Packaging structure and method of manufacturing the same

Abstract

The application relates to a packaging structure and a preparation method thereof, and belongs to the packaging technical field.The preparation method of the packaging structure comprises the following steps: firstly, forming a first conductive layer on at least the side wall and the bottom of a first opening; and then forming a second conductive layer on the first conductive layer in the first opening.Because the first shielding layer covers the first medium layer and the first conductive layer outside the first opening, the second opening is arranged in correspondence with the first opening, and the formed second conductive layer is located in the first opening.The first conductive layer and the second conductive layer in the same first opening jointly form a conductive trace, the second conductive layer at least fills the first opening, the problem that the conductive trace in the first opening is recessed is avoided, and the signal transmission performance of the packaging structure is improved.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, and in particular to a packaging structure and its fabrication method. Background Technology

[0002] In packaged products, conductive traces play a crucial role as signal transmission paths.

[0003] Traditional packaging structures first create openings in the dielectric layer when forming conductive traces, and then form the required conductive traces within these openings. However, because the openings in existing dielectric layers are relatively large, depressions occur when forming conductive traces within these openings, thus affecting the signal transmission performance of the packaged product. Summary of the Invention

[0004] Based on this, this application provides a packaging structure and its fabrication method that can improve the performance of conductive traces.

[0005] To achieve the above objectives, in one respect, the present invention provides a method for preparing an encapsulation structure, comprising:

[0006] Provide substrate;

[0007] A first dielectric layer is formed on one side of the substrate, and the first dielectric layer has a first opening;

[0008] A first conductive layer is formed that at least covers the sidewalls and bottom of the first opening;

[0009] Based on the first shielding layer, a second conductive layer is filled into the first opening. The second conductive layer at least fills the first opening. The first shielding layer covers the first dielectric layer and the first conductive layer, and has a second opening. The second opening is corresponding to the first opening. The first conductive layer and the second conductive layer located in the same first opening form the same conductive trace.

[0010] In one embodiment, the first opening includes a plurality of first sub-openings, the second opening includes a plurality of second sub-openings, the first conductive layer includes a plurality of first conductive portions, and the second conductive layer includes a plurality of second conductive portions; the step of filling the first opening with the second conductive layer based on the first shielding layer includes:

[0011] A first shielding layer having a plurality of second sub-openings is formed;

[0012] Based on the second sub-opening, a second conductive portion that fills the first sub-opening is formed on the first conductive portion within the corresponding first sub-opening;

[0013] Remove the first masking layer.

[0014] In one embodiment, the orthographic projection of the second sub-opening on the substrate lies within the orthographic projection of the first sub-opening on the substrate.

[0015] In one embodiment, filling the first opening with a second conductive layer based on the first shielding layer includes:

[0016] A first shielding layer with the second opening is formed, wherein the orthographic projection of the second opening on the substrate is located within the orthographic projection of the first opening on the substrate, wherein i≥1 and i is a positive integer;

[0017] Based on the second opening, an i-th layer of the second conductive layer filling the first opening is formed on the first conductive layer within the first opening;

[0018] Remove the first masking layer.

[0019] In one embodiment, the orthographic projection edge of the second opening on the substrate is located within the orthographic projection of the bottom of the first opening on the substrate.

[0020] In one embodiment, in a first direction, the projected area of ​​the first opening on the substrate gradually increases, the first direction is perpendicular to the substrate and points from the substrate to the first dielectric layer;

[0021] The orthographic projection edge of the second opening on the substrate is located within the orthographic projection of the sidewall of the first opening on the substrate.

[0022] In one embodiment, prior to forming the first conductive layer that at least covers the sidewalls and bottom of the first opening, the process includes:

[0023] A second shielding layer is formed to cover the first dielectric layer, the second shielding layer having a third opening, and the orthographic projection of the first opening on the substrate is located within the orthographic projection of the third opening on the substrate;

[0024] Based on the second shielding layer, the first conductive layer is formed on the surface of the first dielectric layer away from the substrate, the sidewall of the first opening, and the bottom.

[0025] Remove the second masking layer.

