Antenna structure and electronic device

Abstract

An antenna structure and an electronic device, the antenna structure comprising a substrate assembly, a first metal structure, a second metal structure, a third metal structure, a plastic encapsulation material structure, and a plating layer. The first metal structure, the second metal structure, and the third metal structure are disposed on the substrate assembly. The third metal structure and the second metal structure are on the same side of the first metal structure. The second metal structure and the third metal structure are oppositely disposed. The plastic encapsulation material structure is disposed on the first metal structure, the second metal structure, and the third metal structure. The plating layer is disposed on part of the surface of the plastic encapsulation material structure. The second metal structure and the third metal structure are configured to receive antenna signals and transmit signals through the antenna structure, forming a dual-polarized dielectric resonant antenna, and a single antenna device can provide an effective broadband range of 24GHz-43.5GHz.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and more particularly to an antenna structure and an electronic device. Background Technology

[0002] As mobile communication networks have evolved to the current 5G era, in order to expand more bandwidth for the ever-developing digital applications, the practical application and popularization of the FR2 millimeter wave band is also quite important, in addition to the limited bandwidth of FR1 sub-6GHz.

[0003] In mobile devices, 5G millimeter-wave modules are typically designed as antenna-in-package (AiP) antennas, with the antenna array placed on the circuit layer beneath the module's substrate, implemented as a patch antenna to save cost and size. However, AiP antennas suffer from drawbacks such as poor antenna efficiency and effective bandwidth, and are usually single-band designs. Summary of the Invention

[0004] The purpose of this application is to provide an antenna structure and electronic device, in which a single antenna device can provide an effective broadband range of 24GHz to 43.5GHz, meeting the requirements of 5G millimeter wave bands n257, n258, n259, n260, and n261.

[0005] The technical solution provided by this invention is as follows: An antenna structure, comprising: Substrate assembly; The first metal structure is disposed on the substrate assembly; The second metal structure is disposed on the substrate assembly and located on one side of the first metal structure; A third metal structure is disposed on the substrate assembly. The third metal structure and the second metal structure are both located on the same side of the first metal structure, and the second metal structure and the third metal structure are disposed opposite to each other. A molding compound structure is disposed on a first metal structure, a second metal structure, and a third metal structure; and A coating layer is applied to a portion of the surface of the molding compound structure; Both the second and third metal structures are configured to receive antenna signals and transmit signals through the antenna structure.

[0006] In some embodiments, the first metal structure is a triangular metal structure, and the second and third metal structures are both bent metal structures; the second metal structure includes a first bent portion and a second bent portion, the first bent portion is connected to the second bent portion, the first bent portion and the second bent portion include a first included angle, and the first bent portion is disposed on the substrate assembly; the third metal structure is a mirror-symmetric structure of the second metal structure; The molding compound structure has an open surface on the side near the first metal structure, and the open surface is planar and perpendicular to the substrate assembly.

[0007] In some embodiments, the substrate assembly includes a first power supply stripline and a second power supply stripline, the first power supply stripline being connected to one side of a second metal structure and the second power supply stripline being connected to one side of a third metal structure.

[0008] In some embodiments, the molding compound structure includes a plurality of molding compound surfaces, and at least three of the plurality of molding compound surfaces are not provided with a coating layer.

[0009] In some embodiments, the second bend of the second metal structure includes a first uncovered surface on which the encapsulating material structure does not cover; and the third metal structure includes a second uncovered surface on which the encapsulating material structure does not cover.

[0010] In some embodiments, the molding compound structure includes a first molding portion, a second molding portion, and a third molding portion, wherein the second molding portion and the third molding portion are both connected to the first molding portion, and the second molding portion and the third molding portion are disposed opposite to each other and separated by a molding interval distance; The first encapsulation portion covers the first metal structure and has an open surface. The second encapsulation portion covers the second metal structure. The third encapsulation portion covers the third metal structure. The first encapsulation portion is a shield-shaped encapsulation structure. The second encapsulation portion is an L-shaped encapsulation structure. The third encapsulation portion is an inverted L-shaped encapsulation structure. The triangular bevel of the first metal structure faces the open surface of the first encapsulation portion of the encapsulation material structure.

[0011] In some embodiments, the substrate assembly includes a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board, wherein the first circuit board is disposed on the second circuit board, the second circuit board is disposed on the third circuit board, and the third circuit board is disposed on the fourth circuit board. The substrate assembly also includes multiple ground metal vias, a first signal metal via, a second signal metal via, a first signal pad, and a second signal pad, which are respectively disposed on both sides of the first feed end stripline and the second feed end stripline. The first feed end stripline is connected to the second metal structure through the first signal metal via and the first signal pad, and the second feed end stripline is connected to the third metal structure through the second signal metal via and the second signal pad. Both the first feed end stripline and the second feed end stripline are used to receive antenna signals.

