inductor component

Abstract

Provided is an inductor component including: an inductor wiring (10) extending along a plane; pad portions (10A, 10B) at both ends of the inductor wiring (10); a vertical wiring (20) extending perpendicularly to the plane from the pad portions (10A, 10B); and a first magnetic layer (30) and a second magnetic layer (40) sandwiching the inductor wiring (10) from a direction perpendicular to the plane, the first magnetic layer (30) and the second magnetic layer (40) being inorganic magnetic layers, and a magnetic composite portion (52) having an organic resin and an inorganic filler being provided between the first magnetic layer (30) and the second magnetic layer (40). With the inductor component (2), a thin inductor component with a high Q value that suppresses eddy current even if the interval between the two magnetic layers is reduced can be provided.

Description

Technical Field

[0001] The present invention relates to an inductor component having inductor wiring extending into a flat plate shape.

[0002] This application claims priority based on Japanese Patent Application No. 2023-191734, filed in Japan on November 9, 2023, the entire contents of which are incorporated herein by reference. Background Technology

[0003] Inductor components with inductor wiring extending into a flat plate shape are becoming increasingly common. In such inductor components, it is proposed that the inductor wiring, covered by an insulating material, exists between two magnetic layers (for example, see Patent Document 1). In the inductor component described in Patent Document 1, a gap is provided that separates the two magnetic layers.

[0004] Patent Document 1: Japanese Patent No. 7171680

[0005] Generally speaking, the shorter the distance between two magnetic layers, the higher the permeability. However, if the gap separating the two magnetic layers is reduced, there is a concern that the eddy currents generated in the two magnetic layers will increase and the Q value (quality factor) will decrease. Summary of the Invention

[0006] Therefore, the object of this disclosure is to provide a thin inductor component that suppresses eddy currents and obtains a high Q value even when the spacing between the two magnetic layers is reduced.

[0007] One aspect of the inductor component disclosed herein includes:

[0008] Inductor wiring extends along the plane;

[0009] The pads are located at both ends of the aforementioned inductor wiring;

[0010] Vertical wiring extends perpendicularly from the aforementioned pad portion relative to the aforementioned plane; and

[0011] The first magnetic layer and the second magnetic layer clamp the inductor wiring from a direction perpendicular to the aforementioned plane.

[0012] The first magnetic layer and the second magnetic layer mentioned above are inorganic magnetic layers.

[0013] A magnetic composite portion is provided between the first magnetic layer and the second magnetic layer, and the magnetic composite portion comprises organic resin and inorganic filler.

[0014] According to this disclosure, it is possible to provide a thin inductor component that suppresses eddy currents and obtains a high Q value even when the spacing between the two magnetic layers is reduced. Attached Figure Description

[0015] Figure 1 This is a top view schematically illustrating an inductor component according to a first embodiment of the present invention.

[0016] Figure 2 It means Figure 1 The side sectional view of section A-A.

[0017] Figure 3 It is a graph showing the B-H curves (hysteresis loops) of the easy and difficult axes.

[0018] Figure 4A This is a schematic diagram illustrating a method for manufacturing an inductor component according to a first embodiment of the present invention, and is a side view showing step 1 of preparing substrate material.

[0019] Figure 4B This is a side view of step 2, which follows step 1, where a first magnetic layer is deposited on the substrate material.

[0020] Figure 4C This is a side view representing step 3, which follows step 2, where a first insulating layer is stacked on top of the first magnetic layer.

[0021] Figure 4D This is a side view of step 4, which follows step 3, where inductor wiring is formed on the first insulating layer.

[0022] Figure 4E This is a side view of step 5, which follows step 4, where a magnetic composite part is stacked on the first insulating layer where inductor wiring is arranged.

[0023] Figure 4F This is a side view of step 6, which follows step 5, where a second magnetic layer is laminated onto the magnetic composite part.

[0024] Figure 4G This is a side view of step 7, which follows step 6, to form a via from the surface side of the second magnetic layer.

[0025] Figure 4H This is a side view of step 8, which follows step 7 and involves forming vertical wiring in the through-hole.

[0026] Figure 4I This is a side view of step 9, which involves grinding the substrate material to form a substrate of a specified thickness, following step 8.

[0027] Figure 4J This is a side view of step 10, which involves cutting and isolating the pieces following step 9.

[0028] Figure 4K This is a side view of the inductor component formed by monolithization in process 10.

[0029] Figure 5 This is a top view schematically illustrating a modified example 1 of the inductor component according to the first embodiment of the present invention.

[0030] Figure 6 It means Figure 5 The side sectional view of section B-B.

[0031] Figure 7 This is a schematic side sectional view of a modified example 2 of the inductor component according to the first embodiment of the present invention.

[0032] Figure 8 This is a schematic side sectional view of a modified example 3 of the inductor component according to the first embodiment of the present invention.

[0033] Figure 9 This is a schematic top view of an inductor component according to a second embodiment of the present invention.

[0034] Figure 10A It means Figure 9 The side sectional view of section C-C.

[0035] Figure 10B It means Figure 9 The side sectional view of section D-D.

[0036] Figure 11A This is a schematic diagram illustrating a modified example 1 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10A A side sectional view of a section at the same location.

[0037] Figure 11B This is a schematic diagram illustrating a modified example 1 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location.

[0038] Figure 12 This is a schematic diagram illustrating a modified example 2 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location.

[0039] Figure 13A This is a schematic diagram illustrating a modified example 3A of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location.

[0040] Figure 13B This is a schematic diagram illustrating a modified example 3B of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location.

[0041] Figure 13C This is a schematic diagram illustrating a modified example 3C of the inductor component according to the second embodiment of the present invention, and it is shown as... Figure 10B A side sectional view of a section at the same location.

[0042] Figure 14 This is a top view schematically illustrating an example of an inductor component with multiple inductor wires arranged along a plane.

[0043] Figure 15 This is a schematic diagram illustrating an inductor component according to a third embodiment of the present invention, and is shown in relation to... Figure 10B A side sectional view of a section at the same location. Detailed Implementation

[0044] Hereinafter, embodiments and variations for carrying out the present invention will be described with reference to the accompanying drawings. In each drawing, corresponding components having the same function are labeled with the same reference numerals. For ease of explanation and understanding, separate embodiments may be shown for convenience, but partial substitutions or combinations of structures shown in different embodiments are possible. In the embodiments described later, descriptions of matters shared with the foregoing embodiments are omitted, and only differences are explained. In particular, the same effects achieved by the same structure are not mentioned sequentially in each embodiment. The sizes and positional relationships of the components shown in the drawings are sometimes enlarged for clarity of explanation.

[0045] The accompanying drawings show an inductor component with a generally rectangular shape, placed on a horizontal plane with the substrate side facing down. The long side direction is taken as the X-axis, the short side direction as the Y-axis, and the height direction, which is orthogonal to both the long and short side directions, as the Z-axis.

[0046] (Inductor component according to the first embodiment of the present invention)

[0047] First, refer to Figures 1 to 3 The inductor component of the first embodiment of the present invention will be described. Figure 1 This is a top view schematically illustrating an inductor component according to a first embodiment of the present invention. Figure 2 It means Figure 1 The side sectional view of section A-A. Figure 3 This is a graph showing the B-H curves (hysteresis loops) for the easy and difficult axes. Furthermore, in Figure 1 In the image, the inductor wiring is shown in perspective using solid lines.

[0048] In this embodiment, the inductor component 2 has a first magnetic layer 30 formed on a substrate 60, a first insulating layer 50 formed on the first magnetic layer 30, an inductor wiring 10 and a magnetic composite portion 52 covering the inductor wiring 10 formed on the first insulating layer 50, and a second magnetic layer 40 formed on the magnetic composite portion 52. The magnetic composite portion 52 has an organic resin and an inorganic filler. The inductor wiring 10 extends along a plane and has pad portions 10A and 10B at both ends. Vertical wiring 20 extending perpendicularly to the plane extending relative to the inductor wiring 10 is formed from the pad portions 10A and 10B at both ends. In this embodiment, the inductor wiring 10 is disposed between the first magnetic layer 30 and the second magnetic layer 40 in the Z-axis direction, and the magnetic composite portion 52 having an organic resin and an inorganic filler is disposed between the first magnetic layer 30 and the second magnetic layer 40.

