Composite electronic assembly
By using insulating joints to bond adjacent components in multilayer ceramic capacitors and setting insulating joints between inner bands, the problems of easy cracking and reduced conductivity of multilayer ceramic capacitors under vibration or impact are solved, achieving high-efficiency crack resistance and low ESR heat dissipation characteristics.
CN122158340APending Publication Date: 2026-06-05SAMSUNG ELECTRO MECHANICS CO LTD
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Filing Date
- 2025-11-12
- Publication Date
- 2026-06-05
AI Technical Summary
Technical Problem
Existing multilayer ceramic capacitors are prone to cracking under vibration or external impact, resulting in reduced conductivity, increased equivalent series resistance, and insufficient heat dissipation.
Method used
An insulating joint is used to bond adjacent bodies, and by setting an insulating joint between the first inner strip and the second inner strip, the number of external electrodes is reduced, and the bonding force and heat dissipation characteristics are improved.
Benefits of technology
It improves the crack resistance of composite electronic components, reduces the equivalent series resistance, and enhances heat dissipation performance.
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Smart Images
Figure CN122158340A_ABST
Abstract
The disclosure provides a composite electronic component. The composite electronic component includes an array in which two or more bodies are arranged in a first direction, the bodies including a dielectric layer and an internal electrode; a first external electrode provided on one surface of the two or more bodies in a second direction perpendicular to the first direction; and a second external electrode provided on the other surface of the two or more bodies in the second direction, the first external electrode and the second external electrode each including first and second internal strips extending between two of the bodies adjacent to each other among the two or more bodies and first and second external strips provided on the outermost sides of the two or more bodies in the first direction. The composite electronic component further includes an insulating joint that bonds the two bodies adjacent to each other, the insulating joint being provided in a portion between the first and second internal strips opposite to each other in the second direction.
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