[0012] In some embodiments, the first molding portion of the molding material structure further includes a first top surface, a second top surface, a first upper inclined surface, a second upper inclined surface, a first side surface, a second side surface, a third side surface, a fourth side surface, a fifth side surface, a sixth side surface, and a back surface. A first top surface, a second top surface, a first upper inclined surface, and a second upper inclined surface are arranged adjacently, with the first top surface located on one side of the second top surface. The first upper inclined surface and the second upper inclined surface are respectively located on both sides of the first top surface and the second top surface. A first side surface, a second side surface, and a first upper inclined surface are arranged adjacently. A third side surface is located on one side of the second side surface, with the first side surface located on one side of the second side surface and adjacent to the first upper inclined surface. A fourth side surface, a fifth side surface, and a second upper inclined surface are arranged adjacently. A sixth side surface is located on one side of the fifth side surface, with the fourth side surface located on one side of the fifth side surface and adjacent to the second upper inclined surface. A back surface is located between the second molding portion and the third molding portion. The coating layer is not applied to the opening surface of the first plastic seal, the second side surface, or the fifth side surface.

[0013] In some embodiments, the molding compound structure includes a molding compound height, a molding compound width, and a molding compound thickness. The molding compound height is 4.8 mm, the molding compound width is 5.6 mm, and the molding compound thickness is 3.3 mm. The first included angle of the second metal structure is 135 degrees. The first top surface includes a first top surface width and a first top surface thickness. The first top surface width is 4 mm, and the first top surface thickness is 0.748 mm. The first side surface includes a first side surface width of 0.8 mm. The second side surface is a trapezoidal side surface, including a first side surface height of 4 mm. The third side surface is also a trapezoidal side surface and is disposed adjacent to the second side surface.

[0014] In some embodiments, the second molding portion includes a second molding height, a second molding width, a second molding thickness, a second molding top surface width, and a second molding side surface height. The second molding height is 2.6 mm, the second molding width is 2.5 mm, the second molding thickness is 2.1 mm, the second molding top surface width is 0.4 mm, and the second molding side surface height is 0.5 mm. The third sealing portion includes a third sealing height, a third sealing width, a third sealing thickness, a third sealing top surface width, and a third sealing side surface height. The third sealing height is 2.6 mm, the third sealing width is 2.5 mm, the third sealing thickness is 2.1 mm, the third sealing top surface width is 0.4 mm, and the third sealing side surface height is 0.5 mm.

[0015] In some embodiments, the first metal structure includes a first metal thickness, a first metal length, and a first metal height. The first metal length is 1.0 mm, the first metal height is 1.0 mm, and the first metal thickness is 0.6 mm. The upper side of the first metal structure also includes a triangular upper surface, and one side of the first metal structure also includes a triangular front surface. The width of the upper surface of the triangular upper surface is 0.1 mm, and the height of the front surface of the triangular front surface is 0.1 mm. The first bending portion of the second metal structure includes a first bending length, a first bending width, and a first bending height. The second bending portion includes a second bending length, a second bending width, and a second bending thickness. The first bending length is 0.4 mm, the first bending width is 0.3 mm, the first bending height is 0.462 mm, the second bending length is 1.2 mm, the second bending width is 0.3 mm, and the second bending thickness is 0.6 mm. The second bending portion is disposed on the first bending portion, and the second bending portion and the first bending portion are arranged in a T-shape. The second bending portion and the first bending portion include a first connecting portion. The second bending portion includes a first bending interval distance and a second bending interval distance. The first bending interval distance is 0.2 mm, the second bending interval distance is 0.6 mm, the distance between the lower edge of the second bending portion and the first connecting portion is 0.0724 mm, the second bending interval distance is close to the opening surface of the first plastic seal portion, and the first bending interval distance is far away from the opening surface of the first plastic seal portion.

[0016] This application also provides an electronic device, including: case; Device circuit board; and In any of the above embodiments, the antenna structure is disposed on a device circuit board, the device circuit board is disposed in a housing, and the opening surface of the antenna structure faces one direction.

[0017] The technical advantages of this application are as follows: In this application, both the second and third metal structures can be used to receive antenna signals and transmit signals through the antenna structure, forming a dual-polarized dielectric resonant antenna. This allows a single antenna device to provide an effective broadband range of 24GHz to 43.5GHz, meeting the requirements of 5G millimeter-wave bands n257, n258, n259, n260, and n261. Moreover, the dielectric loss of the dual-polarized dielectric resonant antenna is inherently lower than that of a typical patch antenna, and this advantage becomes more pronounced at higher frequencies. Furthermore, the antenna structure in this application only requires an SMT (Surface Mount Technology) metal structure, an epoxy molding material structure, and a coating layer to fabricate. Its simple structure and small footprint facilitate the configuration of multiple antenna devices together to form an antenna array. Attached Figure Description

