Preventing circuit board from frosting device and operating method

Abstract

This application discloses a device and operating method for preventing frost formation on circuit boards, relating to the field of circuit board testing machine technology. It includes a low-temperature testing chamber for circuit boards. The front of the chamber is connected to a test chamber door via a hinge. An anti-frost fan is fixedly connected to one side of the chamber, and an air supply pipe is fixedly connected to one side of the anti-frost fan, with one end of the air supply pipe inserted into the chamber. This invention prevents condensation caused by excessive temperature difference between the test temperature and the ambient temperature during testing. After modification, it effectively reduces the impact on the electrical performance of the test boards and the damage rate of components, avoiding unnecessary cost losses during production and ensuring production efficiency. Furthermore, the height and airflow direction of the anti-frost device are freely adjustable, and it is divided into a low-speed zone and a low-speed zone to provide airflow to different locations on the board.

Description

Technical Field

[0001] This application relates to the field of circuit board testing machine technology, and more specifically, to a device and operating method for preventing frost formation on circuit boards. Background Technology

[0002] Circuit board integration cards play a crucial role in modern electronic devices, and their stability and reliability directly affect the overall quality and lifespan of the device. To ensure the performance of circuit board integration cards in various harsh environments, high and low temperature shock testing is an essential step. A search revealed an existing patent (publication number: CN223140388U) that discloses an integrated three-temperature memory testing machine, comprising a testing cabinet, an airflow meter, a blowing module, a heat shield, a testing instrument, and an electronic control system. The airflow meter and electronic control system are housed within the testing cabinet. The testing instrument is mounted on the testing cabinet and covered with a heat shield. The heat shield, the blowing module, and the airflow meter are sequentially connected. The electronic control system is connected to both the airflow meter and the testing instrument. This integrated design combines the low, medium, and high-temperature airflow meter, the testing instrument, and the electronic control system within the testing cabinet. The blowing module and heat shield deliver high-speed gas to the device under test, achieving low, medium, and high ambient temperature control. Therefore, this invention is a miniaturized, modular, stand-alone, fully functional, manually operated, small-scale three-temperature memory testing machine, filling a market gap for such machines. During the development of this application, the inventors discovered the following problems with the existing technology: Existing circuit board testing machines lack anti-frost structures. During low-temperature testing, especially when the test temperature is below 15 degrees Celsius, the test boards are prone to frost formation due to the low temperature environment. Frost formation not only affects the electrical performance of the test boards but may also damage electronic components, increase costs, and reduce production efficiency. For example, in a low-temperature environment, there is a temperature difference between the back of the test board and the room temperature environment, which causes moisture to frost on the back of the test board, thus affecting the test results.

[0003] Therefore, a device and operating method for preventing frost formation on circuit boards are proposed to address the aforementioned technical issues. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, this application provides a device and operating method for preventing frost formation on circuit boards to solve the problems mentioned in the background art.

[0005] A device for preventing frost formation on circuit boards includes a low-temperature test chamber for circuit boards. The front of the low-temperature test chamber for circuit boards is rotatably connected to a test chamber door via a hinge. An anti-frost fan is fixedly connected to one side of the low-temperature test chamber for circuit boards. An air supply pipe is fixedly connected to one side of the anti-frost fan, and one end of the air supply pipe is inserted into the low-temperature test chamber for circuit boards. The circuit board low-temperature test chamber is equipped with a test platform, and a magnetic mounting base is fixedly connected to the top of the test platform. Multiple sets of pipe connection plates are fixedly connected to the inner wall of the circuit board low-temperature test chamber. An anti-frost air outlet duct is fixedly connected to the side of the pipe connection plate away from the circuit board low-temperature test chamber. The pipe connection plate is equipped with a synchronous limit rod to realize the synchronous sliding of the linear slider and ensure the synchronous adjustment of the anti-frost air outlet duct.

