Reconfigurable frequency source

Abstract

The application provides a reconfigurable frequency source. The reconfigurable frequency source comprises a heat dissipation module and a plurality of sub-modules; the plurality of sub-modules comprises a frequency reference module, a frequency synthesis module, a gain control module, a signal distribution module and a power supply and programming control module; the plurality of sub-modules are detachably connected with the heat dissipation module; the frequency reference module is connected with the frequency synthesis module, for sending a reference frequency signal to the frequency synthesis module; the frequency synthesis module is connected with the gain control module, for receiving the reference frequency signal and synthesizing a target frequency signal through a phase-locked loop circuit; the gain control module is connected with the signal distribution module, for receiving the target frequency signal and adjusting the gain of the target frequency signal; the power supply and programming control module is connected with the frequency reference module, the frequency synthesis module and the gain control module respectively, for supplying power for the frequency reference module, the frequency synthesis module and the gain control module. The embodiment of the application improves the maintenance convenience through the modular design.

Description

Technical Field

[0001] This application relates to the field of frequency source technology, and in particular to a reconfigurable frequency source. Background Technology

[0002] In modern electronic communications, radar, satellite communications, 5G base stations, and other fields, frequency sources, as core components, play a crucial role in providing highly stable and accurate frequency signals. Current technologies for frequency sources often employ highly integrated monolithic designs or board-level integrated designs based on discrete components. Monolithic designs typically integrate core circuits such as phase-locked loops, voltage-controlled oscillators, and amplifiers into a single chip or package, enabling miniaturization and meeting the requirements for high frequency stability and low phase noise in certain scenarios. Board-level integrated designs, on the other hand, implement each functional unit discretely, allowing for customized designs to meet specific performance requirements and are suitable for scenarios demanding special specifications. Whether highly integrated monolithic designs or discrete component designs, existing frequency source technologies have, to a certain extent, driven the development of modern wireless communication systems and met the performance requirements in some scenarios.

[0003] However, in existing integrated designs, the high integration and tight coupling of functional units make it difficult to pinpoint specific problems when performance anomalies or malfunctions occur, increasing the difficulty of debugging and maintenance. Furthermore, since the functions and performance of integrated designs are fixed at the factory, they cannot be flexibly adjusted according to application requirements, limiting the system's adaptability. Moreover, if a submodule fails, the entire system usually needs to be replaced, resulting in wasted resources and increased maintenance costs. While board-level integrated designs offer some flexibility, their design cycles are long, reusability is poor, and the overall system size is large, making it difficult to meet the miniaturization and high-performance requirements of modern communication equipment. They also struggle to efficiently adapt to diverse application scenarios and cannot significantly improve debugging efficiency or reduce the total lifecycle cost. Summary of the Invention

[0004] In view of this, the purpose of this application is to propose a reconfigurable frequency source.

[0005] To achieve the above objectives, this application provides a reconfigurable frequency source, comprising: a heat dissipation module and multiple sub-modules; the multiple sub-modules include: a frequency reference module, a frequency synthesis module, a gain control module, a signal distribution module, and a power supply and programmable control module; The multiple sub-modules can be detachably connected to the heat dissipation module; The frequency reference module is connected to the frequency synthesis module and is used to send a reference frequency signal to the frequency synthesis module; The frequency synthesis module is connected to the gain control module and is used to receive the reference frequency signal and synthesize the target frequency signal through a phase-locked loop circuit. The gain control module is connected to the signal distribution module and is used to receive the target frequency signal and adjust the gain of the target frequency signal. The power supply and programmable control module is connected to the frequency reference module, the frequency synthesis module and the gain control module respectively, and is used to supply power to the frequency reference module, the frequency synthesis module and the gain control module.

[0006] In one possible implementation, the multiple sub-modules are of uniform specifications.

[0007] In one possible implementation, the plurality of sub-modules are provided with radio frequency SMA connectors in a first direction and a second direction; the first direction and the second direction are arranged opposite to each other and are located on the same straight line.

