A multi-primary backlight partition display LED packaging module and a preparation method thereof, and a display

Abstract

This invention discloses a multi-primary-color backlight zoned display LED packaging module and its manufacturing method, as well as a display, belonging to the field of backlight display technology. The multi-primary-color backlight zoned display LED packaging module includes a substrate, LED components, a barrier wall component, and a light mixing layer. The LED components are disposed on the substrate. The barrier wall component, disposed on the substrate, includes multiple barrier walls for isolating the light path. The light mixing layer includes a C dielectric, an R dielectric, an optically transparent adhesive, and a diffusion particle layer. The C dielectric is used to neutralize the blue light emitted by the blue LED chip to form cyan light, and the R dielectric is used to neutralize the blue light emitted by the blue LED chip to form red light. The optically transparent adhesive is used to isolate contaminants and performs a first light mixing of the colored light emitted by the LED components. The diffusion particle layer performs a second light mixing of the colored light emitted by the LED components. This invention enables the LED packaging module to significantly improve the display color gamut while also possessing high energy efficiency, low cost, and high reliability.

Description

Technical Field

[0001] This invention relates to the field of backlight display technology, and in particular to a multi-primary-color backlight zone display LED packaging module and its manufacturing method, as well as a display. Background Technology

[0002] In the display technology field, as Mini LED backlighting technology becomes more widespread in the mid-to-high-end market, the demand for high contrast and high color gamut image quality is increasing. Currently, high color gamut displays mainly rely on three white light backlighting solutions: RGB three-color LED chip combinations, blue light chips with KsF and β-SiALON phosphor combinations, and blue light chips with quantum dot films. Among them, the phosphor solution has a lower cost, but the color gamut usually only reaches about 85% of NTSC; the quantum dot film solution can exceed 100% of NTSC, but the cost of quantum dot materials and high-barrier films is high, especially in large-size applications, where cost pressure is significant, and it also suffers from low photoelectric conversion efficiency and high power consumption; the RGB three-color LED solution has the advantage of independent dimming, but the red light chip is expensive and has a low yield, and when upgrading to the BT.2020 color gamut, its color gamut still has insufficient coverage in the cyan-green region. It is particularly worth noting that the existing mainstream technologies have not effectively introduced or utilized the cyan spectral components in the wavelength range of 470-490nm, resulting in a bottleneck in color gamut improvement. Existing technologies struggle to achieve an ideal balance between cost, energy efficiency, color gamut, and image fidelity, hindering the further development of high-end Mini LED display products.

[0003] In other words, the current need is for an LED packaging module that can significantly improve the display color gamut (especially effectively cover the blue-green to cyan region in the BT.2020 standard) while also being energy efficient, low-cost, and highly reliable.

[0004] Therefore, existing technologies still need to be improved and enhanced. Summary of the Invention

[0005] The main objective of this invention is to provide a multi-primary-color backlight zone display LED packaging module and its preparation method, aiming to solve the problem that there is no LED packaging module in the prior art that can significantly improve the display color gamut while also having high energy efficiency, low cost, and high reliability.

[0006] To achieve the aforementioned objective, a first aspect of the present invention provides a multi-color backlight zone display LED packaging module, the multi-color backlight zone display LED packaging module comprising a substrate, LED components, a barrier wall component, and a light mixing layer: The LED assembly is disposed on the substrate and is used to provide a light source to form the target color; The barrier wall assembly is disposed on the substrate and includes multiple barrier walls, which are used to isolate the optical path; The light mixing layer includes a C medium, an R medium, an optically transparent adhesive, and a diffusion particle layer. The C medium is used to neutralize the blue light emitted by the blue light chip to form cyan light, and the R medium is used to neutralize the blue light emitted by the blue light chip to form red light. The concentration of the C medium is lower than that of the R medium. The optically transparent adhesive is used to isolate contaminants and to mix the colored light entering the optically transparent adhesive; The diffused particle layer is used to convert directionally propagating light into spatially random distribution to eliminate glare spots caused by specular reflection and to mix the colored light entering the diffused particle layer.

[0007] Secondly, the present invention also provides a method for manufacturing a multi-primary-color backlight zone display LED packaging module, wherein the method for manufacturing the multi-primary-color backlight zone display LED packaging module includes: Multi-color LED chip pads are fabricated on the top surface of the circuit board, and encapsulation pads are fabricated on the bottom surface of the circuit board. The circuits on both sides of the board are made conductive through through holes. An array of intermediate and peripheral barrier walls is produced by molding or printing, with each cell divided into one or more slots by the intermediate barrier wall. After the LED array is set in the bottom area of ​​the slot between the barrier walls, one slot containing a blue light chip is filled with C medium, which is cyan fluorescent adhesive or cyan quantum dot adhesive, and the other slot containing a blue light chip is filled with R medium, which is red fluorescent adhesive or red quantum dot adhesive. Optical transparent adhesive is applied to each of the surrounding barrier wall grids. The optical transparent adhesive protects the chip and simultaneously forms a multi-primary color mixing area. A diffusion layer adhesive layer containing diffusion particles is applied or molded onto the top. The densely packed circuit board is cut along the surrounding barrier wall to form multiple target LED packaging modules.

[0008] In a third aspect, embodiments of the present invention also provide a display based on a multi-primary-color backlight partitioned display LED packaging module, the display comprising a target backlight module and a liquid crystal display panel; The target backlight module includes a substrate and a target packaging module, a driver IC, a reflective sheet, a diffuser plate, and a film disposed on the substrate. The target packaging module is disposed on the substrate in an array and is connected to the driver IC through a circuit. The target packaging module is a multi-primary-color backlight zone display LED packaging module. The liquid crystal display panel is positioned in front of the light emission direction of the target backlight module and is used to control the RGBC light source current connected to the target backlight module through a light mixing and color mixing algorithm to achieve color display.

[0009] Beneficial Effects: Compared with the prior art, the present invention provides a multi-primary-color backlight zoned display LED packaging module and its manufacturing method. The multi-primary-color backlight zoned display LED packaging module provided by the present invention includes a substrate, LED components, a barrier wall component, and a light mixing layer. The LED components are disposed on the substrate and are used to provide a light source to form a target color. The barrier wall component is disposed on the substrate and includes multiple barrier walls, which are used to isolate the light path. The light mixing layer includes a C dielectric, an R dielectric, an optically transparent adhesive, and a diffusion particle layer. The C dielectric is used to neutralize the blue light emitted by the blue light chip to form cyan light, and the R dielectric is used to neutralize the blue light emitted by the blue light chip to form red light. The concentration of the C dielectric is lower than that of the R dielectric. The optically transparent adhesive is used to isolate contaminants and to mix the colored light entering the optically transparent adhesive. The diffusion particle layer is used to convert directionally propagated light into spatially random distribution to eliminate glare spots caused by specular reflection and to mix the colored light entering the diffusion particle layer. This invention provides users with a multi-primary-color backlight zone display LED packaging module, solving the problem in existing technologies that cannot achieve low-cost compatibility with high energy efficiency and high image fidelity in television picture quality. It offers a backlight display solution that significantly improves the display color gamut (especially effectively covering the blue-green to cyan region in the BT.2020 standard) while also being energy efficient, low-cost, and highly reliable, effectively enriching the color levels of the display, improving picture quality, and reducing machine power consumption. Attached Figure Description