[0006] Preferably, a transparent observation window flush with the test platform is fixedly connected inside the test chamber door, and an operation panel is fixedly connected to the side of the test chamber door away from the circuit board low temperature test chamber. The operation panel can adjust the speed of the anti-frost fan, the air supply temperature and the air supply duration, and can display the temperature and air supply parameters of the circuit board low temperature test chamber in real time; the edge of the test chamber door is provided with locking buckles.

[0007] Preferably, two sets of linear sliders are slidably connected inside the pipe fitting connecting plate via a lubricated dustproof guide rail, and a magnetic mounting plate is fixedly connected to the side of the linear slider away from the pipe fitting connecting plate, and a pipe mounting seat is magnetically connected to the magnetic mounting plate.

[0008] Preferably, a connecting plate is fixedly connected to the side of the pipe mounting base away from the magnetic mounting plate, the two sets of vertically parallel connecting plates have different lengths, and a fixed pipe bracket with a top opening is fixedly connected to the side of the connecting plate away from the magnetic mounting plate.

[0009] Preferably, the anti-frost air outlet duct is fixedly clipped inside the fixed pipe frame. There are four sets of anti-frost air outlet ducts, and the four sets of anti-frost air outlet ducts are spliced ​​together to form an adjustable-size rectangle with sealable corners. The inner side of the rectangle is adapted to the edge of the circuit board to be tested, so as to achieve all-round airflow coverage of the circuit board.

[0010] Preferably, the anti-frost air outlet duct has multiple sets of air outlet holes on the side away from the circuit board low temperature test chamber, and two adjacent sets of anti-frost air outlet ducts are rotatably connected by a bent pipe connecting block through a damping shaft.

[0011] Preferably, a set of anti-frost air outlet pipes near the air supply pipe are rotatably connected to a corrugated flexible hose that can be synchronously extended and retracted via a bend connecting block, and one end of the corrugated flexible hose is slidably inserted into the air supply pipe. A pipe opening sealing kit is fixedly sleeved on the outer side of one end of a set of anti-frost air outlet pipes parallel to the corrugated flexible hose.

[0012] Preferably, the operating method of the device for preventing frost formation on circuit boards includes the following steps: Step 1: First, precisely install the circuit board that needs to be tested at low temperature onto the magnetic mounting base of the test bench through the positioning groove, and initially install the anti-frost air outlet duct onto the fixed pipe rack of the pipe mounting seat through the adjustable locking clamp. Step 2: According to the size of the circuit board, connect the anti-frost air outlet pipes end to end through the bend connector and splice them into a rectangle with an open corner. Then connect a set of anti-frost air outlet pipes to the corrugated hose through the bend connector and fix the other end of the corrugated hose into the air supply pipe. Then fix the pipe opening sealing kit on the outside of the other end of the rectangle's anti-frost air outlet pipe opening. Step 3: Then slide each linear slider to a level position and attach each pipe mounting base to the magnetic mounting plate of the linear slider; Step 4: Connect the spliced ​​anti-frost air outlet pipe to the fixed pipe rack of the multiple pipe mounting bases. The air outlet on the side of the anti-frost air outlet pipe assembly can be aligned with the sensitive components of the circuit board by sliding it up and down. The direction of airflow can be adjusted by rotating the anti-frost air outlet pipe. Step 5: Close the test chamber door and begin testing. Set the test program through the operation panel, adjust the speed of the anti-frost fan, and during the test, the anti-frost fan will deliver room temperature dry air (26-30℃, humidity ≤40%RH) through the air supply pipe into the anti-frost outlet pipe. The anti-frost outlet pipe will then act on the circuit board through the air outlet to prevent frost from forming on the circuit board surface. Step Six: Start the test. During the test, the anti-frost fan delivers dry air at room temperature into the anti-frost outlet duct through the air supply duct and corrugated hose. The inclined air guide nozzles at the air outlet act on the circuit board to prevent frost from forming on the circuit board surface. The operator can observe the status of the circuit board in real time through the transparent observation window. If local frost occurs, the air supply parameters or air outlet direction can be adjusted through the operation panel. Step 7: After the test, turn off the anti-frost fan, loosen all locking mechanisms, disassemble the circuit board and air outlet pipe, clean the inside of the device and the air outlet, and the operation is complete.