[0008] In one possible implementation, a rectangular connector is provided in a third direction for the frequency reference module, the frequency synthesis module, the gain control module, and the power supply and programmable module; the third direction is perpendicular to the first direction.

[0009] In one possible implementation, the power supply and programmable control module is electrically connected to the frequency reference module, the frequency synthesis module, and the gain control module respectively via the rectangular connector located in the third direction.

[0010] In one possible implementation, the multiple sub-modules are each physically independent.

[0011] In one possible implementation, the testing and debugging of the multiple sub-modules are performed separately.

[0012] In one possible implementation, the surface of the heat dissipation module is coated with a thermally conductive layer and is detachably connected to the plurality of sub-modules in a fourth direction.

[0013] In one possible implementation, the heat dissipation module integrates a heat pipe or liquid cooling channel.

[0014] In one possible implementation, the heat dissipation module is provided with multiple heat dissipation fins.

[0015] As can be seen from the above, the reconfigurable frequency source provided in this application includes: a heat dissipation module and multiple sub-modules; the multiple sub-modules include: a frequency reference module, a frequency synthesis module, a gain control module, a signal distribution module, and a power supply and programmable control module; the multiple sub-modules are detachably connected to the heat dissipation module; the frequency reference module is connected to the frequency synthesis module and is used to send a reference frequency signal to the frequency synthesis module; the frequency synthesis module is connected to the gain control module and is used to receive the reference frequency signal and synthesize a target frequency signal through a phase-locked loop circuit; the gain control module is connected to the signal distribution module and is used to receive the target frequency signal and adjust the gain of the target frequency signal; the power supply and programmable control module is connected to the frequency reference module, the frequency synthesis module, and the gain control module respectively, and is used to supply power to the frequency reference module, the frequency synthesis module, and the gain control module. This application embodiment, through modular design, divides multiple functional units into independent sub-modules, including a frequency reference module, a frequency synthesis module, a gain control module, a signal distribution module, and a power supply and programmable control module, each module having a clearly defined function and being independent of each other. The modules and heat dissipation module are detachably connected, enhancing system flexibility and facilitating individual testing, debugging, and replacement of each module. Compared to existing integrated frequency sources, this application's technical solution improves system maintainability and fault location efficiency, reduces the likelihood of overall system failure due to partial faults, and lowers overall lifecycle maintenance costs. Through the connection between the frequency reference module and the frequency synthesis module, this application provides a highly stable and accurate reference frequency signal to meet the reference signal requirements of the phase-locked loop circuit in the frequency synthesis module, thereby achieving accurate synthesis of the target frequency signal. The collaborative work of the gain control module and the signal distribution module further enables gain adjustment and multi-channel output capabilities for the target frequency signal, adapting to the needs of multi-channel application scenarios. The power supply and programmable control module provide independent power supply and centralized control capabilities for each submodule, achieving efficient communication and configuration management between modules through standardized interfaces. While achieving high-performance frequency signal output, this application possesses the flexibility and reconfigurability of modular design, allowing for rapid adaptation to different scenarios and performance requirements, significantly improving system development efficiency and functional expansion capabilities. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1This is a schematic diagram of the reconfigurable frequency source structure according to an embodiment of this application; Figure 2 This is a schematic block diagram of a reconfigurable frequency source system according to an embodiment of this application; Figure 3 This is a schematic diagram of a rectangular connector splitter cable according to an embodiment of this application; Figure 4 This is a schematic diagram of the frequency synthesis module structure according to an embodiment of this application. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0019] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0020] It is understood that before using the technical solutions of the various embodiments in this disclosure, users will be informed of the type, scope of use, and usage scenarios of the personal information involved in an appropriate manner, and user authorization will be obtained.

[0021] For example, upon receiving a user's active request, a prompt message is sent to the user to explicitly inform them that the requested operation will require the acquisition and use of the user's personal information. This allows the user to independently choose, based on the prompt message, whether to provide personal information to the software or hardware such as electronic devices, applications, servers, or storage media performing the operations of this disclosed technical solution.