[0010] Figure 1 A schematic diagram illustrating the structural principle of an embodiment of the multi-color backlight zoned display LED packaging module provided by the present invention; Figure 2 A top view of the structure of an embodiment of the multi-primary-color backlight zoned display LED packaging module provided by the present invention; Figure 3 A schematic diagram of the injection principle of the multi-primary-color backlight zoned display LED packaging module provided by the present invention; Figure 4 This is a schematic diagram of the injection principle of another embodiment of the multi-primary-color backlight zoned display LED packaging module provided by the present invention; Figure 5 A schematic diagram of another embodiment of the multi-primary-color backlight zoned display LED packaging module provided by the present invention; Figure 6 A top view of another embodiment of the multi-primary-color backlight zoned display LED packaging module provided by the present invention; Figure 7 The structural principles of further embodiments of the multi-primary-color backlight zoned display LED packaging module provided by the present invention Figure 1 ; Figure 8 The structural principles of further embodiments of the multi-primary-color backlight zoned display LED packaging module provided by the present invention Figure 2 ; Figure 9 A flowchart illustrating an embodiment of the method for fabricating a multi-color backlight zoned display LED packaging module provided by the present invention; Figure 10 A top view of a partition wall showing an embodiment of the method for preparing a multi-primary-color backlight zoned display LED packaging module provided by the present invention; Figure 11 This is a packaging cut-out diagram of an embodiment of the multi-primary-color backlight zoned display LED packaging module manufacturing method provided by the present invention; Figure 12 This is a schematic diagram of the display principle of a display based on a multi-primary-color backlight zone display LED packaging module provided in an embodiment of the present invention; Figure 13 The backlight color gamut diagram of the display based on the multi-primary-color backlight zone display LED packaging module provided in the embodiments of the present invention. Detailed Implementation

[0011] To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0012] Example 1 In today's display technology field, existing technical solutions struggle to achieve high energy efficiency, high contrast, wide color gamut, and low grayscale image fidelity in television picture quality while maintaining low cost.

[0013] In view of the problems existing in the prior art, the purpose of this embodiment is to provide a multi-primary-color backlight zone display LED packaging module to solve the problems of energy efficiency, cost and low grayscale image distortion in existing backlight display devices.

[0014] To achieve this goal, such as Figure 1 As shown in this embodiment, the multi-color backlight zone display LED packaging module provided in this embodiment includes a substrate, LED components, barrier wall components, and a light mixing layer. The LED assembly is disposed on the substrate and is used to provide a light source to form the target color; The barrier wall assembly is disposed on the substrate and includes multiple barrier walls, which are used to isolate the optical path; The light mixing layer includes a C medium, an R medium, an optically transparent adhesive, and a diffusion particle layer. The C medium is used to neutralize the blue light emitted by the blue light chip to form cyan light, and the R medium is used to neutralize the blue light emitted by the blue light chip to form red light. The concentration of the C medium is lower than that of the R medium. The optically transparent adhesive is used to isolate contaminants and to mix the colored light entering the optically transparent adhesive; The diffused particle layer is used to convert directionally propagating light into spatially random distribution to eliminate glare spots caused by specular reflection and to mix the colored light entering the diffused particle layer.

[0015] The barrier wall assembly includes a peripheral barrier wall and an intermediate barrier wall. The peripheral barrier wall includes a first barrier wall, a second barrier wall, a third barrier wall, and a fourth barrier wall. The second and third barrier walls are peripheral barrier walls parallel to the intermediate barrier wall, and the first and fourth barrier walls are peripheral barrier walls perpendicular to the intermediate barrier wall. The intermediate barrier wall is placed inside the encapsulation module and is connected to the first and fourth barrier walls. The height of the intermediate barrier wall is less than the height of the surrounding barrier walls; The width between the intermediate barrier wall and the second barrier wall is less than the width between the intermediate barrier wall and the third barrier wall.

[0016] Specifically, in this embodiment, a multi-color backlight zoned display LED packaging module is provided, which includes the substrate, the LED assembly, the barrier wall assembly and the light mixing layer, wherein the light mixing layer includes an optically transparent adhesive and a diffusion layer.

[0017] The LED component includes multi-color pads and the same number of green light chips, a first blue light chip and a second blue light chip; The first blue light chip is disposed between the intermediate barrier wall and the second barrier wall; The second blue light chip and the green light chip are disposed between the intermediate barrier wall and the third barrier wall.

[0018] Specifically, in this embodiment, a multi-color LED package is provided, which includes the substrate; the LED assembly, wherein the LED assembly includes multi-color pads and multiple LED chips; the multi-color pads include C pads, B pads, R pads and G pads, that is, in this embodiment, each color chip has its own dedicated pad, enabling the driving circuit to perform completely independent and non-interfering current / voltage control on the four light sources of R, G, B, and C. This allows for independent dimming of the corresponding colors: the brightness (luminous flux) of any primary color can be precisely adjusted according to the content of the image, which is a prerequisite for achieving high-precision color mixing; and independent switching: in two-step field-sequence driving, it is possible to turn on only R and C in one subframe and only G and B in another subframe to achieve time-sequence color mixing.

[0019] The barrier wall assembly includes at least three barrier walls; the light mixing layer includes an optically transparent adhesive and a diffusion layer.

[0020] In this embodiment, the barrier wall is white and disposed on the substrate, including the peripheral barrier wall and the intermediate barrier wall, wherein the height of the intermediate barrier wall is less than the height of the peripheral barrier wall. The peripheral barrier wall includes the second barrier wall, the third barrier wall, the fourth barrier wall, and the first barrier wall, wherein the second barrier wall and the third barrier wall are peripheral barrier walls parallel to the intermediate barrier wall, and the first barrier wall and the fourth barrier wall are peripheral barrier walls perpendicular to the intermediate barrier wall; the intermediate barrier wall is placed inside the packaging module and is connected to the first barrier wall and the fourth barrier wall; the width between the intermediate barrier wall and the second barrier wall is less than the width between the intermediate barrier wall and the third barrier wall. Because in this embodiment, a high concentration of R powder is placed between the intermediate barrier wall and the second barrier wall, which needs to be effectively excited by concentrated blue light, a smaller space is beneficial to improving energy density and conversion efficiency. The ample space between the intermediate and third barrier walls is designed to accommodate both the green light chip and the second blue light chip, and is filled with a low concentration of cyan light conversion material (i.e., the C medium). This larger space not only provides placement for the two chips but also provides the physical volume for the optical behavior of the blue light portion penetrating the low-concentration colloid and for the initial premixing of cyan light, transmitted blue light, and native green light. Furthermore, this dimensional difference, combined with the height difference of the barrier walls, constitutes a crucial optical path control mechanism. When light emitted from the narrow slot (e.g., red light) encounters the tall peripheral barrier walls (white), it is reflected back into the cavity and guided in the emission direction, thereby reducing light loss and improving light extraction efficiency.

