A battery and an electric device

Abstract

The application relates to the technical field of battery structure improvement, in particular to a battery and an electric equipment, the battery comprising a battery cell, a functional module, a connector and a circuit board, wherein the battery cell is connected with the circuit board and forms a lap joint surface; the circuit board has a bending section, the bending section extends in a direction away from the lap joint surface, and the extending direction of the bending section intersects with the lap joint surface; the functional module and the connector are both mounted on the bending section and connected with the bending section; and the functional module and the connector are located on the same surface of the bending section. The battery can reduce the demand for space.

Description

Technical Field

[0001] This application relates to the field of battery structure improvement technology, and in particular to a battery and electrical device. Background Technology

[0002] A battery is an energy supply device that transmits the electrical energy stored in its cells to electrical devices to maintain their normal operation.

[0003] A battery typically consists of a cell, a printed circuit board (PCB), a flexible circuit board (FPCB), and a functional module. The functional module is connected to the FPCB via the PCB, while the FPCB is adjacent to the cell. The functional module can monitor the cell's operating status and charge / discharge it through the PCB and FPCB.

[0004] In related technologies, flexible circuit boards, printed circuit boards, and functional modules generally occupy a lot of space at the head of the battery cell, resulting in a large space requirement for the battery. Summary of the Invention

[0005] In view of this, this application provides a battery and electrical device to reduce space requirements.

[0006] Specifically, the following technical solutions are included: A first aspect of this application provides a battery, the battery comprising a cell, a functional module, a connector, and a circuit board, wherein... The battery cell is connected to the circuit board and forms an overlapping surface; The circuit board has a bent section that extends away from the overlapping surface and the extending direction of the bent section intersects the overlapping surface. Both the functional module and the connector are installed on the bent section and connected to the bent section. The functional module and the connector are located on the same side of the bent section.

[0007] Optionally, the functional module includes a charging and discharging module, which is closer to the battery cell than the connector.

[0008] Optionally, the battery cell has a tab located on one side of the battery cell. The tab is connected to the circuit board and forms the overlapping surface, which is parallel to the surface where the tab of the battery cell is located.

[0009] Optionally, the battery includes a first reinforcing portion that is attached to the side of the circuit board facing away from the tab.

[0010] Optionally, the charging and discharging module includes a first substrate layer, a resistor, and a MOSFET. One side of the first substrate layer is connected to the bent section, and the resistor is located on the side of the first substrate layer opposite to the bent section and connected to the bent section. The MOSFET is located inside the first substrate layer and connected to the first substrate layer, or the MOSFET is located on the side of the first substrate layer connected to the bent section and connected to the first substrate layer.

[0011] Optionally, the first substrate layer includes a copper plating layer and an insulating layer, and a plurality of copper plating layers are stacked. Two adjacent copper plating layers are connected through the insulating layer. At least one copper plating layer has a cavity, and the insulating layer adjacent to the copper plating layer with the cavity has a through hole. The MOS transistor is located in the cavity and is connected to the adjacent copper plating layer through the through hole.

[0012] Optionally, the functional module includes a monitoring module, which is located on opposite sides of the bending section, and is connected to the bending section.

[0013] Optionally, the monitoring module includes a monitoring chip and a capacitive-resistive module, wherein the capacitive-resistive module connects the monitoring chip and the bending section.

[0014] Optionally, the monitoring chip includes a die layer, an interposer layer, and a second substrate layer, wherein the die layer, the interposer layer, and the second substrate layer are stacked and connected in sequence.

[0015] Optionally, the die layer includes a first die and a second die, wherein the substrate of the interposer is glass, and the first die and the second die are respectively connected to the side of the interposer that is away from the second substrate layer; or, the interposer includes a first sublayer and a second sublayer, wherein the first sublayer connects the first die and the second substrate layer, and the second sublayer connects the second die and the second substrate layer.

[0016] Optionally, the monitoring chip includes a package portion that covers the interposer layer and the die layer.