[0026] On the other hand, a packaging structure is also provided, including:

[0027] substrate;

[0028] A first dielectric layer is located on one side of the substrate, and the first dielectric layer has a first opening;

[0029] A conductive trace, located within the first opening, and comprising:

[0030] A first conductive layer covers at least the sidewalls and bottom of the first opening;

[0031] A second conductive layer is located within the first opening and at least fills the first opening.

[0032] In one embodiment, the first opening includes a plurality of first sub-openings, and the conductive trace includes a plurality of sub-traces, each sub-traces being disposed within a corresponding first sub-opening, and each sub-traces comprising:

[0033] The first conductive portion covers at least the sidewall and bottom of the first sub-opening;

[0034] The second conductive part is located inside the first sub-opening and at least fills the first sub-opening.

[0035] In one embodiment, in a first direction, the projected area of ​​the first opening on the substrate gradually increases, the first direction is perpendicular to the substrate and points from the substrate to the first dielectric layer;

[0036] The orthographic projection of the second conductive layer on the substrate lies within the orthographic projection of the first opening on the substrate.

[0037] Compared with existing technologies, the above technical solution has the following advantages:

[0038] In the fabrication method of the above-described packaging structure, a first conductive layer is first formed at least on the sidewalls and bottom of the first opening, and then a second conductive layer is formed on the first conductive layer inside the first opening. Since the first shielding layer covers the first dielectric layer and the first conductive layer outside the first opening, and the second opening is positioned corresponding to the first opening, the formed second conductive layer is located inside the first opening. The first conductive layer and the second conductive layer within the same first opening together form conductive traces. The second conductive layer at least fills the first opening, avoiding the problem of recesses in the conductive traces within the first opening and improving the signal transmission performance of the packaging structure. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 A schematic flowchart illustrating a method for fabricating a packaging structure for the purposes of this application;

[0041] Figures 2 to 13 This is a partial cross-sectional schematic diagram of the packaging structure provided in one embodiment of this application;

[0042] Figures 14 to 21 This is a partial cross-sectional schematic diagram of the encapsulation structure provided in another embodiment of this application.

[0043] Explanation of reference numerals in the attached drawings: 01-Substrate; 02-First dielectric layer; 03-First opening; 031-First sub-opening; 04-First conductive layer; 041-First conductive portion; 05-First shielding layer; 06-Second conductive layer; 061-Second conductive portion; 07-Second opening; 071-Second sub-opening; 08-Conductive trace; 081-Sub-trace; 09-Second shielding layer; 10-Third opening; 101-Third sub-opening; 011-Bonding adhesive. Detailed Implementation

[0044] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0046] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, regions, layers, doping types, and / or portions, these elements, components, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, doping type, or portion from another element, component, region, layer, doping type, or portion. Therefore, without departing from the teachings of this invention, the first element, component, region, layer, doping type, or portion discussed below may be referred to as a second element, component, region, layer, or portion.

[0047] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0048] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0049] In one embodiment, please refer to Figure 1 A method for fabricating a packaging structure is provided, comprising the following steps:

[0050] Step S10: Provide substrate 01.

[0051] Substrate 01 may include, but is not limited to, a glass carrier. Furthermore, bonding adhesive 011 for temporary bonding may be provided on substrate 01 to provide mechanical support for subsequently fabricated structures and prevent warping (see reference). Figure 2 ).

[0052] Step S20: A first dielectric layer 02 is formed on one side of the substrate 01, and the first dielectric layer 02 has a first opening 03.

[0053] The material of the first dielectric layer 02 can be an organic material such as PI. The first dielectric layer 02 can be formed by first forming a first dielectric material layer 021, then photolithography forming the first opening 03, and finally curing the first dielectric layer 02. The first dielectric layer 02 has the first opening 03, which exposes the bonding adhesive 011 (see reference). Figure 3 ).

[0054] Step S30: Form a first conductive layer 04 that at least covers the sidewalls and bottom of the first opening 03.

[0055] The first conductive layer 04 can be formed by electroplating. The first conductive layer 04 may only cover the sidewalls and bottom of the first opening 03, or it may extend outwards from the first opening 03 to cover part of the first dielectric layer 02. The material of the first conductive layer 04 includes, but is not limited to, conductive metallic materials (please refer to...). Figure 7 ).

[0056] Step S40: Based on the first shielding layer 05, fill the first opening 03 with the second conductive layer 06.

