An aluminum substrate welding device for a semiconductor lighting device

Abstract

The application discloses a kind of aluminium substrate welding device for semiconductor lighting device, it is related to laser welding field, the irreversible warping deformation that internal stress release is proposed in the background art, leading to substrate flatness loss, welding spot false soldering even chip stress cracking, thermal deformation control is difficult, contact thermal resistance difference is remarkable, whole board preheating temperature difference is often more than 10~20 DEG C, this non-uniform preheating itself introduces thermal deformation, preheating uniformity is insufficient, the following scheme is proposed, including support platform and three-axis motion mechanism, the support platform top is equipped with laser welding assembly, and the laser welding assembly includes connecting plate.The application can recover the waste heat generated when laser welding head operates, uniformly preheat the aluminium substrate and lift the aluminium substrate, so that the aluminium substrate can avoid hard contact friction and edge hard constraint on the bottom surface during welding, internal large compression thermal stress is generated, and irreversible warping deformation caused by stress release is prevented.

Description

Technical Field

[0001] This invention relates to the field of laser welding, and more particularly to an aluminum substrate welding apparatus for semiconductor lighting devices. Background Technology

[0002] Laser welding is a highly efficient and precise welding method that uses a high-energy-density laser beam as a heat source. It is an important application of laser material processing technology. The welding process is heat conduction type, meaning that laser radiation heats the surface of the workpiece, and the surface heat diffuses inward through heat conduction. By controlling parameters such as the width, energy, peak power, and repetition frequency of the laser pulse, the workpiece is melted, forming a specific molten pool.

[0003] Semiconductor lighting, also known as solid-state lighting, refers to lighting that uses solid-state light-emitting devices as light sources, including light-emitting diodes (LEDs) and organic light-emitting diodes (OLEDs). It features low power consumption, long lifespan, rich colors, vibration resistance, and strong controllability. Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided board consists of three layers: a circuit layer (copper foil), an insulating layer, and a metal base layer. It is commonly found in LED lighting products and has two sides. The white side is where the LED pins are soldered, while the other side is the natural color of aluminum. It is usually coated with thermally conductive paste and then comes into contact with the heat-conducting parts.

[0004] The welding quality of aluminum substrates directly affects the heat conduction efficiency and long-term reliability of devices. Laser welding, due to its small heat-affected zone and high energy density, is gradually replacing traditional reflow soldering. However, the following problems exist in the laser welding process for large-size thin aluminum substrates: 1. Aluminum substrates have a large coefficient of thermal expansion. During welding, the local instantaneous temperature of the solder joint can reach several hundred degrees Celsius, while the surrounding area remains at a low temperature. Existing fixtures mostly use pressure plates, positioning pins, etc. to rigidly press the aluminum substrate onto the metal table. When the board expands due to heat, due to the hard contact friction on the bottom surface and the hard constraint on the edges, a large compressive thermal stress is generated inside. After cooling and contraction, the stress is released as irreversible warping deformation, which leads to loss of substrate flatness, poor solder joints, and even chip cracking under stress. It is difficult to control thermal deformation. 2. To prevent welding thermal shock, the aluminum substrate usually needs to be preheated as a whole. Conventional preheating uses a contact heating table, which relies on the contact between the plate and the table surface for heat conduction. Due to the microscopic unevenness, particle contamination and uneven distribution of clamping force on the back of the aluminum substrate, the contact thermal resistance is significantly different. The temperature difference of the whole plate during preheating often exceeds 10-20℃. This non-uniform preheating itself introduces thermal deformation and the preheating uniformity is insufficient. Summary of the Invention

