direct contact damage to the substrate caused by traditional suction cup methods. At the same time, the clamping method significantly reduces the risk of the substrate falling during handling.

[0030] In one feasible implementation, the first support structure includes a predetermined first number of retractable first support columns, which are used to support the substrate to be produced and keep the substrate to be produced horizontal during descent.

[0031] It is understood that the first support column refers to the specific mechanical component constituting the first support structure. It is a retractable columnar body used to provide physical support during substrate placement. Through its retraction function, a smooth descent of the substrate can be achieved. The preset first number can be set according to the substrate size. After the substrate to be produced is transported to the preset placement area, the first support structure of the substrate transport device supports the substrate through the first support column. During the descent, synchronous retraction control ensures that the substrate remains horizontal throughout the entire descent stroke until it smoothly falls into the lower tray. This ensures that the substrate does not tilt or deflect during placement, avoiding edge collisions or surface scratches caused by unstable posture.

[0032] In one feasible implementation, the support column is rotatable and is used to rotate the substrate to be produced so that it is parallel to the TRAY disk.

[0033] It should be noted that the first support column of the first support structure of the substrate transport device has a rotatable function. When the substrate to be produced is supported by the support column, the substrate to be produced is rotated synchronously by controlling the rotation of the support column until the orientation of the substrate to be produced is adjusted to be completely parallel with the TRAY tray below, that is, the edge of the substrate is aligned with the edge of the TRAY tray, ensuring that the substrate can accurately fall into the TRAY tray.

[0034] In this embodiment, since the first support column can rotate and adjust the orientation of the substrate to be produced, this pre-alignment mechanism can eliminate the angular deviation between the substrate and the TRAY disk before the substrate descends, allowing the substrate to enter the placement stage in a state completely parallel to the TRAY disk. Because the substrate and the TRAY disk remain parallel, the substrate can make uniform contact with the bottom of the TRAY disk during the falling process, avoiding one-sided contact or edge collision caused by inconsistent orientation, thereby further reducing the risk of substrate surface scratches and edge damage.

[0035] Based on the first embodiment of this application, in the second embodiment of this application, the content that is the same as or similar to that in the first embodiment described above can be referred to the above description and will not be repeated hereafter. Based on this, in step S20, the substrate transportation method further includes step S01: Step S01: Apply a target clamping force to a preset position of the target TRAY disk using a clamping device, and clamp the target TRAY disk to a preset separation area based on the target clamping force, wherein the target clamping force is positively correlated with the thickness of the substrate to be produced.

[0036] It should be noted that the preset position refers to a pre-defined area on the target tray for the clamping device to grip, typically the edge or reinforcing structure of the tray, to ensure the stability and reliability of the clamping. The target clamping force refers to a specific clamping force applied by the clamping device to the preset position on the target tray. This force is dynamically adjusted according to the thickness of the substrate to be produced, and is not a fixed value. The substrate transport device applies the target clamping force to the preset position of the target tray through the clamping device, and based on this target clamping force, stably clamps the target tray and transports it to the preset separation area. The magnitude of the target clamping force is positively correlated with the thickness of the substrate to be produced; that is, when the substrate to be produced is thicker (i.e., heavier), the clamping force increases accordingly to ensure stable clamping; when the substrate to be produced is thinner (i.e., lighter), the clamping force decreases accordingly to avoid excessive compression of the tray or substrate. This achieves adaptive clamping of substrates of different thicknesses, ensuring transport stability while avoiding tray deformation or substrate damage caused by improper clamping force.

[0037] Before the step of applying a target clamping force to a preset position of the target TRAY disc using a clamping device, the following steps are included: Obtain the rigidity coefficient of the substrate to be produced; determine the loading rate of the target clamping force based on the rigidity coefficient, and gradually increase the clamping force of the clamping device to the target clamping force at the loading rate.

