LED chip heat dissipation structure

Abstract

The application relates to the technical field of LED chip heat dissipation, in particular to an LED chip heat dissipation structure, which comprises a substrate, a plurality of installation openings are formed in the top of the substrate, a cavity is formed in the bottom of the installation opening, elastic connection is made between the top of the cavity and two sides of the elastic block, the outside bottom of the elastic block is connected with a receiving plate, a plurality of heat conduction sheets are arranged at the bottom of the elastic block and the receiving plate, and a heat dissipation plate is arranged at the bottom of the cavity; the LED chip heat dissipation structure has the beneficial effects that when the LED chip is encapsulated, the LED chip is pressed into the two receiving plates along the arc angle of the top of the outside of the elastic block, the elastic block starts to clamp the LED chip through the micro spring connected with the inside, the LED chip is pre-fixed, the LED chip is prevented from falling from the installation opening when the encapsulation glue is applied, and the bottom outside of the two receiving plates in the cavity is respectively provided with a protective sleeve pipe and a protective plug-in rod, and the protective plug-in rod can be stretched and contracted through the elastic block.

Description

Technical Field

[0001] This invention relates to the field of LED chip heat dissipation technology, specifically to an LED chip heat dissipation structure. Background Technology

[0002] The main components of an LED chip are P-type and N-type semiconductors, which combine to form a PN junction. When current flows through a wire and acts on the chip, electrons are pushed into the P-region, where they recombine with holes and emit energy in the form of photons.

[0003] However, the encapsulating adhesive of existing LED chips exposed to high temperatures for extended periods will exhibit yellowing, cracking, and a decrease in refractive index, accelerating phosphor aging. In severe cases, thermal stress concentration can even lead to bond wire breakage or chip detachment, thereby significantly reducing the working stability and reliability of LED chips. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation structure for LED chips to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a substrate, the top of which has multiple sets of mounting openings, and a cavity is formed at the bottom of the mounting openings. Telescopic blocks are elastically connected to both sides of the top of the cavity, and a receiving plate is connected to the bottom of the outer side of the telescopic blocks. Multiple sets of heat-conducting sheets are provided at the bottom of the telescopic blocks and the receiving plate, and a heat dissipation plate is provided at the bottom of the cavity.

[0006] Preferably, micro springs are provided on both sides of the top of the cavity, the inner side of the micro springs is connected to the inner wall of the cavity, and the outer side of the micro springs is connected to the telescopic block. The micro springs can drive the telescopic block to extend and retract.

[0007] Preferably, the top of the receiving plate supports the LED chip, and the top of the outer side of the telescopic block is provided with an arc corner, which holds the LED chip between the two sets of receiving plates.

[0008] Preferably, a protective sleeve is provided on the outer side of the receiving plate on one side of the cavity, and a protective insertion rod is provided on the outer side of the receiving plate on the other side of the cavity. The protective insertion rod is inserted into the protective sleeve and can extend and retract within the protective sleeve.

[0009] Preferably, the substrate has limiting grooves on both sides of the telescopic block and the receiving plate, and limiting blocks are provided on both sides of the telescopic block and the receiving plate. The limiting blocks are inserted into the limiting grooves to limit the telescopic block and the receiving plate and prevent the micro springs connected inside the telescopic block from bending.

[0010] Preferably, the heat-conducting sheet has a through hole in the middle, which connects the entire cavity space, and the bottom of the through hole is in close contact with the heat dissipation plate disposed at the bottom of the cavity on the substrate.

[0011] Preferably, the heat sink extends across the bottom of the entire cavity, and the bottom of the heat sink is connected to the heat sink fin. The substrate has multiple sets of protrusions at the bottom of the cavity, and each protrusion corresponds to a heat sink fin. The bottom of the heat sink fin extends out from the bottom of the protrusion.

[0012] Preferably, the heat sink has a heat dissipation hole in the middle, which extends through the entire heat sink and connects the cavity with the external space, allowing cooling air to enter the cavity through the heat dissipation hole.

[0013] Preferably, the two sets of LED chips are connected by bonding wires, which connect all the LED chips installed in the mounting port.

[0014] Preferably, the top surface of the substrate is coated with encapsulating adhesive, which encapsulates the LED chip in the mounting opening at the top of the substrate.