[0022] As an optional but not limited implementation, in response to a user's active request, sending a prompt message to the user can be done via a pop-up window, where the prompt message can be presented in text format. Furthermore, the pop-up window can also include a selection control allowing the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0023] It is understood that the above notification and user authorization process are merely illustrative and do not constitute a limitation on the implementation of this disclosure. Other methods that comply with relevant laws and regulations may also be applied to the implementation of this disclosure.

[0024] As described in the background section, frequency sources, as core components in modern electronic communications, radar, satellite communications, 5G base stations, and other fields, are responsible for providing high-precision and high-stability frequency signals and are widely used in various scenarios. In existing technologies, frequency sources typically employ integrated designs or board-level integrated designs based on discrete components. Integrated designs achieve miniaturization by highly integrating functions such as phase-locked loops, voltage-controlled oscillators, and amplifiers into a single chip or package, and to some extent meet the requirements for high stability and low phase noise. Board-level integrated designs, on the other hand, achieve customization and flexibility of functional units through discrete components, making them suitable for applications with specific performance requirements. However, existing technologies also have significant shortcomings. Due to the high coupling of functional units, integrated designs make it difficult to pinpoint specific problems when performance abnormalities or failures occur, resulting in high debugging and maintenance costs. Furthermore, their fixed functions cannot flexibly adapt to diverse scenarios, and partial failures often require complete replacement, leading to resource waste. Board-level integration design suffers from problems such as long design cycles, poor reusability, and large system size, making it difficult to meet the demands of modern communication equipment for miniaturization, high performance, and rapid deployment. Therefore, it cannot effectively adapt to complex and ever-changing application scenarios, and it is also difficult to reduce the use and maintenance costs throughout the entire life cycle.

[0025] Based on the above considerations, this application proposes a reconfigurable frequency source, including: a heat dissipation module and multiple sub-modules; the multiple sub-modules include: a frequency reference module, a frequency synthesis module, a gain control module, a signal distribution module, and a power supply and programmable control module; the multiple sub-modules are detachably connected to the heat dissipation module; the frequency reference module is connected to the frequency synthesis module and is used to send a reference frequency signal to the frequency synthesis module; the frequency synthesis module is connected to the gain control module and is used to receive the reference frequency signal and synthesize a target frequency signal through a phase-locked loop circuit; the gain control module is connected to the signal distribution module and is used to receive the target frequency signal and adjust the gain of the target frequency signal; the power supply and programmable control module is connected to the frequency reference module, the frequency synthesis module, and the gain control module respectively, and is used to supply power to the frequency reference module, the frequency synthesis module, and the gain control module. This application embodiment, through modular design, divides multiple functional units into physically independent sub-modules, including a frequency reference module, a frequency synthesis module, a gain control module, a signal distribution module, and a power supply and programmable control module, each module having a clearly defined function and being detachably connected. This design significantly enhances system flexibility, allowing each submodule to be tested and debugged independently, facilitating performance verification and troubleshooting, and reducing maintenance difficulty and costs. Simultaneously, the unified module specifications and standardized interface design support rapid replacement and functional expansion, meeting diverse application needs. The heat dissipation module, through surface coating with a thermally conductive coating and detachable connections, forms an efficient heat conduction system with each submodule, ensuring stable system operation. The heat dissipation module can further enhance heat dissipation performance through integrated heat pipes or liquid cooling channels and heat sink fins, adapting to high-power consumption scenarios and extending equipment lifespan. Independent RF SMA connectors and rectangular connectors achieve efficient signal transmission and electrical connections, ensuring signal integrity and system reliability. Overall, the technical solution of this application not only achieves high-performance frequency signal output but also possesses high modularity, reconfigurability, and efficient heat dissipation performance. Its flexibility, maintainability, and high adaptability significantly reduce system development and life-cycle usage costs, providing a flexible, efficient, and stable frequency source solution for modern communications, radar, 5G base stations, and other fields.