[0038] It is understandable that the rigidity coefficient refers to the ability of the substrate to resist deformation. It is related to the substrate's thickness, material properties, and layer structure. For substrates of the same thickness, the rigidity coefficient may differ due to variations in the number of layers and materials. For thin plates (e.g., 0.035mm), the rigidity coefficient is extremely low, making them highly susceptible to deformation; for thick plates (e.g., 10mm or more), the rigidity coefficient is higher, resulting in stronger resistance to deformation. The loading rate refers to the rate at which the clamping force increases over time from the moment the clamping device begins contacting the target tray until the target clamping force is reached. Before applying the target clamping force to the target tray at a preset position, the substrate transport device first obtains the rigidity coefficient of the substrate to be produced. This rigidity coefficient can be obtained by looking up a table (pre-stored based on the substrate model, thickness, and number of layers) or by real-time detection (e.g., through pre-pressure testing using a micro-deformation sensor). The device determines the loading rate of the target clamping force based on the rigidity coefficient: for thin plates with low rigidity coefficients, a lower loading rate is used to allow the clamping force to increase slowly; for thick plates with high rigidity coefficients, a higher loading rate is used to allow the clamping force to reach the target value more quickly. Subsequently, the clamping device gradually increases the clamping force to the target clamping force at the loading rate, and after reaching the target clamping force, it stably clamps the target TRAY disc and transports it to the preset separation area. Thus, based on the positive correlation between clamping force and thickness, the clamping force application process is further optimized according to the rigidity characteristics of the substrate, avoiding deformation of thin plates or instability of thick plates due to instantaneous impact of clamping force.

[0039] The steps of applying a target clamping force to a preset position of the target TRAY disc using a clamping device, and clamping the target TRAY disc to a preset separation area based on the target clamping force, include: A clamping force is applied to a preset position of the target TRAY disc using a clamping device, and the presence of a slip signal in the clamping device is detected. If a slip signal is detected, a time-frequency transformation is performed on the slip signal to obtain a time-frequency spectrum. Based on the time-frequency spectrum, a short-time energy integral of a preset frequency band is calculated. If the short-time energy integral is greater than a preset energy threshold, it is determined that the clamping device is slipping, and the clamping force is gradually increased to the target TRAY disc in preset steps until the clamping device no longer has the slip signal, and the target TRAY disc is clamped to a preset separation area. The preset energy threshold is determined based on the ambient background noise.

[0040] Optionally, if there is residual medicine, oil, or tiny debris on the surface of the TRAY disc, the clamping device may slip after clamping with the target clamping force (insufficient holding force). Therefore, a miniature accelerometer is installed in the clamping device to continuously detect whether there is a slip signal. The slip signal is manifested as a tiny, continuous vibration. Once slippage is detected, it indicates that the friction coefficient between the clamping device and the TRAY disc is insufficient. Therefore, based on the preset holding force, the clamping force is gradually increased in very small steps (such as 0.5N) until the slippage stops.

[0041] Furthermore, the factory environment has a lot of background vibration (air compressor, conveyor belt, operation of nearby equipment). The miniature accelerometer may misinterpret this background noise as slip signal, causing the system to frequently and incorrectly increase the clamping force, eventually damaging the TRAY disc. Therefore, the substrate transport device extracts signals in a specific frequency range (the low-frequency flutter unique to slip, 20Hz-80Hz) to shield high-frequency environmental noise.

[0042] However, due to the wide frequency vibrations transmitted from the factory floor (usually from a few Hz to several hundred Hz), shielding high frequencies alone is not enough, because the low frequency vibrations of air compressors and motors may be confused with slip characteristics. Therefore, the substrate transport device uses a dual threshold based on time and frequency domain characteristics to determine slip signals.

[0043] Specifically, slip signals are usually not a single frequency, but rather have the characteristics of "suddenness" and "asymmetry". For example, when the board slips, the acceleration waveform will have a steep rising edge (overcoming static friction) and a damped oscillation decaying edge. Therefore, the substrate transport device only determines that the slip signal is a real slip when the slip signal simultaneously meets the conditions of "frequency in the slip characteristic band (e.g., 20Hz-80Hz)" and "waveform steepness exceeding the threshold".

[0044] Specifically, an analog low-pass filter is set in the miniature accelerometer with a cutoff frequency of 200Hz-500Hz to filter out high-frequency electromagnetic interference. Within the algorithm, the slip signal is first band-pass filtered to retain the frequency band of interest (e.g., 10Hz-200Hz). Then, time-frequency transformation analysis is performed on the filtered slip signal, using short-time Fourier transform or wavelet transform algorithms to convert the one-dimensional slip signal into a two-dimensional time-frequency spectrum. During the transformation, the device truncates the data according to a preset window function (e.g., Hanning window), with the window length set to balance time and frequency resolution. The window length is set to ensure that both the sudden start point of the slippage can be captured and the characteristic frequency band of 20Hz-80Hz can be clearly distinguished. This characteristic frequency band is the slippage characteristic band. The device calculates the short-time energy integral of the characteristic frequency band of 20Hz-80Hz for the generated time-frequency spectrum and sets a dynamic energy threshold. This threshold is automatically calculated by multiplying the average environmental background noise energy collected during the idle period of the production line by a safety factor (such as three times). When the device detects that the short-time energy in the characteristic frequency band exceeds the threshold, it immediately marks the current time period as a "candidate slippage event".

