Display module and display device

Abstract

The present disclosure relates to the technical field of display, in particular to a display module and a display device, the display module comprising: a display substrate comprising a display part, a bending part and a binding part, the binding part is arranged opposite to the display part through bending of the bending part; a heat dissipation layer arranged between the binding part and the display part, the heat dissipation layer has a plurality of grooves on one side surface thereof facing the binding part; and a bonding layer arranged between the heat dissipation layer and the binding part, the bonding layer comprises a first glue layer and a second glue layer, the modulus of the second glue layer is smaller than that of the first glue layer, and the second glue layer is filled in the grooves to form an interlocking structure with the inner walls of the grooves.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display module and a display device. Background Technology

[0002] In flexible display modules, especially medium and large-sized flexible display products, improving the product's resistance to mold printing has always been a key focus in this field. To enhance the structural strength of display modules in critical areas such as bending zones, existing technologies typically employ roughening treatment on the surface of the heat dissipation layer.

[0003] During the bonding process between the adhesive layer and the heat dissipation layer, the adhesive layer surface is usually covered with a release film to protect the adhesive layer. This release film needs to be removed before bonding. However, due to the excessive roughness of the heat dissipation layer surface, when the release film is removed, the peeling force on the adhesive layer is greater than the adhesive force between the adhesive layer and the heat dissipation layer. This causes the adhesive layer to be lifted up along with the release film, a phenomenon known as reverse release. The reverse release problem directly affects the bonding yield of the display module, resulting in a decrease in production efficiency. Therefore, how to effectively solve the reverse release problem while maintaining good anti-molding ability of the heat dissipation layer and improve the bonding reliability between the adhesive layer and the heat dissipation layer has become an urgent technical problem to be solved in this field. Summary of the Invention

[0004] This application provides a display module and a display device, aiming to solve the problem of how to improve the bonding reliability between the adhesive layer and the heat dissipation layer.

[0005] A first aspect of this application provides a display module, the display module comprising: The display substrate includes a display portion, a bending portion, and a bonding portion, wherein the bonding portion is bent by the bending portion so that the bonding portion is disposed opposite to the display portion; A heat dissipation layer is disposed between the bonding portion and the display portion, and the side surface of the heat dissipation layer facing the bonding portion has a plurality of grooves; An adhesive layer is disposed between the heat dissipation layer and the bonding portion. The adhesive layer includes a first adhesive layer and a second adhesive layer. The modulus of the second adhesive layer is less than that of the first adhesive layer. The second adhesive layer fills the groove and forms an interlocking structure with the inner wall of the groove.

[0006] In one optional embodiment, the second adhesive layer has a plurality of protrusions arranged at intervals on one side surface facing the heat dissipation layer. The plurality of protrusions are arranged in a one-to-one correspondence with the plurality of grooves, and the protrusions fill the corresponding grooves to form the fitting structure with the inner wall of the grooves.

[0007] In one alternative embodiment, the orthographic projection of the second adhesive layer on the display portion at least covers the orthographic projection of the plurality of grooves on the display portion.

[0008] In one alternative embodiment, the first adhesive layer surrounds the second adhesive layer, and the first adhesive layer and the second adhesive layer are disposed in the same layer.

[0009] In one alternative embodiment, the ring width of the first adhesive layer is greater than or equal to 1 mm.

[0010] In one alternative embodiment, the first adhesive layer is disposed on the side of the second adhesive layer away from the heat dissipation layer, and in the unattached state, the outer periphery of the second adhesive layer is recessed inward relative to the first adhesive layer.

[0011] In one alternative embodiment, in the unattached state, the outer periphery of the second adhesive layer is recessed inward relative to the first adhesive layer by a distance greater than or equal to 0.5 mm.

[0012] In one alternative embodiment, the adhesive layer further includes a third adhesive layer disposed on the side of the first adhesive layer near the bonding portion, the third adhesive layer being configured to bond the bonding portion to the adhesive layer.

