Power module and device

Abstract

The application relates to a power module, which comprises sealing resin, a driving chip, a power chip, power side pins and control side pins, the driving chip and the power chip are arranged in the sealing resin; the control side pins are led out from a first side surface of the sealing resin, and the power side pins are led out from a second side surface of the sealing resin; a first recessed part recessed from the second side surface towards the width direction of the sealing resin is arranged between at least part of the adjacent power side pins, and two second recessed parts are arranged on both sides of the thickness direction of the at least one first recessed part. The second recessed part can improve the heat dissipation of the conductive body arranged opposite to the second recessed part, and is beneficial to improving the current-carrying capacity of the power module; in addition, during the injection of the sealing resin, the resin flowing through the first recessed part is extruded through the second recessed part, the filling uniformity of the sealing resin can be efficiently improved, and defects such as cavities are reduced.

Description

Technical Field

[0001] This application belongs to the field of electronic device technology, and in particular relates to a power module and device. Background Technology

[0002] Power modules (PMs) are characterized by high current density, low saturation voltage, low drive power, high switching frequency, high functional integration, ease of use, and high reliability. They are widely used in consumer electronics, home appliances, automobiles, rail transportation, industrial equipment, new energy, smart grids, and many other fields. Typically, power modules utilize resin to encapsulate power and control chips to achieve high integration. However, current power modules suffer from drawbacks such as poor current carrying capacity, uneven resin filling, and high void ratios. Summary of the Invention

[0003] The purpose of this application is to provide a power module and device that aims to solve the problems of poor current carrying capacity, low uniformity of sealing resin filling, and high void ratio in related technologies.

[0004] In a first aspect, a power module is provided, including a driver chip, a power chip electrically connected to the driver chip, a plurality of control-side pins connected to the driver chip, and a plurality of power-side pins connected to the power chip; the power module further includes a sealing resin encapsulating the driver chip, the power chip, a portion of the control-side pins, and a portion of the power-side pins, the sealing resin having a first side and a second side opposite to each other in the width direction, the plurality of control-side pins extending from the first side of the sealing resin, and the plurality of power-side pins extending from the second side of the sealing resin; the power module further includes a first recess between at least partially adjacent power-side pins, recessed from the second side toward the sealing resin and along the width direction, the minimum creepage distance of two power-side pins located on both sides of the first recess passing through the first recess; and a plurality of second recesses disposed adjacent to and stacked with the first recess in the thickness direction of the sealing resin, at least one first recess having a second recess on each side in the thickness direction, the recess depth of the second recess in the width direction being greater than the recess depth of the first recess in the width direction.

[0005] In this embodiment, the first recess reduces the package size while increasing the creepage distance between the power-side pins, which is beneficial for the high voltage withstand and miniaturization of the power module. The second recess can improve the heat dissipation of the conductor opposite it, which is beneficial for improving the current carrying capacity of the power module. In addition, during the injection of sealing resin in the manufacturing process of the power module, the resin flowing through the first recess is squeezed through the second recess, which can effectively improve the uniformity of the sealing resin filling and reduce defects such as voids.

[0006] In some embodiments, the opening width of the second recess on the second side is greater than the opening width of the first recess on the second side.

[0007] In this embodiment, during the injection of sealing resin, the second recess, which is larger than the first recess, further compresses the resin flowing through the first recess, which can effectively improve the uniformity of resin filling and reduce defects such as voids.

[0008] In some embodiments, the sealing resin further has a heat-dissipating bottom surface and a top surface disposed opposite each other in the thickness direction, and the sealing resin further has a first step portion formed by recessing from the heat-dissipating bottom surface toward the top surface, and the recess depth of the first step portion in the width direction is greater than the recess depth of the second recess portion in the width direction, and the second recess portion is adjacent to and stacked with the first step portion.

[0009] In this embodiment, the first step ensures the creepage distance between the power-side pins and the external heat sink, which is beneficial for the high voltage withstand capability and miniaturization of the power module.

[0010] In some embodiments, at least a portion of the power-side pin has a wire engagement portion disposed opposite to the second recess and a connection portion connected to the outside of the power-side pin within the sealing resin. The connection portion is connected to the wire engagement portion and is offset from the second recess. The wire engagement portion is connected to the corresponding power chip via a wire.

[0011] In this embodiment, by placing the wire at the wire joint, i.e., the wire is opposite to the second recess, the path of heat transfer from the wire to the outside is reduced, thereby improving the heat dissipation performance of the wire and improving the current carrying capacity of the power module.

[0012] In some embodiments, one end of the wire is connected to the wire junction, and one end of the wire is outside the coverage area of ​​the second recess in the thickness direction, while the other end of the wire is connected to the corresponding power chip.

