Interconnected assembly and photovoltaic assembly

Abstract

An interconnection assembly and a photovoltaic module, the interconnection assembly comprising a base film, a metal solder strip and a conductive adhesive layer; the metal solder strip is arranged on the base film; the conductive adhesive layer is connected to the metal solder strip, and at least part of the conductive adhesive layer is located on the side of the metal solder strip away from the base film. The present application integrates the base film, the metal solder strip and the conductive adhesive layer into a complete component, which can be directly combined with the photovoltaic module. In this way, the traditional multiple processes of solder strip laying, conductive adhesive coating and encapsulation film laying in the preparation process of the photovoltaic module are combined into one process, which significantly simplifies the production process, improves the production efficiency, and at the same time improves the consistency and stability of the interconnection structure, reduces the risk of poor contact, virtual welding, falling off and the like.

Description

Technical Field

[0001] This application relates to the field of solar cell technology, specifically to an interconnecting module and a photovoltaic module. Background Technology

[0002] Photovoltaic modules consist of cell strings and busbars, which are electrically connected via solder strips to achieve series-parallel connection of adjacent cell strings. Current technology requires three separate processes to connect photovoltaic modules to the solder strips: separately laying the solder strips, separately applying conductive adhesive, and separately applying insulation protection. This process is not only cumbersome and inefficient, but also prone to problems such as uneven conductive adhesive application, weak adhesion between the solder strips and the base film, and insufficient insulation gaps. These issues lead to potential problems such as poor contact, short circuits, and interlayer delamination, failing to meet the requirements for efficient mass production and long-term stable operation. Summary of the Invention

[0003] The purpose of this application is to provide an interconnection module and a photovoltaic module that solves the problem of cumbersome manufacturing process in existing photovoltaic modules.

[0004] To achieve the objectives of this application, the following technical solution is provided: In a first aspect, the present invention provides an interconnection component applied in a photovoltaic module. The interconnection component includes a base film, a metal solder strip, and a conductive adhesive layer. The metal solder strip is disposed on the base film. The conductive adhesive layer connects the metal solder strip, and at least a portion of the conductive adhesive layer is located on the side of the metal solder strip facing away from the base film.

[0005] In some embodiments, the base film contains one or more of the following: ethylene and vinyl acetate copolymer, polyolefin, polyethylene, polypropylene, polyurethane, and polyvinyl butyral.

[0006] In some embodiments, the base film contains an insulating reinforcing agent, an anti-aging agent, and a crosslinking agent.

[0007] In some embodiments, the breakdown voltage of the base film is ≥1000 V.

[0008] In some embodiments, the metal solder strip contains one or more of copper, silver, and gold.

[0009] In some embodiments, the thickness of the metal solder strip is 10 μm to 20 μm.

[0010] In some embodiments, the linewidth of the metal solder strip is 40 μm to 60 μm.

[0011] In some embodiments, the conductive adhesive layer contains metal powder and conductive carbon material.

[0012] In some embodiments, the thickness of the conductive adhesive layer is 5 μm to 10 μm.

[0013] In some embodiments, the metal powder includes one or more of copper powder, silver powder, and gold powder.

[0014] In some embodiments, the particle size of the metal powder is 50 nm to 100 nm.

[0015] In some embodiments, the conductive carbon material includes one or more of graphene, fullerene, carbon black, and carbon nanotubes.

[0016] In some embodiments, the conductive carbon material accounts for 0.5% to 1% of the mass of the conductive adhesive layer.

[0017] In a second aspect, the present invention provides a photovoltaic module, including a battery string and an interconnecting component as described in any one of the embodiments of the first aspect, the interconnecting component being connected to the battery string.

[0018] In some embodiments, the photovoltaic module further includes a busbar, and the battery string group includes a first string group and a second string group arranged at intervals. The busbar is disposed between the first string group and the second string group, and the first string group and the second string group are electrically connected to the busbar through the interconnection component.

[0019] In some embodiments, the end of the busbar extending from the battery string has a bend, and the distance between the metal solder strip and the bend is greater than or equal to 5 mm.

[0020] In some embodiments, the battery string includes multiple solar cells, with a spacing of 2mm to 3mm between adjacent solar cells.