[0013] In one alternative embodiment, the plurality of grooves are formed by a roughened structure on one side surface of the heat dissipation layer facing the bonding portion.

[0014] A second aspect of this application provides a display device, the display device including a display module as described in any one of the first aspects of this application.

[0015] Beneficial effects: This application provides a display module and a display device. The display module includes: a display substrate, comprising a display portion, a bending portion, and a bonding portion, wherein the bonding portion is bent by the bending portion to be disposed opposite to the display portion; a heat dissipation layer disposed between the bonding portion and the display portion, wherein the surface of the heat dissipation layer facing the bonding portion has multiple grooves; and an adhesive layer disposed between the heat dissipation layer and the bonding portion, wherein the adhesive layer includes a first adhesive layer and a second adhesive layer, the modulus of the second adhesive layer being less than that of the first adhesive layer, and the second adhesive layer filling the grooves to form an interlocking structure with the inner wall of the grooves. This application, by providing a fluid second adhesive layer and setting the surface of the heat dissipation layer near the bonding portion as a rough structure with grooves, ensures that the second adhesive layer fully fills the grooves to form an interlocking structure in the bonded state, thereby effectively improving the adhesion between the two, increasing the bonding reliability between the adhesive layer and the heat dissipation layer, and effectively avoiding the problem of reverse release.

[0016] The above description is merely an overview of the technical solution disclosed herein. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure are described below. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a display module according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a heat dissipation layer in a display module according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the second adhesive layer in a display module according to an embodiment of this application; Figure 4 This is a schematic diagram of a display module in which the first adhesive layer surrounds the second adhesive layer in an unattached state, according to an embodiment of this application. Figure 5 This is a schematic diagram of a display module in which the first adhesive layer surrounds the second adhesive layer in a bonding state, according to an embodiment of this application. Figure 6 This is a top view schematic diagram of a display module in which a first adhesive layer surrounds a second adhesive layer, according to an embodiment of this application; Figure 7 This is a schematic diagram of a display module in which the first to third adhesive layers are stacked in an unbonded state, according to an embodiment of this application. Figure 8 This is a schematic diagram of a display module in which the first to third adhesive layers are stacked in a bonding state according to an embodiment of this application; Figure 9 This is a schematic diagram of the structure of the second adhesive layer fixing and bonding part and the heat dissipation layer in a display module according to an embodiment of this application; Figure 10 This is a schematic diagram of the structure of the third adhesive layer fixing and bonding part and the heat dissipation layer in a display module according to an embodiment of this application.

[0019] Explanation of reference numerals in the attached drawings: 11. Touch substrate; 12. Optical adhesive layer; 13. Display substrate; 131. Display section; 132. Bending section; 133. Bonding section; 14. Heat dissipation layer; 151. First adhesive layer; 152. Second adhesive layer; 153. Third adhesive layer; 16. Release film; 21. Groove; 22. Protrusion. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0022] In flexible display modules, especially medium-to-large-sized flexible display products, improving the product's resistance to mold-printing has always been a key focus in this field. To enhance the structural strength of display modules in critical areas such as bending zones, existing technologies typically employ surface roughening treatment on the heat dissipation layer. Taking Cu foil as an example, by coating the entire surface of the Cu foil with a layer of Cu particles, its surface strength and compressive strength can be significantly improved, thereby effectively resisting mold-printing defects caused by external pressure and enhancing product competitiveness.

[0023] However, while this roughening process improves anti-molding performance, it also introduces new technical challenges. The surface roughness of the Cu foil after Cu particle coating increases significantly, forming numerous micron-level uneven structures. In the actual structure of the display module, the bonding portion is bent to the back of the display unit via a bending portion, and the adhesive layer (usually called a spacer) is placed between the bonding portion and the heat dissipation layer to fix the bent bonding portion to the back of the display unit, while also providing support and cushioning.

