Modified polyacrylate, preparation method thereof, glue solution, adhesive and uv debonding film

Abstract

The embodiment of the present application discloses a modified polyacrylate, a preparation method thereof, a glue solution, a glue and a UV adhesion-reducing scribing film, and a structural formula of the modified polyacrylate is as follows: wherein R1, R2 and R3 are independently any one of -H, an alkyl group, an aryl group, an ether group and a cyano group, R4 is an alkyl group, R5 is an organic group with an acrylate group and a carbon atom number of 2-26, R6, R7, R8, R9 and R10 are independently -H or a methyl group, X is O or N, and a, b, c, d and e are all integers greater than 0. 10 The embodiment of the present application introduces a high-reactivity photosensitive group (an acrylate group) into the polyacrylate, so that the light curing reaction efficiency of the polyacrylate is improved, the crosslinking density of the network structure formed by the UV curing of the polyacrylate is improved, and the adhesion-reducing effect of the generated UV adhesion-reducing scribing film is improved.

Description

Technical Field

[0001] This application relates to the field of UV anti-tack scribe film technology, specifically to a modified polyacrylate and its preparation method, adhesive, binder and UV anti-tack scribe film. Background Technology

[0002] Dicing semiconductor wafers to obtain semiconductor chips is an essential step in semiconductor chip manufacturing. UV-curing dicing films, used for wafer dicing, serve as an invisible consumable to protect, fix, and support the chips on the wafer, thereby ensuring chip production yield and efficiency. During wafer dicing, the UV-curing dicing film firmly adheres to the wafer, preventing wafer displacement and ensuring dicing accuracy. After dicing, UV radiation cures the adhesive layer in the dicing film, rapidly reducing adhesion to the chip, facilitating chip pickup, and preventing adhesive residue.

[0003] Traditional chip pick-up processes use ejector pins to directly lift the chip from the dicing film. This method is prone to warping when the chip is thin or large, which can easily lead to chip breakage during pick-up. Therefore, UV-resistant anti-adhesion dicing films are gradually becoming an important choice for large-size, ultra-thin chips in wafer dicing processes.

[0004] With the rapid development of the optoelectronic industry and artificial intelligence, higher demands are being placed on the integration and performance of semiconductor chips. Therefore, large-size, ultra-thin chips have become the mainstream development trend. According to Moore's Law, reducing the thickness of semiconductor wafers increases their brittleness, making them more prone to breakage during dicing. UV anti-adhesion dicing films, a related technology, have shown poor anti-adhesion effects. Summary of the Invention

[0005] This application provides a modified polyacrylate and its preparation method, adhesive, and UV tack-reducing scribe film, aiming to solve the problem of poor tack-reducing effect of UV tack-reducing scribe film.

[0006] This application provides a modified polyacrylate, the modified polyacrylate having the following structural formula: In this group, R1, R2, and R3 are each independently any one of -H, alkyl, aryl, ether, and cyano groups; R4 is an alkyl group; R5 is an organic group containing an acrylate group with 2 to 26 carbon atoms; and R6, R7, R8, R9, and R... 10 Each of them is either -H or methyl, X is O or N, and a, b, c, d, and e are all integers greater than 0.

[0007] Optionally, in some embodiments of this application, e is 0.6 to 2.0 times d; and / or R1, R2, and R3 each independently contain 0 to 22 carbon atoms; and / or R4 contains 1 to 3 carbon atoms; and / or R5 contains 5 to 15 carbon atoms; and / or The modified polyacrylate has a weight-average molecular weight of 500,000 to 1,000,000.

[0008] Optionally, in some embodiments of this application, R5 is... , where R 11 For -H or methyl, R 12 Including one or more of methyl, ethyl, acrylate, and ether groups, and R 12 The total number of carbon atoms is less than or equal to 13. For connecting points.

[0009] Optionally, in some embodiments of this application, R5 is ethyl acrylate, ethyl methacrylate, 1,1-di(acryloyloxymethyl)ethyl ester, 1,1-di(acryloyloxy)ethyl ester, or... , or ,in, For connecting points.

[0010] Optionally, in some embodiments of this application, the monomers for synthesizing the polyacrylate include hard monomers, soft monomers, and functional monomers; The hard monomers include one or more of the following: methyl acrylate, benzyl acrylate, isobornyl acrylate, acrylonitrile, acrylamide, 4-acryloylmorpholine, methyl methacrylate, ethyl methacrylate, butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, benzyl methacrylate, isobornyl methacrylate, cyclohexyl methacrylate, tetrahydrofuran methacrylate, and vinyl acetate; and / or The soft monomer includes one or more of ethyl acrylate, butyl acrylate, isobutyl acrylate, tert-butyl acrylate, isooctyl acrylate, dodecyl acrylate, tridecyl acrylate, tetradecyl acrylate, hexadecyl acrylate, octadecyl acrylate, and n-octyl methacrylate; and / or The functional monomers include one or more of acrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate, methacrylic acid, hydroxyethyl methacrylate, hydroxypropyl methacrylate, and glycidyl methacrylate; and / or The functional monomer has a mass percentage content of 10% to 25% in the synthetic monomer.

[0011] Accordingly, this application also provides a method for preparing modified polyacrylate, comprising: The polyacrylate, modified monomer, and initiator are mixed in a first solvent and a grafting reaction is carried out to obtain the modified polyacrylate. The modified monomer includes isocyanate and acrylate groups, and the polyacrylate includes hydroxyl groups.

[0012] Optionally, in some embodiments of this application, the modified monomer includes one or more of the following: ethyl isocyanate, ethyl isocyanate methacrylate, 1,1-di(acryloyloxymethyl)ethyl isocyanate, 1,1-di(acryloyloxy)ethyl isocyanate, 2-(2-isocyanate ethoxy)ethyl acrylate, 2-(2-isocyanate ethoxy)ethyl 2-methylprop-2-enoate, and [2-isocyanate-3-prop-2-enoxy-2-(prop-2-enoxymethylpropyl]prop-2-enoate; and / or The first solvent includes one or more of tetrahydrofuran, ethyl acetate, and toluene; and / or The grafting reaction also involves the addition of a polymerization inhibitor, which includes one or more of the following: 4-methoxyphenol, hydroquinone, 2,2,6,6-tetramethylpiperidine oxide, 4-hydroxy-2,2,6,6-tetramethylpiperidineoxy, 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxy, 1,4-benzoquinone, tetramethylbenzoquinone, 2,6-dinitro-p-cresol, 2,6-dinitro-4-methylphenol, n-hexadecyl 3,5-di-tert-butyl-4-hydroxybenzoate, and tris(1,2,2,6,6-pentamethylpiperidinol) phosphite; and / or The grafting reaction also includes a catalyst, which comprises one or more of the following: dibutyltin dilaurate, stannous octoate, bismuth neodecanoate, bismuth laurate, bismuth isooctanoate, triethylenediamine, dimethylcyclohexylamine, 1-butyl-3-methylimidazolium tetrafluoroborate, and tetrabutylammonium bromide.