[0045] Furthermore, for the marked "candidate slip events," the timestamp corresponding to the event is recorded. Using the timestamp as a reference, a fixed-length segment of vibration waveform data is extracted before and after the timestamp to form a complete analysis window. The device calculates the kurtosis value of the waveform within this analysis window to quantify the peak intensity of the waveform. Simultaneously, a rise time detection algorithm is activated. Specifically, the peak point within the window is first identified, and then the device traces backward from the peak point to find the moment when the waveform first exceeds the background noise threshold (e.g., five times the standard deviation of the baseline noise). The difference between these two time points is the rise time. Simultaneously, the waveform within the analysis window is extracted to obtain the curve of the instantaneous frequency of the signal changing over time (at the moment of slip, the instantaneous frequency exhibits an "asymmetric" characteristic, jumping from low frequency to high frequency and then slowly decaying).

[0046] Furthermore, the device calculates whether the waveform characteristics (kurtosis, rise time, instantaneous frequency change rate) meet preset conditions, and only when all conditions are met is it finally determined to be "true slip".

[0047] Specifically, Condition 1: The kurtosis value is much greater than three (e.g., greater than 3.5); Condition 2: The rise time is extremely short (e.g., less than ten milliseconds); Condition 3: The instantaneous frequency change rate exceeds a preset threshold (e.g., greater than 5 kilohertz per second). Condition 4: The highest matching degree with the template library exceeds 85%.

[0048] Optionally, after the clamping device transports the target TRAY disk to the separation area and before the second support structure rises, after the clamping device has transported the target TRAY disk to the separation area and is suspended in a clamped state, a structured light projector or laser speckle interferometer arranged on the side of the separation area is activated to perform non-contact full-field strain measurement on the bottom surface of the TRAY disk. This generates an elastic deformation cloud map of the TRAY disk due to long-term clamping force and substrate gravity, and calculates the interface contact pressure distribution between the TRAY disk and the internal substrate. Based on the substrate thickness and rigidity coefficient, a graded release strategy is implemented. Level 1 (Rapid Unloading): For thick plates with a thickness greater than 2mm, the clamping force is reduced to 70% of the target clamping force at a relatively fast rate (e.g., 10N / s), releasing most of the elastic deformation of the TRAY disc edge while maintaining basic positioning.

[0049] Second stage (creep release): For thin plates with a thickness of less than 0.2 mm, the clamping force is reduced step by step at an extremely slow rate (e.g., 0.5 N / s), with a 0.5-second pause after each reduction, allowing the plastic deformation of the TRAY disc and the residual stress of the substrate to gradually relax, avoiding substrate jumping caused by instantaneous rebound.

[0050] The third stage (pressure holding balance): The clamping force is finally stabilized at a "zero stress holding force" level. This force only needs to overcome the weight of the TRAY disk and the very small positioning resistance (about 10% to 20% of the original target clamping force), so that the TRAY disk and the substrate are in a nearly free state, but are still gently constrained in the clamping device.

[0051] While releasing the clamping force, the two clamping arms of the control device apply a set of small, high-frequency, anti-phase lateral vibrations (amplitude 0.05~0.1mm, frequency 100~200Hz) along the plane of the TRAY disk. This vibration causes micron-level relative sliding between the sidewall of the TRAY disk and the edge of the substrate, thereby preemptively destroying local adhesion points formed by static electricity, vacuum, or residual chemicals. Simultaneously, it causes the substrate to automatically slide within the TRAY disk to its lowest potential energy posture, i.e., a naturally settled state. After completing the above steps, the current clamping force, TRAY disk deformation cloud map, and substrate posture data are sent to the control system of the separation area. Only when the maximum elastic deformation of the TRAY disk is detected to be less than a preset threshold (e.g., 0.1mm) and the uniformity of the contact pressure distribution between the substrate and the bottom of the TRAY disk exceeds 80%, is the second support structure allowed to begin rising. The elastic deformation cloud map is a color spectrum composed of the displacement of various points on the object's surface relative to a reference position, obtained through optical measurement methods, used to visually display the stress distribution. Staged prestress release: Different unloading speeds and step strategies are adopted for workpieces with different stiffness characteristics to control the elastic recovery impact force generated during the release process, similar to the staged tensioning reverse process of large prestressed structures.

