Automatic coupling device and method for silicon light wafer passive device
By designing an automatic coupling device for passive silicon photonic wafers that includes a stepper motor and a piezoelectric ceramic displacement slide, the problems of slow coupling speed and high cost in the prior art are solved, achieving efficient and low-cost fiber-to-wafer coupling, and improving testing efficiency and repeatability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN GOLIGHT TECH
- Filing Date
- 2026-04-01
- Publication Date
- 2026-06-09
AI Technical Summary
In the existing technology, the optical coupling device for passive silicon photonic wafer devices has problems such as slow coupling speed, low testing efficiency and high cost. In particular, the electric slide stage is large in size and low in price, while the six-legged displacement stage is expensive and not suitable for mass production testing.
An automatic coupling device for passive silicon photonic wafers is adopted, including an organic stage, a wafer chuck, a camera, and first and second six-axis displacement modules. By using stepper motors and piezoelectric ceramic displacement slides, combined with pressure sensors and capacitive sensors, clamping and positioning, visual positioning, fiber height control, and high-precision spiral coupling are achieved, thereby improving coupling speed and testing efficiency.
It significantly improves coupling speed and testing efficiency, reduces application costs, and improves coupling repeatability and stability by precisely controlling the distance between the optical fiber and the wafer through pressure and capacitance sensors.
Smart Images
Figure CN122172391A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to semiconductor wafer testing apparatus and methods, and more particularly to an automatic coupling apparatus and method for passive devices on silicon photonic wafers. Background Technology
[0002] The overall production process of silicon photonics wafer products includes three main stages: design, manufacturing, and packaging. Before packaging, passive and active devices on the silicon photonics wafer need to undergo optical-optical, optical-electrical, and electro-optical tests to determine the chip's quality. Currently, there are two commonly used standard electric six-axis motion platforms in the field of optocouplers: one is an electric slide stage composed of stepper motors and linear guides, and the other is a six-legged displacement stage composed of miniature electric cylinders. While electric slide stages offer high precision, good stability, and low cost, they suffer from drawbacks such as large size and slow coupling speed. Conversely, while six-legged displacement stages offer small size, high precision, fast coupling speed, and the ability to change the rotation center via adapters, they also have significant disadvantages, namely high cost, making them unsuitable for mass production testing. Summary of the Invention
[0003] The technical problem to be solved by the present invention is to provide an automatic coupling device and method for silicon photonic wafer passive devices that has fast coupling speed, high testing efficiency, low application cost, and can accurately control the distance between the optical fiber and the wafer, in order to address the shortcomings of the existing technology.
[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution.
[0005] An automated coupling device for passive silicon photonic wafers includes an organic stage with an opening. A wafer chuck is located below the stage. The stage is equipped with a camera, a first six-axis displacement module, and a second six-axis displacement module. The camera is positioned above the opening. The first and second six-axis displacement modules are symmetrically arranged on the left and right sides of the opening. The first six-axis displacement module includes a first Y-axis linear module, a first X-axis linear module at its moving end, a first Z-axis linear module at its moving end, a first θz slide at its moving end, a first θy slide at its moving end, and a first θx slide at its moving end. The first θx slide has a first nanometer displacement stage at its moving end, a first pressure sensor at its moving end, a first capacitance sensor at its sensing end, and a first clamp for holding the first optical fiber at its sensing end. The second six-axis displacement module includes a second Y-axis linear module, a second X-axis linear module at its moving end, a second Z-axis linear module at its moving end, a second θz slide at its moving end, a second θy slide at its moving end, a second θx slide at its moving end, a second nanometer displacement stage at its moving end, a second pressure sensor at its moving end, a second capacitance sensor at its sensing end, and a second clamp for holding the second optical fiber at its sensing end.
[0006] Preferably, the first θy slide is tilted downwards at a preset angle.
[0007] Preferably, the second θy slide is tilted downwards at a preset angle.
[0008] Preferably, the machine platform is provided with a gantry frame, the gantry frame is provided with a camera X-axis displacement module, the moving end of the camera X-axis displacement module is provided with a camera Y-axis displacement module, the moving end of the camera Y-axis displacement module is provided with a camera Z-axis displacement module, and the camera is located at the moving end of the camera Z-axis displacement module.
