A method for producing a composite circuit board having a ceramic substrate embedded therein
By milling a strip-shaped through-slot at the bottom of the circuit board and using copper strips and welding components to firmly secure the ceramic substrate to the circuit board, the problem of ceramic substrate detachment in composite circuit boards under vibration is solved, thus improving production quality and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SICHUAN MEIJIESEN CIRCUIT TECH CO LTD
- Filing Date
- 2026-05-11
- Publication Date
- 2026-06-05
Smart Images
Figure CN122161012A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the technical field of manufacturing composite circuit boards, and in particular to a method for manufacturing composite circuit boards with embedded ceramic substrates. Background Technology
[0002] The structure of composite circuit board A produced in a certain workshop is as follows: Figures 1-2 As shown, the composite circuit board A includes a circuit board 1. A groove 2 is formed on the top surface of the circuit board 1. A ceramic substrate 3 that matches the groove 2 is embedded in the groove 2. A layer of curing film 4 is provided between the ceramic substrate 3 and the bottom of the groove 2. The curing film 4 fixes the ceramic substrate 3 and the circuit board 1 together. The top surface of the ceramic substrate 3 is flush with the top surface of the circuit board 1. A circuit layer is formed on the bottom surface of the circuit board 1. The function of the ceramic substrate 3 is to conduct away the heat on the circuit board 1, so as to play a role in heat conduction.
[0003] This composite circuit board A is used to install in the control box in the workshop. The circuit layer of the composite circuit board A is electrically connected to the various actuators of the mechanical equipment in order to control the operation of the various actuators of the mechanical equipment.
[0004] The specific method used by the workers in the workshop to produce this composite circuit board A is as follows: SI, the worker takes out a... Figures 3-4 The circuit board 1 shown is placed flat on the workbench 5, as shown. Figure 5 As shown; SII. The worker takes out a curing film 4 and places it flat in the recess 2 of the circuit board 1, as follows: Figure 6 As shown; SIII. The worker takes out a ceramic substrate 3 and places it flat on the top surface of the curing film 4. SIV. The worker controls the hot press head 6 of the press to move downwards, so that the hot press head 6 presses against the top surface of the ceramic substrate 3, such as... Figure 7 As shown, at this time, the heat from the hot press head 6 is transferred to the ceramic substrate 3, and the ceramic substrate 3 then transfers the heat to the curing film 4. When the curing film 4 is heated, it bonds and fixes the ceramic substrate 3 and the circuit board 1 together. After holding the pressure for a period of time, a composite circuit board A is finally produced. The structure of the produced composite circuit board A is as follows. Figures 1-2 As shown; SV, the workers repeat the steps SI~SIV multiple times to produce multiple composite circuit boards A.
[0005] However, while the production methods in the workshop can produce this composite circuit board A, the following technical defects still exist: When the manufactured composite circuit board A is actually installed in the control box, the control box is constantly subjected to external vibrations (for example, the operation of mechanical equipment located around the control box will inevitably cause ground vibrations). This vibration will cause the composite circuit board A inside the control box to vibrate synchronously. After the composite circuit board A has been used in a vibrating environment for a long time, the cured film 4 of the composite circuit board A will be shaken off from the circuit board 1, which in turn will cause the ceramic substrate 3 to fall off the circuit board 1, rendering the entire composite circuit board A unusable. Therefore, the production method in the workshop undoubtedly reduces the production quality of the composite circuit board.
[0006] Therefore, there is an urgent need for a production method that greatly improves the quality of composite circuit boards. Summary of the Invention
[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for producing a composite circuit board with an embedded ceramic substrate.
