Liquid-cooled charging module and charging pile

Abstract

The application provides a liquid-cooled charging module and a charging pile, and belongs to the technical field of vehicle charging. The liquid-cooled charging module comprises a liquid-cooled plate and a PCB plate. The liquid-cooled plate comprises a first cooling area, a second cooling area and a third cooling area which are distributed along a first path at intervals. Cooling channels are arranged in the liquid-cooled plate and distributed in the first cooling area and the third cooling area. The PCB plate comprises a first heat dissipation area, a second heat dissipation area and a third heat dissipation area. The cooling channels distributed in the first cooling area and the third cooling area extend to the second cooling area along the first path in a meandering manner, or the liquid-cooled plate is further provided with a shunt channel distributed in the second cooling area, and the shunt channel is in communication with the cooling channels. The liquid-cooled charging module and the charging pile are used to solve the problem that the components are not reasonably distributed, the heat dissipation efficiency of the liquid-cooled plate is low, and local high-temperature points are prone to occur, thereby aggravating the aging and performance degradation of the device.

Description

Technical Field

[0001] This invention belongs to the field of vehicle charging technology, and more specifically, relates to a liquid-cooled charging module and a charging pile. Background Technology

[0002] There are several technical bottlenecks in the design of existing liquid-cooled charging modules. First, in terms of the layout of the power circuit unit, the common structure places the PFC (Power Factor Correction) unit and the DC-DC unit together on one side or on the same plane, which leads to heat source accumulation, long heat dissipation paths, and uneven temperature distribution, thus affecting the overall heat dissipation efficiency and device lifespan. If the key heat-generating components such as the switching transistor module and power inductor in the PFC unit, as well as the switching transistor module, isolation transformer, and resonant inductor in the DC-DC unit, are not arranged properly, local high-temperature points can easily form, accelerating device aging and performance degradation.

[0003] Secondly, existing liquid-cooled plate flow channel designs often fail to fully consider the actual assembly structure and heat source distribution characteristics. Most flow channels are single straight-through or simple tortuous structures, which have problems such as limited flow cross-sectional area, uneven fluid distribution, and insufficient turbulence intensity, resulting in low heat exchange efficiency.

[0004] Therefore, a new heat dissipation layout and liquid cooling plate structure are urgently needed to optimize thermal management performance, improve module reliability, and meet the urgent needs of high power density charging systems for efficient heat dissipation and low operating noise. Summary of the Invention

[0005] The purpose of this invention is to provide a liquid-cooled charging module and charging pile, which aims to solve the problems in the prior art where the distribution of various components is unreasonable and the heat dissipation efficiency of the liquid cooling plate is low, resulting in local high temperature points that accelerate device aging and performance degradation.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: In a first aspect, a liquid-cooled charging module is provided, comprising: A liquid cooling plate includes a first cooling zone, a second cooling zone, and a third cooling zone distributed at intervals along a first path, and cooling channels distributed in the first cooling zone and the third cooling zone are formed in the liquid cooling plate. A PCB board is disposed at least on one side of the liquid cooling plate. The PCB board includes a first heat dissipation area, a second heat dissipation area and a third heat dissipation area. The first heat dissipation area corresponds to the first cooling area, the second heat dissipation area corresponds to the second cooling area, and the third heat dissipation area corresponds to the third cooling area. The cooling channel extends circumferentially along the liquid cooling plate to form a non-closed annular channel, and the cooling channel has multiple curved sections distributed along the second path; Wherein, when the cooling channel distributed in the first cooling zone and the third cooling zone extends meanderingly along the first path to the second cooling zone, the curved portion has an extension section located in the second cooling zone, and the extension section extends along the second path.

[0007] In conjunction with the first aspect, in one possible implementation, the PCB board has a magnetic module disposed in the second heat dissipation area, the magnetic module comprising: Electromagnetic components; A heat sink is provided to cover the electromagnetic component. The heat sink is attached to the liquid cooling plate and is used to transfer the heat of the electromagnetic component to the second cooling zone.

[0008] In conjunction with the first aspect, in one possible implementation, the curved portion forms a "U"-shaped structure with an opening toward the first path, the opening of the "U"-shaped structure being located within the first cooling zone or the third cooling zone, the portion of the "U"-shaped structure corresponding to the opening being the extension segment, the extension segment being distributed within the second cooling zone and exchanging heat with the components of the second heat dissipation zone.

