Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a main body including a dielectric layer and an internal electrode; an external electrode including a first electrode layer disposed on the main body and connected to the internal electrode and a second electrode layer disposed on the first electrode layer; wherein, if a region of the external electrode disposed on a portion of an upper surface and a portion of a lower surface of the main body is referred to as a belt portion, a ratio (BW / BL) of a maximum length BW of each of the belt portions with respect to an average length BL of the main body satisfies 14.9%≤BW / BL<50.0%, and an average surface roughness Ra1 in a region of the main body where the second electrode layer of each of the belt portions is disposed to contact the main body satisfies 0nm<Ra1≤158nm.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0178678, filed on December 4, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) can be chip capacitors mounted on printed circuit boards of various types of electronic products, such as image display devices including liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, mobile phones, etc., for charging or discharging from them.

[0004] Multilayer ceramic capacitors are used as components in a variety of electronic devices due to their small size, high capacitance, and ease of installation. As electronic devices such as computers and mobile devices have become smaller and have higher output power, the demand for miniaturized and high-capacitance multilayer ceramic capacitors has increased.

[0005] Furthermore, because multilayer ceramic capacitors used in electrical / electronic fields (requiring high voltage or high reliability) must maintain high stability even under environments with strong vibration or severe external shocks, they require high flexural strength characteristics. Multilayer ceramic capacitors utilize a body formed from ceramic materials with high hardness and brittleness as components, thus possessing a structure susceptible to cracking due to external impacts, and various structural designs are being applied to compensate for this. Summary of the Invention

[0006] One of the problems this disclosure aims to solve is to provide a multilayer electronic component with improved flexural strength characteristics.

[0007] One of the problems this disclosure aims to solve is to provide a multilayer electronic component with enhanced shock resistance.

[0008] The problems to be solved by this disclosure are not limited to those described above, and can be more easily understood in the process of explaining the specific embodiments of this disclosure.

[0009] According to one aspect of this disclosure, a multilayer electronic component includes: a body comprising a dielectric layer and inner electrodes alternately disposed with respect to the dielectric layer in a first direction, and the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and an outer electrode comprising a first electrode layer and a second electrode layer, the first electrode layer being disposed on the body and connected to the inner electrodes, and the second electrode layer being disposed on the first electrode layer, wherein the outer electrode includes a first outer electrode and a second outer electrode, the first outer electrode being disposed on the third surface and extending to the first electrode layer. On a portion of the first surface and a portion of the second surface, the second external electrode is disposed on the fourth surface and extends to a portion of the first surface and a portion of the second surface. If the regions of the first and second external electrodes extending to a portion of the first surface and a portion of the second surface are referred to as strips, then the ratio (BW / BL) of the maximum second-direction length BW of each strip to the average second-direction length BL of the body satisfies 14.9% ≤ BW / BL < 50.0%. Each strip includes a first region in which the second electrode layer is configured to contact the first surface and / or the second surface of the body, and the average surface roughness Ra1 of the body in the first region satisfies 0 nm. <Ra1≤158nm。 Attached Figure Description

[0010] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is shown schematically.

[0011] Figure 2 An exploded perspective view of the stacked structure of the internal electrodes is shown schematically.

[0012] Figure 3 schematically showing along Figure 1 The cross-sectional view taken from line I-I'.

[0013] Figure 4 schematically shown Figure 3 A magnified view of region P.

[0014] Figure 5 schematically showing along Figure 1 The cross-sectional view taken from line II-II'.

[0015] Figure 6 This illustration schematically shows another embodiment of the present disclosure. Figure 5 The corresponding cross-sectional view. Detailed Implementation

[0016] In the following description, embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. However, embodiments of the present disclosure may be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure may be provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of description, the shape, size, etc., of elements in the drawings may be exaggerated, and elements indicated by the same reference numerals in the drawings may be the same elements.

[0017] Furthermore, to clearly explain this disclosure, portions irrelevant to the description will be omitted in the accompanying drawings to clarify the disclosure, and thicknesses may be enlarged to clearly show layers and regions. The same reference numerals will be used to denote the same components. Additionally, throughout the specification, unless explicitly stated otherwise, when an element is referred to as "comprising" or "including" another element, this means that the element may also include other elements, but does not exclude other elements.

[0018] In the accompanying drawings, the Z direction can be defined as a first direction, a stacking direction, or a thickness direction; the X direction can be defined as a second direction or a length direction; and the Y direction can be defined as a third direction or a width direction.

[0019] Multilayer electronic components Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is shown schematically.

[0020] Figure 2 An exploded perspective view of the stacked structure of the internal electrodes is shown schematically.

[0021] Figure 3 schematically showing along Figure 1 The cross-sectional view taken from line I-I'.

[0022] Figure 4 schematically shown Figure 3 A magnified view of region P.

[0023] Figure 5 schematically showing along Figure 1 The cross-sectional view taken from line II-II'.

[0024] Figure 6 This illustration schematically shows another embodiment of the present disclosure. Figure 5 The corresponding cross-sectional view.

[0025] In the following text, refer to Figures 1 to 6This document will describe in detail some embodiments of multilayer electronic components according to this disclosure. Multilayer ceramic capacitors will be described as examples of multilayer electronic components; however, these example embodiments are also applicable to various electronic products using dielectric compositions, such as inductors, piezoelectric elements, varistors, thermistors, etc.

[0026] According to some embodiments of this disclosure, a multilayer electronic component 100 includes: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122 alternately disposed with respect to the dielectric layer 111 in a first direction; the body 110 includes a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in the third direction; and outer electrodes 131 and 132, including first electrode layers 131a and 132a and second electrode layers 131b and 132b, the first electrode layers 131a and 132a being disposed on the body 110 and connected to the inner electrodes 121 and 122, and the second electrode layers 131b and 132b being disposed on the first electrode layers 131a and 132a, wherein the outer electrodes 131 and 132b are packaged in a manner that is not explicitly stated in the original text. The device includes a first external electrode 131 and a second external electrode 132. The first external electrode 131 is disposed on a third surface 3 and extends to a portion of the first surface 1 and a portion of the second surface 2. The second external electrode 132 is disposed on a fourth surface 4 and extends to a portion of the first surface 1 and a portion of the second surface 2. If the regions of the first external electrode 131 and the second external electrode 132 extending to a portion of the first surface and a portion of the second surface are referred to as strips, then the ratio (BW / BL) of the maximum second-direction length BW of each strip to the average second-direction length BL of the body 110 satisfies 14.9% ≤ BW / BL < 50.0%. Each strip includes a first region in which the second electrode layers 131b and 132b are configured to contact the body (e.g., contact the first surface 1 and / or the second surface 2 of the body 110), and the average surface roughness Ra1 of the body 110 in the first region satisfies 0 nm. <Ra1≤158nm。

[0027] The body 110 may have alternating stacked dielectric layers 111 and internal electrodes 121 and 122.