[0008] The objective of this invention is achieved through the following technical solution: a method for producing a composite circuit board with an embedded ceramic substrate, comprising the following steps: S1. Take out a circuit board and use a CNC milling machine to mill two strip-shaped through slots at the bottom of the recessed groove of the circuit board, ensuring that the two strip-shaped through slots penetrate the bottom surface of the circuit board, and at the same time, ensure that the two strip-shaped through slots are located at the left and right ends of the recessed groove respectively. S2. The worker places the circuit board with the groove facing up and then places it flat on the fixing block fixed on the top surface of the workbench, ensuring that the two strip slots of the circuit board are located on both sides of the fixing block. S3. Take out a ceramic substrate and place it into the groove of the circuit board. S4. Take out an auxiliary welding component, which includes a fastening block. A positioning groove is formed on the bottom surface of the fastening block. The positioning groove matches the outer contour of the circuit board. A central groove is formed at the bottom of the positioning groove, penetrating its top surface. A limiting frame is fixed in the central groove. The bottom surface of the limiting frame is flush with the bottom of the positioning groove. A welding window is formed in the rear side wall of the limiting frame at both its left and right ends. Both welding windows are connected to the inner cavity of the limiting frame. S5. The worker fastens the positioning groove of the fastening block of the auxiliary welding component onto the top of the circuit board from top to bottom. At this time, the limiting frame of the auxiliary welding component is supported on the top surface of the circuit board. Meanwhile, the four inner side walls of the limiting frame are flush with the four inner side walls of the sink. S6. Take out two copper strips and insert them into the two strip-shaped through slots from bottom to top. The copper strips will push the ceramic substrate upwards, allowing it to enter the inner cavity of the limiting frame. When the top surface of the ceramic substrate is observed to be flush with the top surface of the limiting frame, place a pad between each of the two copper strips and the worktable to keep the two copper strips stationary. S7. The worker passes the welding torch through the welding window of the limiting frame from back to front, and then welds the contact point between the copper strip and the ceramic substrate with the welding torch, thereby welding the copper strip onto the ceramic substrate. S8. The worker removes the auxiliary welding components from bottom to top, and then removes the two pads from the workbench. After the pads are removed, the ceramic substrate falls back into the groove of the circuit board under its own weight. S9. The worker folds the bottom ends of the two copper strips toward the circuit board so that the bottom ends of the copper strips are folded onto the bottom surface of the circuit board to form a folded part. S10. The worker operates the spot welding machine so that the spot welding head touches the folded part from bottom to top, so that the folded part is welded to the bottom surface of the circuit board, thereby finally producing the composite circuit board B. S11. Repeat steps S1 to S10 multiple times to produce multiple composite circuit boards B.
[0009] In step S1, both strip-shaped channels are longitudinally distributed, and the two strip-shaped channels are of equal size.
[0010] In step S6, the outer contour of the copper strip matches the strip-shaped through groove, and the height of the copper strip is greater than the height of the strip-shaped through groove.
[0011] In step S9, the worker strikes the bottom end of the copper strip with a wooden hammer to fold the copper strip toward the circuit board.
[0012] The present invention has the following advantages: greatly improving the production quality of composite circuit boards. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the structure of a composite circuit board A in the prior art; Figure 2 for Figure 1 Top view; Figure 3 This is a schematic diagram of the circuit board structure; Figure 4 for Figure 3 Top view; Figure 5 To be Figure 3 A schematic diagram of the circuit board placed flat on the workbench surface. Figure 6This is a schematic diagram showing the curing film being placed flat in the recess of the circuit board. Figure 7 A schematic diagram showing how a hot press head is pressed against the top surface of a ceramic substrate; Figure 8 A schematic diagram of milling two strip-shaped through slots at the bottom of a recess in a circuit board. Figure 9 for Figure 8 Top view; Figure 10 To be Figure 8 A schematic diagram of the circuit board placed flat on the fixing block; Figure 11 This is a schematic diagram of placing a ceramic substrate into the recess of a circuit board. Figure 12 This is a schematic diagram of the auxiliary welding assembly. Figure 13 for Figure 12 P-direction schematic diagram; Figure 14 for Figure 12 Main section diagram; Figure 15 This is a schematic diagram showing how the positioning groove of the fastening block of the auxiliary welding component is fastened onto the top of the circuit board from top to bottom. Figure 16 This is a schematic diagram of the copper strip structure; Figure 17 This is a schematic diagram showing two copper bars being inserted into two strip-shaped slots from bottom to top. Figure 18 This is a schematic diagram showing that the top surface of the ceramic substrate is flush with the top surface of the limiting frame; Figure 19 This is a schematic diagram showing the placement of a pad between each of the two copper bars and the worktable. Figure 20 This is a schematic diagram showing the ceramic substrate falling back into the groove of the circuit board under its own gravity. Figure 21 A schematic diagram showing how the bottom end of a copper strip is folded onto the bottom surface of a circuit board to form a folded portion; Figure 22 A diagram illustrating how the spot welding head contacts the folded part from bottom to top; Figure 23 This is a schematic diagram of the structure of the manufactured composite circuit board B; In the picture: 1-Circuit board, 2-Recessed tank, 3-Ceramic substrate, 4-Curing film, 5-Worktable, 6-Hot press head; 7-Strip groove, 8-Fixing block, 9-Snap-fit block, 10-Positioning groove, 11-Central groove, 12-Limiting frame, 13-Welding window, 14-Copper strip, 15-Padded block, 16-Folding part, 17-Spot welding head. Detailed Implementation