[0013] In this embodiment, the sealing resin outside the second recess in the thickness direction, i.e., at the location covering the wire, is not thinned. This prevents arcing or dielectric breakdown between the wire and the external environment (or other conductive components) when the power module withstands high voltage or carries large current.

[0014] In some embodiments, the second recess in the thickness direction covers at least a portion of the wire joint.

[0015] In this embodiment, the portion of the wire joint covered by the second recess can be used to set pressure claws during the wire welding manufacturing process to fix the lead frame for easy welding; and in the final product, the overlap of the two can reduce the size of the power module in the width direction, which is beneficial for miniaturization.

[0016] In some embodiments, at least four first recesses are provided on the second side between adjacent power-side pins.

[0017] In some embodiments, the plurality of power-side pins include a DC positive power-side pin, three three-phase output power-side pins, and a DC negative power-side pin. The DC positive power-side pin, the three three-phase output power-side pins, and the DC negative power-side pin are arranged sequentially. A first recess is provided between the DC positive power-side pin and an adjacent three-phase output power-side pin. Two of the three three-phase output power-side pins are provided with the first recess and are respectively located between two adjacent three-phase output power-side pins. A first recess is provided between the three-phase output power-side pin and an adjacent DC negative power-side pin.

[0018] In this embodiment, the creepage distance between the DC positive power side pin and the adjacent three-phase output power side pin, between the three-phase output power side pin and the DC negative power side pin, and between adjacent three-phase output power side pins is improved.

[0019] In some embodiments, the sealing resin further has a heat-dissipating bottom surface and a top surface disposed opposite each other in the thickness direction, and the second side surface includes a parting line, the distance from the parting line to the heat-dissipating bottom surface in the thickness direction being greater than or equal to the distance from the parting line to the top surface in the thickness direction.

[0020] In this embodiment, the creepage distance between the power-side pins of the power module and the external heat sink is increased, which is beneficial for the high voltage withstand capability of the power module.

[0021] In some embodiments, the second recess between the first recess and the heat dissipation bottom surface is a lower second recess, and the second recess between the first recess and the top surface is an upper second recess; The recess height of the upper second recess in the thickness direction is greater than or equal to the distance between the parting line and the upper second recess; And / or, the recess height of the lower second recess in the thickness direction is greater than or equal to the distance between the parting line and the lower second recess.

[0022] In this embodiment, improving the compression effect of the second recess on the resin can effectively improve the uniformity of the sealing resin filling and reduce defects such as voids.

[0023] In some embodiments, the sealing resin includes a resin injection portion disposed in the first recess. By positioning the resin injection port at a position corresponding to the first recess, and by squeezing the resin near the resin injection port through the second recess, the uniformity of the sealing resin filling can be efficiently improved, and defects such as voids can be reduced.

[0024] In some embodiments, the sealing resin has a thickness of 4.5 mm to 6.5 mm, a length of 34 mm to 36 mm, and a width of 20 mm to 26 mm.

[0025] On the other hand, a device is provided, including a controller and the power module provided in the above embodiments, wherein the power module is connected to the controller. By employing the power module of the above embodiments, the voltage resistance, miniaturization, and high current carrying capacity of some devices are improved. Attached Figure Description

[0026] Figure 1 This is a top view showing the power module in one embodiment of this application.

[0027] Figure 2 This is a top view showing the interior of a power module in one embodiment of this application.

[0028] Figure 3 This is a bottom view showing the power module in one embodiment of this application.

[0029] Figure 4 This is a side view of a power module in one embodiment of this application.

[0030] Figure 5 It means Figure 4 The diagram shows an enlarged view of region A in the power module.

[0031] Figure 6 This is a cross-sectional view along the width direction of the power module in one embodiment of this application.

[0032] Figure 7 It means Figure 6 An enlarged view of region B in the power module is shown.

[0033] Figure 8 This is a schematic diagram illustrating the structure of a power module according to an embodiment of this application. Detailed Implementation

[0034] The following description, in conjunction with the accompanying drawings, clearly and completely describes some embodiments of this disclosure. Obviously, the described embodiments are merely some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0035] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, a particular feature, structure, material, or characteristic may be included in any suitable manner in any one or more embodiments or examples.

[0036] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. The singular forms "a" and "the" as used in this specification and the appended claims also include a plurality of indicators, unless the content explicitly states otherwise. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality" means two or more.