[0028] More specifically, the body 110 may include a first internal electrode 121 and a second internal electrode 122, which are disposed in the body 110 and alternately arranged to face each other, with a dielectric layer 111 located between the first internal electrode 121 and the second internal electrode 122 to form a capacitor forming portion Ac for forming a capacitor.

[0029] Although there are no particular restrictions on the specific shape of the main body 110, the main body 110 may have a hexahedral shape, etc. (e.g.) Figure 1 (As shown). Due to the shrinkage of the ceramic powder included in the body 110 during the sintering process, the body 110 may not have a perfect right hexahedral shape, but may have a generally hexahedral shape.

[0030] The main body 110 may include a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction.

[0031] The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated to such an extent that the boundaries between adjacent dielectric layers 111 may be difficult to identify without the use of a scanning electron microscope (SEM).

[0032] In this disclosure, the average length BL of the second direction of the body 110 can be the average length BL of the second direction between the third surface 3 and the fourth surface 4. For example, the distance between the extension line EL3 of the third surface 3 and the extension line EL4 of the fourth surface 4, which are parallel to each other, can be the second direction length BL or the average length BL of the second direction. However, this disclosure is not limited to this. A more specific method for obtaining the average length BL of the second direction of the body 110 is as follows: when observing the first-direction-second-direction section of the body 110 with a scanning electron microscope (SEM), the average of the second direction length measured at the center of the first direction of the body 110 and the second direction length measured at points at a certain interval from the center of the first direction in two first directions (e.g., the positive and negative directions of the Z-axis) can be the average length BL of the second direction of the body 110. A more specific description of the average length BL of the second direction of the body 110 will be given later.

[0033] The raw materials used to form dielectric layer 111 are not specifically limited, as long as sufficient capacitance can be obtained. Perovskite (ABO3) based materials can typically be used, such as barium titanate-based materials, lead-based composite perovskite-based materials, strontium titanate-based materials, etc. Barium titanate-based materials may include BaTiO3-based ceramic powder. Examples of BaTiO3-based ceramic powder include BaTiO3 or BaTiO3 in which calcium (Ca), zirconium (Zr), etc., are partially dissolved in BaTiO3. 1-x Ca x TiO3 (0) <x<1)、Ba(Ti 1-y Ca y)O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0034] In addition, according to the purpose of the present disclosure, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to powders such as barium titanate (BaTiO3) which are raw materials for forming the dielectric layer 111.

[0035] In order to distinguish the dielectric layer 111 included in the capacitor forming portion Ac from the dielectric layers included in the covering portions 112 and 113 and the side edge portions (or side edge regions) 114', 115', 114 and 115 described later, the dielectric layer included in the capacitor forming portion Ac can be defined as the first dielectric layer, the dielectric layers included in the covering portions 112 and 113 can be defined as the second dielectric layer, and the dielectric layers included in the side edge portions 114', 115', 114 and 115 can be defined as the third dielectric layer.

[0036] In addition, the first dielectric layer to the third dielectric layer can be formed using a dielectric material such as barium titanate (BaTiO3), and thus can include a dielectric microstructure after sintering. The dielectric microstructure can include a plurality of grains, grain boundaries provided between adjacent grains, and triple points provided at points where three or more grain boundaries intersect, and the numbers of grains, grain boundaries, and triple points can each be plural.

[0037] In order to ensure the reliability of the multilayer electronic component 100 in a high voltage environment, the first direction length td of the dielectric layer 111 can be 10 μm or less. In addition, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the first direction length td of the dielectric layer 111 can be 3 μm or less. In order to more easily achieve miniaturization and high capacitance, the first direction length td of the dielectric layer 111 can be 1 μm or less, can be 0.6 μm or less, or can be 0.4 μm or less.

[0038] The first direction length td of the dielectric layer 111 is not limited thereto.

[0039] In this case, the first direction length td of the dielectric layer 111 can represent the first direction length td of the dielectric layer 111 provided between the first internal electrode 121 and the second internal electrode 122.

[0040] The first direction length td of the dielectric layer 111 can represent the length, distance, size, etc. of the dielectric layer 111 in the first direction, or can represent the thickness of the dielectric layer.

[0041] In this case, the first directional length td of dielectric layer 111 can be a concept that includes the first directional length td of at least one of the plurality of dielectric layers 111, or it can be a concept that includes the first directional length td of each of all dielectric layers 111.

[0042] Furthermore, the first directional length td of dielectric layer 111 can represent the average first directional length td of a dielectric layer 111, can represent the average first directional length td of each of a plurality of dielectric layers 111, or can represent the average first directional length td of a plurality of dielectric layers 111.

[0043] The first-direction average length td of dielectric layer 111 can be measured by scanning an image of the first-direction-second-direction cross section of body 110 at a magnification of 10,000 using a scanning electron microscope (SEM). More specifically, the first-direction average length td of a dielectric layer 111 can be represented as an average value calculated by measuring the first-direction length of a dielectric layer 111 at five (5) equally spaced points in the second direction in the scanned image. The five (5) equally spaced points can be specified in the capacitor forming section Ac. Furthermore, the first-direction average length td of multiple dielectric layers 111 can be more generalized when this average value measurement is extended to three dielectric layers 111 to measure the average value. Alternatively, the first-direction average length td of dielectric layer 111 can also be measured on the first-direction-third-direction cross section of body 110.

[0044] The internal electrodes 121 and 122 may be stacked alternately with the dielectric layer 111.

[0045] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be alternately arranged to face each other and the dielectric layer 111 forming the body 110 is located between the first inner electrode 121 and the second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0046] More specifically, the first inner electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. The first outer electrode 131 may be disposed on the third surface 3 of the body 110 and connected to the first inner electrode 121, and the second outer electrode 132 may be disposed on the fourth surface 4 of the body 110 and connected to the second inner electrode 122.

[0047] For example, the first inner electrode 121 may be connected to the first outer electrode 131 but not to the second outer electrode 132, and the second inner electrode 122 may be connected to the second outer electrode 132 but not to the first outer electrode 131. In this case, the first inner electrode 121 and the second inner electrode 122 may be electrically isolated from each other by a dielectric layer 111 disposed between them.

[0048] The body 110 can be formed by alternately stacking a first ceramic green sheet on which a paste for forming a first internal electrode is printed and a second ceramic green sheet on which a paste for forming a second internal electrode is printed, and then sintering them.

[0049] There are no particular limitations on the materials used to form the internal electrodes 121 and 122, and materials with excellent electrical conductivity can be used as the main component metal. For example, the internal electrodes 121 and 122 may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0050] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for forming the internal electrodes onto a ceramic green sheet. The conductive paste for forming the internal electrodes includes one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The printing method for the conductive paste for forming the internal electrodes can be screen printing, gravure printing, etc., and this disclosure is not limited thereto.

[0051] The first directional length te of the inner electrodes 121 and 122 is not limited thereto, and the following description of the first directional length te of the inner electrodes 121 and 122 may represent the first directional length te of each of the first inner electrode 121 and the second inner electrode 122.