[0009] Preferably, a chuck displacement drive mechanism for driving the wafer chuck to move is provided below the machine base.
[0010] Preferably, a cabinet is provided below the machine platform, and the chuck displacement drive mechanism is located inside the cabinet.
[0011] Preferably, the wafer chuck is provided with vacuum negative pressure adsorption holes for adsorbing wafers.
[0012] Preferably, the first Y-axis linear module, the first X-axis linear module, the first Z-axis linear module, the second Y-axis linear module, the second X-axis linear module, and the second Z-axis linear module are all stepper motor motion modules.
[0013] Preferably, the first θz slide, the first θy slide, the first θx slide, the second θz slide, the second θy slide, and the second θx slide are all piezoelectric ceramic displacement slides.
[0014] An automatic coupling method for passive devices on silicon photonic wafers, implemented based on the aforementioned device, includes the following steps: Step S1, mounting a first optical fiber and a second optical fiber onto the first clamp and the second clamp respectively, and placing the wafer chuck, the first six-axis displacement module, and the second six-axis displacement module in their initial positions; Step S2, placing the wafer on the wafer chuck and fixing it to the wafer chuck by vacuum adsorption; Step S3, controlling the translational movement of the wafer chuck to move the wafer to the center position of the O-shaped opening, and controlling the translational movement of the camera to move the camera to the center position of the O-shaped opening. Then, control the camera's lifting and lowering motion to make the camera image clear; Step S4, control the wafer chuck's translational motion, based on the position of the passive device in the camera image, control the wafer chuck's translational motion to move the passive device to the center position of the camera image, and control the wafer chuck to rise to the contact position; Step S5, control the movement of the first Y-axis linear module and the first X-axis linear module to bring the first optical fiber into the center of the camera's field of view, and then control the first Z-axis linear module to descend. After determining from the camera image that the first optical fiber is in contact with the wafer, control the first Z-axis linear module to rise to a specified height, and then control... Step S6: Control the movement of the first Y-axis linear module and the first X-axis linear module to move the first optical fiber to the light inlet of the passive device; Step S7: Control the movement of the second Y-axis linear module and the second X-axis linear module to move the second optical fiber into the center of the camera's field of view, then control the second Z-axis linear module to descend, and after determining from the camera image that the second optical fiber is in contact with the wafer, control the second Z-axis linear module to rise to a specified height, and then control the movement of the second Y-axis linear module and the second X-axis linear module to move the second optical fiber to the light inlet of the passive device; Step S8: Turn on the laser source output. Step S8: Control the first six-axis displacement module to perform spiral motion, while monitoring the power change during the motion, and find the initial position of the first six-axis displacement module. Control the second six-axis displacement module to perform spiral motion, while monitoring the power change during the motion, and find the initial position of the second six-axis displacement module. Step S9: Control the first nano-displacement stage to perform spiral motion, while monitoring the power change during the motion, and find the precise position of the first nano-displacement stage. Control the second nano-displacement stage to perform spiral motion, while monitoring the power change during the motion, and find the precise position of the second nano-displacement stage.
