Semiconductor chip mounting method, apparatus, and medium

Abstract

The application discloses a semiconductor chip mounting method, device and medium, and relates to the technical field of chip mounting. The method comprises the following steps: in the case that the image of the area where the mounting mark position is located does not meet the definition requirement, the Z-direction motion module drives the vision module to move along the vertical direction until the definition reaches the definition requirement, and then the image coordinates of the mounting mark position and the Z-axis coordinates of the Z-direction motion module are determined; based on the space motion curve of the Z-direction motion module, the X and Y coordinate compensation values corresponding to the Z-axis coordinates of the Z-direction motion module are determined; and based on the coordinate compensation values, the mounting welding head is controlled by the horizontal motion module and the Z-direction motion module to perform the chip mounting operation based on the coordinates of the mounting mark position in the reference coordinate system. The application is used to solve the problem that in the prior art, the target object cannot be accurately positioned in the chip mounting process, resulting in low chip mounting precision, and realizes accurate positioning of the target object and improves the chip mounting precision.

Description

Technical Field

[0001] This application relates to the field of chip mounting, and in particular to a semiconductor chip mounting method, equipment and medium. Background Technology

[0002] In the fields of semiconductor chip mounting, advanced packaging, and high-precision surface mount technology, the vision positioning system is the core to ensure mounting accuracy. Its typical process is as follows: using an industrial camera to acquire images through an optical lens (usually a telecentric lens), using vision processing technology to locate the coordinates of the relevant target objects, and using this to visually guide the mounting head to accurately pick up the chip and mount it onto the substrate to be mounted.

[0003] In actual production environments, there are unavoidable height differences between substrates or chips to be mounted, especially between different batches and models of substrates and chips. This height difference can reach more than 10mm. The height difference of the product itself leads to a height difference between the target object and the optimal focus plane of the industrial camera. In order to achieve high resolution, the physical depth of field of high-magnification, wide-field optical lenses is usually extremely limited (micrometers to tens of micrometers). Therefore, this height difference is often greater than the depth of field of the optical lens, which will cause the captured image to be severely out of focus and unclear, making it difficult to locate the target object in the image. Even if the target object can be located, the positioning accuracy will be reduced due to image blurring, directly affecting the mounting accuracy. Summary of the Invention

[0004] In response to the aforementioned problems and technical requirements, the applicant has proposed a semiconductor chip mounting method, equipment, and medium to solve the problem of low chip mounting accuracy caused by the inability to accurately locate the target object during the chip mounting process in the prior art, thereby achieving accurate target object positioning and improving chip mounting accuracy.

[0005] This application provides a semiconductor chip mounting method, the method comprising:

[0006] The horizontal motion module drives the welding head mechanism to move above the placement mark position. The welding head mechanism includes at least a Z-axis motion module and a placement welding head and vision module connected and driven by it. The image of the area where the mounting mark is located is obtained by the vision module. If the image does not meet the clarity requirements, the Z-axis motion module is controlled to move the vision module vertically until the image obtained by the vision module meets the clarity requirements. Based on the image, the coordinates of the mounting mark position and the Z-axis coordinates of the Z-axis motion module are determined. Based on the pre-calibrated spatial motion curve of the Z-axis motion module, the coordinate compensation value corresponding to the Z-axis coordinate of the Z-axis motion module is determined. The coordinates of the mounting mark position are compensated according to the coordinate compensation value. The mounting soldering head is controlled by the horizontal motion module and the Z-axis motion module to perform chip mounting operation based on the compensated mounting mark position in the reference coordinate system.

[0007] According to the semiconductor chip mounting method provided in the embodiments of this application, the pre-calibration of the Z-axis motion module spatial motion curve includes: A lifting slide is arranged below the welding head mechanism, and a calibration plate with marked points is arranged on the lifting slide. The Z-axis motion module is controlled to drive the vision module to move vertically to multiple different calibration positions. When the vision module is at each calibration position, the lifting slide is controlled to drive the calibration plate to move along the Z-axis of the vertical direction of the reference coordinate system until the image of the calibration plate acquired by the vision module reaches the required clarity and the three-dimensional coordinates of the marker point in the reference coordinate system are determined. Based on the three-dimensional coordinates of the marker points in the reference coordinate system obtained by the vision module at different calibration positions, the spatial motion curve of the Z-axis motion module is obtained by fitting.