[0024] During the bonding process between the adhesive layer and the heat dissipation layer, the surface of the adhesive layer is usually covered with a release film to protect the adhesive layer. This release film needs to be removed before bonding. However, due to the excessive surface roughness of the heat dissipation layer, the actual contact area between the adhesive layer and the heat dissipation layer is significantly reduced, resulting in insufficient initial adhesion between them. When the release film is removed, the peeling force on the adhesive layer is greater than the adhesion force between the adhesive layer and the heat dissipation layer, causing the adhesive layer to be lifted up along with the release film. This phenomenon is called reverse release.

[0025] Reverse release issues not only directly affect the bonding yield of display modules, causing a decrease in production efficiency, but also lead to localized gaps or incomplete adhesion between the adhesive layer and the heat dissipation layer, thereby affecting the structural stability and long-term reliability of the bending area. In extreme cases, reverse release can even cause the bonding part to fail, seriously affecting the overall performance and lifespan of the display module.

[0026] Existing technologies increase adhesion by adjusting the adhesive formulation, optimizing bonding process parameters such as increasing pressure or temperature, or adding a primer to the heat dissipation layer surface to improve interfacial bonding. However, each of these methods has its own shortcomings. Adjusting the adhesive formulation to increase adhesion often requires increasing the adhesive modulus, but high-modulus adhesives have poor flowability and cannot fully fill the micro-grooves on the surface of the heat dissipation layer, potentially further reducing the actual contact area. While optimizing the bonding process can improve the bonding effect to some extent, increasing pressure or temperature may damage other components of the display module and requires high equipment precision, increasing production costs. Adding a primer requires an additional coating process, which not only increases process complexity but may also introduce new interfacial reliability issues. Therefore, how to effectively solve the anti-release problem and improve the bonding reliability between the adhesive layer and the heat dissipation layer while maintaining good anti-molding ability of the heat dissipation layer has become an urgent technical problem to be solved in this field.

[0027] In view of this, embodiments of this application provide a display module, Figure 1 This application shows a schematic diagram of the structure of a display module according to an embodiment of the present application. Figure 9 This invention provides a schematic diagram illustrating the structure of a second adhesive layer fixing and bonding portion and a heat dissipation layer in a display module according to an embodiment of this application. Figure 1 and Figure 9As shown, the display module includes a display substrate 13, which is used to display images. The display substrate 13 can be a flexible display substrate, such as an organic light-emitting diode display substrate or a liquid crystal display substrate. The specific type is not limited in this embodiment. The display substrate 13 includes a display portion 131, a bending portion 132, and a bonding portion 133. The display portion 131 is used to realize the image display function and has an array of pixel units and a driving circuit inside. The bending portion 132 connects the display portion 131 and the bonding portion 133 and has flexible and bendable characteristics. The bonding portion 133 is used to house a driving chip and a flexible circuit board. In the unbent state, the bonding portion 133 is located on one side of the same plane as the display portion 131. After the bending process, the bonding portion 133 is folded to the back side of the display portion 131 (i.e., the side of the display portion 131 away from the light-emitting surface) by the bending of the bending portion 132, so that the bonding portion 133 and the display portion 131 are positioned opposite each other.

[0028] In this embodiment, the display module further includes a heat dissipation layer 14, which is disposed between the bonding portion 133 and the display portion 131. Specifically, as... Figure 9 As shown, after the bonding portion 133 is bent to the back side of the display portion 131, the heat dissipation layer 14 is located in the gap formed between the display portion 131 and the bonding portion 133. The orthographic projection of the heat dissipation layer 14 on the display portion 131 at least partially overlaps with the display portion 131 to provide sufficient heat dissipation area. Other functional layers, such as buffer layers or insulating layers, may be provided between the surface of the heat dissipation layer 14 facing the display portion 131 and the back surface of the display portion 131, or they may be in direct contact; this embodiment does not limit this. The heat dissipation layer 14 can quickly dissipate the heat generated by the display substrate 13 during operation, and also provides support for the bent bonding portion 133, enhancing the structural stability of the bent area. Optionally, the material of the heat dissipation layer 14 can be a metal material with good thermal conductivity, such as copper or copper alloy.