[0013] Optionally, in some embodiments of this application, the mass ratio of the polyacrylate to the modified monomer is 100:(20~60); and / or The mass ratio of the polyacrylate, the polymerization inhibitor, and the catalyst is 100:(0.3~1.2):(1.0~1.5).

[0014] Optionally, in some embodiments of this application, the grafting reaction temperature is 50°C to 70°C, and the grafting reaction time is 5h to 9h.

[0015] Accordingly, this application also provides an adhesive liquid comprising the above-mentioned modified polyacrylate, or the modified polyacrylate prepared by the above-mentioned method.

[0016] Optionally, in some embodiments of this application, a photosensitive oligomer is also included, wherein the photosensitive oligomer is an aliphatic polyurethane acrylate oligomer.

[0017] Optionally, in some embodiments of this application, the photosensitive oligomer includes one or more of polyurethane-modified acrylate, polyester polyurethane-modified acrylate, polyether polyurethane-modified acrylate, and polyimide polyurethane-modified acrylate; and / or The mass ratio of the modified photosensitive polyacrylate to the photosensitive oligomer is 100:(40-50).

[0018] Optionally, in some embodiments of this application, an auxiliary agent is also included, which includes one or more of alkyl quaternary ammonium salts, alkyl sulfonates, conductive polymers, and ionic liquids.

[0019] Optionally, in some embodiments of this application, the alkyl quaternary ammonium salt includes one or more of stearamidopropyl hydroxyethyl dimethyl ammonium nitrate, octadecyl dimethyl hydroxyethyl ester quaternary ammonium nitrate, lauramidopropyl trimethylammonium sulfate methyl ester, bis(octadecyl dimethyl ammonium chloride), bis(2-hydroxyethyl) dimethyl ammonium chloride, hexadecyl trimethyl ammonium chloride, tetraethyl ammonium hydroxide, and choline hydroxide; and / or The alkyl sulfonate comprises one or more of sodium dodecylbenzenesulfonate, sodium dodecyl sulfate, sodium dodecyl sulfonate, sodium p-toluenesulfonate, sodium methanesulfonate, sodium ethylsulfonate, sodium octyl sulfonate, and perfluorooctane sulfonate; and / or The conductive polymer includes at least one of polypyrrole and polyaniline; and / or The ionic liquid comprises one or more of the following: 1-butyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium chloride, 1-(2-hydroxyethyl)-3-methylimidazolium tetrafluoroborate, N-hexylpyridine tetrafluoroborate, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-hexyl-3-methylimidazolium hexafluorophosphate, tetrabutylammonium bis(trifluoromethanesulfonate)imide, octadecyltrimethylammonium hexafluorophosphate, and 1-allyl-3-methylimidazolium bis(trifluoromethanesulfonate)imide; and / or The mass ratio of the modified photosensitive polyacrylate to the additive is 100:(0.15-0.4).

[0020] Optionally, in some embodiments of this application, a thermosetting agent and a photoinitiator are also included; The thermosetting agent includes one or more of epoxy curing agents, polyetheramine curing agents, and isocyanate curing agents; and / or The photoinitiator includes one or more of benzophenone, benzophenone, 1-hydroxy-1-methylethylphenyl ketone, 2,4,6-trimethylbenzoyl-ethoxy-phosphine oxide, and 2-hydroxy-2-methyl-phenylacetone; and / or The mass ratio of the modified photosensitive polyacrylate, the thermosetting agent, and the photoinitiator is 100:(1-5):(0.4-2.5).

[0021] Accordingly, this application also provides an adhesive formed by curing the above-mentioned adhesive liquid.

[0022] Accordingly, this application also provides a UV anti-tack slitting film, comprising a substrate layer, an adhesive layer and a release layer stacked sequentially, wherein the adhesive layer is formed by curing the aforementioned adhesive solution.

[0023] This application improves the photocuring efficiency of polyacrylate by introducing highly reactive photosensitive groups (acrylate groups) into polyacrylate, thereby increasing the crosslinking density of the network structure formed by UV curing of polyacrylate, and thus improving the anti-tack effect of the generated UV anti-tack scribe film. At the same time, the hydroxyl groups retained in polyacrylate can undergo crosslinking reaction under UV irradiation, thereby increasing the crosslinking density of the network structure formed by UV curing of polyacrylate, and thus improving the anti-tack effect of the generated UV anti-tack scribe film. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the UV anti-adhesion scribbling film provided in the embodiments of this application.

[0026] Figure 2 This is a chip image obtained in a pick-up test of the UV anti-adhesion dicing film provided in Embodiment 1 of this application (obtained under a microscope, where the black part is the back of the chip and the white cross lines are the cutting paths). Figure 3 The image shown is a chip image obtained from the pick-up test of the UV anti-adhesion dicing film provided in Comparative Example 1 of this application (observed under a microscope, where the blue part is the front of the chip and the transparent part at the edge is the chip chipping phenomenon after collision). Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] Existing photosensitive polyacrylates and photosensitive oligomers have low curing efficiency and low crosslinking density in the resulting semi-interpenetrating network structure, leading to poor adhesion reduction effects of existing UV-resistant scribe films after UV treatment. Due to the fluidity of the adhesive layer and the hydrogen bonding interactions of polar groups in existing UV-resistant scribe films, the chemical bonding and physical adsorption forces between the scribe film and the adhered surface continuously increase, resulting in a gradual increase in the adhesion force of the scribe film. Consequently, the adhesion force of the scribe film becomes unstable and its adhesion over time is poor.

[0029] This application provides a modified polyacrylate and its preparation method, a liquid adhesive, a binder, and a UV-resistant scribe film. These are described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments. Furthermore, in the description of this application, the term "comprising" means "including but not limited to". The terms first, second, third, etc., are used merely as illustrative and do not impose numerical requirements or establish an order. Various embodiments of the present invention may exist in a range format; it should be understood that the description in a range format is merely for convenience and brevity and should not be construed as a rigid limitation on the scope of the invention; therefore, it should be considered that the range description has specifically disclosed all possible sub-ranges and single numerical values ​​within that range. For example, it should be considered that a range description from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and single numerical values ​​within the counted range, such as 1, 2, 3, 4, 5, and 6, regardless of the range. Additionally, whenever a numerical range is specified in this document, it means that any referenced number (fraction or integer) within the range is included.