[0015] Compared with the prior art, the beneficial effects of the present invention are: This invention proposes an LED chip heat dissipation structure. During LED chip encapsulation, the LED chip is first pressed between two sets of receiving plates along the top arc angle of the outer side of the telescopic block. At this time, the telescopic block clamps the LED chip via a micro-spring connected internally, pre-fixing the LED chip to prevent it from falling out of the mounting opening when applying encapsulating adhesive. Furthermore, protective sleeves and protective insertion rods are respectively provided on the bottom outer sides of the two sets of receiving plates within the cavity. The protective insertion rods can extend and retract synchronously within the protective insertion rods as the telescopic block extends and retracts, preventing… The sheath and protective plug rod can limit the LED chip supported on the receiving plate to prevent the LED chip from falling to the bottom of the cavity; further, the telescopic block and the limiting block set on both sides of the receiving plate are inserted into the limiting groove opened on both sides of the cavity of the substrate to limit the telescopic block and prevent the micro spring connected inside the telescopic block from causing the telescopic block to bend, which would prevent the telescopic block from clamping the LED chip. After the LED chip is installed in the mounting hole on the substrate surface, all LED chips are connected by bonding wires, and then encapsulation glue is applied to complete the encapsulation.

[0016] When the LED chip is running, the heat emitted by the LED chip is transferred through the telescopic block and the receiving plate to the heat-conducting plate at the bottom of the telescopic block and the receiving plate, and then from the bottom of the heat-conducting plate to the heat sink plate that is tightly attached to the bottom of the heat-conducting plate. The heat sink plate then dissipates the heat through the heat sink plate connected to the bottom. Furthermore, the heat-conducting plate has through holes that connect the entire cavity to prevent uneven temperature in the cavity. Furthermore, the heat sink plate has heat dissipation holes in the middle, which allow cooling air to enter the cavity and cool the entire device in the cavity. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the three-dimensional structure of the substrate of the present invention; Figure 3 This is a schematic diagram of the cross-sectional structure of the substrate of the present invention; Figure 4 for Figure 3 Enlarged schematic diagram of the structure at point A in the middle; Figure 5 for Figure 3 Enlarged schematic diagram of the structure at point B; Figure 6 This is a schematic diagram of the cross-sectional structure of the substrate of the present invention on the other side.

[0018] In the diagram: 1. Substrate; 2. Encapsulating adhesive; 3. Mounting port; 4. LED chip; 5. Bonding wire; 6. Cavity; 7. Miniature spring; 8. Telescopic block; 9. Limiting groove; 10. Limiting block; 11. Receiving plate; 12. Arc angle; 13. Protective sleeve; 14. Protective plug rod; 15. Heat-conducting sheet; 16. Through hole; 17. Heat sink; 18. Heat sink; 19. Protrusion; 20. Heat dissipation hole. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the present invention clear and complete, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of the present invention, and are merely illustrative of the embodiments of the present invention. They are not intended to limit the embodiments of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1 to 6The present invention provides a technical solution: a substrate 1, with multiple sets of mounting holes 3 on the top of the substrate 1, and a cavity 6 at the bottom of the mounting holes 3. Telescopic blocks 8 are elastically connected to both sides of the top of the cavity 6, and a receiving plate 11 is connected to the bottom of the outer side of the telescopic blocks 8. Multiple sets of heat-conducting sheets 15 are provided at the bottom of the telescopic blocks 8 and the receiving plate 11, and a heat sink 17 is provided at the bottom of the cavity 6. The heat emitted by the LED chip 4 is transferred through the telescopic blocks 8 and the receiving plate 11 to the heat-conducting sheets 15 at the bottom of the telescopic blocks 8 and the receiving plate 11, and then from the bottom of the heat-conducting sheets 15 to the heat sink 17 that is tightly attached to the bottom of the heat-conducting sheets 15.

[0021] Miniature springs 7 are provided on both sides of the top of the cavity 6. The inner side of the miniature springs 7 is connected to the inner wall of the cavity 6, and the outer side of the miniature springs 7 is connected to the telescopic block 8. The miniature springs 7 can drive the telescopic block 8 to extend and retract. The top of the receiving plate 11 supports the LED chip 4. The top of the outer side of the telescopic block 8 is provided with an arc angle 12. The LED chip 4 is held between the two sets of receiving plates 11 by the arc angle 12. When the LED chip 4 is packaged, the LED chip 4 is first pressed into the two sets of receiving plates 11 along the arc angle 12 on the top of the outer side of the telescopic block 8. At this time, the telescopic block 8 begins to clamp the LED chip 4 through the miniature springs 7 connected on the inner side, and pre-fixes the LED chip 4.