[0029] To improve the anti-molding ability of the heat dissipation layer 14 and prevent irreversible dents or marks from forming under external pressure, in this embodiment, the surface of the heat dissipation layer 14 facing the bonding portion 133 (i.e., the surface away from the display portion 131) has a roughened structure. This roughened structure can be formed in various ways. For example, a layer of Cu particles can be coated across the entire surface of the heat dissipation layer 14, forming a micron-level uneven structure through the accumulation of Cu particles; or regular or irregular pits and protrusions can be formed on the surface of the heat dissipation layer 14 through chemical etching, plasma treatment, or other methods. The above roughening treatment can improve the surface hardness and compressive strength of the heat dissipation layer 14, thereby effectively resisting molding defects caused by external pressure.

[0030] In some alternative implementations, Figure 2 This application provides a schematic diagram of the structure of a heat dissipation layer in a display module according to an embodiment of the present application. Figure 2 As shown, the heat dissipation layer 14 has a plurality of grooves 21 on the side surface facing the bonding portion 133. These grooves 21 are formed by a roughening structure on the side surface of the heat dissipation layer 14 facing the bonding portion 133. Specifically, when roughening the surface of the heat dissipation layer 14, for example by applying a Cu particle layer or performing chemical etching, the recessed portions form the regularly arranged plurality of grooves 21 by controlling the molding process to create a micron-level uneven structure on the surface of the heat dissipation layer 14. These grooves 21 are used to form an interlocking structure with the subsequently applied adhesive layer, thereby enhancing the bonding force between the adhesive layer and the heat dissipation layer 14.

[0031] In this embodiment, the display module further includes an adhesive layer disposed between the heat dissipation layer 14 and the bonding portion 133, for fixing the bent bonding portion 133 to the heat dissipation layer 14, thereby achieving relative positioning between the bonding portion 133 and the display portion 131. Specifically, the adhesive layer includes a first adhesive layer 151 and a second adhesive layer 152, wherein the second adhesive layer 152 is attached to the heat dissipation layer 14.

[0032] To enhance the bonding strength between the adhesive layer and the heat dissipation layer 14 and avoid the problem of reverse release caused by excessive surface roughness of the heat dissipation layer 14, the second adhesive layer 152 is specially configured in this embodiment. Specifically, the second adhesive layer 152 can flow and fill the groove 21 on the surface of the heat dissipation layer 14 in the bonded state, and after curing, it forms an interlocking structure with the inner wall of the groove 21. Through this interlocking structure, the second adhesive layer 152 and the heat dissipation layer 14 form a mechanical interlock, thereby significantly enhancing the bonding force between them.

[0033] In this embodiment, to achieve the aforementioned flow-filling effect, the modulus of the second adhesive layer 152 is configured to be lower than that of the first adhesive layer 151. Due to its lower modulus, the second adhesive layer 152 has better fluidity in its unbonded state. When the adhesive layer and the heat dissipation layer 14 are bonded together, the second adhesive layer 152 can flow rapidly under external force, fully filling the groove 21, and forming a stable and reliable interlocking structure after curing. The first adhesive layer 151, with its higher modulus, plays a supporting and shaping role, ensuring the overall structural stability of the adhesive layer, while preventing the second adhesive layer 152 from overflowing excessively during the bonding process.

[0034] In some alternative embodiments, the modulus of the second adhesive layer is lower than that of conventional adhesives. These conventional adhesives typically refer to ordinary pressure-sensitive adhesives or optically transparent adhesives used in display module bonding, with moduli generally between 0.1 MPa and 10 MPa. They possess good initial adhesion and holding power, meeting the requirements of conventional planar bonding. However, when the bonding surface has a large roughness, these conventional adhesive layers, due to their relatively high modulus and limited fluidity, are unable to fully fill the micro-grooves on the surface of the heat dissipation layer, resulting in insufficient actual contact area and easily causing re-release problems.