[0009] In conjunction with the first aspect, in one possible implementation, the PCB board has a power switching transistor module disposed in the first heat dissipation area and / or the third heat dissipation area, the power switching transistor module comprising: A heat-conducting component is attached to the liquid cooling plate, with the side of the heat-conducting component attached to the liquid cooling plate serving as the contact surface. Multiple power switching transistors are distributed at intervals along a second path on the heat-conducting component, and the contact surfaces of the power switching transistors are respectively located on adjacent surfaces of the heat-conducting component. When at least two power switching transistors are connected in parallel, the parallel power switching transistors correspond to the same cooling section of the cooling channel, the cooling section is a continuous channel, and the cooling section does not cross the second cooling zone.

[0010] In conjunction with the first aspect, in one possible implementation, the diversion channel includes a diversion section and a diversion section connected to the diversion section. The diversion section includes two diversion segments, and both diversion segments are connected to the cooling channels distributed in the first cooling zone. One end of the diversion section is connected to the intersection of the two diversion segments, and the other end is connected to the cooling channels distributed in the third cooling zone.

[0011] In conjunction with the first aspect, in one possible implementation, the diversion section extends along the second path, and the cooling medium in the two diversion sections flows in opposite directions. The diversion section has multiple curved diversion sections, and both the diversion sections and the diversion sections are used to cool the corresponding second heat dissipation area.

[0012] In conjunction with the first aspect, in one possible implementation, the PCB board further includes a protection module located in the second heat dissipation zone, the protection module being located on one side of the magnetic module along a second path, and both the protection module and the magnetic module exchanging heat with the second cooling zone.

[0013] In conjunction with the first aspect, in one possible implementation, the cooling channel further has a connecting portion extending along the first path, the connecting portion being distributed in the first cooling zone and the third cooling zone, and extending to the second cooling zone, the protection module corresponding to the connecting portion.

[0014] The beneficial effects of the liquid-cooled charging module provided by this invention are as follows: Compared with the prior art, the liquid cooling plate, through its first, second, and third cooling zones corresponding one-to-one with the first, second, and third heat dissipation zones of the PCB board, can accurately guide the heat generated by different heat-generating components on the PCB board to the corresponding cooling areas of the liquid cooling plate, avoiding the heat source accumulation problem caused by traditional centralized layouts. Simultaneously, the cooling channel extends meanderingly along the first path to the second cooling zone, or connects to the cooling channel through a diversion channel to achieve heat dissipation coverage of the second cooling zone. This effectively shortens the heat dissipation path of each heat dissipation zone, allowing heat to be quickly transferred to the cooling medium, reducing the formation of local high-temperature points, thereby slowing down the aging rate of the device and improving the device's performance stability and lifespan. Especially when a large magnetic module is placed in the second heat dissipation zone, extending the cooling channels from the first and third cooling zones to the second cooling zone allows both the relatively low-temperature refrigerant near the inlet and the relatively high-temperature refrigerant near the outlet to circulate in the second cooling zone, balancing the heat dissipation effect of the magnetic components. By setting an independent diversion channel, it is also possible to avoid the refrigerant temperature in the second cooling zone becoming too high, thus preventing poor heat dissipation in the second heat dissipation zone. The meandering cooling channels or independently configured diversion channels of this invention optimize the flow path of fluid within the liquid cooling plate, increase the contact area between the cooling medium and the liquid cooling plate, ensure the heat dissipation effect of the components in the second heat dissipation zone, and enhance turbulence intensity. This avoids the problems of uneven fluid distribution and low heat exchange efficiency inherent in traditional single direct-flow or simple meandering channels, thereby improving the overall heat dissipation effect of the PCB and reducing PCB layout difficulty. Furthermore, this application can adapt to the layout requirements of different heat-generating components on the PCB. For example, whether it is the switching transistor module and power inductor in the PFC unit, or the switching transistor module, isolation transformer, and resonant inductor in the DCDC unit, they can all be arranged in different heat dissipation zones according to their heat generation characteristics, ensuring that each key heat-generating component receives efficient cooling and further guaranteeing the overall heat dissipation performance of the module.

[0015] Secondly, embodiments of the present invention also provide a charging pile, including the liquid-cooled charging module described above.

[0016] The beneficial effects of the liquid-cooled charging module provided by the present invention are as follows: compared with the prior art, the liquid-cooled charging module described above has similar technical effects, which will not be repeated here. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the liquid-cooled charging module provided in an embodiment of the present invention; Figure 2 This is a top view of the liquid-cooled charging module used in an embodiment of the present invention; Figure 3 This is another top view of the liquid-cooled charging module used in an embodiment of the present invention; Figure 4 This is a schematic diagram of the liquid cooling plate used in an embodiment of the present invention; Figure 5 This is a schematic diagram of the liquid cooling plate used in another embodiment of the present invention.