[0008] According to the semiconductor chip mounting method provided in the embodiments of this application, the spatial motion curve of the Z-axis motion module is obtained by fitting the three-dimensional coordinates of the marker points in the reference coordinate system, including: Extract the planar coordinates of the marker point corresponding to the current calibration position in the three-dimensional coordinate system of the reference coordinate system, and obtain the three-dimensional coordinate data by subtracting the planar coordinates from the preset reference planar coordinates and combining them with the Z-axis coordinates of the Z-axis motion module at the current calibration position. The least squares method is used to fit the spatial straight line to the three-dimensional coordinate data to obtain the spatial motion curve of the Z-axis motion module.

[0009] According to the semiconductor chip mounting method provided in the embodiments of this application, determining the three-dimensional coordinates of the marker point in the reference coordinate system includes: Determine the planar coordinates of the marker point corresponding to the current calibration position in the reference coordinate system; Based on the three-dimensional coordinates of the marker points in the reference coordinate system obtained by the vision module at different calibration positions, the spatial motion curve of the Z-axis motion module is fitted. By combining the difference between the plane coordinates of the marker point at the current calibration position in the reference coordinate system and the preset reference plane coordinates, and the Z-axis coordinates of the Z-axis motion module, three-dimensional coordinate data is obtained. Based on the three-dimensional coordinate data, the spatial motion curve of the Z-axis motion module is obtained by fitting.

[0010] According to the semiconductor chip mounting method provided in the embodiments of this application, controlling the Z-axis motion module to drive the vision module to move vertically to multiple different calibration positions includes: Based on the movable range of the Z-axis motion module and the preset position interval, multiple calibration positions are determined; The Z-axis motion module is controlled to move the vision module sequentially to each calibration position along the vertical direction.

[0011] According to the semiconductor chip mounting method provided in the embodiments of this application, the coordinate compensation value includes: the X-axis compensation value of the X-axis coordinate value and the Y-axis compensation value of the Y-axis coordinate value; Based on the pre-calibrated spatial motion curve of the Z-axis motion module, determine the coordinate compensation value corresponding to the Z-axis coordinate of the Z-axis motion module, and compensate the coordinates of the mounting mark position according to the coordinate compensation value, including: Based on the pre-calibrated spatial motion curve of the Z-axis motion module, determine the target compensation values ​​of the X-axis and Y-axis corresponding to the Z-axis coordinates of the Z-axis motion module; The X-axis coordinate of the mounting mark position in the reference coordinate system is compensated according to the X-axis target compensation value, and the Y-axis coordinate of the mounting mark position in the reference coordinate system is compensated according to the Y-axis target compensation value.

[0012] According to the semiconductor chip mounting method provided in the embodiments of this application, the spatial motion curve of the Z-axis motion module includes: ; in, Indicates the X-axis compensation value. This indicates that the X-axis target calibration value was obtained through pre-calibration. This represents the target calibration value of the Y-axis obtained from the pre-calibration. This represents the target calibration value of the Z-axis obtained from the pre-calibration. This represents the unit eigenvector corresponding to the X-axis. This represents the unit eigenvector corresponding to the Y-axis. This represents the unit eigenvector corresponding to the Z-axis. Indicates the Y-axis compensation value. This represents the Z-axis coordinate of the Z-axis motion module.

[0013] The semiconductor chip mounting method provided in the embodiments of this application The average value is calculated from multiple X-axis coordinate values ​​obtained during the error calibration process. The average value is calculated from multiple Y-axis coordinate values ​​obtained during the error calibration process. The average value is calculated from multiple Z-axis coordinate values ​​obtained during the error calibration process.

[0014] This application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the steps of the semiconductor chip mounting method as described above.

[0015] This application also provides a non-transitory computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the steps of the semiconductor chip mounting method as described above.

