Semiconductor processing apparatus

Abstract

This application discloses a semiconductor process apparatus, belonging to the field of semiconductor technology. The semiconductor process apparatus includes a chamber body, within which is a base for supporting a wafer and a spray device for performing a cleaning process on the wafer. The spray device includes a support member and a spray beam. The spray beam is mounted on the chamber body via the support member. The spray beam has a spray channel inside for introducing cleaning media, and multiple nozzles are spaced apart along its extension direction, each nozzle communicating with a spray channel. During cleaning media spraying, the spray beam is fixed above the base, and the orthogonal projection of the spray beam's axis onto the wafer-supporting surface of the base passes through the center point of the supporting surface. Using this embodiment, the cleaning media can cover the surface of the wafer supported by the base, resulting in a more uniform liquid film on the wafer surface, which improves the cleaning effect.

Description

Technical Field

[0001] This application belongs to the field of semiconductor cleaning technology, specifically relating to a semiconductor process equipment. Background Technology

[0002] In the semiconductor field, as wafer fabrication processes become more advanced, higher requirements are placed on wafer cleaning processes, and the uniformity of the liquid film formed on the wafer surface during the cleaning process is becoming increasingly important.

[0003] In related technologies, refer to Figure 1 As shown, the semiconductor process equipment includes a base 10 supporting a wafer 20 and a spray device. The spray device is used to spray a cleaning medium onto the wafer 20. The spray device includes a rotary motor 30, a spray arm 40, and a nozzle 50. The output shaft of the rotary motor 30 is connected to the spray arm 40, and the rotary motor 30 can drive the spray arm 40 to swing. The nozzle 50 is disposed at the end of the spray arm 40 and can spray the cleaning medium. Thus, when the spray arm 40 drives the nozzle 50 to move above the wafer 20 and swings under the drive of the rotary motor 30, the nozzle 50 can spray the cleaning medium onto the wafer 20. However, referring to... Figure 2 As shown, during the swinging process of the spray arm 40 driven by the rotary motor 30, the movement trajectory of the nozzle 50 is arc-shaped. Since the wafer 20 is rotating during the spraying process, the cleaning medium is thrown towards the edge area of ​​the wafer 20 under the action of centrifugal force. This results in a thinner or even no liquid film formed in the central area of ​​the wafer 20, while the liquid film formed in the edge area of ​​the wafer 20 is thicker, resulting in uneven liquid film and poor cleaning effect.

[0004] Specifically, the annular liquid film 21 formed before the spray arm 40 swings and the annular liquid film 21 formed after the swing are referenced. Figure 3 As shown, during the swinging process of the spray arm 40, the width of the annular liquid film 21 formed is also larger, but the central area of ​​the wafer 20 is not sprayed with cleaning medium, resulting in the central area of ​​the wafer 20 being unable to be cleaned, and the cleaning effect is poor. Summary of the Invention

[0005] The purpose of this application is to provide a semiconductor process equipment that can solve the problem of poor cleaning effect in related technologies.

[0006] This application provides a semiconductor process apparatus, including a chamber body. The chamber body contains a base for supporting a wafer and a spray device for performing a cleaning process on the wafer. The spray device includes a support member and a spray beam, the spray beam being mounted on the chamber body via the support member. The spray beam has a spray channel inside for introducing cleaning medium, and the spray beam is provided with multiple nozzles at intervals along its extension direction, each of the nozzles being connected to the spray channel. When the cleaning medium is sprayed, the spray beam is fixed above the base, and the orthographic projection of the axis of the spray beam onto the bearing surface of the base that carries the wafer passes through the center point of the bearing surface.

[0007] In this embodiment, a spray beam is provided with multiple nozzles spaced apart along its extension direction. Therefore, the spray beam can spray cleaning medium along its extension direction. Furthermore, the orthogonal projection of the spray beam's axis onto the bearing surface of the base passes through the center point of the bearing surface. This means that when spraying the cleaning medium, the cleaning medium passes through the center point of the bearing surface, i.e., the cleaning medium is sprayed through the nozzles into the diameter direction of the wafer supported by the bearing surface. During the rotation of the wafer driven by the base, the cleaning medium sprayed by the multiple nozzles can cover the surface of the wafer, avoiding uneven spraying of the cleaning medium caused by centrifugal force in the rotational spraying method. Therefore, the liquid film formed on the wafer surface is more uniform, which is beneficial for improving the cleaning effect. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of semiconductor process equipment disclosed in related technologies; Figure 2 It is a top view of the spray arm and wafer disclosed in the relevant technology; Figure 3 This is a schematic diagram of the formation of a liquid film on a wafer before and after the spray arm oscillates, as disclosed in the relevant technology. Figure 4 This is a schematic diagram of the structure of the semiconductor process equipment disclosed in the embodiments of this application; Figure 5 This is a schematic diagram of the interaction between the spray device and the wafer disclosed in the embodiments of this application; Figure 6 This is a partial structural schematic diagram of the spraying device disclosed in the embodiments of this application; Figure 7 This is a schematic diagram of the spray beam when only the transmission rod supports the spray beam, as disclosed in the embodiments of this application; Figure 8 This is a schematic diagram of the spray beam when the transmission rod and guide rod jointly support the spray beam, as disclosed in the embodiments of this application; Figure 9 This is a partial cross-sectional view of the spraying device disclosed in the embodiments of this application; Figure 10 This is a diagram illustrating the spraying effect of the spraying device disclosed in this application when cleaning media are introduced into each media inlet; Figure 11 yes Figure 10A top view of the liquid film and spray zone formed on the wafer in the indicated state; Figure 12 This is a diagram illustrating the spraying effect of a spraying device when cleaning medium is introduced into a portion of the media inlet, as disclosed in an embodiment of this application. Figure 13 yes Figure 12 A top view of the liquid film and spray zone formed on the wafer in the indicated state; Figure 14 These are cross-sectional views of different types of nozzles disclosed in the embodiments of this application; Figure 15 This is a cross-sectional view of the sealing component disclosed in the embodiments of this application; Figures 16-18 These are schematic diagrams illustrating the spraying effect of the spraying device with different spray nozzles in a blocked state, as disclosed in the embodiments of this application. Figure 19 This is a schematic diagram of the structure of a semiconductor process equipment disclosed in another embodiment of this application; Figure 20 This is a schematic diagram of the structure of a spraying device disclosed in another embodiment of this application.

