Multilayer board chip-in-board circuit board and method of manufacturing the same

Abstract

The application relates to the technical field of automobile parts, and provides a multilayer plate type chip embedded circuit board and a manufacturing method thereof. The multilayer plate type chip embedded circuit board comprises: a prefabricated circuit board; a chip packaging unit embedded in the prefabricated circuit board; a plurality of first conductive modules stacked below the prefabricated circuit board, the plurality of first conductive modules are provided with slot holes exposing the chip packaging unit, a heat dissipation cavity is formed between the back surface of the chip packaging unit and the slot holes, and the heat dissipation cavity is filled with auxiliary heat dissipation materials in contact with the chip packaging unit and the plurality of first conductive modules. The plurality of first conductive modules are stacked below the prefabricated circuit board embedded with the chip packaging unit, the signal transmission capacity can be greatly enhanced, the circuit board can stably operate and stably transmit electric signals; and the auxiliary heat dissipation materials filled in the heat dissipation cavity can quickly take away the heat generated in the working process of the chip packaging unit and the first conductive modules, so that effective heat dissipation is realized.

Description

Technical Field

[0001] This invention relates to the field of automotive parts technology, and more specifically, to a multilayer board-type embedded chip circuit board and its manufacturing method. Background Technology

[0002] In vehicle inverters, a design that embeds chips into circuit boards is used to improve the integration of the circuit boards.

[0003] With increasing integration, the heat generated by electronic components on circuit boards becomes more concentrated, making effective heat dissipation a major challenge. Furthermore, inverters are responsible for converting direct current (DC) to alternating current (AC) to drive motors; ensuring stable electrical signal transmission on the inverter's circuit board for stable motor drive is a problem that needs to be solved.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] In view of this, the present invention provides a multilayer board-type embedded chip circuit board and its manufacturing method. Multiple sets of first conductive modules are stacked below a prefabricated circuit board in which chip packaging units are embedded, which can greatly enhance the signal transmission capability, ensure the stable operation of the circuit board, and stably transmit electrical signals. In addition, the heat dissipation cavity between the first conductive modules and the chip packaging units is filled with auxiliary heat dissipation material, which can quickly remove the heat generated by the chip packaging units and the first conductive modules during operation, thereby achieving effective heat dissipation.

[0006] According to one aspect of the present invention, a multilayer board-type embedded chip circuit board is provided, comprising: a prefabricated circuit board; a chip packaging unit embedded in the prefabricated circuit board; and a plurality of first conductive modules stacked below the prefabricated circuit board, wherein the plurality of first conductive modules have slots exposing the chip packaging unit, and a heat dissipation cavity is formed between the back side of the chip packaging unit and the slots, and the heat dissipation cavity is filled with an auxiliary heat dissipation material in contact with the chip packaging unit and the plurality of first conductive modules.

[0007] In some embodiments, the auxiliary heat dissipation material is a thermally conductive adhesive, which is flush with the lowest film layer in the plurality of first conductive modules.

[0008] In some embodiments, the slot is connected to a cooling device, the cooling device seals the heat dissipation cavity, and the auxiliary heat dissipation material is cooling oil that circulates and fills the heat dissipation cavity.

[0009] In some embodiments, a heat dissipation fin is provided on the back side of the chip packaging unit, and the auxiliary heat dissipation material fills the gaps between the heat dissipation fins.

[0010] In some embodiments, the plurality of first conductive modules includes two groups, wherein each group of first conductive modules includes a first dielectric layer and a first conductive layer, and the first dielectric layer and the first conductive layer of the two groups of first conductive modules are alternately stacked.

[0011] In some embodiments, the multilayer board-type embedded chip circuit board further includes: multiple sets of second conductive modules stacked on top of the prefabricated circuit board, each set of second conductive modules including a second dielectric layer and a second conductive layer, the second dielectric layer and the second conductive layer of the multiple sets of second conductive modules being stacked alternately; electrode leads extending from the front side of the chip packaging unit to the surface of the multiple sets of second conductive modules, the electrode leads including vertical strip leads formed in the second dielectric layer and horizontal strip leads formed in the second conductive layer, wherein each electrode of the chip packaging unit is led out through at least one vertical strip lead, and each horizontal strip lead connects to the vertical strip leads leading out of one or more electrodes.