[0017] Optionally, the capacitor-resistor module includes a first conductive layer, a second conductive layer, a first matrix layer, a capacitor-resistor element, and a third substrate layer. The first conductive layer and the second conductive layer respectively cover two opposite sides of the first matrix layer. The capacitor-resistor element is located between the first conductive layer and the first matrix layer. The first matrix layer and the third substrate layer are stacked together. The capacitor-resistor element is connected to the third substrate layer through the first conductive layer.

[0018] Optionally, the first conductive layer is located on the side of the first matrix layer facing away from the third substrate layer, or the first conductive layer is located on the side of the first matrix layer facing the third substrate layer.

[0019] Optionally, the battery includes a second reinforcing portion mounted on the surface of the monitoring module on the bending section, wherein the orthographic projection of the second reinforcing portion on the bending section at least partially overlaps with the orthographic projection of the charging / discharging module on the bending section.

[0020] Optionally, the charging / discharging module and the connector are located on the same side of the bending section, and the orthographic projection of the charging / discharging module onto the battery cell and the orthographic projection of the connector onto the battery cell are both located within the orthographic projection of the circuit board onto the battery cell.

[0021] A second aspect of this application provides an electrical device comprising a battery as described in the above technical solutions.

[0022] The beneficial effects of the technical solution provided in this application include at least the following: the functional module and connector can monitor and charge / discharge the battery cell through the circuit board. The bending section serves as the installation location for the functional module and connector, and its extension direction intersects with the overlapping surface, which is beneficial for the functional module and connector to be located on the same side of the circuit board, thereby improving the space utilization of the bending section and reducing the space requirement. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a battery provided in an embodiment of this application; Figure 2 A side view schematic diagram showing some details of a battery provided in an embodiment of this application; Figure 3 A front view schematic diagram showing some details of a battery provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a functional module and circuit board assembly provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a monitoring chip provided in an embodiment of this application; Figure 6 This is a schematic diagram of another monitoring chip provided in an embodiment of this application; Figure 7This is a schematic diagram of the structure of a capacitive-resistive module provided in an embodiment of this application; Figure 8 These are schematic diagrams of the structures of two capacitive and resistive modules provided in the embodiments of this application; Figure 9 This is a schematic diagram of the structure of a power module provided in an embodiment of this application; Figure 10 This is a schematic diagram of the structure of a power module provided in an embodiment of this application; Figure 11 This is a circuit diagram provided for an embodiment of this application.

[0025] The reference numerals in the figure are respectively: 1. Battery cell; 11. Electrode tab; 2. Monitoring module; 21. Monitoring chip; 211. Die layer; 2111. First die; 2112. Second die; 212. Intermediate layer; 2121. First sublayer; 2122. Second sublayer; 213. Second substrate layer; 214. Packaging unit; 22. Capacitor-resistor module; 221. First conductive layer; 222. Second conductive layer; 223. First matrix layer; 224. Capacitor-resistor element; 225. Third substrate layer; 3. Charging / discharging module; 31. First substrate layer; 311. Copper plating layer; 31101. Cavity; 312. Insulating layer; 31201. Through hole; 32. Resistor; 33. MOSFET; 4. Connectors; 5. Circuit board; 51. Bending section; 6. Second Reinforced Section; 7. First Reinforcement Section.

[0026] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] In the embodiments of this application, directional terms such as "upper," "lower," and "side" are generally used in the following ways: Figure 1The relative positions shown are based on the given information, and these directional terms are used only to more clearly describe the relationships between structures, not to describe absolute positions. Positions may change when the product is placed in different orientations; for example, "up" and "down" may be interchanged.

[0029] Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art.

[0030] To make the technical solutions and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0031] The first aspect of this application provides a battery, such as Figure 1 and Figure 2 As shown, the battery includes a cell 1, a functional module, a connector 4, and a circuit board 5, wherein, Battery cell 1 is connected to circuit board 5 and forms an overlapping surface; The circuit board 5 has a bent section 51, which extends in a direction away from the lap surface and intersects the lap surface. Both the functional module and connector 4 are installed on and connected to the bending section 51.