[0009] Explanation of reference numerals in the attached figures: 10-Base, 20-Wafer, 21-Annular liquid film, 30-Rotary motor, 40-Spray arm, 50-Nozzle 100 - Chamber body, 110 - Base, 111 - Wafer, 111a - Liquid film 200-Support component, 210-Support beam, 220-Transmission rod, 230-Guide rod, 300 - Spray beam, 310 - Linear spray beam, 320 - Annular spray beam, 301 - Spray channel, 301a - Media inlet 410 - Nozzle, 411 - Injection hole, 420 - Sealing component 510 - First drive mechanism, 520 - Second drive mechanism 610 - Threaded sleeve, 620 - Guide cylinder a - First spray zone, b - Second spray zone, c - Spray belt A - First direction, B - Second direction, C - Third direction. Detailed Implementation

[0010] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0011] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0012] The semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0013] Please refer to Figures 4-20 As shown, the semiconductor process equipment disclosed in this application includes a chamber body 100, a base 110 and a spray device inside the chamber body 100. The base 110 is used to support a wafer 111 and has a support surface. Specifically, the upper surface of the base 110 is the support surface. The base 110 supports the wafer 111 through the support surface and drives the wafer 111 to rotate at high speed. The spray device is used to perform a cleaning process on the wafer 111.

[0014] refer to Figure 5 As shown, the spraying device includes a support member 200 and a spray beam 300. The support member 200 serves as the supporting base for the spray beam 300 and is mounted on the chamber body 100 of the semiconductor process equipment. The spray beam 300 is used to spray cleaning media onto the wafer 111, and the spray beam 300 is located on the chamber body 100 via the support member 200. Optionally, the spray beam 300 and the support member 200, and the support member 200 and the chamber body 100, can be connected by welding, bonding, or other methods.

[0015] The support member 200 can be a support rod, support frame, etc., and the specific structure of the support member 200 is not limited in this application embodiment. Optionally, the end of the spray beam 300 is connected to the support member 200, and the spray beam 300 can be a straight structure, a ring structure, etc., and the specific structure of the spray beam 300 is not limited in this application embodiment.

[0016] The spray beam 300 is connected to a storage device for the cleaning medium (not shown in the figure), and its interior is provided with a spray channel 301 for the flow of the cleaning medium. The cleaning medium can be gas or liquid; this embodiment does not limit the type of cleaning medium. Optionally, the spray channel 301 has a strip-shaped structure and extends along the extending direction of the spray beam 300. (Reference) Figure 6 and Figure 7As shown, the spray beam 300 is provided with a plurality of nozzles 410 at intervals along its extension direction (i.e., the second direction B). Each nozzle 410 is connected to the spray channel 301. In this way, the spray beam 300 sprays the cleaning medium along its own extension direction. The cleaning medium flowing through the spray channel 301 is sprayed out through the plurality of nozzles 410, forming a large spray area on the surface of the wafer 111.

[0017] During the spray cleaning medium application, the spray beam 300 is fixed above the base 110, and the orthographic projection of the axis of the spray beam 300 onto the bearing surface of the wafer 111 supported by the base 110 passes through the center point of the bearing surface. In other words, during the spray cleaning medium application, the cleaning medium sprayed by the multiple nozzles 410 can extend along the diameter of the wafer 111. As the base 110 rotates the wafer 111, the cleaning medium can extend from the center region of the wafer 111 to its edge, achieving complete coverage of the wafer 111 surface and preventing uneven spraying of the cleaning medium due to centrifugal force in the rotational spraying method.

[0018] Therefore, the spraying device in this embodiment can avoid the problem of uneven liquid film formation caused by rotating the sprayer, making the liquid film formed on the surface of the wafer 111 more uniform, which is beneficial to improving the cleaning effect.

[0019] In an optional embodiment, refer to Figure 5 As shown, the support member 200 can drive the spray beam 300 to move along a first direction A, which is parallel to the bearing surface. Optionally, the end of the spray beam 300 can be fixedly connected to the support member 200 by welding, bonding, or other means, and the support member 200 moves along the first direction A, causing the spray beam 300 to move together; or, the end of the spray beam 300 can be drivenly connected to the support member 200, and the support member 200 rotates, causing the spray beam 300 to move along the first direction A.

[0020] refer to Figure 6 and Figure 7 As shown, the spray beam 300 extends along the second direction B, that is, the spray beam 300 is provided with multiple nozzles 410 at intervals along the second direction B, and the second direction B is parallel to the bearing surface. Optionally, the nozzles 410 can be evenly distributed along the second direction B, or the nozzles 410 can be unevenly distributed along the second direction B.

