A hot melt adhesive production and glue equipment oriented energy consumption analysis and intelligent scheduling system

Abstract

The application belongs to the technical field of industrial automation and intelligent manufacturing control, and discloses an energy consumption analysis and intelligent scheduling system for hot melt adhesive production and adhesive equipment, which collects production side glue outlet flow, adhesive side glue inlet flow, temperature data and electric parameter data, identifies preheating, steady-state glue supply, standby heating and other operation events and forms an event sequence; determines glue supply delay and glue supply buffer based on double-end flow sequence; integrates electric energy and glue supply according to event segmentation, constructs event type corresponding unit glue supply baseline energy consumption parameter and obtains deviation information; calculates residence time and heat exposure cumulative value according to temperature threshold value determined by glue supply buffer and process parameter table; generates a collaborative scheduling plan containing heating set temperature, glue supply output set value and standby heating target temperature interval in a rolling time window, and issues control instructions, and corrects subsequent plan according to feedback data.

Description

Technical Field

[0001] This invention belongs to the field of industrial automation and intelligent manufacturing control technology, specifically an energy consumption analysis and intelligent scheduling system for hot melt adhesive production and adhesive-using equipment. Background Technology

[0002] Hot melt adhesives are widely used in continuous production scenarios such as packaging sealing, woodworking lamination, automotive interior assembly, and non-woven product lamination due to their fast curing, high bonding strength, and wide range of compatible materials. In the production process, hot melt adhesive production equipment usually melts and heats the adhesive material and then delivers it to the adhesive application equipment through the adhesive pump and heating pipeline to complete the spraying or coating. In order to maintain the adhesive material in a stable and flowable state, the adhesive supply system needs to maintain a certain heating and heat preservation condition during the preheating, continuous adhesive supply, and intermittent standby stages. The power consumption is relatively concentrated, and temperature fluctuations will affect the consistency of adhesive application and the stability of the cycle.

[0003] Existing hot melt adhesive supply systems mostly use programmable logic controllers (PLCs) or host computers to control heating temperature, supply pressure, and dispensing flow rate. They also acquire operating data through temperature sensors, pressure sensors, flow acquisition devices, and power metering devices to achieve status monitoring, alarms, and parameter recording. In some production lines, the supply system also interacts with the manufacturing execution system or production scheduling system to set preheating time, standby heat preservation temperature range, and start-stop strategies according to planned output, in order to adapt to the production needs of multiple product switching and cycle time changes.

[0004] Because there is a molten adhesive conveying channel with effective volume between hot melt adhesive production equipment and adhesive-using equipment, the adhesive supply process has a buffering effect and there is a time lag in the transmission of adhesive supply changes from the production side to the adhesive-using side. Existing technologies often focus on shifts or total equipment volume in energy consumption statistics and control optimization, making it difficult to form a consistent segmentation standard for operation stages such as preheating, steady-state adhesive supply, standby heat preservation, adhesive replacement, and maintenance. Furthermore, it is difficult to establish a stable energy consumption benchmark per unit adhesive supply by combining dual-end flow and power data. As a result, there is a lack of executable collaborative scheduling basis between adhesive supply on the production side and consumption on the adhesive-using side, making it difficult to balance energy consumption optimization and process stability. Summary of the Invention

[0005] The purpose of this invention is to provide an energy consumption analysis and intelligent scheduling system for hot melt adhesive production and adhesive-using equipment, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: To realize energy consumption analysis and collaborative scheduling control of hot melt adhesive production and application processes, the present invention provides an energy consumption analysis and intelligent scheduling system for hot melt adhesive production and application equipment. The system includes a data acquisition interface, an operation event identification unit, an adhesive supply coupling calculation unit, an energy consumption baseline construction unit, a thermal history evaluation unit, a collaborative scheduling generation unit, and an instruction issuance and feedback correction unit.

[0007] The data acquisition interface establishes a communication connection with the hot melt adhesive production equipment and the adhesive-using equipment to acquire operational data of the adhesive supply process. The operational data includes at least electrical parameter data, temperature data, pressure data, flow rate data, and equipment status data to provide data basis for subsequent calculations. The operation event identification unit identifies changes in the operation stage based on the operational data and generates an event sequence containing event types and event start and end times, enabling continuous operation to be analyzed by event segments. The adhesive supply coupling calculation unit calculates the adhesive supply buffer amount and adhesive supply delay based on the operational data. The adhesive supply buffer amount is used to characterize the amount of adhesive material in the molten and consumable state in the adhesive supply path, and the adhesive supply delay is used to characterize the time lag in the transmission of changes in adhesive supply from the production side to the adhesive-using side, thereby providing a constraint basis for collaborative scheduling.

[0008] The energy consumption baseline construction unit segments energy consumption based on the event sequence and combines the segmented glue supply amount in the operation data to form a unit glue supply baseline energy consumption parameter corresponding to the event type. At the same time, it outputs the deviation information of the actual energy consumption per unit glue supply relative to the baseline energy consumption parameter to achieve comparable analysis of energy consumption levels under different operation events. The thermal history assessment unit calculates the thermal history index of the glue material based on the glue supply buffer amount, glue supply delay and temperature data. The thermal history index includes residence time and cumulative heat exposure value, which are used to characterize the degree of residence and high temperature exposure of the glue material in the molten state, thereby introducing a control boundary related to the thermal state of the glue material for the scheduling process.

[0009] The collaborative scheduling generation unit generates a collaborative scheduling plan for the production side and the glue-using side using a rolling time window. It comprehensively determines the production batch arrangement, event start and end times, and set of set values. The set of set values ​​includes at least the heating set temperature, glue supply output set value, and standby heat preservation target temperature range. The glue supply buffer amount and thermal history indicators are introduced as scheduling constraints. The instruction issuance and feedback correction unit is used to convert the collaborative scheduling plan into control instructions and issue them for execution. During the execution process, the deviation information and thermal history indicators are updated based on the updated and collected operating data. When the deviation or thermal history indicators exceed the preset control boundary, the subsequent collaborative scheduling plan is corrected to form a closed-loop scheduling mechanism.

[0010] By adopting the above technical solution, under the condition that there is a buffer and time delay between glue supply on the production side and consumption on the glue consumption side, it is possible to realize segmented assessment of energy consumption for different operating events. While ensuring the continuity of glue supply, the constraints of glue material residence and heat exposure are incorporated into the scheduling process, thereby reducing ineffective heat preservation and unnecessary temperature rise and fall energy consumption, and reducing the risks caused by glue material staying at high temperatures for a long time.

[0011] In one embodiment, the system collects operational data including the flow rate at the glue outlet on the production side, the flow rate at the glue inlet on the glue-using side, temperature data, and electrical parameter data. The flow rate at the glue outlet on the production side is obtained by a flow acquisition device installed at the glue outlet of the hot melt adhesive production equipment, and the flow rate at the glue inlet on the glue-using side is obtained by a flow acquisition device installed at the glue inlet of the glue-using equipment. For glue-using equipment that uses a metering chamber for glue supply, the flow rate at the glue inlet on the glue-using side can also be calculated based on the amount of glue discharged by the metering chamber during the sampling period, so as to be aligned and analyzed with other operational data on the same time reference. By collecting the flow rate at the glue outlet on the production side and the flow rate at the glue inlet on the user side, we can provide input for calculating the glue supply coupling relationship. This provides a quantifiable data basis for the time lag between changes in glue supply output on the production side and the actual consumption response on the user side, as well as for changes in glue supply inventory. At the same time, by combining electrical parameter data and event segmentation results, we can obtain the glue supply amount in each event segment from the flow rate data, and further use it to establish the analysis basis for energy consumption per unit of glue supply, thereby supporting the adjustment and correction of setpoints in subsequent collaborative scheduling.

[0012] In one embodiment, the upper limit of the glue supply buffer capacity is determined by the effective volume of the glue supply path, which is the molten glue conveying channel between the glue outlet of the hot melt glue production equipment and the glue inlet of the glue-using equipment, and the effective volume is the volume in the glue supply path that can be occupied by the molten glue material. During system operation, the glue supply buffer is used to characterize the amount of glue material in a molten and consumable state within the glue supply path. To obtain the real-time changes in this amount, the system calculates based on the cumulative glue output from the production side and the cumulative glue input from the glue consumption side. The cumulative glue output from the production side and the cumulative glue input from the glue consumption side are obtained by accumulating the corresponding flow data over time. At the same time, the cumulative amounts on both sides are aligned according to a unified time reference, taking into account the glue supply delay. Thus, the glue supply buffer is determined by the difference between the cumulative glue output from the production side and the cumulative glue input from the glue consumption side. To ensure that the calculation results meet the physical capacity boundary of the glue supply path, the glue supply buffer is limited to the range of 0 to the upper limit of the capacity.