[0032] It is understood that the functional module and connector 4 can monitor and charge / discharge the battery cell 1 via the circuit board 5. The bending section 51, serving as the mounting location for the functional module and connector 4, extends in a direction intersecting the overlapping surface. This allows the functional module and connector 4 to be located on the same side of the circuit board 5, improving space utilization and reducing space requirements. In this embodiment, the functional module and connector 4 can be connected to the circuit board 5 via separate substrates. This reduces battery assembly complexity and eliminates the need for the printed circuit board 5, minimizing space occupation at the head of the battery cell 1.

[0033] In this embodiment of the application, the battery cell 1 can achieve ion migration through the electrolyte, and the migration process enables the battery cell 1 to store and release electrical energy.

[0034] In this embodiment, since the space occupied by the battery is relatively compact when it is placed inside the electrical equipment, while the surface where the connector 4 is located generally has relatively spacious space, placing the functional module and the connector 4 on the same surface is beneficial to improving the compactness of the battery and thus reducing the space occupied by the battery.

[0035] In this embodiment, the circuit board 5 can be a flexible circuit board 5, which can change the orientation of the connector 4 by bending and deformation, thereby facilitating the connection of the connector 4 with other devices.

[0036] In some embodiments of this application, such as Figure 2 As shown, the functional module includes a charging / discharging module 3, which is closer to the battery cell 1 than the connector 4.

[0037] It is understandable that since the current transmitted by connector 4 needs to pass through charging and discharging module 3 to enter cell 1, this arrangement helps to reduce the concentration of current in bending section 51, which is beneficial to improving battery safety.

[0038] In the embodiments of this application, such as Figure 2 As shown in the figure, the arrows indicate the direction of current flow. It can be seen from the figure that during the charging process, the current mainly flows from connector 4 through charging and discharging module 3 to cell 1.

[0039] In some embodiments of this application, such as Figure 3 As shown, the battery cell 1 has a tab 11, which is located on one side of the battery cell 1. The tab 11 is connected to the circuit board 5 and forms an overlapping surface, which is parallel to the surface where the tab 11 of the battery cell 1 is located.

[0040] Understandably, the tab 11 connects to the circuit board 5 and forms an overlapping surface, allowing ions generated by the cell 1 to migrate through the tab 11 into the circuit board 5, and finally be transmitted to other devices via the connector 4, thus achieving the storage and release of electrical energy. The overlapping surface is parallel to the surface where the tab 11 of the cell 1 is located, which helps improve the overall compactness of the battery, thereby reducing its size. It also allows for a larger capacity within the same space. Furthermore, this connection method eliminates the need for the nickel sheet used to support the circuit board 5, thus reducing the space occupied by the battery.

[0041] In this embodiment of the application, the tab 11 and the circuit board 5 can be connected by means of soldering or other methods.

[0042] In this embodiment, the tab 11 may be L-shaped.

[0043] In some embodiments of this application, such as Figure 3 As shown, the battery includes a first reinforcing part 7, which is attached to the side of the circuit board 5 opposite to the tab 11.

[0044] Understandably, the first reinforcing part 7 can be used to maintain the structural stability of the circuit board 5. When the battery cell 1 or the circuit board 5 is impacted, the force exerted on the circuit board 5 by the lap joint can be dispersed to various locations by the first reinforcing part 7, thereby reducing the deformation of the circuit board 5.

[0045] In this embodiment, the thickness of the first reinforcing part 7 is in the range of 0.15 to 0.2 mm, which helps the circuit board 5 maintain its shape and reduces the deformation of the overlapping surface formed between the circuit board 5 and the tab 11.

[0046] In some embodiments of this application, such as Figure 9 and Figure 10 As shown, the charging and discharging module 3 includes a first substrate layer 31, a resistor 32 and a MOS transistor 33. One side of the first substrate layer 31 is connected to the bending section 51. The resistor 32 is located on the side of the first substrate layer 31 away from the bending section 51 and is connected to the bending section 51. The MOS transistor 33 is located inside the first substrate layer 31 and is connected to the first substrate layer 31.

[0047] It is understandable that the first substrate layer 31 can conduct resistor 32 to circuit board 5 and MOSFET 33 to circuit board 5. The MOSFET 33 is located inside the first substrate layer 31, which helps to reduce the volume of the charging and discharging module 3, thus helping to reduce the overall volume of the battery.