[0021] Specifically, the first blue light chip is disposed in the space between the intermediate barrier wall and the second barrier wall, and the second blue light chip and the green light chip are disposed in the space between the intermediate barrier wall and the third barrier wall.

[0022] Furthermore, in this embodiment, the light mixing layer further includes the C medium and the R medium. The C medium is used to neutralize the blue light emitted by the blue light chip to form cyan light, and the R medium is used to neutralize the blue light emitted by the blue light chip to form red light. The concentration of the C medium is lower than that of the R medium.

[0023] An optically transparent adhesive is filled above the accommodating space formed by the barrier wall, and a diffusion layer containing diffusion particles is provided on the surface of the optically transparent adhesive.

[0024] In this structure, the space between the intermediate barrier wall and the second barrier wall is relatively narrow, used to accommodate the first blue light chip. The space between the intermediate barrier wall and the third barrier wall is relatively wide, used to accommodate the second blue light chip and the green light chip.

[0025] In this embodiment, the R medium can be disposed between the intermediate barrier wall and the second barrier wall, or between the intermediate barrier wall and the third barrier wall. Correspondingly, the C medium can also be disposed between the intermediate barrier wall and the third barrier wall, or between the intermediate barrier wall and the second barrier wall.

[0026] Figure 2 and Figure 3 When the R medium is disposed between the intermediate barrier wall and the second barrier wall, and the C medium is disposed between the intermediate barrier wall and the third barrier wall, the R medium encloses the first blue light chip and its height is not higher than the intermediate barrier wall. When the first blue light chip emits first blue light, the R medium absorbs the first blue light and forms the red light color among the three primary colors through photoexcitation; A portion of the red light passes through the intermediate barrier wall and enters the cavity of the encapsulation module to form the optically transparent adhesive portion, while another portion is reflected back to the optically transparent adhesive portion after encountering the peripheral barrier wall. The C medium encloses the second blue light chip and the green light chip, and its height is not higher than the intermediate barrier wall; When the second blue light chip emits second blue light, the C medium absorbs a first proportion of the second blue light and forms a cyan color through photoexcitation; A portion of the cyan light shines through the intermediate barrier wall into the cavity of the encapsulation module to form the optically transparent adhesive portion, while another portion is reflected back to the optically transparent adhesive portion after encountering the peripheral barrier wall.

[0027] Specifically, refer to Figure 3 The first blue light chip is coated with the R medium, i.e., the red light conversion layer, which is either red phosphor or red quantum dot adhesive, to convert the blue light emitted by the first blue light chip into red light. The second blue light chip is coated with the C medium, i.e., the cyan light conversion layer, which is either cyan phosphor or cyan quantum dot adhesive, and its concentration is configured to allow partial blue light transmission, thereby generating cyan light under photoexcitation.

[0028] When the first blue LED chip is powered on, the blue light it emits is absorbed by the upper red light conversion layer and converted into red light. Due to the low height of the intermediate barrier wall, some light can escape, while when it encounters the higher second barrier wall, the red light is reflected back into the encapsulation cavity by its white surface. Similarly, in the other space, the blue light emitted by the second blue LED chip excites the cyan light conversion layer to produce cyan light, and some unconverted blue light is directly transmitted; the green light emitted by the green LED chip penetrates the cyan light conversion layer without being excited. The resulting red, green, blue, and cyan light undergoes initial mixing in the optically transparent adhesive layer and then enters the diffusion layer. The particles in the diffusion layer scatter and reflect the light, allowing the different colors of light to mix fully, ultimately emitting a uniform multi-colored light spot from the encapsulation surface. When only the first blue LED chip is powered on, a uniform red light spot is emitted from the encapsulation surface; when the second blue LED chip is powered on, a mixed blue-cyan light is emitted; and when the green LED chip is powered on, pure green light is emitted. This structural design enables the package to achieve uniform light emission regardless of whether it operates with three or four primary colors.

[0029] In addition, the relatively high second and third barrier walls can reflect light emitted at large angles back into the encapsulation, allowing it to re-enter the optical path and eventually exit through the diffusion layer, thereby effectively reducing stray light loss and improving the overall light extraction efficiency.

[0030] Reference Figure 4 When the R medium is disposed between the intermediate barrier wall and the third barrier wall, and the C medium can also be disposed between the intermediate barrier wall and the second barrier wall, the R medium encapsulates the second blue light chip and the green light chip, and its height is not higher than the intermediate barrier wall; when the second blue light chip emits second blue light, the R medium absorbs a first proportion of the second blue light and forms red light among the three primary colors through photoexcitation; part of the red light passes through the intermediate barrier wall and irradiates the optically transparent adhesive portion in the cavity of the packaging module, and another part is reflected to the optically transparent adhesive portion after encountering the peripheral barrier wall; The C medium encapsulates the first blue light chip, and its height is not higher than the intermediate barrier wall. When the first blue light chip emits first blue light, the C medium absorbs the first blue light and forms a cyan color through photoexcitation. A portion of the cyan color shines through the intermediate barrier wall into the cavity of the packaging module to obtain the optically transparent adhesive portion, and another portion is reflected to the optically transparent adhesive portion after encountering the peripheral barrier wall.

[0031] Specifically, refer to Figure 4 In this embodiment, another multi-color LED packaging implementation is provided. The main difference from the previous embodiment is that the filling positions of the red light conversion material and the cyan light conversion material are interchanged. Specifically, red phosphor or red quantum dot adhesive is poured into the larger accommodating groove formed between the middle barrier wall and the third barrier wall to form a red light conversion layer; while cyan phosphor or cyan quantum dot adhesive is poured into the smaller accommodating groove formed between the middle barrier wall and the second barrier wall to form a cyan light conversion layer. This layout adjustment can be optimized according to the optical characteristics of the phosphor material, the required luminous flux, or the light mixing requirements, providing another feasible design freedom for the adjustment of multi-color light efficiency.

[0032] Similarly, at this time, the R medium, i.e. the red light conversion layer, which covers the second blue light chip, is configured to allow some blue light to be transmitted, thereby generating red light under photoexcitation.

[0033] The optically transparent adhesive is disposed within the perimeter barrier wall, with the same height as the perimeter barrier wall, and the diffusion particle layer is disposed on the optically transparent adhesive and the perimeter barrier wall; When the unabsorbed second blue light enters the optically transparent adhesive portion, the green light emitted by the green light chip enters the optically transparent adhesive portion. The cyan light and the red light are superimposed on the optically transparent adhesive portion to perform a first light mixing to obtain the target color light. The optically transparent adhesive contains first mixing and diffusion particles to enhance the light mixing effect. The target color light enters the diffusion particle layer and undergoes a second mixing to obtain uniform target color light. The diffusion particle layer contains second mixed diffusion particles, and the concentration of the second mixed diffusion particles in the diffusion particle layer is greater than the concentration of the first mixed diffusion particles in the optically transparent adhesive.