[0013] By establishing a correspondence between the glue supply buffer and the effective volume of the glue supply path, the collaborative scheduling can obtain clear capacity boundary conditions when generating glue supply output settings and event start and end arrangements. It can also reflect changes in the glue material inventory in the glue supply path when glue output changes on the production side or consumption changes on the user side, providing a basis for subsequent scheduling corrections.

[0014] In one embodiment, the operation event identification unit is used to divide the continuous operation process of the hot melt adhesive production equipment and the adhesive application equipment into an event sequence. The event sequence includes a preheating event, a steady-state adhesive supply event, a standby heat preservation event, an adhesive replacement event, and a maintenance event, and determines the corresponding start and end times for each event.

[0015] The operation event identification unit first determines the switching of operation stages based on the equipment's start / stop status, and confirms the event boundaries by combining temperature data, pressure data, and flow data. Specifically, when the equipment switches from a stopped state to an operating state, and the rate of change of the heating unit temperature exceeds a preset temperature rise threshold, a preheating event is determined. When the flow rate at the glue inlet on the glue-using side is within the target flow rate range and the flow rate fluctuation does not exceed a preset fluctuation threshold within the continuous sampling period, and the glue supply pressure fluctuation does not exceed a preset pressure fluctuation threshold, a steady-state glue supply event is determined. When the glue-using equipment is in a stopped state and the heating unit remains on, and the glue inlet flow rate is lower than a preset low flow rate threshold, a standby heat preservation event is determined. When the glue inlet flow rate is lower than a preset glue replacement flow rate threshold and the rate of change of the glue supply pressure exceeds a preset rate of change threshold, a glue replacement event is determined. When the equipment status indicates that maintenance mode is enabled, a maintenance event is determined.

[0016] The event sequence and its start and end times obtained by the above method can be used as the time boundary for energy consumption segmentation, segmented glue supply statistics, and calculation of glue material thermal history indicators, so that subsequent analysis and scheduling processes can establish corresponding relationships at the event granularity and execute constraint control.

[0017] In one embodiment, the energy consumption baseline construction unit is used to establish baseline energy consumption parameters per unit glue supply, so that energy consumption analysis under different operating events has a unified comparison caliber. The baseline energy consumption parameters per unit glue supply are determined by the ratio of segmented power consumption to segmented glue supply, wherein the segment time is limited by the start and end times of the events corresponding to the event sequence, the segmented power consumption is obtained by time integration of the active power calculated based on the electrical parameter data within the segment time, and the segmented glue supply is obtained by time integration of the flow rate data within the segment time.

[0018] By calculating the corresponding power consumption and glue supply within the same time interval, a direct correlation can be established between energy consumption and glue supply load, avoiding the incomparability of total energy consumption caused by fluctuations in glue supply. At the same time, the baseline energy consumption parameter per unit glue supply can serve as the basic input for subsequent deviation information calculation, enabling the system to determine the event segment where the energy consumption per unit glue supply deviates from the baseline at the event granularity, and providing a basis for adjusting the heating set temperature, glue supply output set value, and standby heat preservation target temperature range in collaborative scheduling.

[0019] In one embodiment, the glue supply delay is used to characterize the time lag between the glue supply change at the glue outlet on the production side and the response at the glue inlet on the glue-using side. To obtain the glue supply delay, the system calculates it based on the flow sequence at the glue outlet on the production side and the flow sequence at the glue inlet on the glue-using side. During the calculation, the flow sequences on both sides are first processed to make the sampling period consistent according to a unified time reference, so that the flow data on both sides are time-aligned under the same sampling period. Then, the flow sequences on both sides are cross-correlated within a preset time offset range, and the time offset corresponding to when the cross-correlation calculation result reaches the maximum value is determined as the glue supply delay.

[0020] By introducing a glue supply delay and using cross-correlation calculations to determine the time offset, a time alignment basis can be established for the flow data of the production side and the glue-using side under the condition that there are conveying channels and buffer reserves in the glue supply path. This supports the calculation of the difference in glue supply buffer volume and provides a time reference for the corresponding glue supply volume in event segments and the adjustment of the start and end times of events in collaborative scheduling.

[0021] In one embodiment, the thermal history assessment unit is used to quantify and statistically analyze the thermal state of the adhesive material within the adhesive supply path and form thermal history indicators. The thermal history indicators include residence time and cumulative heat exposure value. Residence time is used to characterize the cumulative duration during which the adhesive material is in a molten and flowable state when there is molten adhesive material available for consumption within the adhesive supply path. The cumulative heat exposure value is used to characterize the cumulative duration during which the temperature of the adhesive material is not lower than a preset temperature threshold when there is molten adhesive material available for consumption within the adhesive supply path. To standardize the statistical criteria, residence time is accumulated under the condition that the adhesive supply buffer is greater than 0 and the adhesive material temperature is not lower than the molten and flowable determination temperature. The cumulative heat exposure value is accumulated under the condition that the adhesive supply buffer is greater than 0 and the adhesive material temperature is not lower than the preset temperature threshold.

[0022] The melt flowability determination temperature and the preset temperature threshold are determined by the process parameter table corresponding to the type of adhesive material. The process parameter table is used to provide the temperature determination benchmark for different adhesive materials. Based on the statistical results of residence time and cumulative heat exposure, the collaborative scheduling generation unit can introduce constraints related to the thermal state of the adhesive material when generating the set of set values ​​such as the start and end times of the event and the heating set temperature, and use the thermal history index as the correction basis in the subsequent scheduling correction.

[0023] In one embodiment, the collaborative scheduling generation unit outputs a set of settings, which includes a heating set temperature, a glue supply output set value, and a standby heat preservation target temperature range. The glue supply output set value is used to adjust the parameters of the actuator corresponding to the glue supply output. The glue supply output set value includes one or more of the following: glue pump speed set value, metering valve opening set value, and glue supply pressure set value, so that the set value can be adapted to different glue supply structures and glue application equipment operating conditions.

[0024] To correct operational deviations during the steady-state glue supply phase, the system continuously monitors deviation information during the steady-state glue supply period. This deviation information characterizes the degree of deviation between the actual energy consumption per unit glue supply and the baseline energy consumption parameter per unit glue supply. When the deviation information exceeds a preset deviation threshold for N consecutive sampling periods, the instruction issuance and feedback correction unit recalculates the glue supply output setpoint and the heating setpoint, and generates corresponding control instructions for execution, where N is a positive integer. Through the above settings, energy consumption deviations within the steady-state glue supply event can trigger dynamic correction of the setpoint, ensuring that the glue supply output adjustment and energy consumption deviation changes remain consistent, providing a basis for subsequent adjustments to the collaborative scheduling plan.

[0025] The beneficial effects of this invention are as follows: 1. This invention identifies operational events in the glue supply process data to form an event sequence containing event types and start and end times. Based on the event sequence, energy consumption is statistically segmented. The electrical parameter data is integrated over the segmented time period to obtain the segmented energy consumption, and the flow rate data is integrated over the segmented time period to obtain the segmented glue supply amount. Furthermore, baseline energy consumption parameters per unit glue supply amount corresponding to the event type are constructed and deviation information is output. This establishes a one-to-one correspondence between energy consumption and glue supply amount in different stages such as preheating, steady-state glue supply, and standby heat preservation, avoiding the dilution of preheating and standby energy consumption by steady-state glue supply. It also facilitates the formation of a baseline parameter library by event type, improving the consistency of energy consumption diagnosis. This provides a reliable comparison benchmark for subsequent deviation judgment, set value set recalculation, and closed-loop correction.

[0026] 2. This invention uses a glue supply coupling calculation unit to jointly analyze the flow rate at the glue outlet on the production side and the flow rate at the glue inlet on the user side. Based on time alignment within the same sampling period, the time offset between the two is determined as the glue supply delay, and the upper limit of the glue supply buffer capacity is determined by combining the effective volume of the glue supply path. After the glue supply delay is corrected, the glue supply buffer capacity is calculated based on the difference between the cumulative glue output on the production side and the cumulative glue inlet on the user side, thereby achieving a quantitative representation of the glue material inventory within the glue supply path. At the same time, the glue supply delay is updated smoothly, and the update is paused during glue replacement events, maintenance events, or data loss to avoid the impact of estimated value jumps on calculation stability. Thus, under operating conditions with buffers and time delays, it provides a consistent time alignment basis and glue supply continuity constraints for energy consumption baseline construction, thermal history assessment, and collaborative scheduling.