[0021] In this configuration, the first direction A intersects with the second direction B. Optionally, the first direction A can be perpendicular to the second direction B, and the spray beam 300 can be a straight structure, with the second direction B being the length direction of the spray beam 300. Of course, the first direction A can intersect with the second direction B but not be perpendicular.

[0022] With this configuration, multiple nozzles 410 spaced apart along the second direction B spray cleaning medium toward the wafer 111. The distance from each nozzle 410 to the bearing surface is equal, and the cleaning medium sprayed by each nozzle 410 has a similar cleaning effect on different positions of the wafer, which is more conducive to improving the uniformity of cleaning.

[0023] In this embodiment, the support member 200 drives the spray beam 300 to move in a direction parallel to the bearing surface (i.e., the first direction A), so that when the cleaning medium is sprayed, the spray beam 300 is accurately positioned above the base 110. This is more conducive to ensuring that the orthogonal projection of the axis of the spray beam 300 on the bearing surface passes through the center point of the bearing surface, ensuring that the cleaning medium can cover the surface of the wafer 111 supported by the bearing surface. This is beneficial to making the liquid film 111a formed on the surface of the wafer 111 more uniform and improving the cleaning effect.

[0024] Of course, in other embodiments, the first direction A can intersect with the bearing surface, that is, the support member 200 drives the spray beam 300 to move in a direction not parallel to the bearing surface, as long as the spray beam 300 can be moved above the base 110 before cleaning, and the orthogonal projection of the axis of the spray beam 300 on the bearing surface passes through the center point of the bearing surface. When spraying the cleaning medium, the spray beam 300 remains stationary.

[0025] In one alternative embodiment, reference is made to... Figure 5 As shown, the support member 200 includes a transmission rod 220, the end of which is rotatably disposed on the chamber body 100. Optionally, the end of the transmission rod 220 can be directly rotatably disposed on the chamber body 100, or the end of the transmission rod 220 can be rotatably disposed on other components, thereby indirectly disposed on the chamber body 100. The transmission rod 220 is used to transmit power to drive the spray beam 300 to move along the first direction A. The transmission rod 220 can be a circular rod, and the transmission rod 220 extends along the first direction A.

[0026] The first end of the spray beam 300 is connected to the transmission rod 220. When the transmission rod 220 rotates around its own axis, it can drive the spray beam 300 to move along the first direction A. Thus, when the transmission rod 220 rotates around its own axis, it can drive the spray beam 300 to move along the first direction A.

[0027] Optionally, the support member 200 further includes a support beam 210, which serves as a support member for the transmission rod 220 and extends along the second direction B. The end of the transmission rod 220 is rotatably disposed at the first end of the support beam 210, and the first end of the spray beam 300 and the transmission rod 220 are in transmission cooperation in the helical transmission direction of the transmission rod 220.

[0028] Optionally, a first shaft hole may be provided at the first end of the support beam 210, through which the transmission rod 220 passes, and the transmission rod 220 is rotatably engaged with the first shaft hole. Further optionally, a bearing may be provided between the first shaft hole and the transmission rod 220 to reduce the friction between the transmission rod 220 and the support beam 210 during rotation. refer to Figure 7 As shown, since the transmission rod 220 only provides support on one side of the spray beam 300, the other end of the spray beam 300 is suspended in the air. The spray beam 300 is prone to bending and deformation due to its own weight, which may lead to breakage over time. Moreover, when the nozzle 410 of the spray beam 300 sprays the cleaning medium, the cleaning medium in the spray channel 301 will also exert downward pressure on the spray beam 300, causing the spray beam 300 to bend and deform downward. Consequently, the nozzle 410 cannot spray the surface of the wafer 111 vertically downward due to the bending and deformation of the spray beam 300, affecting the spraying and cleaning effect.

[0029] In another embodiment, reference Figure 5 and Figure 8 As shown, the support member 200 also includes a guide rod 230, which can be a square rod, a round rod, etc. The end of the guide rod 230 is connected to the second end of the support beam 210. Optionally, the end of the guide rod 230 can be fixedly connected to the support beam 210 by welding, bonding, or other methods; or, when the guide rod 230 is a round rod, the support beam 210 can be provided with a shaft hole, and the end of the guide rod 230 passes through the shaft hole, and the guide rod 230 and the support beam 210 are rotatably engaged. Moreover, the axis of the transmission rod 220 is parallel to the axis of the guide rod 230, that is, both the transmission rod 220 and the guide rod 230 can extend along the first direction A. The second end of the spray beam 300 is guided and engaged with the guide rod 230. When the first end of the spray beam 300 moves along the extension direction of the transmission rod 220 under the transmission of the transmission rod 220, the second end will also slide along the extension direction of the guide rod 230, thereby realizing the movement of the spray beam 300 along the first direction A.

[0030] Optionally, the spray beam 300 and the guide rod 230 can be guided by guide rails and guide blocks, or by other structures. In this way, the guide rod 230 guides the movement direction of the spray beam 300, which helps the spray beam 300 to move better along the first direction A.

[0031] In this embodiment, the addition of a guide rod 230 to support the second end of the spray beam 300 helps to make the spray beam 300 more stable, avoids bending deformation of the spray beam 300 due to gravity, and ensures the spraying and cleaning effect.