[0005] This invention provides an aluminum substrate welding device for semiconductor lighting devices, which solves the problem that in the prior art, the internal stress release of the aluminum substrate during welding in the aluminum substrate laser welding device is irreversible warping deformation, which leads to loss of substrate flatness, poor solder joints, and even chip cracking under stress. It also makes it difficult to control thermal deformation, and the contact thermal resistance difference is significant. The preheating temperature difference of the whole board often exceeds 10-20°C. This non-uniform preheating itself introduces thermal deformation and insufficient preheating uniformity.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A welding apparatus for aluminum substrates in semiconductor lighting devices includes a support platform and a three-axis motion mechanism. A laser welding assembly is mounted above the support platform. The laser welding assembly includes a connecting plate, a fixing frame bolted to the bottom outer wall of the connecting plate, and a laser welding head bolted to the bottom inner wall of the mounting frame. A floating preheating mechanism is mounted on the outer wall at the top center of the support platform. The floating preheating mechanism includes a bearing base bolted to the top outer wall of the support platform, several PTC heaters respectively disposed within the bearing base, and a bearing plate bolted to the upper inner wall of the bearing mechanism. The outer wall of the bearing plate has evenly spaced vent micro-holes. Two waste heat recovery mechanisms are provided on one side of the fixing frame. Each waste heat recovery mechanism includes a connecting pipe penetrating and inserted into the outer wall of the fixing frame, a tee pipe screwed to the outer wall of one end of the connecting pipe, and two screws respectively to the upper and lower inner walls of the tee pipe. The system includes an installation pipe, an insulated corrugated pipe screwed to the lower outer wall of the installation pipe via clamps, and a conveying pipe connected to the lower inner wall of the insulated corrugated pipe via clamps. One end of the conveying pipe passes through and is screwed to the lower inner wall of one side of the bearing base. The bearing base is provided with micro-adjustment mechanisms on both sides and both sides. Each micro-adjustment mechanism includes a micro-adjustment cylinder and an installation frame bolted to a section of the piston rod of the micro-adjustment cylinder. Each of the four installation frames is provided with a flexible limiting component. The flexible limiting component includes a limiting plate with a heat-resistant silicone pad adhered to its bottom outer wall, a limiting block welded to the bottom outer wall of the limiting plate, two sliding rods bolted to the bottom outer wall of the limiting plate, a micro-adjustment screw passing through and screwed to the bottom inner wall of the installation frame, an adjusting plate connected to the top outer wall of the micro-adjustment screw via a bearing, and two return springs respectively sleeved on the lower outer walls of the two sliding rods. The limiting block has a heat-resistant silicone pad adhered to its outer wall near the bearing plate.

[0007] Preferably, the three-axis motion mechanism includes two lower linear motors respectively bolted to the outer walls of the top two sides of the support platform, two mounting brackets respectively bolted to the outer walls of the movers of the two lower linear motors, two servo motors respectively bolted to the outer walls of the top of the two mounting brackets, two ball screws respectively connected to the bottom ends of the output shafts of the two servo motors via couplings, two ball screw pairs respectively helically mounted on the outer walls of the two ball screws, a lifting plate whose two ends are respectively bolted to the bottom outer walls of the two ball screw pairs, and an upper linear motor bolted to the top outer wall of the lifting plate. The bottom ends of the ball screws are connected to the bottom inner wall of the mounting brackets via bearings, and the two ends of the lifting plate are slidably mounted in the two mounting brackets.

[0008] Preferably, the connecting plate is bolted to the top outer wall of the upper linear motor actuator, and two fixing plates are bolted to the upper inner walls on both sides of the fixing frame, and positioning sliders are bolted to the top outer walls of the two fixing plates.

[0009] Preferably, two positioning slide rails are bolted to the bottom outer wall of the lifting plate, and two positioning sliders are slidably installed on the outer walls of the two positioning slide rails respectively.

[0010] Preferably, support blocks are welded to the upper inner walls on both sides of the bearing base, and several PTC heaters are respectively connected to the top outer walls of the two support blocks by bolts.

[0011] Preferably, a flow guide is bolted to the heat dissipation port of the laser welding head, and one end of the connecting pipe is screwed to the inner wall of one side of the flow guide.