[0027] 3. This invention generates a collaborative scheduling plan between the production side and the adhesive-using side within a rolling time window, and uses the adhesive supply buffer amount and the adhesive material thermal history index as scheduling constraints. The adhesive material thermal history index includes residence time and cumulative heat exposure value, which are obtained based on the cumulative data of adhesive supply buffer amount, adhesive supply delay and temperature. The melt flowability judgment temperature and preset temperature threshold are determined by the process parameter table corresponding to the adhesive material type. The collaborative scheduling plan provides a set of set values ​​such as heating set temperature, adhesive supply output set value and standby heat preservation target temperature range. The instruction issuance and feedback correction unit triggers recalculation and issuance when the deviation information exceeds the deviation threshold for N consecutive sampling cycles within the steady-state adhesive supply event. This reduces ineffective heat preservation energy consumption and heating and cooling losses while meeting the adhesive demand, and reduces process deviations caused by high-temperature residence of adhesive materials. Attached Figure Description

[0028] Figure 1 This is a flowchart of the data acquisition and event recognition process of this invention; Figure 2 This is a flowchart of the energy consumption baseline construction and thermal history assessment process of this invention; Figure 3 This is a flowchart of the collaborative scheduling and feedback correction process of the present invention. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] like Figures 1 to 3 As shown, this embodiment of the invention provides an energy consumption analysis and intelligent scheduling system for hot melt adhesive production and adhesive-using equipment. The system includes a data acquisition interface, an operation event identification unit, an adhesive supply coupling calculation unit, an energy consumption baseline construction unit, a thermal history assessment unit, a collaborative scheduling generation unit, and an instruction issuance and feedback correction unit. Each unit operates collaboratively on a unified control platform to perform energy consumption analysis on the adhesive supply process on the production side and the adhesive consumption process on the adhesive-using side, and generate scheduling control instructions accordingly.

[0031] During system operation, the data acquisition interface establishes a communication connection with the hot melt adhesive production equipment and adhesive-using equipment, and acquires the operating data of the adhesive supply process according to the preset sampling period. The operating data includes electrical parameter data, temperature data, pressure data, flow data, and equipment status data. Among them, electrical parameter data is used to characterize the power supply load, temperature data is used to characterize the heating and heat preservation status, pressure data and flow data are used to characterize the adhesive supply output and adhesive consumption process, and equipment status data is used to characterize the operating status such as start-up, standby, and maintenance.

[0032] The operation event identification unit divides the operation phases based on equipment status data and determines event boundaries by combining the changing characteristics of temperature, pressure, and flow data, thereby generating an event sequence. The event sequence includes the event type and the corresponding start and end times, providing a time range for subsequent segmented energy consumption statistics and segmented glue supply statistics. For example, when the equipment switches from shutdown to operation and the temperature rise rate exceeds the preset temperature rise threshold, this phase can be identified as a preheating event; when the flow rate at the glue inlet on the glue-using side is within the target flow range and the fluctuation amplitude does not exceed the preset fluctuation threshold within the continuous sampling period, and the pressure fluctuation amplitude does not exceed the preset pressure fluctuation threshold, this phase can be identified as a steady-state glue supply event; when the glue-using equipment is in a shutdown state but heating is kept on, and the flow rate at the glue inlet is lower than the preset low flow threshold, this phase can be identified as a standby heat preservation event; when the flow rate at the glue inlet is lower than the preset glue replacement flow threshold and the pressure change rate exceeds the preset change rate threshold, this phase can be identified as a glue replacement event; when the equipment status indicates that maintenance mode is enabled, this phase can be identified as a maintenance event.

[0033] The glue supply coupling calculation unit establishes the coupling relationship between the production side and the glue-consuming side based on flow data, and calculates the glue supply buffer and glue supply delay. The glue supply delay is used to characterize the time lag between the glue supply change at the glue outlet end of the production side and the response at the glue inlet end of the glue-consuming side. The glue supply delay can be obtained by cross-correlation calculation of the flow sequence at the glue outlet end of the production side and the flow sequence at the glue inlet end of the glue-consuming side. Specifically, the sampling period of the flow sequences on both sides is first made consistent and aligned according to a unified time reference. Then, the cross-correlation function is calculated within a preset time offset range, and the time offset corresponding to the maximum value of the cross-correlation function is taken as the glue supply delay. The glue supply buffer is used to characterize the amount of glue material in the glue supply path that is in a molten and consumable state. Its calculation is based on the difference between the cumulative glue output on the production side and the cumulative glue inlet on the glue-consuming side, and is combined with the glue supply delay for time alignment. At the same time, the glue supply buffer is constrained by the upper limit of the effective volume of the glue supply path to ensure that the calculation result meets the physical capacity boundary of the glue supply path.

[0034] The energy consumption baseline construction unit performs segmented energy consumption statistics based on the event sequence and generates baseline energy consumption parameters per unit glue supply corresponding to the event type. Within each event segment, the segmented power consumption is obtained based on electrical parameter data, which can be obtained by integrating the active power over the segment time. The segmented glue supply is obtained based on flow rate data, which can be obtained by integrating the flow rate over the segment time. The baseline energy consumption parameter per unit glue supply is determined by the ratio of segmented power consumption to segmented glue supply, and deviation information is generated accordingly. This deviation information characterizes the degree of deviation between the actual energy consumption per unit glue supply and the baseline energy consumption parameter per unit glue supply, thereby enabling comparable energy consumption analysis between different event segments.

[0035] The thermal history assessment unit calculates thermal history indicators by combining glue supply buffer amount, glue supply delay, and temperature data. Thermal history indicators include residence time and cumulative heat exposure. Residence time characterizes the cumulative duration during which the glue supply buffer amount is greater than 0 and the glue temperature is not lower than the melt flowability determination temperature. Cumulative heat exposure characterizes the cumulative duration during which the glue supply buffer amount is greater than 0 and the glue temperature is not lower than a preset temperature threshold. The melt flowability determination temperature and the preset temperature threshold are determined by the process parameter table corresponding to the glue type to ensure that a consistent temperature determination benchmark is used for different glues during scheduling and calibration.

[0036] The collaborative scheduling generation unit generates a collaborative scheduling plan between the production side and the glue-using side using a rolling time window. The collaborative scheduling plan includes at least the production batch arrangement, event start and end times, and a set of set values. The set of set values ​​includes the heating set temperature, glue supply output set value, and standby heat preservation target temperature range. The glue supply output set value includes one or more of the following: glue pump speed set value, metering valve opening set value, and glue supply pressure set value. When generating the collaborative scheduling plan, the glue supply buffer amount, glue supply delay, and thermal history indicators are introduced as constraints so that the scheduling result can meet the glue supply continuity on the glue-using side while controlling the glue material inventory and heat exposure level within the glue supply path to be within the preset range.

[0037] The instruction issuance and feedback correction unit converts the collaborative scheduling plan into control instructions and issues them to the hot melt adhesive production equipment and adhesive-using equipment for execution. During execution, the system updates the deviation information and thermal history indicators in real time based on the updated and collected operating data. When the deviation information in a steady-state adhesive supply event exceeds the preset deviation threshold within N consecutive sampling periods, it triggers the recalculation and issuance of the adhesive supply output setpoint and heating setpoint, where N is a positive integer. Through the above closed-loop correction method, the scheduling plan can be corrected according to changes in the operating state, thereby maintaining the consistency between the energy consumption analysis results and the scheduling control parameters.

[0038] In this embodiment, the system generates operational data of the glue supply process through a data acquisition interface. This operational data is used for subsequent operational event division, glue supply coupling relationship calculation, and energy consumption statistical analysis. The operational data includes at least the glue outlet flow rate on the production side, the glue inlet flow rate on the glue user side, temperature data, and electrical parameter data. The glue outlet flow rate on the production side and the glue inlet flow rate on the glue user side are used to reflect the changes in glue supply output and glue user response. The temperature data is used to reflect the heating and heat preservation status of the glue material in the glue supply path. The electrical parameter data is used to reflect the changes in electrical load related to glue supply.

[0039] The data acquisition interface establishes a communication connection with the hot melt adhesive production equipment and adhesive-using equipment, and records the timestamp information of each data item with a unified time base, so that the operating data from different sources can be aligned on the same time axis. The data acquisition interface can acquire the status and measurement of the equipment side through fieldbus communication or industrial Ethernet communication, and can also acquire the analog or digital signals of the sensors through the acquisition channel, thereby aggregating the key operating quantities of the production side, adhesive-using side and heating unit into operating data in the form of continuous time series. In order to avoid the difficulty of correlation caused by inconsistent sampling periods of different data sources, the system uses a unified sampling period for recording each data source. When the original sampling period of individual data sources is inconsistent with the unified sampling period, it can be aligned according to the timestamp, and missing sampling points can be supplemented by maintaining or interpolating, while retaining the data source identifier and acquisition status identifier.