[0049] In this embodiment, a high-resistivity silicon substrate is used as the substrate 60. However, it is not limited to this; any other inorganic substrate, such as a glass substrate or a ceramic substrate, can be used as the substrate 60. From the viewpoint of suppressing eddy current generation, a substrate with high insulation is preferred. The thickness of the substrate 60 can be 5 μm, but it is not limited to this. In this embodiment, the layers constituting the inductor component 2, including the first magnetic layer 30, are formed on an inorganic substrate, thus ensuring chip strength even when thin.

[0050] However, as referenced Figure 7 As will be described later, an inductor component 6 without a substrate 60 can also be used. Alternatively, an organic insulating layer can be formed between the substrate 60 and the first magnetic layer 30.

[0051] The first magnetic layer 30 and the second magnetic layer 40 are formed by a laminate of an inorganic insulating layer and an inorganic magnetic layer. The thicknesses of the first magnetic layer 30 and the second magnetic layer 40 are typically around 5 to 6 μm, but are not limited to this. The materials and detailed structures of the first magnetic layer 30 and the second magnetic layer 40 will be described in more detail in the description of the manufacturing method.

[0052] In this embodiment, the first insulating layer 50 is formed of polyimide. However, it is not limited to this; other organic resins, such as epoxy resin and phenolic resin, or combinations thereof, can also be used, and insulating fillers may also be included. Furthermore, it can also be formed of inorganic insulators such as SiO2 and TaO. In this embodiment, the thickness of the first insulating layer 50 is 5 μm, but it is not limited to this.

[0053] The magnetic composite part 52 is a composite of organic resin and inorganic filler. In this embodiment, epoxy resin is used as the organic resin, and FeSiCr is used as the inorganic filler. However, it is not limited to this; for example, acrylic resin, phenolic resin, or combinations thereof can also be used as the organic resin. Furthermore, ferrite, other Fe-based resins, or Fe-based alloys can also be used as the magnetic filler. Additionally, insulating fillers such as silica fillers can be included to adjust insulation properties and the coefficient of linear expansion.

[0054] The magnetic composite portion 52 in this embodiment uses FeSiCr as an inorganic filler. By including Si and Cr, the crystal structure of the magnetic composite portion 52 undergoes deformation, which can further improve the permeability of the first magnetic layer 30 and the second magnetic layer 40. In particular, by including Si, the crystal structure undergoes deformation, which can improve the permeability of the magnetic layer compared to the case where only Fe is present. Since Cr is easily oxidized, if Cr is present on the surface, the Cr on the surface will oxidize, which can prevent oxidation into the interior of the magnetic composite portion 52. In this way, by including Si and Cr in the magnetic composite portion 52, a balance between magnetic saturation and the permeability of the magnetic layer can be achieved, which can improve the permeability of the magnetic layer and improve the reliability of the inductor component 2.

[0055] In this embodiment, the thickness of the magnetic composite portion 52 is a value obtained by adding approximately 2 to 10 μm to the thickness of the inductor wiring 10, which will be described later.

[0056] The inductor wiring 10 and vertical wiring 20, which have pads 10A and 10B at both ends, are formed of a conductive material with low resistance, such as copper, silver, or gold. Preferably, a conductor containing copper or a copper compound is used. The vertical wiring 20 is electrically connected to the inductor wiring 10 via the pads 10A and 10B at both ends. In this embodiment, a flat wire with a cross-sectional dimension of 40μm × 20μm is used as the inductor wiring 10, but it is not limited to this. Flat wires of different sizes or wiring other than flat wires can also be used.

[0057] The vertical length of the vertical wiring 20 is determined by the thickness of the magnetic composite portion 52 and the second magnetic layer 40, and the amount of protrusion from the surface of the second magnetic layer 40. In this embodiment, the amount of protrusion of the vertical wiring 20 from the surface of the second magnetic layer 40 is 5 μm, but it is not limited to this.

[0058] The inductor component 2 constructed as described above has a roughly rectangular parallelepiped shape. If the length of the long side (X-axis direction) is set as L, the length of the short side (Y-axis direction) is set as W, and the length of the height (Z-axis direction) is set as T, then it has dimensions of L×W×T=1.0mm×0.5mm×0.5mm. However, this is just an example; inductor components with other arbitrary dimensions can be used.

[0059] By electrically connecting the vertical wiring 20 protruding from the surface of the second magnetic layer 40 to an external circuit, current can flow into the inductor wiring 10 through the vertical wiring 20 to generate magnetic flux, thus enabling it to function as an inductor. Because it is connected to the external circuit via the vertical wiring 20, the inductor component 2 can be mounted efficiently.

[0060] like Figure 2 As shown, in this embodiment, the vertical wiring 20 is formed such that the cross-sectional area increases from the end face that contacts the pad portions 10A and 10B toward the opposite end face 20A. Therefore, at end face 20A, the connection strength with external circuits and external terminals is improved, and connection resistance can be suppressed.

[0061] Furthermore, in the inductor component 2 of this embodiment, multiple conductive layers are formed on the end face 20A of the vertical wiring 20. For example, by forming a Ni layer as a conductive layer on the end face 20A, electromigration resistance can be provided, and by forming an Au layer, Sn layer, or the like as conductive layers, solder wetting properties can be provided. As a result, appropriate functionality can be provided for connection with external circuits.

[0062] <Function of the magnetic composite part>

[0063] While reducing the distance between the first magnetic layer 30 and the second magnetic layer 40 increases the permeability of the magnetic layers, there are concerns about increased eddy currents in the magnetic layers and a decrease in the Q value. Furthermore, the Q value, also known as the Quality Factor, represents the "sharpness" of the signal at the resonant frequency. The ratio of the resistance (R) of the inductor wiring to the inductance L corresponding to the frequency f (R / 2πf·L) is called the loss factor, and its reciprocal is the Q value. A higher Q value indicates lower losses, resulting in superior characteristics for high-frequency inductors.

[0064] In the inductor component 2 of this embodiment, since a magnetic composite portion 52 containing organic resin and inorganic filler is provided between the first magnetic layer 30 and the second magnetic layer 40, eddy currents can be suppressed even if the distance between the first magnetic layer 30 and the second magnetic layer 40 is reduced, and the inductor component 2 can be made thinner and lighter.

[0065] Furthermore, since eddy currents can be suppressed even when the spacing between the first magnetic layer 30 and the second magnetic layer 40 is reduced due to the magnetic composite portion 52, a high Q value can be obtained. Thus, a thin inductor component can be provided that suppresses eddy currents and obtains a high Q value even when the spacing between the two magnetic layers is reduced.

[0066] In this embodiment, from Figure 2 It is understood that the magnetic composite portion 52 covers a portion of the inductor wiring 10. Furthermore, the thickness of the magnetic composite portion 52 in the direction perpendicular to the plane is formed to be thicker than that of the first magnetic layer 30 and the second magnetic layer 40. The organic resin of the magnetic composite portion 52 acts as an insulating layer, imparting insulation between the wirings. Additionally, the magnetic filler, being a magnetic material, suppresses leakage flux. Moreover, since the inductor is a current-carrying element, thickening the wiring is effective in reducing losses when current flows. By forming a thicker magnetic composite portion 52, the inductor wiring 10 can be thickened.

[0067] In this way, since the magnetic composite portion 52 covers a portion of the inductor wiring 10, and the thickness of the magnetic composite portion 52 in the direction perpendicular to the plane is greater than that of the first magnetic layer 30 and the second magnetic layer 40, it can impart insulation between the wirings, suppress leakage flux, and thicken the inductor wiring 10 to reduce losses when current flows.

[0068] Furthermore, in this embodiment, as Figure 2 As shown, the vertical wiring 20 penetrates the magnetic composite portion 52 and the second magnetic layer 40. Thus, when viewed from above, the magnetic composite portion 52 and the second magnetic layer 40 are formed to cover the entire circumference of the vertical wiring 20, with the area of ​​the second magnetic layer 40 maximally expanded in the planar direction. (See reference...) Figure 7 and Figure 8 As will be described later, there are also cases where vertical wiring penetrates through the first magnetic layer 30.

[0069] In this way, when the vertical wiring 20 passes through at least one of the first magnetic layer 30, the second magnetic layer 40 and the magnetic composite portion 52, the inductor acquisition efficiency can be improved and leakage flux can be suppressed because the area of ​​the magnetic layer is maximized in the planar direction.

