Chip mounter for production of circuit board

Abstract

The application discloses a chip mounter for circuit board chip production, and belongs to the field of circuit board chip mounters. A feeding system and a transverse driving assembly are installed on a rack. The upper end of the transverse driving assembly is connected with a second longitudinal driving assembly. The side wall of the second longitudinal driving assembly is connected with a vertical driving and mounting assembly. The end of the second longitudinal driving assembly is provided with a high-definition detection assembly. The position of a chip is detected through the high-definition detection assembly. Then, the movement of a mounting module is realized through an XYZ three-axis driving assembly. A first longitudinal driving assembly is arranged below the transverse driving assembly. The first longitudinal driving assembly is installed with a modular mounting table. The precise three-dimensional movement of the chip mounter is combined with the stable adsorption and size adaptation of the modular mounting table, the reliable sealing and emergency protection of the quick-mounting type vacuumizing and adding device, so that the high precision, high efficiency and high stability of the mounting process are realized, the diversified production requirements are met, the production continuity is ensured, and the mounting quality is improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board placement machines, and particularly to a placement machine for circuit board placement production. Background Technology

[0002] A pick-and-place machine is the core equipment of an SMT (Surface Mount Technology) production line, used to place surface mount components (such as resistors, capacitors, and chips) onto designated locations on a printed circuit board (PCB) with high precision and efficiency. It mainly consists of a feeder, placement head, vision positioning system, PCB conveying and positioning mechanism, and control system.

[0003] After the PCB is positioned by the conveyor mechanism, the feeder delivers the components to the pick-up position. The placement head picks up the components through a vacuum nozzle. The vision system performs image recognition and positioning calibration on the components and PCB pads. Subsequently, the placement head precisely places the components in the target position on the PCB, completing the placement. Based on function, placement machines can be divided into high-speed pick-and-place machines (focusing on placing small-sized, high-quantity components, such as chip resistors and capacitors), general-purpose pick-and-place machines (suitable for large-sized, irregularly shaped components, such as ICs and connectors), and multi-functional all-in-one machines. Based on structure, they can be divided into turret type (multiple placement heads working simultaneously, high speed) and arch type (high flexibility, suitable for complex components), etc. Pick-and-place machines significantly improve the efficiency of electronic manufacturing through automated operation, ensuring placement accuracy (up to ±0.01mm level), and are key equipment for the mass production of modern electronic devices (such as mobile phones, computers, and automotive electronics).

[0004] When a vacuum system malfunctions and causes the pick-and-place machine to stop, the entire production line must be stopped simultaneously, directly resulting in production interruption and reduced output. During the downtime, various equipment on the production line (such as printers and reflow ovens) are idle, reducing equipment utilization and production efficiency. Repairs require additional manpower and spare parts costs, and prolonged downtime can lead to work-in-process inventory buildup or material shortages in subsequent processes, disrupting the production rhythm. If the repair cycle is long, it can easily cause order delivery delays and affect customer reputation. At the same time, frequent downtime for maintenance increases the difficulty of adjusting production plans and raises overall production costs. Summary of the Invention

[0005] The main objective of this invention is to provide a chip mounter for circuit board assembly, which can effectively solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A chip mounter for circuit board assembly includes a frame, a feeding system, a horizontal drive assembly, a first vertical drive assembly, a second vertical drive assembly, a vertical drive and chip mounter assembly, and a high-definition detection assembly. The feeding system and the horizontal drive assembly are mounted on the frame. The upper end of the horizontal drive assembly is connected to the second vertical drive assembly. The side wall of the second vertical drive assembly is connected to the vertical drive and chip mounter assembly. The end of the second vertical drive assembly is provided with a high-definition detection assembly. The chip mounter position is detected by the high-definition detection assembly, and the movement of the chip mounter module is realized by the XYZ three-axis drive assembly. Below the lateral drive assembly is a first longitudinal drive assembly, on which a modular placement stage is mounted to enable movement of the modular placement stage, which is located within the monitoring area of ​​the high-definition detection assembly. The side wall of the modular placement stage is connected to a quick-release vacuum mounting device, which enables the connection of the vacuum device on the modular placement stage.