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: Figure 1 This is a schematic diagram of the antenna structure provided in Embodiment 1 of this application; Figure 2 This is a top view of the antenna structure provided in Embodiment 1 of this application; Figure 3 This is a side view of the antenna structure provided in Embodiment 1 of this application; Figure 4 This is a schematic diagram of the encapsulation material structure provided in Embodiment 1 of this application; Figure 5 This is a schematic diagram of the first metal structure provided in Embodiment 1 of this application; Figure 6 This is a schematic diagram of the second metal structure provided in Embodiment 1 of this application; Figure 7 This is a front view of the second metal structure provided in Embodiment 1 of this application; Figure 8 This is a partial structural schematic diagram of the antenna structure provided in Embodiment 1 of this application; Figure 9 This is a rear view of the antenna structure provided in Embodiment 1 of this application; Figure 10 This is a schematic diagram of the first layer circuit board of the substrate assembly provided in Embodiment 1 of this application; Figure 11 This is a schematic diagram of the second-layer circuit board of the substrate assembly provided in Embodiment 1 of this application; Figure 12 This is a schematic diagram of the third-layer circuit board of the substrate assembly provided in Embodiment 1 of this application; Figure 13This is a diagram of the S-parameters (scattering parameters) of the antenna structure provided in Embodiment 1 of this application; Figure 14 This is a schematic diagram of the isolation between the two orthogonally polarized feed points (SL1 and SL2) of the antenna structure provided in Embodiment 1 of this application; Figure 15 This is a peak gain diagram of the H-plane (magnetic plane) of the antenna structure provided in Embodiment 1 of this application; Figure 16 This is the peak gain diagram of the E-plane (electric plane) of the antenna structure provided in Embodiment 1 of this application; Figure 17 This is a schematic diagram of the antenna array provided in Embodiment 2 of this application; Figure 18 This is the peak gain diagram of the E-plane of the antenna array provided in Embodiment 2 of this application; Figure 19 This is the peak gain diagram of the H-plane of the antenna array provided in Embodiment 2 of this application; Figure 20 This is a schematic diagram of the antenna structure provided in Embodiment 1 of this application disposed in an electronic device.

[0019] Explanation of icon numbers: AT1: Antenna structure; CR1: Substrate assembly; SL1: First feed stripline; SL2: Second feed stripline; CT1: Coating layer; M1: First metal structure; M2: Second metal structure; M3: Third metal structure; PM1: Molding material structure; BP1: First signal pad; BP2: Second signal pad; VA: Metal via; AL1: First included angle; M21: First bend; M22: Second bend; NC1: First uncovered surface; NC2: Second uncovered surface; PM11: First molding portion; PM12: Second molding portion; PM13: Third molding portion; DB1: Molding spacing; ES: Opening surface L1: First layer circuit board; L2: Second layer circuit board; L3: Third layer circuit board; L4: Fourth layer circuit board; SVA1: First signal metal through-hole; SVA2: Second signal metal through-hole; M1W: First metal thickness; M1L: First metal length; M1H: First metal height; M1TS: Upper surface of the triangle; M1LS: Front surface of the triangle; M1TSW: Width of the upper surface; M1LSH: Height of the front surface; M21L: First bending length; M21W: First bending width; M21H: First bending height; M22L: Second bending length; M22W: Second bending width; M22T: Second bending thickness; C N1: First connecting part; PBD1: First bending interval distance; PBD2: Second bending interval distance; DX: Distance; PM1H: Height of molding structure; PM1T: Thickness of molding structure; PM1W: Width of molding structure; TS1: First top surface; TS2: Second top surface; TBS1: First upper bevel; TBS2: Second upper bevel; LS1: First side surface; LS2: Second side surface; LS3: Third side surface; LS4: Fourth side surface; LS5: Fifth side surface; LS6: Sixth side surface; BS: Back surface; TS1W: Width of first top surface; TS1T: Thickness of first top surface; LS1W: Width of first side surface; LS2H1: First connecting part; One side height; PM12BS: First bonding bevel; PM13BS: Second bonding bevel; PM12H: Second molding height; PM12W: Second molding width; PM12T: Second molding thickness; PM12TSW: Second molding top width; PM12LSH: Second molding side height; BSW: Bevel width; PM13H: Third molding height; PM13W: Third molding width; PM13T: Third molding thickness; PM13TSW: Third molding top width; PM13LSH: Third molding side height; COMM1: Antenna array; ED1: Electronic device; HS1: Housing; PCB1: Device circuit board. Detailed Implementation

[0020] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application can also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0022] To keep the drawings concise, each drawing only schematically shows the parts relevant to this application, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of the components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0023] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0024] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] In the embodiments shown in the accompanying drawings, the directional indications (such as up, down, left, right, front, and back) used to explain the structure and movement of the various components of this application are relative rather than absolute. These descriptions are appropriate when these components are in the positions shown in the drawings. If the descriptions of the positions of these components change, these directional indications also change accordingly.

[0026] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] Example 1 See Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 as well as Figure 9 . Figure 1 This is a schematic diagram of the antenna structure provided in Embodiment 1 of this application. Figure 2 This is a top view of the antenna structure provided in Embodiment 1 of this application. Figure 3 This is a side view of the antenna structure provided in Embodiment 1 of this application. Figure 4 This is a schematic diagram of the encapsulation material structure provided in Embodiment 1 of this application. Figure 5 This is a schematic diagram of the first metal structure provided in Embodiment 1 of this application. Figure 6 This is a schematic diagram of the second metal structure provided in Embodiment 1 of this application. Figure 7 This is a front view of the second metal structure provided in Embodiment 1 of this application. Figure 8 This is a partial structural schematic diagram of the antenna structure provided in Embodiment 1 of this application. Figure 9 This is a rear view of the antenna structure provided in Embodiment 1 of this application.

[0028] See Figures 1 to 4 This embodiment provides an antenna structure AT1. The antenna structure AT1 includes a substrate assembly CR1, a first metal structure M1, a second metal structure M2, a third metal structure M3, a molding compound structure PM1, and a coating layer CT1.