[0034] Specifically, the optically transparent adhesive fills the area enclosed by the peripheral barrier wall, with its top height being flush with the top of the peripheral barrier wall; the diffused particle layer covers the entire upper surface of the optically transparent adhesive and the peripheral barrier wall.

[0035] When the remaining blue light emitted by the second blue light chip, which is not completely absorbed by the cyan light conversion layer above it, enters the optically transparent adhesive, and simultaneously the green light emitted by the green light chip also enters the area, these rays will converge with the red light from the red light conversion layer and the cyan light from the cyan light conversion layer within the optically transparent adhesive, undergoing initial optical mixing to preliminarily form the target color light. To promote this mixing, a low concentration of first mixing diffusion particles is pre-dispersed in the optically transparent adhesive.

[0036] Subsequently, the target color light obtained from the initial mixing enters the upper diffusion particle layer, where a second, more thorough optical mixing occurs. This diffusion particle layer contains a high concentration of the second mixed diffusion particles, significantly higher than the concentration of the first mixed diffusion particles in the optically transparent adhesive. Through these two stepwise diffusion and mixing processes, from sparse to dense, the light emitted from the surface of the encapsulation module ultimately becomes highly uniform target color light.

[0037] In summary, this embodiment provides a multi-primary-color backlight zoned display LED packaging module, which includes a substrate, LED components, a barrier wall component, and a light mixing layer. The LED components are disposed on the substrate and are used to provide a light source to form a target color. The barrier wall component is disposed on the substrate and includes multiple barrier walls, which are used to isolate the light path. The light mixing layer includes a C dielectric, an R dielectric, an optically transparent adhesive, and a diffusion particle layer. The C dielectric is used to neutralize the blue light emitted by the blue LED chip to form cyan light, and the R dielectric is used to neutralize the blue light emitted by the blue LED chip to form red light. The concentration of the C dielectric is lower than that of the R dielectric. The optically transparent adhesive is used to isolate contaminants and to mix the colored light entering the optically transparent adhesive. The diffusion particle layer is used to convert directionally propagated light into spatially random distribution to eliminate glare spots caused by specular reflection and to mix the colored light entering the diffusion particle layer. This embodiment provides users with a multi-primary-color backlight zone display LED packaging module, solving the problem in existing technologies that cannot achieve low-cost compatibility with high energy efficiency and high image fidelity in television picture quality. It offers a backlight display solution that significantly improves the display color gamut (especially effectively covering the blue-green to cyan region in the BT.2020 standard) while also being energy efficient, low-cost, and highly reliable, effectively enriching the color levels of the display, improving picture quality, and reducing machine power consumption.

[0038] Example 2 Reference Figure 5 and Figure 6 In another embodiment, without the R medium and the C medium, the LED assembly includes four primary color pads and the same number of green, blue, red and cyan light chips. The barrier wall assembly includes a middle barrier wall and a peripheral barrier wall, and the height of the middle barrier wall is less than the height of the peripheral barrier wall. The middle barrier wall is cross-shaped and forms four rectangular spaces of the same size with the peripheral barrier walls. The green light chip, the first blue light chip, the second blue light chip and the third blue light chip are respectively placed in one of the rectangular spaces. When the blue light chip emits blue light into the optically transparent adhesive, the green light chip emits green light into the optically transparent adhesive, the red light chip emits red light into the optically transparent adhesive, and the cyan light chip emits red light into the optically transparent adhesive, the blue, green, red, and cyan light colors are mixed in the optically transparent adhesive and then enter the diffused particle layer for a second mixing, resulting in uniform target color light.

[0039] Specifically, in this embodiment, four types of LED chips—red, green, blue, and cyan—are arranged in an array on the same circuit substrate, with each color chip having its own independent electrode pad. The package employs a four-cup bracket structure with four independent compartments, each containing one color LED chip, thus achieving the physical separation and integration of the RGBC four-color light source. The driving circuit for each color can be independently controlled, enabling precise control of the brightness and emission timing of each primary color. A transparent optical encapsulating layer is filled above all the LED chips to protect them and promote initial light mixing. On top of this optical encapsulating layer, a diffusion layer containing diffusion particles is further applied. This layer can fully scatter and uniformly mix the directional light emitted by each primary color, ultimately emitting a uniform surface light source with a wide color gamut from the package surface.

[0040] Example 3 Reference Figure 7 In more embodiments, the LED component includes four primary color pads and the same number of green light chips, a first blue light chip, a second blue light chip and a third blue light chip, wherein the four primary color pads include cyan light pads, green light pads, blue light pads and red light pads; The barrier wall assembly includes a middle barrier wall and a peripheral barrier wall, and the height of the middle barrier wall is less than the height of the peripheral barrier wall. The middle barrier wall is cross-shaped and forms four rectangular spaces of the same size with the peripheral barrier walls. The green light chip, the first blue light chip, the second blue light chip and the third blue light chip are respectively placed in one of the rectangular spaces. The R medium is disposed in the space corresponding to the first blue light chip to enclose the first blue light chip, and its height is not higher than the intermediate barrier wall; The C medium is disposed within the space corresponding to the second blue light chip, enclosing the second blue light chip, and its height is not higher than the intermediate barrier wall; When the first blue light chip emits first blue light, the R medium absorbs the first blue light and forms red light from the three primary colors through photoexcitation, which then enters the optically transparent adhesive portion; when the second blue light chip emits second blue light, the C medium absorbs the second blue light and forms cyan light through photoexcitation, which then enters the optically transparent adhesive portion; when the third blue light chip emits blue light, which enters the optically transparent adhesive portion, and when the green light chip emits green light, which enters the optically transparent adhesive portion, the blue light, the green light, the red light, and the cyan light are mixed in the optically transparent adhesive portion and then enter the diffused particle layer for a second mixing, resulting in uniform target color light.

[0041] Specifically, in the packaging structure of this embodiment, the first blue light chip, the second blue light chip, the third blue light chip, and the green light chip are all disposed together on the circuit board, and each chip or its corresponding color channel is provided with an independent electrode pad. The package adopts a four-cup bracket structure with four independent receiving slots to form four optically isolated light-emitting units. Specifically, refer to... Figure 7 The barrier wall assembly consists of a central barrier wall and surrounding peripheral barrier walls. The central barrier wall has a cross-shaped structure, with each of its four ends connected to the inner wall of the peripheral barrier walls, thereby dividing the internal space into four equal-sized, rectangular independent accommodating units. The overall height of the central barrier wall is lower than the height of the peripheral barrier walls. Accordingly, the green light chip, the first blue light chip, the second blue light chip, and the third blue light chip are each placed within one of the four rectangular accommodating units, achieving optical isolation and structural layout between the chips.

[0042] Specifically, red fluorescent adhesive is poured into the accommodating tank containing the first blue light chip to excite it and generate red light; cyan fluorescent adhesive is poured into the accommodating tank containing the second blue light chip to excite it and generate cyan light; and transparent encapsulating adhesive is directly filled into the accommodating tanks containing the third blue light chip and the green light chip, respectively, to provide basic blue light and green light. Thus, independent emission and spectral control of the four colors—red, cyan, blue, and green—are achieved through four separate tanks.