[0052] In one feasible implementation, the step of separating the substrate to be manufactured in the target TRAY disk within the preset separation area includes: The second support structure in the preset separation area rises until the substrate to be produced in the target TRAY disk separates from the target TRAY disk.

[0053] It is understood that the second support structure refers to a liftable mechanical component set in a preset separation area to eject the substrate to be produced from the tray. The separation of the substrate from the tray is achieved through a rising motion, and its function corresponds to the first support structure in the placement area. Within the preset separation area, the substrate transport device activates the second support structure, causing it to rise. The second support structure pushes upwards against the substrate to be produced in the target tray. As the second support structure continues to rise, the substrate is smoothly lifted until it is completely detached from the target tray, thus achieving separation. This completes the removal of the substrate from the tray in a non-contact manner, avoiding direct contact and damage to the substrate surface caused by traditional suction cup methods, and preparing the substrate for entry into the production line as a single piece.

[0054] In one feasible implementation, the second support structure includes a preset second number of retractable second support columns, the second support columns including a third support column and a fourth support column, the fourth support column rising after the third support column rises to a preset distance.

[0055] It should be noted that the second support column refers to the specific mechanical component constituting the second support structure. It is a retractable columnar body used to lift the substrate to be produced in the separation area, achieving separation of the substrate from the TRAY tray. The preset second quantity refers to the total number of second support columns constituting the second support structure. This quantity can be preset according to the substrate size and stability requirements, and can be the same as or different from the preset first quantity. The third support column refers to a portion of the second support columns, located in the middle part of the second support structure, and rises first during the separation process. The fourth support column refers to the remaining portion of the second support columns excluding the middle part, and begins to rise only after the third support column has risen to a preset distance. The preset distance refers to the specific height that the third support column needs to rise before the fourth support column begins to move. This distance is preset based on the substrate thickness, rigidity, and separation stability requirements. During the separation process, the substrate transport device first controls the third support column to rise. After the third support column rises to the preset distance, it then controls the fourth support column to begin rising. Through this staged lifting sequence, the substrate to be produced is smoothly lifted until it is completely detached from the target TRAY tray, achieving separation of the substrate from the TRAY tray. By using a step-by-step lifting method, uneven stress or instantaneous impact on the substrate that might occur if all support columns were to rise simultaneously is avoided, thus ensuring the stability of the substrate's posture and the integrity of its surface during the separation process.

[0056] Although the thickness specifications of the substrates in this application cover a wide range (e.g., from 0.035mm to over 10mm), excessively thin substrates (typically referring to IC substrates, flexible circuit boards, or wafer-level packaging substrates with a thickness of less than 0.1mm, or even 0.035mm) have extremely low bending stiffness. When multiple support pillars rise simultaneously to contact the bottom of the board, because the board is not an absolutely ideal plane (there is residual stress or slight warping), the contact points of the support pillars will preferentially lift local areas rather than the entire board. This will cause the board to form a wavy bulge or depression between two support pillars, similar to the edge of a lotus leaf. If this local deformation exceeds the elastic limit of the substrate, it will cause irreversible microcracks in the inner layer circuitry (fine circuitry of 25 / 25 micrometers), or even break on the spot.

[0057] Furthermore, after prolonged stacking or vacuum handling, a slight vacuum adsorption may exist between the thin plate and the tray. If the surface of the thin plate is smooth, this adsorption force will be very uniform. When multiple support columns lift upwards, if the lifting speed is too fast, it is equivalent to applying a concentrated force to the center area of ​​the plate, attempting to tear the plate apart from the tray. Meanwhile, the edges of the plate are still attached to the tray due to the adsorption force, causing the plate to be flattened like a drumhead, with the greatest force in the center. If the adsorption force exceeds the tensile strength of the plate, the plate will tear or delaminate in the central area.

[0058] Therefore, the substrate transport device first lifts the center, supporting the center of the board while the edges remain attached to the tray. At this point, the board presents a smooth curved surface. This unidirectional deformation is much smoother than the multiple randomly raised curved surfaces created by simultaneous lifting, resulting in a more uniform stress distribution and reducing the likelihood of creases. Furthermore, when the center ejector pin rises first, the center of the board is lifted away from the tray, and air is rapidly drawn from the center outwards into the gap between the board and the tray. This gradual peeling effectively breaks the vacuum, avoiding the impact of complete detachment.