[0014] The present invention will be further described below with reference to the accompanying drawings. The scope of protection of the present invention is not limited to the following description: A method for manufacturing a composite circuit board with an embedded ceramic substrate includes the following steps: S1, Take out one such as Figures 3-4 The circuit board 1 shown has two strip-shaped through slots 7 milled at the bottom of the countersunk groove 2 using a CNC milling machine, as shown. Figures 8-9 As shown, ensure that the two strip-shaped through slots 7 penetrate the bottom surface of the circuit board 1, and at the same time, ensure that the two strip-shaped through slots 7 are located at the left and right ends of the recess 2 respectively; the two strip-shaped through slots 7 are both longitudinally distributed, and the two strip-shaped through slots 7 are of equal size; S2. The worker places the circuit board 1 with the recess 2 facing upwards, and then lays it flat on the fixing block 8 fixed on the top surface of the workbench 5, as follows. Figure 10 As shown, and ensure that the two strip slots 7 of the circuit board 1 are located on both sides of the fixing block 8; S3. Take out a ceramic substrate 3 and place it into the recess 2 of the circuit board 1, such as... Figure 11 As shown; S4. Take out one such as Figures 12-14 The auxiliary welding assembly shown includes a fastening block 9. A positioning groove 10 is formed on the bottom surface of the fastening block 9. The positioning groove 10 matches the outer contour of the circuit board 1. A central groove 11 is formed at the bottom of the positioning groove 10, penetrating its top surface. A limiting frame 12 is fixed in the central groove 11. The bottom surface of the limiting frame 12 is flush with the bottom of the positioning groove 10. A welding window 13 is formed in the rear side wall of the limiting frame 12 at both its left and right ends. Both welding windows 13 are connected to the inner cavity of the limiting frame 12. S5. The worker attaches the positioning groove 10 of the fastening block 9 of the auxiliary welding component to the top of the circuit board 1 from top to bottom, such as... Figure 15 As shown, at this time, the limiting frame 12 of the auxiliary welding assembly is supported on the top surface of the circuit board 1, and at the same time, the four inner sidewalls of the limiting frame 12 are flush with the four inner sidewalls of the sink 2. S6. Take out two as shown in the image. Figure 16 The copper strips 14 shown are inserted into the two strip-shaped through slots 7 from bottom to top, as shown. Figure 17As shown, the ceramic substrate 3 is pushed upward by the copper strip 14, thereby allowing the ceramic substrate 3 to enter the inner cavity of the limiting frame 12. When it is observed that the top surface of the ceramic substrate 3 is flush with the top surface of the limiting frame 12, as... Figure 18 As shown, a pad 15 is placed between each of the two copper strips 14 and the worktable 5, as follows. Figure 19 As shown, the two copper strips 14 are kept stationary; in step S6, the outer contour of the copper strip 14 matches the strip groove 7, and the height of the copper strip 14 is greater than the height of the strip groove 7. S7. The worker passes the welding torch from back to front through the welding window 13 of the limiting frame 12, and then welds the contact point between the copper strip 14 and the ceramic substrate 3 with the welding torch, thereby welding the copper strip 14 onto the ceramic substrate 3. S8. The worker removes the auxiliary welding components from bottom to top, and then removes the two pads 15 from the workbench 5. After the pads 15 are removed, the ceramic substrate 3 falls back into the recess 2 of the circuit board 1 under its own weight. Figure 20 As shown; S9. The worker folds the bottom ends of the two copper strips 14 toward the circuit board 1, so that the bottom ends of the copper strips 14 are folded onto the bottom surface of the circuit board 1, thus forming the folded portion 16. Figure 21 As shown; in step S9, the worker strikes the bottom end of the copper strip 14 with a wooden hammer to fold the copper strip 14 toward the circuit board 1; S10. The worker operates the spot welding machine so that the spot welding head 17 touches the folded part 16 from bottom to top, as follows: Figure 22 As shown, the folded portion 16 is soldered to the bottom surface of the circuit board 1, thereby finally producing the composite circuit board B. The structure of the produced composite circuit board B is as follows: Figure 23 As shown; In step S10, since the ceramic substrate 3 of the composite circuit board B produced has a copper strip 14 welded to its left and right ends respectively, and the bottom ends of the two copper strips 14 are folded and welded to the bottom surface of the circuit board 1, that is, the two copper strips 14 folded and welded to the circuit board 1 always firmly pull and fix the ceramic substrate 3 in the groove 2 of the circuit board 1, thus realizing the fixation of the ceramic substrate 3 on the circuit board 1 in the horizontal and vertical directions.