[0030] This application provides a modified polyacrylate, the modified polyacrylate having the following structural formula: In this group, R1, R2, and R3 are each independently any one of -H, alkyl, aryl, ether, and cyano groups; R4 is an alkyl group; R5 is an organic group containing an acrylate group with 2 to 26 carbon atoms; and R6, R7, R8, R9, and R... 10 Each can be independently -H or methyl, X can be O or N, and a, b, c, d, and e can all be integers greater than 0, such as 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, etc.

[0031] In this application, by introducing highly reactive photosensitive groups (acrylate groups) into polyacrylate, the photocuring efficiency of polyacrylate can be improved, thereby increasing the crosslinking density of the network structure formed by UV curing of polyacrylate, and thus improving the anti-tack effect of the generated UV anti-tack scribe film. At the same time, hydroxyl groups are retained in polyacrylate. When coating to form an adhesive layer, the hydroxyl groups in polyacrylate can react with the thermosetting agent to perform preliminary crosslinking of polyacrylate molecular chains, thereby improving the cohesive force of the adhesive layer and making the peel force of the UV anti-tack scribe film before UV curing moderate.

[0032] It is understandable that the R1, R2, R3, and R4 groups attached to different repeating units -CH2CH- of the modified polyacrylate can be the same or different.

[0033] Optionally, in some embodiments of this application, the e is 0.6 to 2 times the d, for example, it can be 0.6 times, 0.65 times, 0.7 times, 0.75 times, 0.8 times, 1 time, 1.2 times, 1.4 times, 1.6 times, 1.8 times, 2 times, etc.

[0034] Optionally, in some embodiments of this application, R1, R2, and R3 each contain 0 to 22 carbon atoms independently, for example, they may contain 0 carbon atoms, 2 carbon atoms, 5 carbon atoms, 7 carbon atoms, 10 carbon atoms, 12 carbon atoms, 15 carbon atoms, 17 carbon atoms, 20 carbon atoms, 22 carbon atoms, etc.

[0035] Optionally, in some embodiments of this application, R4 contains 1 to 3 carbon atoms, for example, it may contain 1 carbon atom, 2 carbon atoms, or 3 carbon atoms.

[0036] Optionally, in some embodiments of this application, R5 contains 5 to 15 carbon atoms, such as 5 carbon atoms, 7 carbon atoms, 9 carbon atoms, 11 carbon atoms, 13 carbon atoms, 15 carbon atoms, etc.

[0037] Optionally, in some embodiments of this application, the weight-average molecular weight of the modified polyacrylate is 500,000 to 1,000,000, for example, it can be 500,000, 600,000, 700,000, 800,000, 900,000, 1,000,000, etc.

[0038] Optionally, in some embodiments of this application, R5 is... , where R 11 For -H or methyl, R 12 Including one or more of methyl, ethyl, acrylate, and ether groups, and R 12 The total number of carbon atoms is less than or equal to 13. For connecting points.

[0039] Optionally, in some embodiments of this application, R5 is ethyl acrylate, ethyl methacrylate, 1,1-di(acryloyloxymethyl)ethyl ester, 1,1-di(acryloyloxy)ethyl ester, or... , or ,in, For connecting points.

[0040] Optionally, in some embodiments of this application, the monomers for synthesizing the polyacrylate include hard monomers, soft monomers, and functional monomers.

[0041] Optionally, in some embodiments of this application, the hard monomer includes one or more of methyl acrylate, benzyl acrylate, isobornyl acrylate, acrylonitrile, acrylamide, 4-acryloylmorpholine, methyl methacrylate, ethyl methacrylate, butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, benzyl methacrylate, isobornyl methacrylate, cyclohexyl methacrylate, tetrahydrofuran methacrylate, and vinyl acetate.

[0042] Optionally, in some embodiments of this application, the soft monomer includes one or more of ethyl acrylate, butyl acrylate, isobutyl acrylate, tert-butyl acrylate, isooctyl acrylate, dodecyl acrylate, tridecyl acrylate, tetradecyl acrylate, hexadecyl acrylate, octadecyl acrylate, and n-octyl methacrylate.

[0043] Optionally, in some embodiments of this application, the functional monomer includes one or more of acrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate, methacrylic acid, hydroxyethyl methacrylate, hydroxypropyl methacrylate, and glycidyl methacrylate.

[0044] Optionally, in some embodiments of this application, the functional monomer has a mass percentage content of 10% to 25% in the synthetic monomer, for example, it can be 10%, 12%, 15%, 17%, 20%, 22%, 25%, etc.

[0045] Understandably, the required hard monomers, soft monomers, and functional monomers, as well as the ratios between various monomers, can be selected based on the desired properties of the polyacrylate.

[0046] This application provides a method for preparing a modified polyacrylate, comprising: The polyacrylate, modified monomer, and initiator are mixed in a first solvent and a grafting reaction is carried out to obtain the modified polyacrylate. The modified monomer includes isocyanate and acrylate groups, and the polyacrylate includes hydroxyl groups.

[0047] It is understandable that during the grafting reaction, some of the hydroxyl groups in the polyacrylate branch chain can react with the isocyanate groups in the modified monomer to obtain the modified polyacrylate.

[0048] Optionally, in some embodiments of this application, a method for preparing polyacrylate is further included, wherein the method for preparing polyacrylate includes: The synthetic monomer and initiator are mixed in a second solvent and polymerized to obtain polyacrylate.

[0049] Optionally, in some embodiments of this application, the modified monomer includes ethyl isocyanate, ethyl isocyanate methacrylate, 1,1-di(acryloyloxymethyl)ethyl isocyanate, 1,1-di(acryloyloxy)ethyl isocyanate, and 2-(2-isocyanate-ethoxy)ethyl acrylate. CAS: 1088364-03-7), 2-(2-isocyanate ethoxy) ethyl 2-methylprop-2-enoate ( CAS:107023-60-9) and [2-isocyanate-3-prop-2-enoxy-2-(prop-2-enoxymethylpropyl]prop-2-enoxy ( One or more of the following (CAS: 1184212-65-4).

[0050] Optionally, in some embodiments of this application, the first solvent and the second solvent each independently comprise one or more of tetrahydrofuran, ethyl acetate, and toluene.

[0051] Optionally, in some embodiments of this application, the initiator includes one or more of benzoyl peroxide, azobisisobutyronitrile, azobisisoheptanenitrile, and dimethyl azobisisobutyrate.