[0021] This invention achieves a complete component by integrating a base film, metal solder strip, and conductive adhesive layer into a single composite. This component can be directly combined with photovoltaic modules, thereby merging multiple processes in the traditional photovoltaic module manufacturing process, such as solder strip laying, conductive adhesive coating, and encapsulation film laying, into a single process. This significantly simplifies the production process, improves production efficiency, enhances the consistency and stability of the interconnect structure, and reduces the risks of poor contact, incomplete soldering, and detachment. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a front view of a photovoltaic module according to one implementation method; Figure 2 This is a rear view of a photovoltaic module according to one implementation method; Figure 3 yes Figure 2 A magnified view within the dashed box; Figure 4 This is a cross-sectional view of an interconnect component according to one implementation method. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or it can be in a middle component. When a component is said to be "connected" to another component, it can be directly connected to the other component or it may be in a middle component.

[0026] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0027] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0028] This invention provides an interconnection component 10, please refer to... Figure 1 and Figure 2 The interconnecting module 10 is used in photovoltaic modules to connect battery strings and busbars. Specifically, the interconnecting module 10 can be used in back contact solar cell modules (BC cells). The interconnecting module 10 integrates solder ribbon, conductive adhesive, and encapsulation mold into a single structure, which can integrate the three processes of "solder ribbon laying, conductive adhesive coating, and encapsulation film laying" in the prior art into one process. After the interconnecting module 10 is aligned with the battery string and hot-pressed for curing, it can be directly assembled with the busbar.

[0029] For some implementation methods, please refer to Figures 2-4 The interconnect component 10 includes a base film 11, a metal solder ribbon 12, and a conductive adhesive layer 13. The metal solder ribbon 12 is disposed on the base film 11. The conductive adhesive layer 13 connects to the metal solder ribbon 12, with at least a portion of the conductive adhesive layer 13 located on the side of the metal solder ribbon 12 facing away from the base film 11. Specifically, the interconnect component 10 can be structured such that the metal solder ribbon 12 is connected to the base film 11, the conductive adhesive layer 13 covers the metal solder ribbon 12, and the conductive adhesive layer 13 presses the metal solder ribbon 12 firmly onto the base film 11. This interconnect component 10 can be directly attached to the back of a battery string, simultaneously achieving the triple functions of conductive interconnection of solar cells, structural bonding, and encapsulation insulation.

[0030] This invention achieves a complete component by integrating a base film 11, a metal solder strip 12, and a conductive adhesive layer 13 into a single composite. This component can be directly combined with a photovoltaic module, thereby merging multiple processes in the traditional photovoltaic module manufacturing process, such as solder strip laying, conductive adhesive coating, and encapsulation film laying, into a single process. This significantly simplifies the production process, improves production efficiency, enhances the consistency and stability of the interconnect structure, and reduces the risks of poor contact, incomplete soldering, and detachment.

[0031] In a specific embodiment, the width of the conductive adhesive layer 13 can be greater than the width of the metal solder strip 12, so that the conductive adhesive layer 13 can protrude from the metal solder strip 12 in the width direction of the metal solder strip 12, thereby directly connecting to the base film 11. The conductive adhesive layer 13 protruding from the metal solder strip 12 can further enhance the bonding strength between the metal solder strip 12 and the base film 11. Alternatively, the width of the conductive adhesive layer 13 can be the same as the width of the metal solder strip 12; this avoids waste of conductive adhesive and ensures full contact between the metal solder strip 12 and the conductive adhesive layer 13, ensuring the uniformity and stability of current transmission. Alternatively, the width of the conductive adhesive layer 13 can be less than the width of the metal solder strip 12, which can reduce the amount of conductive adhesive used and further reduce production costs.

[0032] In some embodiments, the base film 11 is a thin film structure, and the material used to make the base film 11 may include one or more of ethylene and vinyl acetate copolymer (EVA), polyolefin (POE), polyethylene (PE), polypropylene (PP), polyvinyl butyral (PVB), and polyurethane. Preferably, the base film 11 may be made of modified ethylene and vinyl acetate copolymer. The above-mentioned materials have high light transmittance, which is beneficial for improving the photoelectric conversion efficiency of photovoltaic modules. They are also widely available, have excellent processing performance, and can balance high adhesion, high flexibility, and high weather resistance, making them suitable for photovoltaic lamination processes.