[0007] In an optional embodiment of this application, the modular placement stage includes a first modular placement base, a second modular placement base, a third modular placement base, a fourth modular placement base, and a vacuum adsorption connector. The first modular placement base, the second modular placement base, the third modular placement base, and the fourth modular placement base are arranged sequentially from left to right and fixed by bolts. The lower ends of the first modular placement base, the second modular placement base, the third modular placement base, and the fourth modular placement base are all provided with vacuum adsorption connectors, which are connected to the vacuum pumping device inside the frame. In an optional embodiment of this application, a sealing strip is provided between the first modular patch holder, the second modular patch holder, the third modular patch holder, and the fourth modular patch holder, and a lateral connector is installed on the sidewall of each of the first modular patch holder, the second modular patch holder, the third modular patch holder, and the fourth modular patch holder. In an optional embodiment of this application, the quick-connect vacuuming device includes a connecting pipe, a main pipe, a branch pipe, a vacuuming check valve, and a quick-connect fitting. The outer end of the side fitting is connected to a quick-connect fitting, and the outer end of the quick-connect fitting is connected to a branch pipe through the vacuuming check valve. The outer end of the branch pipe is connected to a main pipe, and the other end of the main pipe is connected to a connecting pipe, which is connected to an emergency vacuuming device. In an optional embodiment of this application, the outer end of the lateral connector is provided with a thread, and the quick-connect connector includes a threaded head, an outer nut and a sealing ring. The inner wall of the outer nut is provided with multiple sealing rings. The threaded head consists of a tube and a threaded tube. The tube is placed at the port of the threaded tube. The tube is inserted into the lateral connector, and the connection is provided with multiple sealing rings. The threaded tube is connected to the lateral connector through the outer nut. In an optional embodiment of this application, the vacuum check valve is a duckbill valve, which prevents air backflow and improves sealing performance. A control valve is provided at the connection between the main pipe and the connecting pipe. This control valve is a manual valve, and the outer end of the connecting pipe is a flange for easy installation of the connecting pipe.

[0008] Compared with the prior art, the present invention has the following beneficial effects: The pick-and-place machine achieves precise three-dimensional movement of the placement module through the coordinated work of the XYZ three-axis drive components, and combines high-definition detection components to detect the placement position at high resolution, ensuring high precision and high efficiency in the placement process; real-time visual feedback and position correction improve placement quality.

[0009] The multi-modular patch holder is fixed with high-strength bolts to ensure the overall structural stability and load-bearing capacity; the vacuum adsorption connector provides uniform and powerful vacuum adsorption force to firmly fix the circuit board and prevent displacement; the high-performance sealing strip effectively prevents vacuum leakage and ensures adsorption reliability; the lateral connector facilitates connection to an external vacuum system to enhance flexibility; it achieves smooth longitudinal movement to adapt to circuit boards of different sizes, and is located in the high-definition detection area for easy real-time visual feedback and position correction.

[0010] Quick-connect couplings enable rapid installation and disassembly via threaded heads and external nuts, reducing downtime; multiple sealing rings ensure high airtightness at the connection; a vacuum check valve (duckbill valve) prevents air backflow, improving system sealing performance and vacuum stability; it can be connected to an emergency vacuum device to provide backup support and ensure production continuity in case of main vacuum system failure; the standardized flange design facilitates quick installation and replacement of connecting pipes, improving system expandability and maintenance convenience.

[0011] The precise three-dimensional motion and high-definition detection of the chip mounter, the stable adsorption and size adaptation of the modular mounting stage, and the reliable sealing and emergency protection of the quick-installation vacuum mounting device combine to achieve high precision, high efficiency, and high stability in the chip mounting process, adapt to diverse production needs, ensure production continuity, and improve chip mounting quality. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a top view of the overall structure of the present invention; Figure 3 This is a side view of the modular patch panel and quick-release vacuum mounting device of the present invention. Figure 4 This is a diagram illustrating the modular patching stage and quick-installation vacuum mounting device of the present invention.