[0052] Optionally, in some embodiments of this application, a polymerization inhibitor is also added during the grafting reaction. The polymerization inhibitor includes one or more of the following: 4-methoxyphenol, hydroquinone, 2,2,6,6-tetramethylpiperidine oxide, 4-hydroxy-2,2,6,6-tetramethylpiperidineoxy, 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxy, 1,4-benzoquinone, tetramethylbenzoquinone, 2,6-dinitro-p-cresol, 2,6-dinitro-4-methylphenol, n-hexadecyl 3,5-di-tert-butyl-4-hydroxybenzoate, and tris(1,2,2,6,6-pentamethylpiperidinol) phosphite.

[0053] It is understandable that polymerization inhibitors can capture free radicals that appear during the grafting reaction and inhibit the probability of polymerization of acrylate free radicals during the grafting reaction.

[0054] Optionally, in some embodiments of this application, a catalyst is also added during the grafting reaction. The catalyst includes one or more of the following: dibutyltin dilaurate, stannous octanoate, bismuth neodecanoate, bismuth laurate, bismuth isooctanoate, triethylenediamine, dimethylcyclohexylamine, 1-butyl-3-methylimidazolium tetrafluoroborate, and tetrabutylammonium bromide. Thus, the catalyst can promote the reaction between the hydroxyl and isocyanate groups during the grafting reaction.

[0055] Optionally, in some embodiments of this application, the mass ratio of the polyacrylate to the modified monomer is 100:(20~60), for example, it can be 100:20, 100:25, 100:30, 100:35, 100:40, 100:45, 100:50, 100:55, 100:60, etc.

[0056] Optionally, in some embodiments of this application, the mass ratio of the polyacrylate, the polymerization inhibitor, and the catalyst is 100:(0.3~1.2):(1.0~1.5), for example, it can be 100:0.3:1.0, 100:0.3:1.3, 100:0.3:1.5, 100:0.6:1.0, 100:0.6:1.3, 100:0.6:1.5, 100:0.9:1.0, 100:0.9:1.3, 100:0.9:1.5, 100:1.2:1.0, 100:1.2:1.3, 100:1.2:1.5, etc.

[0057] Optionally, in some embodiments of this application, the mass ratio of the polyacrylate, the modified monomer, the polymerization inhibitor and the catalyst is 100:(20~60):(0.3~1.2):(1.0~1.5).

[0058] Optionally, in some embodiments of this application, the mass ratio of the second solvent and the first solvent to the mass of the synthetic monomer is (50~70):(30~50), for example, it can be 50:50, 55:45, 60:40, 65:35, 70:30, etc.

[0059] Optionally, in some embodiments of this application, the mass of the initiator is 0.1% to 0.5% of the mass of the synthetic monomer, for example, it can be 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, etc.

[0060] Optionally, in some embodiments of this application, the temperature of the polymerization reaction is 65℃~90℃, for example, 65℃, 70℃, 75℃, 80℃, 85℃, 90℃, etc., and the time of the polymerization reaction is 5h~12h, for example, 5h, 6h, 7h, 8h, 9h, 10h, 11h, 12h, etc.

[0061] Optionally, in some embodiments of this application, the temperature of the grafting reaction is 50℃~70℃, for example, 55℃, 57℃, 60℃, 62℃, 65℃, 67℃, 70℃, etc., and the time of the grafting reaction is 5h~9h, for example, 5h, 6h, 7h, 8h, 9h, etc.

[0062] This application provides an adhesive liquid comprising the modified polyacrylate described above.

[0063] Optionally, in some embodiments of this application, the adhesive further includes a photosensitive oligomer, a thermosetting agent, and a photoinitiator.

[0064] In this application, the photosensitive oligomer has photosensitive groups. When irradiated by UV light, the photosensitive groups of the photosensitive oligomer can undergo a crosslinking reaction with the modified polyacrylate, thereby increasing the crosslinking density of the network structure formed by the curing of the adhesive and thus improving the anti-tack effect of the generated UV anti-tack scribe film. At the same time, the highly reactive photosensitive groups of the modified polyacrylate can improve the crosslinking efficiency between the polyacrylate and the photosensitive oligomer, thereby increasing the crosslinking density of the network structure formed by the curing of the adhesive and thus improving the anti-tack effect of the generated UV anti-tack scribe film.

[0065] Optionally, in some embodiments of this application, the photosensitive oligomer is an aliphatic polyurethane acrylate oligomer.

[0066] Optionally, in some embodiments of this application, the photosensitive oligomer includes one or more of polyurethane-modified acrylate, polyester polyurethane-modified acrylate, polyether polyurethane-modified acrylate, and polyimide polyurethane-modified acrylate. Thus, the photosensitive oligomer contains urethane groups and multiple carbon-carbon double bond groups, which facilitates crosslinking with the modified polyacrylate, thereby increasing the crosslinking density of the network structure formed by the cured adhesive, and further enhancing the anti-tack effect of the generated UV anti-tack scribe film.

[0067] In this application, by combining polyurethane acrylate oligomers with modified polyacrylates and then curing them with UV, a fully interpenetrating network structure with high cross-linking density can be formed, thereby improving the viscosity reduction effect of the adhesive.

[0068] Optionally, in some embodiments of this application, the thermosetting agent includes one or more of epoxy curing agents, polyetheramine curing agents, and isocyanate curing agents. Thus, after UV curing, the thermosetting agent can undergo a crosslinking reaction with the hydroxyl groups of the modified polyacrylate, thereby improving the viscosity-reducing effect of the adhesive.

[0069] Optionally, in some embodiments of this application, the photoinitiator includes one or more of benzophenone, benzophenone, 1-hydroxy-1-methylethylphenyl ketone, 2,4,6-trimethylbenzoyl-ethoxy-phenylphosphine oxide, and 2-hydroxy-2-methyl-phenylacetone.

[0070] Optionally, in some embodiments of this application, an auxiliary agent is also included, which includes one or more of alkyl quaternary ammonium salts, alkyl sulfonates, conductive polymers, and ionic liquids.

[0071] In this application, by adding an additive to the adhesive solution, a low-polarity weak boundary layer can be formed at the adhesion interface between the adhesive layer and the wafer through the continuous migration of the additive. This weakens the chemical bonding or physical adsorption between the adhesive layer and the adhesion interface, reduces the adhesion strength, and avoids the growth of the adhesion force of the adhesive layer. This solves the problem of the adhesion force of the adhesive layer to the wafer increasing over time, thereby improving the adhesion force of the dicing film over time.