[0043] A layer of transparent optical adhesive is applied over the four cup supports to seal the chip, protect the circuitry, and promote the initial mixing of various colors of light. On top of this transparent optical adhesive, a diffusion layer containing diffusion particles is further coated or molded. This diffusion layer effectively scatters and homogenizes the emitted light, thereby forming a high-quality surface light source with uniform light mixing on the encapsulation surface. In this entire structure, each of the four light-emitting units (red, green, blue, and cyan) has an independently controllable driving circuit, enabling precise and independent control of the brightness and emission timing of the multiple primary colors.

[0044] Example 4 Reference Figure 8 In more embodiments, the LED component includes four primary color pads and the same number of green light chips, a first blue light chip, a second blue light chip and a third blue light chip, wherein the four primary color pads include cyan light pads, green light pads, blue light pads and red light pads; The barrier wall assembly includes a middle barrier wall and a peripheral barrier wall. The middle barrier wall includes a first middle barrier wall and a second middle barrier wall. The heights of the first middle barrier wall and the second middle barrier wall are equal and less than the height of the peripheral barrier wall. The first middle barrier wall, the second middle barrier wall, and the peripheral barrier wall form three rectangular spaces. The green light chip and the first blue light chip are placed in the middle rectangular space, and the second blue light chip and the third blue light chip are placed in the rectangular spaces on both sides. The R medium is disposed in the rectangular space in the middle, enclosing the first blue light chip and the green light chip, and its height is not higher than the middle barrier wall; The C medium is disposed within the space corresponding to the second blue light chip, enclosing the second blue light chip, and its height is not higher than the intermediate barrier wall; When the first blue light chip emits first blue light, the R medium absorbs the first blue light and forms red light from the three primary colors through photoexcitation, which then enters the optically transparent adhesive portion; the green light chip emits green light, which then enters the optically transparent adhesive portion; the second blue light chip emits second blue light, the C medium absorbs the second blue light and forms cyan light through photoexcitation, which then enters the optically transparent adhesive portion; the third blue light chip emits blue light, which then enters the optically transparent adhesive portion; the blue light, the green light, the red light, and the cyan light are mixed in the optically transparent adhesive portion, and then enter the diffused particle layer for a second mixing, resulting in uniform target color light.

[0045] Specifically, this embodiment provides a three-slot multi-color integrated LED packaging structure.

[0046] The package employs a three-cup bracket with three independent receiving slots. Specifically, the barrier wall assembly is composed of a central barrier wall and peripheral barrier walls. The central barrier wall further includes a first central barrier wall and a second central barrier wall that are parallel to each other, both having the same height and lower than the height of the peripheral barrier walls. The enclosure formed by the first central barrier wall, the second central barrier wall, and the peripheral barrier walls creates three parallel rectangular independent receiving spaces. The green light chip and the first blue light chip are jointly disposed in the central rectangular space, while the second blue light chip and the third blue light chip are respectively disposed in the rectangular spaces on the left and right sides. This layout structurally achieves optical isolation between different light-emitting units and provides a clear spatial division for the partitioned arrangement of each color chip. In the middle receiving slot, red light fluorescent conversion material is poured in, causing the blue light emitted by the first blue light chip to excite red light, while the green light chip provides the original green light. The second blue light chip is separately located in the left receiving slot and is filled with cyan light fluorescent conversion material, so that its emitted blue light is converted into cyan light. The third blue light chip is located in the right receiving slot, which is filled with transparent encapsulant to maintain the original blue light output. All four types of chips are mounted on the same circuit board and each has an independent electrode pad, thereby realizing independent control and driving of the red, green, blue, and cyan light-emitting unit circuits.

[0047] Above the aforementioned chip and phosphor layer, a layer of transparent optical encapsulating adhesive is applied to protect the chip, enhance structural strength, and promote initial light mixing. On top of this transparent optical adhesive, a diffusion layer containing a high concentration of diffusing particles is further formed. This layer effectively scatters and mixes the different colors of light emitted from each slot, ultimately creating a uniform, wide-gamut mixed-color light output on the encapsulation surface. This three-slot structure achieves effective integration and independent control of the four primary colors in a more compact encapsulation form.

[0048] Example 5 Based on Embodiments 1 to 4, the present invention also provides a method for fabricating a multi-primary-color backlight zoned display LED packaging module, such as... Figure 9 As shown, the method for fabricating a multi-primary-color backlight zoned display LED packaging module provided in this embodiment includes the following steps: S100. Multi-color LED chip pads are fabricated on the top surface of the circuit board, and encapsulation pads are fabricated on the bottom surface of the circuit board. The double-sided circuit of the board is made through the through-hole method. S200. An array of intermediate and peripheral barrier walls is manufactured by molding or printing, with each cell divided into one or more slots by the intermediate barrier wall. S300. After setting the LED array in the bottom area of ​​the slot between the barrier walls, fill one of the slots with blue light chips with C medium, which is cyan fluorescent adhesive or cyan quantum dot adhesive, and fill the other slot with blue light chips with R medium, which is red fluorescent adhesive or red quantum dot adhesive. S400. Optical transparent adhesive is applied to each of the surrounding barrier wall grids. The optical transparent adhesive protects the chip and forms a multi-primary color mixing area. S500: A diffusion layer adhesive layer containing diffusion particles is coated or molded on top. S600: The densely packed circuit board is cut along the surrounding barrier wall to form multiple target LED packaging modules.

[0049] After the intermediate barrier wall and the surrounding barrier wall dam array are manufactured by molding or printing, the process also includes: Each grid within the perimeter barrier wall dam is divided into a first slot and a second slot based on the intermediate barrier wall, wherein the first slot is larger than the second slot; After setting the LED array in the bottom area of ​​the slot between the barrier walls, a green light chip and a second blue light chip are set in the first slot and filled with C medium, which is cyan fluorescent adhesive or cyan quantum dot adhesive. A first blue light chip is set in the second slot and filled with R medium, which is red fluorescent adhesive or red quantum dot adhesive.

[0050] Specifically, refer to Figure 10 In the manufacturing process of RGB LED packaging, an advanced multilayer composite substrate process is used to start the entire process. Specifically, a ceramic-metal composite material with a highly matched coefficient of thermal expansion is selected as the base material. The top surface of the substrate is formed with a micron-level precision LED chip pad array by magnetron sputtering. Each pad surface is treated with OSP anti-oxidation to ensure welding reliability. The bottom surface of the substrate is used to create miniaturized packaging pad patterns using laser direct imaging technology, and through-hole arrays with a diameter of no more than 0.1 mm are processed by high-precision drilling equipment. These through-holes are filled with copper by electroplating to form a three-dimensional conductive network to achieve double-sided circuit interconnection.