[0037] In describing some embodiments, the term "connection" and its derivative expressions may be used. For example, the term "connection" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0038] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0039] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0040] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0041] As used herein, “about,” “approximately,” or “roughly” includes the value stated and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0042] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. The exemplary embodiments disclosed herein should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations caused, for example, by manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0043] like Figures 1-7 As shown, Figure 1 This is a top view showing the power module in one embodiment of this application; Figure 2 This is a top view showing the interior of a power module in one embodiment of this application; Figure 3 This is a bottom view showing the power module in one embodiment of this application; Figure 4 This is a side view of a power module according to an embodiment of this application. The power module is a three-phase inverter, comprising three upper bridge arms connected to the positive DC bus and three lower bridge arms connected to the negative DC bus, with each upper and lower bridge arm corresponding to a one-to-one connection to a three-phase AC output terminal. The encapsulating resin 10 is rectangular in top view and may have a first side surface 10a and a second side surface 10b facing each other in the width direction Y, a top surface 10c and a heat-dissipating bottom surface 10d facing each other in the thickness direction X, and a third side surface 10e and a fourth side surface 10f facing each other in the length direction X. A plurality of control-side pins 20 extend from the first side surface 10a of the encapsulating resin 10. A plurality of power-side pins 30 extend from the second side surface 10b of the encapsulating resin 10. In some embodiments, the power-side pins 30 have a width wider than the control-side pins 20.

[0044] In some embodiments, the plurality of control-side pins 20 may have a plurality of high-side control-side pins 20. H Multiple low-side control pins 20 L Multiple power-side pins 30 can have a DC positive terminal power-side pin 30. P And 3 three-phase output power-side pins 30 HU 30 HV 30 HWand the power side pin 30 at the DC negative terminal. LU 30 LV 30 LW DC positive power side pin 30 P And 3 three-phase output power-side pins 30 HU 30 HV 30 HW and the power side pin 30 at the DC negative terminal. LU 30 LV 30 LW Arranged sequentially, DC positive power side pin 30 P Connect to the positive DC bus. Power side pin 30 of the three-phase output. HU 30 HV 30 HW Each corresponds to one of the U-phase, V-phase, and W-phase of the three-phase inverter, including the U-phase AC output terminal, V-phase AC output terminal, and W-phase AC output terminal, i.e., the three-phase AC output terminals. The power side pin 30 on the DC negative terminal... LU 30 LV 30 LW Each corresponds to the U-phase, V-phase, and W-phase, including the negative DC terminals of the U-phase, V-phase, and W-phase. It is understood that the negative DC terminals of the U-phase, V-phase, and W-phase can also be connected in parallel to a single pin, connected to the negative DC bus.

[0045] In one example, DC positive power side pin 30 P Three-phase output power side pin 30 HU 30 HV 30 HW 30 power-side pins on the negative DC terminal LU 30 LV 30 LW The three phases are arranged sequentially on the second side 10b. It is understood that the arrangement of the terminals of the three phases is free; for example, it could be a UVW phase arrangement, a UWV phase arrangement, or a WVU phase arrangement. In one example, the power-side pins 30 of the three-phase output are arranged in the same order. HU 30 HV 30 HW and the power side pin 30 of the DC negative terminal LU 30 LV 30 LW However, they do not necessarily have to be arranged in the same order.

[0046] The power module 10 includes a driver chip 40 and a power chip 50 electrically connected to the driver chip 40. The driver chip 40 may have a high-side drive chip 50. Hand low-side driver chip 40 L Power chip 50 includes high-side power chip 50. HU 50 HV 50 HW and low-side power chip 50 LU 50 LV 50 LW High-side power chip 50 HU 50 HV 50 HW Forming a three-phase upper arm, with 50 low-side power chips. LU 50 LV 50 LW It forms the lower arm of the three-phase bridge.

[0047] High-side driver chip 40 H With three-phase upper bridge arm and multiple high-side control pins 20 H Make the wire connections. High-side power chip 50 HU 50 HV 50 HW The gate electrodes of each are connected to the high-side driver chip 40 H Make the wire connections. High-side driver chip 40 H With high-side control side pin 20 H The input signal corresponds to the high-side power chip 50. HU 50 HV 50 HW Controlled separately. Low-side driver chip 40 L With three-phase lower bridge arm, multiple low-side control pins 20 L Make the wire connections. Low-side power chip 50 LU 50 LV 50 LW The gate electrodes of each are connected to the low-side driver chip 40 L Connection. Low-side driver chip 40 L With low-side control side pin 20 L The input signal corresponds to the low-side power chip 50. LU 50 LV 50 LW They are controlled separately. In addition, the high-side driver chip 40 can also be used. H and low-side driver chip 40 L It can be configured as a driver chip; or the high-side driver chip 40 can be configured as a driver chip. H The three-phase upper bridge arm is driven by three separate chips; the low-side drive chip is 40. L The three-phase lower bridge arms are driven by three separate chips, and the implementation can be tailored to the specific circumstances. Alternatively, the high-side drive chip 40 can be used. H and low-side driver chip 40L The mounting portion is integrated with the lead frame formed integrally with multiple control side pins 20.

[0048] The encapsulating resin 10 can encapsulate the high-side driver chip 40, the high-side power chip 50, a portion of the multiple control-side pins 20, and a portion of the multiple power-side pins 30.