[0022] A protective sleeve 13 is provided on the outer side of the receiving plate 11 on one side of the cavity 6, and a protective insertion rod 14 is provided on the outer side of the receiving plate 11 on the other side of the cavity 6. The protective insertion rod 14 is inserted into the protective sleeve 13 and can extend and retract within the protective sleeve 13. The substrate 1 has limiting grooves 9 on both sides of the telescopic block 8 and the receiving plate 11, and limiting blocks 10 are provided on both sides of the telescopic block 8 and the receiving plate 11. The limiting blocks 10 are inserted into the limiting grooves 9 to limit the telescopic block 8 and the receiving plate 11, preventing the micro spring 7 connected to the inner side of the telescopic block 8 from bending. The limiting blocks 10 provided on both sides of the telescopic block 8 and the receiving plate 11 are inserted into the limiting grooves 9 provided on both sides of the cavity 6 on the substrate 1 to limit the telescopic block 8, preventing the micro spring 7 connected to the inner side of the telescopic block 8 from causing the telescopic block 8 to bend, thus preventing the telescopic block 8 from clamping the LED chip 4.

[0023] A through hole 16 is provided in the middle of the heat-conducting plate 15, which connects the entire space of the cavity 6. The bottom of the through hole 16 is in close contact with the heat sink 17 provided at the bottom of the cavity 6 on the substrate 1. The heat sink 17 extends across the entire bottom of the cavity 6. The bottom of the heat sink 17 is connected to the heat sink 18. The substrate 1 has multiple sets of protrusions 19 at the bottom of the cavity 6. Each protrusion 19 corresponds to a heat sink 18. The bottom of the heat sink 18 extends out from the bottom of the protrusion 19. A heat dissipation hole 20 is provided in the middle of the heat sink 18. The heat dissipation hole 20 extends through the entire heat sink 18 and connects the cavity 6 to the external space. Cooling air can enter the cavity 6 through the heat dissipation hole 20. The heat is transferred from the bottom of the heat-conducting plate 15 to the heat sink 17 in close contact with the bottom of the heat-conducting plate 15. The heat sink 17 then dissipates the heat through the heat sink 18 connected to the bottom.

[0024] A bonding wire 5 connects the two sets of LED chips 4, and the bonding wire 5 connects all the LED chips 4 installed in the mounting port 3; the top surface of the substrate 1 is coated with encapsulating glue 2, and the encapsulating glue 2 encapsulates the LED chips 4 in the mounting port 3 on the top of the substrate 1; after the LED chips 4 in the mounting port 3 on the surface of the substrate 1 are installed, all the LED chips 4 are connected by the bonding wire 5, and then the encapsulating glue 2 is applied to complete the encapsulation.

[0025] When encapsulating the LED chip 4, the LED chip 4 is first pressed into the space between the two sets of receiving plates 11 along the arc angle 12 at the top of the outer side of the telescopic block 8. At this time, the telescopic block 8 clamps the LED chip 4 through the micro spring 7 connected on the inner side, pre-fixing the LED chip 4 to prevent it from falling out of the mounting port 3 when the encapsulating glue 2 is applied. Further, in the cavity 6, the bottom outer sides of the two sets of receiving plates 11 are respectively provided with protective sleeves 13 and protective plug rods 14. The protective plug rods 14 can extend and retract synchronously in the protective plug rods 14 through the extension and retraction of the telescopic block 8. The rod 14 can limit the LED chip 4 supported on the receiving plate 11 to prevent the LED chip 4 from falling to the bottom of the cavity 6; further, the telescopic block 8 and the limiting blocks 10 set on both sides of the receiving plate 11 are inserted into the limiting grooves 9 opened on both sides of the cavity 6 of the substrate 1 to limit the telescopic block 8 and prevent the miniature spring 7 connected inside the telescopic block 8 from bending the telescopic block 8, which would prevent the telescopic block 8 from clamping the LED chip 4. After the LED chip 4 is installed in the mounting port 3 on the surface of the substrate 1, all the LED chips 4 are connected by the bonding wire 5, and then the encapsulating glue 2 is applied to complete the encapsulation.