[0048] In some embodiments of this application, such as Figure 9 and Figure 10 As shown, the charging and discharging module 3 includes a first substrate layer 31, a resistor 32 and a MOS transistor 33. One side of the first substrate layer 31 is connected to the bending section 51. The resistor 32 is located on the side of the first substrate layer 31 away from the bending section 51 and is connected to the bending section 51. The MOS transistor 33 is located on the side of the first substrate layer 31 connected to the bending section 51 and is connected to the first substrate layer 31.

[0049] It is understandable that the MOS transistor 33 is located on the side of the first substrate layer 31 connected to the bent section 51 and connected to the first substrate layer 31. This is beneficial for the MOS transistor 33 to utilize the cavity 31101 of the row layer connected to the circuit board 5 through the pads of the first substrate layer 31, which helps to improve the compactness of the charging and discharging module 3.

[0050] In some embodiments of this application, such as Figure 9 As shown, the first substrate layer 31 includes a copper plating layer 311 and an insulating layer 312. Multiple copper plating layers 311 are stacked, and two adjacent copper plating layers 311 are connected through the insulating layer 312. At least one copper plating layer 311 has a cavity 31101. The insulating layer 312 adjacent to the copper plating layer 311 with the cavity 31101 has a through hole 31201. The MOS transistor 33 is located in the cavity 31101 and is connected to the adjacent copper plating layer 311 through the through hole 31201.

[0051] Understandably, the copper plating layer 311 enables the resistor 32 and MOSFET 33 to conduct to the circuit board 5, thus achieving the charging and discharging function. The insulating layer 312 prevents direct contact between adjacent copper plating layers 311, which could lead to a short circuit, thereby improving the safety of the charging and discharging module 3.

[0052] In some embodiments of this application, such as Figure 4 As shown, the functional module includes a monitoring module 2, which is located on opposite sides of the bending section 51, and is connected to the bending section 51.

[0053] Understandably, the monitoring module 2 can monitor the working status of the battery cell 1 to prevent situations such as explosion of the battery cell 1. The monitoring module 2 is small in size and requires less space. It is arranged on two sides opposite to the connector 4, which are located on the bending section 51, which helps to improve the compactness of the battery in this application.

[0054] In this embodiment of the application, the connector 4 can be used to connect with other devices through plugging or other means, thereby enabling signal transmission. In this way, the signal generated by the monitoring module 2 can be transmitted to other devices.

[0055] In this embodiment, the thickness of the circuit board 5 is in the range of 0.21 to 0.28 mm. Within this range, the current generated by the monitoring module 2 and the charging / discharging module 3 is generally insufficient to burn out the circuit board 5, and the space occupied by the circuit board 5 can also be reduced.

[0056] In this embodiment, the monitoring module 2 may include a fuel gauge, which can be used to monitor the charge level of the battery cell 1. The fuel gauge, via the circuit board 5, helps the user or other devices obtain the charge level information of the battery cell 1. The monitoring module 2 may also include a protection unit, which can control the on / off state of the MOSFET 33 to achieve overcharge and over-discharge protection for the battery cell 1 and current protection during the charging and discharging process.

[0057] In this embodiment, the orthographic projection of the monitoring module 2 onto the circuit board 5 at least partially overlaps with the orthographic projection of the connector 4 onto the circuit board 5. It is understood that this arrangement helps to shorten the current transmission path between the monitoring module 2 and the connector 4, thereby reducing the distribution of current generated by the monitoring module 2 on the circuit board 5 and preventing current concentration.

[0058] In this embodiment, the center of the monitoring module 2 in the orthographic projection of the circuit board 5 coincides with the center of the connector 4 in the orthographic projection of the circuit board 5.

[0059] In some embodiments of this application, such as Figure 4As shown, the monitoring module 2 includes a monitoring chip 21 and a capacitive-resistive module 22, which connects the monitoring chip 21 and the bending section 51.

[0060] It is understandable that the monitoring module 2 generally includes a monitoring chip 21 and multiple capacitive and resistive components 224. Through cooperation with the multiple capacitive and resistive components 224, the monitoring chip 21 can monitor the working status of the battery cell 1 and protect the battery cell 1. By splitting the monitoring module 2 into two separate components, it is possible to avoid the situation where a single capacitive and resistive component 224 is installed on the circuit board 5. At the same time, it can also protect these capacitive and resistive components 224, reducing the possibility of the monitoring module 2 failing due to the impact of the battery cell 1 on the circuit board 5.