[0070] <Direction of Inductor Wiring>

[0071] The inductor component 2, which has a generally rectangular shape, has pad portions 10A and 10B arranged at both ends in the long side direction (X-axis direction). The inductor wiring 10 extends in the long side direction from one pad portion 10A (10B) while serpentine to draw a smooth curve, and reaches the other pad portion 10B (10A). Thus, a so-called zigzag inductor is constructed.

[0072] The first magnetic layer 30 and the second magnetic layer 40, arranged vertically and horizontally sandwiching the inductor wiring 10, have uniaxial magnetic anisotropy along the same axis. In this embodiment, the two anisotropic axes (easy axis and difficult axis) of the first magnetic layer 30 and the second magnetic layer 40 are compared with those when viewing the inductor component 2 from above (refer to...). Figure 1 The long side (X-axis direction) and short side (Y-axis direction) of the magnetic layer 30 and the magnetic layer 40 are parallel. In addition, considering manufacturing deviations, "the first magnetic layer 30 and the second magnetic layer 40 have uniaxial magnetic anisotropy with the same axis" means that the angle formed by the anisotropy axes of the first magnetic layer 30 and the second magnetic layer 40 converges to less than 10 degrees.

[0073] The anisotropy axes of the first magnetic layer 30 and the second magnetic layer 40, which have uniaxial magnetic anisotropy with the same axis, will be described in more detail. As a method for determining the easy and difficult axes of uniaxial magnetic anisotropy, for example, the B-H curve can be obtained by rotating the sample by 90 degrees, measuring the magnetic layer using a VSM (vibrating sample magnetometer), and obtaining the curve. The B-H curve is also called the hysteresis loop. An example of a measured B-H curve is shown below. Figure 3 . Figure 3 The vertical axis of the graph shows the magnetic flux density B (in tons), and the horizontal axis shows the magnetic field strength H (in meters).

[0074] If the permeability is set to μ, then the relationship B = μH holds. That is, Figure 3 The slope of the B-H curve shown represents the permeability μ. A steeply rising B-H curve represents the easy axis (easily magnetized axis), while a gently sloping B-H curve represents the difficult axis (difficult to magnetize axis). If the direction of the magnetic flux generated by the current flowing in the inductor wiring 10 is parallel to the easy axis, the acquisition efficiency of the inductor can be improved. On the other hand, if the direction of the magnetic flux generated by the current flowing in the inductor wiring 10 is parallel to the difficult axis, the DC superposition characteristic can be improved or the iron loss can be reduced. Furthermore, for the test specimen for uniaxial magnetic anisotropy testing, a planar shape of circular or square is preferred to eliminate the influence of shape anisotropy, but even other shapes can be measured.

[0075] In this embodiment, the difficult axis of the first magnetic layer 30 and the second magnetic layer 40, which have uniaxial magnetic anisotropy, may be oriented towards the long side direction (X-axis direction) and the easy axis towards the short side direction (Y-axis direction), or conversely, the easy axis may be oriented towards the long side direction (X-axis direction) and the difficult axis towards the short side direction (Y-axis direction).

[0076] In either case, the two ends of the inductor wiring 10 are separated along one of the anisotropic axes (X-axis direction) of the uniaxial magnetic anisotropy, either the difficult or easy axis. Furthermore, the two ends of the inductor wiring 10 can be at the same or different positions along the other anisotropic axis (Y-axis direction). The inductor wiring 10 extends along one anisotropic axis (X-axis direction) while meandering between the pads 10A and 10B at both ends. It is particularly noteworthy that the inductor wiring 10 does not extend orthogonally to one anisotropic axis (X-axis direction) throughout the entire region. That is, the inductor wiring 10 extending between the pads 10A and 10B at both ends always has a vector component along one anisotropic axis (X-axis direction). There will be no situation where it lacks a vector component along one anisotropic axis (X-axis direction) and only has a vector component along the other anisotropic axis (Y-axis direction).

[0077] This can also be described as: the wiring centerline G passing through the center in the width direction relative to the inductor wiring 10 (refer to...) Figure 1 It extends across the entire region without being orthogonal to an anisotropic axis (X-axis direction). Alternatively, it can be described as the wiring centerline G intersecting an anisotropic axis (X-axis direction) at an angle of less than 90 degrees.

[0078] In the inductor wiring extending along the plane, there is a spiral wiring. If the case of rotating the spiral wiring of the inductor wiring by 360 degrees is considered as 1 turn, then in this embodiment, it can also be described as being composed of inductor wiring 10 connected with less than 0.5 turns.

[0079] When the inductor wiring 10 extends along an anisotropic axis (X-axis direction), due to the vector component in the direction of the anisotropic axis (X-axis direction), most of the magnetic flux is directed towards the direction of the other anisotropic axis (Y-axis direction). Assuming that the inductor wiring 10 has a region extending perpendicular to the direction of the anisotropic axis (X-axis direction), in that region, all the magnetic flux is directed towards the direction of the anisotropic axis (X-axis direction), and therefore will be affected by it.

[0080] In this embodiment, the first magnetic layer 30 and the second magnetic layer 40 have uniaxial magnetic anisotropy in the same direction, and the inductor wiring 10 extends in the entire region without being orthogonal to an anisotropic axis (X-axis).

[0081] In this way, since the inductor wiring 10 extends along one anisotropic axis (X-axis direction), most of the magnetic flux can be directed towards the other anisotropic axis (Y-axis direction). This provides the effect of directing the magnetic flux towards the other anisotropic axis (Y-axis direction). Furthermore, since the inductor wiring 10 extends non-orthogonally to one anisotropic axis (X-axis) throughout the entire region, the influence of one anisotropic axis (X-axis) can be suppressed. Therefore, effects such as reliably improving inductance efficiency, enhancing DC superposition characteristics, or suppressing iron losses are reliably obtained.

[0082] When one anisotropic axis oriented towards the longer side (X-axis) is the difficult axis, the inductance acquisition efficiency can be improved because most of the magnetic flux passes through the easy axis (Y-axis). On the other hand, when one anisotropic axis oriented towards the longer side (X-axis) is the easy axis, the DC superposition characteristic can be improved or the iron loss can be reduced because most of the magnetic flux passes through the difficult axis (Y-axis).

[0083] When the inductor component 2 has a roughly cuboid shape as described above, with the easy axis oriented along the long side of the cuboid, the following advantages are also present. Considering the influence of shape-based magnetic anisotropy, using the long side as the easy axis makes anisotropic axis control easier. Therefore, since the inductor wiring extends non-orthogonally to the easy axis throughout the entire area, most of the magnetic flux passes through the difficult axis, enabling improved DC superposition characteristics and suppression of iron losses.

[0084] <Manufacturing Method of Inductor Components>

[0085] Next, refer to Figures 4A to 4K The manufacturing method of the inductor component 2 described above will be explained. Figure 4A This is a schematic diagram illustrating a method for manufacturing an inductor component according to a first embodiment of the present invention, and is a side view showing step 1 of preparing substrate material. Figure 4B This is a side view of step 2, which follows step 1, where a first magnetic layer is deposited on the substrate material. Figure 4C This is a side view representing step 3, which follows step 2, where a first insulating layer is stacked on top of the first magnetic layer. Figure 4D This is a side view of step 4, which follows step 3, where inductor wiring is formed on the first insulating layer. Figure 4E This is a side view of step 5, which follows step 4, where a magnetic composite part is stacked on the first insulating layer where inductor wiring is arranged. Figure 4F This is a side view of step 6, which follows step 5, where a second magnetic layer is laminated onto the magnetic composite part. Figure 4G This is a side view of step 7, which follows step 6, to form a via from the surface side of the second magnetic layer. Figure 4HThis is a side view of step 8, which follows step 7 and involves forming vertical wiring in the through-hole. Figure 4I This is a side view of step 9, which is the next step, where the substrate material is ground to a substrate of a specified thickness, following step 8. Figure 4J This is a side view of step 10, which involves cutting and isolating the pieces following step 9. Figure 4K This is a side view of the inductor component formed by monolithization in process 10.

[0086] - Process 1

[0087] First, such as Figure 4A As shown, step 1, preparing substrate material S, is performed. Substrate material S is formed from high-resistivity silicon as described above. The thickness of substrate material S shown is greater than the final thickness of the finished substrate 60. A process is performed where multiple inductor components are formed on a single substrate material S, and then monolithically assembled to obtain individual inductor components 2.