[0052] To ensure the reliability of the multilayer electronic component 100 under high-voltage environments, the first directional length te of the inner electrodes 121 and 122 can be 3.0 μm or less. Furthermore, to achieve miniaturization and high capacitance of the multilayer electronic component 100, the first directional length te of the inner electrodes 121 and 122 can be 1.0 μm or less. To more easily achieve ultra-miniaturization and high capacitance, the first directional length te of the inner electrodes 121 and 122 can be 0.6 μm or less, or 0.4 μm or less.

[0053] In this case, the first directional length te of the inner electrodes 121 and 122 can be a concept that includes the first directional length te of at least one of the plurality of inner electrodes 121 and 122, or it can be a concept that includes the first directional length te of all the inner electrodes 121 and 122.

[0054] In this case, the first direction length te of the inner electrodes 121 and 122 can represent the length, distance, size, etc. of the inner electrodes 121 and 122 in the first direction, or it can represent the thickness of the inner electrodes 121 and 122.

[0055] In this case, the first directional length te of the inner electrodes 121 and 122 can be a concept that includes the first directional length te of at least one of the plurality of inner electrodes 121 and 122, or it can be a concept that includes the first directional length te of each of all the inner electrodes 121 and 122.

[0056] Furthermore, the first directional length te of the inner electrodes 121 and 122 may represent the first directional average length te of one inner electrode 121 or 122, or may represent the first directional average length te of each of a plurality of inner electrodes 121 and 122, or may represent the first directional average length te of a plurality of inner electrodes 121 and 122.

[0057] The first-direction average length *te* of the inner electrodes 121 and 122 can be measured by scanning an image of the first-direction-second-direction cross-section of the body 110 at a magnification of 10,000 using a scanning electron microscope (SEM). More specifically, the first-direction average length *te* of one inner electrode 121 or 122 can be calculated as an average value by measuring the first-direction length of one inner electrode at five (5) equally spaced points in the second direction of the scanned image. The five (5) equally spaced points can be specified in the capacitor forming section *Ac*. Furthermore, the first-direction average length *te* of multiple inner electrodes 121 and 122 can be more generalized when this average value measurement is extended to three inner electrodes 121 and 122 to measure the average value. Alternatively, the first-direction average length *te* of the inner electrodes 121 and 122 can also be measured on a first-direction-third-direction cross-section of the body 110.

[0058] In embodiments of this disclosure, the first directional length td of at least one of the plurality of dielectric layers 111 and the first directional length te of at least one of the plurality of internal electrodes 121 and 122 can satisfy 2×te. <td。

[0059] For example, the first direction length td of a dielectric layer 111 may be greater than twice the first direction length te of an inner electrode 121 or 122. In some embodiments, the average first direction length td of the plurality of dielectric layers 111 may be greater than twice the average first direction length te of the plurality of inner electrodes 121 and 122.

[0060] Typically, reliability issues caused by the reduction in breakdown voltage (BDV) under high voltage conditions are likely to be a major problem for high-voltage electronic components.

[0061] Therefore, in order to prevent the breakdown voltage from decreasing under high voltage conditions, the average length td of the dielectric layer 111 in the first direction can be made greater than twice the average length te of the inner electrodes 121 and 122 in the first direction, thereby improving the breakdown voltage characteristics.

[0062] When the average length td of the dielectric layer 111 in the first direction is equal to or less than twice the average length te of the inner electrodes 121 and 122 in the first direction, the breakdown voltage may decrease and a short circuit may occur between the inner electrodes.

[0063] The main body 110 may include cover portions 112 and 113 disposed on the first direction end surface of the capacitor forming portion Ac.

[0064] Specifically, the covers 112 and 113 may include a first cover 112 and a second cover 113, with the first cover 112 disposed on one surface of the capacitor forming portion Ac in the first direction and the second cover 113 disposed on another surface of the capacitor forming portion Ac in the first direction. More specifically, for example, the covers 112 and 113 may include a first cover 112 disposed below the capacitor forming portion Ac in the first direction and a second cover 113 disposed above the capacitor forming portion Ac in the first direction.

[0065] The first cover portion 112 and the second cover portion 113 can be formed by providing or stacking a single second dielectric layer or two or more second dielectric layers on the lower and upper surfaces of the capacitor forming portion Ac in the first direction, respectively, and can substantially prevent the inner electrodes 121 and 122 from being damaged due to physical stress and / or chemical stress.

[0066] The first cover portion 112 and the second cover portion 113 may not include the inner electrodes 121 and 122, and may include the same dielectric material or ceramic material as the first dielectric layer 111 of the capacitor forming portion Ac. For example, the first cover portion 112 and the second cover portion 113 may include dielectric material or ceramic material, such as barium titanate (BaTiO3) based material.

[0067] The first directional length tc of the covering portions 112 and 113 is not limited thereto, and the following description of the first directional length tc of the covering portions 112 and 113 may represent the first directional length tc of each of the first covering portion 112 and the second covering portion 113.

[0068] To more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the first direction length tc of the covers 112 and 113 can be 500 μm or less, 400 μm or less, 300 μm or less, 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less.

[0069] In this case, the first direction length tc of the covering portions 112 and 113 can represent the length of the covering portions 112 and 113 in the first direction.

[0070] Furthermore, the first directional length tc of the covering portions 112 and 113 may represent the first directional average length tc of each of the first covering portion 112 and the second covering portion 113, or may represent the first directional average length tc of both the first covering portion 112 and the second covering portion 113.

[0071] The average length tc of the first direction of the covers 112 and 113 can be measured by scanning an image of the first-direction-second-direction cross section of the body 110 at a magnification of 10,000 using a scanning electron microscope (SEM). More specifically, the average length tc of the first direction of the covers 112 and 113 can be represented as the average value calculated by measuring the lengths of the covers 112 and 113 in the first direction at five (5) equally spaced points in the second direction in the scanned image.

[0072] Furthermore, the average length tc of the first direction of the covering portions 112 and 113 measured by the above method can have a value that is substantially the same as the average length of the first direction of the covering portions 112 and 113 in the first-third direction cross section of the main body 110.

[0073] exist Figure 5 In the illustrated embodiment, the multilayer electronic assembly 100 may include side edge regions 114' and 115', which may be third-direction end regions of the inner electrodes 121 and 122. Cover portions 112 and 113 may be disposed above and below the capacitor forming portion Ac and the side edge regions 114' and 115', respectively.

[0074] More specifically, the side edge regions 114' and 115' may include a first side edge region 114' disposed between the inner electrodes 121 and 122 and the fifth surface 5, and a second side edge region 115' disposed between the inner electrodes 121 and 122 and the sixth surface 6.

[0075] like Figure 5 As shown, based on the first-third-third-direction cross section of the body 110, the side edge regions 114' and 115' can represent the region between the ends of the first inner electrode 121 and the second inner electrode 122 in the third-third-direction and the outer surface of the body 110.

[0076] Side edge regions 114' and 115' may refer to the regions of the ceramic green sheet that will form side edge regions 114' and 115', excluding the internal electrodes 121 and 122, when the paste for forming the internal electrodes is applied to the ceramic green sheet applied to the capacitor forming part Ac.