[0013] The technical effects and advantages of this application are as follows: 1. Compared with existing technologies, this anti-frost device and operating method for circuit boards prevents condensation caused by excessive temperature difference between the test temperature and the ambient temperature during testing. After installation and modification, it effectively reduces the impact on the electrical performance of the test board and the damage rate of components, avoids unnecessary cost losses during production, and ensures production efficiency. During testing, the anti-frost fan delivers dry air at room temperature (26-30℃, humidity ≤40%RH) through the air supply duct into the anti-frost outlet duct. The anti-frost outlet duct then acts on the circuit board through the air outlet holes to prevent frost from forming on the circuit board surface.

[0014] 2. Compared with existing technologies, this anti-frost device and its operation method allow for free adjustment of the anti-frost device's position and airflow direction. It is divided into a low-speed zone and a low-speed zone to deliver airflow to different locations on the circuit board. Each linear slider is slid to a flush position, and each pipe mounting base is attached to the magnetic mounting plate of the linear slider. The assembled anti-frost air outlet pipes are then clipped onto the fixed pipe rack of multiple pipe mounting bases. The air outlet holes on the side of the anti-frost air outlet pipe group can be aligned with the sensitive components on the circuit board by sliding up and down. The airflow direction can be adjusted by rotating the anti-frost air outlet pipes. Furthermore, the anti-frost air outlet pipes are divided into a low-speed zone near the edge of the circuit board and a low-speed zone near the sensitive components to prevent direct airflow from damaging the components. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this application; Figure 2 This is a schematic diagram of the internal structure of the circuit board low-temperature test chamber of this application; Figure 3 This is a structural schematic diagram of the pipe mounting bracket in this application; Figure 4 This is a schematic diagram of the anti-frost air outlet duct of this application.

[0016] The attached diagram is labeled as follows: 1. Circuit board low temperature test chamber; 11. Test chamber door; 111. Transparent observation window; 12. Operation panel; 2. Anti-frost fan; 21. Air supply duct; 3. Pipe fitting connection plate; 31. Linear slider; 311. Magnetic mounting plate; 4. Anti-frost air outlet duct; 41. Air outlet; 42. Bend connection block; 43. Pipe sealing kit; 44. Corrugated flexible hose; 5. Test platform; 51. Magnetic mounting base; 6. Pipe mounting base; 61. Connection plate; 62. Fixed pipe rack. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] As attached Figures 1 to 4 The circuit board anti-frost device shown includes a circuit board low temperature test chamber 1. The front of the circuit board low temperature test chamber 1 is connected to the test chamber door 11 by a hinge. An anti-frost fan 2 is fixedly connected to one side of the circuit board low temperature test chamber 1. An air supply pipe 21 is fixedly connected to one side of the anti-frost fan 2, and one end of the air supply pipe 21 is inserted into the circuit board low temperature test chamber 1. The circuit board low-temperature test chamber 1 is equipped with a test platform 5, and a magnetic mounting base 51 is fixedly connected to the top of the test platform 5. Multiple sets of pipe fitting connection plates 3 are fixedly connected to the inner wall of the circuit board low-temperature test chamber 1. An anti-frost air outlet duct 4 is fixedly connected to the side of the pipe fitting connection plate 3 away from the circuit board low-temperature test chamber 1. A synchronous limiting rod is provided on the pipe fitting connection plate 3 to achieve synchronous sliding of the linear slider 31, ensuring the synchronous adjustment of the anti-frost air outlet duct 4. The synchronous limiting rod passes through two sets of linear sliders 31 and is flush with the guide rail. The two sets of linear sliders 31 slide synchronously without misalignment. The circuit board to be tested is connected to the magnetic mounting base 51 of the test bench 5. The magnetic mounting base 51 is an adjustable magnetic base. For semiconductor testing scenarios, an ultra-low magnetic flux model is selected, or a magnetic shielding sheet is added to the outer layer of the magnetic base to isolate magnetic field radiation. The anti-frost fan 2 delivers air through the air supply pipe 21. The anti-frost fan 2 can be equipped with a temperature control system according to the processing environment to ensure that the temperature difference between the test temperature and the ambient temperature is not too large.