[0057] The second conductive layer 06 at least fills the first opening 03. The first shielding layer 05 covers the first dielectric layer 02 and the first conductive layer 04, and has a second opening 07. The second opening 07 is correspondingly disposed to the first opening 03. The first conductive layer 04 and the second conductive layer 06 located in the same first opening 03 form the same conductive trace 08 (please refer to...). Figure 9 , Figure 10 ).

[0058] The first shielding layer 05 may include, but is not limited to, photoresist. The second opening 07 of the first shielding layer 05 is correspondingly disposed to the first opening 03, so as to shield the first conductive layer 04 and the first dielectric layer 02 except for the first opening 03 and expose the first opening 03, thereby forming the second conductive layer 06 in the first opening 03.

[0059] To form the first shielding layer 05, a first shielding material layer 051 can be formed first, followed by photolithography to form the second opening 07 (please refer to...). Figure 8 , Figure 9 ).

[0060] The material of the second conductive layer 06 includes, but is not limited to, conductive metal materials, and the material of the second conductive layer 06 can be the same as that of the first conductive layer 04. The second conductive layer 06 is located on the first conductive layer 04 within the first opening 03. The second conductive layer 06 can fill the first opening 03, or the second conductive layer 06 can protrude in the direction from the substrate 01 to the first conductive layer 04 to improve the subsequent electrical connection performance.

[0061] In this embodiment, a first conductive layer 04 is first formed at least on the sidewalls and bottom of the first opening 03, and then a second conductive layer 06 is formed on the first conductive layer 04 within the first opening 03. Since the first shielding layer 05 covers the first dielectric layer 02 and the first conductive layer 04 outside the first opening 03, and the second opening 07 is correspondingly positioned to the first opening 03, the formed second conductive layer 06 is located within the first opening 03. The first conductive layer 04 and the second conductive layer 06 within the same first opening 03 together form a conductive trace 08. The second conductive layer 06 at least fills the first opening 03, avoiding the problem of recesses in the conductive trace 08 within the first opening 03 and improving the signal transmission performance of the packaging structure.

[0062] In one embodiment, please refer to Figures 14-21 The first opening 03 includes a plurality of first sub-openings 031, the second opening 07 includes a plurality of second sub-openings 071, the first conductive layer 04 includes a plurality of first conductive portions 041, and the second conductive layer 06 includes a plurality of second conductive portions 061; step 40 includes:

[0063] Step 410: Form a first shielding layer 05 with multiple second sub-openings 071.

[0064] Step 411: Based on the second sub-opening 071, a second conductive portion 061 filling the first sub-opening 031 is formed on the first conductive portion 041 within the corresponding first sub-opening 031.

[0065] Setting multiple first sub-openings 031 in the first opening 03 can reduce the width of the opening.

[0066] Because the width of the first sub-opening 031 is small, the first opening 03 can be filled in one go when forming the first conductive portion 041. Alternatively, a few areas within the first opening 03 may not be filled. This reduces the occurrence of depressions when forming the conductive trace 08.

[0067] After the first conductive portion 041 is filled, when forming the first shielding layer 05, the second opening 07 also needs to be provided with multiple second sub-openings 071. Each second sub-opening 071 corresponds one-to-one with a first sub-opening 031, ensuring that a second conductive portion 061 is formed on the first conductive portion 041 in each first sub-opening 031 (please refer to...). Figure 18 , Figure 19 ).

[0068] It should be noted that if the formed second conductive portion 061 is thin, step S40 can be repeated multiple times to ensure that the second conductive portion 061 fills the corresponding first sub-opening 031, or that the second conductive portion 061 protrudes in the direction from the substrate 01 to the first conductive portion 041, so as to improve the subsequent electrical connection performance.

[0069] Step 412: Remove the first occlusion layer 05 (please refer to...) Figure 20 ).

[0070] After removing the first occlusion layer 05, the following was formed: Figure 21 The conductive trace shown is 08.

[0071] In this embodiment, the first opening 03 is divided into multiple first sub-openings 031, and the second opening 07 is correspondingly divided into multiple second sub-openings 071. Since the width of the first sub-opening 031 is smaller, when a second conductive portion 061 is formed on the first conductive portion 041 within the corresponding first sub-opening 031 based on the second sub-opening 071, the second conductive portion 061 can more easily allow the conductive trace 08 to fill the first opening 03, or the second conductive portion 061 can protrude in the direction from the substrate 01 to the first conductive portion 041. This avoids the problem of the conductive trace 08 being recessed within the first opening 03, improving the signal transmission performance of the packaging structure.