[0012] Preferably, a mounting plate is bolted to the top outer wall of the support platform, and a fine-tuning cylinder is bolted to the upper outer wall of the mounting plate. Four positioning rods are bolted to the outer wall of the mounting frame near the fine-tuning cylinder, and the four positioning rods are respectively inserted through and slidably mounted on the outer wall of the mounting plate.

[0013] Preferably, the two slide rods are respectively inserted through and slidably installed on the top inner wall of the mounting frame, and the two ends of the adjusting plate are respectively slidably installed on the outer walls of the two slide rods. Limiting rings are screwed onto the lower outer walls of the two slide rods, and the two ends of the two return springs abut against the top inner wall of the mounting frame and the top outer walls of the two limiting rings, respectively.

[0014] Preferably, a PLC control cabinet is bolted to one side of the outer wall of the support platform, and a cabinet door is hinged to one side of the outer wall of the PLC control cabinet.

[0015] The beneficial effects of this invention are as follows: 1. A uniform temperature air cushion is formed by mixing hot air with a carrier plate densely covered with micropores, a PTC heater, and recovered waste heat. The aluminum substrate is lifted away from the carrier surface, with no hard contact on the bottom surface. It is only constrained by the elastic heat-resistant silicone pad in the circumferential direction. The plate can expand freely during the welding process and return to flatness after welding. This can avoid the aluminum substrate from generating large compressive thermal stress due to hard contact friction on the bottom surface and hard constraint on the edges during welding, and prevent irreversible warping deformation caused by stress release.

[0016] 2. The hot air discharged from the heat dissipation port of the laser welding head is actively drawn in by the ejector tube, mixed with compressed air, and then heated to the preset temperature by the PTC heater. It is then evenly sprayed through tens of thousands of micro-holes. The temperature difference of the whole board is controlled within a small range, which can recover the waste heat generated during the operation of the laser welding head, while uniformly preheating the aluminum substrate and supporting the aluminum substrate.

[0017] In summary, this invention can recover the waste heat generated during the operation of the laser welding head, while uniformly preheating and supporting the aluminum substrate. This avoids the generation of large compressive thermal stress inside the aluminum substrate due to hard contact friction on the bottom surface and hard constraint on the edges during welding, thus preventing irreversible warping deformation caused by stress release. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall front view structure of an aluminum substrate welding device for semiconductor lighting devices proposed in this invention.

[0019] Figure 2 This is a bottom view schematic diagram of the overall structure of an aluminum substrate welding device for semiconductor lighting devices proposed in this invention.

[0020] Figure 3 This is a partial cross-sectional schematic diagram of the three-axis motion mechanism of an aluminum substrate welding device for semiconductor lighting devices proposed in this invention.

[0021] Figure 4 The present invention proposes Figure 3 Enlarged structural diagram at point A in the middle.

[0022] Figure 5 This is a schematic diagram of the main structure of a laser welding assembly for an aluminum substrate welding device for semiconductor lighting devices proposed in this invention.

[0023] Figure 6 This is a schematic diagram of the main structure of the floating preheating mechanism of an aluminum substrate welding device for semiconductor lighting devices proposed in this invention.

[0024] Figure 7 This is a bottom view of the floating preheating mechanism of an aluminum substrate welding device for semiconductor lighting devices proposed in this invention.

[0025] Figure 8 This is a schematic diagram of the main structure of the waste heat recovery mechanism of an aluminum substrate welding device for semiconductor lighting devices proposed in this invention.

[0026] Figure 9 This is a front view schematic diagram of the micro-adjustment mechanism of an aluminum substrate welding device for semiconductor lighting devices proposed in this invention.

[0027] Figure 10 This is a schematic diagram of the main structure of a flexible limiting component for an aluminum substrate welding device for semiconductor lighting devices proposed in this invention.