[0029] A first metal structure M1 is disposed on the substrate assembly CR1. A second metal structure M2 is also disposed on the substrate assembly CR1, located on one side of the first metal structure M1. A third metal structure M3 is disposed on the substrate assembly CR1. The third metal structure M3 and the second metal structure M2 are both located on the same side of the first metal structure M1, and the second metal structure M2 and the third metal structure M3 are arranged opposite each other. That is to say, the first metal structure M1, the second metal structure M2, and the third metal structure M3 are respectively disposed at the three vertices of a triangle.

[0030] A molding compound structure PM1 is disposed on a first metal structure M1, a second metal structure M2, and a third metal structure M3. A coating layer CT1 is disposed on a portion of the surface of the molding compound structure PM1. In this embodiment, the coating layer CT1 can be fabricated using a metal sputtering process, a vapor deposition process, or other coating processes. Both the second metal structure M2 and the third metal structure M3 are configured to receive antenna signals and transmit signals through the antenna structure AT1.

[0031] The first metal structure M1 is a triangular metal structure. The second metal structure M2 and the third metal structure M3 are both bent metal structures.

[0032] The second metal structure M2 includes a first bent portion M21 and a second bent portion M22. The first bent portion M21 connects to the second bent portion M22. A first included angle AL1 exists between the first bent portion M21 and the second bent portion M22. Furthermore, the first bent portion M21 is fixedly disposed on the substrate assembly CR1. In this embodiment, the first included angle AL1 is preferably set at 135 degrees. That is, the second bent portion M22 is inclined to one side at a 45-degree angle relative to the substrate assembly CR1.

[0033] The third metal structure M3 is a mirror image of the second metal structure M2, and their dimensions are approximately the same. The only difference is the direction of inclination between the third metal structure M3 and the second metal structure M2. The dimensional designations are relative; the dimensions of the mirror-symmetric third metal structure M3 are the same as those of the second metal structure M2. In other words, when the second metal structure M2 and the third metal structure M3 are bent, they will together form an angle close to ninety degrees.

[0034] The surface of the molding compound structure PM1 closest to the first metal structure M1 is an open surface. This open surface is planar and approximately perpendicular to the substrate assembly CR1.

[0035] The substrate assembly CR1 includes a first feed stripline SL1 and a second feed stripline SL2. The first feed stripline SL1 is connected to one side of the second metal structure M2. The second feed stripline SL2 is connected to one side of the third metal structure M3.

[0036] See Figure 1 , Figure 3 as well as Figure 4 The molding material structure PM1 includes multiple molding material surfaces, and at least three of the multiple molding material surfaces included in the molding material structure PM1 do not have a coating layer CT1.

[0037] Specifically, the second bend M22 of the second metal structure M2 includes a first uncovered surface NC1. The molding compound structure PM1 does not cover the first uncovered surface NC1 of the second bend M22 of the second metal structure M2. Conversely, the third metal structure M3 also includes a second uncovered surface NC2. The molding compound structure PM1 does not cover the second uncovered surface NC2 of the third metal structure M3.

[0038] See Figure 1The molding compound structure PM1 includes a first molding portion PM11, a second molding portion PM12, and a third molding portion PM13. Both the second molding portion PM12 and the third molding portion PM13 are connected to the first molding portion PM11. The second molding portion PM12 and the third molding portion PM13 are disposed opposite each other and separated by a molding interval DB1. The first molding portion PM11 covers the first metal structure M1 and has the aforementioned open surface. The second molding portion is disposed on the second metal structure M2. The third molding portion PM13 is disposed on the third metal structure M3. The first molding portion PM11 is a shield-shaped molding structure. The second molding portion PM12 is an L-shaped molding structure. Conversely, the third molding portion PM13 is an inverted L-shaped molding structure.

[0039] See Figure 5 The triangular bevel of the first metal structure M1 faces the opening surface ES of the first encapsulation part PM11 of the encapsulation material structure PM1.

[0040] See Figure 3 as well as Figures 10 to 12 The substrate assembly CR1 includes a first circuit board L1, a second circuit board L2, a third circuit board L3, and a fourth circuit board L4. The first circuit board L1 is disposed on the second circuit board L2. The second circuit board L2 is disposed on the third circuit board L3. The third circuit board L3 is disposed on the fourth circuit board L4. The substrate assembly CR1 also includes multiple ground metal vias VA, a first signal metal via SVA1, a second signal metal via SVA2, a first signal pad BP1, and a second signal pad BP2. The first signal pad BP1 and the second signal pad BP2 are respectively disposed on both sides of the first feed stripline SL1 and the second feed stripline SL2. The first feed stripline SL1 is connected to the second metal structure M2 through the first signal metal via SVA1 and the first signal pad BP1. The second feed stripline SL2 is connected to the third metal structure M3 through the second signal metal via SVA2 and the second signal pad BP2. Both the first feed stripline SL1 and the second feed stripline SL2 are used to receive antenna signals. In this embodiment, the fourth circuit board L4 is a ground plane and is therefore not shown in the accompanying drawings.

[0041] See Figure 5In this embodiment, the first metal structure M1 includes a first metal thickness M1W, a first metal length M1L, and a first metal height M1H. The first metal length M1L is 1.0 mm, the first metal height M1H is 1.0 mm, and the first metal thickness M1W is 0.6 mm. The upper side of the first metal structure M1 also includes a triangular upper surface M1TS, and one side of the first metal structure M1 also includes a triangular front surface M1LS. The upper surface width M1TSW of the triangular upper surface M1TS is 0.1 mm, and the front surface height M1LSH of the triangular front surface M1LS is 0.1 mm.