[0049] In one embodiment of this application, the encapsulation resin 10 of the power module has a first recess 110 and a second recess 120. Specifically, a first recess 110 is provided between at least partially adjacent power-side pins 30, extending from the second side 10b toward the sealing resin 10 and recessed along the width direction Y. The minimum creepage distance between the two power-side pins 30 located on both sides of the first recess 110 passes through the first recess 110. A plurality of second recesses 120 are arranged adjacent to and stacked with the first recess 110 in the thickness direction Z of the sealing resin 100. At least one first recess 110 has a second recess 120 on each side in the thickness direction Z. The recess depth L2 of the second recess 120 in the width direction Y is greater than the recess depth L1 of the first recess 110 in the width direction Y. See [reference needed]. Figure 7 .in, Figure 6 This is a cross-sectional view of the power module along the width direction in the first recess 110. The power side pin 30 is shown in dashed lines within the sealing resin 10, which only indicates its positional relationship and does not mean that the part is present on this cross-section.

[0050] In this embodiment, the second recess 120, the first recess 110, and the second recess 120 are stacked sequentially in the thickness direction Z.

[0051] The first recess 110 reduces the package size while increasing the creepage distance between the power-side pins 30, which is beneficial for the high voltage withstand and miniaturization of the power module. The second recess 120 can improve the heat dissipation of the conductor opposite it, which is beneficial for improving the current carrying capacity of the power module. In addition, during the injection of sealing resin 10 in the manufacturing of the power module, the resin flowing through the first recess 110 is squeezed through the second recess 120, which can effectively improve the uniformity of the sealing resin filling and reduce defects such as voids.

[0052] In some embodiments, the opening width of the second recess 120 on the second side 10b is greater than the opening width of the first recess 110 on the second side 10b. During the manufacturing process, when the sealing resin 10 is injected, the second recess 120, which is larger than the first recess 110, further compresses the resin flowing through the first recess 110, which can effectively improve the uniformity of resin filling and reduce defects such as voids.

[0053] In some embodiments, at least four first recesses 110 are provided on the second side 10b of the encapsulating resin 10 between adjacent power-side pins 30. Specifically, the DC positive power-side pins 30 P Power side pin 30 of the adjacent three-phase output HU A first recess 110 is provided between (for example, the U-phase output terminal); the power side pins 30 of the three three-phase outputs are provided. HU 30 HV 30 HW Two first recesses 110 are provided, and each of the two first recesses 110 is located between two adjacent power-side pins of the three-phase output, namely, one first recess 110 between the U-phase output terminal and the V-phase output terminal, and one first recess 110 between the W-phase output terminal and the V-phase output terminal; the power-side pins 30 of the three-phase output are provided. HW Power side pin 30 adjacent to the DC negative terminal LU A first recess 110 is provided between, for example, the W-phase output terminal and the U-phase DC negative terminal. Generally, this is because the power-side pin 30 at the DC negative terminal where no high voltage is applied... LU 30 LV 30 LW The required creepage distance between them is small, therefore, in order to miniaturize the power device, the power side pin 30 on the DC negative terminal is used. LU 30 LV 30 LW There is no first recess 110 between them.

[0054] In some embodiments, each first recess 110 has a second recess 120 on both sides of the thickness direction Z. In other embodiments, some first recesses 110 have a second recess 120 on both sides of the thickness direction Z.

[0055] In some embodiments, DC positive power side pin 30 P Power side pin 30 of the adjacent three-phase output HU The spacing and adjacent three-phase output power side pins 30 HU 30 HV 30 HW The spacing is 30 mm more than the adjacent DC negative terminal power side pin. LU 30 LV 30 LW The spacing is wide. Due to the DC positive power side pin 30 P and the power side pin 30 of the three-phase output HU 30 HV 30 HWA high potential difference is generated between adjacent pins, thus making the spacing between the three-phase outputs wider than the spacing between the DC negative terminals. Here, the spacing between adjacent pins refers to the distance between the center lines of adjacent pins in the thickness direction Z.

[0056] In some embodiments, DC positive power side pin 30 P Power side pin 30 of the adjacent three-phase output HU The spacing between adjacent power-side pins 30 is greater than or equal to the spacing between other adjacent power-side pins 30 and the spacing between adjacent control-side pins 20. This ensures that adjacent DC positive power-side pins 30... P Power side pin 30 of the three-phase output HU The spacing is the widest, even with the DC positive power side pins thickened to 30. P This also ensures an insulation distance. Specifically, it allows for a 30mm insulation distance between the DC positive power side pins. P The bolding increases the degree of design freedom.

