A semiconductor processing apparatus

Abstract

The present application provides a semiconductor processing device, which comprises a bottom plate, an air bag, a lower fixed plate, a lower cavity, an upper fixed plate, an upper cavity, an outer wall, a guide column, a top plate and a stroke control device, the upper cavity is fixed in position, the stroke control device can adjust the distance between the lower cavity and the upper cavity and keep the balance of the lower cavity. The present application adopts at least three semispherical protrusions to form fulcrums, so as to keep the horizontal state of the top of the lower cavity and prevent the lower cavity from tilting.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and more specifically to a semiconductor processing apparatus. Background Technology

[0002] In existing technologies, wafer processing cavities require the closure of upper and lower cavities. The lower cavity is lifted by placing an airbag at its bottom and pumping air into it. Airbags are used because they offer advantages such as small size, easy storage, and high load-bearing capacity. However, airbags also introduce drawbacks: the top of the airbag cannot remain horizontal during lifting, potentially causing the lower cavity to tilt during closure. This can lead to sealing problems or cavity wear. Furthermore, a semi-closed state is required during actual operation, but airbags alone are insufficient to control the movement of the lower cavity.

[0003] Therefore, it is necessary to provide a new technical solution. Summary of the Invention

[0004] To address the technical problems existing in the prior art, the present invention discloses a semiconductor processing device, the specific technical solution of which is as follows:

[0005] This invention provides a semiconductor processing apparatus, including a base plate, an airbag, a lower fixing plate, a lower cavity, an upper fixing plate, an upper cavity, and a stroke control device.

[0006] The upper cavity is fixed in position, and the stroke control device can adjust the distance between the lower cavity and the upper cavity and maintain the balance of the lower cavity.

[0007] Preferably, the upper cavity is fixed to the upper fixing plate, and the position of the upper fixing plate is fixed.

[0008] The lower cavity is fixed to the lower fixing plate, and the lower cavity is positioned directly below the upper cavity.

[0009] The base plate is located below the lower fixed plate.

[0010] The airbag is positioned between the lower fixing plate and the base plate. After the airbag is inflated, it lifts the lower fixing plate upwards until the lower cavity and the upper cavity are joined together.

[0011] The first end of the stroke control device is fixed on the upper fixed plate, and the second end of the stroke control device extends downward to above the lower fixed plate. The second end of the stroke control device can extend and retract. When the lower fixed plate is raised to contact the second end of the stroke control device, the stroke control device adjusts the distance between the lower fixed plate and the upper fixed plate by extending and retracting the end of the second end.

[0012] Preferably, the stroke control device comprises at least three devices evenly distributed along the edge of the upper fixed plate.

[0013] Preferably, the stroke control device includes a telescopic motor, a pole head, and a position sensor.

[0014] The telescopic motor is fixed to the upper fixed plate. The telescopic rod of the telescopic motor extends downward and is fixedly connected to the first end of the rod head. The second end of the rod head extends horizontally outward. The rod head is positioned above the lower fixed plate. The position sensor is fixed to the upper fixed plate and detects the position of the second end of the rod head.

[0015] Preferably, the first end of the rod head is provided with a plurality of arc-shaped holes spaced apart circumferentially, and the bottom center of the first end of the rod head is provided with a hemispherical protrusion.

[0016] Preferably, the stroke control device further includes a first bushing, a pad, and a push rod.

[0017] A through hole is provided on the upper fixing plate below the telescopic motor, and the telescopic rod extends downward from the through hole.

[0018] The first bushing is disposed within the through hole. The top edge of the first bushing extends radially outward to form a raised edge that engages with the top of the upper fixing plate. A sealing ring is embedded on the outer side of the first bushing, providing a sealed connection with the upper fixing plate.

[0019] The pad is positioned above the first bushing, and the telescopic motor is positioned above the pad. The telescopic motor is connected and fixed to the upper fixing plate by screws passing through the pad and the protruding edge of the first bushing.

[0020] The push rod is disposed inside the first bushing, and the push rod is fixedly connected to the telescopic rod and the rod head respectively. A sealing ring is embedded on the outside of the push rod and is sealed to the first bushing.

[0021] Preferably, it also includes guide posts.

[0022] The guide posts are located at the four corners of the base plate, and the guide posts pass through the lower fixing plate and the upper fixing plate in sequence. The guide posts are provided with fixing nuts to fix the position of the upper fixing plate, and the lower fixing plate is slidably mounted on the guide posts.

[0023] The present invention has the following beneficial effects:

[0024] 1. The semiconductor processing device provided by the present invention has a simple structure and ingenious design, and is easy to manufacture and modify.

[0025] 2. The semiconductor processing device provided by the present invention employs at least one hemispherical protrusion structure to form a fulcrum, so as to maintain the horizontal state of the top of the lower cavity and prevent the lower cavity from tilting.