[0061] In the embodiments of this application, such as Figure 11 As shown, the monitoring chip 21 includes a fuel gauge chip, a first-stage protection chip, and a second-stage protection chip. The capacitor-resistor module 22 includes capacitors C1, C2, C3, and C4, and resistors 32R1, 32R2, 32R3, 32R4, 32R5, 32R6, 32R7, 32R8, 32R9, 32R10, and 32R11. The charge / discharge module 3 includes MOSFETs 33Q1, 33Q2, 33Q3, and 33Q4, and precision resistors 32RS1 and 32RS2. The connection method of the above components is as follows: Figure 11 As shown, further details will not be repeated here. Through the cooperation of the monitoring chip 21, the capacitive-resistive module 22 and the charge-discharge module 3 described above, the operating status of the battery can be monitored and protected, reducing the possibility of the battery catching fire due to a short circuit.

[0062] In this embodiment, the capacitor-resistor module 22 can be formed by encapsulating multiple capacitor-resistor elements 224.

[0063] In some embodiments of this application, such as Figure 5 As shown, the monitoring chip 21 includes a die layer 211, an interposer layer 212, and a second substrate layer 213, which are stacked and connected in sequence.

[0064] It is understandable that the bare die layer 211 carries a specific circuit function. It is connected to the second substrate layer 213 through the intermediary layer 212, and can be connected to the circuit board 5 through the second substrate layer 213, thereby monitoring the operating status of the battery cell 1 and protecting the battery cell 1.

[0065] In this embodiment, the die layer 211 and the interposer layer 212 can be connected by means of welding or other methods.

[0066] In this embodiment, the intermediary layer 212 and the first substrate layer 31 can be connected by means of welding or the like.

[0067] In some embodiments of this application, such as Figure 5 and Figure 6 As shown, the die layer 211 includes a first die 2111 and a second die 2112, wherein the substrate of the interposer layer 212 is glass, and the first die 2111 and the second die 2112 are respectively connected to the side of the interposer layer 212 facing away from the second substrate layer 213.

[0068] Understandably, the interposer layer 212 configured in this way has high strength, which can prevent the interposer layer 212 from warping due to the pressure exerted by the first die 2111 and the second die 2112. This also helps the interposer layer 212 to support more dies, thereby reducing the size of the monitoring chip 21.

[0069] In some embodiments of this application, such as Figure 5 and Figure 6 As shown, the die layer 211 includes a first die 2111 and a second die 2112, and the interposer layer 212 includes a first sublayer 2121 and a second sublayer 2122. The first sublayer 2121 connects the first die 2111 and the second substrate layer 213, and the second sublayer 2122 connects the second die 2112 and the second substrate layer 213.

[0070] It is understandable that the first die 2111 and the second die 2112 can perform different functions. They are connected to the second substrate layer 213 through the first sublayer 2121 and the second sublayer 2122, respectively. This can improve their independence and reduce the direct impact on the other when one of them is damaged by a short circuit or other factors. This is beneficial for maintaining the normal operation of the battery.

[0071] In this embodiment of the application, the first die 2111 can be a die of a fuel gauge chip or a die of a battery protection IC (Integrated Circuit) chip.

[0072] In this embodiment, the second die 2112 can be a die of a battery protection IC chip or a die of a fuel gauge chip.

[0073] In some embodiments of this application, such as Figure 6 As shown, the monitoring chip 21 includes a package 214, which covers an interposer layer 212 and a die layer 211.

[0074] Understandably, the encapsulation section 214 can protect the interposer layer 212 and the die layer 211, reducing the impact of scratches or shocks from the cell 1 on both.

[0075] In some embodiments of this application, such as Figure 7 As shown, the capacitor-resistor module 22 includes a first conductive layer 221, a second conductive layer 222, a first matrix layer 223, a capacitor-resistor element 224, and a third substrate layer 225. The first conductive layer 221 and the second conductive layer 222 respectively cover the two opposite sides of the first matrix layer 223. The capacitor-resistor element 224 is located between the first conductive layer 221 and the first matrix layer 223. The first matrix layer 223 and the third substrate layer 225 are stacked. The capacitor-resistor element 224 is connected to the third substrate layer 225 through the first conductive layer 221.

