Circuit board structure and method of manufacturing the same

By forming a corrosion-resistant layer on the magnetic sensing element, the problem of corrosion of the magnetic sensing element during the formation of the through-hole metal layer is solved, thereby improving the manufacturing yield of the circuit board and the performance of the device.

CN122160995APending Publication Date: 2026-06-05NAN YA PRINTED CIRCUIT BOARD CORPORATION
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
NAN YA PRINTED CIRCUIT BOARD CORPORATION
Filing Date
2025-04-18
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In the manufacturing process of existing printed circuit boards, magnetic sensing components are easily corroded by acidic or alkaline process solutions, resulting in low manufacturing yield and poor device performance.

Method used

A corrosion-resistant layer is formed on the magnetic sensing element to isolate it from the acidic or alkaline solutions in the process of forming the through-hole metal layer. Acid- or alkali-resistant materials are selected as the corrosion-resistant layer material to ensure that the magnetic sensing element is not corroded.

Benefits of technology

This improves the manufacturing yield and device performance of the circuit board structure. By forming a corrosion-resistant layer before forming the through-hole metal layer, the magnetic sensing components are protected from damage, thus improving the overall quality of the circuit board.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122160995A_ABST
    Figure CN122160995A_ABST
Patent Text Reader

Abstract

A circuit board structure and a manufacturing method thereof. The circuit board structure includes a substrate, a magnetic sensing element, a corrosion-resistant layer, and a via metal layer. The substrate includes a via penetrating from a front surface to a back surface of the substrate. The magnetic sensing element is disposed on a sidewall of the via in the substrate. The corrosion-resistant layer is disposed on the magnetic sensing element. The via metal layer is disposed on the corrosion-resistant layer. The corrosion-resistant layer isolates the magnetic sensing element from the via metal layer.
Need to check novelty before this filing date? Find Prior Art