[0072] In one embodiment, please refer to Figure 19 In step S410, the following is included:

[0073] The orthographic projection of the second sub-opening 071 on the substrate 01 is located within the orthographic projection of the first sub-opening 031 on the substrate 01.

[0074] In the direction from substrate 01 to the first conductive part 041, the first sub-opening 031 can gradually increase in the orthogonal projection area on substrate 01 to form a trumpet-shaped opening.

[0075] The orthographic projection edge of the second sub-opening 071 on the substrate 01 can be located within the orthographic projection of the sidewall of the first sub-opening 031 on the substrate 01. The orthographic projection edge of the second sub-opening 071 on the substrate 01 can also be located within the orthographic projection of the bottom of the first sub-opening 031 on the substrate 01. This can be set according to the size of the first sub-opening 031.

[0076] In this embodiment, the orthographic projection of the second sub-opening 071 onto the substrate 01 is located within the first sub-opening 031, ensuring that the second conductive portion 061 is located within the recessed area of ​​the first sub-opening 031. At this time, the formation of the second conductive portion 061 can at least fill the first sub-opening 031, preventing any recess and improving the signal transmission performance of the packaging structure.

[0077] In one embodiment, please refer to Figure 10 or Figure 11 Step 40 may also include:

[0078] Step 420: Form the i-th first shielding layer 05 with the second opening 07, wherein the orthographic projection of the second opening 07 on the substrate 01 is located within the orthographic projection of the first opening 03 on the substrate 01, where i≥1 and i is a positive integer.

[0079] The orthographic projection of the second opening 07 on the substrate 01 is located within the orthographic projection of the first opening 03 on the substrate 01, which ensures that the second conductive layer 06 is located within the recessed area of ​​the first opening 03.

[0080] Since the width of the first opening 03 is relatively wide, the second conductive layer 06 may not be able to fill the first opening 03 in one go. In this case, in order to ensure that the second conductive layer 06 at least fills the first opening 03, multiple filling operations can be performed.

[0081] Step 421: Based on the second opening 07, form the i-th second conductive layer 06 filling the first opening 03 on the first conductive layer 04 within the first opening 03 (please refer to...). Figure 10 ).

[0082] Step 422: Remove the first occlusion layer 05.

[0083] A first shielding layer 05 can be formed first, and then a second conductive layer 06 filling the first conductive layer 04 within the first opening 03 can be formed based on the second opening 07. The first shielding layer 05 can then be removed; this process can be completed in one step (see reference). Figure 10 ).

[0084] Alternatively, a first shielding layer 05 can be formed first, followed by a second conductive layer 06 filling the first conductive layer 04 within the first opening 03, based on the second opening 07. Then, the first shielding layer 05 is removed. With slight structural adjustments, a second shielding layer 05 can be formed, followed by a second conductive layer 06 filling the first opening 03, based on the second opening 07, on the first conductive layer 04 within the first opening 03. Electroplating is then performed sequentially, reducing the flat area within the first opening 03 until at least the first opening 03 is filled. Alternatively, the second conductive layer 06 can protrude in the direction from the substrate 01 to the first conductive layer 04 (see reference). Figure 11 That is, until the design requirements are met.

[0085] It should be noted that if the first conductive layer 04 and the second conductive part 061 are both thin, steps S30 and S40 can be repeated multiple times to ensure that the second conductive layer 06 fills the corresponding first opening 03, or that the second conductive layer 06 protrudes in the direction from the substrate 01 to the first conductive layer 04, while ensuring that the connection between the first conductive part 041 and the second conductive part 061 is stable, so as to improve the subsequent electrical connection performance.

[0086] In this embodiment, performing i stacking to form multiple layers of the second conductive layer 06 can ensure the formation of conductive traces 08 within the first opening 03. At the same time, it can ensure that the second conductive layer 06 at least fills the first opening 03, avoiding the formation of depressions, providing a foundation for the fabrication of subsequent structures, and increasing electrical connection performance.