[0033] In some embodiments, the base film 11 also includes an insulating reinforcing agent. The insulating reinforcing agent is used to improve the insulation strength and breakdown voltage of the base film 11, fill the microscopic voids inside the base film 11, block internal charge conduction pathways, reduce the leakage risk of the base film 11 under high temperature, high humidity, and high pressure environments, prevent short circuits or insulation failures between battery electrodes, enable the module to meet outdoor high insulation safety requirements, eliminate the need for additional insulation layers, simplify the module structure, and reduce production costs. Optionally, the insulating reinforcing agent may include at least one of nano-silica, nano-alumina, talc, and mica powder.

[0034] In some embodiments, the base film 11 also contains an anti-aging agent. The anti-aging agent is used to inhibit the aging and degradation of the base film 11 under long-term outdoor exposure to sunlight, humidity, heat, and high / low temperature cycling. It effectively absorbs ultraviolet light, scavenge free radicals, and delays phenomena such as yellowing, embrittlement, cracking, delamination, and adhesion failure of the base film 11. This improves the weather resistance and structural stability of the encapsulating film, ensuring the long-term stability of the electrical and mechanical properties of the photovoltaic module during outdoor use. Optionally, the anti-aging agent may include at least one of ultraviolet absorbers, light stabilizers, hindered phenolic antioxidants, and phosphite antioxidants.

[0035] In some embodiments, the base film 11 further includes a crosslinking agent. The crosslinking agent is used to initiate a three-dimensional network crosslinking curing reaction of the matrix resin of the base film 11, improving the degree of crosslinking, cohesive strength, and heat resistance of the base film 11, enhancing the connection strength between the base film 11 and the metal solder strip 12 and the conductive adhesive layer 13, and preventing problems such as delamination, debonding, displacement, and creep during lamination or long-term use. Simultaneously, it improves the base film 11's resistance to damp heat and high / low temperature cycling, ensuring the long-term reliable operation of the component in harsh outdoor environments. Optionally, the crosslinking agent may include at least one of di-tert-butyl peroxide, dicumyl peroxide, tert-butyl peroxide, and organosilane crosslinking agents.

[0036] In some embodiments, the breakdown voltage of the base film 11 is ≥1000V. By controlling the breakdown voltage of the base film 11 to 1000V or higher, it is possible to ensure that the interconnect component 10 does not experience insulation failure during long-term use. At the same time, the additional insulating film, insulating pad, or insulating coating required in traditional BC battery interconnect structures can be eliminated, significantly simplifying the structure of the interconnect component 10, reducing overall material and manufacturing costs, and making the interconnect component 10 more suitable for efficient mass production and large-scale application while meeting high insulation safety standards.

[0037] In some embodiments, the metal solder strip 12 contains one or more of copper, silver, and gold. Preferably, the metal solder strip 12 can be made of copper foil. Using copper foil as the main material of the metal solder strip 12 can ensure efficient and stable transmission of battery current, significantly reduce the cost of component metal materials, and the surface of the copper foil solder strip is easy to modify for anti-oxidation and solderability, making it suitable for low-temperature conductive adhesive bonding and lamination encapsulation processes, improving the long-term reliability of the interconnect structure, and is particularly suitable for solderless integrated interconnect scenarios of BC batteries. Preferably, the surface of the metal solder strip 12 has an anti-oxidation layer that can withstand 2000 hours of damp heat cycling without oxidation.

[0038] In some embodiments, the thickness of the metal solder strip 12 is 10 μm to 20 μm. Optionally, the thickness of the metal solder strip 12 can be 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, or 20 μm.

[0039] By controlling the thickness of the metal ribbon 12 within the aforementioned range, it is possible to ensure that the metal ribbon 12 has sufficient mechanical strength and conductive cross-sectional area, effectively reducing series resistance and avoiding problems such as insufficient current carrying capacity, easy breakage, and easy deformation caused by excessively thin ribbons, thus ensuring stable and efficient current transmission. At the same time, it can maintain the excellent flexibility and adhesion of the metal ribbon 12, enabling it to closely adhere to the surface of the solar cell during the composite process with the conductive adhesive layer 13 and the base film 11 and the manufacturing process of photovoltaic modules, reducing interface gaps and poor contact.

[0040] In some embodiments, the linewidth of the metal solder strip 12 is 40 μm to 60 μm. Optionally, the linewidth of the metal solder strip 12 can be 40 μm, 41 μm, 42 μm, 43 μm, 44 μm, 45 μm, 46 μm, 47 μm, 48 μm, 49 μm, 50 μm, 51 μm, 52 μm, 53 μm, 54 μm, 55 μm, 56 μm, 57 μm, 58 μm, 59 μm, or 60 μm.