[0016] The semiconductor chip mounting method, apparatus, and medium provided in this application acquire an image of the area where the mounting mark is located through a vision module. If the image does not meet the clarity requirements, the Z-axis motion module is controlled to move the vision module vertically until the image acquired by the vision module meets the clarity requirements. Based on the image, the image coordinates of the mounting mark and the Z-axis coordinates of the Z-axis motion module are determined. This application controls the movement of the Z-axis motion module based on the image clarity to accurately locate the mounting mark at the Z-axis coordinates. Furthermore, based on the pre-calibrated spatial motion curve of the Z-axis motion module, a coordinate compensation value corresponding to the Z-axis coordinates of the Z-axis motion module is determined. The coordinates of the mounting mark are compensated according to the coordinate compensation value. The mounting head is controlled by the horizontal motion module and the Z-axis motion module to perform chip mounting operations based on the compensated coordinates of the mounting mark in the reference coordinate system. By compensating the mounting mark position with the coordinate compensation value, the accuracy of chip mounting is ensured. This application improves chip mounting accuracy by accurately locating the mounting mark position and compensating for the movement of the running module. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic flowchart of the semiconductor chip mounting method provided in the embodiments of this application; Figure 2 This is a schematic diagram of the chip mounting equipment provided in the embodiments of this application; Figure 3 This is a schematic diagram of a spatial straight line provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0020] This application provides a semiconductor chip mounting method. This method can be applied to smart terminals, servers, and the controller of mounting equipment. This application uses the application of this method in a server as an example for illustration, and some other descriptions in the embodiments are illustrative and not intended to limit the scope of protection of this application, and will not be described in detail thereafter. The specific implementation of the method is as follows... Figure 1 As shown: Step 101: Use the horizontal motion module to move the welding head mechanism to above the mounting mark position.

[0021] The welding head mechanism includes at least a Z-axis motion module and its connected drive mounting welding head and vision module.

[0022] Step 102: Obtain an image of the area where the mounting mark is located through the vision module. If the image does not meet the clarity requirements, control the Z-axis motion module to move the vision module vertically until the image obtained by the vision module meets the clarity requirements. Then, determine the image coordinates of the mounting mark location and the Z-axis coordinates of the Z-axis motion module based on the image.

[0023] The Z-axis coordinate is the motor position of the Z-axis motor in the Z-axis motion module, fed back by the encoder.

[0024] Step 103: Based on the pre-calibrated spatial motion curve of the Z-axis motion module, determine the coordinate compensation value corresponding to the Z-axis coordinate of the Z-axis motion module, compensate the coordinates of the mounting mark position according to the coordinate compensation value, and control the mounting soldering head to perform chip mounting operation based on the compensated mounting mark position in the reference coordinate system through the horizontal motion module and the Z-axis motion module.

[0025] The semiconductor chip mounting method provided in this application acquires an image of the area where the mounting mark is located through a vision module. If the image does not meet the clarity requirements, the Z-axis motion module is controlled to move the vision module vertically until the image acquired by the vision module meets the clarity requirements. Based on the image, the image coordinates of the mounting mark and the Z-axis coordinates of the Z-axis motion module are determined. This application controls the movement of the Z-axis motion module based on the image clarity to accurately locate the mounting mark at the Z-axis coordinates. Furthermore, based on the pre-calibrated spatial motion curve of the Z-axis motion module, a coordinate compensation value corresponding to the Z-axis coordinates of the Z-axis motion module is determined. The coordinates of the mounting mark are compensated according to the coordinate compensation value. The mounting head is controlled by the horizontal motion module and the Z-axis motion module to perform chip mounting operations based on the compensated coordinates of the mounting mark in the reference coordinate system. By compensating the mounting mark position with the coordinate compensation value, the accuracy of chip mounting is ensured. This application obtains an accurate chip mounting position by accurately locating the mounting mark and compensating for the movement of the running module, thereby improving the chip mounting accuracy.

[0026] In one specific embodiment, the spatial motion curve of the Z-axis motion module is used to determine the X-axis compensation value for the X-axis coordinate value and the Y-axis compensation value for the Y-axis coordinate value based on the Z-axis position of the Z-axis motion module.