[0012] In some embodiments, the plurality of second conductive modules includes two groups, and two chip packaging units are embedded in the prefabricated circuit board at intervals, wherein: the drain of the first chip packaging unit is led out sequentially through a set of vertical strip-shaped leads in the lower second dielectric layer, a set of horizontal strip-shaped leads in the lower second conductive layer, a set of vertical strip-shaped leads in the upper second dielectric layer, and a set of horizontal strip-shaped leads in the upper second conductive layer; the gate of the first chip packaging unit is led out through vertical strip-shaped leads penetrating the lower second dielectric layer, the lower second conductive layer, the upper second dielectric layer, and the upper second conductive layer; the source of the first chip packaging unit is led out through a set of vertical strip-shaped leads in the lower second dielectric layer, and the drain of the second chip packaging unit is led out through a set of vertical strip-shaped leads in the lower second dielectric layer. The vertical stripe leads out of the source of the first chip package unit and the vertical stripe leads out of the drain of the second chip package unit are connected by horizontal stripe leads in the lower second conductive layer, and are led out by a set of vertical stripe leads in the upper second dielectric layer and horizontal stripe leads in the upper second conductive layer; the source of the second chip package unit is led out sequentially by a set of vertical stripe leads in the lower second dielectric layer, a horizontal stripe lead in the lower second conductive layer, a set of vertical stripe leads in the upper second dielectric layer, and a horizontal stripe lead in the upper second conductive layer; the gate of the second chip package unit is led out by vertical stripe leads penetrating the lower second dielectric layer, the lower second conductive layer, the upper second dielectric layer, and the upper second conductive layer.

[0013] In some embodiments, the second conductive layer at the bottom has the greatest thickness among all conductive layers.

[0014] According to another aspect of the present invention, a method for manufacturing a multilayer board-type embedded chip circuit board is provided for manufacturing a multilayer board-type embedded chip circuit board as described in any of the above embodiments. The manufacturing method includes: providing a pre-fabricated circuit board; embedding a chip packaging unit in the pre-fabricated circuit board; stacking multiple sets of first conductive modules below the pre-fabricated circuit board, and forming slots in the multiple sets of first conductive modules to expose the chip packaging unit, thereby forming a heat dissipation cavity between the back side of the chip packaging unit and the slots; filling the heat dissipation cavity with an auxiliary heat dissipation material, thereby making the auxiliary heat dissipation material contact the chip packaging unit and the multiple sets of first conductive modules.

[0015] In some embodiments, the manufacturing method further includes: alternately stacking a second dielectric layer and a second conductive layer above the prefabricated circuit board to form a plurality of second conductive modules; forming electrode leads in the plurality of second conductive modules to lead the electrodes of the chip packaging unit to the surface of the plurality of second conductive modules, wherein the electrode leads include vertical strip leads formed in the second dielectric layer and horizontal strip leads formed in the second conductive layer, wherein each electrode of the chip packaging unit is led out through at least one vertical strip lead, and each horizontal strip lead connects to the vertical strip leads leading out of one or more electrodes.

[0016] The beneficial effects of this invention compared to the prior art include at least the following:

[0017] This invention stacks multiple sets of first conductive modules below a prefabricated circuit board with embedded chip packaging units. These multiple sets of first conductive modules can be used as functional film layers such as signal enhancement layers, impedance control layers, and electromagnetic interference shielding layers, thereby greatly enhancing the signal transmission capability of the circuit board, ensuring stable operation of the circuit board, and stable transmission of electrical signals. The multiple sets of first conductive modules can also enhance the mechanical strength of the circuit board, extend its service life, and adapt to the application scenarios of vehicle inverters.