[0041] By controlling the linewidth of the metal solder ribbon 12 within the aforementioned range, the typical spacing between the fine grid lines on the back of the BC battery and the interdigitated electrodes can be precisely matched, achieving efficient alignment and bonding between the solder ribbon and the battery electrodes and a stable electrical connection. At the same time, it can ensure that the solder ribbon has sufficient conductive cross-sectional area, effectively reducing series resistance, improving current collection and transmission capabilities, and avoiding the risk of insufficient current carrying capacity, localized heating, or breakage due to excessively narrow linewidth.

[0042] In some embodiments, the conductive adhesive layer 13 comprises metal powder and conductive carbon material. Optionally, the metal powder includes one or more of copper powder, silver powder, and gold powder; the conductive carbon material includes one or more of graphene, fullerene, carbon black, and carbon nanotubes. Preferably, the metal powder can be copper powder, and the conductive carbon material can be graphene. The conductive adhesive layer 13 made of the above materials can balance conductivity and low-temperature curing requirements, avoiding high-temperature damage to the solar cell.

[0043] In some embodiments, the thickness of the conductive adhesive layer 13 is 5 μm to 10 μm. Optionally, the thickness of the conductive adhesive layer 13 can be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm.

[0044] By controlling the thickness of the conductive adhesive layer 13 within the aforementioned range, it is possible to ensure that the conductive adhesive layer 13 completely covers and fully wets the metal solder ribbon 12, effectively filling the microscopic gaps between the metal solder ribbon 12 and the solar cell, forming a continuous and dense conductive path, and ensuring stable current transmission. At the same time, it can avoid the increase in resistivity, dispersion of the conductive network, and contamination of the solar cell and base film 11 by excessive adhesive layer thickness.

[0045] In some embodiments, the particle size of the metal powder is 50 nm to 100 nm. Optionally, the particle size of the metal powder can be 50 nm, 55 nm, 60 nm, 65 nm, 70 nm, 75 nm, 80 nm, 85 nm, 90 nm, 95 nm, or 100 nm.

[0046] By controlling the particle size of the metal powder within the aforementioned range, the conductive adhesive layer 13 can achieve significant improvements in conductive pathway construction, dispersion uniformity, contact stability, and curing properties. Simultaneously, this particle size range can enhance the interfacial wettability and adhesion between the conductive adhesive and the battery electrodes and metal solder strips 12, reducing interfacial voids, incomplete connections, and poor contact. This ensures that the conductive adhesive layer 13 does not crack, peel off, or migrate during lamination and curing, significantly improving the long-term reliability and power generation stability of the interconnect structure.

[0047] In some embodiments, the conductive carbon material accounts for 0.5% to 1% of the mass of the conductive adhesive layer 13. Optionally, the mass percentage of the conductive carbon material in the conductive adhesive layer 13 can be 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, or 1%.

[0048] By controlling the mass ratio of conductive carbon material within the above range, the conductive adhesive layer 13 can achieve the best balance between conductivity, bonding strength, curing stability, and dispersion uniformity. At the same time, the mixing ratio range is compatible with the low-temperature rapid curing molding process, which can ensure that the conductivity meets the requirements of BC battery solderless interconnection, while maintaining the excellent adhesion, flexibility, and aging resistance of the conductive adhesive layer 13, thereby improving the mass production yield of the module and the long-term reliability in outdoor applications.

[0049] This invention provides a method for fabricating an interconnect component. The method comprises: Step S100: Cut the base film to a preset size and lay it on the roller coating device; Step S200: Lay the metal welding strip in the preset area; In step S300, conductive adhesive is uniformly rolled onto a preset area of ​​the base film, and after curing, an interconnect component is obtained.

[0050] In a specific embodiment, the conductive adhesive is the precursor material for the conductive adhesive layer in the above embodiments. During the roller coating process, the roller coating speed, roller coating pressure, and adhesive supply can be controlled to keep the error of the conductive adhesive within ±1%. Preferably, the composite strength among the base film, conductive adhesive layer, and metal solder ribbon is ≥10 N / cm.

[0051] In a specific embodiment, the preset area is the area where metal welding strips need to be laid. After the conductive adhesive is applied, the material needs to be cured at a low temperature. The curing temperature can be 60℃~100℃, and the curing time can be 10s~120s. Optionally, the curing temperature can be 60℃, 70℃, 80℃, 90℃, or 100℃; and the curing time can be 10s, 30s, 60s, 90s, or 120s.