[0019] In the diagram: 1. Liquid cooling plate; 101. First cooling zone; 102. Second cooling zone; 103. Third cooling zone; 104. Cooling channel; 1041. Bending section; 1042. Extension section; 105. Flow diversion channel; 1051. Flow guide section; 1052. Flow diversion section; 106. Connecting section; 2. PCB board; 201. First heat dissipation zone; 202. Second heat dissipation zone; 203. Third heat dissipation zone; 204. Magnetic module; 2041. Heat sink; 2042. Electromagnetic component; 205. Power switch module; 2051. Power switch; 2052. Thermal conductive component; 206. Protection module. Detailed Implementation

[0020] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0021] In the claims, description, and accompanying drawings of this invention, unless otherwise expressly defined, the terms "first," "second," or "third," etc., are used to distinguish different objects and not to describe a specific order. Unless otherwise stated, other directional terms, such as "vertical," "clockwise," and "counterclockwise," indicate orientation or positional relationships based on the orientation and positional relationships shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, not to indicate or imply that the referred device or element must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of this invention. In the claims, description, and accompanying drawings of this invention, unless otherwise expressly defined, the terms "fixed connection" or "fixed link" should be interpreted broadly, that is, any connection method in which there is no displacement relationship or relative rotation relationship between the two, that is, including non-removable fixed connections, detachable fixed connections, integral connections, and fixed connections through other devices or elements. In the claims, description, and accompanying drawings of this invention, the terms "comprising," "having," and their variations are intended to mean "including but not limited to."

[0022] It should be noted that the second path is perpendicular to the first path.

[0023] It should be noted that, for the purpose of easily demonstrating the internal structure of the liquid cooling plate and the PCB board, Figure 2 , Figure 3 The PCB substrate has been omitted.

[0024] Please refer to the following: Figures 1 to 5 The liquid-cooled charging module and charging pile provided by the present invention will now be described. A liquid-cooled charging module includes a liquid-cooled plate 1 and a PCB board 2. The liquid-cooled plate 1 includes a first cooling zone 101, a second cooling zone 102, and a third cooling zone 103 distributed along a first path. Cooling channels 104 distributed in the first cooling zone 101 and the third cooling zone 103 are formed in the liquid-cooled plate 1. The PCB board 2 is located on at least one side of the liquid-cooled plate 1. The PCB board 2 includes a first heat dissipation zone 201, a second heat dissipation zone 202, and a third heat dissipation zone 203. The first heat dissipation zone 201 corresponds to the first cooling zone 101, the second heat dissipation zone 202 corresponds to the second cooling zone 102, and the third heat dissipation zone 203 corresponds to the third cooling zone 103. The cooling channels 104 distributed in the first cooling zone 101 and the third cooling zone 103 extend along the first path to the second cooling zone 102. Alternatively, the liquid-cooled plate 1 may also have a diversion channel 105 distributed in the second cooling zone 102, which is connected to the cooling channel 104.

[0025] Compared with existing technologies, the liquid-cooled charging module provided by this invention has a liquid cooling plate 1 with a first cooling zone 101, a second cooling zone 102, and a third cooling zone 103 that correspond one-to-one with the first heat dissipation zone 201, the second heat dissipation zone 202, and the third heat dissipation zone 203 of the PCB board. This allows for precise guidance of heat generated by different heat-generating components on the PCB board to the corresponding cooling areas of the liquid cooling plate 1, avoiding the heat source accumulation problem caused by traditional centralized layouts. Simultaneously, the cooling channel 104 extends along the first path to the second cooling zone 102, or is connected to the cooling channel 104 via a diversion channel 105 to achieve heat dissipation coverage of the second cooling zone 102. This effectively shortens the heat dissipation path of each heat dissipation zone, allowing heat to be quickly transferred to the cooling medium, reducing the formation of local high-temperature points, thereby slowing down the aging of devices and improving device performance stability and lifespan. The meandering cooling channel 104 or the independently configured diverting channel 105 optimizes the flow path of the fluid within the liquid cooling plate 1, increases the contact area between the cooling medium and the liquid cooling plate 1, enhances turbulence intensity, and avoids the problems of uneven fluid distribution and low heat exchange efficiency that exist in traditional single straight-through or simple meandering channels. Furthermore, this application can adapt to the layout requirements of different heat-generating components on the PCB board 2. For example, whether it is the switching transistor module and power inductor in the PFC unit, or the switching transistor module, isolation transformer, and resonant inductor in the DCDC unit, they can all be arranged in different heat dissipation areas according to their heat generation characteristics, ensuring that each key heat-generating component can be efficiently cooled, further guaranteeing the overall heat dissipation performance of the module.

[0026] For a specific implementation of the PCB board, please refer to Figure 3 The PCB board 2 includes a filter capacitor, a rectifier module (i.e., the switching transistor module in the PFC unit mentioned above), a power factor correction inductor, and an AC EMC filter module distributed along the first path. The filter capacitor and rectifier module are located in the first heat dissipation area 201, the power factor correction inductor is located in the second heat dissipation area 202, and the AC EMC filter module is located in the third heat dissipation area 203.