[0018] Multiple sets of first conductive modules have slots that expose the chip packaging unit. The heat dissipation cavity between the back of the chip packaging unit and the slots is filled with auxiliary heat dissipation material that contacts the chip packaging unit and the multiple sets of first conductive modules. The heat generated by the chip packaging unit and the first conductive modules during operation can be quickly dissipated through the auxiliary heat dissipation material, achieving effective heat dissipation. This is suitable for the high current operating conditions of vehicle inverters and applicable to usage scenarios that require strict compatibility / adaptation with inverters.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0021] Figure 1 This diagram shows a cross-sectional view of a multilayer board-type embedded chip circuit board according to an embodiment of the present invention.

[0022] Figure 2 This diagram shows a cross-sectional view of another multilayer board-type embedded chip circuit board according to an embodiment of the present invention.

[0023] Figure 3 This diagram illustrates the steps of a method for manufacturing a multilayer board-type embedded chip circuit board according to an embodiment of the present invention.

[0024] Figure 4 This diagram illustrates the steps of a method for manufacturing a multilayer chip embedded circuit board according to another embodiment of the present invention. Detailed Implementation

[0025] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to those described herein. Rather, these embodiments are provided to make the invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0026] The accompanying drawings are merely illustrative of the invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore, repeated descriptions of them will be omitted. The processes shown in the drawings are merely exemplary and do not necessarily include all steps. For example, some steps can be broken down, some steps can be combined or partially combined, and the actual order of execution may change depending on the actual situation.

[0027] The terms "first," "second," and similar words used in the specific description do not indicate any order, quantity, or importance, but are merely used to distinguish different components. The terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. The term "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, in the description of the invention, when it is said that a device is "connected" to another device, this includes not only direct connections but also indirect connections through other elements.

[0028] It should be noted that, unless otherwise specified, the embodiments of the present invention and the features in different embodiments can be combined with each other.

[0029] Figure 1 The diagram illustrates a cross-sectional structure of a multilayer board-type embedded chip circuit board. Figure 2 This diagram illustrates a cross-sectional structure of yet another multi-layer board-type embedded chip circuit board; combined with Figure 1 and Figure 2 As shown, the multilayer board-type embedded chip circuit board provided in this embodiment of the invention includes:

[0030] Prefabricated circuit board 110;

[0031] The chip packaging unit 120 is embedded in the prefabricated circuit board 110;

[0032] Multiple sets of first conductive modules 130 are stacked below the prefabricated circuit board 110. The multiple sets of first conductive modules 130 have slots that expose the chip packaging unit 120. A heat dissipation cavity 136 is formed between the back of the chip packaging unit 120 and the slots. The heat dissipation cavity 136 is filled with auxiliary heat dissipation material that contacts the chip packaging unit 120 and the multiple sets of first conductive modules 130.

[0033] The present invention stacks multiple sets of first conductive modules 130 below a prefabricated circuit board 110 in which a chip packaging unit 120 is embedded. The multiple sets of first conductive modules 130 can be used as functional film layers such as signal enhancement layer, impedance control layer, and electromagnetic interference shielding layer, which greatly enhances the signal transmission capability of the circuit board, ensures stable operation of the circuit board, and stable transmission of electrical signals. The multiple sets of first conductive modules 130 can also enhance the mechanical strength of the circuit board, extend its service life, and adapt to the application scenarios of vehicle inverters.

[0034] Multiple sets of first conductive modules 130 have slots that expose the chip packaging unit 120. The heat dissipation cavity 136 between the back of the chip packaging unit 120 and the slots is filled with auxiliary heat dissipation material that contacts the chip packaging unit 120 and the multiple sets of first conductive modules 130. The heat generated by the chip packaging unit 120 and the first conductive modules 130 during operation can be quickly dissipated through the auxiliary heat dissipation material to achieve effective heat dissipation. This is suitable for the high current operating conditions of vehicle inverters and applicable to usage scenarios that require strict compatibility / adaptation to inverters.