[0032] In one optional embodiment, the spraying device further includes a sleeve connected to the first end of the spray beam 300. The sleeve is fitted over the outside of the transmission rod 220. One of the inner wall surface of the sleeve and the transmission rod 220 is provided with a spiral groove, and the other with a cylindrical protrusion. The cylindrical protrusion extends into the spiral groove and slides within it, thereby achieving a spiral engagement between the spray beam 300 and the transmission rod 220. Thus, when the transmission rod 220 rotates, the cylindrical protrusion and the spiral groove drive the sleeve to move along the first direction A. Simultaneously, the sleeve drives the spray beam 300 to move along the first direction A.

[0033] In another embodiment, the spraying device further includes a threaded sleeve 610, which is connected to the first end of the spray beam 300. The transmission rod 220 is a screw, and the threaded sleeve 610 is sleeved on the outside of the screw, with the threaded sleeve 610 threadedly engaged with the screw. That is, the threaded sleeve 610 has a threaded hole, through which the screw passes, and the internal thread of the threaded hole engages with the external thread of the screw. Specifically, both the threaded sleeve 610 and the screw have threaded protrusions and threaded grooves, with a threaded groove formed between two adjacent threaded protrusions. The threaded sleeve 610 and the screw achieve a helical engagement through multiple threaded protrusions and multiple threaded grooves.

[0034] In this embodiment, the threaded sleeve 610 and the screw are threaded together, which helps to increase the mating area between the threaded sleeve 610 and the screw. When the screw rotates, it is more conducive to the threaded sleeve 610 driving the spray beam 300 to move stably along the first direction A. Moreover, the transmission rod 220 is directly a screw, and the threaded sleeve 610 can be directly a nut or other structure, without the need to separately open a structure for mating the transmission rod 220 and the threaded sleeve 610, which helps to simplify the structure.

[0035] In an optional embodiment, refer to Figures 5-6 as well as Figure 8 Figure 9 As shown, the spraying device also includes a guide cylinder 620, which is connected to the second end of the spray beam 300. Optionally, the guide cylinder 620 can be fixedly connected to the second end of the spray beam 300 by welding, bonding or other means. The guide cylinder 620 is sleeved on the outside of the guide rod 230, and the guide cylinder 620 and the guide rod 230 are guided and cooperated.

[0036] Optionally, the guide rod 230 can be a square rod, and the guide cylinder 620 can be provided with a square through hole, through which the square rod passes, and the surface of the square rod is in clearance fit with the wall surface of the square through hole; the guide rod 230 can also be a round rod, and the guide cylinder 620 can be provided with a round through hole, through which the round rod passes, and the surface of the round rod is in clearance fit with the wall surface of the round through hole. Of course, the through holes of the guide rod 230 and the guide cylinder 620 can be set to other shapes, and this application embodiment does not limit this, as long as the guide cylinder 620 can slide smoothly in the extension direction of the guide rod 230.

[0037] In this embodiment, the guide structure adopts a guide cylinder 620, which is sleeved on the outside of the guide rod 230. This is beneficial to increase the mating area between the guide cylinder 620 and the guide rod 230, and is more conducive to guiding the movement direction of the spray beam 300, so that the spray beam 300 moves accurately along the extension direction of the guide rod 230, i.e., the first direction A.

[0038] In a further embodiment, a bearing is provided between the guide cylinder 620 and the guide rod 230. This bearing can be a linear bearing, which helps to reduce the frictional force during the relative sliding process of the guide cylinder 620 and the guide rod 230, and facilitates the smooth movement of the spray beam 300. When the guide rod 230 is rotatably engaged with the support beam 210, a bearing can also be provided between the guide rod 230 and the support beam 210.

[0039] Of course, in other embodiments, a bearing may not be provided between the guide cylinder 620 and the guide rod 230, that is, the inner wall surface of the guide cylinder 620 and the guide rod 230 may directly slide in contact.

[0040] In an optional embodiment, refer to Figure 5 and Figure 20 As shown, the spraying device also includes a first drive mechanism 510, which is connected to the transmission rod 220. The drive mechanism drives the transmission rod 220 to rotate around its own axis. Optionally, the first drive mechanism 510 may include a drive motor. The housing of the drive motor and the support beam 210 can be connected by bonding, welding, or other methods. The output shaft of the drive motor is connected to the transmission rod 220 to drive the transmission rod 220 to rotate. Further, the support beam 210 may include a gear set. The output shaft of the drive motor is connected to the transmission rod 220 through the gear set, and the speed of the transmission rod 220 is controlled by the gear set. Of course, the first drive mechanism 510 can also be a pneumatic motor or other drive source, as long as it can provide rotational power to the transmission rod 220.

[0041] In this embodiment, the spraying device is equipped with a first driving mechanism 510. The first driving mechanism 510 drives the transmission rod 220 to rotate, thereby moving the spraying beam 300. This can be achieved without external force or external structure, making the spraying process easier to implement.

[0042] Of course, in other embodiments, the spraying device may not have the first drive mechanism 510, and the transmission rod 220 may be driven to rotate by external force or a drive component other than the spraying device.

[0043] In an optional embodiment, refer to Figure 5 and Figure 20As shown, the spraying device also includes a second drive mechanism 520, which is connected to the support beam 210 to drive the support beam 210 to move along a third direction C. The second drive mechanism 520 drives the support beam 210 to drive the transmission rod 220, the guide rod 230 and the spray beam 300 to move along the third direction C. The third direction C intersects with the bearing surface. Optionally, the third direction C can be perpendicular to the bearing surface, that is, the third direction C is perpendicular to the first direction A and the second direction B respectively, and the third direction C is a vertical direction.