[0026] 3. The semiconductor processing device provided by the present invention adopts a telescopic motor structure, which can actively control the distance between the lower cavity and the upper cavity.

[0027] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a cross-sectional structural schematic diagram of the semiconductor processing device provided in an embodiment of the present invention.

[0030] Figure 2 yes Figure 1 A magnified schematic diagram of the mid-stroke control device.

[0031] Figure 3 This is a schematic diagram of the structure of the rod head of the semiconductor processing device provided in an embodiment of the present invention.

[0032] The reference numerals in the attached figures are:

[0033] The components include: base plate 10, airbag 20, upper fixing plate 30, upper cavity 40, lower fixing plate 50, lower cavity 60, stroke control device 70, and guide column 80.

[0034] Telescopic motor 71, rod head 72, position sensor 73, first bushing 74, pad 75, top rod 76, arc-shaped hole 721 and hemispherical protrusion 722. Detailed Implementation

[0035] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] The semiconductor processing apparatus of the present invention, with reference to Figures 1 to 3 It includes a base plate 10, an airbag 20, an upper fixing plate 30, an upper cavity 40, a lower fixing plate 50, a lower cavity 60, a stroke control device 70, and a guide post 80. The upper cavity 40 is fixed in position, and the stroke control device 70 can adjust the distance between the lower cavity 60 and the upper cavity 40 and maintain the balance of the lower cavity 60.

[0039] In one embodiment, the upper cavity 40 is fixed on the upper fixing plate 30, and the position of the upper fixing plate 30 is fixed. The lower cavity 60 is fixed on the lower fixing plate 50, and the lower cavity 60 is disposed directly below the upper cavity 40. The bottom plate 10 is disposed below the lower fixing plate 50. The airbag 20 is disposed between the lower fixing plate 50 and the bottom plate 10. After the airbag 20 is inflated, it lifts the lower fixing plate 50 upward until the lower cavity 60 and the upper cavity 40 are joined together.

[0040] The first end of the stroke control device 70 is fixed on the upper fixed plate 30, and the second end of the stroke control device 70 extends downward to above the lower fixed plate 50. The second end of the stroke control device 70 can extend and retract. When the lower fixed plate 50 is raised to contact the second end of the stroke control device 70, the stroke control device 70 adjusts the distance between the lower fixed plate 50 and the upper fixed plate 30 by extending and retracting the end of the second end.

[0041] Preferably, the stroke control device 70 includes at least three devices evenly distributed along the edge of the upper fixing plate 30. Specifically, when there are three stroke control devices 70, they are arranged in an equilateral triangle. When there are four stroke control devices 70, they are located at the midpoints of the four sides of the upper fixing plate 30. When there are eight stroke control devices 70, two stroke control devices 70 are symmetrically arranged at the four corners of the upper fixing plate 30. This ensures that the top of the lower cavity 60 remains horizontal and does not tilt, allowing for normal cavity closing with the upper cavity 40.

[0042] Preferably, the stroke control device 70 includes a telescopic motor 71, a rod head 72, a position sensor 73, a first bushing 74, a pad 75, and a push rod 76.

[0043] In one embodiment, the telescopic motor 71 is fixed to the upper fixed plate 30. The telescopic rod of the telescopic motor 71 extends downward and is fixedly connected to the first end of the rod head 72. The second end of the rod head 72 extends horizontally outward. The rod head 72 is positioned above the lower fixed plate 50. The position sensor 73 is fixed to the upper fixed plate 30 and detects the position of the second end of the rod head 72. By detecting whether each rod head 72 remains horizontal, the position sensor 73 determines whether the lower cavity 60 remains horizontal. Furthermore, the position of the position sensor 73 can be arbitrarily set, such as being fixed to the side wall, as long as it can detect the position of the second end of the rod head 72. The second end of the rod head 72 extends beyond the upper fixed plate 30 in the horizontal direction for easy external measurement.

[0044] Preferably, the first end of the rod head 72 is provided with a plurality of arc-shaped holes 721 spaced apart circumferentially, and the bottom center of the first end of the rod head 72 is provided with a hemispherical protrusion 722. The arc-shaped holes 721 can adjust the connection position between the rod head and the top rod 76, and the hemispherical protrusion 722 can ensure that the contact between the lower fixing plate 50 and the rod head 72 is point contact and will not tilt.