[0035] In some embodiments, the auxiliary heat dissipation material is Figure 1 The thermally conductive adhesive 140 shown is flush with the lowest film layer of the multiple sets of first conductive modules 130. The thermally conductive adhesive 140 can be uniformly applied using dispensing technology to the sidewalls of the slots in the multiple sets of first conductive modules 130 and the back of the chip packaging unit 120 until the heat dissipation cavity 136 is completely filled, achieving effective heat dissipation for the chip packaging unit 120 and the multiple sets of first conductive modules 130. The flush alignment of the thermally conductive adhesive 140 with the lowest film layer of the multiple sets of first conductive modules 130 gives the multilayer board-type embedded chip circuit board a flat lower surface for assembly with other circuit modules of the inverter.

[0036] In some embodiments, the slots of multiple sets of first conductive modules 130 are connected to a cooling device, the cooling device seals the heat dissipation cavity 136, and the auxiliary heat dissipation material is cooling oil 150 that circulates and fills the heat dissipation cavity 136. See details [link to relevant documentation]. Figure 2 As shown. The continuously circulating cooling oil 150 can quickly remove the heat generated during the operation of the chip packaging unit 120 and the first conductive module 130, achieving effective heat dissipation and providing insulation protection for the chip packaging unit 120 and the first conductive module 130.

[0037] In the above embodiments, heat dissipation fins 122 can be provided on the back side of the chip packaging unit 120, and auxiliary heat dissipation material is used to fill the gaps between the heat dissipation fins 122. The heat dissipation fins 122 can increase the heat dissipation area and improve the heat dissipation performance of the chip packaging unit 120. Efficient heat dissipation is achieved by the cooperation of auxiliary heat dissipation material and heat dissipation fins 122.

[0038] In some embodiments, the plurality of first conductive modules 130 includes two groups, wherein each group of first conductive modules 130 includes a first dielectric layer 131 and a first conductive layer 132, and the first dielectric layer 131 and the first conductive layer 132 of the two groups of first conductive modules 130 are alternately stacked.

[0039] The first dielectric layer 131 serves as insulation and protection, and also ensures the stable adhesion of the first conductive layer 132. The first conductive layer 132 can stabilize signal transmission and improve the signal transmission capability of the circuit board. The thickness of each group of first conductive modules 130 can be set as needed, for example, approximately 1 mm, but is not limited to this.

[0040] In some embodiments, the multilayer board-type embedded chip circuit board further includes multiple sets of second conductive modules 160 stacked on top of the prefabricated circuit board 110. Each set of second conductive modules 160 includes a second dielectric layer 161 and a second conductive layer 162, and the second dielectric layer 161 and the second conductive layer 162 of the multiple sets of second conductive modules 160 are stacked alternately. Electrode leads 170 are led out from the front side of the chip packaging unit 120 to the surface of the multiple sets of second conductive modules 160. The electrode leads 170 include vertical strip leads formed in the second dielectric layer 161 and horizontal strip leads formed in the second conductive layer 162. Each electrode of the chip packaging unit 120 is led out through at least one vertical strip lead, and each horizontal strip lead connects the vertical strip leads that lead out one or more electrodes.

[0041] This invention stacks multiple sets of conductive modules above and below a prefabricated circuit board 110 to form a multilayer board-type embedded chip circuit board, specifically as follows: Figure 1 and Figure 2 The six-layer board-type (referring to six conductive layers, including two second conductive layers 162, the upper and lower conductive layers 111 of the prefabricated circuit board 110, and two first conductive layers 132) chip embedded circuit board shown is suitable for scenarios requiring strict compatibility and adaptation with vehicle inverters due to its mechanical strength, signal transmission capability, and drive stability.

[0042] The source and drain of the chip packaging unit 120 can be led out through multiple vertical strip leads to ensure stable connection and signal transmission, adapting to the high current operating conditions of the inverter. The horizontal strip leads connect the vertical strip leads that lead out one or more electrodes. On the one hand, this facilitates leading the electrode leads 170 to the surface of multiple sets of second conductive modules 160, ensuring stable connection of the electrode leads 170 between circuit board layers and avoiding disconnection. On the other hand, it enables connection between the electrodes of different chip packaging units 120 to adapt to the operating needs of the inverter's power module.