[0044] Optionally, the second drive mechanism 520 can be a telescopic cylinder, a linear module, or other drive mechanism capable of generating linear drive. In this embodiment, the second drive mechanism 520 includes a linear guide rail, a drive motor, and a transmission assembly. The linear guide rail extends along a third direction C. The drive motor and the transmission assembly are disposed inside the linear guide rail. The output shaft of the drive motor is connected to the support beam 210 through the transmission assembly. When the drive motor is working, it can drive the support beam 210 to move along the extension direction of the linear guide rail.

[0045] In this embodiment, by adding a second driving mechanism 520, the position of the spray device in the third direction C can be adjusted, thereby adjusting the distance between the spray beam 300 and the wafer 111 supported by the bearing surface, so as to adjust the spraying effect as needed. In the embodiment where both the first driving mechanism 510 and the second driving mechanism 520 are provided, the first driving mechanism 510 and the second driving mechanism 520 are located at the two ends of the support beam 210, which is more reasonable than the method of arranging them adjacent to each other.

[0046] Of course, in other embodiments, the spray device may not have a second drive mechanism 520, and the support beam 210 may be directly fixedly installed on the chamber body 100, so that the position of the spray device in the third direction C is fixed.

[0047] In one optional embodiment, the number of spray channels 301 is one, which extends along the extension direction of the spray beam 300. Thus, when cleaning medium is introduced into the spray channel 301, the resulting spray area remains constant.

[0048] In another embodiment, reference Figure 9As shown, at least two spray channels 301 are spaced apart along the extension direction of the spray beam 300. Each spray channel 301 is connected to multiple nozzles 410, and the spray beam 300 is provided with at least two media inlets 301a for introducing cleaning media. The media inlets 301a are connected to the spray channels 301 in a one-to-one correspondence. Optionally, at least two spray channels 301 are spaced apart along the second direction B. The nozzles 410 are located below the spray channel 301, and the media inlets 301a are located above the spray channel 301. The media inlets 301a can be located in the middle of the corresponding spray channel 301. Each media inlet 301a can be supplied with the same cleaning media or different types of cleaning media.

[0049] Specifically, when cleaning media are introduced into each of the media inlets 301a, the spray area formed by the spray device is the first spray area a; when only a portion of the media inlets 301a are introduced into the cleaning media, the spray area formed by the spray device is the second spray area b, and the second spray area b is smaller than the first spray area a.

[0050] In this embodiment, the number of spray channels 301 and media inlets 301a is increased, allowing cleaning media to be introduced into different media inlets 301a as needed to adjust the position and size of the spray area, thereby adjusting the spraying effect and cleaning effect.

[0051] Optionally, there are two spray channels 301 and two media inlets 301a, as shown in the reference. Figure 10 As shown, when cleaning medium is introduced into both media inlets 301a, the spray device is in full-width spray mode, and the first spray area a is relatively large; (Reference) Figure 12 As shown, when cleaning medium is introduced into one of the medium inlets 301a, the spray device is in half-width spray mode, the second spray area b is smaller, and the second spray area b is half of the first spray area a.

[0052] Optionally, the spray beam 300 extends along the second direction B, and the cleaning medium forms a spray band c extending along the diameter direction of the wafer 111 on the surface supported by the bearing surface. When cleaning medium is introduced into each medium inlet 301a, the formed spray band c is referenced. Figure 11 As shown; when cleaning medium is introduced into one of the medium inlets 301a, the resulting spray band c is referenced. Figure 13 As shown. Regardless of the method, when the wafer 111 is rotating, the formed liquid film 111a can be guaranteed to cover the entire surface of the wafer 111, ensuring the uniformity of the liquid film 111a.

[0053] In one optional embodiment, the spray beam 300 is provided with a plurality of spray nozzles at intervals along the extension direction of the spray beam 300. Optionally, the spray beam 300 is provided with a plurality of spray nozzles at intervals along the second direction B. The spray nozzles correspond one-to-one with the nozzles 410, and each nozzle 410 is fixedly installed at the corresponding spray nozzle by means of welding, bonding or other methods.

[0054] In another embodiment, each nozzle 410 is detachably disposed at the corresponding spray port. Optionally, the nozzle 410 can be detachably installed at the corresponding spray port by means of snap-fit, bolt connection or other detachable means.

[0055] In this embodiment, each nozzle 410 is detachable, allowing for installation and removal as needed. This facilitates the replacement of damaged nozzles 410 and ensures smooth spraying of the cleaning medium.

[0056] In a further embodiment, the spray device further includes a sealing member 420, which is used to seal the spray nozzles. The structure of the sealing member 420 is referenced. Figure 15 As shown, the sealing element 420 is a solid structure, and at least part of the spray nozzle is blocked by the sealing element 420. The spray nozzles of the disassembled nozzles 410 can be blocked by the sealing element 420. Optionally, there can be multiple sealing elements 420, and each sealing element 420 can correspond one-to-one with a spray nozzle. When a spray nozzle 410 is not installed, the corresponding sealing element 420 will block it.