[0076] It is understandable that the first conductive layer 221 and the second conductive layer 222 facilitate the connection between the capacitive and resistive element 224 and the third substrate layer 225. The first matrix layer 223, in cooperation with the first conductive layer 221, can protect the capacitive and resistive element 224 and reduce the capacitive and resistive element 224 from scratches or impacts.

[0077] In this embodiment, the capacitive and resistive element 224 can be a combination of one or more components such as capacitors and resistors 32.

[0078] In some embodiments of this application, such as Figure 7 As shown, the first conductive layer 221 is located on the side of the first matrix layer 223 that is opposite to the third substrate layer 225.

[0079] It is understandable that when the first conductive layer 221 is located on the side of the first substrate layer 223 that is away from the third substrate layer 225, the first conductive layer 221 and the first substrate layer 223 can be connected by wire bonding, plastic encapsulation or other means to form a capacitor-resistor module 22.

[0080] In some embodiments of this application, such as Figure 8 As shown, the first conductive layer 221 is located on the side of the first matrix layer 223 facing the third substrate layer 225.

[0081] It is understandable that when the first conductive layer 221 is located on the side of the first substrate layer 223 facing the third substrate layer 225, the first conductive layer 221 and the first substrate layer 223 can form a capacitor-resistor module 22 by means of copper pillar flip-chip molding or solder ball molding.

[0082] In some embodiments of this application, such as Figure 2 As shown, the battery includes a second reinforcing part 6, which is mounted on the surface of the bending section 51 where the monitoring module 2 is located. The orthographic projection of the second reinforcing part 6 on the bending section 51 at least partially overlaps with the orthographic projection of the charging and discharging module 3 on the bending section 51.

[0083] Understandably, the second reinforcing part 6 can help the circuit board 5 support the charging and discharging module 3, reduce the pressure exerted by the charging and discharging module 3 on the circuit board 5, and prevent the circuit board 5 from deforming, which in turn leads to the accumulation of heat generated by the current.

[0084] In some embodiments of this application, the charging / discharging module 3 and the connector 4 are located on the same side of the bending section 51, and the orthographic projection of the charging / discharging module 3 onto the battery cell 1 and the orthographic projection of the connector 4 onto the battery cell 1 are both located within the orthographic projection of the circuit board 5 onto the battery cell 1.

[0085] It is understandable that the projection of the charging / discharging module 3 onto the battery cell 1 and the projection of the connector 4 onto the battery cell 1 are both located within the projection of the circuit board 5 onto the battery cell 1. This allows the connector 4 to make full use of the space at the head of the battery cell 1 when connected to other electrical devices, thereby reducing the space requirements.

[0086] A second aspect of this application provides an electrical device that includes a battery as described above.

[0087] It is understood that, due to the use of the battery in the above embodiments, the electrical device of this application has the same technical effects as the above embodiments, and will not be described again here.

[0088] In the embodiments of this application, the electrical device can be a mobile phone, tablet computer, laptop computer, or other products.

[0089] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0090] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.

[0091] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A battery, characterized in that, The battery includes a cell (1), a functional module, a connector (4), and a circuit board (5), wherein, The battery cell (1) is connected to the circuit board (5) and forms an overlapping surface; The circuit board (5) has a bent section (51) that extends away from the overlapping surface and the extending direction of the bent section (51) intersects the overlapping surface. The functional module and the connector (4) are both installed on the bending section (51) and connected to the bending section (51); The functional module and the connector (4) are located on the same side of the bent section (51).

2. The battery according to claim 1, characterized in that, The functional module includes a charging and discharging module (3), which is closer to the battery cell (1) than the connector (4).

3. The battery according to claim 1, characterized in that, The battery cell (1) has a tab (11) located on one side of the battery cell (1). The tab (11) is connected to the circuit board (5) and forms the overlapping surface. The overlapping surface is parallel to the surface where the tab (11) of the battery cell (1) is located.