[0015] The silicon photonic wafer passive device automatic coupling device disclosed in this invention can sequentially realize the clamping and positioning steps, the visual positioning step, the fiber height control step, and the high-precision spiral coupling step during application. In the clamping and positioning step, the first fiber and the second fiber are respectively installed on the first clamp and the second clamp, and the wafer chuck, the first Y-axis linear module, the first X-axis linear module, the first Z-axis linear module, the second Y-axis linear module, the second X-axis linear module, the second Z-axis linear module, the first θz slide, the first θy slide, the first θx slide, the second θz slide, the second θy slide, and the second θx slide are moved and reset to fix the wafer on the clamp. The invention employs a circular chuck. In the visual positioning step, the wafer center is determined based on the image captured by the camera. The wafer and passive devices are positioned within the camera's shooting area, and the camera's focal length is adjusted to ensure image clarity. In the fiber height control step, the first and second six-axis displacement modules are controlled to move the first and second optical fibers to adjacent positions on the wafer. A sensor measures the distance to determine the safe coupling height, and the optical fibers are then aligned with the light inlet and outlet of the passive devices. In the high-precision spiral coupling step, a laser is activated, causing the optical fiber to move in a spiral motion. While moving, an optical power meter measures the light signal intensity; the position with the strongest signal is the optimal coupling position. A preliminary position is found, and then a nanometer-scale displacement stage is used to find the precise position, completing the test. Compared to existing technologies using electric sliding stages or six-legged displacement stages, this invention significantly improves coupling speed, achieves higher testing efficiency with lower application costs, and integrates pressure and capacitance sensors to precisely control the distance between the optical fiber and the wafer, thereby improving coupling repeatability. Attached Figure Description
[0016] Figure 1 A 3D view of an automatic coupling device for passive devices on silicon photonics wafers; Figure 2 This is a front view of the camera, the first six-axis displacement module, and the second six-axis displacement module; Figure 3 This is a 3D view of the first six-axis displacement module; Figure 4 This is a 3D view of the second six-axis displacement module; Figure 5 A structural diagram of a wafer chuck and its displacement drive mechanism; Figure 6 This is a block diagram of an automatic coupling device for passive devices on silicon photonic wafers. Detailed Implementation
[0017] The present invention will now be described in more detail with reference to the accompanying drawings and embodiments.
[0018] This invention discloses an automatic coupling device for passive devices on silicon photonic wafers, combined with Figures 1 to 6 As shown, it includes an organic stage 1 with an opening 10. A wafer chuck 11 is located below the stage 1. A camera 3, a first six-axis displacement module 4, and a second six-axis displacement module 5 are mounted on the stage 1. The camera 3 is positioned above the opening 10, and the first six-axis displacement module 4 and the second six-axis displacement module 5 are symmetrically arranged on the left and right sides of the opening 10. The first six-axis displacement module 4 includes a first Y-axis linear module 40, a first X-axis linear module 41 at the moving end of the first Y-axis linear module 40, a first Z-axis linear module 42 at the moving end of the first X-axis linear module 41, a first θz slide 43 at the moving end of the first Z-axis linear module 42, a first θy slide 44 at the moving end of the first θy slide 44, a first θx slide 45 at the moving end of the first θx slide 45, a first nano-displacement stage 46 at the moving end of the first nano-displacement stage 46, a first pressure sensor 47 at the moving end of the first pressure sensor 47, a first capacitance sensor 48 at the sensing end of the first pressure sensor 47, and a first clamp 49 for clamping the first optical fiber at the sensing end of the first capacitance sensor 48. The second six-axis displacement module 5 includes a second Y-axis linear module 50, a second X-axis linear module 51 at the moving end of the second Y-axis linear module 50, a second Z-axis linear module 52 at the moving end of the second X-axis linear module 51, a second θz slide 53 at the moving end of the second Z-axis linear module 52, a second θy slide 54 at the moving end of the second θy slide 54, a second θx slide 55 at the moving end of the second θx slide 55, a second nanometer displacement stage 56 at the moving end of the second nanometer displacement stage 56, a second pressure sensor 57 at the moving end of the second pressure sensor 57, a second capacitance sensor 58 at the sensing end of the second pressure sensor 57, and a second clamp 59 for clamping the second optical fiber at the sensing end of the second capacitance sensor 58.