[0027] Furthermore, the PCB board 2 also includes a buffer circuit located in the second heat dissipation area 202.

[0028] Furthermore, the PCB board 2 also includes an auxiliary power supply located in the first heat dissipation area 201.

[0029] For another specific implementation of the PCB board, please refer to Figure 2The PCB board 2 includes an LLC secondary power switch module (i.e., the switch module in the DC-DC unit mentioned above), an isolation transformer, a resonant inductor, a resonant capacitor, and an LLC primary power switch module (also the switch module in the DC-DC unit mentioned above) distributed along the first path. The LLC secondary power switch module is located in the third heat dissipation area 203, the isolation transformer and the resonant inductor are located in the second heat dissipation area 202, and the resonant capacitor and the LLC primary power switch module are located in the first heat dissipation area 201.

[0030] Furthermore, the PCB board 2 also includes an anti-reverse diode module located in the second heat dissipation area 202, and a DC EMC filter module located in the second heat dissipation area 202 and the third heat dissipation area 203, and the isolation transformer, the anti-reverse diode module and the DC EMC filter module are distributed sequentially along the second path.

[0031] In some embodiments, please refer to Figure 2 and Figure 3 The PCB board 2 has a magnetic module 204 located in the second heat dissipation area 202. The magnetic module 204 includes an electromagnetic component 2042 and a heat sink 2041. The heat sink 2041 covers the electromagnetic component 2042, is attached to the liquid cooling plate 1, and is used to transfer the heat of the electromagnetic component 2042 to the second cooling area 102. To ensure the heat dissipation effect of the heat sink 2041, the contact surface between the heat sink 2041 and the liquid cooling plate 1 is set as a plane, and the other sides can be set with other structures, such as heat dissipation teeth on the four sides.

[0032] In this embodiment, the heat sink 2041 of the magnetic module 204 is directly covered by the electromagnetic component 2042, which can fully enclose and absorb the heat generated by the electromagnetic component 2042 during operation. At the same time, the heat sink 2041 is closely attached to the liquid cooling plate 1, which can directly transfer the absorbed heat to the second cooling zone 102 of the liquid cooling plate 1, greatly shortening the heat transfer path from the electromagnetic component 2042 to the cooling medium. This solves the problem of local heat accumulation caused by the limited contact surface between the electromagnetic component and the coolant in traditional electromagnetic components, and effectively reduces the operating temperature of the electromagnetic component 2042. Furthermore, glue can be potted inside the heat sink to further improve the thermal conductivity and the shock resistance of the electromagnetic component. The corresponding layout of the second heat sink 202 and the second cooling zone 102, together with the cooling channel 104 or the diversion channel 105 covering the second cooling zone 102, makes the heat dissipation of the electromagnetic component 2042 synergistic with the heat dissipation of other areas of the PCB board (such as the first and third heat sink 203), ensuring that all key heat-generating components of the entire module can be cooled in a targeted manner, avoiding the impact of high temperature of a single component on the overall performance. Optionally, the magnetic module can be an isolation transformer, a resonant inductor, or a power factor correction inductor.

[0033] In this application, the liquid cooling plate may have a PCB board on only one side, or it may be as follows: Figure 1 In this embodiment, PCBs are mounted on both sides of the liquid cooling plate to form a "sandwich" structure. The liquid cooling plate simultaneously dissipates heat from both PCBs, effectively improving the heat dissipation efficiency of the liquid cooling plate, increasing the module's power density, and reducing space occupation. In this embodiment, the two sides of the liquid cooling plate are respectively as follows... Figure 2 PFC board containing PFC unit and Figure 3 The DC-DC board containing the DC-DC unit, the PFC board, and the DC-DC board together realize the charging function of the module. In the PFC board, the heat generated by the rectifier module is greater than that of the AC EMC filter module. In the DC-DC board, the heat generated by the LLC secondary power switch module is greater than that of the LLC primary power switch module. Therefore, the rectifier module of the PFC board (i.e., the first heat dissipation area) and the LLC primary power switch module of the DC-DC board (i.e., the first heat dissipation area) both correspond to the first cooling area. The AC EMC filter module of the PFC board (i.e., the third heat dissipation area) and the LLC secondary power switch module of the DC-DC board (i.e., the third heat dissipation area) both correspond to the third cooling area, thus balancing the overall heat dissipation effect of the liquid cooling plate.