[0043] Specifically, in some embodiments, the multiple sets of second conductive modules 160 include two sets, and two chip packaging units 120 are embedded in the prefabricated circuit board 110 at intervals, wherein: the drain of the first chip packaging unit 120 is sequentially connected to a set of vertical strip leads 170a1 in the lower second dielectric layer 161, a set of horizontal strip leads 170a2 in the lower second conductive layer 162, a set of vertical strip leads 170a3 in the upper second dielectric layer 161, and a set of horizontal strip leads in the upper second conductive layer 162. Line 170a4 is led out; the gate of the first chip package unit 120 is led out through a vertical strip lead 170b that penetrates the lower second dielectric layer 161, the lower second conductive layer 162, the upper second dielectric layer 161, and the upper second conductive layer 162; the source of the first chip package unit 120 is led out through a set of vertical strip leads 170c1 located in the lower second dielectric layer 161, and the drain of the second chip package unit 120 is led out through a set of vertical strip leads 170c2 located in the lower second dielectric layer 161. The vertical strip lead 170c1 leading out of the source of the first chip package unit 120 and the vertical strip lead 170c2 leading out of the drain of the second chip package unit 120 are connected by a horizontal strip lead 170c3 in the lower second conductive layer 162, and are led out by a set of vertical strip leads 170c4 in the upper second dielectric layer 161 and a set of horizontal strip leads 170c5 in the upper second conductive layer 162; the source of the second chip package unit 120 is sequentially led out through the lower second dielectric layer 161. The second chip package unit 120 is led out through a set of vertical strip leads 170d1, a set of horizontal strip leads 170d2 in the lower second conductive layer 162, a set of vertical strip leads 170d3 in the upper second dielectric layer 161, and a set of horizontal strip leads 170d4 in the upper second conductive layer 162; the gate of the second chip package unit 120 is led out through vertical strip leads 170e that penetrate the lower second dielectric layer 161, the lower second conductive layer 162, the upper second dielectric layer 161, and the upper second conductive layer 162.

[0044] Among all conductive layers, the second conductive layer 162 located at the bottom has the largest thickness to ensure that the horizontal strip leads 170a2, 170c3, and 170d2 have sufficient strength, so that the electrode leads 170 are stably connected between circuit board layers, avoiding disconnection, and achieving stable connection between electrodes of different chip packaging units 120 according to the working requirements of the inverter's power module.

[0045] Furthermore, the horizontal stripe leads 170a4, vertical stripe leads 170b, horizontal stripe leads 170c5, horizontal stripe leads 170d4, and vertical stripe leads 170e, which are led out to the surface of the upper second conductive layer 162, can be connected to other electronic components of the inverter via solder pads. Specifically, horizontal stripe lead 170a4 is used to connect to the positive terminal of the DC power supply, vertical stripe lead 170b is used to connect to the control circuit, horizontal stripe lead 170c5 is used to connect to the load motor, horizontal stripe lead 170d4 is used to connect to the negative terminal of the DC power supply, and vertical stripe lead 170e is used to connect to the control circuit.

[0046] This invention also provides a method for manufacturing a multilayer board-type embedded chip circuit board, used to manufacture the multilayer board-type embedded chip circuit board described in any of the above embodiments. The features and principles of the multilayer board-type embedded chip circuit boards described in the above embodiments can be applied to the following manufacturing method embodiments. In the following manufacturing method embodiments, the features and principles of the multilayer board-type embedded chip circuit board that have already been explained will not be repeated.

[0047] Figure 3 The main steps of manufacturing a multilayer board-type embedded chip circuit board are illustrated below. Figure 3 and combined Figure 1 and Figure 2 As shown, the manufacturing method of the multilayer board-type embedded chip circuit board provided in this embodiment of the invention includes:

[0048] S310 provides a pre-fabricated circuit board 110;

[0049] S320, a chip packaging unit 120 is embedded in a prefabricated circuit board 110;

[0050] S330, multiple sets of first conductive modules 130 are stacked below the prefabricated circuit board 110, and slots are opened in the multiple sets of first conductive modules 130 to expose the chip packaging unit 120, so that a heat dissipation cavity 136 is formed between the back of the chip packaging unit 120 and the slot.