[0052] This invention also provides a photovoltaic module 100, please refer to... Figures 1-2 The photovoltaic module 100 includes a battery string group 20 and an interconnecting component 10 as described above, with the interconnecting component 10 connected to the battery string group 20. Specifically, the photovoltaic module 100 may include a front light-transmitting cover, an encapsulating film, the battery string group 20, a rear encapsulating film, a backsheet, and a frame. The interconnecting component 10 replaces the discrete solder strips, independent conductive adhesive layers, separate encapsulating films, and insulating layers in traditional technologies, and is located between the battery string group 20 and the backsheet.

[0053] In a specific embodiment, the battery string group 20 may include multiple battery strings, which are arranged in a regular array. This array arrangement is adapted to the size specifications and installation requirements of existing photovoltaic modules 100, while taking into account current transmission efficiency and structural stability. Multiple spaced battery strings are arranged along a first direction X (preferably the length or width direction of the photovoltaic module 100), and the multiple battery strings are arranged in parallel and spaced along the first direction X, with a fixed and uniform spacing between adjacent battery strings.

[0054] In a specific embodiment, each battery string includes multiple solar cells 23, which are arranged in series along a second direction Y perpendicular to the first direction X to form a complete current transmission unit; and the number of solar cells 23 in multiple battery strings is the same, that is, the specifications and dimensions of all battery strings are consistent, so that the power generation and current output capability of each battery string are perfectly matched.

[0055] In some embodiments, the photovoltaic module 100 further includes a busbar 30, and the battery string group 20 includes a first string group 21 and a second string group 22 arranged at intervals, with the busbar 30 disposed between the first string group 21 and the second string group 22. Specifically, the busbar 30 is used to collect the current generated by each battery string group 20 and output it uniformly to the junction box, realizing centralized current conduction and connection to the external circuit. The busbar 30 extends along a first direction X, and its two ends are used to connect the positive terminal line and the negative terminal line, respectively.

[0056] In a specific embodiment, the busbar 30 includes a first busbar 31, a second busbar 32, and a third busbar 33 spaced apart along a second direction Y, all extending along a first direction X. A first string group 21 is disposed between the first busbar 31 and the second busbar 32, and is electrically connected to the first busbar 31 and the second busbar 32 via an interconnecting component 10. A second string group 22 is disposed between the second busbar 32 and the third busbar 33, and is electrically connected to the second busbar 32 and the third busbar 33 via the interconnecting component 10.

[0057] In a specific embodiment, one end of the second busbar 32 is connected to the positive electrode in the first direction X, and the other end is connected to the negative electrode. The electrical connection lines of the first string group 21 and the second string group 22 are symmetrical about the second busbar 32, and the positive and negative electrodes of adjacent battery strings in the battery string group 20 are arranged alternately. Exemplarily, the first string group 21 forms a first line through the interconnection component 10, and the second string group 22 forms a second line through the interconnection component 10. Both the first line and the second line extend in an S-shape and are symmetrical about the second busbar 32. Optionally, the number of battery strings in both the first string group 21 and the second string group 22 can be six, and the number of solar cells 23 in each battery string can be nine. The first string group 21 and the second string group 22 are BC battery string groups 20 with an even number of main grids.

[0058] In some embodiments, the chamfered edge of the solar cell 23 in the first string group 21 that is close to the busbar 30 faces the second busbar 32, and the right-angled edge of the solar cell 23 in the second string group 22 that is close to the busbar 30 faces the second busbar 32.

[0059] In some embodiments, the end of the second busbar 32 extending out of the battery string 20 has a bending point, and the distance between the metal solder strip and the bending point is greater than or equal to 5 mm. Specifically, in the first direction X, both ends of the second busbar 32 protrude from the edge of the battery string 20, and the protruding portions of the second busbar 32 are used to connect the positive and negative terminals, so the protruding portions of the second busbar 32 have bending points. The distance between the metal solder strip and the bending point in the first direction X is greater than or equal to 5 mm. Optionally, the distance between the metal solder strip and the bending point can be 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, 16 mm, 17 mm, 18 mm, 19 mm, or 20 mm.

[0060] By controlling the spacing between the metal solder strip and the busbar 30 within the aforementioned range, the optimal balance can be achieved between the insulation safety, structural compactness, and process tolerance of the photovoltaic module 100. This ensures sufficient electrical isolation distance between the metal solder strip and the busbar 30, effectively preventing safety hazards during lamination, assembly, or long-term use. At the same time, it helps maintain a compact and orderly arrangement of the battery string 20, ensuring a reasonable current transmission path and reducing resistance losses caused by ineffective wiring.