[0013] In the diagram: 1. Frame; 2. Feeding system; 3. Lateral drive assembly; 4. First longitudinal drive assembly; 5. Second longitudinal drive assembly; 6. Vertical drive and placement assembly; 7. High-definition detection assembly; 8. Modular placement table; 81. First modular placement base; 82. Second modular placement base; 83. Third modular placement base; 84. Fourth modular placement base; 85. Vacuum adsorption connector; 86. Side connector; 9. Connecting pipe; 10. Main pipe; 11. Branch pipe; 12. Vacuum check valve; 13. Quick-connect coupling. Detailed Implementation

[0014] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0015] like Figures 1-4 As shown, a chip mounter for circuit board assembly includes a frame 1, a feeding system 2, a horizontal drive assembly 3, a first vertical drive assembly 4, a second vertical drive assembly 5, a vertical drive and chip mounter assembly 6, and a high-definition detection assembly 7. The feeding system 2 and the horizontal drive assembly 3 are securely mounted on the frame 1 for automatic material conveying and horizontal motion control. The upper end of the horizontal drive assembly 3 is connected to the second vertical drive assembly 5, and the side wall of the second vertical drive assembly 5 is connected to the vertical drive and chip mounter assembly 6. The end of the second vertical drive assembly 5 is equipped with the high-definition detection assembly 7. The high-definition detection assembly 7 detects the chip mount position at high resolution, and the XYZ three-axis drive assembly (i.e., the horizontal drive assembly 3, the first vertical drive assembly 4, and the second vertical drive assembly 5) works in concert to achieve precise three-dimensional motion of the chip mounter module, ensuring high precision and high efficiency in the chip mounter process.

[0016] Below the lateral drive assembly 3 is a first longitudinal drive assembly 4, on which a modular placement stage 8 is mounted. This enables the modular placement stage 8 to move smoothly in the longitudinal direction, accommodating the placement needs of circuit boards of different sizes. The modular placement stage 8 is located within the monitoring area of ​​the high-definition detection assembly 7, facilitating real-time visual feedback and position correction, thereby improving placement quality.

[0017] The modular placement stage 8 is connected to a quick-connect vacuum installation device on its side wall. This device enables quick connection and reliable sealing of the vacuum device on the modular placement stage 8, simplifying the installation and maintenance process.

[0018] The modular placement stage 8 includes a first modular placement base 81, a second modular placement base 82, a third modular placement base 83, a fourth modular placement base 84, and a vacuum adsorption connector 85. The first modular placement base 81, the second modular placement base 82, the third modular placement base 83, and the fourth modular placement base 84 are arranged sequentially from left to right and are firmly fixed with high-strength bolts to ensure the overall structural stability and load-bearing capacity. The lower end of each of the first modular placement base 81, the second modular placement base 82, the third modular placement base 83, and the fourth modular placement base 84 is equipped with a vacuum adsorption connector 85, which tightly connects to the vacuum pump integrated within the frame 1, providing uniform and powerful vacuum adsorption force to firmly fix the circuit board and prevent displacement.

[0019] High-performance sealing strips are provided between the first modular patch holder 81, the second modular patch holder 82, the third modular patch holder 83, and the fourth modular patch holder 84 to effectively prevent vacuum leakage and ensure adsorption reliability. Side connectors 86 are installed on the side walls of the first modular patch holder 81, the second modular patch holder 82, the third modular patch holder 83, and the fourth modular patch holder 84 for convenient connection to an external vacuum system, enhancing system flexibility.

[0020] The quick-connect vacuum system includes a connecting pipe 9, a main pipe 10, a branch pipe 11, a vacuum check valve 12, and a quick-connect fitting 13. The outer end of the side connector 86 is connected to the quick-connect fitting 13. The outer end of the quick-connect fitting 13 is connected to the branch pipe 11 via the vacuum check valve 12. The outer end of the branch pipe 11 is connected to a main pipe 10, and the other end of the main pipe 10 is connected to the connecting pipe 9. This connecting pipe 9 is connected to an emergency vacuum system, providing backup support in case of a main vacuum system failure, ensuring production continuity.