[0026] The technical solutions of the embodiments of this application will be described in detail below through specific examples.

[0027] refer to Figure 1The reconfigurable frequency source of this application embodiment includes: a heat dissipation module 3 and multiple sub-modules; the multiple sub-modules include: a frequency reference module 4, a frequency synthesis module 5, a gain control module 6, a signal distribution module 7, and a power supply and programmable control module 8; the multiple sub-modules are detachably connected to the heat dissipation module 3; the frequency reference module is connected to the frequency synthesis module and is used to send a reference frequency signal to the frequency synthesis module; the frequency synthesis module is connected to the gain control module and is used to receive the reference frequency signal and synthesize a target frequency signal through a phase-locked loop circuit; the gain control module is connected to the signal distribution module and is used to receive the target frequency signal and adjust the gain of the target frequency signal; the power supply and programmable control module is connected to the frequency reference module, the frequency synthesis module, and the gain control module respectively, and is used to supply power to the frequency reference module, the frequency synthesis module, and the gain control module.

[0028] refer to Figure 1 The reconfigurable frequency source module consists of a system chassis 1, a chassis cover 2, a heat dissipation module 3, a frequency reference module 4, a frequency synthesis module 5, a gain control module 6, a signal distribution module 7, a power supply and programmable control module 8, and semi-steel RF cables 9. The system chassis 1 is internally divided into five areas, with the frequency reference module 4, frequency synthesis module 5, gain control module 6, signal distribution module 7, and power supply and programmable control module 8 arranged sequentially. Each module transmits signals via customized semi-steel RF cables 9, ensuring low loss and high integrity of the RF signal during transmission. The power supply and programmable control module 8 serves as the core control unit, through... Figure 3 The J30J series rectangular connector shown connects to the frequency reference module 4, frequency synthesis module 5, and gain control module 6 via a 1-to-3 splitter cable, providing power and control signals. The heat dissipation module 3 is installed at the bottom of the system chassis 1, and its efficient heat conduction with the bottoms of each submodule is achieved through the application of thermal grease, ensuring stable system operation under high power consumption conditions.

[0029] In some embodiments, the multiple sub-modules are of uniform specifications.

[0030] In some embodiments, the plurality of sub-modules are provided with radio frequency SMA connectors in a first direction and a second direction; the first direction and the second direction are arranged opposite to each other and are located on the same straight line.

[0031] In some embodiments, a rectangular connector is provided in a third direction of the frequency reference module, the frequency synthesis module, the gain control module, and the power supply and programmable module; the third direction is perpendicular to the first direction.

[0032] In some embodiments, the power supply and programmable control module is electrically connected to the frequency reference module, the frequency synthesis module and the gain control module respectively via the rectangular connector disposed on the third direction.

[0033] In some embodiments, the plurality of submodules are physically independent.

[0034] In some embodiments, the testing and debugging of the plurality of submodules are performed separately.

[0035] In some embodiments, the surface of the heat dissipation module is coated with a thermally conductive layer and is detachably connected to the plurality of sub-modules in a fourth direction.

[0036] In some embodiments, the heat dissipation module integrates heat pipes or liquid cooling channels.

[0037] In some embodiments, the heat dissipation module is provided with multiple heat dissipation fins.

[0038] refer to Figure 2 This is a schematic block diagram of a reconfigurable frequency source system according to an embodiment of this application.

[0039] refer to Figure 3 This is a schematic diagram of a rectangular connector splitter cable in an embodiment of this application.

[0040] refer to Figure 4 This is a schematic diagram of the frequency synthesis module structure in an embodiment of this application.

[0041] The heat dissipation module 3 not only serves as the mechanical support for the entire module but also provides an efficient heat dissipation path for other functional modules. The module is made of aluminum alloy or copper, and after CNC machining, its surface is anodized to enhance its thermal conductivity and corrosion resistance. The surface of the heat dissipation module is coated with a thermally conductive coating, and it makes close contact with the bottom of each functional module through the application of thermally conductive silicone grease to achieve rapid heat conduction. For high-power scenarios, heat pipes or liquid cooling channels can be integrated inside the heat dissipation module to further improve heat dissipation capacity. In addition, the heat dissipation module can also be equipped with multiple heat dissipation fins to optimize thermal management performance through natural heat dissipation or air cooling, ensuring the stability of the frequency source module during long-term operation.