[0051] S340, fill the heat dissipation cavity 136 with auxiliary heat dissipation material so that the auxiliary heat dissipation material comes into contact with the chip packaging unit 120 and multiple sets of first conductive modules 130.

[0052] The fabricated multi-layered embedded chip circuit board significantly enhances the signal transmission capability of the circuit board through multiple sets of first conductive modules 130, ensuring stable operation and stable transmission of electrical signals. The multiple sets of first conductive modules 130 also enhance the structural strength of the circuit board, extending its service life and making it suitable for vehicle inverter applications. Furthermore, the auxiliary heat dissipation material filled in the heat dissipation cavity 136 quickly removes the heat generated during the operation of the chip packaging unit 120 and the first conductive modules 130, achieving effective heat dissipation and adapting to the high operating current of the inverter, making it suitable for applications requiring strict compatibility / adaptation with inverters.

[0053] Figure 4 This diagram illustrates the main steps of another method for manufacturing a multilayer board-type embedded chip circuit board, with reference to... Figure 4 and combined Figures 1 to 3 As shown, in some embodiments, the manufacturing method of a multilayer board-type chip embedded circuit board further includes:

[0054] S450, a second dielectric layer 161 and a second conductive layer 162 are alternately stacked on top of the prefabricated circuit board 110 to form multiple sets of second conductive modules 160.

[0055] S460, electrode leads 170 are formed in multiple sets of second conductive modules 160 to lead the electrodes of chip packaging unit 120 to the surface of multiple sets of second conductive modules 160. The electrode leads 170 include vertical strip leads formed in the second dielectric layer 161 and horizontal strip leads formed in the second conductive layer 162, wherein each electrode of chip packaging unit 120 is led out through at least one vertical strip lead, and each horizontal strip lead connects to the vertical strip leads that lead out one or more electrodes.

[0056] The source and drain of the chip package unit 120 can be led out through multiple vertical strip leads to ensure stable connection and signal transmission, adapting to the high current operating conditions of the inverter. The horizontal strip leads connect the vertical strip leads that lead out one or more electrodes. On the one hand, this facilitates leading the electrode leads 170 to the surface of multiple sets of second conductive modules 160, ensuring stable connection of the electrode leads 170 between circuit board layers and avoiding disconnection. On the other hand, it enables connection between the electrodes of different chip package units 120 to adapt to the operating needs of the inverter's power module.

[0057] The present invention stacks multiple sets of conductive modules above and below the prefabricated circuit board 110 to form a six-layer board-type chip embedded circuit board. Its mechanical strength, signal transmission capability and drive stability can be strictly compatible with and adapted to the inverter, and it is suitable for application scenarios that require strict compatibility and adaptation with the inverter's drive / control module.

[0058] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A multilayer board-type embedded chip circuit board, characterized in that, include: Prefabricated circuit boards; A chip packaging unit is embedded in the prefabricated circuit board; Multiple sets of first conductive modules are stacked below the prefabricated circuit board. The multiple sets of first conductive modules have slots that expose the chip packaging unit. A heat dissipation cavity is formed between the back of the chip packaging unit and the slots. The heat dissipation cavity is filled with auxiliary heat dissipation material that contacts the chip packaging unit and the multiple sets of first conductive modules.

2. The multilayer board-type embedded chip circuit board as described in claim 1, characterized in that, The auxiliary heat dissipation material is a thermally conductive adhesive, which is flush with the bottommost film layer in the plurality of first conductive modules.

3. The multilayer board-type embedded chip circuit board as described in claim 1, characterized in that, The slot is connected to a cooling device, the cooling device seals the heat dissipation cavity, and the auxiliary heat dissipation material is cooling oil that circulates and fills the heat dissipation cavity.

4. The multilayer board-type embedded chip circuit board as described in any one of claims 1-3, characterized in that, The back of the chip packaging unit is provided with heat dissipation fins, and the auxiliary heat dissipation material fills the gaps between the heat dissipation fins.