[0077] The side edge regions 114' and 115' can essentially prevent damage to the inner electrodes 121 and 122 due to physical and / or chemical stress.

[0078] The first side edge region 114' and the second side edge region 115' may not include the inner electrodes 121 and 122, and may include the same material as the first dielectric layer 111 of the capacitor forming portion Ac. For example, the first side edge region 114' and the second side edge region 115' may include a dielectric material, such as a barium titanate (BaTiO3) based material.

[0079] The third-direction length wm' of the side edge regions 114' and 115' does not need to be specifically limited, and the following description of the third-direction length wm' of the side edge regions 114' and 115' can represent the third-direction length wm' of each of the first side edge region 114' and the second side edge region 115'.

[0080] To improve the bending strength and moisture resistance of the multilayer electronic assembly 100, the third-dimensional length wm' of the side edge regions 114' and 115' can be 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less.

[0081] In this case, the third-direction length wm' of the side edge regions 114' and 115' can represent the length, distance, size, etc. of the side edge regions 114' and 115' in the third direction, or it can represent the width of the side edge regions 114' and 115'.

[0082] Furthermore, the third-direction length wm' of the side edge regions 114' and 115' may represent the third-direction average length wm' of each of the first side edge region 114' and the second side edge region 115', or may represent the third-direction average length wm' of both the first side edge region 114' and the second side edge region 115'.

[0083] The third-direction average length wm' of the side edge regions 114' and 115' can be measured by scanning an image of the first-direction third-direction cross section of the body 110 at a magnification of 10,000 using a scanning electron microscope (SEM). More specifically, the third-direction average length wm' of a side edge region 114' or 115' can be represented as the average value calculated by measuring the third-direction length of a side edge region 114' or 115' at five (5) equally spaced points in the first direction in the scanned image.

[0084] exist Figure 6In another embodiment shown, the multilayer electronic assembly 100 may include side edge portions 114 and 115 disposed on the third-direction end surface of the capacitor forming portion Ac. The side edge portions 114 and 115 may also be disposed on the third-direction end surfaces of the covering portions 112 and 113.

[0085] More specifically, the side edge portions 114 and 115 may include a first side edge portion 114 disposed on one third-direction end surface of the capacitor forming portion Ac and a second side edge portion 115 disposed on another third-direction end surface of the capacitor forming portion Ac.

[0086] Side edge portions 114 and 115 can be formed by applying conductive paste to the portion of the ceramic green sheet applied to the capacitor forming portion Ac, excluding the portion where side edge portions 114 and 115 will be formed, to form inner electrodes 121 and 122. In order to suppress the step difference caused by the inner electrodes 121 and 122, after stacking, the inner electrodes 121 and 122 can be cut to expose the two end surfaces of the capacitor forming portion Ac in the third direction. Then, a single third dielectric layer or two or more third dielectric layers are formed or stacked on the two end surfaces of the capacitor forming portion Ac in the third direction.

[0087] The side edges 114 and 115 can essentially prevent the inner electrodes 121 and 122 from being damaged by physical stress and / or chemical stress.

[0088] The first side edge portion 114 and the second side edge portion 115 may not include the inner electrodes 121 and 122, and may include the same dielectric material or ceramic material as the first dielectric layer 111. For example, the first side edge portion 114 and the second side edge portion 115 may include dielectric material or ceramic material, such as barium titanate (BaTiO3) based material.

[0089] The third-order length wm of the side edge portions 114 and 115 is not limited thereto, and the following description of the third-order length wm of the side edge portions 114 and 115 may represent the third-order length wm of each of the first side edge portion 114 and the second side edge portion 115.

[0090] To improve the bending strength and moisture resistance of the multilayer electronic component 100, the third-dimensional length wm of the side edges 114 and 115 can be 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less.

[0091] In this case, the third-order length wm of the side edges 114 and 115 can represent the length, distance, size, etc. of the side edges 114 and 115 in the third-order direction, or it can represent the width of the side edges 114 and 115.

[0092] Furthermore, the third-direction length wm of the side edge portions 114 and 115 may represent the third-direction average length wm of each of the first side edge portion 114 and the second side edge portion 115, or may represent the third-direction average length wm of both the first side edge portion 114 and the second side edge portion 115.

[0093] The third-direction average length wm of the side edges 114 and 115 can be measured by scanning an image of the first-direction third-direction cross section of the body 110 at a magnification of 10,000 using a scanning electron microscope (SEM). More specifically, the third-direction average length wm of a side edge 114 or 115 can be represented as the average value calculated by measuring the third-direction length of a side edge 114 or 115 at five (5) equally spaced points in the first direction in the scanned image.

[0094] In embodiments of this disclosure, a multilayer electronic assembly 100 is shown to have a structure with two external electrodes 131 and 132, but the number, shape, etc. of the external electrodes 131 and 132 may be changed according to the shape of the internal electrodes 121 and 122 or for other purposes.

[0095] External electrodes 131 and 132 may be disposed on the main body 110 and may be connected to internal electrodes 121 and 122.

[0096] More specifically, the external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132, which are respectively disposed on the third surface 3 and the fourth surface 4 of the body 110 and respectively connected to the first internal electrode 121 and the second internal electrode 122. For example, the first external electrode 131 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0097] Furthermore, the external electrodes 131 and 132 may be configured to extend on a portion of the first surface 1 and a portion of the second surface 2 of the body 110, or they may be configured to extend on a portion of the fifth surface 5 and a portion of the sixth surface 6 of the body 110. For example, the first external electrode 131 may be disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the body 110, and the second external electrode 132 may be disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the body 110.

[0098] In this case, the first external electrode 131 and the second external electrode 132 are configured to extend in each region on a portion of the first surface 1 and a portion of the second surface 2, which may be referred to as a strip. The strip of the first external electrode 131 may be referred to as the first strip, and the strip of the second external electrode 132 may be referred to as the second strip.

[0099] More specifically, the first external electrode 131 may include a first strip portion, which may be a region configured to extend to a portion of the first surface 1 and a portion of the second surface 2. In the first strip portion of the first external electrode 131, the region configured to extend to a portion of the first surface 1 may be referred to as the 1-1 strip portion, and the region configured to extend to a portion of the second surface 2 may be referred to as the 1-2 strip portion.

[0100] The second external electrode 132 may include a second strip portion, which may be a region that extends to a portion of the first surface 1 and a portion of the second surface 2. In the second strip portion of the second external electrode 132, the region that extends to a portion of the first surface 1 may be referred to as the 2-1 strip portion, and the region that extends to a portion of the second surface 2 may be referred to as the 2-2 strip portion.

[0101] In this disclosure, unless there is a significant contradiction, the description of the belt section may correspond to the description of each of the first belt section and the second belt section, the description of the first belt section may correspond to the description of each of the 1-1 belt section and the 1-2 belt section, and the description of the second belt section may correspond to the description of each of the 2-1 belt section and the 2-2 belt section. Furthermore, the description of the belt section may correspond to the description of each of the 1-1 belt section, the 1-2 belt section, the 2-1 belt section, and the 2-2 belt section.