[0042] Frequency reference module 4 provides the high-quality reference frequency signal required by the system and serves as the signal source for the entire frequency source module. The module includes an independent crystal oscillator unit, allowing selection of crystals with different performance characteristics, such as a temperature-compensated crystal oscillator (TCXO) or an oven-controlled crystal oscillator (OCXO), to meet requirements for phase noise or temperature stability. The module integrates a linear regulator circuit and a clock buffer drive circuit, outputting a reference frequency signal (e.g., 10MHz or 100MHz) via an RF SMA interface. The frequency reference module is designed to support independent testing and calibration; users can replace the crystal oscillator unit to adapt to the performance requirements of different scenarios.

[0043] The frequency synthesis module 5 receives the reference signal from the frequency reference module 4 and generates the required high-frequency, high-stability target frequency signal through its internal phase-locked loop (PLL) circuit. The module employs a high-performance PLL chip (such as TI's LMX2592), supporting a wide frequency range output (20MHz to 9800MHz). It receives control signals from the power supply and programmable control module 8 via an SPI interface, enabling flexible configuration of parameters such as frequency step and output range. The module design supports the replacement of PLL chips with different frequency ranges to cover application requirements in different bands, while ensuring low phase noise and high accuracy of the target frequency signal. The frequency synthesis module outputs signals through an RF SMA connector, ensuring high-quality signal transmission.

[0044] The gain control module 6 is used to adjust the power level of the output signal from the frequency synthesis module and provides good output matching and isolation. Internally, the module consists of a single-stage driver amplifier and a single-stage digitally controlled attenuator, supporting an output power range of -40dBm to 10dBm, with precise adjustment in 0.5dB steps. The module receives control signals from the power supply and programmable control module 8 via an SPI interface, enabling flexible power configuration and adjustment. Depending on actual needs, the gain control module can replace low-noise amplifiers or broadband amplifier components with different performance characteristics; for example, it can integrate a higher-power amplifier to boost the output power to over 20dBm. The module's design ensures high-quality signal transmission while supporting independent testing and debugging, facilitating fault location and performance verification.

[0045] Signal distribution module 7 is responsible for distributing the single-channel signal output from the gain control module into multiple equal-amplitude, in-phase signals to meet the needs of multi-channel systems. Internally, the module employs a Wilkinson power divider design. Its input is connected to the output of the gain control module 6 via an RF SMA connector, and its two outputs serve as the final outputs of the frequency source module via RF SMA connectors. The signal distribution module design supports replacing the power divider chip with different numbers of channels (e.g., 1 to 2, 1 to 3, etc.) according to specific application requirements, ensuring phase consistency and amplitude balance of the distributed signals, and adapting to scenarios requiring multiple signal outputs.

[0046] The power supply and programmable control module 8 provides a stable and clean power input for each functional module and enables centralized management and control of the modules through a unified programmable control interface. Internally, the module integrates multiple DC-DC converters and linear regulators to convert external input power (e.g., 12V) into the operating voltages required by each module (e.g., 5V, 3.3V, 1.8V), while possessing excellent ripple suppression and electrical isolation performance. The programmable control section is based on a microcontroller (MCU) (e.g., an ARM Cortex-M series chip), communicating with the frequency synthesis module 5 and gain control module 6 via the SPI bus, supporting functions such as frequency configuration and power adjustment. The module connects to a host computer via a USB interface to receive control parameters and monitor the operating status of each module in real time. The design of the power supply and programmable control module supports independent testing and functional expansion, ensuring the stable operation of the entire frequency source system.

