A jig for surface evaporation of aluminum nitride ceramic plate

Abstract

The application discloses a jig for surface evaporation of an aluminum nitride ceramic plate. The jig for surface evaporation of the aluminum nitride ceramic plate comprises a support base plate, wherein the support base plate is a ceramic plate, a rectangular evaporation operation hollow hole is arranged in the center of the ceramic plate, a limiting boss made of ceramic is fixed to the outer edge of the upper side of the ceramic plate, the limiting boss is used for limiting the outer edge of an evaporation product, and the inner side of the ceramic plate located on the limiting boss is a support surface for supporting the evaporation product. The metal frame jig is replaced by the jig, the high-temperature environment and process medium corrosion in the evaporation process can be tolerated, the generation of an oxidation layer is avoided from the root, the problem of product pollution caused by the falling of the oxidation layer of the metal jig is solved, and the surface cleanliness and coating quality of the evaporation product are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to DCB substrates. Background Technology

[0002] Before fabricating the aluminum nitride copper-clad substrate, both the upper and lower surfaces of the aluminum nitride ceramic plate undergo a vapor deposition process to form copper-containing metal oxides on their surfaces. Currently, a metal frame fixture is used in the vapor deposition process. During use, the object to be vapor-deposited is placed inside the metal frame fixture, the lower surface is vapor-deposited, and then the upper surface is vapor-deposited (see...). Figure 1 However, this type of vapor deposition fixture has the following problems:

[0003] 1) When metal fixtures are used in high-temperature environments for a long time, an oxide layer is easily formed on the surface. This oxide layer is prone to peeling off, and the peeled oxide impurities will directly adhere to the upper surface of the product to be vapor-deposited. When vapor-depositing is performed on the upper surface, problems such as product contamination and coating defects will occur, which will seriously reduce the yield of vapor-deposited products.

[0004] 2) The continuous formation of the oxide layer and the deformation of the fixture after long-term use will lead to a decrease in the surface precision of the fixture, affecting the accuracy of product positioning and further aggravating product quality problems. Summary of the Invention

[0005] To address the problems existing in the prior art, the present invention provides a fixture for vapor deposition on the surface of aluminum nitride ceramic plates, which solves at least one of the above-mentioned technical problems.

[0006] The technical solution of the present invention is: a fixture for vapor deposition on the surface of aluminum nitride ceramic plate, comprising a support substrate, characterized in that the support substrate is a ceramic plate, and a rectangular vapor deposition operation hollow hole is formed in the center of the ceramic plate;

[0007] A ceramic limiting boss is fixed to the upper outer edge of the ceramic plate. The limiting boss is used to limit the outer edge of the product to be vapor-deposited, and the ceramic plate is located inside the limiting boss as a support surface for supporting the product to be vapor-deposited.

[0008] This invention replaces metal frame fixtures, can withstand the high-temperature environment and process medium corrosion in the vapor deposition process, avoids the formation of oxide layers from the root, completely solves the problem of oxide layer falling off metal fixtures and contaminating products, and effectively improves the surface cleanliness and coating quality of vapor-deposited products.

[0009] More preferably, the thickness of the ceramic plate is 1 mm.

[0010] More preferably, two limiting bosses are installed on the long side of the ceramic plate, and one limiting boss is installed on the short side of the ceramic plate.

[0011] More preferably, the limiting boss located on the short side of the ceramic plate is centrally positioned;

[0012] Two limiting bosses are symmetrically arranged on the long side of the ceramic plate, and the distance between the two limiting bosses is 100mm.

[0013] More preferably, the limiting boss is a cuboid protrusion;

[0014] The length direction of the limiting boss is parallel to the length direction of the adjacent side of the ceramic plate.

[0015] This ensures the effectiveness of the limiting mechanism.

[0016] More preferably, the length of the limiting boss is 10mm and the width is 4mm.

[0017] More preferably, the limiting boss is fixed to the surface of the ceramic plate with organic adhesive.

[0018] More preferably, the ceramic plate has a length of 200mm and a width of 148mm;

[0019] The length of the perforated hole for the vapor deposition operation is 187 mm and the width is 135 mm.

[0020] More preferably, the ceramic plate is rectangular, and the evaporation operation perforation is rectangular.

[0021] More preferably, the ceramic plate is a 96% Al2O3 ceramic plate material.

[0022] Beneficial effects:

[0023] This invention replaces metal frame fixtures, solving the problem of oxide layer shedding and contaminating products from metal fixtures. It can improve the product vapor deposition yield by more than 5%. Attached Figure Description

[0024] Figure 1 A schematic diagram of a structure for the background technology;

[0025] Figure 2 This is a schematic diagram of one structure of the present invention.