[0042] See Figure 6 as well as Figure 7 The first bending portion M21 of the second metal structure M2 includes a first bending length M21L, a first bending width M21W, and a first bending height M21H. The second bending portion M22 includes a second bending length M22L, a second bending width M22W, and a second bending thickness M22T. The first bending length M21L is 0.4 mm, the first bending width M21W is 0.3 mm, and the first bending height M21H is 0.462 mm. The second bending length M22L is 1.2 mm, the second bending width M22W is 0.3 mm, and the second bending thickness M22T is 0.6 mm. The second bending portion M22 is disposed on the first bending portion M21. The second bending portion M22 and the first bending portion M21 are arranged in a T-shape. A first connecting portion CN1 is included between the second bending portion M22 and the first bending portion M21. The second bending portion M22 includes a first bending interval PBD1 and a second bending interval PBD2. The first bending interval PBD1 is 0.2 mm, and the second bending interval PBD2 is 0.6 mm. The distance DX between the lower edge of the second bending portion M22 and the first connecting portion CN1 is 0.0724 mm. The second bending interval PBD2 is closer to the opening surface ES of the first molding portion PM11, while the first bending interval PBD1 is farther away from the opening surface ES of the first molding portion PM11.

[0043] See Figure 2 as well as Figure 3 The molding compound structure PM1 includes a molding compound height PM1H, a molding compound thickness PM1T, and a molding compound width PM1W. The molding compound height PM1H is 4.8 mm. The molding compound thickness PM1T is 3.3 mm. The molding compound width PM1W is 5.6 mm.

[0044] See Figures 2 to 4The first encapsulation part PM11 of the encapsulation material structure PM1 includes an opening surface ES, a first top surface TS1, a second top surface TS2, a first upper inclined surface TBS1, a second upper inclined surface TBS2, a first side surface LS1, a second side surface LS2, a third side surface LS3, a fourth side surface LS4, a fifth side surface LS5, a sixth side surface LS6, a back surface BS, and a bottom surface (not shown).

[0045] The first top surface TS1, the second top surface TS2, the first upper inclined surface TBS1, and the second upper inclined surface TBS2 are arranged adjacent to each other. The first top surface TS1 is located on one side of the second top surface TS2. The first upper inclined surface TBS1 and the second upper inclined surface TBS2 are respectively located on both sides of the first top surface TS1 and the second top surface TS2.

[0046] The first side LS1, the second side LS2, and the first upper inclined surface TBS1 are arranged adjacent to each other. The third side LS3 is located on one side of the second side LS2. The first side LS1 is located on one side of the second side LS2 and is adjacent to the first upper inclined surface TBS1.

[0047] The fourth side LS4, the fifth side LS5, and the second upper inclined surface TBS2 are arranged adjacent to each other. The sixth side LS6 is disposed on one side of the fifth side LS5, and the fourth side LS4 is disposed on one side of the fifth side LS5 and adjacent to the second upper inclined surface TBS2. In this embodiment, the coating layer CT1 is not disposed on the opening surface ES, the second side LS2, and the fifth side LS5. In addition, the back surface BS is disposed between the second molding portion PM12 and the third molding portion PM13.

[0048] See Figures 3 to 5 The first top surface TS1 includes a first top surface width TS1W and a first top surface thickness TS1T. The first top surface width TS1W is 4 mm. The first top surface thickness TS1T is 0.748 mm. The first side surface LS1 includes a first side surface width LS1W. The first side surface width LS1W is 0.8 mm. The second side surface LS2 is a trapezoidal side surface, including a first side surface height LS2H1. The first side surface height LS2H1 is 4 mm. The third side surface LS3 is also a trapezoidal side surface, and is disposed adjacent to the second side surface LS2. The bottom surface (not shown) of the first molding portion PM11 is in contact with the substrate assembly CR1.

[0049] See Figure 2 , Figure 3 as well as Figure 8The second molding portion PM12 also includes a first joining bevel PM12BS. The first joining bevel PM12BS is disposed between the L-shaped structures of the second molding portion PM12. The second molding portion PM12 includes a second molding height PM12H, a second molding width PM12W, a second molding thickness PM12T, a second molding top surface width PM12TSW, and a second molding side surface height PM12LSH. The second molding height PM12H is 2.6 mm, the second molding width PM12W is 2.5 mm, the second molding thickness PM12T is 2.1 mm, the second molding top surface width PM12TSW is 0.4 mm, and the second molding side surface height PM12LSH is 0.5 mm. The first joining bevel PM12BS includes a bevel width BSW. The bevel width BSW is 2.27 mm.

[0050] Conversely, the third molding portion PM13 includes a second joining bevel PM13BS. The second joining bevel PM13BS is disposed between the inverted L-shaped structures of the third molding portion PM13. The third molding portion PM13 includes a third molding height PM13H, a third molding width PM13W, a third molding thickness PM13T, a third molding top surface width PM13TSW, and a third molding side surface height PM13LSH. The third molding height PM13H is 2.6 mm, the third molding width PM13W is 2.5 mm, the third molding thickness PM13T is 2.1 mm, the third molding top surface width PM13TSW is 0.4 mm, and the third molding side surface height PM13LSH is 0.5 mm. The second joining bevel PM13BS also includes a bevel width BSW. The bevel width BSW is 2.27 mm.