[0028] In the diagram: 1. Support platform; 2. Three-axis motion mechanism; 201. Lower linear motor; 202. Mounting bracket; 203. Servo motor; 204. Ball screw; 205. Ball screw pair; 206. Lifting plate; 207. Upper linear motor; 3. Laser welding assembly; 301. Connecting plate; 302. Fixing bracket; 303. Fixing plate; 304. Positioning slider; 305. Laser welding head; 4. Positioning slide rail; 5. Floating preheating mechanism; 501. Bearing base; 502. Support block; 503. PTC heater; 504. 6. Load-bearing plate; 7. Waste heat recovery mechanism; 8. Flow guide; 9. Connecting pipe; 10. T-pipe; 11. Mounting pipe; 12. Insulated corrugated pipe; 13. Conveying pipe; 14. Micro-adjustment mechanism; 15. Mounting plate; 16. Micro-adjustment cylinder; 17. Mounting frame; 18. Positioning rod; 19. Flexible limit assembly; 10. Limiting plate; 11. Limiting block; 12. Slide rod; 13. Micro-adjustment screw; 14. Adjusting plate; 15. Return spring; 16. Limiting ring; 17. PLC control cabinet. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0030] Example 1, referring to Figure 1-2 A welding device for aluminum substrates used in semiconductor lighting devices includes a support platform 1 and a three-axis motion mechanism 2. The support platform 1 is a rectangular steel frame structure with leveling feet at the bottom. The three-axis motion mechanism 2 is used to drive the laser welding head 305 to move in space to complete multi-point welding. A PLC control cabinet 9 is bolted to one side of the support platform 1. The cabinet contains a PLC controller, solenoid valve group, relay and temperature control module for centralized control of the movement of each component and the air circuit. A cabinet door is hinged to one side of the PLC control cabinet 9 for easy maintenance.

[0031] Reference Figure 1-4 The specific structure of the three-axis motion mechanism 2 is as follows: Two lower linear motors 201 are fixed to the top of the support platform 1 by bolts on both sides. The moving parts of the lower linear motors 201 are vertically mounted on the top of the mounting brackets 202 by bolts. Each mounting bracket 202 is fixed to the top of the mounting bracket by bolts. The output shaft of the servo motor 203 is connected to a vertically arranged ball screw 204 through a coupling. The bottom end of the ball screw 204 is rotatably connected to the bottom inner wall of the mounting bracket 202 through a bearing. A ball screw pair 205 is installed on the ball screw 204 by a helical drive. The bottom of the two ball screw pairs 205 is fixed to a horizontal lifting plate 206 by bolts. The two ends of the lifting plate 206 are slidably fitted in the vertical guide groove inside the mounting bracket 202, so that the lifting plate 206 can be smoothly lifted and lowered in the Z-axis direction by the synchronous drive of the two servo motors 203. The top of the lifting plate 206 is fixed to an upper linear motor 207 by bolts, and the moving parts of the upper linear motor 207 are arranged facing upwards.

[0032] Reference Figure 1-2 and Figure 5 The laser welding assembly 3 includes a connecting plate 301, which is bolted to the top outer wall of the mover of the upper linear motor 207 and moves along the Y-axis with the mover. A fixing frame 302 is bolted to the bottom outer wall of the connecting plate 301. The fixing frame 302 is a semi-enclosed frame, and a laser welding head 305 is bolted to its bottom inner wall. The optical path of the laser welding head 305 is vertically downward. To enhance motion stability, two fixing plates 303 are bolted to the upper inner walls on both sides of the fixing frame 302. Each fixed plate 303 has a positioning slider 304 bolted to its top outer wall. At the same time, two positioning slide rails 4 parallel to the upper linear motor 207 are bolted to the bottom outer wall of the lifting plate 206. The two positioning sliders 304 are slidably mounted on the two positioning slide rails 4 respectively. In this way, when the upper linear motor 207 drives the laser welding head 305 to move, the positioning sliders 304 slide along the positioning slide rails 4, which plays an auxiliary support and guiding role, suppresses the cantilever shaking of the welding head, and improves the positioning accuracy of the welding point.