[0088] - Process 2

[0089] Next, as Figure 4B As shown, process 2 involves stacking a first magnetic layer 30 on a substrate material S. Figure 4B As shown in the enlarged view on the right, the first magnetic layer 30 is composed of a stack of an inorganic insulating layer 30A and an inorganic magnetic layer 30B. For example, the inorganic insulating layer 30A and the inorganic magnetic layer 30B are sequentially stacked by sputtering. Therefore, the inorganic insulating layer 30A can also be called the sputtered insulating layer 30A, and the inorganic magnetic layer 30B can also be called the sputtered magnetic layer 30B.

[0090] An example of a method for imparting uniaxial magnetic anisotropy to the first magnetic layer 30 is as follows: By sputtering an inorganic magnetic layer 30B in a magnetic field, the atoms inside the inorganic magnetic layer 30B can be arranged in desired positions with the easy axis oriented towards the direction of the applied magnetic field. If the direction of the applied magnetic field is oriented towards the long side of the inductor component 2, the easy axis is oriented towards the long side; if the direction of the applied magnetic field is oriented towards the short side of the inductor component 2, the difficult axis is oriented towards the long side. All inorganic magnetic layers 30B are stacked to have uniaxial magnetic anisotropy in the same direction.

[0091] Inorganic insulating layer 30A can be formed from inorganic insulators such as SiO2 and TaO. In addition, inorganic magnetic layer 30B can be formed from a composite of CZT (Co-Zr-Ta), FeNi alloy, magnetic materials, and inorganic materials. The interlayer thickness between inorganic magnetic layers 30B is preferably thinner than that of each individual inorganic magnetic layer 30B. Since the function of inorganic insulating layer 30A is to insulate between inorganic magnetic layers 30B or to protect inorganic magnetic layers 30B from stress during processing, a thinner layer increases the proportion of the magnetic layer in the overall laminate.

[0092] Thus, the first magnetic layer 30 is composed of a stack of inorganic insulating layer 30A and inorganic magnetic layer 30B, with the inorganic insulating layer 30A being thinner than the inorganic magnetic layer 30B, and all inorganic magnetic layers 30B exhibiting uniaxial magnetic anisotropy in the same direction. The same applies to the second magnetic layer 40, which will be described later. Because the inorganic insulating layer 30A is thinner than the inorganic magnetic layer 30B, sufficient insulation can be achieved between the inorganic magnetic layers 30B, and the magnetic layer ratio can be increased. Furthermore, by arranging a stacked structure of inorganic insulating layers 30A such as TaO and SiO2 between the inorganic insulating layers 30B, the inorganic magnetic layers 30B are insulated, suppressing eddy currents in the inorganic magnetic layers 30B, thereby enabling the realization of an inductor component 2 with a high Q value at high frequencies.

[0093] Furthermore, if the inorganic magnetic layer 30B is thickened with materials such as CZT (Co-Zr-Ta) or FeNi alloy, eddy currents will be generated within the magnetic layer; therefore, a thinner thickness is preferred. Specifically, it is preferable to be thinner than the skin depth derived from the circuit operating frequency, such as the switching frequency of a DC-DC converter. On the other hand, since the inductor is a current-carrying element, the inductor wiring 10 is preferably thicker to allow for the flow of a larger current.

[0094] Considering these factors, in the inductor component 2 of this embodiment, the thickness of the first magnetic layer 30 is less than the thickness of the inductor wiring 10. By making the inorganic magnetic layer 30B thinner, eddy currents generated within the inorganic magnetic layer 30B can be suppressed, and by increasing the thickness of the inductor wiring 10, an inductor component 2 with low DC resistance and high inductor acquisition efficiency can be achieved.

[0095] Furthermore, in this embodiment, an inorganic insulating layer 30A is provided on the surface of the first magnetic layer 30, which is composed of a laminate of an inorganic insulating layer 30A and an inorganic magnetic layer 30B. Thus, since the inorganic insulating layer 30A is provided on the surface of the first magnetic layer 30, reliable insulation from peripheral components such as wiring can be achieved. The same applies to the second magnetic layer 40, which will be described later.

[0096] - Process 3

[0097] Next, as Figure 4C As shown, step 3 involves stacking a first insulating layer 50 on the first magnetic layer 30 formed in step 2. Specifically, the first insulating layer 50 can be formed by coating the first magnetic layer 30 with polyimide, which is an organic resin, and then curing it.

[0098] - Process 4

[0099] Next, as Figure 4DAs shown, step 4 involves forming the inductor wiring 10 on the first insulating layer 50 formed in step 3 using electrolytic plating. Specifically, a seed layer composed of Ti / Cu is formed on the first insulating layer 50 using sputtering. A dry film resist (DFR) is laminated onto the seed layer, and photolithography is used to expose the seed layer in a shape corresponding to the inductor wiring. Then, power is supplied from the seed layer, and electrolytic plating is used to separate the plating areas on the exposed seed layer, forming the inductor wiring. The dry film resist (DFR) is then stripped, and the seed layer is etched to obtain isolated, insulated inductor wiring. This forms the inductor wiring 10 with a serpentine shape.

[0100] - Process 5

[0101] Next, as Figure 4E As shown, step 5 involves stacking a magnetic composite portion 52 on the first insulating layer 50, on which the inductor wiring 10 formed in step 4 is disposed. Specifically, the magnetic composite portion 52 can be formed by coating a composite material consisting of an organic resin made of epoxy resin and an inorganic filler made of FeSiCr and then curing it. Thus, the magnetic composite portion 52 is formed to cover the side and top surfaces of the inductor wiring 10. In this way, the first insulating layer 50 and the magnetic composite portion 52 surrounding the inductor wiring 10 are formed.

[0102] - Process 6

[0103] Next, as Figure 4F As shown, step 6 involves stacking a second magnetic layer 40 onto the magnetic composite portion 52 formed in step 5. The second magnetic layer 40 can also be stacked using the same process as the first magnetic layer 30. Similar to the first magnetic layer 30, the easy axis direction of the inorganic magnetic layer can be aligned with the direction of the applied magnetic field by sputtering in a magnetic field. By making the applied magnetic field directions the same when forming the first magnetic layer 30 and the second magnetic layer 40, the first magnetic layer 30 and the second magnetic layer 40 can have uniaxial magnetic anisotropy along the same axis.

[0104] - Process 7

[0105] Next, as Figure 4G As shown, step 7 involves forming a via from the surface side of the second magnetic layer 40 formed in step 6. Specifically, a laser is irradiated from the surface side of the second magnetic layer to remove the second magnetic layer 40 and a portion of the magnetic composite portion 52, forming a via BH that reaches the pad portions 10A and 10B of the inductor wiring 10. The formed via BH has a shape that narrows as it extends inward from the surface side of the second magnetic layer 40.

[0106] - Process 8

[0107] Next, as Figure 4H As shown, step 8 is performed to form vertical wiring 20 in the via BH formed in step 7. When the via BH is formed by laser irradiation, resin residue called smear is generated. First, a smear removal process is performed to remove the smear (resin residue) generated during laser processing. After the via BH is cleaned in the smear removal process, vertical wiring 20 is formed in the via BH. Vertical wiring 20 can be formed in the via BH by electrolytic plating in the same way as the inductor wiring 10 described above. However, it is not limited to this; it can also be formed by SAP (Semi-Additive Process). If SAP is used, low-resistance vertical wiring 20 can be obtained at low cost. Furthermore, vertical wiring 20 can also be formed by plating processes other than SAP, such as sputtering, vapor deposition, coating, etc.

[0108] - Process 9

[0109] Next, as Figure 4I As shown, following step 8, step 9 involves grinding the substrate material S to form a substrate 60 of a predetermined thickness. However, this is not a limitation; if the thickness of the substrate material S is predetermined beforehand, step 9 can be omitted. For example, if a temporary bonding layer is pre-formed on the substrate material S, and a first magnetic layer 30 is formed on this temporary bonding layer, the substrate material S can be removed from the first magnetic layer 30 after steps 1 to 8. Thus, a substrate 60 can be obtained as shown in step 9. Figure 7 The inductor component 6 shown is without a substrate.

[0110] - Process 10

[0111] Next, as Figure 4J As shown, following step 9 (or step 8 depending on the situation), step 10, which involves single-piece fabrication using a cutting method, is performed. Figure 4K The image shows the inductor component 2 formed after being monolithized through process 10.