[0027] Specifically, based on the pre-calibrated spatial motion curve of the Z-axis motion module, the coordinate compensation value corresponding to the Z-axis coordinate of the Z-axis motion module is determined. The X-axis coordinate of the mounting mark position in the reference coordinate system is compensated according to the X-axis target compensation value, and the Y-axis coordinate of the mounting mark position in the reference coordinate system is compensated according to the Y-axis target compensation value.

[0028] This application utilizes the pre-calibrated spatial motion curve of the Z-axis motion module to directly determine the target compensation values ​​of the X-axis and Y-axis corresponding to the Z-axis position, so as to perform planar compensation when the Z-axis motion module performs Z-axis motion, eliminate horizontal deviation, and solve the impact of horizontal position deviation that occurs during Z-axis motion on the mounting accuracy.

[0029] In one specific embodiment, the downward direction of the Z-axis running direction is the positive direction.

[0030] In one specific embodiment, the calibration operation is implemented as follows: A lifting slide is arranged below the welding head mechanism, and a calibration plate with marked points is placed on the lifting slide. The Z-axis motion module is controlled to drive the vision module to move vertically to multiple different calibration positions. When the vision module is at each calibration position, the lifting slide is controlled to drive the calibration plate to move along the Z-axis of the reference coordinate system until the image of the calibration plate acquired by the vision module reaches the required clarity, and the three-dimensional coordinates of the marked points in the reference coordinate system are determined. Based on the three-dimensional coordinates of the marked points in the reference coordinate system obtained by the vision module at different calibration positions, the spatial motion curve of the Z-axis motion module is fitted.

[0031] In one specific embodiment, the spatial motion curve of the Z-axis motion module is fitted based on the three-dimensional coordinates of the marker points in the reference coordinate system obtained by the vision module at different calibration positions: For each calibration position, extract the planar coordinates of the marker point corresponding to the current calibration position in the three-dimensional coordinate system of the reference coordinate system. Subtract the planar coordinates from the preset reference plane coordinates and combine them with the Z-axis coordinates of the Z-axis motion module at the current calibration position to obtain the three-dimensional coordinate data. Perform a least squares method spatial line fitting operation on the three-dimensional coordinate data to obtain the spatial motion curve of the Z-axis motion module.

[0032] Specifically, the difference between the X coordinate in the plane coordinate system and the X coordinate in the preset reference plane coordinate system is calculated, and the difference between the Y coordinate in the plane coordinate system and the Y coordinate in the preset reference plane coordinate system is calculated.

[0033] Alternatively, for each calibration position, the Z-coordinate value of the marker point in the three-dimensional coordinate system is replaced with the Z-axis coordinate of the corresponding Z-axis motion module at the calibration position to obtain the three-dimensional coordinate data; the least squares method is used to fit the three-dimensional coordinate data to obtain the spatial motion curve of the Z-axis motion module.

[0034] The replaced 3D coordinate data needs to be obtained by subtracting the planar coordinates from the preset reference planar coordinates.

[0035] In one specific embodiment, for each calibration position, when determining the three-dimensional coordinates of the marker point in the reference coordinate system, the planar coordinates of the marker point corresponding to the current calibration position in the reference coordinate system are determined. The difference between the planar coordinates and the preset reference planar coordinates is calculated, and the difference is combined with the Z-axis coordinates of the Z-axis motion module at the corresponding calibration position to obtain the three-dimensional coordinate data. The least squares method is used to fit the three-dimensional coordinate data to obtain the spatial motion curve of the Z-axis motion module.

[0036] Specifically, three-dimensional coordinate data is obtained by normalizing the reference point (predicted reference plane coordinates) and a preset normalization calculation formula.

[0037] The normalization calculation formula is shown in formula (1): ...(1) in, Represents three-dimensional coordinate data. This represents the three-dimensional coordinate data before normalization. This represents the coordinates of the prediction reference plane, and n represents the number of 3D coordinate data.

[0038] Specifically, a set of reference points is selected from multiple unnormalized 3D coordinate data to create a reference coordinate system for the Z-axis module. Without loss of generality, for example, the 5th point is selected to create a reference coordinate system, and normalization is performed based on this.