[0019] Referring to Figure 1, a transparent observation window 111, flush with the test bench 5, is fixedly connected inside the test chamber door 11. An operation panel 12 is fixedly connected to the side of the test chamber door 11 away from the circuit board low-temperature test chamber 1. The operation panel 12 can adjust the speed, air supply temperature, and air supply duration of the anti-frost fan 2, and can display the temperature and air supply parameters of the circuit board low-temperature test chamber 1 in real time. The edge of the test chamber door 11 is provided with locking buckles to achieve a stable closure and seal between the test chamber door 11 and the circuit board low-temperature test chamber 1. The circuit board low-temperature test chamber 1 is opened or closed through the test chamber door 11, and the test program of the circuit board low-temperature test chamber 1 can be set and controlled through the operation panel 12. The test process can be observed through the transparent observation window 111. The circuit board low-temperature test chamber 1 and the operation panel 12 used to control the test are common technical means in this field, and will not be described in detail here.

[0020] Reference Figure 2 and Figure 3 As shown, two sets of linear sliders 31 are slidably connected inside the pipe fitting connecting plate 3 via a lubricated dustproof guide rail. A magnetic mounting plate 3111 is fixedly connected to the side of the linear slider 31 away from the pipe fitting connecting plate 3. A pipe mounting seat 6 is magnetically connected to the magnetic mounting plate 3111. The linear slider 31 can slide freely up and down on the pipe fitting connecting plate 3. The linear slider 31 has a locking structure that can lock the sliding position on the slide rail. The self-locking slider is a common technical means in this field. Its specific structural principle will not be elaborated here. The pipe mounting seat 6 can be magnetically installed onto the magnetic mounting plate 3111, so that it can be selected whether to connect according to the processing requirements, and the number of sets can be selected according to the requirements.

[0021] Reference Figure 2 , Figure 3 and Figure 4 A connecting plate 61 is fixedly connected to the side of the pipe mounting base 6 away from the magnetic mounting plate 3111. The two sets of vertically parallel connecting plates 61 have different lengths, and a fixed pipe bracket 62 with a top opening is fixedly connected to the side of the connecting plate 61 away from the magnetic mounting plate 3111. The pipe mounting base 6 is grouped by connecting plates 61 of different lengths, so that the anti-frost air outlet duct 4 can be divided into four groups of anti-frost air outlet ducts in the low wind speed area near the edge of the board and four groups of anti-frost air outlet ducts in the low wind speed area near sensitive components, so as to avoid the airflow directly blowing and damaging the components. The connecting plate 61 can also be replaced with a telescopic plate as needed to suit the testing work of circuit boards of different sizes.

[0022] Reference Figure 2 , Figure 3 and Figure 4 The anti-frost air outlet duct 4 is fixedly clipped inside the fixed pipe bracket 62. There are four sets of anti-frost air outlet ducts 4, and the four sets of anti-frost air outlet ducts 4 are spliced ​​together to form an adjustable-size rectangle with sealable corners. The inner side of the rectangle is adapted to the edge of the circuit board to be tested, so as to achieve all-round airflow coverage of the circuit board. The anti-frost air outlet duct 4 is connected to the pipe mounting base 6 through the fixed pipe bracket 62 clip, and the four sets of anti-frost air outlet ducts forming a circle can provide more uniform airflow.