[0102] The strip may be disposed on a portion of the first surface 1 and a portion of the second surface 2, and in this case, the first surface 1 and the second surface 2 may represent the surfaces of the body 110 located between the extension line EL3 of the third surface 3 and the extension line EL4 of the fourth surface 4. In this case, the surfaces of the body 110 located between the extension line EL3 of the third surface 3 and the extension line EL4 of the fourth surface 4 are not limited to the first surface 1 and the second surface 2 which are substantially parallel to each other, and may be the concept of including the corner of the body 110.

[0103] The external electrodes 131 and 132 can be formed using any material (such as metals) as long as they are conductive, and the specific material can be determined by taking into account electrical properties, structural stability, etc., and the external electrodes 131 and 132 can also have a multilayer structure.

[0104] For example, external electrodes 131 and 132 may include first electrode layers 131a and 132a disposed on the body 110 and second electrode layers 131b and 132b disposed on the first electrode layers 131a and 132a. Furthermore, third electrode layers 131c and 132c disposed on the second electrode layers 131b and 132b may be included. In this case, preferably, the first to third electrode layers correspond to layers that are distinguishable from each other. However, this is not a limitation, and they may be distinguished according to the sequence of the manufacturing process, and at least some of the first to third electrode layers may not be distinguishable from each other and may be observed as a single layer.

[0105] In this disclosure, "distinguishable" can mean that two layers can be distinguished due to physical differences, chemical differences, and / or simple optical differences, and is not limited to these. For example, they can be distinguished by the presence of an "interface" between the layers. An interface can refer to a surface on which two layers in contact with each other can be distinguished from one another, and can refer to a state that can be distinguished, for example, by differences in composition, such as EDS analysis using equipment such as scanning electron microscopy (SEM), transmission electron microscopy (TEM), or scanning transmission electron microscopy (STEM).

[0106] The first electrode layers 131a and 132a and the second electrode layers 131b and 132b can be formed by transferring a sheet including conductive metal onto the body 110, or by coating the body 110 with a conductive paste including conductive metal for the external electrode and then sintering it, or by immersing the body 110 in a conductive paste including conductive metal for the external electrode, but are not limited thereto.

[0107] For a more specific example of electrode layers 131a, 132a, 131b and 132b, electrode layers 131a, 132a, 131b and 132b may have a two-layer structure including first electrode layers 131a and 132a and second electrode layers 131b and 132b.

[0108] More specifically, the external electrodes 131 and 132 may include: first electrode layers 131a and 132a, including a first conductive metal and glass; and second electrode layers 131b and 132b, which are distinct from the first electrode layers 131a and 132a, disposed on the first electrode layers 131a and 132a, and including a second conductive metal and resin.

[0109] The conductive metals included in electrode layers 131a, 132a, 131b, and 132b may be made of materials with excellent conductivity. For example, the conductive metals may include, but are not limited to, one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0110] In this case, the conductive metal included in the first electrode layers 131a and 132a may be referred to as the first conductive metal, and the conductive metal included in the second electrode layers 131b and 132b may be referred to as the second conductive metal. In this case, the first conductive metal and the second conductive metal may be the same as each other or different from each other, and in the case of including multiple conductive metals, only some of the multiple conductive metals may be the same conductive metal, but this is not a limitation.

[0111] The glass included in the first electrode layers 131a and 132a can improve the adhesion to the body 110, and the resin included in the second electrode layers 131b and 132b can improve the flexural strength.

[0112] The first conductive metal included in the first electrode layers 131a and 132a can serve to electrically connect with the inner electrodes 121 and 122.

[0113] The first conductive metal included in the first electrode layers 131a and 132a is not particularly limited, as long as it is a material that can be electrically connected to the inner electrodes 121 and 122. For example, it may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and alloys thereof.

[0114] The first electrode layers 131a and 132a may be disposed on the third surface 3 and the fourth surface 4, and may be configured to extend into a portion of the first surface 1 and a portion of the second surface 2. For example, the first electrode layers 131a and 132a may be disposed in the strip portion of the outer electrodes 131 and 132.

[0115] Specifically, the first electrode layer 131a of the first external electrode 131 may be disposed on the third surface 3 and may be configured to extend to a portion of the first surface 1 and a portion of the second surface 2. The first electrode layer 132a of the second external electrode 132 may be disposed on the fourth surface 4 and may be configured to extend to a portion of the first surface 1 and a portion of the second surface 2. For example, the first electrode layer 131a of the first external electrode 131 may be disposed in the first strip portion, more specifically, the first electrode layer 131a of the first external electrode 131 may be disposed in the 1-1 strip portion and the 1-2 strip portion. The second electrode layer 132a of the second external electrode 132 may be disposed in the second strip portion, more specifically, the first electrode layer 132a of the second external electrode 132 may be disposed in the 2-1 strip portion and the 2-2 strip portion.

[0116] The second conductive metal included in the second electrode layers 131b and 132b can perform the function of electrically connecting with the first electrode layers 131a and 132a.

[0117] The second conductive metal included in the second electrode layers 131b and 132b is not specifically limited, as long as it is a material that can be electrically connected to the first electrode layers 131a and 132a, and may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and alloys thereof.

[0118] The second electrode layers 131b and 132b may be disposed on the first electrode layers 131a and 132a, and may be configured to cover the first electrode layers 131a and 132a.

[0119] In this case, the statement that the second electrode layers 131b and 132b can be “configured to cover” the first electrode layers 131a and 132a can indicate that the second electrode layers 131b and 132b can be disposed on the first electrode layers 131a and 132a such that the first electrode layers 131a and 132a are not exposed to the outside, and can also indicate that the second electrode layers 131b and 132b can be configured such that the ends of the first electrode layers 131a and 132a are not exposed to the outside, and can extend to the portions of the first surface 1 and the second surface 2 where the first electrode layers 131a and 132a are not disposed, and can be configured to directly contact the body 110.

[0120] Specifically, the second electrode layers 131b and 132b may be disposed on the third surface 3 and the fourth surface 4 and extend to a portion of the first surface 1 and a portion of the second surface 2. For example, the second electrode layers 131b and 132b may be disposed in the strip portion of the outer electrodes 131 and 132.

[0121] More specifically, the second electrode layer 131b of the first external electrode 131 may be disposed on the portion of the first electrode layer 131a of the first external electrode 131 disposed on the third surface 3, and may be disposed on the portion of the first electrode layer 131a of the first external electrode 131 extending to a portion of the first surface 1 and a portion of the second surface 2, and may also be disposed on the portion extending to the first surface 1 and the second surface 2 where the first electrode layer 131a of the first external electrode 131 is not disposed. For example, the strip portion of the first external electrode 131 may include the portion of the first electrode layer 131a of the first external electrode 131 that extends to a portion of the first surface 1 and a portion of the second surface 2, and the portion of the second electrode layer 131b that extends to the first surface 1 and the second surface 2 and covers the first electrode layer 131a of the first external electrode 131.