[0033] Example 2, refer to Figure 1-2 and Figure 6-7A welding apparatus for aluminum substrates in semiconductor lighting devices further includes a floating preheating mechanism 5 disposed at the center of the top of a support platform 1 for non-contact uniform preheating of the aluminum substrate. The floating preheating mechanism 5 includes a rectangular frame-shaped support base 501, which is fixed to the top of the support platform 1 by bolts. Support blocks 502 are welded to the upper inner walls of both sides of the support base 501. Several PTC heaters 503 are bolted across and fixed to the top outer walls of the two support blocks 502. The Curie temperature of the PTC heaters 503 can be selected to be 18. The temperature can be set to 0℃ or as needed. It has built-in heat dissipation fins, high heating efficiency after power-on and can automatically maintain a constant temperature. A support plate 504 is bolted to the upper inner wall of the support base 501. The support plate 504 is a stainless steel microporous plate. The outer wall of the plate is laser-processed with evenly distributed air outlet microholes with a diameter of 0.1-0.3mm to ensure uniform airflow. A thermocouple temperature sensor (not shown in the figure) is embedded in the side of the support plate 504 to feed back the plate surface temperature of the support plate 504 to the temperature controller in the PLC control cabinet 9 to realize closed-loop regulation of the power of the PTC heater 503.

[0034] Reference Figure 1-2 and Figure 8 To fully utilize the waste heat emitted during the operation of the laser welding head 305, a waste heat recovery mechanism 6 is provided. Specifically, a guide shroud 601 is bolted to the heat dissipation port of the laser welding head 305 to gather the heat dissipation airflow. Two waste heat recovery mechanisms 6 are provided on one side of the fixing frame 302. Each waste heat recovery mechanism 6 includes a connecting pipe 602. One end of the connecting pipe 602 passes through and is inserted into the side wall of the fixing frame 302, and its end is screwed to the inner wall of one side of the guide shroud 601 to extract hot air. The other end of the connecting pipe 602 is screwed to a three-way pipe 603. An installation pipe 604 is screwed into the upper interface of the three-way pipe 603. The installation pipe 604 is connected to a compressed air source through a pipeline and a solenoid valve. The lower interface of the three-way pipe 603 is also screwed to an installation pipe 604. The mounting pipe 604 is connected to the heat-insulating corrugated pipe 605 by clamps. The heat-insulating corrugated pipe 605 is expandable and temperature resistant, adapting to the lifting and lowering movement of the laser head. The lower end of the heat-insulating corrugated pipe 605 is connected to the delivery pipe 606 by clamps. The other end of the delivery pipe 606 passes through and is screwed to the air inlet connector on the lower inner wall of one side of the support base 501, sending the mixed hot air into the inner cavity of the support base 501. When the compressed air flows through the three-way pipe 603 at high speed, it generates an ejection effect, actively drawing in and mixing the hot air in the guide shroud 601, and then sending it into the support base 501 through the heat-insulating corrugated pipe 605, realizing waste heat recovery and initial heating. The mixed air is further heated to the set temperature by the heat dissipation fins of the PTC heater 503 in the base, and finally sprayed out evenly from the micropores of the support plate 504, forming a hot air pad with a constant temperature.