[0019] In application, the above-mentioned device can sequentially perform the clamping and positioning steps, the visual positioning step, the fiber height control step, and the high-precision spiral coupling step. In the clamping and positioning step, the first fiber and the second fiber are respectively installed on the first clamp 49 and the second clamp 59. The wafer chuck 11, the first Y-axis linear module 40, the first X-axis linear module 41, the first Z-axis linear module 42, the second Y-axis linear module 50, the second X-axis linear module 51, the second Z-axis linear module 52, the first θz slide 43, the first θy slide 44, the first θx slide 45, the second θz slide 53, the second θy slide 54, and the second θx slide 55 are then moved and reset to fix the wafer. In the wafer chuck 11, during the visual positioning step, the wafer center is determined based on the image captured by the camera 3, and the wafer and passive device are positioned within the shooting area of the camera 3. The camera focal length is adjusted to ensure image clarity. In the fiber height control step, the first six-axis displacement module 4 and the second six-axis displacement module 5 are controlled to move the first and second optical fibers to adjacent positions on the wafer. A sensor is used to measure the distance to determine the safe coupling height, and then the optical fibers are aligned with the light inlet and outlet of the passive device. In the high-precision spiral coupling step, the laser is activated, allowing the optical fiber to move in a spiral motion. While moving, an optical power meter measures the light signal intensity; the position with the strongest signal is the optimal coupling position. A preliminary position is found, and then a nanometer displacement stage is used to find the precise position to complete the test. Compared to existing technologies using electric sliding stages or six-legged displacement stages, this invention significantly improves coupling speed, achieves higher testing efficiency with lower application costs, and integrates pressure and capacitance sensors to precisely control the distance between the optical fiber and the wafer, thereby improving coupling repeatability.
[0020] Please see Figures 1 to 4 The first θy slide 44 is tilted downwards at a preset angle. The second θy slide 54 is tilted downwards at a preset angle.
[0021] In order to control the precise movement of the camera, in this embodiment, the machine tool 1 is provided with a gantry 30, the gantry 30 is provided with a camera X-axis displacement module 31, the moving end of the camera X-axis displacement module 31 is provided with a camera Y-axis displacement module 32, the moving end of the camera Y-axis displacement module 32 is provided with a camera Z-axis displacement module 33, and the camera 3 is located at the moving end of the camera Z-axis displacement module 33.
[0022] To achieve the translational movement of the wafer chuck 11 and its ascent to the contact position, please refer to [link to relevant documentation]. Figure 1 and Figure 5The machine base 1 is provided with a chuck displacement drive mechanism 12 for driving the wafer chuck 11 to move below it. Furthermore, a cabinet 13 is provided below the machine base 1, and the chuck displacement drive mechanism 12 is located inside the cabinet 13.
[0023] In practical applications, the wafer chuck 11 fixes the wafer by negative pressure adsorption. Specifically, the wafer chuck 11 is provided with vacuum negative pressure adsorption holes for adsorbing the wafer.
[0024] As a preferred embodiment, the first Y-axis linear module 40, the first X-axis linear module 41, the first Z-axis linear module 42, the second Y-axis linear module 50, the second X-axis linear module 51, and the second Z-axis linear module 52 are all stepper motor motion modules.
[0025] Accordingly, the first θz slide 43, the first θy slide 44, the first θx slide 45, the second θz slide 53, the second θy slide 54 and the second θx slide 55 are all piezoelectric ceramic displacement slides.
[0026] Based on this, the present invention also proposes an automatic coupling method for passive devices on silicon photonic wafers. This method is implemented based on the aforementioned device and includes: Step S1: Mount the first optical fiber and the second optical fiber onto the first clamp 49 and the second clamp 59 respectively, and place the wafer chuck 11, the first six-axis displacement module 4 and the second six-axis displacement module 5 in the initial position; Step S2: Place the wafer on the wafer chuck 11 and fix it to the wafer chuck 11 by vacuum adsorption; Step S3: Control the wafer chuck 11 to translate and move the wafer to the center of the O-type opening 10. Control the camera 3 to translate and move the camera 3 to the center of the O-type opening 10. Then control the camera 3 to move up and down to make the camera image clear. Step S4: Control the wafer chuck 11 to translate. Based on the position of the passive device in the camera image, control the wafer chuck 11 to translate and move the passive device to the center position of the camera image. Control the wafer chuck 11 to rise to the contact position. Step S5: Control the movement of the first Y-axis linear module 40 and the first X-axis linear module 41 to bring the first optical fiber into the center of the field of view of the camera 3. Then control the first Z-axis linear module 42 to move downward. After determining that the first optical fiber is in contact with the wafer through the camera image, control the first Z-axis linear module 42 to rise to a specified height. Then control the movement of the first Y-axis linear module 40 and the first X-axis linear module 41 to move the first optical fiber to the light inlet of the passive device. Step S6: Control the movement of the second Y-axis linear module 50 and the second X-axis linear module 51 to bring the second optical fiber into the center of the field of view of the camera 3. Then control the movement of the second Z-axis linear module 52 downward. After determining that the second optical fiber is in contact with the wafer through the camera image, control the movement of the second Z-axis linear module 52 to raise it to a specified height. Then control the movement of the second Y-axis linear module 50 and the second X-axis linear module 51 to move the second optical fiber to the light inlet of the passive device. Step S7: Turn on the laser source output, control the first six-axis displacement module 4 to perform spiral motion, and monitor the power change during the motion to find the initial position of the first six-axis displacement module 4. Control the second six-axis displacement module 5 to perform spiral motion, and monitor the power change during the motion to find the initial position of the second six-axis displacement module 5. Step S8: Control the first nano-displacement stage 46 to perform spiral motion, while monitoring the power change during the motion process to find the precise position of the first nano-displacement stage 46. Control the second nano-displacement stage 56 to perform spiral motion, while monitoring the power change during the motion process to find the precise position of the second nano-displacement stage 56.