[0057] In some embodiments, the second side 10b is connected to the DC positive power side pin 30. P Three-phase output power side pin 30 HU 30 HV 30 HW 30 power-side pins on the negative DC terminal LU 30 LV 30 LW The configuration is performed in the following order. In other embodiments, it is not limited to this; it can also be configured on the second side 10b via the DC positive power side pin 30. P 30 power-side pins on the negative DC terminal LU 30 LV 30 LW Three-phase output power side pin 30 HU 30 HV 30 HW The configuration is performed in sequence. In this case, the first recess 110 is located on the adjacent DC positive power side pin 30. P Power side pin 30 connected to the DC negative terminal LU One is set between adjacent three-phase output power-side pins 30. HU 30 HV 30 HW Two pins are set between each other, on the power side pin 30 at the DC negative terminal. LW Power side pin 30 of the adjacent three-phase output HU One pin is set between the pins. It's understandable that the higher the voltage applied to the pins, the more necessary it is to increase the pin spacing and width. With the same applied voltage, a wider pin width results in a larger spacing.

[0058] Please see Figure 2 In some embodiments, at least a portion of the power-side pin 30 has a wire connection portion 301 disposed opposite to the second recess 120 and a connection portion 302 connected to the outside of the power-side pin within the sealing resin 10. The connection portion 302 is connected to the wire connection portion 301, and the connection portion 302 is misaligned with the second recess 120, that is, the connection portion 302 and the second recess 120 are not directly opposite each other. The wire connection portion 301 is connected to the corresponding power chip 50 via a wire 60. Figure 2 An example is shown in which the connecting portion 302 and the wire joint portion 301 are connected with the position of the dashed line 303 as the boundary. In other examples, the boundary position between the connecting portion 302 and the wire joint portion 301 may be offset from the position of the dashed line 303, and is not limited here.

[0059] For example, DC positive power side pin 30 P Three-phase output power side pin 30 HU 30 HV 30 HW It has a wire engagement portion 301 disposed opposite to the second recess 120 and a connection portion 302 connected to the outside of the power side pin. The three-phase output power side pin 30... HU 30 HV 30 HW The wire junction 301 is connected to the corresponding power chip 50 via the wire 60.

[0060] By placing the wire 60 at the wire joint 301, i.e., the wire 60 is opposite to the second recess 120, the path for heat transfer from the wire 60 to the outside is reduced, improving the heat dissipation performance of the wire 60 and thus enhancing the current carrying capacity of the power module. The power side pins are the portions exposed to the sealing resin 10.

[0061] See Figure 2 and Figure 7 In some embodiments, the power-side pin 30 of the three-phase output is... HU 30 HV 30 HW Connecting wire 60, one end of which is connected to the power side pin 30 of the three-phase output. HU 30 HV 30 HW The wire connection portion 301, and the wire 60 is outside the coverage area of ​​the corresponding second recess 120 in the thickness direction Z, and the other end of the wire 60 is connected to the corresponding power chip 50.

[0062] In the thickness direction Z, the sealing resin 10 at the location covering the conductor 60, outside the second recess 120, is not thinned. This prevents arcing or dielectric breakdown between the conductor 60 and the external environment (or other conductive components) when the power module withstands high voltage or carries large current. If the conductor 60 is within the coverage area of ​​the second recess 120, the sealing resin 10 at that location will become thinner due to the inherent arc height of the conductor 60, making breakdown more likely.

[0063] In one embodiment, a circuit board 90 is housed within a sealing resin 10, and a power chip 50 is mounted on the circuit board 90. High-side power chip 50 HU 50 HV 50 HW The lower surface electrodes are all connected to the DC positive power side pin 30 via the same copper-clad circuit 910 on the circuit board 90. P The power chip at the negative DC terminal is 50. LU 50 LV 50 LW The lower surface electrodes are respectively connected to the power-side pins 30 of the three-phase output via different copper-clad circuits 910 on the circuit board 90. HU 30 HV 30 HW One-to-one electrical connection. High-side power chip 50 HU 50 HV 50 HW The upper surface electrodes are connected one-to-one to the power side pins 30 of the three-phase output via different wires 60. HU 30 HV 30 HW The wire connection portion 301. Low-side power chip 50 LU 50 LV 50 LW The lower surface electrodes are connected one-to-one to the power side pins 30 of the DC negative terminal via different wires 60. LU 30 LV 30 LW In this configuration, one of the upper surface electrode and the other of the lower surface electrode is, for example, the drain electrode, and the other is the source electrode.

[0064] Three-phase output power side pin 30 HU 30 HV 30 HW The exposed portions of the sealing resin 10, the wire joint 301, and the connection portion 30 are constructed from an integrated wiring harness called a lead frame. These form a path for the main current to flow. The lead frame is, for example, made of copper.

[0065] DC positive power side pin 30 P Three-phase output power side pin 30HU 30 HV 30 HW The outer surface of the wire connection portion 301 is opposite to the bottom surface of the first recess 110 and the side surface of the second recess 120, which increases the heat conduction area of ​​these wire connection portions 301 and facilitates the release of heat conducted to the wire connection portion 301 from the first recess 110 and the second recess 120 to the outside by using air cooling. Therefore, heat dissipation is improved.