[0039] In one specific embodiment, the specific implementation of controlling the Z-axis motion module to drive the vision module to move vertically to multiple different calibration positions includes: Based on the movable range of the Z-axis motion module and the preset position interval, multiple calibration positions are determined; the Z-axis motion module is controlled to drive the vision module to move sequentially to each calibration position along the vertical direction.

[0040] Specifically, during the calibration operation, the vision module is controlled to take pictures in the Z-axis running direction based on a preset position interval to obtain a sample image including the calibration board; if the clarity of the sample image is greater than the preset clarity (corresponding to meeting the clarity requirement), the three-dimensional coordinate data corresponding to the calibration board is obtained.

[0041] Specifically, to calibrate the planar deviation of the Z-axis module at different spatial positions, this application is equipped with a high-precision lifting slide (mounted on the equipment platform). The lifting slide must meet the requirement that the Z-axis deviation within a 10mm travel range (corresponding to the movable range) is less than or equal to 1µm. A 5mm diameter circular marker is placed on the lifting slide. A 5mm calibration plate.

[0042] Among them, through Figure 2 The placement equipment is illustrated. Specifically, the movement of the vision module is achieved by controlling the Z-axis motor 201 to make the Z-axis motor cross bearing 202 work. The vision module includes an industrial camera 203, a telecentric lens 204, and a light source 204.

[0043] Specifically, the Z-axis module is set at a preset initial position (e.g., 0mm), and the lifting slide with the calibration plate (bonded to the slide) is adjusted so that the camera (vision module) can clearly image the calibration plate. The calibration plate is then matched and positioned, and the three-dimensional coordinate data is recorded. ,in, .

[0044] Control the Z-axis module to move 1mm in the positive direction, and simultaneously manually move the lifting platform upwards so that the camera can clearly image the calibration board. Perform matching and positioning on the calibration board, and record the three-dimensional coordinate data at this time. ,in, .

[0045] Repeat the above steps to obtain a limited number of 3D coordinate data points within the entire travel range. , ..., , N is the value corresponding to the end position of the movable range.

[0046] In one specific embodiment, the least squares method is used to perform spatial line fitting on the three-dimensional coordinate data to obtain a spatial line (corresponding to the spatial motion curve of the Z-axis motion module). The specific implementation includes: Assume the equation of the straight line in space is given by formula (2): ……………………(2) in, Let t represent a point on a straight line in space, and let t represent the linear coefficient. The unit direction vector representing a straight line in space. .

[0047] any point in space (One of the three-dimensional coordinate data), a vector In direction vector The projection scalar on is .

[0048] The projection vector is , the foot is .

[0049] The perpendicular component vector (i.e., the perpendicular line vector) is: .

[0050] The square of the distance is the square of the magnitude of the perpendicular component vector, as shown in formula (3): …………(3) For unknown variables and First, for Differentiate and set it equal to 0, see formula (4): ... (4) Assume the centroid of all points is .

[0051] Substituting the centroid into formula (4) yields formula (5): ...(5) According to formula (5), the vector Perpendicular to The projection in the direction is 0, which means it must be with Parallel. Assume Where 'a' is a scalar, and the deprimed point set is... Therefore, we can obtain formula (6): ... (6) Based on formula (6), we obtain formula (7): ... (7) In summary, See formula (8): ... (8) Next, we can simplify formula (7) to obtain formula (9): ... (9) because Since it is a constant, it is equivalent to formula (10): ... (10) make .

[0052] Where s is 3 A matrix of size n, where each column is a decentralized point. Formula (10) can be expressed as .

[0053] Based on linear algebra, exist The maximum value under the given conditions is obtained in the direction of the unit eigenvector corresponding to the largest eigenvalue of M. This then transforms into finding the unit eigenvector corresponding to the largest eigenvalue of M.

[0054] Wherein, matrix M is shown in formula (11): …(11) in, ; ; ; ; ; ; ; ; .