[0051] Figure 11 In the structural forming stage, three-dimensional barrier structures are mass-produced using nanoimprint lithography. First, a photosensitive resist layer is spin-coated onto the substrate. Then, the intermediate barrier wall and the surrounding barrier wall dam array are formed by molding or printing. The dam array has submicron-level sidewall roughness, providing a precise positioning reference for subsequent cutting.

[0052] Each cell is designed with a multi-groove structure. For example, in the fabrication of the multi-color backlight zoned display LED packaging module as described in Embodiment 1, each cell has a stepped double-groove structure, divided into a first slot and a second slot by the intermediate barrier wall. In Embodiment 1, the second slot contains a high concentration of red phosphor that needs to be effectively excited by concentrated blue light; a smaller space is beneficial for improving energy density and conversion efficiency. The larger first slot needs to accommodate both the green and blue light chips and be filled with a lower concentration of cyan conversion material (i.e., the C medium). The larger space not only provides a layout position for the two chips but also provides physical volume for the optical behavior of the blue light portion penetrating the low-concentration phosphor and for the initial premixing of cyan, transmitted blue, and native green light. Moreover, this size difference, combined with the height difference of the barrier wall, constitutes a key optical path control mechanism. When light emitted from the narrow slot (such as red light) encounters the tall peripheral barrier wall (white), it is reflected back into the cavity and guided in the light-emitting direction, thereby reducing light loss and improving light-emitting efficiency. Therefore, in this embodiment, the first slot is larger than the second slot. Figure 10 As can be seen, the first slot is on the left side of each packaging module, and the second slot is on the right side of each packaging module.

[0053] Reference Figure 11 After the LED array is positioned at the bottom of the slots between the barrier walls, C-powder, which is either cyan fluorescent adhesive or cyan quantum dot adhesive, is poured into the first slot. Similarly, R-powder, which is either red fluorescent adhesive or red quantum dot adhesive, is poured into the second slot. Next, the optically transparent adhesive is applied to the surrounding grid of each encapsulation module. This optically transparent adhesive not only effectively protects the chip but also cleverly forms an area for the mixed emission of the three primary colors.

[0054] After the aforementioned steps are successfully completed, a diffusion layer adhesive layer is applied to the top by coating or molding. The adhesive layer contains uniformly distributed diffusion particles, and its substrate is made of the same material as the transparent optical adhesive.

[0055] Finally, as Figure 11 As shown, the meticulously crafted dense LED light panel is precisely cut along the surrounding barrier wall, thereby separating individual RGB LED packaged devices one by one. It is worth mentioning that after the surrounding barrier wall is cut, a first barrier wall, a second barrier wall, a third barrier wall, and a fourth barrier wall are formed, thus completing the fabrication of the multi-primary-color backlight zoned display LED packaged module.

[0056] In summary, this embodiment provides a method for fabricating a multi-primary-color backlight zoned display LED packaging module. During the fabrication of the packaging module, multi-primary-color LED chip pads are fabricated on the top surface of the circuit substrate, and packaging pads are fabricated on the bottom surface of the circuit substrate. Through-holes are used to achieve double-sided circuit connectivity on the substrate. Then, an array of intermediate and peripheral barrier walls is fabricated using molding or printing. Each cell is divided into a first slot and a second slot by the intermediate barrier wall, with the first slot being larger than the second slot. Afterward, the LED array is placed in the bottom area of ​​the slots between the barrier walls, and then... The circuit board is constructed by embedding a green LED chip and a second blue LED chip, and filling them with a C-medium (cyan fluorescent adhesive or cyan quantum dot adhesive). A first blue LED chip is then placed in the second slot and filled with an R-medium (red fluorescent adhesive or red quantum dot adhesive). Optical transparent adhesive is then applied to each of the surrounding barrier wall squares. This adhesive protects the chip and simultaneously forms a multi-primary-color mixing area. A diffusion layer containing diffusion particles is then coated or molded onto the top. Finally, the densely packed circuit board is cut along the surrounding barrier walls to form multiple target LED packaging modules. This embodiment provides a method for manufacturing multi-primary-color backlight zoned display LED packaging modules, solving the problem in existing technologies where low-cost, high-efficiency, and high-fidelity television picture quality cannot be achieved. It provides a method for manufacturing LED packaging modules with higher picture quality and energy efficiency. The red, green, blue, and cyan colors of the LED package can be individually controlled by changing the current, effectively enriching the color levels of the display, improving picture quality, and reducing power consumption. At the same time, it has high production efficiency and low cost.

[0057] It should be understood that although the steps in the flowcharts shown in the accompanying drawings are displayed sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of the steps in this invention, and these steps can be executed in other orders. Moreover, at least a portion of the steps in this invention may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least a portion of the sub-steps or stages of other steps.

[0058] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program using signal-related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided by this invention can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), Synchlink, DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0059] Example 6 Based on the above embodiment one, the present invention also provides a display based on a multi-primary-color backlight zone display LED packaging module, the display comprising a target backlight module and a liquid crystal display panel: The target backlight module includes a substrate and a target packaging module, a driver IC, a reflective sheet, a diffuser plate, and a film disposed on the substrate. The target packaging module is disposed on the substrate in an array and is connected to the driver IC through a circuit. The target packaging module is a multi-primary-color backlight zone display LED packaging module. The liquid crystal display panel is positioned in front of the light emission direction of the target backlight module and is used to control the RGBC light source current connected to the target backlight module through a light mixing and color mixing algorithm to achieve color display.

[0060] The target backlight module includes a red light source, a cyan light source, a green light source, and a blue light source; The liquid crystal display panel has red sub-pixels, green sub-pixels and blue sub-pixels; The liquid crystal display panel controls the RGBC light source current connected to the target backlight module through a color mixing algorithm to achieve color display, where a display cycle of one frame includes a first subframe and a second subframe: During the first subframe, all subpixels of the liquid crystal display panel are turned on, and the red light source and cyan light source in the backlight module are controlled to emit light synchronously. During the second subframe, the green and blue subpixels of the liquid crystal display panel are turned on, and the green and blue light sources in the backlight module are simultaneously controlled to emit light.

[0061] The red sub-pixel is used to modulate the light intensity of the red light source, and the green and blue sub-pixels are used together to modulate the light intensity of the cyan light source.

[0062] Specifically, in this embodiment, the display based on the multi-primary-color backlight zone display LED packaging module includes the target backlight module and the liquid crystal display panel.

[0063] Specifically, when acquiring the target backlight module, the first step is to arrange and fix RGBC four-color LED packaging modules in an array on a lamp board substrate. These modules are then connected to a driver IC chip via precision circuitry, thus forming an independently controllable RGBC LED backlight board. A reflector, an optical diffuser, and multiple functional films are sequentially arranged above this lamp board to collectively construct an optically uniform and color-pure RGBC multi-primary-color backlight module. Subsequently, a liquid crystal display panel with red, green, and blue color filters is installed on the light-emitting surface of the target backlight module.