[0040] Obtaining the flow rate at the production side dispensing end The flow rate at the production side outlet is obtained by a flow acquisition device installed at the outlet of the hot melt adhesive production equipment. The flow acquisition device is arranged on the molten adhesive output channel on the production side and is used to measure the volumetric flow rate or mass flow rate of the adhesive material passing through the outlet per unit time. For scenarios where the output is volumetric flow rate, the output value of the flow acquisition device is directly used as the flow rate at the production side outlet. For scenarios where the output is mass flow rate, the system converts the mass flow rate into volumetric flow rate based on the adhesive density parameter and maintains the same unit diameter as the flow rate at the adhesive inlet on the adhesive side. The adhesive density parameter can be obtained from adhesive parameter data or determined by calibration data on the production side under preset temperature conditions to ensure traceability of the conversion diameter.

[0041] Obtaining the flow rate at the glue inlet end using the glue side The flow rate at the glue inlet end of the glue-using equipment is obtained by a flow acquisition device installed at the glue inlet end of the glue-using equipment. The flow acquisition device is arranged at the glue inlet of the glue-using equipment and is used to measure the flow rate of the glue entering the glue-using equipment. Since the glue-using equipment may have intermittent glue supply or pulse glue supply process in actual operation, the direct acquisition of the flow rate at the glue inlet end can record the actual response change on the glue-using side and provide input basis for subsequent glue supply coupling analysis.

[0042] Flow conversion in metering chamber glue supply scenario When the glue-using equipment uses a metering chamber for glue supply and it is inconvenient to install a flow acquisition device at the glue inlet end, the flow rate at the glue inlet end on the glue-using side can be calculated from the glue discharge volume of the metering chamber within the sampling period. Specifically, the data acquisition interface collects the glue discharge action signal of the metering chamber and combines it with the single glue discharge volume parameter of the metering chamber to obtain the cumulative glue discharge volume within the sampling period. Then, the cumulative glue discharge volume is divided by the sampling period duration to obtain the corresponding flow rate at the glue inlet end. The single glue discharge volume parameter can be determined by the relationship between the metering chamber structural parameters and the displacement feedback of the actuator, or by the glue discharge calibration result of the metering chamber. When using this conversion method, the system simultaneously records the glue discharge status and action number information of the metering chamber to ensure that the converted flow rate data is consistent with the actual glue discharge process.

[0043] Acquisition methods for temperature and electrical parameters Temperature data includes at least the temperature of the production-side heating unit, and may further include the temperature of the molten adhesive storage chamber, the temperature of the heating pipeline, and the temperature at the adhesive supply inlet on the adhesive-using side, to reflect the thermal state changes of the adhesive material in the adhesive supply path; electrical parameter data is acquired by an energy metering device, which at least covers the power circuits corresponding to the production-side heating unit and the adhesive supply drive unit, and outputs power data or cumulative energy data for subsequent energy consumption statistical analysis. To ensure that energy consumption and adhesive supply can correspond within the same time boundary, temperature data, electrical parameter data, and flow rate data are all recorded according to a unified time reference, and status markings are performed when communication interruption, sampling loss, or data mutation exceeds a reasonable range, so that abnormal data can be removed or downweighted in the subsequent calculation process.

[0044] Through the above-mentioned data generation method, the system can simultaneously obtain flow data directly related to the glue supply behavior at both the glue outlet on the production side and the glue inlet on the user side. It also provides an implementable flow conversion caliber in the glue supply scenario of the metering chamber, so that the coupling relationship between the glue supply output on the production side and the response on the user side has a quantifiable data basis. Based on the time alignment results of the flow data and temperature and electrical parameter data, the system can further calculate the glue supply delay and the glue supply buffer, and provide basic input for subsequent energy consumption statistics and collaborative scheduling.

[0045] In this embodiment, the glue supply coupling calculation unit is used to calculate the glue supply buffer amount. The glue supply buffer amount is used to characterize the amount of glue material in the glue supply path that is in a molten and consumable state, and participates in the subsequent set value calculation as a constraint in the coordinated scheduling. In order to make the glue supply buffer amount have a clear physical boundary, this embodiment sets the upper limit of the glue supply buffer amount to correspond to the effective volume of the glue supply path, and introduces a glue supply delay to time-align the data on the production side and the glue-using side when calculating the glue supply buffer amount. Both the glue supply buffer amount and the effective volume are measured by volume, and the unit can be cubic centimeters or milliliters.

[0046] Determining the glue supply path and effective volume The glue supply path is the molten glue conveying channel between the glue outlet end of the hot melt glue production equipment and the glue inlet end of the glue-using equipment. The glue supply path includes a molten glue output pipeline, a heating hose or heating pipeline, a filter assembly, and a transition joint connected to the glue inlet end of the glue-using equipment. The effective volume is the volume inside the glue supply path that can be occupied by molten glue material, which is used to characterize the maximum molten glue material storage boundary that the glue supply path can accommodate.

[0047] The effective volume can be determined in the following ways: Structural parameter calculation method: For pipe sections with a defined inner diameter and length, the corresponding volume is calculated based on the inner diameter and length and then summed; for irregular cavity parts such as filter components, valve body cavities, and distribution manifolds, equivalent volume parameters are used. The equivalent volume parameters can be derived from the equipment structural drawings or the nominal volume data provided by the manufacturer. Calibration measurement method: Calibration is performed when the glue supply path is in a repeatable and known state, such as after the glue supply path is emptied and the heating temperature is stable. The effective volume is obtained by injecting molten glue into the glue supply path and measuring the injection amount. The injection amount can be obtained based on the metering output of the hot melt adhesive production equipment, or by obtaining the difference in weighing and converting it into volume using the glue density parameter. After calibration, the effective volume is stored as a parameter for subsequent calculations. The upper limit of the glue supply buffer capacity is taken as the volume value corresponding to the effective volume, which is used to physically constrain the calculation results of the glue supply buffer capacity.

[0048] The calculation of glue supply buffer amount is aligned with the glue supply delay. To reflect the dynamic changes in the amount of adhesive material in the adhesive supply path, this implementation method uses the difference between the cumulative adhesive output on the production side and the cumulative adhesive input on the adhesive-using side to calculate the adhesive supply buffer. The cumulative adhesive output on the production side is obtained by accumulating the flow rate at the adhesive output end of the production side according to the sampling period, and the cumulative adhesive input on the adhesive-using side is obtained by accumulating the flow rate at the adhesive input end of the adhesive-using side according to the sampling period.

[0049] Considering the delivery lag between the glue dispensing end on the production side and the glue inlet end on the glue-using side, this implementation introduces a glue supply delay to align the flow sequences on both sides before calculating the difference. Specifically, under a unified sampling period, the flow sequence at the glue inlet end on the glue-using side is shifted according to the time offset corresponding to the glue supply delay before participating in the cumulative calculation. This ensures that the cumulative glue dispensing amount on the production side corresponds to the aligned cumulative glue inlet amount on the glue-using side under the same time reference. If the glue supply delay is not an integer multiple of the sampling period, an alignment sequence can be generated by interpolation on the shifted flow sequence on the glue-using side to ensure that the alignment process is feasible.

[0050] When the units of measurement for the flow rate at the production side outlet and the flow rate at the glue inlet side are inconsistent, the system first unifies them to volumetric flow rate before performing cumulative calculations. If a mass flow rate unit exists, it is converted to volumetric flow rate based on the glue density parameter before being included in the cumulative calculation. The glue density parameter is taken from the glue parameter data or calibration data to ensure consistent conversion.

[0051] Boundary constraints and data anomaly handling After the glue supply buffer is calculated, range constraint processing is performed in each sampling period to meet the physical capacity boundary of the glue supply path: when the glue supply buffer is less than 0, the glue supply buffer is set to 0; when the glue supply buffer is greater than the capacity limit, the glue supply buffer is set to the capacity limit. Through range constraint processing, negative or overcapacity storage caused by flow measurement noise, short-term data loss or cumulative error is avoided. When there is a data interruption or missing sampling point, the system marks the missing sampling point and uses either a hold-in process or fills it in according to a preset rule in the cumulative calculation. When the duration of the missing data exceeds a preset threshold, the glue supply buffer enters a frozen update state until the data is restored and the update resumes according to the sampling cycle, in order to avoid the glue supply buffer drift caused by abnormal data.