5. The multilayer board-type embedded chip circuit board as described in claim 1, characterized in that, The plurality of first conductive modules includes two groups, wherein each group of first conductive modules includes a first dielectric layer and a first conductive layer, and the first dielectric layer and the first conductive layer of the two groups of first conductive modules are alternately stacked.

6. The multilayer board-type embedded chip circuit board as described in claim 1, characterized in that, Also includes: Multiple sets of second conductive modules are stacked on top of the prefabricated circuit board. Each set of second conductive modules includes a second dielectric layer and a second conductive layer. The second dielectric layer and the second conductive layer of the multiple sets of second conductive modules are stacked alternately. Electrode leads extend from the front of the chip packaging unit to the surface of the plurality of second conductive modules. The electrode leads include vertical strip leads formed in the second dielectric layer and horizontal strip leads formed in the second conductive layer. Each electrode of the chip packaging unit is led out through at least one vertical strip lead, and each horizontal strip lead connects to the vertical strip leads that lead out one or more electrodes.

7. The multilayer board-type embedded chip circuit board as described in claim 6, characterized in that, The plurality of second conductive modules includes two groups, and two chip packaging units are embedded at intervals in the prefabricated circuit board, wherein: The drain of the first chip packaging unit is led out sequentially through a set of vertical strip leads in the lower second dielectric layer, a set of horizontal strip leads in the lower second conductive layer, a set of vertical strip leads in the upper second dielectric layer, and a set of horizontal strip leads in the upper second conductive layer. The gate of the first chip packaging unit is led out through a vertical strip-shaped lead that passes through the lower second dielectric layer, the lower second conductive layer, the upper second dielectric layer, and the upper second conductive layer; The source of the first chip package unit is led out through a set of vertical strip-shaped leads in the lower second dielectric layer, and the drain of the second chip package unit is led out through a set of vertical strip-shaped leads in the lower second dielectric layer. The vertical strip-shaped leads leading out of the source of the first chip package unit and the vertical strip-shaped leads leading out of the drain of the second chip package unit are connected through horizontal strip-shaped leads in the lower second conductive layer, and led out through a set of vertical strip-shaped leads in the upper second dielectric layer and horizontal strip-shaped leads in the upper second conductive layer. The source of the second chip packaging unit is led out sequentially through a set of vertical strip leads in the lower second dielectric layer, a set of horizontal strip leads in the lower second conductive layer, a set of vertical strip leads in the upper second dielectric layer, and a set of horizontal strip leads in the upper second conductive layer. The gate of the second chip package unit is led out through a vertical strip-shaped lead that passes through the lower second dielectric layer, the lower second conductive layer, the upper second dielectric layer, and the upper second conductive layer.

8. The multilayer board-type embedded chip circuit board as described in claim 7, characterized in that, Of all the conductive layers, the second conductive layer at the bottom has the greatest thickness.

9. A method for manufacturing a multilayer board-type embedded chip circuit board, characterized in that, The manufacturing method for manufacturing a multilayer board-type embedded chip circuit board as described in any one of claims 1-8 includes: Provide prefabricated circuit boards; A chip packaging unit is embedded in the prefabricated circuit board; Multiple sets of first conductive modules are stacked below the prefabricated circuit board, and slots are opened in the multiple sets of first conductive modules to expose the chip packaging unit, so that a heat dissipation cavity is formed between the back of the chip packaging unit and the slots. An auxiliary heat dissipation material is filled into the heat dissipation cavity so that the auxiliary heat dissipation material comes into contact with the chip packaging unit and the multiple sets of first conductive modules.

10. The manufacturing method as described in claim 9, characterized in that, Also includes: A second dielectric layer and a second conductive layer are alternately stacked on top of the prefabricated circuit board to form multiple sets of second conductive modules; Electrode leads are formed in the plurality of sets of second conductive modules to lead the electrodes of the chip packaging unit to the surface of the plurality of sets of second conductive modules. The electrode leads include vertical strip leads formed in the second dielectric layer and horizontal strip leads formed in the second conductive layer. Each electrode of the chip packaging unit is led out through at least one vertical strip lead, and each horizontal strip lead connects to the vertical strip leads that lead out one or more electrodes.

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