[0035] Example 3, referring to Figure 1-2 and Figure 9 A welding device for aluminum substrates used in semiconductor lighting devices is designed with four micro-adjustment mechanisms 7 and four flexible limiting components 8 to achieve avoidance during material feeding and flexible positioning during welding. A mounting plate 701 is fixed to the top of the support platform 1 by bolts. The mounting plate 701 is vertically set. A micro-adjustment cylinder 702 is horizontally fixed to the upper outer wall of the mounting plate 701 by bolts. The piston rod end of the micro-adjustment cylinder 702 is fixed to the mounting frame 703 by bolts. To improve the guiding rigidity, four positioning rods 704 are bolted to the outer wall of the mounting frame 703 near the micro-adjustment cylinder 702. The four positioning rods 704 pass through and slide in the oil-free bushings on the mounting plate 701 to ensure the smooth extension and retraction of the mounting frame 703.

[0036] Reference Figure 1-2 and Figure 9 Four flexible limiting components 8 are respectively assembled on four mounting frames 703. Each flexible limiting component 8 includes a horizontal limiting plate 801. A heat-resistant silicone pad is adhered to the bottom outer wall of the limiting plate 801. A vertical limiting block 802 is welded to the bottom side of the limiting plate 801 near the bearing plate 504. A heat-resistant silicone pad is also adhered to the side of the limiting block 802 facing the aluminum substrate. Two sliding rods 803 are vertically fixed to the bottom outer wall of the limiting plate 801 by bolts. 803 extends upward through the top inner wall of the mounting frame 703 and slides therewith. A limit ring 807 is screwed onto the lower outer wall of the slide rod 803. A return spring 806 is fitted on the slide rod 803. The two ends of the return spring 806 abut against the top inner wall of the mounting frame 703 and the top outer wall of the limit ring 807, respectively. In this way, the elastic force of the return spring 806 pulls the limit plate 801 and the limit block 802 downward as a whole through the limit ring 807 and the slide rod 803, maintaining the initial lower stop point.

[0037] To precisely adjust the preload of the reset spring 806, a fine-tuning screw 804 is threaded through and screwed onto the inner wall of the bottom of the mounting frame 703. The fine-tuning screw 804 is vertically positioned, and its top end is rotatably connected to an adjusting plate 805 via a bearing. The two ends of the adjusting plate 805 are slidably sleeved on two slide rods 803. Rotating the fine-tuning screw 804 drives the adjusting plate 805 to move up and down along the slide rods 803, thereby adjusting the distance between the plate 805 and the limiting ring 807. The actual structure is as follows: the adjusting plate 805 is located above the limiting ring 807. When the adjusting plate 805 moves downward, it compresses the reset spring 806, increasing the preload.

[0038] It should be noted that, to keep the diagram simple, the linkage between the fine-tuning screw 804 and the adjusting plate 805 can be achieved by: the adjusting plate 805 having a light hole that mates with the slide rod 803; a bearing being embedded in the center of the adjusting plate 805; and the stepped shaft at the top of the fine-tuning screw 804 being interference-fitted with the inner ring of the bearing, so that the adjusting plate does not rotate when the screw rotates, but only moves up and down. The preload of the return spring 806 can be steplessly adjusted within a certain range through the fine-tuning screw 804 to compensate for stress relaxation after long-term operation.