[0122] The second electrode layer 132b of the second external electrode 132 may be disposed on the portion of the first electrode layer 132a of the second external electrode 132 disposed on the fourth surface 4, and may be disposed on the portion of the first electrode layer 132a of the second external electrode 132 extending to a portion of the first surface 1 and a portion of the second surface 2, and may also be disposed on the portion of the first electrode layer 132a of the second external electrode 132 extending to the first surface 1 and the second surface 2 on which the second external electrode 132 is not disposed. For example, the strip portion of the second external electrode 132 may include the portion of the first electrode layer 132a of the second external electrode 132 extending to a portion of the first surface 1 and a portion of the second surface 2, and the portion of the second electrode layer 132b extending to the first surface 1 and the second surface 2 and covering the first electrode layer 132a of the second external electrode 132.

[0123] For example, the second electrode layer 131b of the first external electrode 131 can be disposed in the first strip portion; more specifically, the second electrode layer 131b of the first external electrode 131 can be disposed in strip portion 1-1 and strip portion 1-2. The second electrode layer 132b of the second external electrode 132 can be disposed in the second strip portion; more specifically, the second electrode layer 132b of the second external electrode 132 can be disposed in strip portion 2-1 and strip portion 2-2.

[0124] The second conductive metal included in the second electrode layers 131b and 132b may include at least one of spherical particles and sheet-like particles. For example, the second conductive metal may be composed of only sheet-like particles, only spherical particles, or a mixture of spherical particles and sheet-like particles.

[0125] In this context, spherical particles may have shapes that are not perfectly spherical, for example, having a length ratio (major axis to minor axis) of 1.45 or less. Flaky particles refer to particles with a flat and elongated shape, and are not particularly limited, but may have a length ratio (major axis to minor axis) of 1.95 or greater, for example. The lengths of the major and minor axes of spherical and flaky particles can be measured from images obtained by scanning cross-sections in the first and second directions cut from the central portion of a multilayer electronic component in a third-direction orientation using SEM, TEM, or similar instruments.

[0126] The resin included in the second electrode layers 131b and 132b can serve to ensure bonding and absorb shock, and is not particularly limited, as long as it is mixed with the second conductive metal particles to form a paste, for example, it may include epoxy resin.

[0127] In addition, the second electrode layers 131b and 132b may include intermetallic compounds.

[0128] Intermetallic compounds may be included to further improve electrical connectivity with the first electrode layers 131a and 132a. The intermetallic compounds can be used to improve electrical connectivity by connecting multiple metal particles, and can be used to surround and connect multiple metal particles to each other.

[0129] In this context, the intermetallic compound may include a metal with a melting point lower than the resin's curing temperature. For example, since the intermetallic compound includes a metal with a melting point lower than the resin's curing temperature, the metal with a melting point lower than the resin's curing temperature can melt during the drying and curing processes to form some metal particles and the intermetallic compound surrounding the metal particles. In this case, the intermetallic compound may include a low-melting-point metal of 300°C or lower. More specifically, for example, the intermetallic compound may include tin (Sn) with a melting point of 213°C to 220°C. During the drying and curing processes, tin (Sn) can melt, and the molten tin (Sn) can capillarily wet conductive metal particles (such as Ag, Ni, or Cu) with a portion of the Ag, Ni, or Cu metal particles to form intermetallic compounds (such as Ag3Sn, Ni3Sn4, Cu6Sn5, Cu3Sn, etc.). Unreacted Ag, Ni, or Cu may be retained as metal particles.

[0130] Therefore, the plurality of metal particles may include one or more selected from the group consisting of Ag, Ni and Cu, and the intermetallic compound may include one or more selected from the group consisting of Ag3Sn, Ni3Sn4, Cu6Sn5 and Cu3Sn.

[0131] The third electrode layers 131c and 132c can improve the mounting characteristics, and the third electrode layers 131c and 132c can be plating layers formed on the second electrode layers 131b and 132b by plating method, but are not limited thereto.

[0132] The types of the third electrode layers 131c and 132c are not particularly limited, and may include at least one of, for example, nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof.

[0133] The third electrode layers 131c and 132c can be a single layer or multiple layers.

[0134] More specifically, for example, the third electrode layer may include a nickel (Ni) electrode layer or a tin (Sn) electrode layer, and may be a configuration in which the nickel (Ni) electrode layer and the tin (Sn) electrode layer are sequentially formed on the second electrode layers 131b and 132b, or may be a configuration in which the tin (Sn) electrode layer, the nickel (Ni) electrode layer, and the tin (Sn) electrode layer are sequentially formed on the second electrode layers 131b and 132b. Furthermore, the third electrode layers 131c and 132c may include multiple nickel (Ni) electrode layers and / or multiple tin (Sn) electrode layers.

[0135] In some embodiments of this disclosure, the ratio (BW / BL) of the maximum length BW in the second direction of the strip to the average length BL in the second direction of the body 110 can satisfy 14.9% ≤ BW / BL < 50.0%.

[0136] As described above, the method for obtaining the average length BL in the second direction of the main body 110 can be omitted, and the method for obtaining the maximum length BW in the second direction of the belt can be as follows, but is not limited thereto. In this case, the maximum length BW in the second direction of the belt can represent the maximum length BW in the second direction of each of belts 1-1, 1-2, 2-1, and 2-2.

[0137] The maximum length BW in the second direction of the belt portion can be the maximum length BW in the second direction of the belt portion disposed on the first surface 1 and / or the second surface 2 of the body. More specifically, the maximum length BW in the second direction of the belt portion can be the distance between the extension line EL3 of the third surface 3 or the extension line EL4 of the fourth surface 4 (which can be one end of the belt portion in the second direction) and the endpoint of the belt portion disposed on the first surface 1 or the second surface 2 of the body (which can be the other end of the belt portion in the second direction). The maximum length BW in the second direction of the belt portion can be a straight-line distance in the second direction.

[0138] The ratio (BW / BL) of the maximum length BW in the second direction of the strip to the average length BL in the second direction of the body 110 can satisfy 14.9%≤BW / BL<50.0% to minimize the bending stress exerted on the body 110 by external vibration, impact, etc., thereby preventing cracks from appearing in the body 110 and improving the bending strength characteristics.

[0139] The lower limit of the ratio (BW / BL) of the maximum length BW in the second direction of the belt to the average length BL in the second direction of the body 110 can be 14.9% or 15.7%.

[0140] In addition, in order to improve the bending strength characteristics, the maximum length BW in the second direction of the strip is not particularly limited, but it can be 850 μm or greater (850 μm ≤ BW), and it can be 900 μm or greater (900 μm ≤ BW).

[0141] When the ratio (BW / BL) of the maximum length BW in the second direction of the strip portion to the average length BL in the second direction of the main body is less than 14.9% (BW / BL < 14.9%), the bending strength characteristics may not be sufficiently improved, and cracks may occur in the main body 110.