[0059] In this embodiment, since the second support structure gradually detaches the substrate from the TRAY disk through a smooth upward movement, this process avoids friction and collision between the substrate and the edge of the TRAY disk, effectively protecting the integrity of the circuit on the substrate surface. It is particularly suitable for high-end HDI and high-multilayer boards with fine circuits (such as 25 / 25 micrometer level).

[0060] It should be noted that the above examples are only for understanding this application and do not constitute a limitation on the substrate transportation method of this application. Any simple modifications based on this technical concept are within the protection scope of this application.

[0061] This application also provides a substrate transport device; please refer to... Figure 2 The substrate transport device includes: The placement module 10 is used to control the first support structure of the preset placement area to descend when the substrate to be produced is transported to the preset placement area, so that the substrate to be produced is placed in the TRAY tray below the substrate to be produced, thereby obtaining a target TRAY tray containing the substrate to be produced. The separation module 20 is used to clamp the target TRAY disk to a preset separation area using a clamping device, separate the substrate to be produced in the target TRAY disk in the preset separation area, and transport the separated substrate to be produced to the production line.

[0062] Optionally, the separation module includes: The clamping submodule is used to apply a target clamping force to a preset position of the target TRAY disk through a clamping device, and clamp the target TRAY disk to a preset separation area based on the target clamping force, wherein the target clamping force is positively correlated with the thickness of the substrate to be produced.

[0063] The rising submodule is used to rise in the second support structure in the preset separation area until the substrate to be produced in the target TRAY disk is separated from the target TRAY disk.

[0064] The substrate transport apparatus provided in this application, employing the substrate transport method described in the above embodiments, can solve the technical problem of substrate transport. Compared with the prior art, the beneficial effects of the substrate transport apparatus provided in this application are the same as those of the substrate transport method provided in the above embodiments, and other technical features of the substrate transport apparatus are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0065] This application provides a substrate transport device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, which are executed by the at least one processor to enable the at least one processor to perform the substrate transport method in Embodiment 1 above.

[0066] The following is for reference. Figure 3 The diagram illustrates a structural schematic suitable for implementing the substrate transport device of the embodiments of this application. The substrate transport device in the embodiments of this application may include, but is not limited to, mobile terminals such as mobile phones, laptops, tablets, digital broadcast receivers, PDAs (Personal Digital Assistants), PMPs (Portable Media Players), vehicle terminals (e.g., vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 3 The substrate transport device shown is merely an example and should not be construed as limiting the functionality and scope of use of the embodiments of this application.

[0067] like Figure 3As shown, the substrate transport device may include a processing unit 1001 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1002 or a program loaded from a storage device 1003 into a random access memory (RAM) 1004. The RAM 1004 also stores various programs and data required for the operation of the substrate transport device. The processing unit 1001, ROM 1002, and RAM 1004 are interconnected via a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Typically, the following systems can be connected to the I / O interface 1006: input devices 1007 including, for example, a touchscreen, touchpad, keyboard, mouse, image sensor, microphone, accelerometer, gyroscope, etc.; output devices 1008 including, for example, a liquid crystal display (LCD), speaker, vibrator, etc.; storage devices 1003 including, for example, magnetic tape, hard disk, etc.; and communication devices 1009. The communication device 1009 allows the substrate transport equipment to communicate wirelessly or wiredly with other devices to exchange data. Although substrate transport equipment with various systems is shown in the figures, it should be understood that it is not required to implement or possess all of the systems shown. More or fewer systems may be implemented alternatively.

[0068] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from ROM 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0069] The substrate transport device provided in this application, employing the substrate transport method described in the above embodiments, can solve the technical problem of substrate transport. Compared with the prior art, the beneficial effects of the substrate transport device provided in this application are the same as those of the substrate transport method provided in the above embodiments, and other technical features of the substrate transport device are the same as those disclosed in the previous embodiment method, and will not be repeated here.

[0070] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0071] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0072] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, the computer-readable program instructions being used to perform the substrate transport method in the above embodiments.

[0073] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0074] The aforementioned computer-readable storage medium may be included in the substrate transport equipment; or it may exist independently and not assembled into the substrate transport equipment.

[0075] The aforementioned computer-readable storage medium carries one or more programs. When the aforementioned one or more programs are executed by the substrate transport equipment, the substrate transport equipment: when the substrate to be produced is transported to a preset placement area, controls the first support structure of the preset placement area to descend, so that the substrate to be produced is placed in a TRAY tray below the substrate to be produced, thereby obtaining a target TRAY tray containing the substrate to be produced; clamps the target TRAY tray to a preset separation area using a clamping device; separates the substrate to be produced from the target TRAY tray in the preset separation area; and transports the separated substrate to be produced to the production line.

