Method of manufacturing an array sensor element

By forming a piezoelectric layer at the tapered end and the covering end of the first electrode during the manufacturing process of the piezoelectric element, the problem of mismatch in the crystal structure of the piezoelectric film is solved, the crystallinity and orientation of the piezoelectric element are improved, and the sensor performance is enhanced.

CN122161335APending Publication Date: 2026-06-05SEIKO EPSON CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SEIKO EPSON CORP
Filing Date
2025-12-03
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In existing piezoelectric elements, when the piezoelectric film covers the end of the lower electrode, the crystal structure of the piezoelectric film is mismatched with the side of the lower electrode, resulting in a decrease in overall crystallinity and orientation, which affects the sensor performance.

Method used

During the manufacturing process, a piezoelectric body layer and a second electrode layer are formed by forming a cone shape with an angle of less than 90° between the lower surface and the side surface at the end of the first electrode, and by covering the end of the first electrode in the piezoelectric element region with a gas containing chlorine and oxygen for dry etching, in order to ensure the crystallinity and orientation of the piezoelectric element region.

Benefits of technology

This improved the crystallinity and orientation of the piezoelectric element region, suppressed stress-induced degradation, and enhanced the piezoelectric performance and response speed of the sensor element.

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Abstract

The present application provides a manufacturing method of an array sensor element, which reduces a mismatch of crystal structure of a piezoelectric layer generated at an end portion of a first electrode. The manufacturing method of the array sensor element includes the following steps: (a) forming a first electrode layer on a substrate, and patterning the first electrode layer to form a first electrode; (b) forming a piezoelectric layer on the first electrode, and patterning the piezoelectric layer to form a piezoelectric element region; and (c) forming a second electrode layer on the piezoelectric element region, and patterning the second electrode layer to form a second electrode. In step (a), the first electrode layer is patterned in such a manner that a taper is formed at an end portion of the first electrode, and an angle formed by a lower surface of the first electrode and a side surface of the first electrode is less than 90°. In step (b), the piezoelectric layer is patterned in such a manner that the piezoelectric element region covers the end portion of the first electrode.
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