[0142] In order to improve the bending strength characteristics, the upper limit value of the ratio (BW / BL) of the maximum length BW in the second direction of the strip portion to the average length BL in the second direction of the main body is not particularly limited. However, in order to prevent the first external electrode 131 and the second external electrode 132 from being electrically connected to each other, BW / BL < 50% can be satisfied. And since arc discharge may occur between adjacent strip portions according to the usage environment of the multilayer electronic component 100, in order to prevent this, BW / BL ≤ 25% can be satisfied.

[0143] As described above, the strip portion may include first electrode layers 131a and 132a and second electrode layers 131b and 132b provided to cover the first electrode layers 131a and 132a.

[0144] In the strip portion, the region where the second electrode layers 131b and 132b are provided to directly contact the main body 110 may be referred to as the first region, the region where the first electrode layers 131a and 132a are provided to directly contact the main body 110 (for example, the region contacting the first surface 1 and / or the second surface 2 of the main body 110) may be referred to as the second region, and the region where the second electrode layers 131b and 132b are provided on the first electrode layers 131a and 132a may be referred to as the third region.

[0145] In this case, the interface where the second electrode layers 131b and 132b contact the main body 110 in the first region may be referred to as the first interface, the interface where the first electrode layers 131a and 132a contact the main body 110 in the second region may be referred to as the second interface, and the interface where the first electrode layers 131a and 132a contact the second electrode layers 131b and 132b in the third region may be referred to as the third interface.

[0146] In some embodiments of the present disclosure, the average surface roughness Ra1 of the main body 110 in the first region may satisfy 0 nm < Ra1 ≤ 158 nm. For example, the average surface roughness Ra1 of the main body 110 at the first interface may satisfy 0 nm < Ra1 ≤ 158 nm, and the first interface may be the interface where the second electrode layers 131b and 132b contact the main body 110.

[0147] In the present disclosure, the "average surface roughness (Ra)" may be a value obtained by calculating the roughness of the surface of the main body 110 on the surface, and may represent the roughness of the main body 110 by calculating the average value based on the virtual center line of the roughness.

[0148] Surface roughness may be the degree of minute unevenness that appears on the surface when processing the surface of a specific material, and may also be referred to as surface roughness. Surface roughness is generally caused by the tools used for processing, the applicability of the processing method, scratches on the surface, rust, etc.

[0149] The average surface roughness (Ra) may represent a value obtained by the following method: extracting only the reference length in the average line direction from the roughness curve obtained by a roughness measuring device, taking the x-axis in the average line direction of the extracted portion, taking the y-axis in the vertical magnification direction, then obtaining the roughness curve corresponding formula f(x), and obtaining this value according to the following formula 1, and its unit may be micrometers (μm) or nanometers (nm).

[0150] In the case where it is difficult to measure the roughness using a roughness measuring device, the roughness curve corresponding formula f(x) of the above method may be obtained based on an image of a cross-section to be measured (for example, the first region to the third region in the present disclosure) taken using SEM, TEM, STEM, etc., and then the roughness may be obtained according to the following formula 1.

[0151] [Formula 1]

[0152] Another method for calculating the average surface roughness (Ra) may be to measure each maximum distance (for example, r1, r2, r3,... r n ) of the surface roughness based on the virtual center line of the surface roughness, and then calculate the average value of each distance as in the following formula 2 to obtain the average surface roughness (Ra) using the calculated value.

[0153] [Formula 2]

[0154] The average surface roughness Ra1 of the main body 110 in the first region may satisfy 0 nm < Ra1 ≤ 158 nm to minimize the anchoring effect between the second electrode layers 131b and 132b and the main body 110, thereby causing peeling between the second electrode layers 131b and 132b and the main body 110, thereby minimizing the bending stress applied to the main body 110, thereby preventing crack generation. In addition, even if cracks are generated, the capacitance forming portion Ac may not be affected, thereby preventing deterioration of the reliability of the multilayer electronic component 100.

[0155] When the average surface roughness Ra1 of the main body 110 in the first region is such that 158 nm < Ra1, peeling does not occur due to the anchoring effect between the second electrode layers 131b and 132b and the main body 110, and thus cracks may occur in the main body 110.

[0156] The lower limit value of the average surface roughness Ra1 of the main body 110 in the first region is not particularly limited as long as peeling occurs between the second electrode layers 131b and 132b and the main body 110. For example, 0 nm < Ra1 can be satisfied.

[0157] In addition, the average surface roughness Ra2 of the main body 110 in the second region can satisfy 158 nm < Ra2. For example, the average surface roughness Ra2 of the main body 110 on the second interface can satisfy 158 nm < Ra2, where the second interface can be the interface where the first electrode layers 131a and 132a contact the main body 110.

[0158] The average surface roughness Ra2 of the main body 110 in the second region can satisfy 158 nm < Ra2 to maintain the anchoring effect between the first electrode layers 131a and 132a and the main body 110, thereby improving the bonding strength between the first electrode layers 131a and 132a and the main body 110, preventing delamination between the first electrode layers 131a and 132a and the main body 110, suppressing the penetration of external moisture, and improving the moisture-proof reliability of the multilayer electronic component 100.

[0159] When the average surface roughness Ra2 of the main body 110 in the second region is such that Ra2 ≤ 158 nm, the anchoring effect between the first electrode layers 131a and 132a and the main body 110 may be insufficient, resulting in peeling, and the moisture-proof reliability of the multilayer electronic component 100 may be reduced.

[0160] The upper limit value of the average surface roughness Ra2 of the main body 110 in the second region is not particularly limited as long as delamination does not occur between the first electrode layers 131a and 132a and the main body 110, and it can be, for example, 5 μm or less, 4 μm or less, 3 μm or less, 2 μm or less, or 1 μm or less.

[0161] In some embodiments of the present disclosure, the average surface roughness Ra3 of the first electrode layers 131a and 132a in the third region can satisfy 0 nm < Ra3 ≤ 158 nm. For example, the average surface roughness Ra3 of the first electrode layers 131a and 132a on the third interface can satisfy 0 nm < Ra3 ≤ 158 nm, and the third interface can be the interface where the first electrode layers 131a and 132a contact the second electrode layers 131b and 132b.

[0162] The average surface roughness Ra3 of the first electrode layers 131a and 132a in the third region may satisfy 0 nm < Ra3 ≤ 158 nm, so as to minimize the anchoring effect between the first electrode layers 131a and 132a and the second electrode layers 131b and 132b, thereby causing peeling between the first electrode layers 131a and 132a and the second electrode layers 131b and 132b, thereby minimizing the bending stress applied to the main body 110, thereby preventing cracks from occurring. In addition, even if cracks occur, the capacitance forming portion Ac may not be affected, thereby preventing the reliability of the multilayer electronic component 100 from deteriorating.

[0163] When the average surface roughness Ra3 of the first electrode layers 131a and 132a in the third region is 158 nm < Ra3, peeling does not occur due to the anchoring effect between the first electrode layers 131a and 132a and the second electrode layers 131b and 132b, so cracks may occur in the main body 110.