[0047] The functional modules are interconnected through standardized electrical interfaces and physical connections. Radio frequency (RF) signals are transmitted via custom RF SMA connectors to ensure low signal loss and high integrity. Power and control signals are transmitted through… Figure 3 The J30J series rectangular connector shown uses a three-way splitter for data transmission. Each module has a rectangular connector on its third-way side, supporting quick plugging and unplugging and replacement of modules. The connection design between modules ensures reliable signal transmission, easy system maintenance, and convenient fault location.

[0048] refer to Figure 4 To improve the versatility of the frequency source module, all sub-modules are designed to a uniform specification. Taking frequency synthesis module 5 as an example, its structure diagram is as follows: Figure 4 As shown. Among them, 51 is the metal shielding shell, 52 is the J30J series rectangular connector, and 53 is the RF SMA connector.

[0049] refer to Figure 2 The overall structure and connection relationship of the reconfigurable frequency source module are as follows: The system main chassis 1 is divided into five areas, in which the frequency reference module 4, frequency synthesis module 5, gain control module 6, signal distribution module 7, and power supply and programmable control module 8 are placed in sequence. The modules are interconnected via semi-steel RF cables 9 to ensure low-loss and high-integrity signal transmission. The power supply and programmable control module 8 is electrically connected to the frequency reference module 4, frequency synthesis module 5, and gain control module 6 via rectangular connectors located on the third direction, providing stable power input and control signals to these modules. The entire system is enclosed by the chassis cover 2 to ensure safety during testing and the reliability of the frequency source module. The heat dissipation module 3 is installed at the bottom of the system main chassis 1 and is in close contact with the bottom of each functional module by applying thermal grease, achieving efficient heat conduction and further optimizing the system's heat dissipation performance.

[0050] The reconfigurable frequency source of this application adopts a modular design, which solves the shortcomings of existing frequency sources in terms of flexibility, maintainability, and scalability. By dividing the system functional units into physically independent sub-modules and adopting a unified specification design, each module can not only be tested and debugged independently, but also supports rapid replacement and functional expansion, thereby significantly improving fault location efficiency and system adaptability. In addition, the standardized interface design between modules ensures high-quality signal transmission and reduces RF signal loss and interference.

[0051] The optimized design of the heat dissipation module further enhances the system's reliability. Through the combined use of thermally conductive coatings, heat pipes or liquid cooling channels, and heat sink fins, the heat dissipation module can efficiently handle high-power scenarios, ensuring system stability during long-term operation. The power supply and programmable controller module, through the integration of a microcontroller (MCU), enables centralized configuration and management of the frequency synthesis module and gain control module, allowing users to monitor system status and adjust operating parameters in real time via a host computer.

[0052] The technical solution of this application is applicable to fields such as satellite communication, radar systems, and 5G base stations, and can flexibly meet the requirements of different scenarios for output frequency range, power range, and multi-channel signal distribution. For example, by replacing the crystal oscillator unit in the frequency reference module, reference signal outputs with different stability or phase noise performance can be achieved; by replacing the amplifier in the gain control module or the power divider in the signal distribution module, it can adapt to the needs of different power ranges or multi-channel output. In addition, the modular design also supports rapid product iteration and upgrades, reduces R&D costs, and extends the service life of equipment.

[0053] The reconfigurable frequency source module of this application significantly improves the system's flexibility, maintainability, and scalability through modular design and standardized interface connections, while providing high-performance frequency signal output. The efficient design of the heat dissipation module ensures stable system operation, while the centralized management capabilities of the power supply and programmable control modules further enhance the system's reliability and intelligence. This technical solution provides a flexible, efficient, and stable solution for modern communication, radar, and testing fields, fully meeting the current performance requirements of electronic systems for frequency sources, while adapting to the needs of future technological developments.