[0023] Reference Figure 4 The anti-frost air outlet duct 4 has multiple sets of air outlet holes 41 on the side away from the circuit board low temperature test chamber 1, and two adjacent sets of anti-frost air outlet ducts 4 are rotatably connected by a bend connecting block 42 through a damping shaft; the anti-frost air outlet duct 4 performs air blowing and anti-frost work through the air outlet holes 41, and can be divided into a low wind speed zone and a low wind speed zone by setting different opening sizes and spacings.

[0024] Reference Figure 4 A set of anti-frost air outlet pipes 4 near the air supply pipe 21 is rotatably connected to a synchronously retractable corrugated hose 44 via a bend connecting block 42. One end of the corrugated hose 44 is slidably inserted into the air supply pipe 21. A set of anti-frost air outlet pipes 4 parallel to the corrugated hose 44 has a pipe opening sealing kit 43 fixedly sleeved on the outer side of one end. The air supply pipe 21 can rotate freely within the bend connecting block 42 to adjust the orientation angle of the air outlet 41. The corrugated hose 44 can be bent and retracted freely, so that it will not be disconnected from the air supply pipe 21 during the adjustment process. The pipe opening sealing kit 43 is used to seal the anti-frost air outlet pipes 4. The retraction range of the corrugated hose 44 is adapted to the adjustment stroke of the air outlet pipe to avoid excessive stretching and damage.

[0025] The operating method for the device to prevent frost formation on circuit boards includes the following steps: Step 1: First, precisely install the circuit board that needs to be tested at low temperature onto the magnetic mounting base 51 of the test bench 5 through the positioning groove, and initially install the anti-frost air outlet duct 4 onto the fixed pipe bracket 62 of the pipe mounting seat 6 through the adjustable locking clamp. Step 2: According to the size of the circuit board, connect the anti-frost air outlet pipe 4 end to end through the bend pipe connecting block 42 and splice it into a rectangle with an open corner. Then connect a set of anti-frost air outlet pipes 4 to the corrugated hose 44 through the bend pipe connecting block 42, and fix the other end of the corrugated hose 44 into the air supply pipe 21. Then fix the pipe opening sealing kit 43 on the outside of the other end of the rectangular anti-frost air outlet pipe 4. Step 3: Then slide each linear slider 31 to a flush position and attach each pipe mounting base 6 to the magnetic mounting plate 3111 of the linear slider 31. Step 4: Connect the spliced ​​anti-frost air outlet duct 4 to the fixed pipe bracket 62 of the multi-pipe mounting base 6. The air outlet 41 on the side of the anti-frost air outlet duct 4 can be aligned with the sensitive components of the circuit board by sliding it up and down. The circuit board contains core components that are sensitive to temperature, condensation or frost, such as chips, capacitors, sensors, precision solder joints, etc. These components are collectively referred to as sensitive components. The direction of airflow can be adjusted by rotating the anti-frost air outlet duct 4. Step 5: Close the test chamber door 11 and carry out the test. Set the test program through the operation panel 12, adjust the speed of the anti-frost fan 2, and during the test, the anti-frost fan 2 sends room temperature dry air of 26-30℃ and humidity ≤40%RH into the anti-frost outlet duct 4 through the air supply duct 21. The anti-frost outlet duct 4 acts on the circuit board through the air outlet 41 to prevent frost from forming on the surface of the circuit board. Step Six: Start the test. During the test, the anti-frost fan 2 delivers room temperature dry air into the anti-frost outlet duct 4 through the air supply duct 21 and the corrugated hose 44. The inclined air guide nozzle of the air outlet 41 acts on the circuit board to prevent frost from forming on the circuit board surface. The operator can observe the status of the circuit board in real time through the transparent observation window 111. If local frost occurs, the air supply parameters or air outlet direction can be adjusted through the operation panel 12. Step 7: After the test, turn off the anti-frost fan 2, loosen all locking structures, disassemble the circuit board and air outlet pipe, clean the inside of the device and the air outlet 41, and the operation is complete.