[0026] When the LED chip 4 is running, the heat emitted by the LED chip 4 is transferred through the telescopic block 8 and the receiving plate 11 to the heat-conducting sheet 15 at the bottom of the telescopic block 8 and the receiving plate 11, and then from the bottom of the heat-conducting sheet 15 to the heat sink 17 that is tightly attached to the bottom of the heat-conducting sheet 15. The heat sink 17 then dissipates the heat through the heat sink 18 connected to the bottom. Furthermore, the heat-conducting sheet 15 has through holes 16, which connect the entire cavity 6 to prevent uneven temperature in the cavity 6. Furthermore, the heat sink 18 has heat dissipation holes 20 in the middle, through which cooling air can enter the cavity 6 to cool the entire device in the cavity 6.

[0027] Although the illustrative specific embodiments of this application have been described above to enable those skilled in the art to understand this application, this application is not limited to the scope of the specific embodiments. For those skilled in the art, all applications utilizing the concept of this application are protected as long as various variations are within the spirit and scope of this application as defined and determined by the appended claims.

Claims

1. A heat dissipation structure for an LED chip, characterized in that: include: The substrate (1) has multiple mounting ports (3) on its top. The substrate (1) has a cavity (6) at the bottom of the mounting port (3). The top two sides of the cavity (6) are elastically connected to telescopic blocks (8). The bottom of the telescopic block (8) is connected to a receiving plate (11). The bottom of the telescopic block (8) and the receiving plate (11) are provided with multiple heat-conducting plates (15). The substrate (1) has a heat sink (17) at the bottom of the cavity (6).

2. The LED chip heat dissipation structure according to claim 1, characterized in that: Miniature springs (7) are provided on both sides of the top of the cavity (6). The inner side of the miniature springs (7) is connected to the inner wall of the cavity (6), and the outer side of the miniature springs (7) is connected to the telescopic block (8). The miniature springs (7) can drive the telescopic block (8) to extend and retract.

3. The LED chip heat dissipation structure according to claim 2, characterized in that: The top of the receiving plate (11) carries the LED chip (4), and the top of the outer side of the telescopic block (8) is provided with an arc corner (12). The LED chip (4) is held between the two sets of receiving plates (11) by the arc corner (12).

4. The LED chip heat dissipation structure according to claim 3, characterized in that: A protective sleeve (13) is provided on the outer side of the receiving plate (11) on one side of the cavity (6), and a protective plug rod (14) is provided on the outer side of the receiving plate (11) on the other side of the cavity (6). The protective plug rod (14) is inserted into the protective sleeve (13) and can extend and retract within the protective sleeve (13).

5. The LED chip heat dissipation structure according to claim 4, characterized in that: The substrate (1) has limiting grooves (9) on both sides of the telescopic block (8) and the receiving plate (11), and limiting blocks (10) are provided on both sides of the telescopic block (8) and the receiving plate (11). The limiting blocks (10) are inserted into the limiting grooves (9) to limit the telescopic block (8) and the receiving plate (11) and prevent the micro spring (7) connected to the inside of the telescopic block (8) from bending.

6. The LED chip heat dissipation structure according to claim 5, characterized in that: The heat-conducting sheet (15) has a through hole (16) in the middle, which connects the entire space of the cavity (6). The bottom of the through hole (16) is in close contact with the heat sink (17) provided at the bottom of the cavity (6) by the substrate (1).

7. The LED chip heat dissipation structure according to claim 6, characterized in that: The heat sink (17) extends across the bottom of the entire cavity (6). The bottom of the heat sink (17) is connected to the heat sink (18). The substrate (1) has multiple sets of protrusions (19) at the bottom of the cavity (6). The protrusions (19) correspond one-to-one with the heat sink (18). The bottom of the heat sink (18) extends out from the bottom of the protrusion (19).

8. The LED chip heat dissipation structure according to claim 7, characterized in that: The heat sink (18) has a heat dissipation hole (20) in the middle. The heat dissipation hole (20) runs through the entire heat sink (18) and connects the cavity (6) with the external space. Cooling air can enter the cavity (6) through the heat dissipation hole (20).

9. The LED chip heat dissipation structure according to claim 8, characterized in that: The two sets of LED chips (4) are connected by bonding wires (5), which connect all the LED chips (4) installed in the mounting port (3).

10. The LED chip heat dissipation structure according to claim 9, characterized in that: The top surface of the substrate (1) is coated with encapsulating adhesive (2), which encapsulates the LED chip (4) in the mounting port (3) at the top of the substrate (1).

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