[0039] Initially, the piston rods of the four fine-tuning cylinders 702 retract, and the mounting frame 703, along with the limiting plate 801 and the limiting block 802, moves outward to the outside of the aluminum substrate placement area. The top of the support plate 504 is completely open. A robotic arm or a person places the aluminum substrate to be welded flat on the upper surface of the support plate 504. Subsequently, the four fine-tuning cylinders 702 extend simultaneously, and the limiting plate 801 and the limiting block 802 extend above the edge of the aluminum substrate. The heat-resistant silicone pad on the side of the limiting block 802 leaves a small gap with the side of the aluminum substrate (limited to horizontal drift). 1. An initial gap is set between the heat-resistant silicone pad on the bottom surface and the upper surface of the aluminum substrate. The PLC program is started: the compressed air source solenoid valve opens, and the airflow enters the three-way pipe 603 through the mounting pipe 604. The ejector effect draws the hot air discharged from the heat dissipation port of the laser welding head 305 through the guide shroud 601 and connecting pipe 602 for mixing. The mixture then enters the inner cavity of the bearing base 501 through the heat-insulating corrugated pipe 605 and conveying pipe 606. The PTC heater 503 is energized, heating the mixed airflow to the temperature required for the welding process (e.g., 130℃). The temperature controller controls the flow through the heat... The thermocouple feedback closed-loop regulation causes the heated gas to be evenly ejected from the vent micro-holes of the support plate 504, forming a hot air cushion. The aluminum substrate is lifted by the air cushion and floats upward, just making contact with the heat-resistant silicone pad on the bottom surface of the limiting plate 801. This overcomes the preload of the return spring 806, causing the limiting plate 801 and the slide rod 803 to move slightly upward. At this time, the upper surface of the aluminum substrate is subjected to a gram-level elastic contact force, the bottom surface is completely suspended, and the four sides are flexibly constrained by the limiting blocks 802. The whole is in a state of near-free expansion. Subsequently, the three-axis motion mechanism 2 moves the laser welding head 305... Moved directly above the first welding point, the lower linear motor 201 moves along the X-axis, and the upper linear motor 207 moves along the Y-axis. Two servo motors 203 drive the lifting plate 206 and the laser welding head 305 to be precisely positioned along the Z-axis via the ball screw pair 205. The laser welding head 305 emits light to complete the welding. The heat dissipated during the process is continuously utilized by the waste heat recovery mechanism 6. After the welding is completed, the compressed air and PTC heating stop, the air cushion disappears, the aluminum substrate falls back onto the support plate 504, the fine-tuning cylinder 702 retracts, and the welded product is taken out.

[0040] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0042] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An aluminum substrate welding apparatus for semiconductor lighting devices, comprising a support stage (1) and a three-axis motion mechanism (2), characterized in that, The support platform (1) is provided with a laser welding assembly (3). The laser welding assembly (3) includes a connecting plate (301), a fixing frame (302) connected to the bottom outer wall of the connecting plate (301) by bolts, and a laser welding head (305) connected to the bottom inner wall of the mounting frame (202) by bolts. A floating preheating mechanism (5) is provided on the outer wall at the top center of the support platform (1). The floating preheating mechanism (5) includes a bearing base (501) connected to the outer wall at the top of the support platform (1) by bolts, a number of PTC heaters (503) respectively set in the bearing base (501), and a bearing plate (504) connected to the upper inner wall of the bearing mechanism (501) by bolts. The outer wall of the bearing plate (504) has equidistantly distributed air outlet microholes. The fixed frame (302) is provided with two waste heat recovery mechanisms (6) on one side. The waste heat recovery mechanism (6) includes a connecting pipe (602) that penetrates and is inserted into the outer wall of the fixed frame (302), a three-way pipe (603) that is screwed into the outer wall of one end of the connecting pipe (602), two installation pipes (604) that are respectively screwed into the upper and lower inner walls of the three-way pipe (603), a heat-insulating corrugated pipe (605) that is screwed into the lower outer wall of the installation pipe (604) by a clamp, and a conveying pipe (606) that is connected into the lower inner wall of the heat-insulating corrugated pipe (605) by a clamp. One end of the conveying pipe (606) penetrates and is screwed into the lower inner wall of one side of the bearing base (501). The bearing base (501) is provided with micro-adjustment mechanisms (7) on both sides and both sides. The micro-adjustment mechanism (7) includes a micro-adjustment cylinder (702) and a mounting frame (703) that is bolted to a section of the piston rod of the micro-adjustment cylinder (702). Each of the four mounting frames (703) is provided with a flexible limiting component (8). The flexible limiting component (8) includes a limiting plate (801) with a heat-resistant silicone pad adhered to its bottom outer wall, a limiting block (802) welded to the bottom outer wall of the limiting plate (801), two slide rods (803) respectively bolted to the bottom outer wall of the limiting plate (801), a fine-tuning screw (804) passing through and screwed to the bottom inner wall of the mounting frame (703), an adjusting plate (805) connected to the top outer wall of the fine-tuning screw (804) by a bearing, and two return springs (806) respectively sleeved on the lower outer wall of the two slide rods (803). The limiting block (802) has a heat-resistant silicone pad adhered to its outer wall near the bearing plate (504).