[0055] Solving for formula (12) yields: ………………(12) Take the largest eigenvalue corresponding unit eigenvector Thus, the initial expression for the spatial straight line is given by formula (13): ………………(13) During the Z-axis module's movement, autofocus determined the Z-axis coordinates of the Z-axis motion module (corresponding to...). After that, by transforming formula (13), the final spatial lines corresponding to the Z-axis coordinate values ​​and the X-axis and Y-axis compensation values ​​are obtained, as shown in formula (14): ………………(14) in, Indicates the X-axis compensation value. This represents the average of multiple X-axis coordinate values ​​obtained during the error calibration process. This represents the average of multiple Y-axis coordinate values ​​obtained during the error calibration process. This represents the average of multiple Z-axis coordinate values ​​obtained during the error calibration process. This represents the unit eigenvector corresponding to the X-axis. This represents the unit eigenvector corresponding to the Y-axis. This represents the unit eigenvector corresponding to the Z-axis. Indicates the Y-axis compensation value. This represents the Z-axis coordinate of the Z-axis motion module.

[0056] For a schematic diagram of a spatial straight line, see [link to diagram]. Figure 3 ,exist Figure 3 The coordinate system in the figure is the reference coordinate system. Figure 3 The image is indicated by a bold black line.

[0057] This application acquires planar positions at different Z-axis positions through multiple visual positioning operations, obtains three-dimensional coordinate data at different Z-axis positions within a preset Z-axis interval, and then performs spatial straight-line fitting on all three-dimensional coordinate data to determine a spatial straight-line expression. This obtained spatial straight-line expression is used to identify XY plane deviations during autofocus in real time. Specifically, the Z-axis module performs planar compensation during Z-axis movement to eliminate horizontal deviations, thus addressing the impact of horizontal position deviations during Z-axis movement on mounting accuracy. This solves the problem of low mounting accuracy and improves chip mounting precision.

[0058] Figure 4 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 4As shown, the electronic device may include a processor 401, a communications interface 402, a memory 403, and a communication bus 404. The processor 401, communications interface 403, and memory 403 communicate with each other via the communication bus 404. The processor 401 can call logic instructions stored in the memory 403 to execute a semiconductor chip mounting method.

[0059] Furthermore, the logical instructions in the aforementioned memory 403 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0060] On the other hand, the present invention also provides a computer program product, the computer program product including a computer program stored on a non-transitory computer-readable storage medium, the computer program including program instructions, and when the program instructions are executed by a computer, the computer is able to execute the semiconductor chip mounting method provided by the above methods.

[0061] In another aspect, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to perform the semiconductor chip mounting method provided in the above embodiments.

[0062] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0063] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0064] Finally, it should be noted that the above descriptions are merely preferred embodiments of this application, and this application is not limited to the above embodiments. It is understood that other improvements and variations directly derived or conceived by those skilled in the art without departing from the spirit and concept of this application should be considered to be included within the protection scope of this application.

Claims

1. A semiconductor chip mounting method, characterized in that, The semiconductor chip mounting method includes: The horizontal motion module drives the welding head mechanism to move above the placement mark position. The welding head mechanism includes at least a Z-axis motion module and a placement welding head and vision module connected and driven by it. The image of the area where the mounting mark is located is obtained by the vision module. If the image does not meet the clarity requirements, the Z-axis motion module is controlled to move the vision module vertically until the image obtained by the vision module meets the clarity requirements. Based on the image, the coordinates of the mounting mark position and the Z-axis coordinates of the Z-axis motion module are determined. Based on the pre-calibrated spatial motion curve of the Z-axis motion module, the coordinate compensation value corresponding to the Z-axis coordinate of the Z-axis motion module is determined. The coordinates of the mounting mark position are compensated according to the coordinate compensation value. The mounting soldering head is controlled by the horizontal motion module and the Z-axis motion module to perform chip mounting operation based on the compensated mounting mark position in the reference coordinate system.

2. The semiconductor chip mounting method according to claim 1, characterized in that, The pre-calibrated Z-axis motion module spatial motion curve includes: A lifting slide is arranged below the welding head mechanism, and a calibration plate with marked points is arranged on the lifting slide. The Z-axis motion module is controlled to drive the vision module to move vertically to multiple different calibration positions. When the vision module is at each calibration position, the lifting slide is controlled to drive the calibration plate to move along the Z-axis of the vertical direction of the reference coordinate system until the image of the calibration plate acquired by the vision module reaches the required clarity and the three-dimensional coordinates of the marker point in the reference coordinate system are determined. Based on the three-dimensional coordinates of the marker points in the reference coordinate system obtained by the vision module at different calibration positions, the spatial motion curve of the Z-axis motion module is obtained by fitting.