[0015] Therefore, when the composite circuit board B is actually installed in the control box, the vibrations generated by the mechanical equipment located around the control box during operation, even if transmitted to the composite circuit board B over a long period of time, will not cause the ceramic substrate 3 inside the composite circuit board B to fall off the circuit board 1, ensuring the long-term use of the entire composite circuit board B. Therefore, the composite circuit board B produced by this method, compared to those produced by existing methods, is superior. Figures 1-2 The composite circuit board A shown effectively prevents the ceramic substrate 3 from falling off the circuit board 1 due to long-term vibration, thereby greatly improving the production quality of the composite circuit board.
[0016] S11. Repeat steps S1 to S10 multiple times to produce multiple composite circuit boards B.
[0017] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A method for producing a composite circuit board with an embedded ceramic substrate, characterized in that: It includes the following steps: S1. Take out a circuit board (1) and use a CNC milling machine to mill two strip-shaped through slots (7) at the bottom of the groove (2) of the circuit board (1) to ensure that the two strip-shaped through slots (7) penetrate the bottom surface of the circuit board (1). At the same time, ensure that the two strip-shaped through slots (7) are located at the left and right ends of the groove (2) respectively. S2. The worker places the circuit board (1) with the groove (2) facing up, and then places it flat on the fixing block (8) fixed on the top surface of the workbench (5), and ensures that the two strip slots (7) of the circuit board (1) are located on both sides of the fixing block (8). S3. Take out a ceramic substrate (3) and put the ceramic substrate (3) into the groove (2) of the circuit board (1); S4. Take out an auxiliary welding component, which includes a fastening block (9). A positioning groove (10) is provided on the bottom surface of the fastening block (9). The positioning groove (10) matches the outer contour of the circuit board (1). A central groove (11) is provided at the bottom of the positioning groove (10) and penetrates its top surface. A limiting frame (12) is fixed in the central groove (11). The bottom surface of the limiting frame (12) is flush with the bottom of the positioning groove (10). A welding window (13) is provided in the rear side wall of the limiting frame (12) and at its left and right ends. Both welding windows (13) are connected to the inner cavity of the limiting frame (12). S5. The worker fastens the positioning groove (10) of the fastening block (9) of the auxiliary welding component onto the top of the circuit board (1) from top to bottom. At this time, the limiting frame (12) of the auxiliary welding component is supported on the top surface of the circuit board (1). Meanwhile, the four inner walls of the limiting frame (12) are flush with the four inner walls of the sink (2). S6. Take out two copper strips (14) and insert them into the two strip-shaped through slots (7) from bottom to top. The ceramic substrate (3) is pushed upward by the copper strips (14), so that the ceramic substrate (3) enters the inner cavity of the limiting frame (12). When the top surface of the ceramic substrate (3) is observed to be flush with the top surface of the limiting frame (12), place a pad (15) between the two copper strips (14) and the worktable (5) to keep the two copper strips (14) stationary. S7. The worker passes the welding torch through the welding window (13) of the limiting frame (12) from back to front, and then welds the contact point between the copper strip (14) and the ceramic substrate (3) with the welding torch, thereby welding the copper strip (14) onto the ceramic substrate (3). S8. The worker removes the auxiliary welding components from bottom to top, and then removes the two pads (15) from the workbench (5). After the pads (15) are removed, the ceramic substrate (3) falls back into the sink (2) of the circuit board (1) under its own weight. S9. The worker folds the bottom ends of the two copper strips (14) toward the circuit board (1) so that the bottom ends of the copper strips (14) are folded onto the bottom surface of the circuit board (1) to form a folded part (16). S10. The worker operates the spot welding machine so that the spot welding head (17) on it touches the folded part (16) from bottom to top, so that the folded part (16) is welded to the bottom surface of the circuit board (1), thereby finally producing the composite circuit board B. S11. Repeat steps S1 to S10 multiple times to produce multiple composite circuit boards B.
2. The method for producing a composite circuit board with an embedded ceramic substrate according to claim 1, characterized in that: In step S1, the two strip grooves (7) are both longitudinally distributed, and the two strip grooves (7) are of equal size.
3. The method for producing a composite circuit board with an embedded ceramic substrate according to claim 1, characterized in that: In step S6, the outer contour of the copper strip (14) matches the strip groove (7), and the height of the copper strip (14) is greater than the height of the strip groove (7).
4. The method for producing a composite circuit board with an embedded ceramic substrate according to claim 1, characterized in that: In step S9, the worker strikes the bottom end of the copper strip (14) with a wooden hammer to fold the copper strip (14) toward the circuit board (1).