[0054] As can be seen from the above embodiments, the reconfigurable frequency source described in this application transforms the traditional frequency source from a component with fixed functions and performance into a flexible and configurable platform, significantly improving the system's engineering efficiency and adaptability. Through modular design, the frequency source system is decoupled into six clearly defined and physically independent modules: heat dissipation, frequency reference, frequency synthesis, gain control, signal distribution, and power supply and programmable control. Interconnection and control between modules are achieved through a unified, standardized electrical interface. This design enables "plug-and-play" functionality, supports parallel debugging and fault location, significantly shortens the development cycle, and reduces maintenance difficulty and cost. The flexibility of the modules allows the system to be quickly configured to adapt to different scenario requirements by replacing different functional modules, such as low phase noise, high power, or multi-channel applications, thereby improving the device's versatility and reducing the cost of developing multiple models. Compared to existing technologies, the modular architecture of this invention offers multifunctional independence, allowing each module to undergo independent performance testing and debugging, precisely isolating problems and improving debugging efficiency. Each module can be used as an independent unit, such as a clock source, amplifier, or power divider, enhancing its independence. Furthermore, modules can be flexibly replaced according to performance, cost, or usage scenario requirements, further improving the system's adaptability. Traditional frequency sources typically employ monolithic integrated circuits or system-in-package (SiP) technology, highly integrating functional units into a single chip or package. This design, due to high coupling of functional units and closed ports, leads to difficulties in debugging and troubleshooting, and its fixed functionality results in high maintenance costs. Another option, board-level integration customization based on discrete components, suffers from long design cycles, poor reusability, and insufficient flexibility. This invention, through its modular architecture, achieves a fundamental upgrade of the frequency source from a "fixed-function device" to a "reconfigurable platform." Physical isolation between modules reduces crosstalk, optimizes system performance, while shielding and heat dissipation designs ensure long-term module stability and reduce overall lifecycle usage and maintenance costs.

[0055] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0056] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A reconfigurable frequency source, characterized in that, include: The heat dissipation module and multiple sub-modules; The multiple sub-modules include: a frequency reference module, a frequency synthesis module, a gain control module, a signal distribution module, and a power supply and programmable control module; The multiple sub-modules can be detachably connected to the heat dissipation module; The frequency reference module is connected to the frequency synthesis module and is used to send a reference frequency signal to the frequency synthesis module; The frequency synthesis module is connected to the gain control module and is used to receive the reference frequency signal and synthesize the target frequency signal through a phase-locked loop circuit. The gain control module is connected to the signal distribution module and is used to receive the target frequency signal and adjust the gain of the target frequency signal. The power supply and programmable control module is connected to the frequency reference module, the frequency synthesis module and the gain control module respectively, and is used to supply power to the frequency reference module, the frequency synthesis module and the gain control module.

2. The reconfigurable frequency source according to claim 1, characterized in that, The specifications of the multiple sub-modules are uniform.

3. The reconfigurable frequency source according to claim 2, characterized in that, The multiple sub-modules are provided with radio frequency SMA connectors in the first and second directions; the first direction and the second direction are arranged opposite to each other and are located on the same straight line.

4. The reconfigurable frequency source according to claim 3, characterized in that, The frequency reference module, the frequency synthesis module, the gain control module, and the power supply and programmable module are provided with rectangular connectors in a third direction; the third direction is perpendicular to the first direction.

5. The reconfigurable frequency source according to claim 4, characterized in that, The power supply and programmable control module is electrically connected to the frequency reference module, the frequency synthesis module and the gain control module respectively through the rectangular connector located in the third direction.

6. The reconfigurable frequency source according to claim 1, characterized in that, Each of the multiple sub-modules is physically independent.

7. The reconfigurable frequency source according to claim 1, characterized in that, The testing and debugging of the various sub-modules are carried out separately.

8. The reconfigurable frequency source according to claim 1, characterized in that, The surface of the heat dissipation module is coated with a thermally conductive layer and is detachably connected to the plurality of sub-modules in a fourth direction.

9. The reconfigurable frequency source according to claim 8, characterized in that, The heat dissipation module integrates heat pipes or liquid cooling channels.

10. The reconfigurable frequency source according to claim 9, characterized in that, The heat dissipation module is equipped with multiple heat dissipation fins.

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