3. The semiconductor chip mounting method according to claim 2, characterized in that, Based on the three-dimensional coordinates of the marked points in the reference coordinate system, the spatial motion curve of the Z-axis motion module is obtained by fitting, including: Extract the planar coordinates of the marker point corresponding to the current calibration position in the three-dimensional coordinate system of the reference coordinate system, and obtain the three-dimensional coordinate data by subtracting the planar coordinates from the preset reference planar coordinates and combining them with the Z-axis coordinates of the Z-axis motion module at the current calibration position. The least squares method is used to fit the spatial straight line to the three-dimensional coordinate data to obtain the spatial motion curve of the Z-axis motion module.

4. The semiconductor chip mounting method according to claim 2, characterized in that, Determining the three-dimensional coordinates of the marker point in the reference coordinate system includes: Determine the planar coordinates of the marker point corresponding to the current calibration position in the reference coordinate system; Based on the three-dimensional coordinates of the marker points in the reference coordinate system obtained by the vision module at different calibration positions, the spatial motion curve of the Z-axis motion module is fitted. By combining the difference between the plane coordinates of the marker point at the current calibration position in the reference coordinate system and the preset reference plane coordinates, and the Z-axis coordinates of the Z-axis motion module, three-dimensional coordinate data is obtained. Based on the three-dimensional coordinate data, the spatial motion curve of the Z-axis motion module is obtained by fitting.

5. The semiconductor chip mounting method according to claim 2, characterized in that, The Z-axis motion module is controlled to move the vision module vertically to multiple different calibration positions, including: Based on the movable range of the Z-axis motion module and the preset position interval, multiple calibration positions are determined; The Z-axis motion module is controlled to move the vision module sequentially to each calibration position along the vertical direction.

6. The semiconductor chip mounting method according to any one of claims 1-5, characterized in that, The coordinate compensation values ​​include: the X-axis compensation value of the X-axis coordinate and the Y-axis compensation value of the Y-axis coordinate; Based on the pre-calibrated spatial motion curve of the Z-axis motion module, determine the coordinate compensation value corresponding to the Z-axis coordinate of the Z-axis motion module, and compensate the coordinates of the mounting mark position according to the coordinate compensation value, including: Based on the pre-calibrated spatial motion curve of the Z-axis motion module, determine the target compensation values ​​of the X-axis and Y-axis corresponding to the Z-axis coordinates of the Z-axis motion module; The X-axis coordinate of the mounting mark position in the reference coordinate system is compensated according to the X-axis target compensation value, and the Y-axis coordinate of the mounting mark position in the reference coordinate system is compensated according to the Y-axis target compensation value.

7. The semiconductor chip mounting method according to any one of claims 1-5, characterized in that, The spatial motion curve of the Z-axis motion module includes: ； in, Indicates the X-axis compensation value. This indicates that the X-axis target calibration value was obtained through pre-calibration. This represents the target calibration value of the Y-axis obtained from the pre-calibration. This represents the target calibration value of the Z-axis obtained from the pre-calibration. This represents the unit eigenvector corresponding to the X-axis. This represents the unit eigenvector corresponding to the Y-axis. This represents the unit eigenvector corresponding to the Z-axis. Indicates the Y-axis compensation value. This represents the Z-axis coordinate of the Z-axis motion module.

8. The semiconductor chip mounting method according to claim 7, characterized in that, The average value is calculated from multiple X-axis coordinate values ​​obtained during the error calibration process. The average value is calculated from multiple Y-axis coordinate values ​​obtained during the error calibration process. The average value is calculated from multiple Z-axis coordinate values ​​obtained during the error calibration process.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the steps of the semiconductor chip mounting method as described in any one of claims 1 to 8.

10. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by a processor, the computer program implements the steps of the semiconductor chip mounting method as described in any one of claims 1 to 8.

Images