[0026] In the diagram: 1 is a ceramic plate, and 2 is a limiting boss. Detailed Implementation

[0027] See Figure 2Specific embodiment 1: A fixture for vapor deposition on the surface of aluminum nitride ceramic plates includes a supporting substrate, which is a ceramic plate 1. A rectangular vapor deposition operation perforation is formed in the center of the ceramic plate 1. A ceramic limiting boss 2 is fixed to the upper outer edge of the ceramic plate 1. The limiting boss 2 is used to limit the outer edge of the product to be vapor-deposited, with the ceramic plate 1 located inside the limiting boss 2 as the supporting surface for supporting the product to be vapor-deposited. This invention replaces metal frame fixtures, can withstand the high-temperature environment and process medium corrosion in the vapor deposition process, fundamentally avoids the formation of oxide layers, completely solves the problem of oxide layer shedding and contaminating products from metal fixtures, and effectively improves the surface cleanliness and coating quality of vapor-deposited products.

[0028] The thickness of ceramic plate 1 is 1 mm.

[0029] Two limiting bosses 2 are installed on the long side of the ceramic plate 1, and one limiting boss 2 is installed on the short side of the ceramic plate 1. The limiting boss 2 on the short side of the ceramic plate 1 is centrally located; the two limiting bosses 2 on the long side of the ceramic plate 1 are symmetrically arranged, and the interval g between the two limiting bosses 2 is 100mm.

[0030] The limiting boss 2 is a cuboid protrusion; its length direction is parallel to the length direction of the adjacent side of the ceramic plate 1. This ensures a good limiting effect. The outer edge of the limiting boss 2 is flush with the outer edge of the ceramic plate 1. This facilitates positioning and fixation.

[0031] The length f of the limiting boss 2 is 10mm, and the width e of the limiting boss 2 is 4mm.

[0032] The surface of ceramic plate 1 is fixed with limiting bosses 2 by organic adhesive.

[0033] The length a of ceramic plate 1 is 200mm, and the width b of ceramic plate 1 is 148mm; the length c of the evaporation operation cutout hole is 187mm, and the width d of the evaporation operation cutout hole is 135mm.

[0034] Ceramic plate 1 is rectangular, and the perforations for the vapor deposition process are also rectangular. Ceramic plate 1 is made of 96% Al2O3 ceramic material. The limiting boss is also made of 96% Al2O3 ceramic material.

[0035] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A fixture for vapor deposition on the surface of an aluminum nitride ceramic plate, comprising a supporting substrate, characterized in that, The supporting substrate is a ceramic plate, and a rectangular evaporation operation hollow hole is opened in the center of the ceramic plate. A ceramic limiting boss is fixed to the upper outer edge of the ceramic plate. The limiting boss is used to limit the outer edge of the product to be vapor-deposited, and the ceramic plate is located inside the limiting boss as a support surface for supporting the product to be vapor-deposited.

2. The fixture for vapor deposition on the surface of aluminum nitride ceramic plates according to claim 1, characterized in that: The ceramic plate has a thickness of 1 mm.

3. The fixture for vapor deposition on the surface of aluminum nitride ceramic plates according to claim 1, characterized in that: Two limiting bosses are installed on the long side of the ceramic plate, and one limiting boss is installed on the short side of the ceramic plate.

4. A fixture for vapor deposition on the surface of aluminum nitride ceramic plates according to claim 1, characterized in that: The limiting boss located on the short side of the ceramic plate is centrally positioned; Two limiting bosses are symmetrically arranged on the long side of the ceramic plate, and the distance between the two limiting bosses is 100mm.

5. A fixture for vapor deposition on the surface of aluminum nitride ceramic plates according to claim 1, characterized in that: The limiting boss is a rectangular parallelepiped protrusion; The length direction of the limiting boss is parallel to the length direction of the adjacent side of the ceramic plate.

6. A fixture for vapor deposition on the surface of aluminum nitride ceramic plates according to claim 1, characterized in that: The length of the limiting boss is 10mm and the width is 4mm.

7. A fixture for vapor deposition on the surface of aluminum nitride ceramic plates according to claim 1, characterized in that: The limiting boss is fixed to the surface of the ceramic plate with organic adhesive.

8. A fixture for vapor deposition on the surface of aluminum nitride ceramic plates according to claim 1, characterized in that: The ceramic plate is 200mm long and 148mm wide; The length of the perforated hole for the vapor deposition operation is 187 mm and the width is 135 mm.

9. A fixture for vapor deposition on the surface of aluminum nitride ceramic plates according to claim 1, characterized in that: The ceramic plate is rectangular, and the perforation holes for the vapor deposition operation are rectangular.

10. A fixture for vapor deposition on the surface of aluminum nitride ceramic plates according to claim 1, characterized in that: The ceramic plate is made of 96% Al2O3 ceramic plate material.

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