[0057] With nozzles 410 installed at each spray nozzle (i.e., without sealing elements 420 blocking the spray nozzles), each nozzle 410 sprays the cleaning medium simultaneously, resulting in a relatively large spray area. (Refer to...) Figure 16 As shown; the situation where some spray nozzles are equipped with nozzles 410 and some spray nozzles are blocked by sealing members 420 includes the following two situations, optionally, refer to Figure 17 As shown, a sealing element 420 is provided between every two nozzles 410, that is, a nozzle 410 is provided between every two sealing elements 420. The nozzles 410 and sealing elements 420 are alternately arranged. At this time, the spray area remains unchanged, but the spray density is relatively small. Therefore, by changing the sealing state of the spray nozzles, the spray density of the spray device in a fixed spray area can be adjusted; Reference Figure 18As shown, the spray nozzles 410 are installed in the middle area, and the spray nozzles on both sides are sealed by the sealing members 420, thereby adjusting the overall width of the spray area to accommodate the needs of wafers 111 of different sizes. Specifically, the greater the maximum distance between the installed nozzles 410 and the center of the spray beam 300 (i.e., the spray center), the wider the spray area is, and the larger the diameter of the wafers 111 that can be sprayed and cleaned. Conversely, the smaller the maximum distance between the installed nozzles 410 and the center of the spray beam 300, the smaller the width of the spray area is, and the smaller the diameter of the wafers 111 that can be sprayed and cleaned. By adopting this embodiment, by changing the state of each spray nozzle, that is, whether the nozzle 410 is installed or the nozzle is blocked by the sealing member 420, the density and width of the spray area can be adjusted as needed, which is beneficial to expanding the applicable range of the spray device.

[0058] In one optional embodiment, each nozzle 410 is provided with a spray hole 411, and the flow area of ​​the spray hole 411 of each nozzle 410 is equal.

[0059] In another embodiment, at least some of the nozzles 410 have different flow areas for their injection holes 411. Optionally, the flow areas of the injection holes 411 of some nozzles 410 may be different, or the flow areas of the injection holes 411 of each nozzle 410 may be different. Optionally, the nozzles 410 may include three types, see reference. Figure 14 As shown, the orifice diameters of the spray holes 411 of the three nozzles 410 are 1mm, 2mm and 3mm respectively. Of course, the orifice diameter of the nozzles 410 can also be set to other values, and more types of nozzles 410 can be set. In short, when the flow rate requirement of the cleaning medium is large, the nozzle 410 with a larger flow area should be selected; when the flow rate requirement of the cleaning medium is small, the nozzle 410 with a smaller flow area should be selected.

[0060] In this embodiment, there are at least two types of nozzles 410. Different types of nozzles 410 have different flow areas, so a suitable nozzle 410 can be selected according to the process flow requirements, which is beneficial to further expand the application range of the spraying device.

[0061] In an optional embodiment, the flow area of ​​the nozzle 410 located near the spray center of the spray beam 300 is greater than that of the nozzle 410 located away from the spray center. Specifically, the spray beam 300 has a first end, a second end, and a spray center. The distance between the spray center and the first end is equal to the distance between the spray center and the second end. Along a direction away from the spray center and parallel to the bearing surface, the flow area of ​​the spray holes 411 of the nozzle 410 decreases. That is, the flow area of ​​the nozzle 410 near the spray center is larger, and the flow area of ​​the nozzle 410 located away from the spray center is smaller. The spray center typically corresponds to the central region of the wafer 111 supported by the bearing surface. The first and second ends of the spray beam 300 are relatively close to the edge region of the wafer 111. Therefore, the amount of cleaning medium sprayed into the central region of the wafer 111 is larger, and the amount of cleaning medium sprayed into the edge region of the wafer 111 is smaller.

[0062] Optionally, when the spray beam 300 is fixed above the base 110, the spray center is located above the center of the wafer 111 supported by the base 110.

[0063] Due to the high-speed rotation of the wafer 111, the cleaning medium is thrown towards the edge of the wafer 111 under centrifugal force, resulting in a thicker liquid film 111a at the edge region and a thinner liquid film 111a at the center region, leading to poor uniformity of the liquid film 111a. In this embodiment, by setting different flow areas for each nozzle 410, the amount of cleaning medium sprayed onto the center region of the wafer 111 is increased, while the amount sprayed onto the edge region is decreased. This increases the thickness of the liquid film 111a at the center region and decreases the thickness at the edge region, thus improving the uniformity of the liquid film 111a, increasing cleaning efficiency, and enhancing cleaning effectiveness.

[0064] Of course, in other embodiments, the flow area of ​​the spray hole 411 of each nozzle 410 can have other variation patterns, or the flow area of ​​a portion of the nozzles 410 of the spray beam 300 can satisfy the above variation patterns.

[0065] In one alternative embodiment, the number of spray beams 300 is one.

[0066] In another embodiment, reference Figure 4 As shown, there are multiple spray beams 300, which are spaced apart along the first direction A. Optionally, each spray beam 300 is connected to a threaded sleeve 610 and a guide cylinder 620 at both ends. Each threaded sleeve 610 is threadedly engaged with a screw, and each guide cylinder 620 is guided by a guide rod 230.