[0061] In some embodiments, the spacing between adjacent solar cells 23 is 2mm to 3mm. Optionally, the spacing between adjacent solar cells 23 can be 2mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm, 2.8mm, 2.9mm, or 3mm.

[0062] By controlling the spacing between solar cells 23 within the aforementioned range, an optimal balance can be achieved between the space utilization of the photovoltaic module 100, the adaptability of the lamination process, and the reliability of cell protection. At the same time, it can effectively prevent the edges of adjacent cells from being squeezed and collided during the lamination process, significantly reducing the risk of microcracks, edge chipping, and breakage of the cells.

[0063] The technical solution of the present invention will be described in detail below through specific embodiments.

[0064] Example 1 This embodiment provides a photovoltaic module and its manufacturing method. The photovoltaic module includes interconnect components, battery strings, and busbars.

[0065] The interconnect component comprises a base film, metal solder strips, and a conductive adhesive layer. The base film is a modified ethylene and vinyl acetate copolymer (EVA) with added anti-aging agents and insulation reinforcing agents; the breakdown voltage of the base film is 1000V. The metal solder strip is a 15μm thick copper foil solder strip with a linewidth of 50μm; the surface of the metal solder strip has undergone surface anti-oxidation treatment. The conductive adhesive layer comprises copper powder (50nm particle size) and graphene (0.5% addition); the contact resistance of the conductive adhesive layer is 0.01mΩ·cm. 2 The interconnect components are manufactured using a roller coating process, with a curing temperature of 80℃ and a curing time of 30 seconds. The amount of conductive adhesive used is controlled within ±1%, and the composite strength of the interconnect components is 10 N / cm.

[0066] The battery string assembly includes a first string group and a second string group, symmetrically distributed on both sides of the central busbar. The battery string assembly uses 210mm TBC (TOPCon Back Contact) type solar cells. The solar cells have an even number of main grids, with positive and negative electrodes arranged alternately. The spacing between adjacent solar cells is 2mm. In the first string group, the chamfered edges of the solar cells closest to the busbar face the busbar, and in the second string group, the right-angled edges of the solar cells closest to the central busbar face the busbar. The spacing between the metal solder strip and the bend in the busbar is 5mm.

[0067] The manufacturing method of photovoltaic modules includes: aligning the arranged cell strings with the metal welding rods on the interconnecting modules, then placing them onto the interconnecting modules; and finally pressing the aligned cell strings and interconnecting modules using low-temperature hot pressing, wherein the hot pressing temperature is 80℃ and the pressure is 0.3MPa. The manufactured photovoltaic modules are then tested, and the results show: the defect rate at the connection between the cell strings and the interconnecting modules is 0.06%, the yield rate of the photovoltaic modules is 96.2%, the production line speed is increased by 30%, labor costs are reduced by 25%, and material costs are reduced by 12%.

[0068] Example 2 This embodiment provides a photovoltaic module and its manufacturing method. The photovoltaic module includes interconnect components, battery strings, and busbars.

[0069] The interconnect component comprises a base film, metal solder strips, and a conductive adhesive layer. The base film is a modified ethylene and vinyl acetate copolymer (EVA) with added anti-aging agents and insulation reinforcing agents; the breakdown voltage of the base film is 1000V. The metal solder strip is a 15μm thick copper foil solder strip with a linewidth of 50μm; the surface of the metal solder strip has undergone surface anti-oxidation treatment. The conductive adhesive layer comprises copper powder (100nm particle size) and graphene (1% addition); the contact resistance of the conductive adhesive layer is 0.008mΩ·cm. 2 The interconnect components are manufactured using a roller coating process, with a curing temperature of 80℃ and a curing time of 30s after roller coating; the amount of conductive adhesive layer is controlled within ±0.8% error, and the composite strength of the interconnect components is 12N / cm.

[0070] The battery string assembly includes a first string group and a second string group, symmetrically distributed on both sides of the central busbar. The battery string assembly uses 182mm HPBC (High Efficiency Passivated Back Contact) type solar cells. The solar cells have an even number of main grids, with positive and negative electrodes arranged alternately. The spacing between adjacent solar cells is 3mm. In the first string group, the chamfered edges of the solar cells closest to the busbar face the busbar, while in the second string group, the right-angled edges of the solar cells closest to the central busbar face the busbar. The spacing between the metal solder strip and the bend in the busbar is 6mm.