[0021] The outer end of the side connector 86 is provided with precision threads. The quick-connect connector 13 includes a threaded head, an outer nut, and multiple sealing rings. The inner wall of the outer nut is provided with multiple sealing rings to ensure high airtightness at the connection. The threaded head consists of a insert and a threaded tube. The insert is placed at the end of the threaded tube and inserted into the side connector 86. Multiple sealing rings are provided at the connection to enhance the sealing effect. The threaded tube and the side connector 86 are connected by tightening the outer nut, enabling quick installation and disassembly and reducing downtime.

[0022] The vacuum check valve 12 is a duckbill valve, which effectively prevents air backflow and improves the system's sealing performance and vacuum stability. A control valve is installed at the connection between the main pipe 10 and the connecting pipe 9. This control valve is a manual valve, allowing operators to easily control the vacuum on / off state. The outer end of the connecting pipe 9 features a standardized flange design, facilitating quick installation and replacement of the connecting pipe, improving system expandability and maintenance convenience, and adapting to diverse production environments.

[0023] Fix the frame 1, and securely install the feeding system 2 and the transverse drive assembly 3 on the frame 1. Install the first longitudinal drive assembly 4 below the transverse drive assembly 3, and install the modular placement stage 8 on the first longitudinal drive assembly 4. The upper end of the transverse drive assembly 3 is connected to the second longitudinal drive assembly 5, and the side wall of the second longitudinal drive assembly 5 is connected to the vertical drive and placement assembly 6. The end is equipped with a high-definition detection assembly 7 to ensure that the monitoring area of ​​the high-definition detection assembly 7 covers the modular placement stage 8. Arrange the first modular placement base 81, the second modular placement base 82, the third modular placement base 83, and the fourth modular placement base 84 from left to right and fix them with high-strength bolts. Install high-performance sealing strips between the bases, and tightly connect the lower vacuum adsorption connector 85 to the original vacuum device inside the frame 1. Install lateral connectors 86 on the side walls of each base. The outer end of the side connector 86 is connected to the quick-connect connector 13 (the threaded tube is inserted into the side connector 86, and the threaded tube is tightened to the side connector 86 by the outer nut, which is sealed by multiple sealing rings on the inner wall of the outer nut); the outer end of the quick-connect connector 13 is connected to the branch pipe 11 through the vacuum check valve 12 (duckbill valve); all branch pipes 11 are connected to the main pipe 10, and the other end of the main pipe 10 is connected to the connecting pipe 9 (standard flange design), which is connected to the emergency vacuum device; a manual control valve is installed at the connection between the main pipe 10 and the connecting pipe 9.

[0024] Upon startup, the feeding system 2 automatically conveys the circuit board to the modular placement stage 8. The first longitudinal drive component 4 drives the modular placement stage 8 longitudinally to the monitoring area of ​​the high-definition detection component 7. The high-definition detection component 7 detects the placement position of the circuit board with high resolution. The horizontal drive component 3 (X-axis), the first longitudinal drive component 4 (Y-axis), and the vertical drive and placement component 6 (Z-axis) work together to drive the vertical drive and placement component 6 to complete material picking and precise three-dimensional movement. The vertical drive and placement component 6 places the circuit board according to the detection results. The modular placement stage 8 connects to the original vacuum device through the vacuum adsorption connector 85, generating a uniform vacuum adsorption force to fix the circuit board. A high-performance sealing strip prevents vacuum leakage and ensures a stable placement process.

[0025] Shut down the original vacuum system and open the manual control valve at the connection between the main pipe 10 and the connecting pipe 9. This allows the emergency vacuum device to provide backup vacuum adsorption force to the modular placement stage 8 via connecting pipe 9 → main pipe 10 → branch pipe 11 → vacuum check valve 12 (to prevent air backflow) → quick connector 13 → side connector 86. The stability of the circuit board adsorption is observed through the high-definition detection component 7. The vacuum check valve 12 ensures the system's sealing performance, guaranteeing continuous production.

[0026] Shut down the machine and shut down the vacuum system. Loosen the high-strength bolts between the first modular patch holder 81, the second modular patch holder 82, the third modular patch holder 83, and the fourth modular patch holder 84. Remove the modular patch holders to be replaced and the old high-performance sealing strips. Install new modular patch holders, place new high-performance sealing strips, and re-secure each modular patch holder with high-strength bolts, ensuring that the vacuum adsorption connector 85 is tightly connected to the vacuum pumping device (or an additional device) inside the frame 1. Check the sealing status of the multiple sealing rings between the side connector 86 and the quick-connect connector 13. Start the equipment to test the vacuum adsorption effect. Resume production after confirming there are no leaks.