[0067] Optionally, the number of spray beams 300 can be three, namely spray beam 300a, spray beam 300b, and spray beam 300c. Different types of cleaning media can be introduced into spray beams 300a, 300b, and 300c. After the process begins, the first drive mechanism 510 operates to move the screw to drive spray beam 300a along the first direction A to above the bearing surface. Simultaneously, the second drive mechanism 520 drives the support beam 210 to rise and fall, so that each spray beam 300 is raised or lowered to a suitable height. Spray beam 300a then begins to spray the first type of cleaning media. After spray beam 300a finishes spraying, the first drive mechanism 510 continues to operate to move the screw to move spray beam 300b along the first direction A to above the bearing surface. Simultaneously, the second drive mechanism 520 drives the support beam 210 to rise and fall, so that each spray beam 300 is raised or lowered to a suitable height. The drive mechanism 520 drives the support beam 210 to rise and fall, so that each spray beam 300 is raised or lowered to a suitable height, and the spray beam 300b begins to spray the second cleaning medium. After the spray beam 300b finishes spraying, the first drive mechanism 510 continues to work, so that the screw drives the spray beam 300c to move along the first direction A above the bearing surface. At the same time, the second drive mechanism 520 drives the support beam 210 to rise and fall, so that each spray beam 300 is raised or lowered to a suitable height, and the spray beam 300c begins to spray the drying gas. When the entire process is completed, the first drive mechanism 510 drives the screw to rotate in the opposite direction, and at the same time, the second drive mechanism 520 drives the support beam 210 to move in the opposite direction, so that each spray beam 300 returns to its original position. Moreover, each spray beam 300 moves simultaneously relative to the screw, so there is no problem of mutual collision.

[0068] In this embodiment, the number of spray beams 300 is increased, and different types of cleaning media can be introduced into the spray channels 301 of each spray beam 300, so as to facilitate quick switching between different cleaning processes, shorten the time for switching between different cleaning media, and quickly switch to the cleaning process of the next cleaning media after the cleaning of the previous cleaning media is completed, thereby improving cleaning efficiency.

[0069] In one optional embodiment, the spray beam 300 is a straight spray beam that extends along the second direction B.

[0070] In another embodiment, reference Figure 10 and Figure 20 As shown, the spray beam 300 includes a linear spray beam 310 and one or more annular spray beams 320. The end of the linear spray beam 310 is connected to the support member 200, and the annular spray beams 320 are connected to the linear spray beam 310. Specifically, there can be one or more annular spray beams 320. Optionally, the end of the linear spray beam 310 and the support member 200, and the annular spray beams 320 and the linear spray beam 310, can be fixedly connected by welding or other means.

[0071] Both the linear spray beam 310 and the annular spray beam 320 are equipped with spray channels 301 and nozzles 410. The spray channels 301 of the linear spray beam 310 extend along the length of the linear spray beam 310, and multiple nozzles 410 are spaced apart along its length. The spray channels 301 of the annular spray beam 320 extend circumferentially along the annular spray beam 320, with the second direction B being the circumference of the annular spray beam 320. Multiple nozzles 410 are spaced apart along the annular spray beam 320, forming an annular spray area when the nozzles 410 spray. The multiple nozzles 410 in the linear spray beam 310 and the multiple nozzles 410 in the annular spray beam 320 can be evenly or unevenly distributed.

[0072] Optionally, the two ends of the linear spray beam 310 are respectively connected to a threaded sleeve 610 and a guide cylinder 620, and then the threaded sleeve 610 is threadedly engaged with the screw, while the guide cylinder 620 is guided and engaged with the guide rod 230; the annular spray beam 320 can be fixedly connected to the linear spray beam 310 by welding, bonding or other methods.

[0073] In this embodiment, the combination of the linear spray beam 310 and the annular spray beam 320 is beneficial to further increase the spray area of ​​the spraying device, improve cleaning efficiency, and enhance the spraying effect.

[0074] In a further embodiment, there are multiple annular spray beams 320, which are spaced apart. In any two adjacent annular spray beams 320, one annular spray beam 320 is located outside the other, and all annular spray beams 320 are concentrically arranged. Optionally, the diameters of the annular spray beams 320 are different, with the diameter of the outermost annular spray beam 320 matching the diameter of the wafer 111 to be processed. Furthermore, each annular spray beam 320 is connected to a linear spray beam 310.

[0075] Each annular spray beam 320 is equipped with a spray channel 301 and a nozzle 410. The spray channel 301 of the linear spray beam 310 is connected to the spray channel 301 of each annular spray beam 320. Each annular spray beam 320 is provided with multiple nozzles 410 at intervals along its circumference. When the nozzles 410 of each annular spray beam 320 spray, they form annular spray areas of different diameters.

[0076] In this embodiment, the number of annular spray beams 320 is increased, and the cleaning medium sprayed by each annular spray beam 320 forms annular spray areas of different diameters, which is more conducive to fully spraying the wafers supported on the bearing surface, improving the uniformity of spraying and improving the cleaning effect. Of course, in other embodiments, the spray beam 300 may also adopt other structures such as star shape, and the structure of the spray beam 300 is not limited to the two embodiments described above.

[0077] In an optional embodiment, the spray channel 301 of the linear spray beam 310 and the spray channel 301 of the annular spray beam 320 are connected. Optionally, the spray channel 301 of the linear spray beam 310 and the spray channel 301 of the annular spray beam 320 can be directly connected, or the spray channel 301 of the linear spray beam 310 and the spray channel 301 of the annular spray beam 320 can be indirectly connected through a connecting pipe or other components.

[0078] In this embodiment, cleaning medium can be introduced into the spray channel 301 of the linear spray beam 310 or the spray channel 301 of the annular spray beam 320, so that the linear spray beam 310 and the annular spray beam 320 can spray cleaning medium simultaneously.

[0079] Of course, in other embodiments, the spray channel 301 of the linear spray beam 310 and the spray channel 301 of the annular spray beam 320 may not be connected, and cleaning medium may be introduced into the spray channel 301 of the linear spray beam 310 or the spray channel 301 of the annular spray beam 320 as needed.