[0051] See Figure 10 , Figure 11 and Figure 12 . Figure 10 This is a schematic diagram of the first layer circuit board of the substrate assembly provided in Embodiment 1 of this application. Figure 11 This is a schematic diagram of the second-layer circuit board of the substrate assembly provided in Embodiment 1 of this application. Figure 12 This is a schematic diagram of the third-layer circuit board of the substrate assembly provided in Embodiment 1 of this application.

[0052] The substrate assembly CR1 comprises four circuit boards. The topmost first circuit board L1 has a first metal structure M1, a second metal structure M2, a third metal structure M3, a molding compound structure PM1, and a coating layer CT1. Multiple metal vias VA are disposed between the first, second, and third circuit boards L1, located on either side of the first feed stripline SL1 and the second feed stripline SL2 in the third circuit board L3. Antenna signals can be transmitted through the first signal metal via SVA1 and the second signal metal via SVA2 to the first signal pad BP1 and the second signal pad BP2 on the first circuit board L1 of the substrate assembly CR1, respectively. In this embodiment, the first signal pad BP1 is in contact with the second metal structure M2, and the second signal pad BP2 is in contact with the third metal structure M3. Therefore, the two sets of antenna signals are transmitted through the second metal structure M2 and the third metal structure M3 to the side of the opening surface ES of the molding compound structure PM1 where the coating layer CT1 is not located. The electric field signal of the antenna signal will be converted from the folded shape to the 45-degree polarization direction of the substrate assembly CR1 and radiated into the air.

[0053] Current millimeter-wave packaged antennas are mostly only suitable for single frequency bands, thus limiting bandwidth. To meet the requirements of multiple frequency bands in 5G millimeter-wave, at least two antenna units are needed (e.g., two antenna units for 28GHz and 39GHz). However, in this embodiment, the antenna structure AT1 only needs to be designed as a dual-polarized dielectric resonant antenna (DRA) using plastic encapsulation and vacuum sputtering. A single antenna device can provide an effective bandwidth of 24GHz to 43.5GHz, thereby meeting the requirements of 5G millimeter-wave bands n257, n258, n259, n260, and n261, and providing performance superior to common millimeter-wave packaged antennas.

[0054] Furthermore, the first metal structure M1 is made of a metal material (such as copper) and can be surface-mounted (SMT) with the substrate assembly CR1 to perform an SMT process, thereby placing the first metal structure M1 on one side of the open surface of the antenna structure AT1, improving the return loss of the signal feed and the isolation between the signals of the two fed antennas.

[0055] In addition, when the coating layer CT1 is applied to the surface of the encapsulated material structure PM1, three sides are left uncovered. Combined with the shape of the encapsulated material structure PM1, the electric field of the two feed antenna signals can be guided to change from a folded shape to a ±45 degree orthogonal polarization shape.

[0056] Furthermore, in the detailed dimensions of the first metal structure M1, the second metal structure M2, the third metal structure M3, and the encapsulation material structure PM1, the encapsulation material structure PM1 can be made of a material with a dielectric constant of 5 (Dk=5), or a material with a dielectric constant (Dk) between 4 and 7. The dimensions of the first metal structure M1, the second metal structure M2, the third metal structure M3, and the encapsulation material structure PM1 can also be adjusted proportionally according to 1 / √(Dk / 5).

[0057] In this embodiment, the antenna structure AT1 radiates in an axial direction, which is beneficial for the installation and configuration of the millimeter-wave module on the mobile device. The millimeter-wave module can be directly coplanar with the system substrate for system heat dissipation, significantly improving the heat dissipation performance of the millimeter-wave module. A single antenna can provide an effective bandwidth of 24GHz to 43.5GHz, meeting the requirements of 5G millimeter-wave bands n257, n258, n259, n260, and n261.

[0058] In practical applications, the dielectric loss of the DRA dielectric resonator antenna is lower than that of the patch antenna, and this advantage becomes more pronounced at higher frequencies. Furthermore, the AT1 antenna has a simple structure, requiring only epoxy molding and sputtering processes for fabrication.

[0059] In this embodiment, the antenna structure AT1 has an electric field intensity distribution. When the electromagnetic wave is transmitted, the signal enters from the feed terminal striplines SL1 and SL2 in the inner layer. The energy is transmitted to the circular signal pads BP1-BP2 through the metal through-holes VA in the inner layer of the substrate assembly CR1. It is then converted into a folded wave shape through the second metal structure M2 and the third metal structure M3, which are bent at 45 degrees. The energy is then transmitted to the air through the first bonding slope PM12BS, the second bonding slope PM13BS, the first upper slope TBS1, the second upper slope TBS2, and the encapsulation structure PM1 and the coating layer CT1. The energy is then transferred to the air at the opening surface ES of the encapsulation structure PM1.

[0060] See Figure 13 , Figure 13 This is a diagram of the S-parameters (scattering parameters) of the antenna structure provided in Embodiment 1 of this application.