[0052] Connection with subsequent scheduling By establishing a boundary correspondence between the glue supply buffer amount and the effective volume of the glue supply path, and introducing the glue supply delay in the difference calculation for time alignment, the glue supply buffer amount can be used as a state quantity of the glue material inventory in the glue supply path to participate in the collaborative scheduling generation. When generating production batch arrangements and glue supply output settings, the glue supply buffer amount can be kept within the range of 0 to the upper limit of capacity as a constraint condition, so that the scheduling result is consistent with the actual capacity of the glue supply path, and at the same time, it provides a state input that can be used as a basis for the correction of subsequent control commands.

[0053] In this embodiment, the operation event identification unit is used to divide the continuous operation process of hot melt adhesive production equipment and adhesive-using equipment into event sequences, which can serve as the time boundary for subsequent energy consumption segmentation statistics, segmented adhesive supply statistics, and collaborative scheduling timing generation. The event sequence includes preheating events, steady-state adhesive supply events, standby heat preservation events, adhesive replacement events, and maintenance events, with each event corresponding to the start and end times of the event.

[0054] The operation event identification unit makes judgments based on operation data, which includes at least equipment start / stop status, temperature data, pressure data, and flow data. The flow data includes at least the flow rate at the glue outlet on the production side and the flow rate at the glue inlet on the glue-using side. To improve the stability of event boundaries, the operation event identification unit smooths the temperature data, pressure data, and flow data, and calculates the temperature change rate, pressure change rate, and flow fluctuation amplitude under a unified sampling period. The change rate is obtained by dividing the difference between adjacent sampling periods by the sampling period duration. The equipment start / stop status is obtained from the operation status bit or switch signal output by the equipment control system and is used to mark the time point of operation status switching.

[0055] The event identification unit adopts a state machine-based decision-making method, outputting only one event type within any sampling period. A continuous sampling period confirmation mechanism suppresses repeated event switching caused by short-term fluctuations. When the entry condition of a candidate event is met for P consecutive sampling periods, the event switch is confirmed and the event start time is recorded. When the exit condition of the current event is met for P consecutive sampling periods, the event end time is recorded and the system switches to the next event type, where P is a positive integer determined by equipment configuration parameters or process parameter tables. To avoid ambiguity caused by multiple conditions being met simultaneously, event judgment is prioritized: maintenance events take precedence over adhesive replacement events, adhesive replacement events take precedence over preheating events and steady-state adhesive supply events, and standby heat preservation events take precedence over steady-state adhesive supply events.

[0056] The preheating event is used to characterize the heating phase of the glue supply system from a shutdown or low temperature state to a glue-supplying state. The start time of the preheating event meets the following conditions: the hot melt glue production equipment switches from a shutdown state to an operating state, and the temperature of the production side heating unit shows an upward trend within P consecutive sampling periods, and the temperature change rate exceeds the temperature rise threshold. At the same time, the flow rate at the glue inlet on the glue-using side is lower than the low flow rate threshold. The end time of the preheating event meets the following conditions: the temperature of the production side heating unit enters the target temperature range and the temperature change rate does not exceed the stability threshold, and the flow rate at the glue inlet on the glue-using side reaches or exceeds the start-up threshold or the equipment status indicates that it has entered the glue supply output state.

[0057] Steady-state glue supply events are used to characterize a relatively stable stage in glue supply output and glue consumption. The start time of a steady-state glue supply event meets the following conditions: the flow rate at the glue inlet on the glue-consuming side is within the target glue supply flow rate range, and the flow rate fluctuation amplitude does not exceed the flow rate fluctuation threshold within P consecutive sampling periods, while the glue supply pressure fluctuation amplitude does not exceed the pressure fluctuation threshold. The end time of a steady-state glue supply event meets one of the following conditions: the flow rate at the glue inlet on the glue-consuming side is lower than the low flow rate threshold for P consecutive sampling periods, or the glue supply pressure change rate exceeds the pressure change rate threshold for P consecutive sampling periods, or the start-up and shutdown states of the hot melt adhesive production equipment are switched.

[0058] The standby heat preservation event is used to characterize the stage where there is no consumption of glue on the glue-using side while the production side maintains heating and heat preservation. The start time of the standby heat preservation event meets the following conditions: the glue-using side does not trigger glue-using action or the metering chamber does not discharge glue, and the flow rate at the glue inlet end of the glue-using side is lower than the low flow rate threshold for P consecutive sampling cycles. At the same time, the temperature of the heating unit on the production side is within the standby heat preservation target temperature range. The end time of the standby heat preservation event meets the following conditions: the flow rate at the glue inlet end of the glue-using side reaches the start threshold for P consecutive sampling cycles, or the equipment status switches from standby state to running glue supply state.

[0059] The glue replacement event is used to characterize the glue supply disturbance stage caused by glue material replacement, purging, or switching during the glue supply process. The start time of the glue replacement event meets one of the following conditions: the equipment status data indicates that the glue replacement or purging process has been entered; or the flow rate at the glue inlet on the glue-using side is lower than the glue replacement flow rate threshold for P consecutive sampling periods and the glue supply pressure change rate exceeds the pressure change rate threshold for P consecutive sampling periods. The end time of the glue replacement event meets the following conditions: the equipment status data indicates that the glue replacement process has ended, and the flow rate at the glue inlet on the glue-using side has recovered to the target glue supply flow rate range and the flow rate fluctuation amplitude does not exceed the flow rate fluctuation threshold for P consecutive sampling periods.

[0060] Maintenance events are used to characterize the stage when equipment is under maintenance, upkeep, or requires manual intervention. The start time of a maintenance event meets the following conditions: equipment status data indicates that the maintenance mode is enabled or a critical safety status signal triggers the maintenance condition. The end time of a maintenance event meets the following conditions: equipment status data indicates that the maintenance mode is disabled and the equipment has returned to normal operation.

[0061] The target temperature range, standby heat preservation target temperature range, target glue supply flow range, start-up threshold, low flow threshold, temperature rise threshold, stability threshold, flow fluctuation threshold, pressure fluctuation threshold, and pressure change rate threshold mentioned above are given by the equipment configuration parameters or process parameter table. The process parameter table can be established based on the glue type and equipment model and stored in the system, so that the event identification criteria have traceable parameter sources. The event sequence output by the running event identification unit includes the event type and the start and end times of the event. It serves as the time boundary for the energy consumption baseline construction unit to perform energy consumption segmentation and segment glue supply statistics, and as the timing basis for the collaborative scheduling generation unit to generate production batch arrangements and set value sets.

[0062] In this embodiment, the energy consumption baseline construction unit is used to establish the baseline energy consumption parameter of unit glue supply, so as to perform segmented statistics on energy consumption under different operating events, and provide a basis for subsequent deviation information calculation and collaborative scheduling correction. The baseline energy consumption parameter of unit glue supply is used to characterize the power consumption level corresponding to the unit glue supply, and is maintained according to the event type.

[0063] The energy consumption baseline construction unit segments the event sequence output by the operation event identification unit. The event sequence includes the event type and the start and end times of the event. The energy consumption baseline construction unit defines the segment time interval by the start and end times of the event, dividing the continuous operation process into several event segments. Each event segment corresponds to a unique event type. When performing segmented statistics, the electrical parameter data and flow data within the corresponding time interval are first extracted according to the start and end times of the event, and the statistical calculation is completed under a unified sampling period. When the start and end times of the event fall between adjacent sampling points, the segment boundary can be determined by the nearest sampling point, or the power value and flow value at the boundary point can be obtained by linear interpolation to ensure that the segmented integration process is feasible and consistent in scope.

[0064] Segmented power consumption is used to characterize the power consumption of the glue supply process within a segment of the event. The power parameter data is collected by the power metering device, which at least covers the power circuits corresponding to the heating unit and glue supply drive unit of the hot melt glue production equipment, and outputs active power data or cumulative power data.

[0065] When active power data is collected, the energy consumption baseline construction unit integrates the active power over time within the segmented time interval to obtain the segmented energy consumption. Under the condition of a uniform sampling period, a discrete accumulation method can be used, that is, the active power value of each sampling period is multiplied by the sampling period duration and accumulated within the segmented time interval.

[0066] When the cumulative energy data is collected, the segmented energy consumption is obtained by the difference between the cumulative energy at the end of the segment and the cumulative energy at the beginning of the segment. The unit of measurement for segmented energy consumption is uniformly kilowatt-hours to be consistent with the output of commonly used energy metering devices.