[0034] In other embodiments, the PFC unit and the DC-DC unit can be mounted on the same PCB board, and the switching modules (including rectifier modules, LLC primary-side power switching modules, and LLC secondary-side power switching modules) in both the PFC and DC-DC units can be located in the first and / or third heat dissipation areas, while the magnetic modules in both the PFC and DC-DC units can be located in the second heat dissipation area. Two PCB boards containing both PFC and DC-DC units can be mounted on opposite sides of a liquid-cooled plate to increase the power of the charging module and thus improve power density.

[0035] In some embodiments, please refer to Figures 4 to 5 The cooling channel 104 extends circumferentially along the liquid cooling plate 1 to form a non-closed annular channel. The cooling channel 104 has a plurality of curved sections 1041 distributed along the second path. When the cooling channel 104 distributed in the first cooling zone 101 and the third cooling zone 103 extends circumferentially along the first path to the second cooling zone 102, the curved section 1041 has an extension section 1042 located in the second cooling zone 102, and the extension section 1042 extends along the second path.

[0036] The non-enclosed annular structure of the cooling channel 104 extends circumferentially along the liquid cooling plate 1, maximizing the coverage of the liquid cooling plate 1 surface and avoiding the problem of insufficient coverage of edge areas by traditional direct-flow channels. Simultaneously, multiple curved sections 1041 distributed along the second path alter the flow direction of the cooling medium, enhancing fluid turbulence intensity and overcoming the limitation of low heat exchange efficiency under laminar flow conditions. This allows the cooling medium to fully contact the inner wall of the liquid cooling plate 1, increasing the heat exchange rate per unit time. When the cooling channel 104 extends circumferentially to the second cooling zone 102 and forms an extension section 1042 along the second path, the extension section 1042 can cross-cover the liquid cooling plate 1 in a partitioned layout, preventing heat dissipation blind spots in the second cooling zone 102 due to a single path.

[0037] The bend 1041 slows down the flow rate of the cooling medium, prolongs its residence time in the high-heat area, and allows it to fully absorb heat before being discharged along the annular channel. This avoids the problem of the cooling medium flowing out before sufficient heat exchange, further reducing temperature fluctuations in the second cooling zone 102 and the entire liquid cooling plate 1. The design of the non-enclosed annular cooling channel 104 does not require it to completely surround the liquid cooling plate 1. It can reserve interfaces or avoid other components according to the assembly space of the liquid-cooled charging module, improving the flexibility of the structural design.

[0038] In some embodiments, please refer to Figure 4 The curved portion 1041 forms a "U"-shaped structure with an opening to the first path. The opening of the "U"-shaped structure is located in the first cooling zone 101 or the third cooling zone 103. The part of the "U"-shaped structure corresponding to the opening is an extension 1042. The extension 1042 is distributed in the second cooling zone 102 and exchanges heat with the components in the second heat dissipation zone 202.

[0039] The extension section 1042 is distributed in the second cooling zone 102 and directly exchanges heat with the components in this area. Both the relatively low-temperature refrigerant near the inlet and the relatively high-temperature refrigerant near the outlet circulate within the second cooling zone 102, ensuring that the cooling medium releases its cooling capacity centrally in the second cooling zone 102. This allows for the placement of large and high-heat-generating magnetic components in the second heat dissipation zone 202, thus balancing the heat dissipation effect of the magnetic components while considering the heat dissipation requirements of the first and third cooling zones. This solution significantly improves the accuracy of heat exchange between each heat dissipation zone and its corresponding cooling zone, avoiding the problem of insufficient heat dissipation in high-heat-generating areas due to the uniform path of traditional channels. Furthermore, since the extension section 1042 is only distributed in the second cooling zone 102, its length and direction can be adjusted according to the size and layout of the components in the second heat dissipation zone 202 without changing the overall channel frame. This adapts to the heat dissipation requirements of components such as the magnetic module 204 of different specifications, improving the versatility of the liquid cooling plate 1 structure and the flexibility of module assembly.

[0040] In some embodiments, please refer to Figure 2The PCB board 2 has a power switch module 205 disposed in the first heat dissipation area 201 and / or the third heat dissipation area 203. The power switch module 205 includes a heat-conducting component 2052 and a plurality of power switch transistors 2051. The heat-conducting component 2052 is attached to the liquid cooling plate 1, and the side of the heat-conducting component 2052 attached to the liquid cooling plate 1 is defined as the contact surface. The plurality of power switch transistors 2051 are distributed at intervals along a second path on the heat-conducting component 2052, and the power switch transistors 2051 and the contact surface are respectively located on adjacent surfaces of the heat-conducting component 2052. When at least two power switch transistors 2051 are connected in parallel, the parallel power switch transistors 2051 correspond to the same cooling section of the cooling channel 104. The cooling section is a continuous channel and does not cross the second cooling area 102. Figure 4 Taking the curved part 1041 of the "U"-shaped structure as an example, the extension section 1042 of the "U"-shaped structure is located in the second cooling zone. The left vertical line of the "U"-shaped structure and the part connected to it to the left (without crossing the second cooling zone) can be the same cooling section. The right vertical line of the "U"-shaped structure and the part connected to it to the right (without crossing the second cooling zone) can be the same cooling section. The left and right vertical lines of the same "U"-shaped structure located in the second cooling zone are not the same cooling section.