[0035] In contrast, the second adhesive layer in this embodiment uses an adhesive material with a lower modulus. Optionally, the modulus of the second adhesive layer can be less than 0.1 MPa, or even as low as 0.01 MPa, thereby giving the second adhesive layer better fluidity in the bonded state, enabling it to flow rapidly under external force and fully fill the grooves on the surface of the heat dissipation layer, forming a strong interlocking structure with the inner wall of the groove after curing.

[0036] In some alternative implementations, Figure 3 This invention provides a schematic diagram of the structure of a second adhesive layer in a display module according to an embodiment of the present application. Figure 3 As shown, the second adhesive layer 152 has a plurality of spaced protrusions 22 on the side facing the heat dissipation layer 14. These protrusions 22 are corresponding one-to-one with a plurality of grooves 21 on the surface of the heat dissipation layer 14, that is, the position, number and arrangement of the protrusions 22 match the grooves 21. When the second adhesive layer 152 is bonded to the heat dissipation layer 14, the protrusions 22 can fill the corresponding grooves 21 and form an interlocking structure with the inner wall of the grooves 21. Through this interlocking of the protrusions 22 and the grooves 21, a mechanical interlock is formed between the second adhesive layer 152 and the heat dissipation layer 14, thereby significantly enhancing the bonding force between the two and effectively avoiding the problem of reverse separation caused by excessive surface roughness of the heat dissipation layer 14.

[0037] In some alternative embodiments, the orthographic projection of the second adhesive layer 152 onto the display portion 131 at least covers the orthographic projection of the plurality of grooves 21 onto the display portion 131. That is, when viewed from a direction perpendicular to the display portion 131, the area covered by the second adhesive layer 152 should completely cover the location areas of all the grooves 21. This defined coverage ensures that during the bonding process, each protrusion 22 of the second adhesive layer 152 can form an interlocking structure with each groove 21, thereby achieving a uniform and reliable bonding effect and avoiding the risk of re-deposition due to localized unfilled areas.

[0038] In some alternative implementations, Figure 4This illustration shows a schematic diagram of a display module in which a first adhesive layer surrounds a second adhesive layer in an unattached state, according to an embodiment of this application. Figure 5 This illustration shows a schematic diagram of a display module in which a first adhesive layer surrounds a second adhesive layer in a bonded state, according to an embodiment of this application. Figure 6 This illustration shows a top view of a display module according to an embodiment of the present application, in which a first adhesive layer surrounds a second adhesive layer. Figures 4-6 As shown, the first adhesive layer 151 surrounds the second adhesive layer 152, and the first adhesive layer 151 and the second adhesive layer 152 are disposed in the same layer. That is, the first adhesive layer 151 and the second adhesive layer 152 are located in the same plane, with the second adhesive layer 152 located on the inner side and the first adhesive layer 151 surrounding the outer periphery of the second adhesive layer 152 in a ring shape. Since the modulus of the first adhesive layer 151 is greater than that of the second adhesive layer 152, the first adhesive layer 151 has relatively low flowability, while the second adhesive layer 152 has relatively high flowability. Through this surrounding layout, during the bonding process, when the second adhesive layer 152 is pressed and flows to fill the groove 21 of the heat dissipation layer 14, the first adhesive layer 151 surrounding its outer periphery can act as a barrier, effectively limiting the extent of the second adhesive layer 152 overflowing outward and preventing excessive overflow of adhesive layer from contaminating the surrounding area.

[0039] Optionally, the transition between the second adhesive layer 152 and the first adhesive layer 151 can be achieved by using a rounded transition, a concave-convex structure transition, or other methods to alleviate stress concentration at the interface and improve the consistency of the structure.