[0027] In the above method, in order to enable the wafer to move in the X / Y / Z / θz directions, the wafer is placed on the chuck and fixed on the chuck by vacuum adsorption. The drive unit is located below the chuck, and from top to bottom, the θ-axis stepper motor assembly, the Z-axis linear module, the Y-axis linear module, and the X-axis linear module are installed respectively. Meanwhile, to enable the camera to move in the X / Y / Z directions, a gantry was placed on the wafer stage. X-axis linear modules, Y-axis linear modules, and Z-axis linear modules were mounted on the gantry. The camera was fixed to the Z-axis linear module via an adapter. Furthermore, to enable the optical fiber to move in six dimensions, the optical fiber was fixed to a capacitive sensor via a clamp. The capacitive sensor was connected to a pressure sensor adapter via screws. The pressure sensor was connected to a nanometer displacement stage, which was mounted on an θx slide. The θx slide was then mounted to an θy slide via an adapter, and the θy slide was mounted to an θz slide via an adapter. The θz slide was then mounted to the Z-axis linear module via an adapter. The Z-axis linear module was mounted on the X-axis linear module, and the X-axis linear module was mounted on the Y-axis linear module.
[0028] Compared with the prior art, the technical effects achieved by the above-mentioned device and method of the present invention include the following beneficial effects: First, the present invention combines a stepper motor electric slide and a piezoelectric ceramic displacement stage, which can change the coupling method according to the actual application, thereby improving the testing efficiency; at the same time, the rotation center of the device is located below the horizontal line, and the adapter design can ensure that the linear axis does not need to be moved when rotating the angle of the clamped object; furthermore, the automatic coupling device of the present invention has good coupling stability, high movement repeatability accuracy, and the cost is one-tenth that of a six-legged displacement stage; in addition, the automatic coupling device integrates a pressure sensor and a capacitance sensor, which can accurately control the distance between the optical fiber and the wafer, and can significantly improve the repeatability of coupling.