[0072] Understandably, the small molecular weight of the additives allows them to migrate within the adhesive layer formed by the adhesive solution. Before UV irradiation, the additives continuously migrate and accumulate at the adhesion interface between the adhesive layer and the silicon wafer, forming a low-polarity, weak boundary layer, thereby reducing the interfacial adhesion. After UV irradiation, the carbon-carbon double bonds in the adhesive layer undergo free radical polymerization, forming a three-dimensional cross-linked network structure, accompanied by adhesive layer volume shrinkage (this phenomenon originates from the fact that the distance between molecular chains is "brought closer" by covalent bonds during polymerization), further promoting the migration of additives to the interface layer, thus reducing the interfacial adhesion.

[0073] Optionally, in some embodiments of this application, the alkyl quaternary ammonium salt includes one or more of stearamidopropyl hydroxyethyl dimethyl ammonium nitrate, octadecyl dimethyl hydroxyethyl ester quaternary ammonium nitrate, lauroamide propyl trimethylammonium sulfate methyl ester, bis(octadecyl dimethyl ammonium chloride), bis(2-hydroxyethyl) dimethyl ammonium chloride, hexadecyl trimethyl ammonium chloride, tetraethyl ammonium hydroxide, and choline hydroxide.

[0074] Optionally, in some embodiments of this application, the alkyl sulfonate includes one or more of sodium dodecylbenzenesulfonate, sodium dodecyl sulfate, sodium dodecyl sulfonate, sodium p-toluenesulfonate, sodium methanesulfonate, sodium ethylsulfonate, sodium octyl sulfonate, and perfluorooctane sulfonate.

[0075] Optionally, in some embodiments of this application, the conductive polymer includes at least one of polypyrrole and polyaniline.

[0076] Optionally, in some embodiments of this application, the ionic liquid includes one or more of the following: 1-butyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium chloride, 1-(2-hydroxyethyl)-3-methylimidazolium tetrafluoroborate, N-hexylpyridine tetrafluoroborate, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-hexyl-3-methylimidazolium hexafluorophosphate, tetrabutylammonium bis(trifluoromethanesulfonate)imine, octadecyltrimethylammonium hexafluorophosphate, and 1-allyl-3-methylimidazolium bis(trifluoromethanesulfonate)imine.

[0077] Optionally, in some embodiments of this application, the mass ratio of the modified photosensitive polyacrylate, the photosensitive oligomer, and the thermosetting agent is 100:(40-50), for example, it can be 100:40, 100:42, 100:44, 100:46, 100:48, 100:50, etc.

[0078] In this application, by controlling the mass ratio of modified photosensitive polyacrylate to photosensitive oligomer, the anti-tack effect of the adhesive after UV irradiation can be improved, and the probability of adhesive residue on the chip can be reduced. When the amount of photosensitive oligomer added is too small, the adhesive layer adhesion decreases only slightly after UV irradiation, resulting in a poor anti-tack effect; when the amount of photosensitive oligomer added is too large, it will cause material waste, and the adhesive force of the adhesive before UV irradiation will be too high, which may lead to the risk of adhesive residue on the chip.

[0079] Optionally, in some embodiments of this application, the mass ratio of the modified photosensitive polyacrylate to the additive is 100:(0.15-0.4), for example, it can be 100:0.15, 100:0.2, 100:0.25, 100:0.3, 100:0.35, 100:0.4, etc.

[0080] Understandably, if too much additive is added, the adhesion between the adhesive layer and the wafer is weak before UV irradiation. During wafer dicing, mechanical vibration can cause the chip to fail to adhere firmly to the tape, leading to chip failure. If too little additive is added, the adhesion between the adhesive layer and the wafer is strong before UV irradiation. During chip picking, the chip is prone to colliding with other chips around it, resulting in edge chipping.

[0081] Optionally, in some embodiments of this application, the mass ratio of the modified photosensitive polyacrylate, the photosensitive oligomer, the thermosetting agent, the photoinitiator and the additive is 100:(40-50):(1-5):(0.4-2.5):(0.15-0.4).

[0082] Optionally, in some embodiments of this application, a solvent is also included, said solvent comprising one or more of ethyl acetate, tetrahydrofuran, toluene, acetone, chloroform, dioxane, methyl tert-butyl ether, and pinacolone.

[0083] Optionally, in some embodiments of this application, the viscosity of the adhesive is 500 cps-4000 cps, for example, 500 cps, 1000 cps, 1500 cps, 2000 cps, 2500 cps, 3000 cps, 3500 cps, 4000 cps, etc. This facilitates the application of the adhesive.

[0084] Understandably, the viscosity of the adhesive can be adjusted by changing the amount of solvent added to the adhesive.

[0085] Optionally, in some embodiments of this application, the viscosity of the adhesive is 1000cps-2500cps, for example, it can be 1000cps, 1200cps, 1500cps, 1700cps, 2000cps, 2200cps, 2500cps, etc.

[0086] This application provides an adhesive formed by curing the above-described adhesive solution.

[0087] Please see Figure 1 This application provides a UV anti-adhesion slitting film, comprising a substrate layer 3, an adhesive layer 2 and a release layer 1 stacked sequentially, wherein the adhesive layer 2 is formed by curing the aforementioned adhesive solution.

[0088] Optionally, in some embodiments of this application, the substrate is polyvinyl chloride (PVC).

[0089] Optionally, in some embodiments of this application, the release layer is polyethylene terephthalate (PET).

[0090] Optionally, in some embodiments of this application, the thickness of the adhesive layer 2 is 6µm-20µm, for example, it can be 6µm, 8µm, 10µm, 12µm, 14µm, 16µm, 18µm, 20µm, etc.

[0091] Optionally, in some embodiments of this application, the thickness of the adhesive layer 2 is 8µm-12µm, for example, it can be 8µm, 8.5µm, 9µm, 9.5µm, 10µm, 10.5µm, 11µm, 11.5µm, 12µm, etc.

[0092] Please see Figure 1 This application provides a method for preparing a UV anti-adhesion scribe film, comprising: The above-mentioned adhesive is applied to the first material layer and then dried to cure the adhesive and form the adhesive layer 2. The adhesive layer 2 is stacked with the second material layer on the side opposite to the first material layer to obtain a UV anti-adhesion dicing film; Wherein, the first material layer is one of the substrate layer 3 and the release layer 1, and the second material layer is the other of the substrate layer 3 and the release layer 1.

[0093] Optionally, in some embodiments of this application, the drying temperature is 80℃-110℃, for example, 80℃, 85℃, 90℃, 95℃, 100℃, 105℃, 110℃, etc., and the time is 1min-3min, for example, 1min, 2min, 3min, etc.

[0094] Optionally, in some embodiments of this application, after the adhesive layer 2 is stacked with the second material layer on the side opposite to the first material layer, the process further includes: curing the stacked material.