[0041] The heat-conducting component 2052 of the power switching transistor module 205 is directly attached to the liquid cooling plate 1, enabling rapid conduction of the heat generated by the multiple power switching transistors 2051 during operation to the liquid cooling plate 1. Simultaneously, the multiple power switching transistors 2051 are spaced apart along a second path perpendicular to the first path, preventing localized heat accumulation caused by concentrated arrangement of the power switching transistors 2051, allowing heat to be evenly distributed and efficiently transferred to the surface of the heat-conducting component 2052. Similarly, to ensure the heat dissipation effect of the heat-conducting component 2052, the contact surface between the heat-conducting component 2052 and the liquid cooling plate 1 is set as a plane, while other sides can be configured with other structures, such as heat dissipation fins.

[0042] Crucially, the multiple power switches 2051 connected in parallel correspond to the cooling section in the cooling channel 104. Since the cooling section is a continuous channel and does not pass through the second cooling zone 102, temperature loss due to premature heat exchange between the cooling medium and other components is avoided. This ensures that the cooling medium within the cooling section maintains a stable and uniform temperature, allowing all the power switches 2051 connected in parallel to achieve the same heat dissipation efficiency, effectively reducing temperature differences between the parallel power switches. Temperature is a key factor affecting the electrical parameters of power switches; temperature uniformity directly reduces deviations in core parameters such as on-state voltage drop and switching speed, significantly improving overall parameter consistency.

[0043] The core requirement for parallel operation of power switches is to achieve uniform current distribution, and parameter consistency is a prerequisite for current sharing. Because the temperature differences and parameter deviations of each power switch (2051) are small, under the same operating voltage and control signal, the current borne by each power switch will be closer to the theoretically shared current, avoiding current concentration caused by abnormal parameters of some power switches. This not only prevents individual power switches from incurring additional losses due to overcurrent, but also reduces the impact of current fluctuations on the overall circuit stability, extends the service life of the power switch module (205), and improves the operating efficiency and reliability of the entire power system.

[0044] In some embodiments, please refer to Figure 5 The diversion channel 105 includes a diversion section 1051 and a diversion section 1052 connected to the diversion section 1051. The diversion section 1051 includes two diversion segments, and both diversion segments are connected to the cooling channels 104 distributed in the first cooling zone 101. One end of the diversion section 1052 is connected to the intersection of the two diversion segments, and the other end is connected to the cooling channels 104 distributed in the third cooling zone 103.

[0045] The two diversion sections obtain cooling medium from the cooling channel 104 of the first cooling zone 101, which can significantly increase the medium flow rate to the second cooling zone 102 and avoid the problem of insufficient flow caused by the flow section limitation of a single diversion section, ensuring that the second cooling zone 102 receives sufficient cooling medium. At the same time, after the two diversion sections converge, they are uniformly transported to the third cooling zone 103 through the diversion section 1052, forming a smooth path of "dual source inflow and single output", reducing the pressure loss of the medium during the diversion process, allowing the cooling medium to flow through the second cooling zone 102 at a higher flow rate, and improving the heat removal efficiency.

[0046] The dual-flow section introduces the medium from different positions in the first cooling zone 101, which can form a balanced fluid pressure at the confluence of the flow section 1051, avoiding local flow velocity differences caused by a single inlet. When the flow branch section 1052 receives the converged medium and flows into the third cooling zone 103, it can evenly cover each area of ​​the second cooling zone 102 along the path, ensuring that the heat dissipation conditions of different components in this area are consistent, preventing local high temperatures due to uneven medium distribution, effectively reducing the overall temperature fluctuation of the second cooling zone 102, and ensuring the stable performance of each component.

[0047] In some embodiments, please refer to Figure 5 The flow section extends along the second path, and the cooling medium in the two flow sections flows in opposite directions. The flow branch 1052 has multiple curved flow branches, and both the flow branch and the flow section are used to cool the corresponding second heat dissipation area 202.