[0029] In practical applications, the above process method can be referred to in the following specific embodiments: Example
[0030] An automatic coupling method for passive devices on silicon photonics wafers, comprising the following steps: Step 1: Mount the optical fiber onto the six-axis displacement stage 1 fixture and the six-axis displacement stage 2 fixture; Step 2: Zero all motion axes of the chuck, camera, and six-axis translation stage; Step 3: Place the wafer onto the chuck and fix it to the chuck using vacuum adsorption; Step 4: Move the chuck along the X and Y axes to move the wafer to the center of the O-type stage of the wafer stage; Step 5: Move the camera along the XY axis to the center of the O-type stage of the wafer stage; Step 6: Move the camera along the Z-axis to make the wafer image clear; Step 7: Straighten the wafer angle using camera images; Step 8: Move the chuck along the XY axis. Using the camera image, move the chuck to the center of the passive device position on the wafer die, and raise the chuck along the Z axis to the contact position. Step 9: Move the XY axis of the six-axis displacement stage 1 so that the optical fiber 1 enters the center of the camera's field of view; Step 10: Slowly lower the Z-axis of the six-axis displacement stage 1 by step. After determining that the optical fiber is in contact with the wafer through the camera image, raise the Z-axis of the six-axis displacement stage 1 to the specified height. Step 11: Move the XY axis of the six-axis displacement stage 1 to move the optical fiber 1 to the optical inlet of the passive device. Step 12: Move the XY axis of the six-axis displacement stage 2 so that the optical fiber 2 enters the center of the camera's field of view; Step 13: Slowly lower the Z-axis of the six-axis displacement stage 2 by stepping. After determining that the optical fiber is in contact with the wafer through the camera image, raise the Z-axis of the six-axis displacement stage 2 to the specified height. Step fourteen: Move the XY axis of the six-axis displacement stage 2 to move the optical fiber 2 to the output port of the passive device; Step 15: Turn on the laser source output and control the six-axis displacement stage 1 to perform helical motion. At the same time, monitor the power change during the motion and find the initial position of the six-axis displacement stage 1. Step 16: Control the six-axis displacement stage 2 to perform helical motion, while monitoring the power change during the motion process, and find the initial position of the six-axis displacement stage 2. Step 17: Control the six-axis displacement stage (1 nanometer displacement stage) to perform helical motion, while monitoring the power change during the motion process, and find the precise position of the six-axis displacement stage (1 nanometer displacement stage). Step 18: Control the six-axis displacement stage (2 nm displacement stage) to perform helical motion, while monitoring the power changes during the motion process, and find the precise position of the six-axis displacement stage (2 nm displacement stage).
[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the technical scope of the present invention should be included within the scope of protection of the present invention.
Claims
1. An automatic coupling device for passive devices on silicon photonic wafers, characterized in that, The system includes an organic stage (1), an opening (10) on the stage (1), a wafer chuck (11) below the stage (1), a camera (3), a first six-axis displacement module (4), and a second six-axis displacement module (5) on the stage (1). The camera (3) is positioned above the opening (10), and the first six-axis displacement module (4) and the second six-axis displacement module (5) are symmetrically positioned on the left and right sides of the opening (10). The first six-axis displacement module (4) includes a first Y-axis linear module (40), the moving end of the first Y-axis linear module (40) is provided with a first X-axis linear module (41), the moving end of the first X-axis linear module (41) is provided with a first Z-axis linear module (42), the moving end of the first Z-axis linear module (42) is provided with a first θz slide (43), the moving end of the first θz slide (43) is provided with a first θy slide (44), the moving end of the first θy slide (44) is provided with a first θx slide (45), the moving end of the first θx slide (45) is provided with a first nano-displacement stage (46), the moving end of the first nano-displacement stage (46) is provided with a first pressure sensor (47), the sensing end of the first pressure sensor (47) is provided with a first capacitance sensor (48), and the sensing end of the first capacitance sensor (48) is provided with a first clamp (49) for clamping the first optical fiber. The second six-axis displacement module (5) includes a second Y-axis linear module (50), the moving end of the second Y-axis linear module (50) is provided with a second X-axis linear module (51), the moving end of the second X-axis linear module (51) is provided with a second Z-axis linear module (52), the moving end of the second Z-axis linear module (52) is provided with a second θz slide (53), the moving end of the second θz slide (53) is provided with a second θy slide (54), the moving end of the second θy slide (54) is provided with a second θx slide (55), the moving end of the second θx slide (55) is provided with a second nano-displacement stage (56), the moving end of the second nano-displacement stage (56) is provided with a second pressure sensor (57), the sensing end of the second pressure sensor (57) is provided with a second capacitive sensor (58), and the sensing end of the second capacitive sensor (58) is provided with a second clamp (59) for clamping the second optical fiber.
2. The automatic coupling device for passive silicon photonic wafers as described in claim 1, characterized in that, The first θy slide (44) is tilted downward at a preset angle.
3. The automatic coupling device for passive devices on silicon photonic wafers as described in claim 1, characterized in that, The second θy slide (54) is tilted downward at a preset angle.