[0112] (A variation of the first embodiment)

[0113] Next, refer to Figures 5 to 8 A variation of the first embodiment described above will be explained.

[0114] <Variation Example 1>

[0115] First, refer to Figure 5 and Figure 6 A modified example 1 of the inductor component of the first embodiment will be described. Figure 5 This is a top view schematically illustrating a modified example 1 of the inductor component according to the first embodiment of the present invention. Figure 6 It means Figure 5 The side sectional view of section B-B. Furthermore, in Figure 5 In the diagram, like perspective, solid lines are used to represent vertical wiring and inductor wiring.

[0116] In the inductor component 4 of Modified Example 1, the difference from the inductor component 2 of the first embodiment described above is that a second insulating layer 70, which serves as an inorganic insulating layer, is also formed on the surface of the stacked second magnetic layer 40. The sides of the vertical wiring 20 are covered by the second insulating layer 70. The second insulating layer 70 may have the same material as the first insulating layer 50 described above, or it may have a different material.

[0117] In this way, since the sides of the vertical wiring 20 are covered by the second insulating layer 70, current leakage to the second magnetic layer 40 and the like can be suppressed.

[0118] The surface 70A of the second insulating layer 70 is formed to be in the same plane as the end face 20A of the vertical wiring 20, and the external terminal 80 is formed to contact the surface 70A of the second insulating layer 70 and the end face 20A of the vertical wiring 20. The external terminal 80, like the vertical wiring 20, can be formed by electrolytic plating, sputtering, electroless plating, etc.

[0119] Thus, when viewed from the vertical direction, the outer terminal 80 extending along the plane overlaps with the second magnetic layer 40. That is, when viewed from above, the outer terminal 80 extends further outward compared to the second magnetic layer 40. Therefore, since the outer terminal 80 is connected to the vertical wiring 20 and extends along the plane, and the outer terminal 80 is formed to overlap with the second magnetic layer 40 when viewed from the vertical direction, the outer terminal 80 can be increased, the resistance can be reduced, and the adhesion strength can be improved.

[0120] <Variation Example 2>

[0121] Next, refer to Figure 7 A modified example 2 of the inductor component of the first embodiment will be described. Figure 7 This is a schematic side sectional view of a modified example 2 of the inductor component according to the first embodiment of the present invention.

[0122] In Modification 2, the inductor component 6 does not have a substrate 60. Because it lacks a substrate 60, the inductor component 6 can be made thinner and lighter. Furthermore, a vertical wiring 20 (the vertical wiring on the left side of the attached drawing) is similar to that in Modification 1 described above. The vertical wiring 20, which is connected to the pad portion 10A of the inductor wiring 10, is covered by a second insulating layer 70, and an external terminal 80 is formed on the end face 20A of the vertical wiring 20.

[0123] On the other hand, another vertical wiring 22 (the vertical wiring on the right side of the figure) is connected to the surface of the first magnetic layer 30 side (the lower side of the figure) of the pad portion 10B of the inductor wiring 10. The other vertical wiring 22 passes through the first magnetic layer 30 and protrudes to the outside. Thus, in Modification 2, since a thin inductor component 6 is achieved and it can be connected to the external circuit from the top and bottom, the freedom of mounting position is improved.

[0124] <Variation Example 3>

[0125] Next, refer to Figure 8 A variation 3 of the inductor component of the first embodiment will be described. Figure 8 This is a schematic side sectional view of a modified example 3 of the inductor component according to the first embodiment of the present invention.

[0126] The inductor component 6 of Modification 3 includes a substrate 60. A vertical wiring 20 (the vertical wiring on the left side of the figure) is similar to that of Modifications 1 and 2 described above. The vertical wiring 20, which is connected to the pad portion 10A of the inductor wiring 10, is covered by a second insulating layer 70, and an external terminal 80 is formed on the end face 20A of the vertical wiring 20.

[0127] On the other hand, another vertical wiring 22 (the vertical wiring on the right side of the figure) is connected to the surface of the first magnetic layer 30 side (bottom side of the figure) of the pad portion 10B of the inductor wiring 10, similar to that in Variation 2. In Embodiment 3, the other vertical wiring 22 penetrates the first magnetic layer 30 and further penetrates the substrate 60. Moreover, the end face 22A of the other vertical wiring 22 is disposed on the same plane as the surface of the substrate 60 and is exposed externally.

[0128] Thus, in Embodiment 3, since the vertical wiring 20 penetrates the substrate 60, which serves as an inorganic substrate, it can be connected to external circuits from both above and below, thereby increasing the freedom of installation position. Furthermore, the presence of an inorganic substrate also ensures the strength of the substrate.

[0129] As in variations 2 and 3 above, by extending the vertical wiring 20 and 22 to both sides of the clamping inductor wiring 10, it is possible to connect to the external circuit from the top and bottom, thus increasing the freedom of installation position.

[0130] (Inductor component according to the second embodiment of the present invention)

[0131] Next, refer to Figure 9 , Figure 10A as well as Figure 10B The inductor component of the second embodiment of the present invention will be described. Figure 9 This is a schematic top view of an inductor component according to a second embodiment of the present invention. Figure 10A It means Figure 9The side sectional view of section C-C. Figure 10B It means Figure 9 The side sectional view of section D-D. Figure 9 In the diagram, the inductor wiring is represented by solid lines, similar to perspective.

[0132] In the inductor component 102 of the second embodiment of the present invention, the inductor wiring extends differently than in the first embodiment, and the points where the two inductor wirings 110 are arranged along the plane are different. Each inductor wiring 110 is formed by connecting two regions extending parallel to the direction (X-axis direction) of one of the anisotropic axes (difficult and easy axes) in uniaxial magnetic anisotropy through a region extending in a direction intersecting the direction (X-axis direction) of the anisotropic axis. The region extending in a direction intersecting the direction (X-axis direction) of one of the anisotropic axes of the inductor wiring 110 also extends in a manner not orthogonal to one of the anisotropic axes (X-axis), similar to the first embodiment described above.

[0133] In other words, in the inductor component 102 of the second embodiment, the two ends of the inductor wiring 110 are also separately arranged in the direction of one of the anisotropic axes (X-axis direction) in the difficult axis and easy axis of uniaxial magnetic anisotropy, and the inductor wiring 110 extends in a direction that is not orthogonal to one anisotropic axis (X-axis) throughout the entire region. In addition, the positions of the two ends of the inductor wiring 10 in the direction of the other anisotropic axis (Y-axis direction) can be the same position or different positions.

[0134] In the second embodiment, the inductor wiring 110 extends in a different manner than in the first embodiment, but for the stacked structure, it is almost the same as in the first embodiment. For example... Figure 10B As shown, a first insulating layer 150 and a first magnetic layer 130 are stacked on a substrate 160, such that the first magnetic layer 130 is disposed between the first insulating layers 150. Inductor wiring 110 is formed on the first insulating layer 150, and a magnetic composite portion 152 is stacked to cover the inductor wiring 110, and a second magnetic layer 140 is stacked to cover the magnetic composite portion 152. In this embodiment, no insulating layer is formed on the second magnetic layer 140.

[0135] In the second embodiment, since a magnetic composite portion 152 is provided between the first magnetic layer 130 and the second magnetic layer 140, it is also possible to provide a thin inductor component 102 with high Q value by suppressing eddy currents even when the spacing between the two magnetic layers 130 and 140 is reduced.

[0136] The cross-sectional dimensions of the inductor wiring 10 can be 40 μm × 20 μm, the thickness of the substrate 160 can be 5 μm, the thicknesses of the first magnetic layer 130 and the second magnetic layer 140 can each be 5 to 6 μm, and the thickness of the first insulating layer 150 can be 5 μm. The thickness of the magnetic composite portion 152 is a value obtained by adding approximately 2 to 4 μm to the thickness of the inductor wiring 110. Furthermore, the protrusion of the vertical wiring 120 from the surface of the second magnetic layer 140 can be 5 μm, and the dimensions of the inductor component 102, which has a generally rectangular parallelepiped shape, can be L × W × T = 1.0 mm × 0.5 mm × 0.5 mm. However, these dimensions are just examples and are not limited to them.

[0137] The materials of each component are the same as those in the first embodiment, and the inductor component 102 of the second embodiment can be manufactured using the same manufacturing method as in the first embodiment.