[0066] In addition, DC positive power side pin 30 P The connection part 302, the three three-phase output power side pins 30 HU 30 HV 30 HW The connection portion 302 is not opposite to the first recess 110 and the second recess 120, which allows the resin at the connection portion 302 to be relatively thick, ensuring the connection strength between the part exposed outside the sealing resin 10 and the sealing resin 10, and improving the reliability of the power module. On the other hand, during the manufacturing process of the sealing resin 10, the DC positive terminal power side pin 30 P Connection part 302, power side pin 30 of three-phase output HU 30 HV 30 HW The first recess 110 and the second recess 120 on both sides of the connector 302 compress the resin around the connector 302, which can effectively improve the uniformity and strength of the resin filling around the connector 302, reduce defects such as voids, further improve the connection strength between the part exposed outside the sealing resin 10 and the sealing resin 10, and improve the reliability of the power module.

[0067] Please see Figure 2 and Figure 7 In some embodiments, the second recess 120 covers at least a portion of the wire connection portion 301 in the thickness direction Z. The portion of the wire connection portion 301 covered by the second recess 120 can be used to provide clamping claws during the wire 60 soldering process to secure the lead frame for easy soldering; and in the final product, the overlap of the two reduces the size of the power module in the width direction, facilitating miniaturization. The wire connection portion 301, being part of the lead frame, is planar relative to the wire 60, and the reduction in its material thickness remains within a safe range, thus simultaneously meeting electrical reliability requirements.

[0068] Please see Figure 3 In some embodiments, the sealing resin 10 also forms a first stepped portion 130 recessed from the heat-dissipating bottom surface 10d toward the top surface 10c, and the recess depth L3 of the first stepped portion 130 in the width direction Y is greater than the recess depth L2 of the second recess 120 in the width direction Y (see...). Figure 7The second recess 120 and the first stepped portion 130 are adjacent to and stacked. The first stepped portion 130 ensures the creepage distance between the power-side pin 30 and the external heat sink, which is beneficial for the high voltage withstand and miniaturization of the power module. Generally, the external heat sink is in contact with the heat sink bottom surface 10d. In addition, by providing the first stepped portion 130, while ensuring the fixing strength of the control-side pin 20 and the power-side pin 30 in the sealing resin 10, the thermal conductivity distance between the control-side pin 20 and the power-side pin 30 and the outside can also be reduced, which is further beneficial for heat dissipation.

[0069] In the thickness direction Z from the bottom heat dissipation surface 10d towards the top surface 10c, on the second side surface 10b, the first stepped portion 130, the second recessed portion 120, the first recessed portion 110, and the second recessed portion 120 are stacked sequentially, see [reference]. Figure 7 .

[0070] Please see Figures 4 to 7 In some embodiments, the second side surface 10b includes a parting line 70, and the distance H1 from the parting line 70 to the heat dissipation bottom surface 10d in the thickness direction Z is greater than or equal to the distance H2 from the parting line 70 to the top surface 10c in the thickness direction Z. This increases the creepage distance between the power side pins 30 of the power module and the external heat sink, which is beneficial for the high voltage withstand capability of the power module.

[0071] In some embodiments, the main structure of the power module is encapsulated using transfer molding to form a sealing resin 10. The mold has an upper housing and a lower housing, which are fastened together to form an internal cavity. The main structure of the power module is placed in the cavity of the mold, and the side of the sealing resin 10 formed by the mold has a parting line 7 corresponding to the fastening position of the upper and lower housings of the mold. The mold has a resin injection port, through which liquid resin is injected into the cavity of the mold, filling the space between the main structure of the power module and the cavity wall. After the resin cures, a sealing resin 10 is formed. Figure 1 The sealing resin 10 shown serves to cover and protect circuit components such as the power chip 50 and the driver chip 40, thereby improving the structural reliability of the power module. It is understood that the portion of the formed sealing resin 10 corresponding to the resin injection port is the resin injection portion 80 of the sealing resin 10. The roughness of the resin injection portion 80 is greater than that of other parts of the sealing resin 10, thus leaving a trace of the resin injection port. In some embodiments, the resin injection portion 80 of the sealing resin 10 is arranged in the first recess 110. During the injection of the sealing resin 10, the resin injection port is positioned at the location corresponding to the first recess 110. By squeezing the resin near the resin injection port through the second recess 120, the uniformity of the filling of the sealing resin 10 can be efficiently improved, reducing defects such as voids.