[0048] The two flow sections extend along the second path and the medium flows in opposite directions, which can form a bidirectional convection cooling situation in the second cooling zone 102, avoiding the problem of sufficient heat dissipation at the inlet and heat accumulation at the outlet caused by a single flow direction; the reverse-flowing cooling medium can form a heat counter-current absorption from both sides of the second cooling zone 102 towards the middle or along a preset path, ensuring that the temperature of each location in the area tends to be consistent, effectively eliminating local heat dissipation blind spots, greatly reducing the overall temperature difference of the second cooling zone 102, and ensuring that all components in the area are in a stable operating temperature environment.

[0049] The reverse flow design of the two diversion sections can enhance the turbulence intensity of the cooling medium in the second cooling zone 102, breaking the limitation of low heat exchange efficiency in laminar flow state, and making the medium more fully contact the inner wall of the liquid cooling plate 1 and the corresponding components. At the same time, the multiple curved diversion sections of the diversion section 1052 can further extend the flow path and residence time of the medium in the second cooling zone 102, allowing the medium to have more time to absorb heat, significantly increasing the heat exchange rate per unit time, and quickly removing the heat generated by the components in the second heat dissipation zone 202, avoiding performance degradation caused by high temperature.

[0050] In some embodiments, please refer to Figure 2 The PCB board 2 also has a protection module 206 located in the second heat dissipation zone 202. The protection module 206 is located on one side of the magnetic module 204 along the second path. Both the protection module 206 and the magnetic module 204 exchange heat with the second cooling zone 102.

[0051] The protection module 206 and the magnetic module 204 are arranged sequentially along the second path and both directly exchange heat with the second cooling zone 102. This allows the cooling medium in the second cooling zone 102 to simultaneously provide heat dissipation support for both critical components, avoiding localized overheating caused by multiple components competing for heat dissipation resources in traditional layouts. Simultaneously, they are compatible with the extension direction of the cooling channel 104 (or the diversion channel 105) in the second cooling zone 102, enabling the cooling medium to continuously absorb heat from both components as it flows along the second path. This significantly improves the overall heat dissipation efficiency of the second cooling zone 202 and reduces temperature differences within the area. The close-range collaborative heat dissipation of the magnetic module 204 and the protection module 206 prevents them from affecting each other due to localized high temperatures, ensuring that both components function in a stable temperature environment and further enhancing the operational reliability and safety of the liquid-cooled charging module.

[0052] In some embodiments, please refer to Figures 4 to 5 The cooling channel 104 also has a connecting part 106 extending along the first path. The connecting part 106 is distributed in the first cooling zone 101 and the third cooling zone 103, and extends to the second cooling zone 102. The protection module 206 corresponds to the connecting part 106.

[0053] The connecting part 106 extends along the first path to the second cooling zone 102 and directly corresponds to the protection module 206. This allows the cooling medium to flow directly through the connecting part 106 below the protection module 206, shortening the heat transfer path from the protection module 206 to the cooling medium. At the same time, the design of the connecting part 106 distributed in the first and third cooling zones 103 can directly extend the cooling capacity of the cooling channel 104 to the protection module 206 area of ​​the second cooling zone 102. This avoids insufficient heat dissipation of the protection module 206 due to its distance from the main channel, ensuring that the heat generated by the protection module 206 during operation is quickly absorbed. This effectively prevents the protection function from being delayed or failing due to high temperature, ensuring the safe operation of the module.

[0054] In some embodiments, please refer to Figure 4 The cooling channels 104 are mirror-symmetrically distributed in the first cooling zone 101 and the third cooling zone 103 with the second path as the axis of symmetry.

[0055] The mirror-symmetrical cooling channel 104 design ensures that the first and third cooling zones 103 have completely consistent cooling medium distribution and flow paths, guaranteeing that the heat-generating components in both zones are under the same heat dissipation conditions. The symmetrically distributed cooling channels 104 ensure consistent flow resistance of the cooling medium in the first and third cooling zones 103, preventing localized excessive flow velocity or pressure surges due to differences in flow paths, and reducing noise generated by fluid impacting the inner walls of the flow channels.

[0056] Based on the same inventive concept, the present invention also provides a charging pile. The charging pile includes the above-mentioned liquid-cooled charging module.