[0087] In one embodiment, step S420 includes:

[0088] The orthographic projection edge of the second opening 07 on the substrate 01 is located within the orthographic projection of the bottom of the first opening 03 on the substrate 01.

[0089] At this time, the orthographic projection of the formed second conductive layer 06 on the substrate 01 is located within the orthographic projection of the bottom of the first opening 03 on the substrate 01.

[0090] If the sidewall of the first opening 03 is perpendicular to the substrate 01, the second conductive layer 06 can completely fill the first opening 03 or protrude in the direction from the substrate 01 to the first conductive layer 04.

[0091] In this embodiment, by setting the width of the second opening 07, the second opening 07 is placed on a flat position of the first conductive layer 04. At this time, no depression will occur, and the actual requirements are met, thereby improving the signal transmission performance of the packaging structure.

[0092] In one embodiment, step S420 may further include:

[0093] In the first direction, the projected area of ​​the first opening 03 on the substrate 01 gradually increases, the first direction is perpendicular to the substrate 01, and points from the substrate 01 to the first dielectric layer 02.

[0094] The orthographic projection edge of the second opening 07 on the substrate 01 is located within the orthographic projection of the sidewall of the first opening 03 on the substrate 01.

[0095] The first opening 03 can form a trumpet-shaped opening. At this time, the orthographic projection edge of the second conductive layer 06 on the substrate 01 is located within the orthographic projection of the sidewall of the first opening 03 on the substrate 01.

[0096] It should be noted that when only one first conductive layer 04 is formed in the formation step, a first recessed area 11 may be formed between the second conductive layer 06 and the first conductive layer 04 in a direction parallel to the substrate 01 (please refer to...). Figure 12 ).

[0097] In this embodiment, by setting the width of the second opening 07, the second opening 07 falls on the first conductive layer 04 on the sidewall of the first opening 03, thus avoiding any recess and meeting practical requirements. At this time, a conductive trace 08 with a patterned (first recessed area 11) can be formed. The formation of the second conductive layer 06 can at least fill the first opening 03, or protrude in the direction from the substrate 01 to the first conductive layer 04, without causing a recess and improving the signal transmission performance of the packaging structure.

[0098] In one embodiment, prior to step S30, the method further includes:

[0099] Step S130: Form a second shielding layer 09 covering the first dielectric layer 02. The second shielding layer 09 has a third opening 10. The orthographic projection of the first opening 03 on the substrate 01 is located within the orthographic projection of the third opening 10 on the substrate 01.

[0100] The second shielding layer 09 can be photoresist. To form the second shielding layer 09, a second shielding material layer 091 can be formed first, and then the third opening 10 can be formed by photolithography (please refer to...). Figure 4 , Figure 5 ).

[0101] Since the first conductive layer 04 can extend to cover part of the first dielectric layer 02 in addition to covering the sidewall or bottom of the first opening 03, the orthographic projection of the first opening 03 on the substrate 01 can be located within the orthographic projection of the third opening 10 on the substrate 01, so as to ensure that the first conductive layer 04 at least covers part of the first dielectric layer 02.

[0102] It should be noted that when the first opening 03 has multiple first sub-openings 031, the third opening 10 on the second shielding layer 09 also has multiple corresponding third sub-openings 101 (please refer to...). Figure 15 ).

[0103] Step S131: Based on the second shielding layer 09, a first conductive layer 04 is formed on the surface of the first dielectric layer 02 away from the substrate 01, the sidewall of the first opening 03, and the bottom.

[0104] Because the third opening 10 is relatively large, the formed first conductive layer 04 can cover the portion of the first dielectric layer 02 that is away from the substrate 01, the sidewalls of the first opening 03, and the bottom (see reference). Figure 6 The first conductive layer 04 extends to cover part of the first dielectric layer 02, which allows for better contact of the subsequently formed structure and improves the signal transmission performance of the package structure.

[0105] It should be noted that when the first opening 03 has multiple first sub-openings 031, the third opening 10 on the second shielding layer 09 also has multiple corresponding third sub-openings 101. In this case, a first conductive part 041 is formed in each first sub-opening 031 (please refer to...). Figure 16 ).

[0106] Step S131: Remove the second occlusion layer 09.

[0107] After forming the first conductive layer 04, the second shielding layer 09 is removed to prepare for the subsequent formation of the first shielding layer 05 (please refer to...). Figure 7 , Figure 17 ).

