A laser welding apparatus for diamond grinding wheel processing

By using a clamping device with interconnected drive shaft, screw, bushing, and other components, along with a one-way gear and pressure sensor, the problem of insufficient coaxiality between the abrasive ring and the substrate in diamond wheel laser welding equipment has been solved. This has enabled efficient and stable wheel clamping and welding, improving production efficiency and product quality.

CN122142525APending Publication Date: 2026-06-05JIANGXI DINGHAI GRINDING WHEEL CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIANGXI DINGHAI GRINDING WHEEL CO LTD
Filing Date
2026-05-08
Publication Date
2026-06-05

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    Figure CN122142525A_ABST
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Abstract

The application belongs to the technical field of laser welding equipment, and particularly discloses a laser welding device for diamond grinding wheel processing, which comprises a welding table, a mounting plate fixedly connected to the top of the welding table, and a laser welding gun mounted on the mounting plate; a rotating disc horizontally mounted on the top of the welding table; a fixing device comprising a chuck, a pressing rod, a clamping block and a driving assembly, the chuck being horizontally mounted on the top of the rotating disc and coaxial with the rotating disc, the top of the chuck being provided with a grinding wheel to be welded, the top surface of the chuck being uniformly and annularly provided with three mounting grooves, and the pressing rod and the clamping block being slidingly mounted in the mounting grooves. Through the linkage of the driving shaft, the screw rod, the shaft sleeve and other structures, the synchronous action of the inner and outer clamping is realized by single-power driving, the structure is compact and stable, the clamping efficiency is high, the device is suitable for the quick clamping of diamond grinding wheels of multiple specifications, and the complexity and the debugging difficulty of the device are reduced.
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