[0095] Optionally, in some embodiments of this application, the curing temperature is 50℃-70℃, for example, 50℃, 52℃, 55℃, 57℃, 60℃, 62℃, 65℃, 67℃, 70℃, etc., and the time is 24h-72h, for example, 24h, 30h, 35h, 40h, 45h, 50h, 55h, 60h, 65h, 70h, 72h, etc.

[0096] Example 1 A modified polyacrylate and its preparation method, comprising, by weight: (1) Take 100 parts of synthetic monomers (including 15 parts of isobornyl acrylate, 13 parts of methyl methacrylate, 37 parts of isooctyl acrylate, 20 parts of dodecyl acrylate, 14 parts of hydroxyethyl methacrylate and 1 part of acrylic acid), 200 parts of solvent (ethyl acetate), 0.2 parts of initiator (azobisisobutyronitrile), 35 parts of modified monomer (ethyl isocyanate), 0.7 parts of polymerization inhibitor (4-methoxyphenol) and 1.2 parts of catalyst (dibutyltin dilaurate); (2) Add 10% of the synthetic monomer and twice the mass of the solvent to the reactor under nitrogen atmosphere, heat to 72±1℃ and start stirring. Then add the remaining synthetic monomer and a mixture of one mass of the solvent and 70% of the initiator dropwise to the reactor for 4 hours. After the addition is complete, heat to 76±1℃ and react for 1.5 hours. Then heat to 82±1℃ and add the mixture of the remaining initiator and 10% of the remaining solvent dropwise for 0.5 hours. After the addition is complete, heat to 86±1℃ and react for 2 hours to obtain polyacrylate. (3) Cool the reactor to 60±1℃, add 60% of the remaining solvent and polymerization inhibitor, stir for 1h, and continue to add the mixture of remaining solvent, modified monomer and catalyst dropwise for 1.5h. After the addition is complete, continue to react for 6h. After the reaction is complete, lower the reactor temperature to room temperature and discharge the material to obtain modified polyacrylate.

[0097] A UV anti-adhesion scribe film and its preparation method, comprising: (1) Adhesive preparation: 100 parts of modified polyacrylate, 40 parts of photosensitive oligomer (aliphatic polyurethane acrylate oligomer 9500N (Sartomer, functionality: nonafunctional, weight average molecular weight: 4000Da)), 5 parts of thermosetting agent (aliphatic polyisocyanate, Wannate HT-100 (Wanhua Chemical)), 0.4 parts of photoinitiator (2,4,6-trimethylbenzoyl-ethoxy-phenylphosphine oxide), and 0.15 parts of additive (isopropanol solution of 1-butyl-3-methylimidazolium tetrafluoroborate, 5%wt) were added to a container and stirred evenly. After standing to defoam, the adhesive solution was obtained. (2) Coating: The adhesive is evenly coated onto a 40μm thick release film using a coating machine, then placed in an oven at 95±1℃ for 2 minutes, then transferred onto an 80μm thick substrate film, and then placed in an oven at 50±1℃ for 72 hours to form a 10μm thick adhesive layer, thus obtaining a UV anti-tack scribbling film.

[0098] Example 2 This embodiment is basically the same as Embodiment 1, except that the monomers synthesized in this embodiment include 15 parts butyl acrylate, 15 parts methyl methacrylate, 39 parts isooctyl acrylate, 20 parts dodecyl acrylate, 10 parts hydroxyethyl acrylate and 1 part methacrylic acid. The modified monomer is replaced with isocyanate ethyl methacrylate. The amount of photosensitive oligomer is 50 parts, the amount of thermosetting agent is 1 part, the amount of photoinitiator is 2.5 parts, and the amount of auxiliary agent is 0.4 parts.

[0099] Example 3 This embodiment is basically the same as Example 1, except that the monomers synthesized in this embodiment include 15 parts methyl acrylate, 5 parts acrylamide, 40 parts isooctyl acrylate, 14 parts hexadecyl acrylate, 25 parts hydroxypropyl acrylate and 1 part acrylic acid, the solvent is replaced with 180 parts tetrahydrofuran, the modified monomer is replaced with isocyanate methacrylate, the initiator is replaced with dimethyl azobisisobutyrate, the amount of photosensitive oligomer is 45 parts, the amount of thermosetting agent is 3 parts, the amount of photoinitiator is 1.5 parts, and the amount of additive is 0.3 parts.

[0100] Example 4 This embodiment is basically the same as Embodiment 1, except that the amount of the adjuvant used in this embodiment is 0.4 parts.

[0101] Example 5 This embodiment is basically the same as Embodiment 1, except that the amount of the adjuvant in this embodiment is 0.5 parts.

[0102] Example 6 This embodiment is basically the same as Embodiment 1, except that the amount of the adjuvant used in this embodiment is 0.05 parts.

[0103] Example 7 This embodiment is basically the same as Embodiment 1, except that no additives are added in this embodiment.

[0104] Example 8 This embodiment is basically the same as Embodiment 1, except that no photosensitive oligomer is added in this embodiment.

[0105] Example 9 This embodiment is basically the same as Embodiment 1, except that the additive added in this embodiment is an isopropanol solution of sodium dodecylbenzenesulfonate (5%wt).

[0106] Example 10 This embodiment is basically the same as Embodiment 1, except that the modified monomer in this embodiment is 35 parts of 1,1-di(acryloyloxy)ethyl isocyanate.

[0107] Comparative Example 1 This embodiment is basically the same as Embodiment 1, except that no modified monomer was used in this comparative example.

[0108] Test example: The performance of the UV anti-adhesion scribbling film obtained in the examples and comparative examples was tested, and the test results are shown in Table 1.

[0109] Peel strength test: Test standard: GB / T 2792-2014; Sample size: 25mm×300mm; Multiple sets of data were tested. The values ​​after ± in the peel strength data in Table 1 represent the standard deviation of the data fluctuation.

[0110] Duration test: Test standard: GB / T 2792-2014; Sample size: 25mm×300mm; The sample was tested after standing for 10 days. Multiple sets of data were tested. The values ​​after ± in the duration data in Table 1 represent the standard deviation of the data fluctuation.

[0111] Pull-out force test: Chip size: 10×10mm, chip thickness: 500μm.

[0112] UV curing rate test: The integral area of ​​the carbon-carbon double bond infrared peak of the adhesive layer before and after UV is detected by infrared detection. UV curing rate = (before UV - after UV) / before UV × 100%.

[0113] Cleavage test: Cut 5 wafers and observe the surface defects and chipping dimensions of all chips under a microscope. A chipping diameter of <15μm on the front, <50μm on the back, and <1 / 3 of the chip thickness on the side is considered acceptable. Wafer: 12 inch, 50μm; Chip size: 12×12mm.