4. The automatic coupling device for passive devices on silicon photonic wafers as described in claim 1, characterized in that, The machine (1) is provided with a gantry (30), the gantry (30) is provided with a camera X-axis displacement module (31), the moving end of the camera X-axis displacement module (31) is provided with a camera Y-axis displacement module (32), the moving end of the camera Y-axis displacement module (32) is provided with a camera Z-axis displacement module (33), and the camera (3) is located at the moving end of the camera Z-axis displacement module (33).
5. The automatic coupling device for passive devices on silicon photonic wafers as described in claim 1, characterized in that, The machine tool (1) is provided with a chuck displacement drive mechanism (12) for driving the wafer chuck (11) to move below it.
6. The automatic coupling device for passive devices on silicon photonic wafers as described in claim 5, characterized in that, The machine base (1) is provided with a cabinet (13) below it, and the chuck displacement drive mechanism (12) is located inside the cabinet (13).
7. The automatic coupling device for passive devices on silicon photonic wafers as described in claim 1, characterized in that, The wafer chuck (11) is provided with vacuum negative pressure adsorption holes for adsorbing wafers.
8. The automatic coupling device for passive silicon photonic wafers as described in claim 1, characterized in that, The first Y-axis linear module (40), the first X-axis linear module (41), the first Z-axis linear module (42), the second Y-axis linear module (50), the second X-axis linear module (51), and the second Z-axis linear module (52) are all stepper motor motion modules.
9. The automatic coupling device for passive devices on silicon photonic wafers as described in claim 1, characterized in that, The first θz slide (43), the first θy slide (44), the first θx slide (45), the second θz slide (53), the second θy slide (54) and the second θx slide (55) are all piezoelectric ceramic displacement slides.
10. An automatic coupling method for passive devices on silicon photonic wafers, characterized in that, This method is implemented based on the apparatus of claim 1, and the method includes: Step S1: Mount the first optical fiber and the second optical fiber onto the first clamp (49) and the second clamp (59) respectively, and place the wafer chuck (11), the first six-axis displacement module (4) and the second six-axis displacement module (5) in the initial position; Step S2: Place the wafer on the wafer chuck (11) and fix it to the wafer chuck (11) by vacuum adsorption. Step S3: Control the wafer chuck (11) to translate and move the wafer to the center of the O-type opening (10); control the camera (3) to translate and move the camera (3) to the center of the O-type opening (10); and then control the camera (3) to move up and down to make the camera image clear. Step S4: Control the translation movement of the wafer chuck (11). Based on the position of the passive device in the camera image, control the translation of the wafer chuck (11) to move the passive device to the center position of the camera image, and control the wafer chuck (11) to rise to the contact position. Step S5: Control the movement of the first Y-axis linear module (40) and the first X-axis linear module (41) to make the first optical fiber enter the field of view of the camera (3). Then control the first Z-axis linear module (42) to move downward. After the camera image determines that the first optical fiber is in contact with the wafer, control the first Z-axis linear module (42) to raise to a specified height. Then control the movement of the first Y-axis linear module (40) and the first X-axis linear module (41) to move the first optical fiber to the light inlet of the passive device. Step S6: Control the movement of the second Y-axis linear module (50) and the second X-axis linear module (51) to bring the second optical fiber into the center of the field of view of the camera (3). Then control the movement of the second Z-axis linear module (52) downward. After the camera image determines that the second optical fiber is in contact with the wafer, control the movement of the second Z-axis linear module (52) to raise it to a specified height. Then control the movement of the second Y-axis linear module (50) and the second X-axis linear module (51) to move the second optical fiber to the light inlet of the passive device. Step S7: Turn on the laser source output, control the first six-axis displacement module (4) to perform spiral motion, and monitor the power change during the motion process to find the initial position of the first six-axis displacement module (4). Control the second six-axis displacement module (5) to perform spiral motion, and monitor the power change during the motion process to find the initial position of the second six-axis displacement module (5). Step S8: Control the first nano-displacement stage (46) to perform spiral motion, while monitoring the power change during the motion process, and find the precise position of the first nano-displacement stage (46). Control the second nano-displacement stage (56) to perform spiral motion, while monitoring the power change during the motion process, and find the precise position of the second nano-displacement stage (56).