[0067] Segmented glue supply is used to characterize the actual glue supply within a segmented time period of an event. In order to match the glue supply statistics with the actual consumption on the glue-using side, in this embodiment, the segmented glue supply is statistically calculated using the glue-inlet flow rate on the glue-using side. The segmented glue supply is obtained by integrating the glue-inlet flow rate on the glue-using side over the segmented time interval. Under the condition of a unified sampling period, the segmented glue supply is also implemented by discrete accumulation, that is, the flow rate value of each sampling period is multiplied by the sampling period duration and then accumulated. The unit of measurement for segmented glue supply is uniformly set to milliliters or cubic centimeters, and a fixed unit diameter is set in the system configuration. When the flow rate at the glue inlet is in mass caliber, the energy consumption baseline construction unit is converted to volume caliber based on the glue density parameter before accumulation. The glue density parameter is taken from the glue parameter data or calibration data to ensure that the segmented glue supply and segmented power consumption have a consistent dimensional basis when calculating the energy consumption per unit glue supply.

[0068] The baseline energy consumption parameter for unit glue supply is determined by the ratio of segmented power consumption to segmented glue supply, which is used to characterize the energy consumption level corresponding to each unit glue supply within the event segment. To avoid abnormal amplification of the ratio due to excessively small segmented glue supply, this implementation sets validity conditions for segmented glue supply: when the segmented glue supply is less than the preset minimum glue supply threshold, the event segment does not participate in the update of the baseline energy consumption parameter for unit glue supply, but is only retained as an operation record; when the segmented glue supply meets the validity conditions, the energy consumption value of unit glue supply corresponding to the event segment is calculated and stored in association with the event type. The preset minimum glue supply threshold is determined by the equipment configuration parameters or process parameter table.

[0069] In this embodiment, the energy consumption baseline construction unit maintains the unit glue supply baseline energy consumption parameters according to the event type. For steady-state glue supply events, the baseline energy consumption parameters are obtained by statistically analyzing the unit glue supply energy consumption values ​​of the most recent effective steady-state glue supply segments. The statistical method can be a moving average or median. The number of effective segments is determined by the equipment configuration parameters and is used to suppress the impact of occasional fluctuations on the baseline. For preheating events, standby heat preservation events, glue replacement events, and maintenance events, the system configuration can be selected to participate in baseline updates or deviation assessments to ensure that the statistical caliber of different operating events is consistent with the subsequent control strategy.

[0070] After obtaining the baseline energy consumption parameters of the unit glue supply corresponding to the event type, the energy consumption baseline construction unit generates deviation information based on the degree of deviation between the actual energy consumption of the unit glue supply in the event segment and the baseline energy consumption parameters of the unit glue supply. The deviation information is then output in a corresponding relationship with the event type, the start and end time of the event, the segmented glue supply, and the segmented power consumption. The collaborative scheduling generation unit corrects the set value set according to the deviation information within the rolling time window, so that the scheduling correction has a clear segmented statistical basis.

[0071] In this embodiment, the glue supply coupling calculation unit is used to determine the glue supply delay. The glue supply delay is used to characterize the time lag in the transmission of glue supply changes from the glue outlet end on the production side to the glue inlet end on the glue-using side, and serves as the time alignment basis in the subsequent glue supply buffer calculation. The glue supply delay is determined by the time offset between the flow rate sequence at the glue outlet end on the production side and the flow rate sequence at the glue inlet end on the glue-using side. The time offset is the offset value that maximizes the cross-correlation value between the two sequences.

[0072] Simultaneous sampling period alignment and preprocessing of flow sequences The flow rate sequence at the glue outlet on the production side and the flow rate sequence at the glue inlet on the glue-using side may have inconsistent sampling periods or timestamp jitter. In order to ensure that the cross-correlation calculation can be directly implemented, the glue supply coupling calculation unit uses the unified sampling period set by the data acquisition interface as the target sampling period and resamples the flow rate sequences on both sides to the same equally spaced sequence according to the timestamp.

[0073] In a feasible default approach: when the original sampling interval is greater than the target sampling period, linear interpolation is used to fill in the intermediate sampling points; when the original sampling interval is less than the target sampling period, sampling is performed at equal intervals according to the target sampling period, and the original samples within the sampling interval are averaged to obtain the corresponding sampling point value. If there are short-term missing sampling points, they are filled in by keeping the previous valid value, and the filled points are marked as missing so as to determine whether the estimation within the time window is reliable in the future.

[0074] To reduce the impact of long-term bias on cross-correlation, the glue-coupled calculation unit performs mean-reduction processing on the flow sequences on both sides after alignment. That is, the average flow value within the cross-correlation calculation window is subtracted from each of the two sequences, so that the cross-correlation calculation focuses more on the flow change pattern rather than the difference in absolute base value. If further stability needs to be improved, the mean-reduction sequence can be normalized according to the standard deviation within the window to ensure that the cross-correlation values ​​under different operating conditions are comparable.

[0075] Cross-correlation calculation window and search range constraints The estimation of glue supply delay should be prioritized within a time period where glue supply is continuous and flow rate variation characteristics are clear. The glue supply coupling calculation unit combines the event sequence output by the operation event identification unit and selects a rolling time window for cross-correlation calculation within the steady-state glue supply event. For time periods such as standby heat preservation events, maintenance events, or glue replacement events where the flow rate is close to zero or fluctuates irregularly, the glue supply delay is not updated and the previous valid estimate is used.

[0076] The length of the rolling time window can be set to the length of several sampling periods and is updated forward in fixed steps. The window length and step size are determined by the device configuration parameters to achieve a balance between stability and response speed.

[0077] The time offset range of the cross-correlation search is set to 0, maximum delay 0, maximum delay 0, and maximum delay. The maximum delay is used to limit the upper bound of the feasible transmission lag. The maximum delay can be estimated based on the effective volume of the glue supply path and the minimum stable glue supply flow rate of the glue supply process. This ensures that the search range covers the actual lag while avoiding mismatches caused by a large-scale search, thereby ensuring that the glue supply delay conforms to the physical transmission boundary of the glue supply path.

[0078] Rules and symbol conventions for determining glue supply delay Within the selected rolling time window, the glue supply coupling calculation unit calculates the cross-correlation value for each candidate time offset. The calculation of the cross-correlation value can be achieved by using discrete cross-correlation, that is, multiplying the production side flow sequence with the glue supply side flow sequence shifted according to the candidate offset point by point within the window and accumulating them to obtain the correlation degree corresponding to the candidate offset. The time offset corresponding to the maximum cross-correlation value is taken as the glue supply delay.

[0079] To avoid symbolic ambiguity, this implementation method stipulates that the glue supply delay is a non-negative value, which represents the time lag between the change in flow rate at the glue outlet on the production side and the change in flow rate at the glue inlet on the user side. After the glue supply delay is determined, in the calculation of the glue supply buffer, the flow rate sequence at the glue inlet on the user side is shifted according to the glue supply delay so that the flow rates on both sides form a corresponding relationship under the same time reference, and then the cumulative difference is calculated.

[0080] When the cross-correlation values ​​corresponding to multiple candidate offsets are numerically close and all reach their maximum, in order to conform to the physical meaning of minimum transmission lag, the offset with the smallest value is preferentially selected as the glue supply delay. To avoid unreliable estimation when the flow rate changes are not significant, the maximum cross-correlation value and the normalized maximum cross-correlation value can be used as the confidence index, and a preset confidence threshold is set. When the confidence index is lower than the threshold, the glue supply coupling calculation unit does not update the glue supply delay and uses the previous valid estimate.

[0081] Smooth updates and handling of abnormal operating conditions for glue supply delay The glue supply delay may change slowly with temperature, flow rate, and pipeline condition. To avoid frequent jumps in the estimation results due to noise, this implementation adopts a smooth update strategy for the glue supply delay: when a new glue supply delay estimate meets the confidence condition, it is weighted and fused with the previous valid glue supply delay to obtain an updated value; when there is missing data, the flow rate at the glue inlet end on the glue-using side is continuously lower than the low flow rate threshold, or the current event type is a glue replacement event or maintenance event, the glue supply delay enters a frozen state until it recovers to a steady-state glue supply event and meets the confidence condition before being updated.

[0082] Using the above method, the glue supply delay can be obtained without adding additional hardware dependencies by utilizing the dual-end flow sequence of the glue outlet on the production side and the glue inlet on the user side, and form a collaborative reference relationship with the event sequence, providing a consistent time alignment basis for calculating the glue supply buffer, constructing the baseline energy consumption parameter per unit glue supply, and collaborative scheduling correction.

[0083] In this embodiment, the thermal history assessment unit is used to calculate the thermal history index of the adhesive material to characterize the residence and exposure state of the molten adhesive material under high temperature conditions in the adhesive supply path, and to provide constraint input for the collaborative scheduling generation unit. The thermal history index of the adhesive material includes residence time and cumulative thermal exposure value. Both indexes are accumulated based on the adhesive material temperature under the premise that there is an amount of adhesive material in the adhesive supply path.