[0072] In some embodiments, there are two resin injection sections 80, and the power side pins 30 of the three-phase output are... HW Power side pin 30 connected to the DC negative terminal LU It has a resin injection section 80 and a three-phase output power side pin 30. HU 30 HV There is a resin injection section 80 between them, such as Figure 4 As shown. In other embodiments, the DC positive power side pin 30 P Power side pin 30 of the adjacent three-phase output HU It also has a resin injection section 80 and a three-phase output power side pin 30. HV 30 HW It also has a resin injection section 80, that is, it has four resin injection sections 80.

[0073] It is easy to understand that the two resin injection sections 80 mentioned above are provided with two resin injection ports in the resin injection process, and the four resin injection sections 80 are provided with four resin injection ports in the resin injection process. In comparison, when resin is injected into the mold through four resin injection ports simultaneously, the resin flow is concentrated on one side of the mold, resulting in poor resin filling uniformity and increased void rate. When resin is injected into the mold through two resin injection ports located in the middle, the resin can flow evenly to the surrounding area of ​​the mold during the resin injection process. Compared with resin being injected into the mold through four resin injection ports simultaneously, this improves the resin filling uniformity and reduces defects such as voids.

[0074] In some embodiments, such as Figure 4 As shown, the parting line 70 passes through the resin injection section 80. Alternatively, the parting line 70 is positioned in the middle of the first recess 110. This facilitates alignment of the upper and lower shells of the mold, improving manufacturing efficiency. It is easily understood that the resin injection section 80 is located on the concave surface of the second recess 110, which faces the second side surface 10b. During the resin injection process, the resin injection port faces the mold directly, improving the uniformity of resin filling and reducing defects such as voids.

[0075] In some embodiments, one edge of the resin injection portion 80 along the longitudinal direction X of the sealing resin 10 coincides with the straight line containing the parting line 70. Alternatively, the resin injection portion 80 is located on the side of the first recess 110 near the top surface 10c. Alternatively, the resin injection portion 80 is located on the side of the first recess 110 near the heat dissipation bottom surface 10d. In this way, one of the upper and lower housings of the mold can be located at the resin injection port, which facilitates mold processing.

[0076] In some embodiments, the straight line containing the parting line 70 passes through the end of the power-side pin 30 that contacts the second side surface 10b of the sealing resin 10. Thus, both the upper and lower housings of the mold should be provided with corresponding grooves to allow the power-side pin 30 to extend beyond the sealing resin 10, facilitating the mating of the upper and lower housings.

[0077] Please see Figures 4 to 7 In some embodiments, the portion of the first recess 110 between the parting line 70 and the heat dissipation bottom surface 10d is the lower portion of the first recess 110b, the portion of the first recess 110 between the parting line 70 and the top surface 10c is the upper portion of the first recess 110a, the second recess 120 between the first recess 110 and the top surface 10c is the upper second recess 120a, and the second recess 120 between the first recess 110 and the heat dissipation bottom surface 10d is the lower second recess 120b.

[0078] The recess height H3 of the upper second recess 120a in the thickness direction Z is greater than or equal to the recess height H4 of the upper first recess 110a in the thickness direction Z. And / or, the recess height H5 of the lower second recess 120b in the thickness direction Z is greater than or equal to the recess height H6 of the lower first recess 110b in the thickness direction Z. Improving the compression effect of the second recess 120 on the resin can effectively improve the uniformity of the sealing resin filling and reduce defects such as voids. The recess heights H4 and H6 constitute the total recess height of the first recess 110 in the thickness direction Z.

[0079] In some embodiments, the sealing resin 10 has a thickness of 4.5 mm to 6.5 mm, a length of 34 mm to 36 mm, and a width of 20 mm to 26 mm.

[0080] A thickness of 4.5 mm to 6.5 mm is beneficial for increasing creepage distance and improving the voltage withstand capability of the power module. In power modules with a relatively small width and length (34 mm < length < 36 mm, 20 mm < width < 26 mm), the high heat generated by the power-side conductors 60, coupled with a large module thickness, hinders heat dissipation and limits current carrying capacity. However, the second recess 120, positioned opposite the conductors, facilitates timely heat dissipation, achieving high voltage withstand capability and miniaturization while maintaining high current carrying capacity. Furthermore, a larger thickness increases the cross-sectional area of ​​the sealing resin 10, making it prone to uneven filling during manufacturing, resulting in defects such as bubbles and voids. By placing the resin injection port at the position corresponding to the first recess 110, and the second recess 120 compressing the resin at the injection port, the uniformity of the sealing resin filling is effectively improved, reducing defects such as voids. Power modules within this size range can achieve a voltage withstand capability of 600V-102000V and a current carrying capacity of 300A-500A. Therefore, the overall design of this application can simultaneously achieve a power module with high pressure resistance, miniaturization, high current carrying capacity, while also improving the uniformity of the sealing resin 10 filling and reducing defects such as voids.

[0081] Some embodiments of this application also propose a device in which the power module provided in the above embodiments is applied.