[0071] The manufacturing method of photovoltaic modules includes: aligning the arranged cell strings with the metal welding rods on the interconnecting modules, then placing them onto the interconnecting modules; and finally pressing the aligned cell strings and interconnecting modules using low-temperature hot pressing, wherein the hot pressing temperature is 80℃ and the pressure is 0.4MPa. The manufactured photovoltaic modules are then tested, and the results show: the defect rate at the connection between the cell strings and the interconnecting modules is 0.04%, the yield rate of the photovoltaic modules is 96.8%, the production line speed is increased by 32%, labor costs are reduced by 25%, and material costs are reduced by 12%.

[0072] The test results from Examples 1 and 2 show that connecting metal solder strips to battery strings using interconnect components requires only three steps: alignment, hot pressing, and curing. This increases production line speed by 30%-32% and reduces labor costs by 25%, addressing the core pain point of cumbersome existing solder strip and battery string connection processes. Simultaneously, the base film combines encapsulation and insulation functions, eliminating the need for an additional insulation layer and reducing material costs by 12%. The reuse of metal solder strips and conductive adhesive layers further reduces solder strip usage, resulting in an overall material cost reduction of 18%-23%, aligning with the cost reduction needs of the photovoltaic industry for large-scale mass production.

[0073] Meanwhile, the photovoltaic module provided by this invention optimizes the layout of even-numbered busbar BC cell strings, keeping the reserved solder strips away from the busbar bending point, reducing the interconnection defect rate from over 1% in the prior art to below 0.06%, and stabilizing the overall yield at over 96%, significantly improving mass production stability and reducing production costs.

[0074] In the description of the embodiments of this application, it should be noted that the orientation or positional relationship of the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and other indicators are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0075] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art will understand that all or part of the processes for implementing the above embodiments and equivalent variations made in accordance with the claims of this application are still within the scope of this application.

Claims

1. An interconnection component, characterized in that, The interconnecting component is used in photovoltaic modules, and the interconnecting component includes: Base film; Metal welding strips are disposed on the base film; A conductive adhesive layer is attached to the metal solder strip, and at least a portion of the conductive adhesive layer is located on the side of the metal solder strip facing away from the base film.

2. The interconnection component according to claim 1, characterized in that, The base film contains one or more of the following: ethylene and vinyl acetate copolymer, polyolefin, polyethylene, polypropylene, polyurethane, and polyvinyl butyral; and / or, the base film contains an insulating reinforcing agent, an anti-aging agent, and a crosslinking agent; and / or, the breakdown voltage of the base film is ≥1000 V.

3. The interconnection component according to claim 1, characterized in that, The metal solder strip contains one or more of copper, silver, and gold; and / or, the thickness of the metal solder strip is 10μm to 20μm; and / or, the linewidth of the metal solder strip is 40μm to 60μm.

4. The interconnection component according to claim 1, characterized in that, The conductive adhesive layer contains metal powder and conductive carbon material; and / or, the thickness of the conductive adhesive layer is 5μm~10μm.

5. The interconnection component according to claim 4, characterized in that, The metal powder includes one or more of copper powder, silver powder, and gold powder; and / or, the particle size of the metal powder is 50nm~100nm.

6. The interconnection component according to claim 4, characterized in that, The conductive carbon material includes one or more of graphene, fullerene, carbon black, and carbon nanotubes; and / or, the conductive carbon material accounts for 0.5% to 1% of the mass of the conductive adhesive layer.

7. A photovoltaic module, characterized in that, It includes a battery string and an interconnect component as described in any one of claims 1-6, the interconnect component being connected to the battery string.

8. The photovoltaic module according to claim 7, characterized in that, The photovoltaic module further includes a busbar, and the battery string group includes a first string group and a second string group arranged at intervals. The busbar is disposed between the first string group and the second string group, and the first string group and the second string group are electrically connected to the busbar through the interconnection component.

9. The photovoltaic module according to claim 8, characterized in that, The end of the busbar extending from the battery string has a bending point, and the distance between the metal solder strip and the bending point is greater than or equal to 5mm.

10. The photovoltaic module according to claim 8, characterized in that, The battery string includes multiple solar cells, and the spacing between adjacent solar cells is 2mm to 3mm.

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