[0114] Pick-up test: Cut 5 wafers. If all chips can be successfully picked up without chipping or core collision, it is qualified. Wafer: 12 inches, 50 μm; Chip size: 12 × 12 mm.

[0115] Residual glue test: Use a microscope to observe whether there is residual glue on the chips after pick-up.

[0116] Table 1

[0117] As can be seen from Table 1: Compared with Example 1 and Examples 4 - 7, after the UV release dicing film of Example 7 is irradiated by UV, the peeling force between it and the silicon wafer is the largest, the peeling force between it and the silicon wafer after standing for 10 days is the largest, the pulling force is the largest, and there are problems of core collision, edge chipping and chipping. The reason is that no additive is added to the glue solution of Example 7, and the adhesive layer formed after the glue solution is irradiated by UV has the largest adhesion to the wafer, resulting in easy collision with other chips around it when picking up the chips. At the same time, too large adhesion is likely to cause problems such as edge chipping and even chipping. Before the UV release dicing film of Example 5 is irradiated by UV, the peeling force between it and the silicon wafer is the smallest, the peeling force between it and the silicon wafer after standing for 10 days is the smallest, the pulling force is the smallest, and there is a problem of core flying. The reason is that the additive addition amount in the glue solution of Example 5 is the largest, and the adhesion between the glue solution and the wafer before being irradiated by UV is the smallest. When cutting the wafer, due to mechanical vibration, the adhesion between the chip and the tape is small, so the problem of core flying is likely to occur. Example 6 has a problem of core collision. The reason is that the additive addition amount in the glue solution of Example 6 is the smallest, and the adhesive layer formed after the glue solution is irradiated by UV has a large adhesion to the wafer, resulting in easy collision with other chips around it when picking up the chips.

[0118] Compared with Example 1 and Example 8, after the UV release dicing film of Example 8 is irradiated by UV, the peeling force between it and the silicon wafer is larger, the peeling force between it and the silicon wafer after standing for 10 days is larger, the pulling force is larger, and there are problems of residual glue, edge chipping, core collision and chipping. The reason is that no photosensitive oligomer is added to the glue solution of Example 8, and the adhesive layer formed after the glue solution is irradiated by UV has a large adhesion to the wafer, resulting in easy collision with other chips around it when picking up the chips. At the same time, too large adhesion is likely to cause problems of residual glue and edge chipping and even chipping.

[0119] Compared with Example 1 and Example 9, after the UV release dicing film of Example 1 is irradiated by UV, the peeling force between it and the silicon wafer is smaller, the peeling force between it and the silicon wafer after standing for 10 days is smaller, and the pulling force is smaller. The reason is that the migration abilities of different additives are different, which makes the time-dependent property of the UV release dicing different.

[0120] Compared with Examples 1, 2 and 10, the UV anti-tack scribe film of Example 10 exhibits lower peel force with the silicon wafer after UV irradiation, lower peel force with the silicon wafer after standing for 10 days, and lower pull force. This is because the modified monomer 1,1-di(acryloyloxy)ethyl isocyanate of Example 10 contains more acrylate groups, which in turn makes the UV anti-tack scribe film more effective in reducing adhesion.

[0121] Compared with Comparative Example 1, the UV anti-adhesion dicing film of Comparative Example 1 exhibited the greatest peel force with the silicon wafer after UV irradiation, the greatest peel force after standing for 10 days, the greatest pull force, and the lowest curing rate. It also showed problems such as residual adhesive, edge chipping, chip collision, and breakage. The reason for this is that the polyacrylate in the adhesive solution of Comparative Example 1 was not modified, and the curing rate of the adhesive solution was the lowest after UV irradiation. The resulting adhesive layer had the greatest adhesion to the wafer, which made it easy for the chip to collide with other chips around it during chip pickup. At the same time, the excessive adhesion force easily led to problems such as residual adhesive, edge chipping, and even breakage.

[0122] Figure 2 This is a chip image obtained from a pick-up test of the UV anti-adhesion scribe film provided in Embodiment 1 of this application. Figure 3 This is a chip image obtained from a pick-up test of the UV anti-adhesion scribe film provided in Comparative Example 1 of this application. From Figure 2 and Figure 3 It can be seen that the chips obtained by the UV anti-adhesion scribe film provided in Example 1 of this application are intact during the pick-up test, while the chips obtained by the UV anti-adhesion scribe film of Comparative Example 1 have problems such as chip collision and edge chipping during the pick-up test.

[0123] In summary, this application modifies polyacrylate, introduces acrylate groups, and adds photosensitive oligomers and additives to the adhesive solution, so that the UV anti-adhesion dicing film can rapidly and significantly reduce the adhesion of the film to silicon wafers after UV irradiation. The adhesion exhibits good long-term performance and can be used for dicing ultra-thin wafers (50μm) and picking up large-size chips (12×12mm).

[0124] The above provides a detailed description of a modified polyacrylate and its preparation method, adhesive, and UV tack-reducing scribe film provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A modified polyacrylate, characterized in that, The modified polyacrylate has the following structural formula: In this group, R1, R2, and R3 are each independently any one of -H, alkyl, aryl, ether, and cyano groups; R4 is an alkyl group; R5 is an organic group containing an acrylate group with 2 to 26 carbon atoms; and R6, R7, R8, R9, and R... 10 Each of them is either -H or methyl, X is O or N, and a, b, c, d, and e are all integers greater than 0.

2. The modified polyacrylate according to claim 1, characterized in that, The e is 0.6 to 2.0 times the d; and / or R1, R2, and R3 each independently contain 0 to 22 carbon atoms; and / or R4 contains 1 to 3 carbon atoms; and / or R5 contains 5 to 15 carbon atoms; and / or The modified polyacrylate has a weight-average molecular weight of 500,000 to 1,000,000.

3. The modified polyacrylate according to claim 1, characterized in that, R5 is , where R 11 For -H or methyl, R 12 Including one or more of methyl, ethyl, acrylate, and ether groups, and R 12 The total number of carbon atoms is less than or equal to 13. For connecting points.

4. The modified polyacrylate according to claim 3, characterized in that, R5 is ethyl acrylate, ethyl methacrylate, 1,1-di(acryloyloxymethyl)ethyl ester, 1,1-di(acryloyloxy)ethyl ester, or ethyl acrylate. , or ,in, For connecting points.