4. The battery according to claim 3, characterized in that, The battery includes a first reinforcing part (7), which is attached to the side of the circuit board (5) opposite to the tab (11).

5. The battery according to claim 2, characterized in that, The charging / discharging module (3) includes a first substrate layer (31), a resistor (32), and a MOSFET (33). One side of the first substrate layer (31) is connected to the bent section (51). The resistor (32) is located on the side of the first substrate layer (31) opposite to the bent section (51) and is connected to the bent section (51). The MOSFET (33) is located inside the first substrate layer (31) and is connected to the first substrate layer (31). or, The MOS transistor (33) is located on the side of the first substrate layer (31) connected to the bent section (51) and is connected to the first substrate layer (31).

6. The battery according to claim 5, characterized in that, The first substrate layer (31) includes a copper plating layer (311) and an insulating layer (312). A plurality of copper plating layers (311) are stacked, and two adjacent copper plating layers (311) are connected through the insulating layer (312). At least one of the copper plating layers (311) has a cavity (31101), and the insulating layer (312) adjacent to the copper plating layer (311) with the cavity (31101) has a through hole (31201). The MOS transistor (33) is located in the cavity (31101) and is connected to the adjacent copper plating layer (311) through the through hole (31201).

7. The battery according to claim 2, characterized in that, The functional module includes a monitoring module (2), which is located on opposite sides of the bending section (51) and the connector (4). The monitoring module (2) is connected to the bending section (51).

8. The battery according to claim 7, characterized in that, The monitoring module (2) includes a monitoring chip (21) and a capacitive resistor module (22), wherein the capacitive resistor module (22) connects the monitoring chip (21) and the bending section (51).

9. The battery according to claim 8, characterized in that, The monitoring chip (21) includes a die layer (211), an interposer layer (212), and a second substrate layer (213), which are stacked and connected in sequence.

10. The battery according to claim 9, characterized in that, The bare die layer (211) includes a first bare die (2111) and a second bare die (2112), wherein the substrate of the interposer layer (212) is glass, and the first bare die (2111) and the second bare die (2112) are respectively connected to the side of the interposer layer (212) opposite to the second substrate layer (213). or, The interposer layer (212) includes a first sublayer (2121) and a second sublayer (2122), the first sublayer (2121) connecting the first die (2111) and the second substrate layer (213), and the second sublayer (2122) connecting the second die (2112) and the second substrate layer (213).

11. The battery according to claim 9, characterized in that, The monitoring chip (21) includes a packaging section (214) which covers the interposer layer (212) and the die layer (211).

12. The battery according to claim 8, characterized in that, The capacitor-resistor module (22) includes a first conductive layer (221), a second conductive layer (222), a first matrix layer (223), a capacitor-resistor element (224), and a third substrate layer (225). The first conductive layer (221) and the second conductive layer (222) respectively cover the two opposite sides of the first matrix layer (223). The capacitor-resistor element (224) is located between the first conductive layer (221) and the first matrix layer (223). The first matrix layer (223) and the third substrate layer (225) are stacked together. The capacitor-resistor element (224) is connected to the third substrate layer (225) through the first conductive layer (221).

13. The battery according to claim 12, characterized in that, The first conductive layer (221) is located on the side of the first matrix layer (223) facing away from the third substrate layer (225). or, The first conductive layer (221) is located on the side of the first matrix layer (223) facing the third substrate layer (225).

14. The battery according to claim 7, characterized in that, The battery includes a second reinforcing part (6), which is mounted on the side of the bending section (51) where the monitoring module (2) is located. The orthographic projection of the second reinforcing part (6) on the bending section (51) at least partially overlaps with the orthographic projection of the charging and discharging module (3) on the bending section (51).

15. The battery according to claim 2, characterized in that, The charging / discharging module (3) and the connector (4) are located on the same side of the bending section (51). The orthographic projection of the charging / discharging module (3) on the cell (1) and the orthographic projection of the connector (4) on the cell (1) are both located within the orthographic projection of the circuit board (5) on the cell (1).

16. An electrical appliance, characterized in that, The electrical device includes a battery as described in any one of claims 1 to 15.

Images