2. The aluminum substrate welding apparatus for semiconductor lighting devices according to claim 1, characterized in that, The three-axis motion mechanism (2) includes two lower linear motors (201) that are bolted to the outer walls of the top two sides of the support platform (1), two mounting brackets (202) that are bolted to the outer walls of the movers of the two lower linear motors (201), two servo motors (203) that are bolted to the outer walls of the top of the two mounting brackets (202), two ball screws (204) that are connected to the bottom ends of the output shafts of the two servo motors (203) by couplings, two ball screw pairs (205) that are helically driven and mounted on the outer walls of the two ball screw pairs (204), a lifting plate (206) that is bolted to the bottom outer walls of the two ball screw pairs (205) at both ends, and an upper linear motor (207) that is bolted to the top outer wall of the lifting plate (206). The bottom end of the ball screw (204) is connected to the bottom inner wall of the mounting bracket (202) by bearings, and the two ends of the lifting plate (206) are slidably mounted in the two mounting brackets (202).

3. The aluminum substrate welding apparatus for semiconductor lighting devices according to claim 2, characterized in that, The connecting plate (301) is bolted to the top outer wall of the upper linear motor (207) mover. Two fixing plates (303) are bolted to the upper inner walls on both sides of the fixing frame (302), and positioning sliders (304) are bolted to the top outer walls of the two fixing plates (303).

4. The aluminum substrate welding apparatus for semiconductor lighting devices according to claim 3, characterized in that, The bottom outer wall of the lifting plate (206) is connected by bolts to two positioning slide rails (4), and two positioning sliders (304) are slidably installed on the outer wall of the two positioning slide rails (4).

5. The aluminum substrate welding apparatus for semiconductor lighting devices according to claim 1, characterized in that, Support blocks (502) are welded to the upper inner walls on both sides of the bearing base (501), and several PTC heaters (503) are respectively connected to the top outer walls of the two support blocks (502) by bolts.

6. The aluminum substrate welding apparatus for semiconductor lighting devices according to claim 1, characterized in that, The heat dissipation port of the laser welding head (305) is connected to a flow guide (606) by bolts, and one end of the connecting pipe (602) is screwed to the inner wall of one side of the flow guide (606).

7. The aluminum substrate welding apparatus for semiconductor lighting devices according to claim 1, characterized in that, The support platform (1) is connected to the top outer wall by bolts with a mounting plate (701), and the fine-tuning cylinder (702) is connected to the upper outer wall of the mounting plate (701) by bolts. The mounting frame (703) is connected to the outer wall near the fine-tuning cylinder (702) by bolts with four positioning rods (704), and the four positioning rods (704) are respectively inserted through and slidably installed on the outer wall of the mounting plate (701).

8. The aluminum substrate welding apparatus for semiconductor lighting devices according to claim 1, characterized in that, The two slide rods (803) are respectively inserted through and slidably installed on the top inner wall of the mounting frame (703), and the two ends of the adjusting plate (805) are respectively slidably installed on the outer wall of the two slide rods (803). Limiting rings (807) are screwed onto the lower outer wall of the two slide rods (803), and the two ends of the two return springs (806) respectively abut against the top inner wall of the mounting frame (703) and the top outer wall of the two limiting rings (807).

9. The aluminum substrate welding apparatus for semiconductor lighting devices according to claim 1, characterized in that, A PLC control cabinet (9) is bolted to one side of the outer wall of the support platform (1), and a cabinet door is hinged to one side of the outer wall of the PLC control cabinet (9).

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