[0040] In some optional embodiments, in order to ensure that the first adhesive layer 151 can effectively block the overflow of the second adhesive layer 152, the annular width of the first adhesive layer 151 should not be too narrow. Optionally, the annular width of the first adhesive layer 151 can be set to be greater than or equal to 1 mm to ensure sufficient blocking width so that the second adhesive layer 152 is effectively confined within a predetermined area during the bonding process.

[0041] In some alternative implementations, Figure 7 This illustration shows a schematic diagram of a display module in which the first to third adhesive layers are stacked in an unbonded state, according to an embodiment of this application. Figure 8 This illustration shows a schematic diagram of a display module in which the first to third adhesive layers are stacked in a bonding state, according to an embodiment of this application. Figure 7 and Figure 8As shown, the first adhesive layer 151 is disposed on the side of the second adhesive layer 152 away from the heat dissipation layer 14. That is, the first adhesive layer 151 and the second adhesive layer 152 are arranged sequentially in a direction perpendicular to the heat dissipation layer 14. The first adhesive layer 151, with its larger modulus, mainly serves a supporting function, providing structural strength for the entire adhesive layer and mitigating the potential adhesive overflow problem that may occur during the bonding process of the second adhesive layer 152. Optionally, the material of the first adhesive layer 151 can be a material with high rigidity and structural stability, such as, but not limited to, stainless steel (SUS), polyester film (PET), and composite structures of the two.

[0042] Specifically, in the unattached state (i.e., before the adhesive layer and the heat dissipation layer come into contact with each other), the outer periphery of the second adhesive layer 152 is recessed inward relative to the first adhesive layer 151. That is, when viewed from a direction perpendicular to the heat dissipation layer 14, the projected area of ​​the second adhesive layer 152 is smaller than the projected area of ​​the first adhesive layer 151, and the boundary of the second adhesive layer 152 is located inside the boundary of the first adhesive layer 151.

[0043] By setting the second adhesive layer 152 to be recessed inward relative to the first adhesive layer 151 in the unbonded state, when the adhesive layer is bonded to the heat dissipation layer 14, the second adhesive layer 152 will flow and expand outward under pressure. Since the modulus of the second adhesive layer 152 is smaller than that of the first adhesive layer 151, its fluidity is better, allowing it to fully fill the groove 21 on the surface of the heat dissipation layer 14 during bonding. Simultaneously, the space reserved by the inward recess provides a buffer zone for the flow of the second adhesive layer 152, preventing excessive overflow beyond the boundary of the first adhesive layer 151. After curing, the second adhesive layer 152 forms a stable interlocking structure with the inner wall of the groove 21, while the first adhesive layer 151 maintains a relatively stable shape, serving a supporting and shaping function.

[0044] In some optional embodiments, to allow sufficient flow space and ensure that the second adhesive layer 152 can fully fill the groove 21 without excessive overflow during the bonding process, the inward recess distance of the outer periphery of the second adhesive layer 152 relative to the first adhesive layer 151 should not be too small. Optionally, this inward recess distance can be set to be greater than or equal to 0.5 mm to ensure that the second adhesive layer 152 has sufficient expansion space, while avoiding the second adhesive layer 152 failing to effectively cover the area where the groove 21 is located due to excessive inward recess distance.

[0045] It should be noted that, in this embodiment, "adhesive state" refers to the final state after the adhesive layer and the heat dissipation layer 14 are pressed together and bonded. In this state, the second adhesive layer 152 has flowed under external pressure and filled the groove 21 on the surface of the heat dissipation layer 14. After curing, it forms a stable interlocking structure with the inner wall of the groove 21, and a reliable bond has been formed between the adhesive layer and the heat dissipation layer 14. Correspondingly, "unadhesive state" refers to the initial state of the adhesive layer itself before it comes into contact with the heat dissipation layer 14. In this state, the second adhesive layer 152 has not yet been subjected to bonding pressure and maintains its original shape and size. For example, structural features such as the outer periphery of the second adhesive layer 152 being recessed inward relative to the first adhesive layer 151 refer to the initial shape in the unadhesive state. When the adhesive layer and the heat dissipation layer 14 are bonded, the second adhesive layer 152 will flow and deform under pressure, and its shape and size may change.