[0138] In this embodiment, the number of inductor wirings 110 arranged along the plane in one inductor component 102 is two, but it is not limited to this. There may also be any number of inductor wirings 110 arranged along the plane, such as three or more. In this case, it is possible to illustrate a situation where multiple inductor components 102 are arranged symmetrically with respect to a centerline extending along the long side direction (X-axis direction) of the inductor component 102 having a rectangular planar shape.

[0139] In this embodiment, since multiple inductor wirings 110 are arranged along a plane, an inductor array element can be formed. Therefore, space can be saved because the mounting spacing can be omitted.

[0140] Here, Figure 14 This is a top view schematically illustrating an example of an inductor assembly with multiple inductor wires arranged along a plane. (See attached image.) Figure 14 As shown, by arranging the multiple inductor wirings 110 along a plane, the planar shapes of the first magnetic layer 130 and the second magnetic layer 140 can be made close to square. Therefore, since the influence of shape magnetic anisotropy can be reduced, a wider range of material choices and other options can be broadened.

[0141] As a near-square shape, if the dimension along one anisotropic axis (X-axis direction) is designated as P, and the dimension along the other anisotropic axis (Y-axis direction) is designated as Q, then the ratio of the two, i.e., Q / P, is preferably in the range of 0.5 or more and 1 or less, more preferably in the range of 0.7 or more and 1 or less. Considering that the first magnetic layer 130 and the second magnetic layer 140 are not of the same shape, it is preferable to have a plurality of inductor wirings 110 extending on the same plane parallel to the plane. When the plane is viewed from the vertical direction, at least one of the first magnetic layer 130 and the second magnetic layer 140 overlaps with the plurality of inductor wirings 110, and the aspect ratio of the shape is in the range of 0.5 or more and 1 or less, more preferably in the range of 0.7 or more and 1 or less.

[0142] In the multiple inductor wirings 110 arranged along the plane, such as Figure 9 As shown, the diagram includes both regions where the inductor wirings 110 are arranged parallel to each other and regions where they are not arranged parallel to each other. The non-parallel regions create regions where the inductor wirings 110 are close to each other and arranged parallel to each other, and regions where the inductor wirings 110 are separated from each other and arranged parallel to each other. With this configuration, the coupling coefficient can be increased in the regions where the inductor wirings 110 are close to each other, and the coupling coefficient can be decreased in the regions where the inductor wirings 110 are separated from each other. By connecting the regions where the inductor wirings 110 are arranged parallel to each other using the non-parallel regions, the coupling coefficient of the inductor can be controlled in various ways.

[0143] like Figure 10B As shown, leakage flux can be suppressed when at least a portion of the magnetic composite portion 152, the second magnetic layer 140, and the inductor wiring 110 are located in the same layer parallel to the plane.

[0144] In addition, such as Figure 10B As shown, in the region where the inductor wirings 110 are close to each other, in a cross-sectional view orthogonal to the direction in which the inductor wirings 110 extend, the magnetic composite portion 152 has an uneven shape that covers the inductor wirings 110 from two directions parallel to the plane and one direction perpendicular to the plane. Utilizing the resin flowability of the magnetic composite portion 152, the inductor wirings 110 can be reliably covered. Furthermore, since the uneven edges are gentler than the inductor wirings, breakage is less likely when the second magnetic layer 140 is formed on the magnetic composite portion 152.

[0145] In addition, by Figure 9 and Figure 10BAs can be seen, the second magnetic layer 140 is disposed on the inner side of the outer surface of the inductor component 102. Therefore, during monolithic fabrication, there is no concern about damage to the magnetic layer due to cutting. For example, if the magnetic layer stretches due to mechanical stress during cutting, leakage will occur between the stacked magnetic layers, resulting in increased iron loss, but this problem can be avoided in this embodiment.

[0146] In this embodiment, such as Figure 10A As shown, the first magnetic layer 130 and the second magnetic layer 140 are not formed in the regions at both ends of the inductor wiring 110 having pad portions 110A and 110B. Therefore, the vertical wiring 120 connected to the pad portions 110A and 110B does not penetrate the magnetic layer. In this embodiment, the magnetic layer is disposed in the regions other than the two ends of the inductor wiring 110.

[0147] (A variation of the second embodiment)

[0148] Next, refer to Figure 11A , Figure 11B as well as Figure 12 A variation of the second embodiment described above will be explained.

[0149] <Variation Example 1>

[0150] First, refer to Figure 11A as well as Figure 11B A variation of the inductor component of the second embodiment will be described. Figure 11A This is a schematic diagram illustrating a modified example 1 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10A A side sectional view of a section at the same location. Figure 11B This is a schematic diagram illustrating a modified example 1 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location.

[0151] In the inductor component 104 of Modified Example 1, compared with the inductor component 102 of the second embodiment described above, a third insulating layer 170, serving as an inorganic insulating layer, is further formed on the surface of the stacked second magnetic layer 140. Thus, as... Figure 11A As shown, the sides of the vertical wiring 120 are surrounded by a third insulating layer 170. Figure 11B As shown, the second magnetic layer 140 with its concave-convex shape is also surrounded by a third insulating layer 170.

[0152] The surface 170A of the third insulating layer 170 is formed to be in the same plane as the end face 120A of the vertical wiring 120, and the external terminal 180 is formed to contact the surface 170A of the third insulating layer 170 and the end face 120A of the vertical wiring 120. The external terminal 180, as described above, can be formed by electrolytic plating, sputtering, electroless plating, or the like.

[0153] As described above, in the second embodiment of the modified example 1, since the first magnetic layer 130 and the second magnetic layer 140 are covered by the first insulating layer 150 and the third insulating layer 170, the first magnetic layer 130 and the second magnetic layer 140 can be protected from environmental loads (humidity, etc.).

[0154] Furthermore, since the surface of the third insulating layer 170, which covers the second magnetic layer 140 and serves as the outermost surface of the inductor component 104, is formed to be flatter than the uneven shape of the second magnetic layer 140, the coplanarity during installation can be improved. Here, coplanarity refers to the property or state of multiple points existing on the same plane. It is also sometimes referred to as "surface uniformity" or "terminal flatness."

[0155] Furthermore, in the inductor component 104 of Modified Example 1, such as Figure 11B As shown, instead of an insulating layer, a magnetic composite portion 152 is stacked on the substrate 160, and a first magnetic layer 130 is stacked thereon, such that the first magnetic layer 130 is disposed between the magnetic composite portions 152. Inductor wiring 110 is formed on the magnetic composite portion 152, and a first insulating layer 150 is stacked thereon to cover the inductor wiring 110. A second magnetic layer 140 is further stacked thereon to cover the first insulating layer 150. In Modification 1, with... Figure 10B Compared to the second embodiment shown, the positions of the first insulating layer 150 and the magnetic composite portion 152 are reversed.

[0156] In this configuration, since a magnetic composite portion 152 is provided between the first magnetic layer 130 and the second magnetic layer 140, it is also possible to provide a thin inductor component 104 with a high Q value by suppressing eddy currents even when the spacing between the two magnetic layers 130 and 140 is reduced.

[0157] <Variation Example 2>

[0158] Next, refer to Figure 12 A modified example 2 of the inductor component of the second embodiment will be described. Figure 12 This is a schematic diagram illustrating a modified example 2 of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location.

[0159] In the inductor component 106 of Modified Example 2, the inductor wiring 110 extending along the plane is composed of multiple layers. Figure 12 In the example shown, two layers are formed, consisting of two inductor wirings 110 arranged along the plane. That is, when viewed in cross-section, the inductor wirings 110 are arranged in a 2×2 matrix.

[0160] In Modification 2, similarly to Modification 1, a magnetic composite portion 152 is stacked on the substrate 160, and a first magnetic layer 130 is stacked such that the first magnetic layer 130 is disposed between the magnetic composite portions 152. Inductor wiring 110 is formed on the magnetic composite portion 152, and a first insulating layer 150 is stacked to cover the inductor wiring 110. A second magnetic layer 140 is further stacked to cover the first insulating layer 150. Therefore, insulating material (first insulating layer 150) is filled between the layers of the inductor wiring 110. However, this is not a limitation; a matrix-like inductor component 106 with any number of inductor wiring 110 arranged along a plane in any number of layers can also be used.