[0061] Depend on Figure 13As can be seen from the S-parameter diagram, the antenna structure AT1 of this embodiment can effectively provide an effective bandwidth range of 24GHz to 43.5GHz, meeting the requirements of 5G millimeter wave bands n257, n258, n259, n260, and n261 for return loss. Moreover, the return loss is above 10dB, indicating that the antenna structure of this embodiment is very suitable for 5G millimeter wave or higher frequency band applications.

[0062] See Figure 14 , Figure 15 as well as Figure 16 . Figure 14 This is a schematic diagram of the isolation between the two orthogonally polarized feed points (SL1 and SL2) of the antenna structure provided in Embodiment 1 of this application. Figure 15 This is a peak gain diagram of the H-plane (magnetic plane) of the antenna structure provided in Embodiment 1 of this application. Figure 16 This is the peak gain diagram of the E-plane (electric plane) of the antenna structure provided in Embodiment 1 of this application.

[0063] Depend on Figure 14 It can be seen that the isolation between the two orthogonally polarized feed points can reach over 15dB, meeting the requirements of general applications. Combined with... Figure 15 , Figure 16 As shown in Table 1 below, the antenna structure AT1 in this embodiment can achieve a peak realized gain of over 6.8 dBi at 40 GHz.

[0064]

[0065] Example 2 See Figure 17 , Figure 18 as well as Figure 19 . Figure 17 This is a schematic diagram of the antenna array provided in Embodiment 2 of this application. Figure 18 This is the peak gain diagram of the E-plane of the antenna array provided in Embodiment 2 of this application. Figure 19 This is the peak gain diagram of the H-plane of the antenna array provided in Embodiment 2 of this application.

[0066] See Figure 17 Multiple antenna structures AT1 can be mounted on the substrate assembly CR1 of the antenna array COMM1. Furthermore, the antenna array COMM1 or the antenna structures AT1 can be mounted in an electronic device.

[0067] See Figure 20 , Figure 20 This is a schematic diagram of the antenna structure provided in Embodiment 1 of this application disposed in an electronic device. Figure 20 The electronic device ED1 includes at least a housing HS1 and a device circuit board PCB1. An antenna structure AT1 is mounted on the device circuit board PCB1, and the opening surface of the antenna structure AT1 faces one direction (the specific orientation can be determined according to actual needs). In other embodiments, the multiple antenna structures AT1 of the antenna array COMM1 can face different directions.

[0068] Because the single antenna structure provided in Embodiment 1 occupies a small area, it is advantageous to configure multiple antenna structures on the substrate assembly to form an antenna array. In this embodiment, the overall array length, including the substrate assembly, is 24.3 mm, which meets the size requirements of general millimeter-wave modules, and the peak realized gain at 40 GHz can reach 10.67 dBi.

[0069] The beneficial effects of this application are that the antenna device provided can provide an effective broadband range of 24GHz to 43.5GHz with a single antenna device, meeting the requirements of 5G millimeter wave bands n257, n258, n259, n260, and n261. Moreover, the dielectric loss of the antenna device itself is lower than that of typical patch antennas, and this advantage becomes more pronounced at higher frequencies. Furthermore, the antenna device provided in this application has a simple structure, requiring only an SMT metal structure, an epoxy molding material structure, and a coating layer for fabrication. It occupies a small area, which is beneficial for configuring multiple antenna devices together to form an antenna array.

[0070] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0071] It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of this application. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. An antenna structure, characterized in that, include: Substrate assembly; A first metal structure is disposed on the substrate assembly; A second metal structure is disposed on the substrate assembly and located on one side of the first metal structure; A third metal structure is disposed on the substrate assembly. The third metal structure and the second metal structure are both located on the same side of the first metal structure, and the second metal structure is disposed opposite to the third metal structure. A molding compound structure is disposed on the first metal structure, the second metal structure, and the third metal structure; as well as A coating layer is disposed on a portion of the surface of the molding compound structure; Both the second metal structure and the third metal structure are configured to receive antenna signals and transmit signals through the antenna structure.

2. The antenna structure according to claim 1, characterized in that, The first metal structure is a triangular metal structure, and the second and third metal structures are both bent metal structures; the second metal structure includes a first bent portion and a second bent portion, the first bent portion is connected to the second bent portion, and a first included angle is included between the first bent portion and the second bent portion, and the first bent portion is disposed on the substrate assembly; the third metal structure is a mirror-symmetric structure of the second metal structure. The molding compound structure has an open surface on the side near the first metal structure, and the open surface is planar and perpendicular to the substrate assembly.

3. The antenna structure according to claim 2, characterized in that, The substrate assembly includes a first power supply stripline and a second power supply stripline. The first power supply stripline is connected to one side of the second metal structure, and the second power supply stripline is connected to one side of the third metal structure.

4. The antenna structure according to claim 3, characterized in that, The molding compound structure includes multiple molding compound surfaces, and at least three of the multiple molding compound surfaces do not have the coating layer.

5. The antenna structure according to claim 4, characterized in that, The second bent portion of the second metal structure includes a first uncovered surface, on which the molding compound structure does not cover; and the third metal structure includes a second uncovered surface, on which the molding compound structure does not cover.