[0045] In one embodiment, a through hole is provided on the upper fixing plate 30 below the telescopic motor 71, and the telescopic rod extends downward from the through hole. A first bushing 74 is disposed within the through hole, and the top edge of the first bushing 74 extends radially outward to form a raised edge that engages with the top of the upper fixing plate 30. A sealing ring is embedded on the outer side of the first bushing 74, sealingly connecting it to the upper fixing plate 30. A pad 75 is disposed above the first bushing 74, and the telescopic motor 71 is disposed above the pad 75. The telescopic motor 71 is connected and fixed to the upper fixing plate 30 by screws passing through the pad 75 and the raised edge of the first bushing 74. A top rod 76 is disposed inside the first bushing 74, and the top rod 76 is fixedly connected to both the telescopic rod and the rod head 72. A sealing ring is embedded on the outer side of the top rod 76, sealingly connecting it to the first bushing 74. This double sealing prevents internal acid gas from escaping and corroding the equipment.

[0046] In one embodiment, the guide post 80 is disposed at the four corners of the base plate 10, and the guide post 80 passes through the lower fixing plate 50 and the upper fixing plate 30 in sequence. The guide post 80 is provided with a fixing nut to fix the position of the upper fixing plate 30, and the lower fixing plate 50 is slidably disposed on the guide post 80.

[0047] The working principle of this invention is as follows: multiple telescopic motors are installed on the upper fixed plate. The telescopic rod of the telescopic motor passes through the upper fixed plate and is fixedly connected to one end of the rod head. The other end of the rod head extends out of the upper fixed plate. The position sensor detects whether the multiple rod heads are on the same horizontal plane to determine whether the lower cavity is horizontal. If it is not horizontal, the lower cavity is adjusted to reach a horizontal state by adjusting the corresponding telescopic motor.

[0048] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0049] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications and variations to the above embodiments within the scope of the present invention.

Claims

1. A semiconductor processing apparatus, characterized in that, It includes a base plate, airbag, lower fixing plate, lower cavity, upper fixing plate, upper cavity, and stroke control device. The upper cavity is fixed in position, and the stroke control device can adjust the distance between the lower cavity and the upper cavity and maintain the balance of the lower cavity.

2. The semiconductor processing apparatus according to claim 1, characterized in that, The upper cavity is fixed to the upper fixing plate, and the position of the upper fixing plate is fixed. The lower cavity is fixed to the lower fixing plate, and the lower cavity is positioned directly below the upper cavity. The base plate is located below the lower fixed plate. The airbag is positioned between the lower fixing plate and the base plate. After the airbag is inflated, it lifts the lower fixing plate upwards until the lower cavity and the upper cavity are joined together. The first end of the stroke control device is fixed on the upper fixed plate, and the second end of the stroke control device extends downward to above the lower fixed plate. The second end of the stroke control device can extend and retract. When the lower fixed plate is raised to contact the second end of the stroke control device, the stroke control device adjusts the distance between the lower fixed plate and the upper fixed plate by extending and retracting the end of the second end.

3. The semiconductor processing apparatus according to claim 1, characterized in that, The stroke control device includes at least three units, which are evenly distributed along the edge of the upper fixed plate.

4. The semiconductor processing apparatus according to claim 1, characterized in that, The travel control device includes a telescopic motor, a pole head, and a position sensor. The telescopic motor is fixed to the upper fixed plate. The telescopic rod of the telescopic motor extends downward and is fixedly connected to the first end of the rod head. The second end of the rod head extends horizontally outward. The rod head is positioned above the lower fixed plate. The position sensor is fixed to the upper fixed plate and detects the position of the second end of the rod head.

5. The semiconductor processing apparatus according to claim 4, characterized in that, The first end of the club head has multiple arc-shaped holes spaced apart circumferentially, and the bottom center of the first end of the club head has a hemispherical protrusion.

6. The semiconductor processing apparatus according to claim 4, characterized in that, The stroke control device also includes a first bushing, a pad, and a push rod. A through hole is provided on the upper fixing plate below the telescopic motor, and the telescopic rod extends downward from the through hole. The first bushing is disposed within the through hole. The top edge of the first bushing extends radially outward to form a raised edge that engages with the top of the upper fixing plate. A sealing ring is embedded on the outer side of the first bushing, providing a sealed connection with the upper fixing plate. The pad is positioned above the first bushing, and the telescopic motor is positioned above the pad. The telescopic motor is connected and fixed to the upper fixing plate by screws passing through the pad and the protruding edge of the first bushing. The push rod is disposed inside the first bushing, and the push rod is fixedly connected to the telescopic rod and the rod head respectively. A sealing ring is embedded on the outside of the push rod and is sealed to the first bushing.

7. The semiconductor processing apparatus according to claim 2, characterized in that, It also includes guide pillars, The guide posts are located at the four corners of the base plate, and the guide posts pass through the lower fixing plate and the upper fixing plate in sequence. The guide posts are provided with fixing nuts to fix the position of the upper fixing plate, and the lower fixing plate is slidably mounted on the guide posts.

Images