[0161] In this way, with the inductor wiring 110 extending along the plane consisting of multiple layers and insulating resin filling the spaces between the layers of the inductor wiring 110, the degree of freedom of the inductor wiring 110 is increased. Furthermore, by filling the spaces between the inductor wiring 110 with insulating resin, current leakage can be suppressed, and the inductor wiring 110 can be brought closer together, thus enabling the realization of a thin inductor component 106.

[0162] <Variations 3A-3C>

[0163] Next, refer to Figures 13A to 13C Modifications 3A to 3C of the inductor component of the second embodiment will be described. Figure 13A This is a schematic diagram illustrating a modified example 3A of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location. Figure 13B This is a schematic diagram illustrating a modified example 3B of the inductor component according to the second embodiment of the present invention, and it shows a variation with... Figure 10B A side sectional view of a section at the same location. Figure 13C This is a schematic diagram illustrating a modified example 3C of the inductor component according to the second embodiment of the present invention, and it is shown as... Figure 10B A side sectional view of a section at the same location.

[0164] In the inductor components 108A-108C of variations 3A-3C, a first insulating layer 150 and a first magnetic layer 130 are stacked on a substrate 160, such that the first magnetic layer 130 is disposed between the first insulating layers 150. Inductor wiring 110 is formed on the first insulating layer 150, and a second insulating layer 154 is stacked to cover the inductor wiring 110. A second magnetic layer 140 is further stacked to cover the second insulating layer 154. In this embodiment, no insulating layer is formed on the second magnetic layer 140 either.

[0165] Furthermore, the magnetic composite portion 152' is not formed over the entire surface, but rather partially. In the long side direction (X-axis direction), any one of the magnetic composite portions 152' in variations 3A to 3C is formed along the extension direction of the inductor wiring 110, so that their relative positions with respect to the inductor wiring 110 are almost identical.

[0166] exist Figure 13A In the modified example 3A shown, the magnetic composite portion 152' is disposed between the first magnetic layer 130 and the second magnetic layer 140 within the first insulating layer 150. Figure 13A In the example shown, the magnetic composite portion 152' is in contact with the first magnetic layer 130 and the second magnetic layer 140, but it is not limited to this. There may also be a case where the magnetic composite portion 152' is covered by the first insulating layer 150 and is not in contact with the first magnetic layer 130 and the second magnetic layer 140.

[0167] exist Figure 13B In the modified example 3B shown, the magnetic composite portion 152' is disposed between the first magnetic layer 130 and the second insulating layer 154 within the first insulating layer 150. Figure 13B In the example shown, the magnetic composite portion 152' is covered by the first insulating layer 150, but it is not limited to this. There may also be a situation where the magnetic composite portion 152' is in contact with the first magnetic layer 130 and the second insulating layer 154.

[0168] exist Figure 13C In the modified example 3C shown, the magnetic composite portion 152' is disposed between the first magnetic layer 130 within the first insulating layer 150 and the inductor wiring 110. Figure 13C In the example shown, the magnetic composite portion 152' is covered by the first insulating layer 150, but it is not limited to this. There may also be a situation where the magnetic composite portion 152' is in contact with the first magnetic layer 130 and the inductor wiring 110.

[0169] exist Figure 13AIn the modified example 3A shown, when the surface of the magnetic composite portion 152' facing one of the directions perpendicular to the plane is designated as main surface 1 (the upper surface in the figure), and the surface opposite to main surface 1 is designated as main surface 2 (the lower surface in the figure), main surface 1 contacts the second magnetic layer 140, main surface 2 contacts the first magnetic layer 130, and the side connecting main surface 1 and main surface 2 contacts the first insulating layer 150. With this configuration of the magnetic composite portion 152', eddy currents generated in the first magnetic layer 130 and the second magnetic layer 140 can be suppressed.

[0170] Furthermore, when the magnetic composite portion 152' is covered by a first insulating layer 150 made of a non-magnetic insulating organic resin, eddy currents generated in the first magnetic layer 130 and the second magnetic layer 140 can be suppressed more effectively.

[0171] In all cases, the magnetic composite portion 152' is in contact with the insulating layers (first insulating layer 150, second insulating layer 154) made of non-magnetic insulating organic resin. This improves the insulation of the magnetic composite portion 152' and reduces the risk of current leakage. Furthermore, since the insulating layers (first insulating layer 150, second insulating layer 154) are non-magnetic, the magnetic flux density is mitigated, improving the DC superposition characteristics.

[0172] (Inductor component according to the third embodiment of the present invention)

[0173] Next, refer to Figure 15 The inductor component of the third embodiment of the present invention will be described. Figure 15 This is a schematic diagram illustrating an inductor component according to a third embodiment of the present invention, and is shown in relation to... Figure 10B A side sectional view of a section at the same location.

[0174] The inductor component 202 of the third embodiment has the same planar shape as the inductor component 102 of the second embodiment. That is, it includes both regions where the two inductor wirings 210 are arranged parallel to each other and regions where they are not arranged parallel to each other. Figure 15 The middle section represents a cross-section of the area where the wiring 210 of the two inductors are close to each other and arranged in parallel.

[0175] In the inductor component 202 of the third embodiment, there are points on the end 230A of the first magnetic layer 230 and the end 240A of the second magnetic layer 240 that are inclined from a direction perpendicular to the plane, which is different from the inductor component 102 of the second embodiment that is formed perpendicular to the end.

[0176] When the magnetic layer is formed vertically at its ends, it is necessary to perform hole processing or change the wiring design in order to change the electrical characteristics of the inductor. However, in the third embodiment, since the ends 230A and 240A of the magnetic layers 230 and 240 have inclined portions that slope in a direction perpendicular to the plane, the characteristics of the inductor can be adjusted without performing hole processing or changing the wiring design.

[0177] (overall)

[0178] As described above, in any of the inductor components 2-8, 102-109, and 202 of the above embodiments, all include: inductor wirings 10, 110, and 210 extending along a plane; pad portions 10A, 10B, 110A, and 110B located at both ends of the inductor wirings 10, 110, and 210; vertical wirings 20 and 120 extending perpendicularly to the plane from the pad portions 10A, 10B, 110A, and 110B; and wirings extending perpendicularly to the plane from the pad portions 10A, 10B, 110A, and 110B. The first magnetic layer 30, 130, 230 and the second magnetic layer 40, 140, 240 of the straight direction clamp inductor wiring 10, 110, 210 are inorganic magnetic layers. The first magnetic layer 30, 130, 230 and the second magnetic layer 40, 140, 240 are inorganic magnetic layers. Magnetic composite parts 52, 152, 152', 252 with organic resin and inorganic filler are provided between the first magnetic layer 30, 130, 230 and the second magnetic layer 40, 140, 240.

[0179] Thus, it is possible to provide thin inductor components 2-8, 102-109, and 202 that suppress eddy currents and achieve high Q values ​​even when the spacing between the two magnetic layers is reduced.

[0180] This disclosure includes the following methods.

[0181] <1>

[0182] An inductor component comprising:

[0183] Inductor wiring extends along the plane;

[0184] The pads are located at both ends of the aforementioned inductor wiring;

[0185] Vertical wiring extends perpendicularly from the aforementioned pad portion relative to the aforementioned plane; and

[0186] The first magnetic layer and the second magnetic layer clamp the inductor wiring from a direction perpendicular to the aforementioned plane.

[0187] The first magnetic layer and the second magnetic layer mentioned above are inorganic magnetic layers.

[0188] A magnetic composite portion is provided between the first magnetic layer and the second magnetic layer, and the magnetic composite portion comprises organic resin and inorganic filler.

[0189] <2>

[0190] According to the inductor component described in <1>, wherein,

[0191] The aforementioned magnetic composite portion covers a portion of the inductor wiring, and the thickness of the aforementioned magnetic composite portion in the direction perpendicular to the aforementioned plane is greater than that of the aforementioned first magnetic layer and the aforementioned second magnetic layer.

[0192] <3>

[0193] According to the inductor component described in <1> or <2>, wherein,

[0194] The aforementioned vertical wiring penetrates at least one of the aforementioned first magnetic layer, the aforementioned second magnetic layer, and the aforementioned magnetic composite portion.

[0195] <4>

[0196] The inductor component according to any one of <1> to <3>, wherein,

[0197] The first magnetic layer and the second magnetic layer described above have uniaxial magnetic anisotropy in the same direction.