5. The modified polyacrylate according to claim 1, characterized in that, The monomers used in the synthesis of the polyacrylate include hard monomers, soft monomers, and functional monomers. The hard monomers include one or more of the following: methyl acrylate, benzyl acrylate, isobornyl acrylate, acrylonitrile, acrylamide, 4-acryloylmorpholine, methyl methacrylate, ethyl methacrylate, butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, benzyl methacrylate, isobornyl methacrylate, cyclohexyl methacrylate, tetrahydrofuran methacrylate, and vinyl acetate; and / or The soft monomer includes one or more of ethyl acrylate, butyl acrylate, isobutyl acrylate, tert-butyl acrylate, isooctyl acrylate, dodecyl acrylate, tridecyl acrylate, tetradecyl acrylate, hexadecyl acrylate, octadecyl acrylate, and n-octyl methacrylate; and / or The functional monomers include one or more of acrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate, methacrylic acid, hydroxyethyl methacrylate, hydroxypropyl methacrylate, and glycidyl methacrylate; and / or The functional monomer has a mass percentage content of 10% to 25% in the synthetic monomer.

6. A method for preparing a modified polyacrylate, characterized in that, include: The polyacrylate, the modified monomer, and the initiator are mixed in a first solvent and a grafting reaction is carried out to obtain the modified polyacrylate as described in any one of claims 1-5. The modified monomer includes isocyanate and acrylate groups, and the polyacrylate includes hydroxyl groups.

7. The method for preparing modified polyacrylate according to claim 6, characterized in that, The modified monomers include one or more of the following: ethyl isocyanate, ethyl isocyanate methacrylate, 1,1-di(acryloyloxymethyl)ethyl isocyanate, 1,1-di(acryloyloxy)ethyl isocyanate, 2-(2-isocyanate ethoxy)ethyl acrylate, 2-(2-isocyanate ethoxy)ethyl 2-methylpropenyl acrylate, and [2-isocyanate-3-propenyl-2-enoxy-2-(propenyl-2-enoxymethylpropyl)propenyl acrylate; and / or The first solvent includes one or more of tetrahydrofuran, ethyl acetate, and toluene; and / or The grafting reaction also involves the addition of a polymerization inhibitor, which includes one or more of the following: 4-methoxyphenol, hydroquinone, 2,2,6,6-tetramethylpiperidine oxide, 4-hydroxy-2,2,6,6-tetramethylpiperidineoxy, 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxy, 1,4-benzoquinone, tetramethylbenzoquinone, 2,6-dinitro-p-cresol, 2,6-dinitro-4-methylphenol, n-hexadecyl 3,5-di-tert-butyl-4-hydroxybenzoate, and tris(1,2,2,6,6-pentamethylpiperidinol) phosphite; and / or The grafting reaction also includes a catalyst, which comprises one or more of the following: dibutyltin dilaurate, stannous octoate, bismuth neodecanoate, bismuth laurate, bismuth isooctanoate, triethylenediamine, dimethylcyclohexylamine, 1-butyl-3-methylimidazolium tetrafluoroborate, and tetrabutylammonium bromide.

8. The method for preparing modified polyacrylate according to claim 7, characterized in that, The mass ratio of the polyacrylate to the modified monomer is 100:(20~60); and / or The mass ratio of the polyacrylate, the polymerization inhibitor, and the catalyst is 100:(0.3~1.2):(1.0~1.5).

9. The method for preparing modified polyacrylate according to claim 6, characterized in that, The grafting reaction temperature is 50℃~70℃, and the grafting reaction time is 5h~9h.

10. An adhesive liquid, characterized in that, This includes the modified polyacrylate as described in any one of claims 1-5, or the modified polyacrylate prepared by the method described in any one of claims 6-9.

11. The adhesive according to claim 10, characterized in that, It also includes photosensitive oligomers, which are aliphatic polyurethane acrylate oligomers.

12. The adhesive according to claim 11, characterized in that, The photosensitive oligomer includes one or more of polyurethane-modified acrylate, polyester polyurethane-modified acrylate, polyether polyurethane-modified acrylate, and polyimide polyurethane-modified acrylate; and / or The mass ratio of the modified photosensitive polyacrylate to the photosensitive oligomer is 100:(40-50).

13. The adhesive according to claim 10, characterized in that, It also includes additives, which include one or more of alkyl quaternary ammonium salts, alkyl sulfonates, conductive polymers, and ionic liquids.

14. The adhesive according to claim 13, characterized in that, The alkyl quaternary ammonium salt comprises one or more of stearamidopropyl hydroxyethyl dimethyl ammonium nitrate, octadecyl dimethyl hydroxyethyl ester quaternary ammonium nitrate, lauroamide propyl trimethylammonium sulfate methyl ester, bis(octadecyl dimethyl ammonium chloride), bis(2-hydroxyethyl) dimethyl ammonium chloride, hexadecyl trimethyl ammonium chloride, tetraethyl ammonium hydroxide, and choline hydroxide; and / or The alkyl sulfonate comprises one or more of sodium dodecylbenzenesulfonate, sodium dodecyl sulfate, sodium dodecyl sulfonate, sodium p-toluenesulfonate, sodium methanesulfonate, sodium ethylsulfonate, sodium octyl sulfonate, and perfluorooctane sulfonate; and / or The conductive polymer includes at least one of polypyrrole and polyaniline; and / or The ionic liquid comprises one or more of the following: 1-butyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium chloride, 1-(2-hydroxyethyl)-3-methylimidazolium tetrafluoroborate, N-hexylpyridine tetrafluoroborate, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-hexyl-3-methylimidazolium hexafluorophosphate, tetrabutylammonium bis(trifluoromethanesulfonate)imide, octadecyltrimethylammonium hexafluorophosphate, and 1-allyl-3-methylimidazolium bis(trifluoromethanesulfonate)imide; and / or The mass ratio of the modified photosensitive polyacrylate to the additive is 100:(0.15-0.4).

15. The adhesive according to claim 10, characterized in that, It also includes thermosetting agents and photoinitiators; The thermosetting agent includes one or more of epoxy curing agents, polyetheramine curing agents, and isocyanate curing agents; and / or The photoinitiator includes one or more of benzophenone, benzophenone, 1-hydroxy-1-methylethylphenyl ketone, 2,4,6-trimethylbenzoyl-ethoxy-phosphine oxide, and 2-hydroxy-2-methyl-phenylacetone; and / or The mass ratio of the modified photosensitive polyacrylate, the thermosetting agent, and the photoinitiator is 100:(1-5):(0.4-2.5).

16. An adhesive, characterized in that, It is formed by curing the adhesive as described in any one of claims 10-15.

17. A UV anti-adhesion slitting film, characterized in that, It includes a substrate layer, an adhesive layer and a release layer stacked sequentially, wherein the adhesive layer is formed by curing the adhesive liquid according to any one of claims 10-15.

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