[0064] To achieve effective matching between multi-primary-color light sources and RGB liquid crystal pixels, in this embodiment, the display employs an innovative two-step field-sequence driving and color mixing algorithm. Specifically, for the liquid crystal display panel, which itself only has red, green, and blue filter channels, while the target backlight module already contains four independent light sources (red, green, blue, and cyan), timing control is achieved by dividing the display period of each frame into two consecutive subframes (the first subframe T1 and the second subframe T2).

[0065] Reference Figure 12 During the first subframe, the liquid crystal circuits of all red, green, and blue subpixels on the liquid crystal display panel are simultaneously turned on. Simultaneously, the red and cyan light sources in the backlight module are illuminated. At this time, the red subpixels of the liquid crystal display panel are responsible for modulating the red backlight, while the green and blue subpixels jointly modulate the cyan backlight. This is because the spectral wavelength range of cyan light (approximately 470-490nm) spans the transmission bands of traditional green and blue light filters; therefore, both green and blue subpixel channels must be used simultaneously to achieve complete control over the transmission of cyan light. The system calculates and controls the emission ratio of red and cyan light in real time based on the color and brightness information of the image to be displayed, completing the color synthesis for this subframe.

[0066] Subsequently, the system enters the second subframe. In this stage, the liquid crystal display panel only activates the liquid crystal circuits of the green and blue subpixels, while the backlight module simultaneously illuminates the green and blue light sources. The green and blue subpixels of the liquid crystal display panel independently modulate the corresponding green and blue backlights, thereby synthesizing the green, blue, and mixed color components required for the image.

[0067] The rapid alternation of the first and second subframes constitutes a complete image display cycle. It can be seen that this embodiment cleverly achieves efficient utilization and color mixing of the RGBC four-color backlight within a standard RGB LCD panel architecture. Because this field-sequence driving method distributes color synthesis across two subframes, the response speed requirements of the LCD panel itself are relatively relaxed; a conventional LCD panel with a refresh rate of 120Hz or higher is sufficient, ensuring that the refresh rate perceived by the human eye is above 60Hz, effectively avoiding visual flicker.

[0068] like Figure 13 The color gamut comparison diagram shown illustrates that, in this embodiment, by introducing a cyan light source, the displayed color gamut (the area of ​​the black polygon in the diagram) is significantly expanded compared to traditional white light or RGB backlight solutions. In particular, it covers the key blue-green to cyan area in the BT.2020 standard color gamut (the orange triangle in the diagram), thereby greatly improving the overall display color gamut range and color performance, and achieving a significant enhancement in image quality.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-primary-color backlight zoned display LED packaging module, characterized in that, The multi-color backlight zone display LED packaging module includes a substrate, LED components, barrier wall components, and a light mixing layer. The LED assembly is disposed on the substrate and is used to provide a light source to form the target color; The barrier wall assembly is disposed on the substrate and includes multiple barrier walls, which are used to isolate the optical path; The light mixing layer includes a C medium, an R medium, an optically transparent adhesive, and a diffusion particle layer. The C medium is used to neutralize the blue light emitted by the blue light chip to form cyan light, and the R medium is used to neutralize the blue light emitted by the blue light chip to form red light. The concentration of the C medium is lower than that of the R medium. The optically transparent adhesive is used to isolate contaminants and to mix the colored light entering the optically transparent adhesive; The diffused particle layer is used to convert directionally propagating light into spatially random distribution to eliminate glare spots caused by specular reflection and to mix the colored light entering the diffused particle layer.

2. The multi-primary-color backlight zoned display LED packaging module according to claim 1, characterized in that, The barrier wall assembly includes a peripheral barrier wall and an intermediate barrier wall. The peripheral barrier wall includes a first barrier wall, a second barrier wall, a third barrier wall, and a fourth barrier wall. The second and third barrier walls are peripheral barrier walls parallel to the intermediate barrier wall, and the first and fourth barrier walls are peripheral barrier walls perpendicular to the intermediate barrier wall. The intermediate barrier wall is placed inside the encapsulation module and is connected to the first and fourth barrier walls. The height of the intermediate barrier wall is less than the height of the surrounding barrier walls; The width between the intermediate barrier wall and the second barrier wall is less than the width between the intermediate barrier wall and the third barrier wall.

3. The multi-primary-color backlight zoned display LED packaging module according to claim 2, characterized in that, The LED component includes multi-color pads and the same number of green light chips, a first blue light chip and a second blue light chip; The first blue light chip is disposed between the intermediate barrier wall and the second barrier wall; The second blue light chip and the green light chip are disposed between the intermediate barrier wall and the third barrier wall.

4. The multi-primary-color backlight zoned display LED packaging module according to claim 3, characterized in that, The R medium is disposed between the intermediate barrier wall and the second barrier wall, enclosing the first blue light chip, and its height is not higher than the intermediate barrier wall; When the first blue light chip emits first blue light, the R medium absorbs the first blue light and forms the red light color among the three primary colors through photoexcitation; A portion of the red light passes through the intermediate barrier wall and enters the cavity of the encapsulation module to form the optically transparent adhesive portion, while another portion is reflected back to the optically transparent adhesive portion after encountering the peripheral barrier wall. The C medium is disposed between the intermediate barrier wall and the third barrier wall, enclosing the second blue light chip and the green light chip, and its height is not higher than the intermediate barrier wall; When the second blue light chip emits second blue light, the C medium absorbs a first proportion of the second blue light and forms a cyan color through photoexcitation; A portion of the cyan light shines through the intermediate barrier wall into the cavity of the encapsulation module to form the optically transparent adhesive portion, while another portion is reflected back to the optically transparent adhesive portion after encountering the peripheral barrier wall.

5. The multi-primary-color backlight zoned display LED packaging module according to claim 3, characterized in that, The R medium is disposed between the intermediate barrier wall and the third barrier wall, enclosing the second blue light chip and the green light chip, and its height is not higher than the intermediate barrier wall; when the second blue light chip emits second blue light, the R medium absorbs a first proportion of the second blue light and forms red light in the three primary colors through photoexcitation; part of the red light shines through the intermediate barrier wall into the cavity of the packaging module to obtain the optically transparent adhesive portion, and another part is reflected to the optically transparent adhesive portion after encountering the peripheral barrier wall; The C medium is disposed between the intermediate barrier wall and the second barrier wall, encapsulating the first blue light chip, and its height is not higher than the intermediate barrier wall; when the first blue light chip emits first blue light, the C medium absorbs the first blue light and forms a cyan color through photoexcitation; part of the cyan color shines through the intermediate barrier wall into the cavity of the packaging module to obtain the optically transparent adhesive portion, and another part is reflected to the optically transparent adhesive portion after encountering the peripheral barrier wall.

6. The multi-primary-color backlight zoned display LED packaging module according to claim 4 or 5, characterized in that, The optically transparent adhesive is disposed within the perimeter barrier wall, with the same height as the perimeter barrier wall, and the diffusion particle layer is disposed on the optically transparent adhesive and the perimeter barrier wall; When the unabsorbed second blue light enters the optically transparent adhesive portion, the green light emitted by the green light chip enters the optically transparent adhesive portion. The cyan light and the red light are superimposed on the optically transparent adhesive portion to perform a first light mixing to obtain the target color light. The optically transparent adhesive contains first mixing and diffusion particles to enhance the light mixing effect. The target color light enters the diffusion particle layer and undergoes a second mixing to obtain uniform target color light. The diffusion particle layer contains second mixed diffusion particles, and the concentration of the second mixed diffusion particles in the diffusion particle layer is greater than the concentration of the first mixed diffusion particles in the optically transparent adhesive.