[0198] The aforementioned inductor wiring extends throughout the region without being orthogonal to one of the anisotropic axes of the aforementioned uniaxial magnetic anisotropy.

[0199] <5>

[0200] According to the inductor component described in <4>, wherein,

[0201] The aforementioned anisotropic axis is a free axis.

[0202] The two ends of the aforementioned inductor wiring are separated in the direction of the free axis.

[0203] Viewed from the direction of the easy axis, at least a portion of the aforementioned pads at both ends overlap.

[0204] <6>

[0205] According to the inductor component described in <4>, wherein,

[0206] The aforementioned first magnetic layer and the aforementioned second magnetic layer are composed of a laminate of an inorganic insulating layer and an inorganic magnetic layer.

[0207] The thickness of the aforementioned inorganic insulating layer is thinner than the thickness of the aforementioned inorganic magnetic layer.

[0208] All of the aforementioned inorganic magnetic layers exhibit uniaxial magnetic anisotropy in the same direction.

[0209] <7>

[0210] The inductor component according to any one of <1> to <6>, wherein,

[0211] The aforementioned magnetic composite portion, the aforementioned second magnetic layer, and at least a portion of the aforementioned inductor wiring are located in the same layer parallel to the aforementioned plane.

[0212] <8>

[0213] The inductor component according to any one of <1> to <7>, wherein,

[0214] In a cross-sectional view orthogonal to the direction in which the inductor wiring extends, the magnetic composite portion has a concave-convex shape that covers the inductor wiring from two directions parallel to the plane and one direction perpendicular to the plane.

[0215] <9>

[0216] The inductor component according to any one of <1> to <8>, wherein,

[0217] The aforementioned magnetic composite part is in contact with an insulating layer made of non-magnetic insulating organic resin.

[0218] <10>

[0219] According to the inductor component described in <9>, wherein...

[0220] When the surface of the magnetic composite part facing one of the directions perpendicular to the aforementioned plane is designated as main surface 1, and the surface opposite to main surface 1 is designated as main surface 2,

[0221] The aforementioned main surface 1 is in contact with the aforementioned second magnetic layer, the aforementioned main surface 2 is in contact with the aforementioned first magnetic layer, and the side connecting the aforementioned main surface 1 and the aforementioned main surface 2 is in contact with the aforementioned insulating layer.

[0222] <11>

[0223] According to the inductor component described in <9>, wherein...

[0224] The aforementioned magnetic composite portion is covered by the aforementioned insulating layer.

[0225] <12>

[0226] The inductor component according to any one of <1> to <11>, wherein,

[0227] The device has a plurality of inductor wirings extending on the same plane parallel to the aforementioned plane. When the plane is viewed from the vertical direction, at least one of the first magnetic layer and the second magnetic layer overlaps with the plurality of inductor wirings. The aspect ratio of the device is in the range of 0.5 or more and 1 or less.

[0228] <13>

[0229] The inductor component according to any one of <1> to <12>, wherein,

[0230] The ends of the first magnetic layer and the second magnetic layer have inclined portions that slope in a direction perpendicular to the plane.

[0231] The description of the above embodiments is illustrative in all respects and is not restrictive. Those skilled in the art will be able to make appropriate modifications and alterations. The scope of the invention is not defined by the above embodiments, but by the claims. Furthermore, the scope of the invention includes modifications to the embodiments within the scope equivalent to the claims.

[0232] Explanation of reference numerals in the attached figures

[0233] 2, 4, 6, 8… Inductor components; 10… Inductor wiring; 10A, 10B… Pads; 20… Vertical wiring; 20A… End face; 22… Vertical wiring; 30… First magnetic layer; 30A… Inorganic insulating layer (sputtered insulating layer); 30B… Inorganic magnetic layer (sputtered magnetic layer); 40… Second magnetic layer; 50… First insulating layer; 52… Magnetic composite section; 60… Substrate; 70… Second insulating layer; 70A… Surface; 80… External terminals; 102, 104, 106, 108A~C, 109… Inductor components; 110A, 110B… Pads; 1 20…Vertical wiring; 120A…End face; 130…First magnetic layer; 140…Second magnetic layer; 150…First insulating layer; 152, 152'…Magnetic composite part; 154…Second insulating layer; 160…Substrate; 170…Third insulating layer; 170A…Surface; 180…External terminal; 202…Inductor component; 210…Inductor wiring; 230…First magnetic layer; 230A…End; 240…Second magnetic layer; 240A…End; 250…First insulating layer; 252…Magnetic composite part; 260…Substrate; S…Substrate material; BH…Through hole.

Claims

1. An inductor component comprising: Inductor wiring extends along the plane; The pads are located at both ends of the aforementioned inductor wiring; Vertical wiring extends perpendicularly from the aforementioned pad portion relative to the aforementioned plane; and The first magnetic layer and the second magnetic layer clamp the inductor wiring from a direction perpendicular to the aforementioned plane. The first magnetic layer and the second magnetic layer mentioned above are inorganic magnetic layers. A magnetic composite portion is provided between the first magnetic layer and the second magnetic layer, and the magnetic composite portion comprises organic resin and inorganic filler.

2. The inductor component according to claim 1, wherein, The aforementioned magnetic composite portion covers a portion of the inductor wiring, and the thickness of the aforementioned magnetic composite portion in the direction perpendicular to the aforementioned plane is greater than that of the aforementioned first magnetic layer and the aforementioned second magnetic layer.

3. The inductor component according to claim 1 or 2, wherein, The aforementioned vertical wiring penetrates at least one of the aforementioned first magnetic layer, the aforementioned second magnetic layer, and the aforementioned magnetic composite portion.

4. The inductor component according to any one of claims 1 to 3, wherein, The first magnetic layer and the second magnetic layer described above have uniaxial magnetic anisotropy in the same direction. The aforementioned inductor wiring extends throughout the region without being orthogonal to one of the anisotropic axes of the aforementioned uniaxial magnetic anisotropy.

5. The inductor component according to claim 4, wherein, The aforementioned anisotropic axis is a free axis. The two ends of the aforementioned inductor wiring are separated in the direction of the free axis. Viewed from the direction of the easy axis, at least a portion of the aforementioned pads at both ends overlap.

6. The inductor component according to claim 4, wherein, The aforementioned first magnetic layer and the aforementioned second magnetic layer are composed of a laminate of an inorganic insulating layer and an inorganic magnetic layer. The thickness of the aforementioned inorganic insulating layer is thinner than the thickness of the aforementioned inorganic magnetic layer. All of the aforementioned inorganic magnetic layers exhibit uniaxial magnetic anisotropy in the same direction.

7. The inductor component according to any one of claims 1 to 6, wherein, The aforementioned magnetic composite portion, the aforementioned second magnetic layer, and at least a portion of the aforementioned inductor wiring are located in the same layer parallel to the aforementioned plane.

8. The inductor component according to any one of claims 1 to 7, wherein, In a cross-sectional view orthogonal to the direction in which the inductor wiring extends, the magnetic composite portion has a concave-convex shape that covers the inductor wiring from two directions parallel to the plane and one direction perpendicular to the plane.

9. The inductor component according to any one of claims 1 to 8, wherein, The aforementioned magnetic composite part is in contact with an insulating layer made of non-magnetic insulating organic resin.

10. The inductor component according to claim 9, wherein, When the surface of the magnetic composite part facing one of the directions perpendicular to the aforementioned plane is designated as main surface 1, and the surface opposite to main surface 1 is designated as main surface 2, The aforementioned main surface 1 is in contact with the aforementioned second magnetic layer, the aforementioned main surface 2 is in contact with the aforementioned first magnetic layer, and the side connecting the aforementioned main surface 1 and the aforementioned main surface 2 is in contact with the aforementioned insulating layer.

11. The inductor component according to claim 9, wherein, The aforementioned magnetic composite portion is covered by the aforementioned insulating layer.

12. The inductor component according to any one of claims 1 to 11, wherein, The device has a plurality of inductor wirings extending on the same plane parallel to the aforementioned plane. When the plane is viewed from the vertical direction, at least one of the first magnetic layer and the second magnetic layer overlaps with the plurality of inductor wirings. The aspect ratio of the device is in the range of 0.5 or more and 1 or less.

13. The inductor component according to any one of claims 1 to 12, wherein, The ends of the first magnetic layer and the second magnetic layer have inclined portions that slope in a direction perpendicular to the plane.

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