[0108] In this embodiment, a second shielding layer 09 with a third opening 10 is formed, and the third opening 10 is larger than the first opening 03, which allows the formed first conductive layer 04 to extend and cover part of the first dielectric layer 02, providing a larger contact area for subsequent structural steps and increasing contact stability.

[0109] In one embodiment, please refer to Figure 13 and Figure 21 A packaging structure is provided, including: a substrate 01, a first dielectric layer 02, and conductive traces 08.

[0110] The substrate 01 may include, but is not limited to, a glass substrate. In addition, bonding adhesive 011 for temporary bonding may be provided on the substrate 01 to provide mechanical support for the structure to be fabricated subsequently and to prevent warping.

[0111] The material of the first dielectric layer 02 can be an organic material such as PI. The first dielectric layer 02 has a first opening 03, which exposes the bonding adhesive 011.

[0112] The conductive trace 08 includes at least one first conductive layer 04 and at least one second conductive layer 06. The first conductive layer 04 at least covers the sidewalls and bottom of the first opening 03, and may also extend outward from the first opening 03 to cover part of the first dielectric layer 02. The second conductive layer 06 is located inside the first opening 03 and at least fills the first opening 03.

[0113] Both the first conductive layer 04 and the second conductive layer 06 can be formed by electroplating. The materials of the first conductive layer 04 and the second conductive layer 06 include, but are not limited to, conductive metal materials.

[0114] In this embodiment, the conductive trace 08 formed in the first opening 03 includes a first conductive layer 04 and a second conductive layer 06. Since the second conductive layer 06 can at least fill the first opening 03, the problem of depression that occurs when forming the conductive trace 08 is avoided, and the signal transmission performance of the package structure is improved.

[0115] In one embodiment, please refer to Figure 20 The first opening 03 includes multiple first sub-openings 031, and the conductive trace 08 includes multiple sub-traces 081. The sub-traces 081 are correspondingly disposed within the first sub-openings 031, and the sub-traces 081 include:

[0116] The first conductive part 041 covers at least the sidewall and bottom of the first sub-opening 031.

[0117] The second conductive part 061 is located inside the first sub-opening 031 and at least fills the first sub-opening 031.

[0118] Multiple first sub-openings 031 can be provided in the first opening 03, which can reduce the width of the opening, making it easier for the sub-trace 081 to fill the first sub-opening 031 or to protrude in the direction from the substrate 01 to the first conductive layer 04.

[0119] The first conductive portion 041 and the second conductive portion 061 can be made of the same material. The first conductive portion 041 at least covers the sidewall and bottom of the first sub-opening 031, and may also extend outward from the first opening 031 to cover part of the first dielectric layer 02. This can increase the contact area. The second conductive portion 061 is inside the first sub-opening 031, at least filling the first sub-opening 031, and may also protrude in the direction from the substrate 01 to the first conductive portion 041.

[0120] In this embodiment, the first opening 03 is divided into multiple first sub-openings 031. Since the width of the first sub-openings 031 is smaller, it is easier for the conductive traces 08 to fill the first opening 03, or for the second conductive portion 061 to protrude in the direction from the substrate 01 to the first conductive portion 041. This avoids the problem of the conductive traces 08 being recessed within the first opening 03, and improves the signal transmission performance of the package structure.

[0121] In one embodiment, please refer to Figure 12 In the first direction, the projected area of ​​the first opening 03 on the substrate 01 gradually increases, the first direction is perpendicular to the substrate 01, and points from the substrate 01 to the first dielectric layer 02.

[0122] The orthographic projection of the second conductive layer 06 on the substrate 01 lies within the orthographic projection of the first opening 03 on the substrate 01.

[0123] The first opening 03 can be formed into a trumpet shape. In this case, the orthographic projection edge of the second opening 07 on the substrate 01 can be located within the orthographic projection of the sidewall of the first opening 03 on the substrate 01. Alternatively, the orthographic projection edge of the second opening 07 on the substrate 01 can be located within the orthographic projection of the bottom of the first opening 03 on the substrate 01. This can be set according to the size of the first opening 03.