[0027] It should be noted that, in this document, relational terms such as first and second (number one, number two), etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A chip mounter for circuit board surface mount production, comprising a frame (1), a feeding system (2), a horizontal drive assembly (3), a first vertical drive assembly (4), a second vertical drive assembly (5), a vertical drive and chip mounter assembly (6), and a high-definition detection assembly (7), wherein the feeding system (2) and the horizontal drive assembly (3) are mounted on the frame (1), and the upper end of the horizontal drive assembly (3) is connected to the second vertical drive assembly (5), the side wall of the second vertical drive assembly (5) is connected to the vertical drive and chip mounter assembly (6), and the end of the second vertical drive assembly (5) is provided with a high-definition detection assembly (7), wherein the chip mounter position is detected by the high-definition detection assembly (7), and the movement of the chip mounter module is realized by the XYZ three-axis drive assembly, characterized in that: Below the horizontal drive assembly (3) is a first vertical drive assembly (4), on which a modular mounting stage (8) is installed to realize the movement of the modular mounting stage (8), which is located within the monitoring area of ​​the high-definition detection assembly (7). The modular mounting stage (8) is connected to a quick-installation vacuum mounting device on its side wall, which enables the connection of the vacuum device on the modular mounting stage (8).

2. The chip mounter for circuit board assembly according to claim 1, characterized in that: The modular mounting station (8) includes a first modular mounting base (81), a second modular mounting base (82), a third modular mounting base (83), a fourth modular mounting base (84), and a vacuum adsorption connector (85). The first modular mounting base (81), the second modular mounting base (82), the third modular mounting base (83), and the fourth modular mounting base (84) are arranged sequentially from left to right and fixed by bolts. The lower ends of the first modular mounting base (81), the second modular mounting base (82), the third modular mounting base (83), and the fourth modular mounting base (84) are all provided with vacuum adsorption connectors (85) and are connected to the vacuum pumping device inside the frame (1).

3. A chip mounter for circuit board surface mount production according to claim 2, characterized in that: A sealing strip is provided between the first modular patch holder (81), the second modular patch holder (82), the third modular patch holder (83), and the fourth modular patch holder (84), and a lateral connector (86) is installed on the side wall of the first modular patch holder (81), the second modular patch holder (82), the third modular patch holder (83), and the fourth modular patch holder (84).

4. A chip mounter for circuit board assembly according to claim 3, characterized in that: The quick-connect vacuuming device includes a connecting pipe (9), a main pipe (10), a branch pipe (11), a vacuuming check valve (12), and a quick-connect connector (13). The outer end of the side connector (86) is connected to the quick-connect connector (13), and the outer end of the quick-connect connector (13) is connected to the branch pipe (11) through the vacuuming check valve (12). The outer end of the branch pipe (11) is connected to a main pipe (10), and the other end of the main pipe (10) is connected to the connecting pipe (9). The connecting pipe (9) is connected to the emergency vacuuming device.

5. A chip mounter for circuit board surface mount production according to claim 4, characterized in that: The outer end of the side connector (86) is provided with threads. The quick-connect connector (13) includes a threaded head, an outer nut and a sealing ring. The inner wall of the outer nut is provided with multiple sealing rings. The threaded head consists of a tube and a screw tube. The tube is placed at the port of the screw tube. The tube is inserted into the side connector (86) and the connection is provided with multiple sealing rings. The screw tube is connected to the side connector (86) through the outer nut.

6. A chip mounter for circuit board assembly according to claim 5, characterized in that: The vacuum check valve (12) is a duckbill valve. The vacuum check valve (12) prevents air backflow and improves sealing performance. A control valve is provided at the connection between the main pipe (10) and the connecting pipe (9). The control valve is a manual valve. The outer end of the connecting pipe (9) is a flange, which facilitates the installation of the connecting pipe (9).

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