[0076] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a Local Area Network (LAN) or a Wide Area Network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0077] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0078] The modules described in the embodiments of this application can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0079] The readable storage medium provided in this application is a computer-readable storage medium that stores computer-readable program instructions (i.e., a computer program) for executing the above-described substrate transportation method, thereby solving the technical problem of substrate transportation. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as the beneficial effects of the substrate transportation method provided in the above embodiments, and will not be repeated here.

[0080] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the substrate transport method as described above.

[0081] The computer program product provided in this application can solve the technical problem of substrate transportation. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as the beneficial effects of the substrate transportation method provided in the above embodiments, and will not be repeated here.

[0082] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. All equivalent structural transformations made under the technical concept of this application and using the content of this application specification and drawings, or direct / indirect applications in other related technical fields, are included in the scope of protection of this application.

Claims

1. A method for transporting a substrate, characterized in that, The substrate transportation method includes: When the substrate to be produced is transported to the preset placement area, the first support structure of the preset placement area is controlled to descend so that the substrate to be produced is placed in the TRAY tray below the substrate to be produced, and a target TRAY tray containing the substrate to be produced is obtained. The target TRAY disk is clamped by a clamping device to a preset separation area. In the preset separation area, the substrate to be produced in the target TRAY disk is separated, and the separated substrate to be produced is transported to the production line.

2. The substrate transportation method as described in claim 1, characterized in that, The first support structure includes a preset first number of retractable first support columns. The first support columns are used to support the substrate to be produced and keep the substrate to be produced horizontal during descent. The support columns are rotatable and are used to rotate the substrate to be produced to be parallel to the TRAY disk.

3. The substrate transportation method as described in claim 1, characterized in that, The step of clamping the target TRAY disc to the preset separation area using the clamping device includes: A target clamping force is applied to a preset position of the target TRAY disk by a clamping device, and the target TRAY disk is clamped to a preset separation area based on the target clamping force, wherein the target clamping force is positively correlated with the thickness of the substrate to be produced.

4. The substrate transportation method as described in claim 3, characterized in that, Before the step of applying a target clamping force to a preset position of the target TRAY disc using a clamping device, the following steps are included: Obtain the rigidity coefficient of the substrate to be produced; The loading rate of the target clamping force is determined based on the stiffness coefficient, and the clamping device gradually increases the clamping force to the target clamping force at the loading rate.

5. The substrate transportation method as described in claim 3, characterized in that, The step of applying a target clamping force to a preset position of the target TRAY disc using a clamping device, and clamping the target TRAY disc to a preset separation area based on the target clamping force, includes: The clamping device applies a target clamping force to a preset position of the target TRAY disc and detects whether the clamping device has a slip signal. If it exists, the time-frequency transformation of the slip signal is performed to obtain a time-frequency spectrum, and the short-time energy integral of the preset frequency band is calculated based on the time-frequency spectrum. If the short-time energy integral is greater than a preset energy threshold, it is determined that the clamping device is slipping, and the clamping force is gradually increased to the target TRAY disk in preset steps until the clamping device no longer has the slipping signal, and the target TRAY disk is clamped to a preset separation area, wherein the preset energy threshold is determined based on the ambient background noise.

6. The substrate transportation method as described in claim 5, characterized in that, The step of separating the substrate to be manufactured in the target TRAY disk in the preset separation area includes: The second support structure in the preset separation area rises until the substrate to be produced in the target TRAY disk separates from the target TRAY disk. The second support structure includes a preset second number of retractable second support columns. The second support columns include a third support column and a fourth support column. The fourth support column rises after the third support column rises to a preset distance.

7. A substrate transport device, characterized in that, The device includes: The placement module is used to control the first support structure of the preset placement area to descend when the substrate to be produced is transported to the preset placement area, so that the substrate to be produced is placed in the TRAY tray below the substrate to be produced, thereby obtaining a target TRAY tray containing the substrate to be produced. The separation module is used to clamp the target TRAY disk to a preset separation area using a clamping device, separate the substrate to be produced in the target TRAY disk in the preset separation area, and transport the separated substrate to be produced to the production line.

8. A substrate transport device, characterized in that, The device includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the substrate transport method as described in any one of claims 1 to 6.

9. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, it implements the steps of the substrate transport method as described in any one of claims 1 to 6.

10. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements the steps of the substrate transport method as described in any one of claims 1 to 6.

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