[0026] The working process of this application is as follows: First, the circuit board that needs to be tested at low temperature is precisely installed and connected to the magnetic mounting base 51 of the test bench 5 through the positioning groove, and the anti-frost air outlet duct 4 is installed into the circuit board low temperature test chamber 1. The anti-frost air outlet duct 4 is connected end to end through the bend pipe connecting block 42 and spliced ​​into a rectangle with an open corner. Then, a set of anti-frost air outlet ducts 4 is connected to the corrugated hose 44 through the bend pipe connecting block 42, and the other end of the corrugated hose 44 is fixedly inserted into the air supply pipe 21. Then, the pipe opening sealing kit 43 is fixedly sleeved on the outside of the other end of the anti-frost air outlet duct 4. Then, slide each linear slider 31 to a level position and attach each pipe mounting base 6 to the magnetic mounting plate 3111 of the linear slider 31. Snap the assembled anti-frost air outlet duct 4 to the fixed pipe rack 62 of the multiple sets of pipe mounting bases 6. The air outlet 41 on the side of the anti-frost air outlet duct 4 can be aligned with the sensitive components of the circuit board by sliding it up and down. The direction of airflow can be adjusted by rotating the anti-frost air outlet duct 4. The anti-frost air outlet duct 4 is divided into two groups: one group of anti-frost air outlet ducts in the low-wind-speed zone near the edge of the circuit board and another group of anti-frost air outlet ducts in the low-wind-speed zone near the sensitive components, to prevent direct airflow from damaging the components.

Claims

1. A device for preventing frost formation on circuit boards, comprising a low-temperature test chamber for circuit boards (1), characterized in that: The front of the circuit board low temperature test chamber (1) is connected to the test chamber door (11) by a hinge. An anti-frost fan (2) is fixedly connected to one side of the circuit board low temperature test chamber (1). An air supply pipe (21) is fixedly connected to one side of the anti-frost fan (2), and one end of the air supply pipe (21) is inserted into the circuit board low temperature test chamber (1). The circuit board low temperature test chamber (1) is fixedly connected to a test platform (5), and the top of the test platform (5) is fixedly connected to a magnetic mounting base (51). The inner wall of the circuit board low temperature test chamber (1) is fixedly connected to multiple sets of pipe fitting connection plates (3), and the side of the pipe fitting connection plate (3) away from the circuit board low temperature test chamber (1) is fixedly connected to an anti-frost air outlet pipe (4). The pipe fitting connection plate (3) is provided with a synchronous limit rod, which is used to realize the synchronous sliding of the linear slider (31) and ensure the synchronous adjustment of the anti-frost air outlet pipe (4).

2. The device for preventing circuit board frost formation according to claim 1, characterized in that: The test chamber door (11) is fixedly connected to a transparent observation window (111) that is flush with the test platform (5). An operation panel (12) is fixedly connected to the side of the test chamber door (11) away from the circuit board low temperature test chamber (1). The operation panel (12) can adjust the speed, air supply temperature and air supply duration of the anti-frost fan (2), and can display the temperature and air supply parameters of the circuit board low temperature test chamber (1) in real time. The test chamber door (11) is provided with locking buckles on its edge.

3. The device for preventing frost formation on circuit boards according to claim 1, characterized in that: The pipe fitting connecting plate (3) has two sets of linear sliders (31) slidably connected by a lubricated dustproof guide rail. A magnetic mounting plate (311) is fixedly connected to the side of the linear slider (31) away from the pipe fitting connecting plate (3). A pipe mounting seat (6) is magnetically connected to the magnetic mounting plate (311).

4. The device for preventing frost formation on circuit boards according to claim 3, characterized in that: The pipe mounting base (6) is fixedly connected to a connecting plate (61) on the side away from the magnetic mounting plate (311). The two sets of vertically parallel connecting plates (61) have different lengths, and a fixed pipe rack (62) with an open top is fixedly connected to the side of the connecting plate (61) away from the magnetic mounting plate (311).