[0046] In some alternative implementations, Figure 10 This invention provides a schematic diagram illustrating the structure of a third adhesive layer fixing and bonding portion and a heat dissipation layer in a display module according to an embodiment of this application. Figures 7-8 as well as Figure 10 As shown, the adhesive layer further includes a third adhesive layer 153, which is disposed on the side of the first adhesive layer 151 near the bonding portion 133. The third adhesive layer 153 is configured to bond the bonding portion 133 to the adhesive layer, fixing the bent bonding portion 133 to the adhesive layer, thereby achieving relative positioning between the bonding portion 133 and the display portion. Optionally, the third adhesive layer 153 can be double-sided adhesive, such as double-sided pressure-sensitive tape, with its two sides forming adhesive connections with the first adhesive layer 151 and the bonding portion 133, respectively. Through this three-layer structure design, the adhesive layer can form a firm interlocking connection with the heat dissipation layer 14 through the second adhesive layer 152, and can also achieve reliable bonding with the bonding portion 133 through the third adhesive layer 153, thereby forming a stable overall structure in the bending area.

[0047] In some optional embodiments, the display module further includes: a touch substrate 11, which is disposed on the side of the display substrate 13 away from the heat dissipation layer 14 (i.e., the light-emitting surface side of the display section 131) for realizing touch sensing function; and an optical adhesive layer 12, which is disposed between the touch substrate 11 and the display substrate 13 for attaching the touch substrate 11 to the light-emitting surface of the display substrate 13. The optical adhesive layer 12 is usually made of pressure-sensitive adhesive or optically transparent adhesive with high light transmittance to ensure that the display effect is not affected.

[0048] Furthermore, during the manufacturing and transportation of the adhesive layer, the surface of the adhesive layer is usually covered with a release film 16 to protect the adhesive layer from contamination and damage, and to prevent accidental adhesion before bonding. The surface of the release film 16 has undergone release treatment and has a certain peel force, allowing it to be easily removed when bonding is required. In this embodiment, by setting a first adhesive layer 151 and a second adhesive layer 152, and configuring the modulus of the second adhesive layer 152 to be less than that of the first adhesive layer 151, the second adhesive layer 152 can flow and fill the groove 21 on the surface of the heat dissipation layer 14 in the bonded state, and form an interlocking structure with the inner wall of the groove 21 after curing. This interlocking structure significantly enhances the adhesion between the second adhesive layer 152 and the heat dissipation layer 14, making it greater than the peel force of the release film 16. Therefore, when the release film 16 is removed, the second adhesive layer 152 can be firmly retained on the surface of the heat dissipation layer 14 and will not be lifted up with the release film 16, thereby effectively avoiding the problem of reverse release.

[0049] As can be seen, the embodiments of this application, through the structural design and material selection of the adhesive layer, especially through the combination of high and low modulus adhesive layers and the formation of the interlocking structure, significantly improve the adhesion between the adhesive layer and the heat dissipation layer, thereby overcoming the risk of reverse release caused by the release film peeling force and improving the bonding yield and long-term reliability of the display module.

[0050] This application provides a display module, comprising: a display substrate including a display portion, a bending portion, and a bonding portion, wherein the bonding portion is bent by the bending portion to be positioned opposite to the display portion; a heat dissipation layer disposed between the bonding portion and the display portion, wherein the surface of the heat dissipation layer facing the bonding portion has multiple grooves; and an adhesive layer disposed between the heat dissipation layer and the bonding portion, wherein the adhesive layer includes a first adhesive layer and a second adhesive layer, the modulus of the second adhesive layer being less than that of the first adhesive layer, and the second adhesive layer filling the grooves to form an interlocking structure with the inner wall of the grooves. This application, by providing a fluid second adhesive layer and setting the surface of the heat dissipation layer near the bonding portion as a rough structure with grooves, ensures that the second adhesive layer fully fills the grooves to form an interlocking structure in the bonded state, thereby effectively improving the adhesion between the two, increasing the bonding reliability between the adhesive layer and the heat dissipation layer, and effectively avoiding the problem of reverse release.