[0057] The charging pile provided by this invention adopts the aforementioned liquid-cooled charging module. The liquid cooling plate 1 corresponds one-to-one with the first heat dissipation area 201, the second heat dissipation area 202, and the third heat dissipation area 203 of the PCB board through the first cooling area 101, the second cooling area 102, and the third cooling area 103. This allows for precise guidance of heat generated by different heat-generating components on the PCB board to the corresponding cooling area of ​​the liquid cooling plate 1, avoiding the heat source accumulation problem caused by traditional centralized layouts. Simultaneously, the cooling channel 104 extends along the first path to the second cooling area 102, or is connected to the cooling channel 104 through the diversion channel 105 to achieve heat dissipation coverage of the second cooling area 102. This effectively shortens the heat dissipation path of each heat dissipation area, allowing heat to be quickly transferred to the cooling medium, reducing the formation of local high-temperature points, thereby slowing down the aging rate of components and improving the performance stability and service life of the components. The meandering cooling channel 104 or the independently configured diverting channel 105 optimizes the flow path of the fluid within the liquid cooling plate 1, increases the contact area between the cooling medium and the liquid cooling plate 1, enhances turbulence intensity, and avoids the problems of uneven fluid distribution and low heat exchange efficiency that exist in traditional single straight-through or simple meandering flow channels. Furthermore, this application can adapt to the layout requirements of different heat-generating components on the PCB board 2. For example, whether it is the rectifier module and power inductor in the PFC unit, or the isolation transformer and resonant inductor in the DC unit, they can be arranged in different heat dissipation areas according to their heat generation characteristics, ensuring that each key heat-generating component can be efficiently cooled, further guaranteeing the overall heat dissipation performance of the module.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A liquid-cooled charging module, characterized in that, include: A liquid cooling plate includes a first cooling zone, a second cooling zone, and a third cooling zone distributed at intervals along a first path, and cooling channels distributed in the first cooling zone and the third cooling zone are formed in the liquid cooling plate. A PCB board is disposed at least on one side of the liquid cooling plate. The PCB board includes a first heat dissipation area, a second heat dissipation area and a third heat dissipation area. The first heat dissipation area corresponds to the first cooling area, the second heat dissipation area corresponds to the second cooling area, and the third heat dissipation area corresponds to the third cooling area. The cooling channels distributed in the first cooling zone and the third cooling zone also extend along the first path to the second cooling zone; The cooling channel extends circumferentially along the liquid cooling plate to form a non-closed annular channel, and the cooling channel has multiple bends distributed along the second path; Wherein, when the cooling channel distributed in the first cooling zone and the third cooling zone extends meanderingly along the first path to the second cooling zone, the curved portion has an extension section located in the second cooling zone, and the extension section extends along the second path.

2. The liquid-cooled charging module as described in claim 1, characterized in that, The PCB board has a magnetic module disposed in the second heat dissipation area, the magnetic module comprising: Electromagnetic components; A heat sink is provided to cover the electromagnetic component. The heat sink is attached to the liquid cooling plate and is used to transfer the heat of the electromagnetic component to the second cooling zone.

3. The liquid-cooled charging module as described in claim 2, characterized in that, The curved portion forms a "U"-shaped structure with an opening to the first path. The opening of the "U"-shaped structure is located in the first cooling zone or the third cooling zone. The portion of the "U"-shaped structure corresponding to the opening is the extension segment. The extension segment is distributed in the second cooling zone and exchanges heat with the components in the second heat dissipation zone.

4. The liquid-cooled charging module as described in claim 1, characterized in that, The PCB board has a power switching transistor module disposed in the first heat dissipation area and / or the third heat dissipation area, the power switching transistor module comprising: A heat-conducting component is attached to the liquid cooling plate, with the side of the heat-conducting component attached to the liquid cooling plate serving as the contact surface. Multiple power switching transistors are distributed at intervals along a second path on the heat-conducting component, and the contact surfaces of the power switching transistors are respectively located on adjacent surfaces of the heat-conducting component. When at least two power switching transistors are connected in parallel, the parallel power switching transistors correspond to the same cooling section of the cooling channel, the cooling section is a continuous channel, and the cooling section does not cross the second cooling zone.

5. The liquid-cooled charging module as described in claim 1, characterized in that, The diversion channel includes a diversion section and a diversion section connected to the diversion section. The diversion section includes two diversion segments, and both diversion segments are connected to the cooling channels distributed in the first cooling zone. One end of the diversion section is connected to the intersection of the two diversion segments, and the other end is connected to the cooling channels distributed in the third cooling zone.

6. The liquid-cooled charging module as described in claim 5, characterized in that, The flow guide section extends along the second path, and the cooling medium in the two flow guide sections flows in opposite directions. The flow branch has multiple curved flow branch sections, and both the flow branch section and the flow guide section are used to cool the corresponding second heat dissipation area.

7. The liquid-cooled charging module as described in claim 2, characterized in that, The PCB board also has a protection module located in the second heat dissipation area. The protection module is located on one side of the magnetic module along the second path. Both the protection module and the magnetic module exchange heat with the second cooling area.

8. The liquid-cooled charging module as described in claim 7, characterized in that, The cooling channel also has a connecting portion extending along the first path, the connecting portion being distributed in the first cooling zone and the third cooling zone, and extending to the second cooling zone, and the protection module corresponding to the connecting portion.

9. A charging pile, characterized in that, The liquid-cooled charging module has any one of claims 1-8.

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