[0084] Temperature selection and consistency control of adhesive materials The temperature of the adhesive material is determined by temperature data, which is obtained by temperature acquisition devices located at key positions in the adhesive supply path. To ensure the stability of the calculation caliber of the thermal history index, in this embodiment, the temperature of the adhesive material is taken by default as the temperature of the temperature control point near the adhesive inlet of the adhesive application equipment, and recorded together with the sampling timestamp. When only the temperature control point at the production side output end or the temperature control point in the middle section of the heating pipeline is available on site, the temperature control point closest to the adhesive inlet of the adhesive application equipment can also be selected as the source of the adhesive material temperature value. However, it should remain unchanged after being fixed in the system configuration to avoid incomparable cumulative results caused by switching between different temperature control points.

[0085] When temperature data is temporarily missing, the thermal history assessment unit marks the missing sampling points and fills them in by maintaining the previous valid temperature value. When the duration of the missing data exceeds a preset threshold, the thermal history assessment unit suspends the incremental updates of residence time and cumulative heat exposure value until the temperature data is restored and the number of consecutive valid sampling points reaches the preset number before resuming the accumulation, so as to reduce the impact of the missing data on the accumulation result.

[0086] Criteria for determining the state of adhesive in the adhesive supply path The thermal history assessment unit uses the glue supply buffer amount as the basis for determining the amount of glue material in the glue supply path. The glue supply buffer amount is calculated by the glue supply coupling calculation unit based on the difference between the cumulative glue output on the production side and the cumulative glue input on the user side after considering the glue supply delay. It is also constrained by the upper limit of the glue supply path capacity. In order to avoid frequent fluctuations in the glue supply buffer amount near zero due to noise, this implementation adopts the minimum effective buffer amount threshold as the glue-in-the-path determination condition. That is, when the glue supply buffer amount is greater than the minimum effective buffer amount threshold, it is considered that there is glue material in the glue supply path, and the residence time and cumulative heat exposure value are allowed to increase. The minimum effective buffer amount threshold is determined by the equipment configuration parameters and is consistent with the volume diameter of the effective volume of the glue supply path.

[0087] Sources of melt flowability determination temperature and preset temperature threshold The melt flowability determination temperature and preset temperature threshold are determined by the process parameter table corresponding to the adhesive type. The process parameter table uses the adhesive type as an index. The adhesive type can be obtained from production-side formulation selection information, batch work order information, or adhesive identification code, and is recorded as part of the operating data. This allows the historical evaluation unit to call the corresponding parameter table entries during operation. The process parameter table is stored in the system parameter library, and its parameter sources can include the process recommendation range of the adhesive supplier, calibration records during equipment commissioning, and on-site process management documents, thereby ensuring that the threshold has a traceable basis. The preset temperature threshold is used to characterize the boundary conditions of the adhesive at a higher level of heat exposure, and is generally not lower than the melt flowability determination temperature. The specific value is subject to the process parameter table.

[0088] Cumulative update method for residence time and cumulative heat exposure values The thermal history assessment unit updates the residence time and cumulative heat exposure value under a unified sampling period. Within each sampling period, the thermal history assessment unit first determines whether the glue supply buffer meets the glue-on conditions. When the glue-on conditions are met, it then performs incremental accumulation based on the comparison result between the glue temperature and the corresponding threshold: when the glue temperature is not lower than the melt flowability determination temperature, the duration corresponding to this sampling period is added to the residence time; when the glue temperature is not lower than the preset temperature threshold, the duration corresponding to this sampling period is added to the cumulative heat exposure value. Both the residence time and the cumulative heat exposure value are output as time, and the unit is fixed in seconds or minutes by the system configuration.

[0089] In one implementation, the duration of the sampling period is taken as a uniform sampling period; when there are slight unequal intervals in the on-site sampling, the duration of the sampling period can be determined by the difference between adjacent sampling timestamps, so that the cumulative time is consistent with the actual sampling interval.

[0090] The connection between statistical granularity and subsequent scheduling The dwell time and cumulative heat exposure can be statistically analyzed using a rolling time window and updated in real time as the time window progresses. When it is necessary to manage by batch or by event segment, the dwell time and cumulative heat exposure can also be segmented and summarized according to the start and end times of the events given by the event identification unit, and stored in association with the event type. This ensures that the thermal history assessment results and energy consumption segment statistics have consistent time boundaries. The dwell time and cumulative heat exposure output by the thermal history assessment unit are used as thermal history indicators of the adhesive material and input to the collaborative scheduling generation unit to form a thermal history constraint basis when generating production batch arrangements, standby heat preservation target temperature ranges, and adhesive supply output setpoints.

[0091] In this embodiment, the collaborative scheduling generation unit generates a collaborative scheduling plan within a rolling time window. In addition to production batch arrangements and event start and end times, the collaborative scheduling plan also outputs a set of setpoints related to the glue supply process. The set of setpoints is used to parameterize the heating and glue supply process of the hot melt adhesive production equipment and the glue-using equipment, so that the instruction issuance and feedback correction unit can convert the scheduling results into control instructions that the equipment can execute.

[0092] Set of settings and their parameter sources The set of settings includes heating set temperature, glue supply output set value, and standby heat preservation target temperature range. The heating set temperature is used to limit the target temperature of the heating unit of the hot melt adhesive production equipment; the standby heat preservation target temperature range is used to limit the upper and lower limits of temperature control during standby heat preservation events; the glue supply output set value is used to limit the glue supply output capacity, and the glue supply output set value may include one or more of the following: glue pump speed set value, metering valve opening set value, and glue supply pressure set value.

[0093] The parameters in the set of settings are constrained by the equipment configuration parameters and the process parameter table corresponding to the adhesive type: the equipment configuration parameters are used to limit the heating capacity, the usable speed range of the adhesive pump, the usable opening range of the metering valve, and the usable pressure range of the adhesive supply circuit; the process parameter table is used to limit the recommended melting temperature range and the allowable standby heat preservation temperature range for different adhesive types, and provides the temperature boundary conditions corresponding to the adhesive type. When the collaborative scheduling generation unit outputs the set of settings, it performs upper and lower limit checks on each set value to ensure that the set values ​​are within the range that the equipment can execute and that meets the adhesive process requirements.

[0094] Correspondence between setpoints and actuators After receiving the set of settings, the instruction issuance and feedback correction unit converts them into control instructions and issues them to the equipment control system. The heating set temperature corresponds to the target temperature setting parameter of the heating controller; the glue pump speed set value corresponds to the speed setting parameter of the glue pump driver; the metering valve opening set value corresponds to the opening setting parameter of the metering valve actuator; and the glue supply pressure set value corresponds to the target pressure setting parameter of the glue supply circuit pressure controller.

[0095] When the equipment has both glue pump speed regulation and pressure closed-loop control capabilities, the system executes according to the control mode determined by the equipment configuration parameters: when the pressure closed loop is enabled, the glue supply pressure setpoint is used as the main control constraint, and the glue pump speed setpoint is subject to amplitude and rate of change limits to ensure that the glue pump output is consistent with the adjustment direction of the pressure closed loop; when the pressure closed loop is not enabled, the glue pump speed setpoint or the metering valve opening setpoint is used as the main control setting for the glue supply output.

[0096] Determination and triggering conditions of deviation information in steady-state glue supply events The energy consumption baseline construction unit maintains the baseline energy consumption parameters of the unit glue supply for steady-state glue supply events and generates deviation information based on the current operating data. Within a steady-state glue supply event, the system uses a uniform sampling period as the time base and a sliding statistical window of length W to calculate the actual energy consumption of the unit glue supply, where W is a positive integer determined by the equipment configuration parameters. The actual energy consumption of the unit glue supply is obtained by the ratio of the increase in power consumption to the increase in glue supply within the sliding window, and compared with the baseline energy consumption parameters of the unit glue supply corresponding to the steady-state glue supply event to obtain the deviation information.

[0097] To avoid unnecessary setpoint adjustments triggered by instantaneous fluctuations, the system employs a continuous sampling period determination mechanism: when the deviation information exceeds the deviation threshold for N consecutive sampling periods, the deviation is determined to persist, triggering the recalculation and reissue of the setpoint set, where N is a positive integer determined by the equipment configuration parameters; the deviation threshold is given by the equipment configuration parameters or process parameter table. When the deviation information falls back to within the deviation threshold in any sampling period, the continuous count is cleared and re-accumulated to ensure clear trigger boundaries. The above triggering only takes effect when the running event identification unit determines it to be a steady-state glue supply event; other event types do not execute the deviation triggering logic.