[0051] Based on the same inventive concept, embodiments of this application disclose a display device, which includes a display module as described in embodiments of this application.

[0052] In some optional embodiments, the display device is a product with image display capabilities. Optionally, the display device can be used to display static images, such as pictures and photographs; the display device can also be used to display dynamic images, such as videos and game screens.

[0053] In some alternative implementations, the display device includes, but is not limited to, laptops, mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, car displays, navigators, cockpit controllers and / or displays, displays of camera views, electronic photographs, electronic billboards or signs, projectors, packaging and aesthetic structures, etc.

[0054] It should be noted that, in addition to the display module, the display device also includes other necessary components and parts. For example, the display device may also include a housing, circuit board, power cord, etc. Those skilled in the art can make corresponding additions according to the specific usage requirements of the display device, which will not be elaborated here.

[0055] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0056] In the description of this specification, it should be understood that the terms "center", "thickness", "upper", "lower", "front", "rear", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0057] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0058] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0059] The foregoing application provides many different implementations or examples for carrying out different structures of this application. To simplify this application, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0060] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0061] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0062] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0063] The above provides a detailed description of a display module and display device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display module, characterized in that, The display module includes: The display substrate includes a display portion, a bending portion, and a bonding portion, wherein the bonding portion is bent by the bending portion so that the bonding portion is disposed opposite to the display portion; A heat dissipation layer is disposed between the bonding portion and the display portion, and the side surface of the heat dissipation layer facing the bonding portion has a plurality of grooves; An adhesive layer is disposed between the heat dissipation layer and the bonding portion. The adhesive layer includes a first adhesive layer and a second adhesive layer. The modulus of the second adhesive layer is less than that of the first adhesive layer. The second adhesive layer fills the groove and forms an interlocking structure with the inner wall of the groove.

2. The display module according to claim 1, characterized in that, The second adhesive layer has a plurality of protrusions arranged at intervals on one side of the heat dissipation layer. The plurality of protrusions are arranged one-to-one with the plurality of grooves, and the protrusions fill the corresponding grooves to form the fitting structure with the inner wall of the grooves.

3. The display module according to claim 1, characterized in that, The orthographic projection of the second adhesive layer on the display portion at least covers the orthographic projection of the plurality of grooves on the display portion.

4. The display module according to claim 1, characterized in that, The first adhesive layer surrounds the second adhesive layer, and the first adhesive layer and the second adhesive layer are disposed in the same layer.

5. The display module according to claim 1, characterized in that, The ring width of the first adhesive layer is greater than or equal to 1 mm.

6. The display module according to claim 1, characterized in that, The first adhesive layer is disposed on the side of the second adhesive layer away from the heat dissipation layer. In the unattached state, the outer periphery of the second adhesive layer is recessed inward relative to the first adhesive layer.

7. The display module according to claim 6, characterized in that, In the unattached state, the outer periphery of the second adhesive layer is recessed inward by a distance greater than or equal to 0.5 mm relative to the first adhesive layer.

8. The display module according to claim 6, characterized in that, The adhesive layer further includes a third adhesive layer disposed on the side of the first adhesive layer near the bonding portion, and the third adhesive layer is configured to bond the bonding portion to the adhesive layer.

9. The display module according to claim 1, characterized in that, The plurality of grooves are formed by a roughened structure on the side surface of the heat dissipation layer facing the bonding portion.

10. A display device, characterized in that, The display device includes the display module as described in any one of claims 1-9.

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