[0124] In this embodiment, the orthographic projection of the second opening 07 onto the substrate 01 is located within the first opening 03, ensuring that the second conductive layer 06 is located within the recessed area of ​​the first opening 03. In this case, the formation of the second conductive layer 06 can at least fill the first opening 03, or the second conductive portion 061 can protrude in the direction from the substrate 01 to the first conductive portion 041, avoiding the problem of recesses and improving the signal transmission performance of the packaging structure.

[0125] In the description of this specification, references to terms such as "some embodiments," "another embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0126] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0127] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for preparing a packaging structure, characterized in that, include: Provide substrate; A first dielectric layer is formed on one side of the substrate, and the first dielectric layer has a first opening; A first conductive layer is formed that at least covers the sidewalls and bottom of the first opening; Based on the first shielding layer, a second conductive layer is filled into the first opening. The second conductive layer at least fills the first opening. The first shielding layer covers the first dielectric layer and the first conductive layer, and has a second opening. The second opening is corresponding to the first opening. The first conductive layer and the second conductive layer located in the same first opening form the same conductive trace.

2. The method for preparing the packaging structure according to claim 1, characterized in that, The first opening includes a plurality of first sub-openings, the second opening includes a plurality of second sub-openings, the first conductive layer includes a plurality of first conductive portions, and the second conductive layer includes a plurality of second conductive portions; the step of filling the first opening with a second conductive layer based on the first shielding layer includes: A first shielding layer having a plurality of second sub-openings is formed; Based on the second sub-opening, a second conductive portion that fills the first sub-opening is formed on the first conductive portion within the corresponding first sub-opening; Remove the first masking layer.

3. The method for preparing the packaging structure according to claim 2, characterized in that, The orthographic projection of the second sub-opening on the substrate is located within the orthographic projection of the first sub-opening on the substrate.

4. The method for preparing the packaging structure according to claim 1, characterized in that, The method of filling the first opening with a second conductive layer based on the first shielding layer includes: A first shielding layer with the second opening is formed, wherein the orthographic projection of the second opening on the substrate is located within the orthographic projection of the first opening on the substrate, wherein i≥1 and i is a positive integer; Based on the second opening, an i-th layer of the second conductive layer filling the first opening is formed on the first conductive layer within the first opening; Remove the first masking layer.

5. The method for preparing the packaging structure according to claim 4, characterized in that, The orthographic projection edge of the second opening on the substrate is located within the orthographic projection of the bottom of the first opening on the substrate.

6. The method for preparing the packaging structure according to claim 4, characterized in that, In a first direction, the projected area of ​​the first opening on the substrate gradually increases, the first direction is perpendicular to the substrate and points from the substrate to the first dielectric layer; The orthographic projection edge of the second opening on the substrate is located within the orthographic projection of the sidewall of the first opening on the substrate.

7. The method for preparing the packaging structure according to claim 1, characterized in that, Before forming the first conductive layer that at least covers the sidewalls and bottom of the first opening, the process includes: A second shielding layer is formed to cover the first dielectric layer, the second shielding layer having a third opening, and the orthographic projection of the first opening on the substrate is located within the orthographic projection of the third opening on the substrate; Based on the second shielding layer, the first conductive layer is formed on the surface of the first dielectric layer away from the substrate, the sidewall of the first opening, and the bottom. Remove the second masking layer.

8. A packaging structure, characterized in that, include: substrate; A first dielectric layer is located on one side of the substrate, and the first dielectric layer has a first opening; A conductive trace, located within the first opening, and comprising: A first conductive layer covers at least the sidewalls and bottom of the first opening; A second conductive layer is located within the first opening and at least fills the first opening.

9. The packaging structure according to claim 8, characterized in that, The first opening includes a plurality of first sub-openings, and the conductive trace includes a plurality of sub-traces. The sub-traces are correspondingly disposed within the first sub-openings, and each sub-traces includes: The first conductive portion covers at least the sidewall and bottom of the first sub-opening; The second conductive part is located inside the first sub-opening and at least fills the first sub-opening.

10. The packaging structure according to claim 8, characterized in that, In a first direction, the projected area of ​​the first opening on the substrate gradually increases, the first direction is perpendicular to the substrate and points from the substrate to the first dielectric layer; The orthographic projection of the second conductive layer on the substrate lies within the orthographic projection of the first opening on the substrate.

Images