[0082] like Figure 8 As shown, the device 1000 includes a controller 200 and a power module 100 provided in any of the above embodiments, and the power module 100 is connected to the controller 200.

[0083] In some embodiments, the power module 100 may be one or more, and the device 1000 may include, but is not limited to, an inverter or a rectifier, such as a motor drive controller.

[0084] For example, the controller 200 can generate a control signal according to the user's instructions and send the control signal to the power module 100. The power module 100 generates a drive signal according to the control signal and outputs it to the corresponding drive device to realize drive control, inversion, or rectification conversion, etc.

[0085] By employing the power module 100 of the above embodiments, the insulation withstand voltage and insulation reliability of the device 10000 provided in some embodiments are improved, as well as the electrical safety of the device is enhanced.

[0086] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A power module, characterized by include: Driver chip; The power chip electrically connected to the driver chip; Multiple control-side pins connected to the driver chip; Multiple power-side pins connected to the power chip; A sealing resin encapsulating the driver chip, the power chip, a portion of the control-side pins, and a portion of the power-side pins, the sealing resin having a first side and a second side opposite to each other in the width direction, a plurality of the control-side pins extending from the first side of the sealing resin, and a plurality of the power-side pins extending from the second side of the sealing resin; A first recess is provided between at least partially adjacent power-side pins, recessed from the second side toward the sealing resin and along the width direction, wherein the minimum creepage distance of the two power-side pins located on either side of the first recess passes through the first recess; and A plurality of second recesses are disposed adjacent to and stacked with the first recess in the thickness direction of the sealing resin, wherein at least one of the first recesses is provided with second recesses on both sides in the thickness direction, and the recess depth of the second recesses in the width direction is greater than the recess depth of the first recesses in the width direction.

2. The power module as described in claim 1, characterized in that, The opening width of the second recess on the second side is greater than the opening width of the first recess on the second side.

3. The power module as described in claim 1, characterized in that, The sealing resin also has a heat-dissipating bottom surface and a top surface disposed opposite to each other in the thickness direction. The sealing resin also has a first step portion formed by recessing from the heat-dissipating bottom surface toward the top surface. The recess depth of the first step portion in the width direction is greater than the recess depth of the second recess portion in the width direction. The second recess portion is adjacent to and stacked with the first step portion.

4. The power module as described in claim 1, characterized in that, At least a portion of the power-side pin has a wire engagement portion disposed opposite to the second recess and a connection portion connected to the outside of the power-side pin within the sealing resin. The connection portion is connected to the wire engagement portion and is offset from the second recess. The wire engagement portion is connected to the corresponding power chip via a wire.

5. The power module as described in claim 4, characterized in that, One end of the wire is connected to the wire junction, and one end of the wire is outside the coverage area of ​​the second recess in the thickness direction; the other end of the wire is connected to the corresponding power chip.

6. The power module as described in claim 4, characterized in that, The second recess covers at least a portion of the wire joint in the thickness direction.

7. The power module according to any one of claims 1 to 6, characterized in that, At least four first recesses are provided on the second side between adjacent power-side pins; The plurality of power-side pins include a DC positive terminal power-side pin, three three-phase output power-side pins, and a DC negative terminal power-side pin. The DC positive terminal power-side pin, the three three-phase output power-side pins, and the DC negative terminal power-side pins are arranged sequentially. A first recess is provided between the DC positive terminal power-side pin and an adjacent three-phase output power-side pin. Two of the three three-phase output power-side pins are provided with the first recess and are respectively located between two adjacent three-phase output power-side pins. A first recess is provided between the three-phase output power-side pin and an adjacent DC negative terminal power-side pin. The sealing resin includes a resin injection portion disposed in the first recess.

8. The power module according to any one of claims 1 to 6, characterized in that, The sealing resin further has a heat-dissipating bottom surface and a top surface disposed opposite to each other in the thickness direction, and the second side surface includes a parting line, the distance from the parting line to the heat-dissipating bottom surface in the thickness direction being greater than or equal to the distance from the parting line to the top surface in the thickness direction; The portion of the first recess between the parting line and the heat dissipation bottom surface is the lower portion of the first recess, and the portion of the first recess between the parting line and the top surface is the upper portion of the first recess; the second recess between the first recess and the heat dissipation bottom surface is the lower second recess, and the second recess between the first recess and the top surface is the upper second recess. The recess height of the upper second recess in the thickness direction is greater than or equal to the recess height of the upper first recess in the thickness direction; And / or, the recess height of the lower second recess in the thickness direction is greater than or equal to the recess height of the lower first recess in the thickness direction.

9. The power module according to any one of claims 1 to 6, characterized in that, The sealing resin has a thickness of 4.5 mm to 6.5 mm, a length of 34 mm to 36 mm, and a width of 20 mm to 26 mm.

10. A device, characterized in that, Includes the power module as described in any one of claims 1 to 9.

Images