5. The device for preventing frost formation on circuit boards according to claim 4, characterized in that: The anti-frost air outlet pipe (4) is fixedly clipped inside the fixed pipe frame (62). There are four sets of the anti-frost air outlet pipe (4), and the four sets of the anti-frost air outlet pipe (4) are spliced ​​together to form an adjustable size and a sealable rectangle. The inner side of the rectangle is adapted to the edge of the circuit board to be tested, so as to achieve all-round airflow coverage of the circuit board.

6. The device for preventing frost formation on circuit boards according to claim 4, characterized in that: The anti-frost air outlet pipe (4) has multiple sets of air outlet holes (41) on the side away from the circuit board low temperature test chamber (1), and two adjacent sets of anti-frost air outlet pipes (4) are rotatably connected by a bent pipe connecting block (42) through a damping shaft.

7. The device for preventing frost formation on circuit boards according to claim 6, characterized in that: A set of anti-frost air outlet pipes (4) near the air supply pipe (21) is rotatably connected to a corrugated hose (44) that can be synchronously extended and retracted through a bend pipe connecting block (42), and one end of the corrugated hose (44) is slidably inserted into the air supply pipe (21). A set of anti-frost air outlet pipes (4) parallel to the corrugated hose (44) has a pipe opening sealing kit (43) fixedly sleeved on the outer side of one end.

8. A method for operating a device for preventing frost formation on circuit boards, using the device for preventing frost formation on circuit boards as described in any one of claims 1-7, characterized in that: The operation method includes the following steps: Step 1: First, the circuit board that needs to be tested at low temperature is precisely installed and connected to the magnetic mounting base (51) of the test bench (5) through the positioning groove, and the anti-frost air outlet pipe (4) is initially installed on the fixed pipe rack (62) of the pipe mounting seat (6) through the adjustable locking clamp; Step 2: According to the size of the circuit board, connect the anti-frost air outlet pipe (4) end to end through the bend pipe connecting block (42) and splice it into a rectangle with an open corner. Then connect a set of anti-frost air outlet pipes (4) to the corrugated hose (44) through the bend pipe connecting block (42), and fix the other end of the corrugated hose (44) into the air supply pipe (21). Then fix the pipe opening sealing kit (43) on the outside of the opening of the other end of the rectangular anti-frost air outlet pipe (4). Step 3: Then slide each linear slider (31) to a level position and attach each pipe mounting base (6) to the magnetic mounting plate (311) of the linear slider (31); Step 4: Connect the spliced ​​anti-frost air outlet pipe (4) to the fixed pipe bracket (62) of the multi-pipe mounting base (6), and slide it up and down to make the air outlet hole (41) on the side of the anti-frost air outlet pipe (4) face the sensitive components of the circuit board. The direction of air blowing can be adjusted by rotating the anti-frost air outlet pipe (4). Step 5: Close the test chamber door (11) and carry out the test. Set the test program through the operation panel (12), adjust the speed of the anti-frost fan (2), and during the test, the anti-frost fan (2) sends the normal temperature dry air of 26-30℃ and humidity ≤40%RH into the anti-frost outlet pipe (4) through the air supply pipe (21). The anti-frost outlet pipe (4) acts on the circuit board through the air outlet hole (41) to prevent frost from forming on the surface of the circuit board. Step 6: Start the test. During the test, the anti-frost fan (2) delivers room temperature dry air into the anti-frost outlet pipe (4) through the air supply pipe (21) and the corrugated hose (44). The inclined air guide nozzle of the air outlet (41) acts on the circuit board to prevent frost from forming on the surface of the circuit board. The operator observes the status of the circuit board in real time through the transparent observation window (111). If local frost occurs, the air supply parameters or air outlet direction can be adjusted through the operation panel (12). Step 7: After the test, turn off the anti-frost fan (2), loosen all locking structures, disassemble the circuit board and air outlet pipe, clean the inside of the device and the air outlet (41), and complete the operation.

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