[0098] Recalculation method and boundary constraints of the set of settings When the triggering conditions are met, the collaborative scheduling generation unit updates the glue supply output setpoint and heating setpoint within the current rolling time window based on glue demand, glue supply buffer constraints, glue material thermal history index constraints, and equipment configuration constraints.

[0099] In one implementation, the recalculation process is performed in the following order: First, the glue supply output target is determined based on the recent statistical value of the glue inlet flow rate on the glue-using side and the glue supply buffer status, so that the glue supply output can cover the glue demand and the glue supply buffer is maintained within the allowable range; then, the glue supply output target is converted into updated values ​​of the glue pump speed setting value, metering valve opening setting value, or glue supply pressure setting value through a control mapping table, wherein the control mapping table can be obtained by equipment debugging and calibration and stored in the equipment configuration parameters; the updated value is subjected to amplitude limiting processing and a change rate limit is applied before it is issued to avoid the set value from changing abruptly in adjacent sampling periods.

[0100] After the glue supply output setting value is updated, the heating setting temperature is then corrected to ensure that the temperature constraint meets the requirements of the process parameter table corresponding to the glue type, and satisfies the boundary conditions between the melt flow determination temperature and the preset temperature threshold. The heating setting temperature is also limited, and the rate of change of heating and cooling can be limited to ensure that the temperature control process is executable.

[0101] When the cumulative heat exposure value of the adhesive material reaches the heat exposure warning threshold, the collaborative scheduling generation unit prioritizes reducing the risk of continued heat exposure accumulation by adjusting the standby insulation target temperature range or shortening the standby insulation period. When the cumulative heat exposure value reaches the heat exposure limit, the heating set temperature is restricted from further increase, and the set value set for subsequent steady-state adhesive supply events is protectively corrected in conjunction with the scheduling plan. The heat exposure warning threshold and heat exposure limit are determined by the process parameter table or process management parameters corresponding to the adhesive material type.

[0102] When the collaborative scheduling generation unit outputs the updated set of settings, it also outputs the corresponding start and end times of effectiveness, so that the instruction issuance and feedback correction unit can complete the setting value switching within the defined time boundary.

[0103] Control command issuance, execution confirmation, and rollback processing The instruction issuance and feedback correction unit encodes the updated set of settings into control instructions and issues them for execution, and confirms the execution status. The execution confirmation includes feedback collection of actual temperature, actual pressure, actual flow rate and equipment start-up and shutdown status, which is used to determine whether the equipment accepts the set values ​​and enters the response process.

[0104] Within the preset confirmation time, if the temperature error or pressure error is detected to fall within the allowable error range for M consecutive sampling cycles, or if the actual flow rate is detected to remain within the target range for M consecutive sampling cycles, then the set value issuance is considered valid. The confirmation time, M, and allowable error range are determined by the equipment configuration parameters. If the above confirmation conditions are not met within the confirmation time, or if the equipment enters an abnormal state, the instruction issuance and feedback correction unit will stop issuing the updated set value set and retain the previous valid set value set. After the abnormality is resolved and the steady-state glue supply event is re-entered, the deviation information judgment and triggering process will be executed again. During the execution process, the deviation information and the glue material thermal history index are continuously updated according to the sampling cycle and used as the input for subsequent rolling time window scheduling recalculation, forming a closed-loop correction process.

[0105] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0106] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An energy consumption analysis and intelligent scheduling system for hot melt adhesive production and application equipment, characterized in that: It includes a data acquisition interface, a running event identification unit, a glue supply coupling calculation unit, an energy consumption baseline construction unit, a thermal history assessment unit, a collaborative scheduling generation unit, and an instruction issuance and feedback correction unit; The data acquisition interface is communicatively connected to the hot melt adhesive production equipment and the adhesive application equipment, and is used to collect operating data of the adhesive supply process; The runtime event identification unit is used to identify runtime events based on the runtime data and generate an event sequence, wherein the event sequence includes the event type and the start and end times of the event. The glue supply coupling calculation unit is used to determine the glue supply buffer amount and glue supply delay based on the operating data; The energy consumption baseline construction unit is used to segment the energy consumption according to the event sequence, and combine the segmented glue supply amount to form the unit glue supply baseline energy consumption parameter corresponding to the event type, and output the deviation information of the actual energy consumption per unit glue supply relative to the unit glue supply baseline energy consumption parameter. The thermal history assessment unit is used to calculate the thermal history index of the adhesive material based on the adhesive supply buffer amount, adhesive supply delay and temperature-related data. The thermal history index of the adhesive material includes residence time and cumulative heat exposure value. The collaborative scheduling generation unit is used to generate a collaborative scheduling plan between the production side and the adhesive user side within a rolling time window, with the goal of reducing energy consumption and on the premise of meeting the adhesive demand, based on the constraints of adhesive supply buffer and adhesive material thermal history indicators. The collaborative scheduling plan includes at least production batch arrangement, event start and end times, and a set of set values. The instruction issuance and feedback correction unit is used to convert the collaborative scheduling plan into control instructions and issue them for execution, and to update the deviation information and the thermal history index of the adhesive material according to the update data of the execution process, thereby triggering the correction of the subsequent collaborative scheduling plan.

2. The energy consumption analysis and intelligent scheduling system for hot melt adhesive production and application equipment according to claim 1, characterized in that: The operational data includes at least the flow rate at the glue outlet on the production side, the flow rate at the glue inlet on the glue-using side, temperature data, and electrical parameter data. The flow rate at the glue outlet on the production side is obtained by a flow acquisition device installed at the glue outlet of the hot melt adhesive production equipment, and the flow rate at the glue inlet on the glue-using side is obtained by a flow acquisition device installed at the glue inlet of the glue-using equipment; when the glue-using equipment uses a metering chamber for glue supply, the flow rate at the glue inlet on the glue-using side is calculated from the glue discharge rate per unit time of the metering chamber.

3. The energy consumption analysis and intelligent scheduling system for hot melt adhesive production and application equipment according to claim 2, characterized in that: The upper limit of the glue supply buffer capacity is determined by the effective volume of the glue supply path, which is the molten glue conveying channel between the glue outlet of the hot melt glue production equipment and the glue inlet of the glue-using equipment. The glue supply buffer is calculated from the difference between the cumulative glue output from the production side and the cumulative glue input from the glue user side, taking into account the glue supply delay, and is limited to the range of 0 to the upper limit of the capacity.

4. The energy consumption analysis and intelligent scheduling system for hot melt adhesive production and application equipment according to claim 3, characterized in that: The operation event identification unit divides the operation process into preheating events, steady-state glue supply events, standby heat preservation events, glue replacement events, and maintenance events, and determines the start and end times of the events based on the equipment start / stop status and at least one of temperature changes, pressure changes, and flow rate changes.

5. The energy consumption analysis and intelligent scheduling system for hot melt adhesive production and application equipment according to claim 4, characterized in that: The baseline energy consumption parameter for the unit glue supply is determined by the ratio of segmented power consumption to segmented glue supply. The segmented power consumption is obtained by integrating the electrical parameter data over the segmented time period, and the segmented glue supply is obtained by integrating the flow rate data over the segmented time period.

6. The energy consumption analysis and intelligent scheduling system for hot melt adhesive production and application equipment according to claim 5, characterized in that: The glue supply delay is determined by the time offset between the flow rate sequence at the glue outlet on the production side and the flow rate sequence at the glue inlet on the glue-using side. The time offset is the offset value that makes the cross-correlation function of the two sequences reach its maximum value. Furthermore, the two sequences are time-aligned for the same sampling period before the cross-correlation calculation.

7. The energy consumption analysis and intelligent scheduling system for hot melt adhesive production and application equipment according to claim 6, characterized in that: The dwell time is the cumulative duration during which the glue supply buffer is greater than zero and the glue temperature is not lower than the melt flowability determination temperature. The cumulative heat exposure value is the cumulative duration during which the glue supply buffer is greater than zero and the glue temperature is not lower than a preset temperature threshold. The melt flowability determination temperature and the preset temperature threshold are determined by the process parameter table corresponding to the glue type.

8. The energy consumption analysis and intelligent scheduling system for hot melt adhesive production and application equipment according to claim 7, characterized in that: The set of settings includes at least the heating set temperature, the glue supply output set value, and the standby heat preservation target temperature range; The glue supply output setting value includes one or more of the following: glue pump speed setting value, metering valve opening setting value, and glue supply pressure setting value; when the deviation information exceeds the deviation threshold within N consecutive sampling periods during a steady-state glue supply event, the glue supply output setting value and the heating setting temperature are recalculated and sent out, where N is a positive integer.

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