[0080] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A semiconductor process apparatus comprising a chamber body (100) having a susceptor (110) for carrying a wafer (111) and a shower device for performing a cleaning process on the wafer (111) within the chamber body (100), characterized in that, The spraying device includes a support member (200) and a spray beam (300), the spray beam (300) being disposed on the chamber body (100) via the support member (200). The spray beam (300) is provided with a spray channel (301) for introducing cleaning medium inside, and the spray beam (300) is provided with a plurality of nozzles (410) at intervals along its own extension direction, and each nozzle (410) is connected to the spray channel (301). When the cleaning medium is sprayed, the spray beam (300) is fixed above the base (110), and the orthographic projection of the axis of the spray beam (300) onto the bearing surface of the base (110) that carries the wafer (111) passes through the center point of the bearing surface.

2. The semiconductor process apparatus according to claim 1, wherein The support member (200) can drive the spray beam (300) to move along the first direction (A), the spray beam (300) extends along the second direction (B), the first direction (A) intersects the second direction (B), and the first direction (A) and the second direction (B) are parallel to the bearing surface respectively.

3. The semiconductor process apparatus according to claim 2, wherein The support member (200) includes a transmission rod (220), the end of which is rotatably disposed on the chamber body (100). The first end of the spray beam (300) is connected to the transmission rod (220). When the transmission rod (220) rotates around its own axis, it can drive the spray beam (300) to move along the first direction (A).

4. The semiconductor process apparatus according to claim 3, wherein The spraying device also includes a threaded sleeve (610), which is connected to the first end of the spraying beam (300). The transmission rod (220) is a screw rod, and the threaded sleeve (610) is sleeved on the outside of the screw rod, and the threaded sleeve (610) is threadedly engaged with the screw rod.

5. The semiconductor process apparatus according to claim 3 or 4, characterized by The support member (200) further includes a support beam (210) and a guide rod (230). The support beam (210) extends along the second direction (B). The end of the transmission rod (220) is rotatably disposed at the first end of the support beam (210). The end of the guide rod (230) is connected to the second end of the support beam (210). The axis of the transmission rod (220) is parallel to the axis of the guide rod (230). The second end of the spray beam (300) is guided and engaged with the guide rod (230).

6. The semiconductor process apparatus according to claim 5, wherein The spraying device also includes a guide cylinder (620), which is connected to the second end of the spray beam (300). The guide cylinder (620) is sleeved on the outside of the guide rod (230), and the guide cylinder (620) and the guide rod (230) are guided and cooperated.

7. The semiconductor process apparatus according to claim 3, wherein The spraying device further includes a first drive mechanism (510), which is connected to the transmission rod (220). The drive mechanism drives the transmission rod (220) to rotate around its own axis.

8. The semiconductor process apparatus according to claim 5, wherein The spraying device further includes a second drive mechanism (520), which is connected to the support beam (210). The second drive mechanism (520) drives the support beam (210) to move the transmission rod (220), the guide rod (230) and the spray beam (300) along a third direction (C), which intersects with the bearing surface.

9. The semiconductor process apparatus according to claim 1, wherein At least two spray channels (301) are provided at intervals along the extension direction of the spray beam (300). Each spray channel (301) is connected to a plurality of nozzles (410). The spray beam (300) is provided with at least two media inlets (301a) for introducing cleaning media. The media inlets (301a) are connected to the spray channels (301) one by one.

10. The semiconductor process apparatus according to claim 1, wherein The spray beam (300) has multiple spray nozzles spaced apart along its extension direction. Each of the nozzles (410) is detachably disposed at the corresponding spray port.

11. The semiconductor process apparatus according to claim 10, wherein The spraying device also includes a sealing element (420), at least a portion of the spray nozzles are sealed by the sealing element (420).

12. The semiconductor process apparatus according to claim 1 or 10, wherein Each of the nozzles (410) is provided with a spray hole (411), and the flow area of ​​the spray hole (411) of at least some of the nozzles (410) is different.

13. The semiconductor process apparatus according to claim 12, wherein The flow area of ​​the nozzle (410) located near the spray center of the spray beam (300) is greater than that of the nozzle (410) located away from the spray center.

14. The semiconductor process equipment according to claim 2, characterized in that, There are multiple spray beams (300), and each spray beam (300) is spaced apart along the first direction (A).

15. The semiconductor process equipment according to claim 1, characterized in that, The spray beam (300) includes a linear spray beam (310) and one or more annular spray beams (320). The ends of the linear spray beams (310) are connected to the support member (200), and the annular spray beams (320) are connected to the linear spray beams (310). Both the annular spray beam (320) and the linear spray beam (310) are provided with spray channels (301) and nozzles (410). The spray channels (301) of the linear spray beam (310) extend along the length direction of the linear spray beam (310), and the linear spray beam (310) is provided with a plurality of nozzles (410) at intervals along its own length direction. The spray channels (301) of the annular spray beam (320) extend along the circumference of the linear spray beam (310), and the annular spray beam (320) is provided with a plurality of nozzles (410) at intervals along its own circumference.

16. The semiconductor process equipment according to claim 15, characterized in that, There are multiple annular spray beams (320), and each annular spray beam (320) is spaced apart. In two adjacent annular spray beams (320), one annular spray beam (320) is located outside the other annular spray beam (320). Each annular spray beam (320) is connected to the linear spray beam (310), and each annular spray beam (320) is concentrically arranged.

17. The semiconductor process apparatus according to claim 15 or 16, wherein the spray channel (301) of the linear spray beam (310) is connected to the spray channel (301) of the annular spray beam (320).

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