7. The multi-primary-color backlight zoned display LED packaging module according to claim 1, characterized in that, The LED component includes four primary color pads and the same number of green light chips, a first blue light chip, a second blue light chip and a third blue light chip. The four primary color pads include cyan light pads, green light pads, blue light pads and red light pads. The barrier wall assembly includes a middle barrier wall and a peripheral barrier wall, and the height of the middle barrier wall is less than the height of the peripheral barrier wall. The middle barrier wall is cross-shaped and forms four rectangular spaces of the same size with the peripheral barrier walls. The green light chip, the first blue light chip, the second blue light chip and the third blue light chip are respectively placed in one of the rectangular spaces. The R medium is disposed in the space corresponding to the first blue light chip to enclose the first blue light chip, and its height is not higher than the intermediate barrier wall; The C medium is disposed within the space corresponding to the second blue light chip, enclosing the second blue light chip, and its height is not higher than the intermediate barrier wall; When the first blue light chip emits first blue light, the R medium absorbs the first blue light and forms red light from the three primary colors through photoexcitation, which then enters the optically transparent adhesive portion; when the second blue light chip emits second blue light, the C medium absorbs the second blue light and forms cyan light through photoexcitation, which then enters the optically transparent adhesive portion; when the third blue light chip emits blue light, which enters the optically transparent adhesive portion, and when the green light chip emits green light, which enters the optically transparent adhesive portion, the blue light, the green light, the red light, and the cyan light are mixed in the optically transparent adhesive portion and then enter the diffused particle layer for a second mixing, resulting in uniform target color light.

8. The multi-primary-color backlight zoned display LED packaging module according to claim 1, characterized in that, The LED component includes four primary color pads and the same number of green light chips, a first blue light chip, a second blue light chip and a third blue light chip. The four primary color pads include cyan light pads, green light pads, blue light pads and red light pads. The barrier wall assembly includes a middle barrier wall and a peripheral barrier wall. The middle barrier wall includes a first middle barrier wall and a second middle barrier wall. The heights of the first middle barrier wall and the second middle barrier wall are equal and less than the height of the peripheral barrier wall. The first middle barrier wall, the second middle barrier wall, and the peripheral barrier wall form three rectangular spaces. The green light chip and the first blue light chip are placed in the middle rectangular space, and the second blue light chip and the third blue light chip are placed in the rectangular spaces on both sides. The R medium is disposed in the rectangular space in the middle, enclosing the first blue light chip and the green light chip, and its height is not higher than the middle barrier wall; The C medium is disposed within the space corresponding to the second blue light chip, enclosing the second blue light chip, and its height is not higher than the intermediate barrier wall; When the first blue light chip emits first blue light, the R medium absorbs the first blue light and forms red light from the three primary colors through photoexcitation, which then enters the optically transparent adhesive portion; the green light chip emits green light, which then enters the optically transparent adhesive portion; the second blue light chip emits second blue light, the C medium absorbs the second blue light and forms cyan light through photoexcitation, which then enters the optically transparent adhesive portion; the third blue light chip emits blue light, which then enters the optically transparent adhesive portion; the blue light, the green light, the red light, and the cyan light are mixed in the optically transparent adhesive portion, and then enter the diffused particle layer for a second mixing, resulting in uniform target color light.

9. A method for manufacturing a multi-primary-color backlight zoned display LED packaging module, characterized in that, The method of using the multi-color backlight zoned display LED packaging module as described in any one of claims 1-8 includes: Multi-color LED chip pads are fabricated on the top surface of the circuit board, and encapsulation pads are fabricated on the bottom surface of the circuit board. The circuits on both sides of the board are made conductive through through holes. An array of intermediate and peripheral barrier walls is produced by molding or printing, with each cell divided into one or more slots by the intermediate barrier wall. After the LED array is set in the bottom area of ​​the slot between the barrier walls, one slot containing a blue light chip is filled with C medium, which is cyan fluorescent adhesive or cyan quantum dot adhesive, and the other slot containing a blue light chip is filled with R medium, which is red fluorescent adhesive or red quantum dot adhesive. Optical transparent adhesive is applied to each of the surrounding barrier wall grids. The optical transparent adhesive protects the chip and simultaneously forms a multi-primary color mixing area. A diffusion layer adhesive layer containing diffusion particles is applied or molded onto the top. The densely packed circuit board is cut along the surrounding barrier wall to form multiple target LED packaging modules.

10. The method for preparing a multi-primary-color backlight zoned display LED packaging module according to claim 9, characterized in that, After the intermediate barrier wall and the surrounding barrier wall dam array are manufactured by molding or printing, the process also includes: Each grid within the perimeter barrier wall dam is divided into a first slot and a second slot based on the intermediate barrier wall, wherein the first slot is larger than the second slot; After setting the LED array in the bottom area of ​​the slot between the barrier walls, a green light chip and a second blue light chip are set in the first slot and filled with C medium, which is cyan fluorescent adhesive or cyan quantum dot adhesive. A first blue light chip is set in the second slot and filled with R medium, which is red fluorescent adhesive or red quantum dot adhesive.

11. A display based on the multi-primary-color backlight zone display LED packaging module according to any one of claims 1-8, characterized in that, The display includes a target backlight module and a liquid crystal display panel: The target backlight module includes a substrate and a target packaging module, a driver IC, a reflective sheet, a diffuser plate, and a film disposed on the substrate. The target packaging module is disposed on the substrate in an array and is connected to the driver IC through a circuit. The target packaging module is a multi-primary-color backlight zone display LED packaging module. The liquid crystal display panel is positioned in front of the light emission direction of the target backlight module and is used to control the RGBC light source current connected to the target backlight module through a light mixing and color mixing algorithm to achieve color display.

12. The display according to claim 11, characterized in that: The target backlight module includes a red light source, a cyan light source, a green light source, and a blue light source; The liquid crystal display panel has red sub-pixels, green sub-pixels and blue sub-pixels; The liquid crystal display panel controls the RGBC light source current connected to the target backlight module through a color mixing algorithm to achieve color display, where a display cycle of one frame includes a first subframe and a second subframe: During the first subframe, all subpixels of the liquid crystal display panel are turned on, and the red light source and cyan light source in the backlight module are controlled to emit light synchronously. During the second subframe, the green and blue subpixels of the liquid crystal display panel are turned on, and the green and blue light sources in the backlight module are simultaneously controlled to emit light.

13. The display according to claim 12, characterized in that, During the first subframe, the red subpixel is used to modulate the light intensity of the red light source, and the green subpixel and the blue subpixel are used together to modulate the light intensity of the cyan light source.

Images