6. The antenna structure according to claim 5, characterized in that, The molding compound structure includes a first molding portion, a second molding portion, and a third molding portion. The second molding portion and the third molding portion are both connected to the first molding portion. The second molding portion and the third molding portion are arranged opposite to each other and are separated by a molding interval distance. The first encapsulation portion covers the first metal structure and has the opening surface; the second encapsulation portion covers the second metal structure; the third encapsulation portion covers the third metal structure; the first encapsulation portion is a shield-shaped encapsulation structure; the second encapsulation portion is an L-shaped encapsulation structure; the third encapsulation portion is an inverted L-shaped encapsulation structure; and the triangular bevel of the first metal structure faces the opening surface of the first encapsulation portion of the encapsulation material structure.

7. The antenna structure according to claim 6, characterized in that, The substrate assembly includes a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board. The first circuit board is disposed on the second circuit board, the second circuit board is disposed on the third circuit board, and the third circuit board is disposed on the fourth circuit board. The substrate assembly further includes multiple ground metal vias, a first signal metal via, a second signal metal via, a first signal pad, and a second signal pad, which are respectively disposed on both sides of the first feed end stripline and the second feed end stripline. The first feed end stripline is connected to the second metal structure through the first signal metal via and the first signal pad. The second feed end stripline is connected to the third metal structure through the second signal metal via and the second signal pad. Both the first feed end stripline and the second feed end stripline are used to receive antenna signals.

8. The antenna structure according to claim 7, characterized in that, The first molding portion of the molding material structure further includes a first top surface, a second top surface, a first upper inclined surface, a second upper inclined surface, a first side surface, a second side surface, a third side surface, a fourth side surface, a fifth side surface, a sixth side surface, and a back surface. The first top surface, the second top surface, the first upper inclined surface, and the second upper inclined surface are arranged adjacent to each other. The first top surface is disposed on one side of the second top surface, and the first upper inclined surface and the second upper inclined surface are respectively disposed on both sides of the first top surface and the second top surface. The first side surface, the second side surface, and the first upper inclined surface are arranged adjacent to each other. The third side surface is disposed on one side of the second side surface, and the first side surface is disposed on one side of the second side surface and adjacent to the first upper inclined surface. The fourth side surface, the fifth side surface, and the second upper inclined surface are arranged adjacent to each other. The sixth side surface is disposed on one side of the fifth side surface, and the fourth side surface is disposed on one side of the fifth side surface and adjacent to the second upper inclined surface. The back surface is disposed between the second molding portion and the third molding portion. The coating layer is not disposed on the opening surface, the second side surface, and the fifth side surface of the first plastic seal portion.

9. The antenna structure according to claim 8, characterized in that, The molding material structure includes a molding structure height, a molding structure width, and a molding structure thickness. The molding structure height is 4.8 mm, the molding structure width is 5.6 mm, and the molding structure thickness is 3.3 mm. The first included angle of the second metal structure is 135 degrees. The first top surface includes a first top surface width and a first top surface thickness. The first top surface width is 4 mm, and the first top surface thickness is 0.748 mm. The first side surface includes a first side surface width of 0.8 mm. The second side surface is a trapezoidal side surface, including a first side surface height of 4 mm. The third side surface is also a trapezoidal side surface and is adjacent to the second side surface.

10. The antenna structure according to claim 9, characterized in that, The second molding portion includes a second molding height, a second molding width, a second molding thickness, a second molding top surface width, and a second molding side surface height. The second molding height is 2.6 mm, the second molding width is 2.5 mm, the second molding thickness is 2.1 mm, the second molding top surface width is 0.4 mm, and the second molding side surface height is 0.5 mm. The third molding portion includes a third molding height, a third molding width, a third molding thickness, a third molding top surface width, and a third molding side surface height. The third molding height is 2.6 mm, the third molding width is 2.5 mm, the third molding thickness is 2.1 mm, the third molding top surface width is 0.4 mm, and the third molding side surface height is 0.5 mm.

11. The antenna structure according to claim 10, characterized in that, The first metal structure includes a first metal thickness, a first metal length, and a first metal height. The first metal length is 1.0 mm, the first metal height is 1.0 mm, and the first metal thickness is 0.6 mm. The upper side of the first metal structure also includes a triangular upper surface, and one side of the first metal structure also includes a triangular front surface. The width of the upper surface of the triangular upper surface is 0.1 mm, and the height of the front surface of the triangular front surface is 0.1 mm. The first bending portion of the second metal structure includes a first bending length, a first bending width, and a first bending height. The second bending portion includes a second bending length, a second bending width, and a second bending thickness. The first bending length is 0.4 mm, the first bending width is 0.3 mm, the first bending height is 0.462 mm, the second bending length is 1.2 mm, the second bending width is 0.3 mm, and the second bending thickness is 0.6 mm. The second bending portion is disposed on the first bending portion, and the second bending portion and the first bending portion are arranged in a T-shape. A first connecting portion is included between the second bending portion and the first bending portion. The second bending portion includes a first bending interval distance and a second bending interval distance. The first bending interval distance is 0.2 mm, the second bending interval distance is 0.6 mm, the distance between the lower edge of the second bending portion and the first connecting portion is 0.0724 mm, the second bending interval distance is close to the opening surface of the first plastic seal portion, and the first bending interval distance is far away from the opening surface of the first plastic seal portion.

12. An electronic device comprising: case; Device circuit board; as well as The antenna structure according to any one of claims 1-11, wherein the antenna structure is disposed on the device circuit board, the device circuit board is disposed in the housing, and the opening surface of the antenna structure faces one direction.

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