[0164] The lower limit value of the average surface roughness Ra3 of the first electrode layers 131a and 132a in the third region is not particularly limited as long as peeling occurs between the first electrode layers 131a and 132a and the second electrode layers 131b and 132b. For example, 0 nm < Ra3 may be satisfied.

[0165] The size of the multilayer electronic component 100 is not limited.

[0166] Among the dimensions of the multilayer electronic component 100 that are vulnerable to bending strength, in order to minimize the occurrence of cracks due to external impact, according to the effects of the present disclosure, it can be more prominent in the multilayer electronic component 100 with a size of 3216 (length × width: 3.2 mm × 1.6 mm, the length and width satisfy an error of ±10%) or larger (dimensions such as 3225, 4520, 4532, 5750, 5763, etc.).

[0167] Hereinafter, the present disclosure will be described in more detail through test examples, but this can help to specifically understand the present invention, and the scope of the present disclosure may not be limited by the test examples.

[0168] (Test Example) Table 1 below describes the ratio of the maximum length BW in the second direction of the belt portion to the average length BL in the second direction of the main body, and the average surface roughness Ra1 of the main body in the region where the second electrode layer contacts the main body, and the number of sample sheets with bending cracks and peeling after performing the bending strength evaluation.

[0169] For each test example, 30 sample sheets are manufactured, and when performing the bending strength evaluation, the number of sample sheets with bending cracks and peeling is counted.

[0170] For the evaluation of bending strength, after mounting the sample piece on the substrate, a bending strength measuring device (R340) is used to gradually apply different forces to the substrate to bend the substrate, and the substrate is set to bend by 1 mm or more per step and held for 5 seconds per step. Bending strength evaluation is performed when the substrate is bent from 2 mm to 8 mm.

[0171] The number of sample pieces with peeling occurring in each step during the bending strength evaluation of Test Examples 1 to Test Examples 4 is counted and described in Table 2 below.

[0172] [Table 1]

[0173] [Table 2]

[0174] In Test Example 1, the ratio of the maximum length BW in the second direction of the belt portion to the average length BL in the second direction of the main body satisfies 14.9% ≤ BW / BL, but the average surface roughness Ra1 in the region where the second electrode layer contacts the main body of the main body satisfies 158 nm < Ra1. There is 1 sample piece with cracks, and the number of sample pieces with peeling is 21, which is relatively large. In Test Examples 2 to Test Examples 4, the ratio of the maximum length BW in the second direction of the belt portion to the average length BL in the second direction of the main body satisfies 14.9% ≤ BW / BL and the average surface roughness Ra1 in the region where the second electrode layer contacts the main body of the main body satisfies 0 < Ra1 ≤ 158 nm. There are no sample pieces with cracks (0), and the numbers of sample pieces with peeling are 18, 18, and 7 respectively, which are relatively small. In addition, in Test Example 4 where BW / BL is 15.7%, the number of sample pieces with peeling is 7, which is the least. When evaluating the bending strength, peeling occurs from a bending strength of 6 mm, indicating that it has the best bending strength. The belt portion plays a protective role for the main body. The longer the belt portion, the more beneficial it is to ensure the bending strength. For example, compared with Test Example 3, in Test Example 4, BW / BL increases by less than 1%, while the number of peeling occurrences significantly decreases and no cracks occur. Combining the above test examples, it can be seen that when the ratio (BW / BL) of the maximum length BW in the second direction of each of the belt portions to the average length BL in the second direction of the main body satisfies 14.9% ≤ BW / BL < 50.0% and the average surface roughness Ra1 in the region where the second electrode layer contacts the main body of the main body satisfies 0 nm < Ra1 ≤ 158 nm, cracks in the main body can be prevented.

[0175] Furthermore, the term "embodiment" as used in this specification does not imply the same embodiment and may be provided to emphasize and describe different unique features. However, the embodiments presented above are not excluded from implementation in combination with features of another embodiment. For example, although a particular embodiment is not described in another example, it may be understood as an interpretation relating to that other example unless otherwise described or contradicted.

[0176] The terminology used in this disclosure is for illustrative purposes only and is not intended to limit the scope of the invention. Unless the context clearly specifies otherwise, singular expressions include plural expressions.

[0177] One of the various effects of this disclosure is to improve the bending strength of multilayer electronic components.

[0178] One of the various effects of this disclosure is to enhance the shock resistance of multilayer electronic components.

[0179] The various advantages and effects of this disclosure are not limited to those described above, and can be more easily understood in the process of explaining specific embodiments of this disclosure.

[0180] While exemplary embodiments have been described and illustrated above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body includes a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and the body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in the third direction. as well as The external electrode includes a first electrode layer and a second electrode layer. The first electrode layer is disposed on the main body and connected to the internal electrode, and the second electrode layer is disposed on the first electrode layer. The external electrodes include a first external electrode and a second external electrode. The first external electrode is disposed on the third surface and extends to a portion of the first surface and a portion of the second surface. The second external electrode is disposed on the fourth surface and extends to a portion of the first surface and a portion of the second surface. When the regions of the first and second external electrodes extending to a portion of the first and second surfaces are referred to as strips, the ratio of the maximum second-direction length BW of each strip to the average second-direction length BL of the body, BW / BL, satisfies 14.9% ≤ BW / BL < 50.0%. Each of the strips includes a first region in which the second electrode layer contacts the first surface and / or the second surface of the body, and the average surface roughness Ra1 of the body in the first region satisfies 0 nm. <Ra1≤158nm。 2. The multilayer electronic component according to claim 1, wherein, Each of the strips includes a second region in which the first electrode layer contacts the first surface and / or the second surface of the body, and the average surface roughness Ra2 of the body in the second region satisfies 158 nm. <Ra2。 3. The multilayer electronic component according to claim 1, wherein, Each of the strips includes a third region in which the second electrode layer contacts the first electrode layer, and the average surface roughness Ra3 of the first electrode layer in the third region satisfies 0. <Ra3≤158nm。 4. The multilayer electronic assembly according to claim 1, wherein, BW satisfies 850μm≤BW.

5. The multilayer electronic component according to claim 1, wherein, The first electrode layer comprises a first conductive metal and glass.

6. The multilayer electronic assembly according to claim 1, wherein, The second electrode layer comprises a second conductive metal and a resin.

7. The multilayer electronic assembly according to claim 1, wherein, The external electrode includes a third electrode layer disposed on the second electrode layer.

8. The multilayer electronic component according to claim 1, wherein, The average length td of the dielectric layer in the first direction and the average length te of the inner electrode in the first direction satisfy 2×te. <td。 9. The multilayer electronic component according to claim 1, wherein, The average length BL of the second direction of the body is 3.2 mm or greater, and the average length of the third direction of the body is 1.6 mm or greater.

10. The multilayer electronic assembly according to claim 1, wherein, The ratio BW / BL satisfies 15.7% ≤ BW / BL ≤ 25%.

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